2013 Prof Andrew Tay

ME4225 Industrial Heat Transfer 1

Department of Mechanical Engineering, NUS

ME 4225 Industrial Heat Transfer

Professor Andrew Tay
Department of Mechanical Engineering
National University of Singapore

Office: EA-07-19
Phone: 6516-2207
Email: mpetayao@nus.edu.sg

2013 Prof Andrew Tay
ME4225 Industrial Heat Transfer 2
Course Outline
A. Electronics Cooling
Heat Transfer with special application to electronics cooling industry.
However, application of principles/techniques to other industrial heat
transfer problems are within the scope of this module.

1. Introduction
2. Conduction Cooling
3. Free and Forced Convection Cooling
4. Radiation Heat Transfer
5. Combined Modes of Heat Transfer

B. Transient Heat Conduction
beyond lumped capacitance method
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Course Outline - Continued
C. 2D Steady Heat Conduction
numerical method of solution

D. Boiling Heat Transfer (Drs PS Lee & SY Park)
1. Pool boiling.
2. Film boiling and condensation
3. Two phase flow and heat transfer (flow boiling)

E. Mass Transfer
1. Diffusive and convective mass transfer
2. Analogy between heat and mass transfer
3. Evaporative cooling
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Module Learning Outcomes
1. Ability to analyze heat flows through various components in a
thermal system involving one or more modes of heat transfer.

2. Ability to analyze transient and 2D steady heat transfer
problems.

3. Ability to analyze heat transfer problems involving boiling and
condensation.

4. Ability to understand the analogy between heat and mass
transfer and solve mass transfer problems.
Assessment: 2 quizes (15% each); final examination (70%)
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1. D. S. Steinberg,
Cooling Techniques for Electronic Equipment
2e, J. Wiley & Sons, 1991

2. F.P. Incropera, D.P. Dewitt, T.L. Bergman, A.S. Lavine,
"Principles of Heat and Mass Transfer
7e, J Wiley & Sons, 2013.

3. Holman, J.P., Heat Transfer, McGraw-Hill, New York,
10e, 2010.
References
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With the relentless trend toward ever powerful chips in ever decreasing
package sizes, intense heat fluxes and higher operating temperatures
are becoming a concern.

Thermal Challenges in Electronics Systems
Heat dissipation of
Intel CPUs.
W
80 W/cm
2
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Newspaper Article on 2004 Intel Chip

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ME4225 Industrial Heat Transfer 8
Humidity
19%
Vibration
20%
Dust
6%
Temperature
55%
Dust
Vibration
Humidity
Temperature
Major Causes of Electronics Failures
Thermally induced failures account for more than 50% of all electric
failures. The useful life of an electronic component is halved for
every rise of 10C in its operating temperature.
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ME4225 Industrial Heat Transfer 9
Perspective on Microelectronic Heat Fluxes
Unlike other systems
the temperature of
chips cannot be
increase even while
heat fluxes are
increased.
Heat flux, q =h T
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ME4225 Industrial Heat Transfer
10
Values of Heat Transfer Coefficient for Various
Cooling Technologies
FC = Fluorocarbon fluid
s
th
hA
R
1
=
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11
Structure of IC Packages
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Chip Carrier or Package
Early design of IC package.
Pin-Through-Hole (PTH) technology used.
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Small Outline Integrated circuit
(SOIC) using SMT Ceramic Dual in-line package (CerDIP)
using PTH technology
IC packages, chip carriers or modules hold semiconductor chips and
supply the connections or leads between the chip and printed circuit
boards. As number of leads increases, PTH technology is replaced by
Surface Mount Technology (SMT)
Conventional IC Packages
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Leadless Chip
Carrier
Pin Grid Array (PGA)
J-Leaded
Plastic
Quad Flat
Package
(PQFP)
Plastic Dual-in-line
Packages (PDIP)
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Ceramic Quad Flat Pack
Plane of heat dissipation
at IC layer on surface of
silicon chip
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PCB
Copper Pads
Underfill
Solder
Joints
Flip Chip Package
Chip directly connected to PCB by solder ball joints.
Area array packaging to accommodate more chip-to-board
interconnections.
Plane of heat dissipation
at IC layer on surface of
silicon chip
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Flip Chip Package
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Wirebonded Ball Grid Array (BGA)
Plane of heat dissipation at IC layer on
surface of silicon chip
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Flip Chip Ball Grid Array (BGA)
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Fully Populated and Depopulated BGA
Fully-populated BGA where
solder balls cover the entire
substrate
Depopulated BGA. Often the
central patch of solder balls
serve a thermal function rather
than an electrical function.
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Stacked Die Packages
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Stacked Flip-Chip CSP
CSP = Chip Scale Package
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Package-on-Package (PoP)
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Examples of Electronics Cooling Systems
Electronic box cooled with exhaust fan
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Water or Refrigerant Cooling Systems
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Electronic Boxes in Missiles
Plan view of electronic box with cover removed
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Coolers for PC CPUs Fan-Cooled Heat Sink
heat sink
fan
CPU
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Heat Pipes
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heat sink
Coolers for PC CPUs Heat Pipes
fan
heat pipes
CPU
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heat exchanger
Heat Pipe Coolers for Notebook Computers
fan
heat pipes
Copper block
for CPU
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Coolers for PC CPUs Thermoelectric Coolers
q
p q
p
q
sink
= q
p

P
e
q
sink
= q
p
+ P
e


Seebeck and Peltier effects.

A bigger heat sink will be necessary with thermoelectric cooling.
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Thermoelectric CPU Cooler for AMD Athlon
XP
Coolers for PC CPUs
Thermoelectric Coolers
heat sink
TE Cooler
CPU
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Liquid Cooling
Source: Thermacore
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Liquid Cooling
Source: Electronics Cooling
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Immersion Cooling
Source: Electronics Cooling
CRAY-2 liquid immersion cooling system
Boiling may
occur.
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Review of
Modes of Heat Transfer
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Conduction Heat Transfer
Thermal energy exchange from region of high temperature to
region of low temperature by the vibration of atoms/ions/molecules
and by the drift of electrons (metals)

Fouriers Law of Heat Conduction

Heat flux Temperature gradient

Heat flux, (1.1)


or heat rate, (1.2)

where k is the thermal conductivity of the material.
x
T
k q
x
c
c
=
' '
x
T
kA q
x
c
c
=
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W/m K



W/m K

Aluminum (pure)

216

Alloy 42

16

Alumina

25

Mylar

0.2

Bakelite

0.2

Nickel

92

Beryllia

230

Nylon

0.2

Copper

398

Platinum

69

Diamond

2300

Quartz

1.0

Epoxy (no fill)

0.2

Silicon (undoped)

144

Epoxy (high fill)

2.1

Silicone grease

0.2

Glass- epoxy

1.7

Silicone rubber

0.2

Gold

297

Silver

418

Kovar

16.4

Solder (37% Pb, 63% Sn)

53

Lead

34

Teflon

0.2

Magnesium (cast)

70

Thermal grease/paste

~1

Mica

0.5

Tin

63

Thermal Conductivity of Packaging Materials at 25C
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W/m K

Water

0.60

Freon 113

0.073

FC-72

0.055

FC-75

0.057

FC-77

0.057

Mineral Oil

~0.15

Thermal Conductivity of Selected Liquids at 25C
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Measured at (C)

W/m K

Air

0

0.024



100

0.030

Argon

0

0.017



63

0.019

Helium

7

0.144



56

0.159

Hydrogen

4

0.168



50

0.186

Thermal Conductivity of Selected Gases at 1 atm.
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Convection Heat Transfer
Convection thermal energy exchange between solid
surface and fluid as a result of the motion of the fluid relative
to the solid surface.
Forced convection
Motion of fluid artificially induced
e.g. by fan, pump.
Free (natural) convection
Motion of fluid induced by
buoyancy forces.



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Flow Regimes
Flow can be

Laminar or Turbulent
Smooth, orderly flow. Disorderly, mixing flow





Internal or External
Flow in tubes, ducts. Flow over surfaces.
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Heat flux, q = h (T
w
T
f
) [W/m
2
] (1.3)

Heat transfer rate, q = h A (T
w
T
f
) [W] (1.4)


where h = convective heat transfer coefficient
[W/m
2
K]
T
w
= temperature of wall surface
T
f
= bulk temperature of fluid
Newtons Law of Cooling
Heat flux Temperature difference
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Radiation Heat Transfer
No medium required for radiation heat transfer.

Stefan-Boltzmann Law of black body radiation

Emissive power, e
b
= oT
4
(1.5)

where T is absolute temperature [K]
o is S-B constant = 5.67 x 10
-8
[W/m
2
.T
-4
]

A black surface is one which absorbs all thermal radiation
incident on it.
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Radiation exchange between surfaces
Radiation heat transfer between two black surfaces

Q = oA
1
F
12
(T
1
4
- T
2
4
) (1.6)

where A
1
is area of surface 1, and
F
12
is a Shape or View Factor between the surfaces.


Radiation heat transfer is usually negligible when
temperature differences are not large. However, they can
be of the same order as natural convection heat transfer.