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Output Drive Capability: 10 LSTTL Loads Outputs Directly Interface to CMOS, NMOS and TTL Operating Voltage Range: 2.0 to 6.0 V Low Input Current: 1.0 mA High Noise Immunity Characteristic of CMOS Devices In Compliance with the Requirements Defined by JEDEC Standard No. 7A ESD Performance: HBM > 2000 V; Machine Model > 200 V Chip Complexity: 100 FETs or 29 Equivalent Gates These are PbFree Devices
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet.
74HC138
A0 A1 A2 1 2 3 15 Y0 14 Y1 13 Y2 12 Y3 11 Y4 10 Y5 9 Y6 7 Y7
1 2 3 4 5 6 7 8
16 15 14 13 12 11 10 9
VCC Y0 Y1 Y2 Y3 Y4 Y5 Y6
ADDRESS INPUTS
ACTIVELOW OUTPUTS
H = high level (steady state); L = low level (steady state); X = dont care
ORDERING INFORMATION
Device 74HC138DR2G 74HC138DTR2G Package SOIC16 (PbFree) TSSOP16* Shipping 2500 / Tape & Reel 2500 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently PbFree.
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MAXIMUM RATINGS
Symbol VCC Vin Vout Iin Iout ICC PD Tstg TL Parameter Value Unit V V V mA mA mA mW _C _C 260 DC Supply Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) DC Output Voltage (Referenced to GND) DC Input Current, per Pin DC Output Current, per Pin DC Supply Current, VCC and GND Pins Power Dissipation in Still Air, Storage Temperature Lead Temperature, 1 mm from Case for 10 Seconds (SOIC or TSSOP Package) SOIC Package TSSOP Package 0.5 to + 7.0 0.5 to VCC + 0.5 0.5 to VCC + 0.5 20 25 50 500 450 65 to + 150
74HC138
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this highimpedance circuit. For proper operation, Vin and Vout should be constrained to the range GND v (Vin or Vout) v VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Derating SOIC Package: 7 mW/_C from 65_ to 125_C TSSOP Package: 6.1 .W/_C from 65_ to 125_C For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor HighSpeed CMOS Data Book (DL129/D).
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74HC138
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Symbol VIH Parameter Minimum HighLevel Input Voltage Test Conditions Vout = 0.1 V or VCC 0.1 V |Iout| v 20 mA VCC (V) 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 2.0 4.5 6.0 3.0 4.5 6.0 2.0 4.5 6.0 3.0 4.5 6.0 6.0 6.0 Guaranteed Limit 55_C to 25_C 1.5 2.1 3.15 4.2 0.5 0.9 1.35 1.8 1.9 4.4 5.9 2.48 3.98 5.48 0.1 0.1 0.1 0.26 0.26 0.26 0.1 4 v 85_C 1.5 2.1 3.15 4.2 0.5 0.9 1.35 1.8 1.9 4.4 5.9 2.34 3.84 5.34 0.1 0.1 0.1 0.33 0.33 0.33 1.0 40 v 125_C 1.5 2.1 3.15 4.2 0.5 0.9 1.35 1.8 1.9 4.4 5.9 2.20 3.70 5.20 0.1 0.1 0.1 0.40 0.40 0.40 1.0 40 mA mA V Unit V
VIL
VOH
Vin = VIH or VIL |Iout| v 20 mA Vin = VIH or VIL |Iout| v 2.4 mA |Iout| v 4.0 mA |Iout| v 5.2 mA
VOL
Vin = VIH or VIL |Iout| v 20 mA Vin = VIH or VIL |Iout| v 2.4 mA |Iout| v 4.0 mA |Iout| v 5.2 mA
Iin ICC
Maximum Input Leakage Current Maximum Quiescent Supply Current (per Package)
NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor HighSpeed CMOS Data Book (DL129/D).
tPLH, tPHL
ns
tPLH, tPHL
ns
tTLH, tTHL
ns
Cin
pF
NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the ON Semiconductor HighSpeed CMOS Data Book (DL129/D). Typical @ 25C, VCC = 5.0 V CPD Power Dissipation Capacitance (Per Package)* 55 pF * Used to determine the no load dynamic power consumption: PD = CPD VCC2 f + ICC VCC . For load considerations, see Chapter 2 of the ON Semiconductor HighSpeed CMOS Data Book (DL129/D).
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74HC138
SWITCHING WAVEFORMS
VALID INPUT A tPLH OUTPUT Y 50% 50% tPHL OUTPUT Y tTHL VALID VCC GND INPUT CS1 tPHL tr 90% 50% 10% 90% 50% 10% tf VCC tPLH GND
tTLH
Figure 1.
Figure 2.
TEST POINT tf INPUT CS2, CS3 90% 50% 10% tr VCC tPLH GND DEVICE UNDER TEST OUTPUT C L*
OUTPUT Y
tPHL
tTHL
tTLH
Figure 3.
PIN DESCRIPTIONS
ADDRESS INPUTS A0, A1, A2 (Pins 1, 2, 3)
Address inputs. For any other combination of CS1, CS2, and CS3, the outputs are at a logic high.
OUTPUTS Y0 Y7 (Pins 15, 14, 13, 12, 11, 10, 9, 7)
Address inputs. These inputs, when the chip is selected, determine which of the eight outputs is activelow.
CONTROL INPUTS CS1, CS2, CS3 (Pins 6, 4, 5)
Chip select inputs. For CS1 at a high level and CS2, CS3 at a low level, the chip is selected and the outputs follow the
Activelow Decoded outputs. These outputs assume a low level when addressed and the chip is selected. These outputs remain high when not addressed or the chip is not selected.
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74HC138
EXPANDED LOGIC DIAGRAM
15
Y0
14
Y1
A0
13
Y2
A1
12
Y3
A2
11
Y4
10 CS3 CS2 5 4 9
Y5
Y6
Y7
CS1
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74HC138
PACKAGE DIMENSIONS
SOIC16 CASE 751B05 ISSUE K
A
16 9 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019
B
1 8
8 PL
0.25 (0.010)
G F
K C T
SEATING PLANE
X 45 _
M D
16 PL M
0.25 (0.010)
T B
SOLDERING FOOTPRINT*
6.40
16X 8X
1.12 16
1
16X
0.58
1.27 PITCH 8 9
DIMENSIONS: MILLIMETERS
*For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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74HC138
PACKAGE DIMENSIONS
TSSOP16 CASE 948F01 ISSUE B
16X K REF
T U
2X
L/2
16
J1 B U
SECTION NN J N
L
PIN 1 IDENT. 1 8
K1 0.25 (0.010) M
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE W. DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_
0.15 (0.006) T U
A V
N F DETAIL E
DETAIL E
SOLDERING FOOTPRINT*
7.06 1
0.65 PITCH
0.36
16X
16X
1.26
DIMENSIONS: MILLIMETERS
*For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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74HC138
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customers technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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74HC138/D