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March 9, 1998
AN96-2
Introduction
A crucial part of the overall design in a system incorporating a linear regulator is dissipating the heat that is generated in the regulator. This application note gives advice on choosing a heatsink and suitable part numbers from leading manufacturers.
(1)
s a =
Tj Ta j c c s P
Selecting a Heatsink 1. On the chart for the device that you are planning to Where: use, cross reference the maximum current required and (2) the systems maximum ambient temperature. s-a = thermal impedance sink-to-ambient (C/W) 2. Read the required heatsink thermal impedance (sink- Tj to-ambient) off the chart. If your plotted point is between two lines, use the lower thermal impedance value. Ta 3. Look up your required thermal impedance value in Table 1: Suggested Heatsink Selection, ensuring that j-c you use the column relevant to the air flow in your application. If the air flow in your application is between two of the values, then the lower flow rate column must be c-s used. From this table you can obtain suggested part numbers for three different manufacturers. Notes 1. These charts apply to heatsinking TO-220 regulators converting from 5V to 3.3V only. Please refer to the next column for information on how to calculate the heatsink requirements for other applications. 2. Note that if the device is mounted with no insulation, the heatsink will be smaller, less hardware will be used, and therefore the cost will be lower! Remember that in this case, the heatsink will be at the same potential as the output of the regulator. In cases with very high power dissipation, using insulation may not be an option. In extreme cases, consider using one of Semtechs switching solutions, or the EZ1900 Load Balance Controller to enable the use of two smaller heatsinks. = maximum junction temperature (C) (obtained from the device data sheet) = maximum ambient temperature (C) = thermal impedance junction-to-case (C/W) (obtained from the device data sheet) = thermal impedance case-to-sink (C/W) (look up in your thermal management hardware suppliers data - for the TO-220 package, typically 1.25C/W using silicone pads, and 0.5C/W using thermal grease with no insulation ) = power dissipated in the device (W) (where P = IOUT(max)(VIN(max)-VOUT(min)) for worst case calculation)
AN96-2
2.5
1.5
D
A = 50 C/W B = 20 C/W C = 17.5 C/W D = 15 C/W
A: No Heatsink
0.5
Heatsink Thermal Impedance (Sink-to-Ambient) vs. Ambient Temperature and Output Current o Device mounted using a silicone pad (c-s = 1.25 C/W)
2.5
1.5
A: No Heatsink
0.5
AN96-2
3.5
B
2.5
A
Output Current (A) A = 20 C/W 2 B = 17.5 C/W C = 15 C/W D = 12.5 C/W E = 10 C/W 1.5 F = 7.5 C/W
0.5
Heatsink Thermal Impedance (Sink-to-Ambient) vs. Ambient Temperature and Output Current o Device mounted using a silicone pad (c-s = 1.25 C/W)
3.5
B
2.5
A
Output Current (A)
A = 20 C/W B = 17.5 C/W C = 15 C/W D = 12.5 C/W E = 10 C/W F = 7.5 C/W G = 5 C/W
1.5
0.5
AN96-2
C
4
B
Output Current (A)
A
3
Heatsink Thermal Impedance (Sink-to-Ambient) vs. Ambient Temperature and Output Current o Device mounted using a silicone pad (c-s = 1.25 C/W)
C
4 Output Current (A) A = 15 C/W B = 12.5 C/W C = 10 C/W D = 7.5 C/W E = 5 C/W F = 2.5 C/W
B A
3
AN96-2
D
7
C
A = 12.5 C/W 5 Output Current (A) B = 10 C/W C = 7.5 C/W D = 5 C/W 4 E = 2.5 C/W F = 1 C/W
A
3
Heatsink Thermal Impedance (Sink-to-Ambient) vs. Ambient Temperature and Output Current o Device mounted using a silicone pad (c-s = 1.25 C/W)
E D
7
C
5 Output Current (A)
B
4
A
3
AN96-2
11
10
D
8 A = 12.5 C/W 7 Output Current (A) B = 10 C/W C = 7.5 C/W D = 5 C/W E = 2.5 C/W F = 1 C/W 5
C
6
B
4
A
3
Heatsink Thermal Impedance (Sink-to-Ambient) vs. Ambient Temperature and Output Current o Device mounted using a silicone pad (c-s = 1.25 C/W)
11
10
D
7 Output Current (A)
A = 12.5 C/W B = 10 C/W C = 7.5 C/W D = 5 C/W E = 2.5 C/W F = 1 C/W G = 0.5 C/W
C
5
B
4
A
3
AN96-2
297-V2-80B 574802
(2)
(2)
(2)
6021PB 297-V2-80B 575002 6021PB 286-AB 575002 6021PB 286-AB 513302 6101B 627-25ABP 513302 6101B 627-25ABP 532802 6400B 677-25ABP Not Applicable
(2)
(2)
(2) (2)
627-15ABP 513202 6100B 627-20ABP 532602 6298B 657-15ABP 532702 6299B 657-20ABP Not Applicable
(2)
(2) (2)
297-V2-80B 574802
(2)
6021PB 286-AB 513002 6098B 627-10ABP 532802 6300B 657-25ABP Specialized Solutions Only
A = Aavid Engineering, Inc. T = Thermalloy, Inc. W = Wakefield Engineering 2. No additional hardware required for these heatsinks (other than insulators/thermal grease as needed) 1998 SEMTECH CORP.