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Thermal Solutions
Excellence in Technology
Insulated Aluminum Substrates
Thermal Solutions for
Power Applications
T.T. Electronics is a leading designer and
manufacturer of electronic components.
As a result of our experience with power
components, Anotherm
substrates, an
innovative method of addressing thermal
problems was developed.
Anotherm
substrate and substrate and substrate and substrate and substrate and
trace. The anodized insulation layer gives excellent trace. The anodized insulation layer gives excellent trace. The anodized insulation layer gives excellent trace. The anodized insulation layer gives excellent trace. The anodized insulation layer gives excellent
continuos coverage, even around sharp corners continuos coverage, even around sharp corners continuos coverage, even around sharp corners continuos coverage, even around sharp corners continuos coverage, even around sharp corners
Printed traces on finned heatsink available.
Thermal Solutions
Specifications
g n i t a r e p O m u m i x a M
e g a t l o V
C A V 0 5 2
s u o u n i t n o C m u m i x a M
e r u t a r e p m e T g n i t a r e p O
) t n a k s a M r e d l o S o / w ( C 0 0 4
) t n a k s a M r e d l o S / w ( C 5 7 1
e c n a d e p m I l a m r e h T t t a W / C 2 . 0 * *
e n i L m u m i n i M
g n i c a p S / h t d i W
" 6 0 0 . 0 / " 6 0 0 . 0
) m m 5 1 . 0 / m m 5 1 . 0 (
s s e n k c i h T e c a r T r o t c u d n o C
0 7 4 ( d r a d n a t s s n o r c i m 2 2 1
0 5 1 o t p u , ) s e h c n i o r c i m
h g i h r o f ) " 6 0 0 . 0 ( s n o r c i m
s n o i t a c i l p p a t n e r r u c
e c a r T r o t c u d n o C
y t i v i t s i s e R
l i m / . q s / s m h o 7 1 0 0 . 0
s s e n k c i h t
s s e n k c i h T c i r t c e l e i D
) s n o r c i m 5 3 ( " 4 1 0 0 . 0
l a n i m o N
e z i S e t a r t s b u S m u m i x a M
" 0 1 x " 8
) m m 4 5 2 x m m 3 0 2 (
e t a r t s b u S m u m i x a M
s s e n k c i h T
" 5 7 . 0
) m m 9 1 (
* * , e r o c m u n i m u l a o t d a p d e t n i r p m o r f e c n a d e p m I l a m r e h T
. n i . q s 1 . 0 = e z i s d a p
Applications:
Solid State Relays
Automotive Power Electronics
L.E.D. Displays
DC-DC Switching Power Supplies
Power Amplifiers
Low Voltage Motor Controls
High Temperature Electronics such as down-hole
oilfield telemetry and automotive engine
compartment applications
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substrates can be scored and grooved for easy substrates can be scored and grooved for easy substrates can be scored and grooved for easy substrates can be scored and grooved for easy substrates can be scored and grooved for easy
singulation. singulation. singulation. singulation. singulation.
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substrates are compatible with chip & wire assembly substrates are compatible with chip & wire assembly substrates are compatible with chip & wire assembly substrates are compatible with chip & wire assembly substrates are compatible with chip & wire assembly. .. ..
Custom circuits and traces are also available on arrayed Custom circuits and traces are also available on arrayed Custom circuits and traces are also available on arrayed Custom circuits and traces are also available on arrayed Custom circuits and traces are also available on arrayed
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