VND600SP

DOUBLE CHANNEL HIGH SIDE SOLID STATE RELAY

TYPE VND600SP
I I

RDS(on) 30m

Ilim 25A

VCC 36 V
10

DC SHORT CIRCUIT CURRENT: 25 A

CMOS COMPATIBLE INPUTS I PROPORTIONAL LOAD CURRENT SENSE I UNDERVOLTAGE AND OVERVOLTAGEn SHUT-DOWN I OVERVOLTAGE CLAMP I THERMAL SHUT DOWN I CURRENT LIMITATION I VERY LOW STAND-BY POWER DISSIPATION I PROTECTION AGAINST: n LOSS OF GROUND AND LOSS OF VCC I REVERSE BATTERY PROTECTION (*) DESCRIPTION The VND600SP is a monolithic device made using STMicroelectronics VIPower M0-3 technology. It is intended for driving resistive or inductive loads with one side connected to ground. Active VCC pin voltage clamp protects the device against low energy spikes (see ISO7637 BLOCK DIAGRAM

PowerSO-10

ORDER CODES
PACKAGE PowerSO-10 TUBE T&R VND600SP VND600SP13TR

transient compatibility table). This device has two channels in high side configuration; each channel has an analog sense output on which the sensing current is proportional (according to a known ratio) to the corresponding load current. Built-in thermal shut-down and outputs current limitation protect the chip from over temperature and short circuit. Device turns off in case of ground pin disconnection.

VCC

OVERVOLTAGE VCC CLAMP UNDERVOLTAGE PwCLAMP 1

DRIVER 1

INPUT 1 LOGIC INPUT 2 GND

DRIVER 2

ILIM1 Vdslim1 IOUT1 K

Ot1

OUTPUT 1

CURRENT SENSE 1 OUTPUT 2

Ot2

PwCLAMP 2
Ot1

ILIM2 Vdslim2 IOUT2

OVERTEMP. 1 OVERTEMP. 2
Ot2

CURRENT SENSE 2

(*) See application schematic at page 8

October 2002

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VND600SP
ABSOLUTE MAXIMUM RATING
Symbol VCC -VCC - IGND IOUT IR IIN VCSENSE Parameter DC supply voltage Reverse supply voltage DC reverse ground pin current Output current Reverse output current Input current Current sense maximum voltage Electrostatic Discharge (Human Body Model: R=1.5K; C=100pF) - INPUT VESD - CURRENT SENSE - OUTPUT - VCC Maximum Switching Energy (L=0.13mH; RL=0; Vbat=13.5V; Tjstart=150C; IL=40A) Power dissipation at Tc=25C Junction operating temperature Case operating temperature Storage temperature 4000 2000 5000 5000 145 96.1 Internally limited -40 to 150 -55 to 150 V V V V mJ W C C C Value 41 -0.3 -200 Internally limited -21 +/- 10 -3 +15 Unit V V mA A A mA V V

EMAX Ptot Tj Tc TSTG

CONNECTION DIAGRAM (TOP VIEW)

GROUND INPUT 2 INPUT 1 C.SENSE1 C.SENSE2

6 7 8 9 10 11 VCC

5 4 3 2 1

OUTPUT 2 OUTPUT 2 N.C. OUTPUT 1 OUTPUT 1

CURRENT AND VOLTAGE CONVENTIONS

IS VCC IIN1 INPUT1 VIN1 IIN2 VIN2 INPUT2 IOUT1 OUTPUT1 ISENSE1 IOUT2 OUTPUT2 VSENSE1 VOUT1 VCC

CURRENT SENSE 1

V ISENSE2 OUT2 VSENSE2

CURRENT SENSE 2 GROUND IGND

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VND600SP
THERMAL DATA
Symbol Rthj-case Rthj-amb Parameter Thermal resistance junction-case Thermal resistance junction-ambient (MAX) (MAX) Value 1.3 51.3 (*) Unit C/W C/W

(*) When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35m thick).

ELECTRICAL CHARACTERISTICS (8V<VCC<36V; -40C<Tj<150C; unless otherwise specified) (Per each channel) POWER
Symbol VCC (**) VUSD (**) VOV (**) RON Vclamp IS (**) IL(off1) IL(off2) IL(off3) IL(off4) Parameter Operating supply voltage Undervoltage shutdown Overvoltage shutdown On state resistance Clamp Voltage Test Conditions Min 5.5 3 36 Typ 13 4 Max 36 5.5 30 60 41 48 12 12 100 55 40 25 6 50 0 5 3 Unit V V V m m m V A A mA A A A A

IOUT=5A; Tj=25C IOUT=5A; Tj=150C IOUT=3A; VCC=6V ICC=20mA (see note 3) Off State; VCC=13V; VIN=VOUT=0V Supply current Off State; VCC=13V; VIN=VOUT=0V; Tj=25C On state; VIN=5V; VCC=13V; IOUT=0A; RSENSE=3.9k VIN=VOUT=0V VIN=0V; VOUT=3.5V VIN=VOUT=0V; Vcc=13V; Tj =125C VIN=VOUT=0V; Vcc=13V; Tj =25C

Off State Off State Off State Off State

Output Current Output Current Output Current Output Current

0 -75

SWITCHING (VCC=13V)
Symbol td(on) td(off) Parameter Turn-on delay time Turn-on delay time Test Conditions RL=2.6 (see figure 1) RL=2.6 (see figure 1) RL=2.6 (see figure 1) RL=2.6 (see figure 1) Min Typ 30 30 See relative diagram See relative diagram Max Unit s s V/s V/s

(dVOUT/dt)on Turn-on voltage slope

(dVOUT/dt)off Turn-off voltage slope

PROTECTIONS
Symbol Ilim TTSD TR THYST Vdemag VON
(**) Per device.

Parameter DC short circuit current Thermal shut-down temperature Thermal reset temperature Thermal hysteresis Turn-off output voltage clamp Output voltage drop limitation VCC=13V

Test Conditions 5.5V<VCC<36V

Min 25

Typ 40

Max 70 70

Unit A A C C C V mV

150 135 7 IOUT=2A; VIN=0V; L=6mH IOUT=0.5A Tj= -40C...+150C

175

200

15

VCC-41 VCC-48 VCC-55 50

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VND600SP
ELECTRICAL CHARACTERISTICS (continued) CURRENT SENSE (9VVCC16V) (See figure 1)
Symbol K1 dK1/K1 K2 dK2/K2 K3 dK3/K3 VSENSE1,2 VSENSEH Parameter IOUT/ISENSE Current Sense Ratio Drift Test Conditions IOUT1 or IOUT2=0.5A; VSENSE=0.5V; other channels open; Tj= -40C...150C IOUT1 or IOUT2=0.5A; VSENSE=0.5V; other channels open; Tj= -40C...150C IOUT1 or IOUT2=5A; VSENSE=4V; other channels open; Tj=-40C Tj=25C...150C Current Sense Ratio Drift IOUT1 or IOUT2=5A; VSENSE=4V; other channels open; Tj=-40C...150C IOUT1 or IOUT2=15A; VSENSE=4V; other channels open; Tj=-40C Tj=25C...150C Current Sense Ratio Drift Max analog sense output voltage Analog sense output voltage in overtemperature condition Analog Sense Output Impedance in Overtemperature Condition Current sense delay response IOUT1 or IOUT2=15A; VSENSE=4V; other channels open; Tj=-40C...150C VCC=5.5V; IOUT1,2=2.5A; RSENSE=10k VCC>8V, IOUT1,2=5A; RSENSE=10k VCC=13V; RSENSE=3.9k Min 3300 -10 Typ 4400 Max 6000 +10 % Unit

IOUT/ISENSE

4200 4400 -6

4900 4900

6000 5750 +6 %

IOUT/ISENSE

4200 4400 -6 2 4

4900 4900

5500 5250 +6 % V V

5.5

RVSENSEH tDSENSE

VCC=13V; Tj>TTSD; All channels open to 90% ISENSE (see note 4)

400 500

LOGIC INPUT (Channels 1,2)

Symbol VIL IIL VIH IIH VI(hyst) VICL Parameter Input low level voltage Low level input current Input high level voltage High level input current Input hysteresis voltage Input clamp voltage Test Conditions VIN=1.25V VIN=3.25V IIN=1mA IIN=-1mA 0.5 6 6.8 -0.7 Min 1 3.25 10 8 Typ Max 1.25 Unit V A V A V V V

Note 3: Vclamp and VOV are correlated. Typical difference is 5V. Note 4: current sense signal delay after positive input slope. Note: sense pin doesnt have to be left floating.

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VND600SP
TRUTH TABLE (per channel)
CONDITIONS Normal operation Overtemperature Undervoltage Overvoltage INPUT L H L H L H L H L H H L H L OUTPUT L H L L L L L L L L L H H L SENSE 0 Nominal 0 VSENSEH 0 0 0 0 0 (Tj<TTSD) 0 (Tj>TTSD) VSENSEH 0 < Nominal 0

Short circuit to GND

Short circuit to VCC Negative output voltage clamp

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VND600SP

ELECTRICAL TRANSIENT REQUIREMENTS

ISO T/R 7637/1 Test Pulse 1 2 3a 3b 4 5 ISO T/R 7637/1 Test Pulse 1 2 3a 3b 4 5 CLASS C E I -25 V +25 V -25 V +25 V -4 V +26.5 V II -50 V +50 V -50 V +50 V -5 V +46.5 V TEST LEVELS III -75 V +75 V -100 V +75 V -6 V +66.5 V TEST LEVELS RESULTS II III C C C C C C C C C C E E IV -100 V +100 V -150 V +100 V -7 V +86.5 V Delays and Impedance 2 ms 10 0.2 ms 10 0.1 s 50 0.1 s 50 100 ms, 0.01 400 ms, 2

I C C C C C C

IV C C C C C E

CONTENTS All functions of the device are performed as designed after exposure to disturbance. One or more functions of the device is not performed as designed after exposure to disturbance and cannot be returned to proper operation without replacing the device.

Figure 1: Switching Characteristics (Resistive load RL=2.6)

VOUT

80% dVOUT /dt(on) tr ISENSE 90% 10%

90% dVOUT /dt(off) tf t

INPUT

tDSENSE

t td(off)

td(on)

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VND600SP
Figure 2: Waveforms

NORMAL OPERATION INPUTn LOAD CURRENTn SENSEn UNDERVOLTAGE VCC INPUTn LOAD CURRENTn SENSEn OVERVOLTAGE
VOV VUSD VUSDhyst

VCC INPUTn LOAD CURRENTn SENSEn

VCC < VOV

VCC > VOV

SHORT TO GROUND INPUTn LOAD CURRENTn LOAD VOLTAGEn SENSEn

SHORT TO VCC INPUTn LOAD VOLTAGEn LOAD CURRENTn SENSEn

<Nominal

<Nominal

OVERTEMPERATURE Tj INPUTn LOAD CURRENTn SENSEn

ISENSE= VSENSEH RSENSE TTSD TR

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VND600SP

APPLICATION SCHEMATIC

+5V

Rprot INPUT1

VCC
Dld

Rprot Rprot

CURRENT SENSE1 INPUT2

OUTPUT1

Rprot

CURRENT SENSE2 GND OUTPUT2

RSENSE1

RSENSE2

VGND

RGND

DGND

GND PROTECTION REVERSE BATTERY

NETWORK

AGAINST

Solution 1: Resistor in the ground line (RGND only). This can be used with any type of load. The following is an indication on how to dimension the RGND resistor. 1) RGND 600mV / IS(on)max. 2) RGND (VCC) / (-IGND) where -IGND is the DC reverse ground pin current and can be found in the absolute maximum rating section of the devices datasheet. Power Dissipation in RGND (when VCC<0: during reverse battery situations) is: PD= (-VCC)2/RGND This resistor can be shared amongst several different HSD. Please note that the value of this resistor should be calculated with formula (1) where IS(on)max becomes the sum of the maximum on-state currents of the different devices. Please note that if the microprocessor ground is not common with the device ground then the RGND will produce a shift (IS(on)max * RGND) in the input thresholds and the status output values. This shift will vary depending on how many devices are ON in the case of several high side drivers sharing the same RGND.

If the calculated power dissipation leads to a large resistor or several devices have to share the same resistor then the ST suggests to utilize Solution 2 (see below). Solution 2: A diode (DGND) in the ground line. A resistor (RGND=1k) should be inserted in parallel to DGND if the device will be driving an inductive load. This small signal diode can be safely shared amongst several different HSDs. Also in this case, the presence of the ground network will produce a shift (j600mV) in the input thresholds and the status output values if the microprocessor ground is not common with the device ground. This shift will not vary if more than one HSD shares the same diode/resistor network.

LOAD DUMP PROTECTION

Dld is necessary (Voltage Transient Suppressor) if the load dump peak voltage exceeds VCC max DC rating. The same applies if the device will be subject to transients on the VCC line that are greater than the ones shown in the ISO T/R 7637/1 table.

C I/Os PROTECTION:
If a ground protection network is used and negative transient are present on the VCC line, the control pins will be pulled negative. ST suggests to insert a resistor (Rprot ) in line to prevent the C I/Os pins to latch-up. The value of these resistors is a compromise between the leakage current of C and the current required by the

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VND600SP

HSD I/Os (Input levels compatibility) with the latch-up limit of C I/Os. -VCCpeak/Ilatchup Rprot (VOHC-VIH-VGND) / IIHmax

Calculation example: For VCCpeak= - 100V and Ilatchup 20mA; VOHC 4.5V 5k Rprot 65k. Recommended Rprot value is 10k.

Figure 3: IOUT/ISENSE versus IOUT IOUT/ISENSE

6500 6000
max.Tj=-40C

5500
max.Tj=25...150C

5000 4500 4000 3500 3000

min.Tj=25...150C typical value

min.Tj=-40C

8
IOUT (A)

10

12

14

16

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VND600SP

Off State Output Current

IL(off1) (uA)
5 4.5 4 3.5 3 2.5 2 1.5 1 0.5 0 -50 -25 0 25 50 75 100 125 150 175

High Level Input Current

Iih (uA)
5 4.5

Off state Vcc=36V Vin=Vout=0V

Vin=3.25V
4 3.5 3 2.5 2 1.5 1 0.5 0 -50 -25 0 25 50 75 100 125 150 175

Tc (C)

Tc (C)

Input Clamp Voltage

Vicl (V)
8 7.8

Input High Level

Vih (V)
3.6 3.4 3.2

Iin=1mA
7.6 7.4 7.2 7 6.8 6.6

3 2.8 2.6 2.4

6.4 6.2 6 -50 -25 0 25 50 75 100 125 150 175 2.2 2 -50 -25 0 25 50 75 100 125 150 175

Tc (C)

Tc (C)

Input Low Level

Vil (V)
2.6 2.4 2.2

Input Hysteresis Voltage

Vhyst (V)
1.5 1.4 1.3 1.2

2 1.8 1.6 1.4

1.1 1 0.9 0.8 0.7

1.2 1 -50 -25 0 25 50 75 100 125 150 175

0.6 0.5 -50 -25 0 25 50 75 100 125 150 175

Tc (C)

Tc (C)

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VND600SP

Overvoltage Shutdown
Vov (V)
50 48 46

ILIM Vs Tcase
Ilim (A)
80 70

Vcc=13V
60

44 42 40 38 36 20 34 32 30 -50 -25 0 25 50 75 100 125 150 175 10 0 -50 -25 0 25 50 75 100 125 150 175 50 40 30

Tc (C)

Tc (C)

Turn-on Voltage Slope

dVout/dt(on) (V/ms)
750 700 650 600 550 500 450 400 350 300 250 -50 -25 0 25 50 75 100 125 150 175

Turn-off Voltage Slope

dVout/dt(off) (V/ms)
500 450

Vcc=13V Rl=2.6Ohm

400 350 300 250 200 150 100 50 0 -50

Vcc=13V Rl=2.6Ohm

-25

25

50

75

100

125

150

175

Tc (C)

Tc (C)

On State Resistance Vs Tcase

Ron (mOhm)
100 90 80 70 60 50 40 30

On State Resistance Vs VCC

Ron (mOhm)
80 70

Iout=5A Vcc=8V & 36V

Iout=5A
60 50 40 30 20

Tc= 150C

Tc= 25C

20 10 0 -75 -50 -25 0 25 50 75 100 125 150 175

Tc= - 40C
10 0 5 10 15 20 25 30 35 40

Tc (C)

Vcc (V)

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VND600SP

Maximum turn off current versus load inductance

ILMAX (A) 100

A B C

10

1 0.01 0.1 1 L(mH) 10 100

A = Single Pulse at TJstart=150C B= Repetitive pulse at TJstart=100C C= Repetitive Pulse at TJstart=125C Conditions: VCC=13.5V Values are generated with RL=0 In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves B and C. VIN, IL Demagnetization Demagnetization Demagnetization

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VND600SP

PowerSO-10 THERMAL DATA

PowerSO-10 PC Board

Layout condition of Rth and Zth measurements (PCB FR4 area= 58mm x 58mm, PCB thickness=2mm, Cu thickness=35m, Copper areas: from minimum pad lay-out to 8cm2).

Rthj-amb Vs PCB copper area in open box free air condition

RTHj_amb (C/W)

55
Tj-Tamb=50C

50 45 40 35 30
0 2 4 6 8 10
PCB Cu heatsink area (cm^2)

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VND600SP

PowerSO-10 Thermal Impedance Junction Ambient Single Pulse

ZTH (C/W) 1000

100

Footprint 6 cm2

10

0.1

0.01 0.0001 0.001 0.01 0.1 1 Time (s) 10 100 1000

Thermal fitting model of a double channel HSD in PowerSO-10

Pulse calculation formula

ZTH = R TH + Z THtp ( 1 )
where

= tp T
Footprint 0.05 0.3 0.3 0.8 12 37 0.001 5.00E-03 0.02 0.3 0.75 3 6

Thermal Parameter
Tj_1
Pd1 C1 C2 C1 C2 C3 C4 C5 C6

R1

R2

R3

R4

R5

R6

Tj_2

R1 Pd2

R2

T_amb

Area/island (cm2) R1 (C/W) R2 (C/W) R3( C/W) R4 (C/W) R5 (C/W) R6 (C/W) C1 (W.s/C) C2 (W.s/C) C3 (W.s/C) C4 (W.s/C) C5 (W.s/C) C6 (W.s/C)

22

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VND600SP

PowerSO-10 MECHANICAL DATA

DIM. A A (*) A1 B B (*) C C (*) D D1 E E2 E2 (*) E4 E4 (*) e F F (*) H H (*) h L L (*) (*)
(*) Muar only POA P013P

mm. MIN. 3.35 3.4 0.00 0.40 0.37 0.35 0.23 9.40 7.40 9.30 7.20 7.30 5.90 5.90 1.27 1.25 1.20 13.80 13.85 0.50 1.20 0.80 0 2 1.80 1.10 8 8 0.047 0.031 0 2 1.35 1.40 14.40 14.35 0.049 0.047 0.543 0.545 TYP MAX. 3.65 3.6 0.10 0.60 0.53 0.55 0.32 9.60 7.60 9.50 7.60 7.50 6.10 6.30 MIN. 0.132 0.134 0.000 0.016 0.014 0.013 0.009 0.370 0.291 0.366 0.283 0.287 0.232 0.232

inch TYP. MAX. 0.144 0.142 0.004 0.024 0.021 0.022 0.0126 0.378 0.300 0.374 300 0.295 0.240 0.248 0.050 0.053 0.055 0.567 0.565 0.002 0.070 0.043 8 8

0.10 A B

10

E2

E4

SEATING PLANE e
0.25

DETAIL "A"

C D = D1 = = = SEATING PLANE

A F A1

A1

L DETAIL "A"
P095A

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VND600SP
PowerSO-10 SUGGESTED PAD LAYOUT
14.6 - 14.9
B

TUBE SHIPMENT (no suffix)

CASABLANCA MUAR
C

10.8- 11 6.30

A A

0.67 - 0.73 1 2 3 4 5 10 9 8 7 6 1.27 0.54 - 0.6

9.5

All dimensions are in mm. Base Q.ty Bulk Q.ty Tube length ( 0.5) Casablanca Muar 50 50 1000 1000 532 532 A B C ( 0.1) 0.8 0.8

10.4 16.4 4.9 17.2

TAPE AND REEL SHIPMENT (suffix 13TR)

REEL DIMENSIONS
Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) F G (+ 2 / -0) N (min) T (max) 600 600 330 1.5 13 20.2 24.4 60 30.4

All dimensions are in mm.

TAPE DIMENSIONS
According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb. 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 ( 0.1) P D ( 0.1/-0) D1 (min) F ( 0.05) K (max) P1 ( 0.1) 24 4 24 1.5 1.5 11.5 6.5 2
End

All dimensions are in mm.

Start Top cover tape 500mm min Empty components pockets saled with cover tape. User direction of feed 500mm min No components Components No components

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VND600SP

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a trademark of STMicroelectronics 2002 STMicroelectronics - Printed in ITALY- All Rights Reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. http://www.st.com

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