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DATA SHEET
Philips Semiconductors
Preliminary specication
TDA8920
The TDA8920 is a high efficiency class-D audio power amplifier. It can be used in a mono Bridge-Tied Load (BTL) or in a stereo Single-Ended (SE) configuration. The device operates over a wide supply voltage range from 15 V up to 30 V and consumes a very low quiescent current.
MAX. 30 60 31 37 50
UNIT
V mA %
Stereo single-ended conguration Po Gv(cl) Zi Vn(o) SVRR cs Po Gv(cl) Zi Vn(o) SVRR VO output power closed loop voltage gain input impedance noise output voltage supply voltage ripple rejection channel separation tbf 29 80 60 50 35 40 66 35 30 120 100 tbf W dB k V dB dB
Mono bridge-tied load conguration output power closed loop voltage gain input impedance noise output voltage supply voltage ripple rejection DC output offset voltage THD = 10% 130 36 60 140 W dB k V dB mV
1998 Dec 01
Philips Semiconductors
Preliminary specication
TDA8920
BLOCK DIAGRAM
VDD2 13
VDD1 5
BOOT1
IN1+ IN1
TDA8920J
12 VDD2 BOOT2
IN2+ IN2
2 SGND
1 OSC
10
MGR657
VSS1 VSS2
1998 Dec 01
Philips Semiconductors
Preliminary specication
TDA8920
1 2 3 4 5 6 7 8 9
TDA8920J
1998 Dec 01
Philips Semiconductors
Preliminary specication
TDA8920
Current limiting With an external resistor RLIM connected between pin LIM and VSS the maximum output current of the amplifiers can be set. If pin LIM is short-circuited to VSS, then the maximum output current is limited to 7 A. The relationship between maximum output current and resistor value is given by: 70.10 I O(max) = ------------------------------------------ [ A] 3 10.10 + R LIM Protections Protections are included to avoid the device being damaged at: Over-temperature Tj > 150 C Short-circuit of the loudspeaker terminals: when short-circuited the power dissipation is limited A maximum current limiter which limits the maximum output current to 7 A, or to the value set by RLIM. During limiting the current is measured and when the current is higher than 7 A, the amplifier is switched off within 3 s and every 20 ms the IC tries to restart. The dissipation will be low because of this low duty cycle. ESD protection (human body model: 3000 V and machine model: 300 V).
3
handbook, halfpage +5 V
R pin MODE
mute SGND
MGR660
1998 Dec 01
Philips Semiconductors
Preliminary specication
TDA8920
UNIT
C C C
THERMAL CHARACTERISTICS SYMBOL Rth(j-a) Rth(j-c) PARAMETER thermal resistance from junction to ambient thermal resistance from junction to case CONDITIONS in free air VALUE 40 10 UNIT K/W K/W
QUALITY SPECIFICATION Quality according to SNW-FQ-611-part E, if this type is used as an audio amplifier. SWITCHING CHARACTERISTICS VDD = 25 V; Tamb = 25 C; measured in Fig.5; unless otherwise specied. SYMBOL fosc VOSC(p-p) oscillator frequency voltage at tracking point (peak-to-peak value) PARAMETER MIN. 400 TYP. 500 1.75 MAX. 600 V UNIT kHz
1998 Dec 01
Philips Semiconductors
Preliminary specication
TDA8920
MAX. 30 60 50
UNIT
V mA A
Amplier outputs output offset voltage delta output offset voltage on and mute on mute 50 30 mV mV
Mode select input; see Fig.4 input voltage range input current threshold voltage threshold voltage hysteresis (Vth1+) (Vth1) threshold voltage threshold voltage hysteresis (Vth2+) (Vth2) mute on; note 2 on mute; note 2 note 2 Vms = 5.5 V standby mute; note 2 mute standby; note 2 0 1 3 5.5 tbf 2 4 V A V V mV V V mV
on
mute
Vms
1998 Dec 01
Philips Semiconductors
Preliminary specication
TDA8920
MAX.
UNIT W W W W % % dB % dB dB dB dB k V V V dB dB V dB
1. Total harmonic distortion is measured in a bandwidth of 22 Hz to 22 kHz, using an 11th-order low-pass filter. When distortion is measured using a lower order low-pass filter a significantly higher value will be found, due to the switching frequency outside the audio band. 2. Output power measured across the loudspeaker load. 3. Vripple = Vripple(max) = 2 V (p-p); fi = 100 Hz; Rs = 0 . 4. Vripple = Vripple(max) = 2 V (p-p); fi = 1 kHz; Rs = 0 . 5. B = 22 Hz to 22 kHz; Rs = 0 . 6. B = 22 Hz to 22 kHz; Rs = 10 k. 7. B = 22 Hz to 22 kHz; independent of Rs. 8. Po = tbf W; Rs = 0 . 9. Vi = Vi(max) = 1 V (RMS).
1998 Dec 01
Philips Semiconductors
Preliminary specication
TDA8920
UNIT W W W W % % dB % dB dB dB dB k V V V mV dB
1. Total harmonic distortion is measured in a bandwidth of 22 Hz to 22 kHz, using an 11th-order low-pass filter. When distortion is measured using a lower order low-pass filter a significantly higher value will be found, due to the switching frequency outside the audio band. 2. Output power measured across the loudspeaker load. 3. Vripple = Vripple(max) = 2 V (p-p); fi = 100 Hz; Rs = 0 . 4. Vripple = Vripple(max) = 2 V (p-p); fi = 1 kHz; Rs = 0 . 5. B = 22 Hz to 22 kHz; Rs = 0 . 6. B = 22 Hz to 22 kHz; Rs = 10 k. 7. B = 22 Hz to 22 kHz; independent of Rs. 8. Vi = Vi(max) = 1 V (RMS).
1998 Dec 01
Philips Semiconductors
Preliminary specication
TDA8920
VDD VDD2 13 VDD1 5 6 BOOT1 CBOOT1 100 nF IN1+ IN1 4 ANALOG 3 DIGITAL 7 OUT1 100 H 390 nF VSS1 LIM 16 PROTECTION 8 47 nF 100 nF 2200 F
25 V
Vi1 SGND
100 nF
TDA8920J
12 VDD2 BOOT2 CBOOT2 47 nF 11 OUT2 100 H 390 nF VSS2 8 0V SGND
Vi2 100 nF
STAB CSTAB
2 SGND Vms
1 OSC
10
100 nF
2200 F
25 V
ROSC 10 k
MGR663
Maximum value of CBOOT = tbf nF. Filter coil is type tbf, Rs < tbf . The case of the package is internally connected to VSS.
1998 Dec 01
10
Philips Semiconductors
Preliminary specication
TDA8920
25 V
100 nF Vi
IN1+ IN1
100 nF
PROTECTION
TDA8920J
12 VDD2 BOOT2 CBOOT2 47 nF 11 OUT2 100 H 390 nF VSS2 0V SGND
ANALOG
DIGITAL
STAB CSTAB
2 SGND Vms
1 OSC
10
100 nF
2200 F
25 V
ROSC 10 k
MGR664
Maximum value of CBOOT = tbf nF. Filter coil is type tbf, Rs < tbf . The case of the package is internally connected to VSS.
1998 Dec 01
11
Philips Semiconductors
Preliminary specication
TDA8920
SOT243-1
non-concave D x Dh
Eh
A2
B j E A
L3
Q c v M
1 Z e e1 bp w M
17 m e2
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT243-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION A 17.0 15.5 A2 4.6 4.2 bp 0.75 0.60 c 0.48 0.38 D (1) 24.0 23.6 d 20.0 19.6 Dh 10 E (1) 12.2 11.8 e 2.54 e1 e2 Eh 6 j 3.4 3.1 L 12.4 11.0 L3 2.4 1.6 m 4.3 Q 2.1 1.8 v 0.8 w 0.4 x 0.03 Z (1) 2.00 1.45
1.27 5.08
1998 Dec 01
12
Philips Semiconductors
Preliminary specication
TDA8920
SOT418-1
E D x
A X
c y E2 HE v M A
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A A1 max. 3.7 0.3 0.1 A2 3.5 3.2 A3 0.35 bp c D(1) D1 D2 1.1 0.9 E(1) 11.1 10.9 E1 6.2 5.8 E2 2.9 2.5 e 1.27 HE 14.5 13.9 Lp 1.1 0.8 Q 1.7 1.5 v w x y 0.1 Z 2.5 2.0 8 0
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT418-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
1998 Dec 01
13
Philips Semiconductors
Preliminary specication
TDA8920
Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. WAVE SOLDERING Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. For packages with leads on two sides and a pitch (e): larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
Philips Semiconductors
Preliminary specication
TDA8920
SOLDERING METHOD MOUNTING PACKAGE WAVE Through-hole mount DBS, DIP, HDIP, SDIP, SIL Surface mount BGA, SQFP HLQFP, HSQFP, HSOP, HTSSOP, SMS PLCC(4), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. 2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 4. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specication Preliminary specication Product specication Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specication is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specication. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains nal product specications. suitable(2) not suitable not not not suitable(3) recommended(4)(5) recommended(6) suitable REFLOW(1) suitable suitable suitable suitable suitable DIPPING suitable
1998 Dec 01
15
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 Philips Electronics N.V. 1998
SCA60
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
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