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IRFL4105
HEXFET Power MOSFET
l l l l l l
Surface Mount Advanced Process Technology Ultra Low On-Resistance Dynamic dv/dt Rating Fast Switching Fully Avalanche Rated
ID = 3.7A
S
Description
Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. This benefit, combined with the fast switching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an extremely efficient and reliable device for use in a wide variety of applications. The SOT-223 package is designed for surface-mount using vapor phase, infra red, or wave soldering techniques. Its unique package design allows for easy automatic pickand-place as with other SOT or SOIC packages but has the added advantage of improved thermal performance due to an enlarged tab for heatsinking. Power dissipation of 1.0W is possible in a typical surface mount application.
S O T -22 3
Max.
5.2 3.7 3.0 30 2.1 1.0 8.3 20 110 3.7 0.10 5.0 -55 to + 150
Units
A
W W
mW/C
V mJ A mJ V/ns C
Thermal Resistance
Parameter
RJA RJA Junction-to-Amb. (PCB Mount, steady state)* Junction-to-Amb. (PCB Mount, steady state)**
Typ.
90 50
Max.
120 60
Units
C/W
* When mounted on FR-4 board using minimum recommended footprint. ** When mounted on 1 inch square copper board, for comparison with other SMD devices.
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1
1/14/99
IRFL4105
Electrical Characteristics @ TJ = 25C (unless otherwise specified)
V(BR)DSS
V(BR)DSS/TJ
RDS(on) VGS(th) gfs IDSS IGSS Qg Qgs Qgd td(on) tr td(off) tf Ciss Coss Crss
Parameter Drain-to-Source Breakdown Voltage Breakdown Voltage Temp. Coefficient Static Drain-to-Source On-Resistance Gate Threshold Voltage Forward Transconductance Drain-to-Source Leakage Current Gate-to-Source Forward Leakage Gate-to-Source Reverse Leakage Total Gate Charge Gate-to-Source Charge Gate-to-Drain ("Miller") Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance
Max. Units Conditions V VGS = 0V, ID = 250A V/C Reference to 25C, ID = 1mA 0.045 VGS = 10V, ID = 3.7A 4.0 V VDS = VGS, ID = 250A S VDS = 25V, ID = 1.9A 25 VDS = 55V, VGS = 0V A 250 VDS = 44V, VGS = 0V, TJ = 150C 100 VGS = 20V nA -100 VGS = -20V 35 ID = 3.7A 5.1 nC VDS = 44V 15 VGS = 10V, See Fig. 6 and 13 VDD = 28V ID = 3.7A ns RG = 6.0 RD = 7.5, See Fig. 10 VGS = 0V pF VDS = 25V = 1.0MHz, See Fig. 5
Parameter Continuous Source Current (Body Diode) Pulsed Source Current (Body Diode) Diode Forward Voltage Reverse Recovery Time Reverse RecoveryCharge
Conditions MOSFET symbol showing the integral reverse p-n junction diode. TJ = 25C, IS = 3.7A, VGS = 0V TJ = 25C, I F = 3.7A di/dt = 100A/s
Notes:
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IRFL4105
100
TO P VGS 15V 10V 8.0V 7.0V 6.0V 5.5V 5.0V 4.5V
100
I , D rain-to-S ou rc e C urre nt (A ) D
BO TTOM
VGS 15V 10V 8.0V 7.0V 6.0V 5.5V 5.0V BOTTOM 4.5V TOP
10
10
4 .5V
4 .5 V
1 0.1 1
2 0 s P U L S E W ID T H T C = 25 C
10 100
1 0.1 1
20 s P U LS E W ID TH T J = 1 50 C
10 100
100
2.0
I D = 3.7 A
1.5
TJ = 2 5C TJ = 1 5 0 C
10
1.0
0.5
V DS = 25V 2 0 s P UL S E W ID TH
6.0 6.5 7.0
V G S = 1 0V
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IRFL4105
1200 20
1000
C iss
800
C oss
600
V GS C is s C rs s C o ss
= = = =
0V , f = 1M H z C g s + C g d , Cd s S H O R T E D C gd C d s + C gd
I D = 3.7 A V D S = 24 V V D S = 15 V
16
C , Capacitance (pF)
12
400
C rss
200
0 1 10 100
0 0 10 20
FO R TE S T C IR C U IT S E E FIG U R E 9
30 40
100
100
O P E R A TIO N IN TH IS A R E A L IM ITE D B Y R D S (o n)
10s
I D , Drain C urrent (A )
10 100 s
10
TJ = 1 50 C T J = 25 C
1m s 1 10m s
V G S = 0V
1.4
0.1
T A = 25 C T J = 15 0C S ing le P u lse
0.1 1 10 100
1.6
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IRFL4105
QG
VDS VGS
RD
10V
QGS VG QGD
D.U.T.
+
RG
- VDD
10V
Charge
Pulse Width 1 s Duty Factor 0.1 %
VDS
50K 12V .2F .3F
90%
D.U.T. VGS
3mA
+ V - DS
10% VGS
td(on)
IG ID
tr
t d(off)
tf
100 D = 0 .5 0 0 .2 0 10 0 .1 0 0 .0 5 0 .0 2 1 0 .0 1
PD M
t
0.1 S IN G L E P U L S E (T H E R M A L R E S P O N S E )
1 t2
N o te s : 1 . D u ty fa c to r D = t
/t
0.01 0.00001
2 . P e a k T J = P D M x Z th J A + T A
A
10000
0.0001
0.001
0.01
0.1
10
100
1000
IRFL4105
300
1 5V
TO P
250
B O TTO M
VDS
D RIV E R
200
RG
20 V tp
D .U .T
IA S
+ - VD D
150
0 .01
100
50
V D D = 25 V
25 50 75 100 125
A
150
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IRFL4105
Peak Diode Recovery dv/dt Test Circuit
D.U.T
Circuit Layout Considerations Low Stray Inductance Ground Plane Low Leakage Inductance Current Transformer
RG dv/dt controlled by RG Driver same type as D.U.T. ISD controlled by Duty Factor "D" D.U.T. - Device Under Test
+ VDD
D.U.T. ISD Waveform Reverse Recovery Current Body Diode Forward Current di/dt D.U.T. VDS Waveform Diode Recovery dv/dt
VDD
Body Diode
Forward Drop
Ripple 5%
ISD
* VGS = 5V for Logic Level Devices Fig 13. For N-Channel HEXFETS
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IRFL4105
Package Outline
SOT-223 (TO-261AA) Outline
TOP
B O TT O M
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IRFL4105
Tape & Reel Information
SOT-223 Outline
4 .1 0 (.1 6 1 ) 3 .9 0 (.1 5 4 ) 1 .8 5 (.0 7 2 ) 1 .6 5 (.0 6 5 ) 0 .3 5 (.0 1 3 ) 0 .2 5 (.0 1 0 )
TR
2 .0 5 (.0 8 0 ) 1 .9 5 (.0 7 7 )
7 .5 5 (.2 9 7) 7 .4 5 (.2 9 4) 7 .6 0 (.2 9 9 ) 7 .4 0 (.2 9 2 ) 1 .6 0 (.0 6 2 ) 1 .5 0 (.0 5 9 ) TYP . F E E D D IR E C T IO N 1 2 .1 0 (.4 7 5 ) 1 1 .9 0 (.4 6 9 ) NOTES : 1 . C O N T R O L L IN G D IM E N S IO N : M IL L IM E T E R . 2 . O U T L IN E C O N F O R M S T O E IA -4 8 1 & E IA -5 4 1 . 3 . E A C H O 3 30 .0 0 (1 3 .0 0 ) R E E L C O N T A IN S 2 ,5 0 0 D E V IC E S . 1 3 .2 0 (.5 1 9 ) 1 2 .8 0 (.5 0 4 ) 1 5 .40 (.6 0 7) 1 1 .90 (.4 6 9) 4 7 .1 0 (.2 7 9 ) 6 .9 0 (.2 7 2 )
1 6 .3 0 (.6 4 1 ) 1 5 .7 0 (.6 1 9 )
2 .3 0 (.0 9 0 ) 2 .1 0 (.0 8 3 )
5 0.00 (1 .9 6 9 ) M IN .
N O TE S : 1 . O U T LIN E C O M F O R M S T O E IA -4 1 8 -1 . 2 . C O N T R O L L IN G D IM E N S IO N : M IL L IM E T E R .. 3 . D IM E N S IO N M E A S U R E D @ H U B . 4 . IN C L U D E S F L A N G E D IS T O R T IO N @ O U T E R E D G E .
1 4 .4 0 (.5 6 6 ) 1 2 .4 0 (.4 8 8 ) 3
1 8 .4 0 (.72 4 ) M AX . 4
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