OptiX OSN 1500 Intelligent Optical Transmission System V100R008

Hardware Description

Issue Date Part Number

02 2007-03-29 00384267

Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd

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Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Contents

Contents
About This Document.....................................................................................................................1 1 Equipment Structure.................................................................................................................1-1 2 Cabinet.........................................................................................................................................2-1
2.1 Cabinet Type...................................................................................................................................................2-2 2.2 Cabinet Configuration.....................................................................................................................................2-2 2.2.1 Cabinet Indicator....................................................................................................................................2-3 2.2.2 DC PDU.................................................................................................................................................2-3 2.2.3 Other Configuration...............................................................................................................................2-4 2.3 Technical Specifications.................................................................................................................................2-5

3 Subrack.........................................................................................................................................3-1
3.1 Structure..........................................................................................................................................................3-2 3.2 Capacity...........................................................................................................................................................3-3 3.3 Slot Allocation.................................................................................................................................................3-4 3.4 Slot Allocation...............................................................................................................................................3-13 3.5 Technical Specifications...............................................................................................................................3-24

4 Board List and Classification...................................................................................................4-1

4.1 Appearance and Dimensions of Boards..........................................................................................................4-2 4.2 Description of the Barcode on the Board........................................................................................................4-3 4.3 Board Classification........................................................................................................................................4-4 4.3.1 SDH Processing Boards.........................................................................................................................4-4 4.3.2 PDH Processing Boards.........................................................................................................................4-6 4.3.3 Data Processing Boards..........................................................................................................................4-7 4.3.4 Interface Boards and Switching Boards.................................................................................................4-9 4.3.5 Cross-Connect Boards and SCC Boards..............................................................................................4-10 4.3.6 Auxiliary Boards..................................................................................................................................4-10 4.3.7 WDM Processing Boards.....................................................................................................................4-11 4.3.8 Optical Amplifier Boards and Dispersion Compensation Board.........................................................4-12 4.3.9 Power Interface Boards........................................................................................................................4-12

5 SDH Processing Boards............................................................................................................5-1

5.1 SL1..................................................................................................................................................................5-3 5.1.1 Version Description................................................................................................................................5-3 Issue 02 (2007-03-29) Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd i

Contents

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description 5.1.2 Function and Feature..............................................................................................................................5-4 5.1.3 Working Principle and Signal Flow.......................................................................................................5-5 5.1.4 Front Panel.............................................................................................................................................5-7 5.1.5 Valid Slots..............................................................................................................................................5-8 5.1.6 Board Feature Code................................................................................................................................5-9 5.1.7 Board Configuration Reference.............................................................................................................5-9 5.1.8 Technical Specifications........................................................................................................................5-9

5.2 SL1A.............................................................................................................................................................5-11 5.2.1 Version Description..............................................................................................................................5-11 5.2.2 Function and Feature............................................................................................................................5-11 5.2.3 Working Principle and Signal Flow.....................................................................................................5-12 5.2.4 Front Panel...........................................................................................................................................5-14 5.2.5 Valid Slots............................................................................................................................................5-15 5.2.6 Board Feature Code..............................................................................................................................5-15 5.2.7 Board Configuration Reference...........................................................................................................5-15 5.2.8 Technical Specifications......................................................................................................................5-15 5.3 SLQ1.............................................................................................................................................................5-17 5.3.1 Version Description..............................................................................................................................5-17 5.3.2 Function and Feature............................................................................................................................5-18 5.3.3 Working Principle and Signal Flow.....................................................................................................5-19 5.3.4 Front Panel...........................................................................................................................................5-21 5.3.5 Valid Slots............................................................................................................................................5-22 5.3.6 Board Feature Code..............................................................................................................................5-23 5.3.7 Board Configuration Reference...........................................................................................................5-23 5.3.8 Technical Specifications......................................................................................................................5-24 5.4 SLQ1A..........................................................................................................................................................5-25 5.4.1 Version Description..............................................................................................................................5-26 5.4.2 Function and Feature............................................................................................................................5-26 5.4.3 Working Principle and Signal Flow.....................................................................................................5-27 5.4.4 Front Panel...........................................................................................................................................5-28 5.4.5 Valid Slots............................................................................................................................................5-30 5.4.6 Board Feature Code..............................................................................................................................5-30 5.4.7 Board Configuration Reference...........................................................................................................5-30 5.4.8 Technical Specifications......................................................................................................................5-30 5.5 SLO1.............................................................................................................................................................5-32 5.5.1 Version Description..............................................................................................................................5-32 5.5.2 Function and Feature............................................................................................................................5-32 5.5.3 Working Principle and Signal Flow.....................................................................................................5-33 5.5.4 Front Panel...........................................................................................................................................5-35 5.5.5 Valid Slots............................................................................................................................................5-37 5.5.6 Board Feature Code..............................................................................................................................5-37 5.5.7 Board Configuration Reference...........................................................................................................5-37 ii Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd Issue 02 (2007-03-29)

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Contents

5.5.8 Technical Specifications......................................................................................................................5-38 5.6 SLT1..............................................................................................................................................................5-39 5.6.1 Version Description..............................................................................................................................5-39 5.6.2 Function and Feature............................................................................................................................5-39 5.6.3 Working Principle and Signal Flow.....................................................................................................5-40 5.6.4 Front Panel...........................................................................................................................................5-42 5.6.5 Valid Slots............................................................................................................................................5-44 5.6.6 Board Configuration Reference...........................................................................................................5-44 5.6.7 Technical Specifications......................................................................................................................5-44 5.7 SEP1..............................................................................................................................................................5-45 5.7.1 Version Description..............................................................................................................................5-46 5.7.2 Function and Feature............................................................................................................................5-46 5.7.3 Working Principle and Signal Flow.....................................................................................................5-47 5.7.4 Front Panel...........................................................................................................................................5-50 5.7.5 Valid Slots............................................................................................................................................5-52 5.7.6 TPS Protection for the Board...............................................................................................................5-52 5.7.7 Board Configuration Reference...........................................................................................................5-53 5.7.8 Technical Specifications......................................................................................................................5-54 5.8 SL4................................................................................................................................................................5-54 5.8.1 Version Description..............................................................................................................................5-55 5.8.2 Function and Feature............................................................................................................................5-55 5.8.3 Working Principle and Signal Flow.....................................................................................................5-56 5.8.4 Front Panel...........................................................................................................................................5-58 5.8.5 Valid Slots............................................................................................................................................5-60 5.8.6 Board Feature Code..............................................................................................................................5-60 5.8.7 Board Configuration Reference...........................................................................................................5-61 5.8.8 Technical Specifications......................................................................................................................5-61 5.9 SL4A.............................................................................................................................................................5-62 5.9.1 Version Description..............................................................................................................................5-63 5.9.2 Function and Feature............................................................................................................................5-63 5.9.3 Working Principle and Signal Flow.....................................................................................................5-64 5.9.4 Front Panel...........................................................................................................................................5-65 5.9.5 Valid Slots............................................................................................................................................5-67 5.9.6 Board Feature Code..............................................................................................................................5-67 5.9.7 Board Configuration Reference...........................................................................................................5-67 5.9.8 Technical Specifications......................................................................................................................5-67 5.10 SLD4...........................................................................................................................................................5-68 5.10.1 Version Description............................................................................................................................5-69 5.10.2 Function and Feature..........................................................................................................................5-70 5.10.3 Working Principle and Signal Flow...................................................................................................5-71 5.10.4 Front Panel.........................................................................................................................................5-73 5.10.5 Valid Slots..........................................................................................................................................5-74 Issue 02 (2007-03-29) Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd iii

Contents

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description 5.10.6 Board Feature Code............................................................................................................................5-75 5.10.7 Board Configuration Reference.........................................................................................................5-75 5.10.8 Technical Specifications....................................................................................................................5-76

5.11 SLD4A........................................................................................................................................................5-77 5.11.1 Version Description............................................................................................................................5-77 5.11.2 Function and Feature..........................................................................................................................5-77 5.11.3 Working Principle and Signal Flow...................................................................................................5-78 5.11.4 Front Panel.........................................................................................................................................5-79 5.11.5 Valid Slots..........................................................................................................................................5-81 5.11.6 Board Feature Code............................................................................................................................5-81 5.11.7 Board Configuration Reference.........................................................................................................5-81 5.11.8 Technical Specifications....................................................................................................................5-81 5.12 SLQ4...........................................................................................................................................................5-83 5.12.1 Version Description............................................................................................................................5-83 5.12.2 Function and Feature..........................................................................................................................5-84 5.12.3 Working Principle and Signal Flow...................................................................................................5-85 5.12.4 Front Panel.........................................................................................................................................5-87 5.12.5 Valid Slots..........................................................................................................................................5-88 5.12.6 Board Feature Code............................................................................................................................5-88 5.12.7 Board Configuration Reference.........................................................................................................5-89 5.12.8 Technical Specifications....................................................................................................................5-89 5.13 SLQ4A........................................................................................................................................................5-90 5.13.1 Version Description............................................................................................................................5-90 5.13.2 Function and Feature..........................................................................................................................5-91 5.13.3 Working Principle and Signal Flow...................................................................................................5-92 5.13.4 Front Panel.........................................................................................................................................5-93 5.13.5 Valid Slots..........................................................................................................................................5-94 5.13.6 Board Feature Code............................................................................................................................5-94 5.13.7 Board Configuration Reference.........................................................................................................5-94 5.13.8 Technical Specifications....................................................................................................................5-95 5.14 SL16............................................................................................................................................................5-96 5.14.1 Version Description............................................................................................................................5-96 5.14.2 Function and Feature..........................................................................................................................5-97 5.14.3 Working Principle and Signal Flow...................................................................................................5-98 5.14.4 Front Panel.......................................................................................................................................5-100 5.14.5 Valid Slots........................................................................................................................................5-102 5.14.6 Board Feature Code..........................................................................................................................5-102 5.14.7 Board Configuration Reference.......................................................................................................5-102 5.14.8 Technical Specifications..................................................................................................................5-102 5.15 SL16A.......................................................................................................................................................5-104 5.15.1 Version Description..........................................................................................................................5-105 5.15.2 Function and Feature........................................................................................................................5-105 iv Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd Issue 02 (2007-03-29)

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Contents

5.15.3 Working Principle and Signal Flow.................................................................................................5-106 5.15.4 Front Panel.......................................................................................................................................5-109 5.15.5 Valid Slots........................................................................................................................................5-110 5.15.6 Board Feature Code..........................................................................................................................5-110 5.15.7 Board Configuration Reference.......................................................................................................5-111 5.15.8 Technical Specifications..................................................................................................................5-111 5.16 SF16..........................................................................................................................................................5-112 5.16.1 Version Description..........................................................................................................................5-113 5.16.2 Function and Feature........................................................................................................................5-113 5.16.3 Working Principle and Signal Flow.................................................................................................5-114 5.16.4 Front Panel.......................................................................................................................................5-116 5.16.5 Valid Slots........................................................................................................................................5-118 5.16.6 Board Configuration Reference.......................................................................................................5-118 5.16.7 Technical Specifications..................................................................................................................5-118

6 PDH Processing Boards............................................................................................................6-1

6.1 PL1..................................................................................................................................................................6-3 6.1.1 Version Description................................................................................................................................6-3 6.1.2 Function and Feature..............................................................................................................................6-3 6.1.3 Working Principle and Signal Flow.......................................................................................................6-4 6.1.4 Front Panel.............................................................................................................................................6-6 6.1.5 Valid Slots..............................................................................................................................................6-7 6.1.6 Board Feature Code................................................................................................................................6-7 6.1.7 Board Configuration Reference.............................................................................................................6-7 6.1.8 Technical Specifications........................................................................................................................6-8 6.2 PD1 .................................................................................................................................................................6-8 6.2.1 Version Description................................................................................................................................6-9 6.2.2 Function and Feature..............................................................................................................................6-9 6.2.3 Working Principle and Signal Flow.....................................................................................................6-10 6.2.4 Front Panel...........................................................................................................................................6-13 6.2.5 Valid Slots............................................................................................................................................6-13 6.2.6 Board Feature Code..............................................................................................................................6-14 6.2.7 TPS Protection for the Board...............................................................................................................6-15 6.2.8 Board Configuration Reference...........................................................................................................6-17 6.2.9 Technical Specifications......................................................................................................................6-17 6.3 PQ1................................................................................................................................................................6-18 6.3.1 Version Description..............................................................................................................................6-18 6.3.2 Function and Feature............................................................................................................................6-19 6.3.3 Working Principle and Signal Flow.....................................................................................................6-20 6.3.4 Front Panel...........................................................................................................................................6-22 6.3.5 Valid Slots............................................................................................................................................6-23 6.3.6 Board Feature Code..............................................................................................................................6-24 6.3.7 TPS Protection for the Board...............................................................................................................6-24 Issue 02 (2007-03-29) Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd v

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description 6.3.8 Board Configuration Reference...........................................................................................................6-26 6.3.9 Technical Specifications......................................................................................................................6-26

6.4 PQM .............................................................................................................................................................6-27 6.4.1 Version Description..............................................................................................................................6-27 6.4.2 Function and Feature............................................................................................................................6-27 6.4.3 Working Principle and Signal Flow.....................................................................................................6-28 6.4.4 Front Panel...........................................................................................................................................6-31 6.4.5 Valid Slots............................................................................................................................................6-32 6.4.6 TPS Protection for the Board...............................................................................................................6-32 6.4.7 Board Configuration Reference...........................................................................................................6-34 6.4.8 Technical Specifications......................................................................................................................6-34 6.5 PL3................................................................................................................................................................6-35 6.5.1 Version Description..............................................................................................................................6-35 6.5.2 Function and Feature............................................................................................................................6-36 6.5.3 Working Principle and Signal Flow.....................................................................................................6-36 6.5.4 Front Panel...........................................................................................................................................6-39 6.5.5 Valid Slots............................................................................................................................................6-40 6.5.6 TPS Protection for the Board...............................................................................................................6-40 6.5.7 Board Configuration Reference...........................................................................................................6-42 6.5.8 Technical Specifications......................................................................................................................6-42 6.6 PL3A.............................................................................................................................................................6-43 6.6.1 Version Description..............................................................................................................................6-43 6.6.2 Function and Feature............................................................................................................................6-44 6.6.3 Working Principle and Signal Flow.....................................................................................................6-45 6.6.4 Front Panel...........................................................................................................................................6-47 6.6.5 Valid Slots............................................................................................................................................6-48 6.6.6 Board Configuration Reference...........................................................................................................6-49 6.6.7 Technical Specifications......................................................................................................................6-49 6.7 PD3................................................................................................................................................................6-50 6.7.1 Version Description..............................................................................................................................6-50 6.7.2 Function and Feature............................................................................................................................6-51 6.7.3 Working Principle and Signal Flow.....................................................................................................6-51 6.7.4 Front Panel...........................................................................................................................................6-54 6.7.5 Valid Slots............................................................................................................................................6-55 6.7.6 TPS Protection for the Board...............................................................................................................6-55 6.7.7 Board Configuration Reference...........................................................................................................6-57 6.7.8 Technical Specifications......................................................................................................................6-57 6.8 PQ3................................................................................................................................................................6-57 6.8.1 Version Description..............................................................................................................................6-58 6.8.2 Function and Feature............................................................................................................................6-58 6.8.3 Working Principle and Signal Flow.....................................................................................................6-59 6.8.4 Front Panel...........................................................................................................................................6-61 vi Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd Issue 02 (2007-03-29)

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

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6.8.5 Valid Slots............................................................................................................................................6-62 6.8.6 TPS Protection for the Board...............................................................................................................6-63 6.8.7 Board Configuration Reference...........................................................................................................6-64 6.8.8 Technical Specifications......................................................................................................................6-65 6.9 DX1...............................................................................................................................................................6-65 6.9.1 Version Description..............................................................................................................................6-66 6.9.2 Function and Feature............................................................................................................................6-66 6.9.3 Working Principle and Signal Flow.....................................................................................................6-66 6.9.4 Front Panel...........................................................................................................................................6-68 6.9.5 Valid Slots............................................................................................................................................6-69 6.9.6 Board Feature Code..............................................................................................................................6-69 6.9.7 TPS Protection for the Board...............................................................................................................6-70 6.9.8 Board Configuration Reference...........................................................................................................6-71 6.9.9 Technical Specifications......................................................................................................................6-71 6.10 DXA............................................................................................................................................................6-72 6.10.1 Version Description............................................................................................................................6-72 6.10.2 Function and Feature..........................................................................................................................6-73 6.10.3 Working Principle and Signal Flow...................................................................................................6-73 6.10.4 Front Panel.........................................................................................................................................6-74 6.10.5 Valid Slots..........................................................................................................................................6-75 6.10.6 Board Configuration Reference.........................................................................................................6-76 6.10.7 Technical Specifications....................................................................................................................6-76 6.11 SPQ4............................................................................................................................................................6-76 6.11.1 Version Description............................................................................................................................6-77 6.11.2 Function and Feature..........................................................................................................................6-77 6.11.3 Working Principle and Signal Flow...................................................................................................6-78 6.11.4 Front Panel.........................................................................................................................................6-82 6.11.5 Valid Slots..........................................................................................................................................6-83 6.11.6 TPS Protection for the Board.............................................................................................................6-84 6.11.7 Board Configuration Reference.........................................................................................................6-85 6.11.8 Technical Specifications....................................................................................................................6-85

7 Data Processing Boards.............................................................................................................7-1

7.1 EFT4................................................................................................................................................................7-3 7.1.1 Version Description................................................................................................................................7-3 7.1.2 Function and Feature..............................................................................................................................7-3 7.1.3 Working Principle and Signal Flow.......................................................................................................7-4 7.1.4 Front Panel.............................................................................................................................................7-6 7.1.5 Valid Slots..............................................................................................................................................7-8 7.1.6 Board Configuration Reference.............................................................................................................7-8 7.1.7 Technical Specifications........................................................................................................................7-8 7.2 EFT8................................................................................................................................................................7-9 7.2.1 Version Description................................................................................................................................7-9 Issue 02 (2007-03-29) Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd vii

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description 7.2.2 Function and Feature..............................................................................................................................7-9 7.2.3 Working Principle and Signal Flow.....................................................................................................7-11 7.2.4 Front Panel...........................................................................................................................................7-12 7.2.5 Valid Slots............................................................................................................................................7-14 7.2.6 Board Configuration Reference...........................................................................................................7-15 7.2.7 Technical Specifications......................................................................................................................7-15

7.3 EFT8A...........................................................................................................................................................7-16 7.3.1 Version Description..............................................................................................................................7-16 7.3.2 Function and Feature............................................................................................................................7-16 7.3.3 Working Principle and Signal Flow.....................................................................................................7-17 7.3.4 Front Panel...........................................................................................................................................7-19 7.3.5 Valid Slots............................................................................................................................................7-21 7.3.6 Board Configuration Reference...........................................................................................................7-22 7.3.7 Technical Specifications......................................................................................................................7-22 7.4 EGT2.............................................................................................................................................................7-22 7.4.1 Version Description..............................................................................................................................7-23 7.4.2 Function and Feature............................................................................................................................7-23 7.4.3 Working Principle and Signal Flow.....................................................................................................7-24 7.4.4 Front Panel...........................................................................................................................................7-26 7.4.5 Valid Slots............................................................................................................................................7-28 7.4.6 Board Feature Code..............................................................................................................................7-28 7.4.7 Board Configuration Reference...........................................................................................................7-28 7.4.8 Technical Specifications......................................................................................................................7-28 7.5 EFS0..............................................................................................................................................................7-30 7.5.1 Version Description..............................................................................................................................7-30 7.5.2 Function and Feature............................................................................................................................7-31 7.5.3 Working Principle and Signal Flow.....................................................................................................7-33 7.5.4 Front Panel...........................................................................................................................................7-36 7.5.5 Valid Slots............................................................................................................................................7-37 7.5.6 TPS Protection......................................................................................................................................7-37 7.5.7 Board Configuration Reference...........................................................................................................7-38 7.5.8 Technical Specifications......................................................................................................................7-38 7.6 EFS4..............................................................................................................................................................7-38 7.6.1 Version Description..............................................................................................................................7-39 7.6.2 Function and Feature............................................................................................................................7-39 7.6.3 Working Principle and Signal Flow.....................................................................................................7-41 7.6.4 Front Panel...........................................................................................................................................7-44 7.6.5 Valid Slots............................................................................................................................................7-46 7.6.6 Board Configuration Reference...........................................................................................................7-46 7.6.7 Technical Specifications......................................................................................................................7-46 7.7 EGS2.............................................................................................................................................................7-46 7.7.1 Version Description..............................................................................................................................7-47 viii Huawei Proprietary and Confidential Copyright Huawei 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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

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7.7.2 Function and Feature............................................................................................................................7-47 7.7.3 Working Principle and Signal Flow.....................................................................................................7-50 7.7.4 Front Panel...........................................................................................................................................7-52 7.7.5 Valid Slots............................................................................................................................................7-54 7.7.6 Board Feature Code..............................................................................................................................7-54 7.7.7 Board Configuration Reference...........................................................................................................7-54 7.7.8 Technical Specifications......................................................................................................................7-54 7.8 EMS4.............................................................................................................................................................7-55 7.8.1 Version Description..............................................................................................................................7-56 7.8.2 Function and Feature............................................................................................................................7-56 7.8.3 Working Principle and Signal Flow.....................................................................................................7-59 7.8.4 Front Panel...........................................................................................................................................7-61 7.8.5 Valid Slots............................................................................................................................................7-63 7.8.6 Board Feature Code..............................................................................................................................7-64 7.8.7 Board Protection...................................................................................................................................7-64 7.8.8 Board Configuration Reference...........................................................................................................7-67 7.8.9 Technical Specifications......................................................................................................................7-68 7.9 EGS4.............................................................................................................................................................7-69 7.9.1 Version Description..............................................................................................................................7-69 7.9.2 Function and Feature............................................................................................................................7-70 7.9.3 Working Principle and Signal Flow.....................................................................................................7-72 7.9.4 Front Panel...........................................................................................................................................7-75 7.9.5 Valid Slots............................................................................................................................................7-77 7.9.6 Board Feature Code..............................................................................................................................7-77 7.9.7 Board Protection...................................................................................................................................7-77 7.9.8 Board Configuration Reference...........................................................................................................7-80 7.9.9 Technical Specifications......................................................................................................................7-81 7.10 EGS4A........................................................................................................................................................7-82 7.10.1 Version Description............................................................................................................................7-82 7.10.2 Function and Feature..........................................................................................................................7-82 7.10.3 Working Principle and Signal Flow...................................................................................................7-84 7.10.4 Front Panel.........................................................................................................................................7-87 7.10.5 Valid Slots..........................................................................................................................................7-89 7.10.6 Board Feature Code............................................................................................................................7-89 7.10.7 Board Protection.................................................................................................................................7-89 7.10.8 Board Configuration Reference.........................................................................................................7-91 7.10.9 Technical Specifications....................................................................................................................7-92 7.11 EGR2...........................................................................................................................................................7-93 7.11.1 Version Description............................................................................................................................7-93 7.11.2 Function and Feature..........................................................................................................................7-93 7.11.3 Working Principle and Signal Flow...................................................................................................7-96 7.11.4 Front Panel.........................................................................................................................................7-98 Issue 02 (2007-03-29) Huawei Proprietary and Confidential Copyright Huawei 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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description 7.11.5 Valid Slots........................................................................................................................................7-100 7.11.6 Board Feature Code..........................................................................................................................7-100 7.11.7 Board Configuration Reference.......................................................................................................7-100 7.11.8 Technical Specifications..................................................................................................................7-100

7.12 EMR0........................................................................................................................................................7-101 7.12.1 Version Description..........................................................................................................................7-102 7.12.2 Function and Feature........................................................................................................................7-103 7.12.3 Working Principle and Signal Flow.................................................................................................7-106 7.12.4 Front Panel.......................................................................................................................................7-108 7.12.5 Valid Slots........................................................................................................................................7-111 7.12.6 Board Feature Code..........................................................................................................................7-112 7.12.7 Board Configuration Reference.......................................................................................................7-112 7.12.8 Technical Specifications..................................................................................................................7-112 7.13 ADL4.........................................................................................................................................................7-113 7.13.1 Version Description..........................................................................................................................7-114 7.13.2 Function and Feature........................................................................................................................7-114 7.13.3 Working Principle and Signal Flow.................................................................................................7-115 7.13.4 Front Panel.......................................................................................................................................7-117 7.13.5 Valid Slots........................................................................................................................................7-119 7.13.6 Board Feature Code..........................................................................................................................7-119 7.13.7 Board Configuration Reference.......................................................................................................7-119 7.13.8 Technical Specifications..................................................................................................................7-120 7.14 ADQ1........................................................................................................................................................7-121 7.14.1 Version Description..........................................................................................................................7-121 7.14.2 Function and Feature........................................................................................................................7-121 7.14.3 Working Principle and Signal Flow.................................................................................................7-122 7.14.4 Front Panel.......................................................................................................................................7-124 7.14.5 Valid Slots........................................................................................................................................7-126 7.14.6 Board Feature Code..........................................................................................................................7-126 7.14.7 Board Configuration Reference.......................................................................................................7-126 7.14.8 Technical Specifications..................................................................................................................7-127 7.15 IDL4..........................................................................................................................................................7-128 7.15.1 Version Description..........................................................................................................................7-128 7.15.2 Function and Feature........................................................................................................................7-128 7.15.3 Working Principle ...........................................................................................................................7-130 7.15.4 Front Panel.......................................................................................................................................7-132 7.15.5 Valid Slots........................................................................................................................................7-134 7.15.6 Board Feature Code..........................................................................................................................7-134 7.15.7 Board Protection...............................................................................................................................7-134 7.15.8 Board Configuration Reference.......................................................................................................7-134 7.15.9 Technical Specifications..................................................................................................................7-135 7.16 IDQ1..........................................................................................................................................................7-136 x Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd Issue 02 (2007-03-29)

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

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7.16.1 Version Description..........................................................................................................................7-136 7.16.2 Function and Feature........................................................................................................................7-136 7.16.3 Working Principle and Signal Flow.................................................................................................7-138 7.16.4 Front Panel.......................................................................................................................................7-140 7.16.5 Valid Slots........................................................................................................................................7-142 7.16.6 Board Feature Code..........................................................................................................................7-142 7.16.7 Board Protection...............................................................................................................................7-142 7.16.8 Board Configuration Reference.......................................................................................................7-142 7.16.9 Technical Specifications..................................................................................................................7-143 7.17 MST4.........................................................................................................................................................7-144 7.17.1 Version Description..........................................................................................................................7-144 7.17.2 Function and Feature........................................................................................................................7-144 7.17.3 Working Principle and Signal Flow.................................................................................................7-146 7.17.4 Front Panel.......................................................................................................................................7-148 7.17.5 Valid Slots........................................................................................................................................7-149 7.17.6 Board Feature Code..........................................................................................................................7-149 7.17.7 Board Configuration Reference.......................................................................................................7-150 7.17.8 Technical Specifications..................................................................................................................7-150

8 Interface Boards and Switching Boards.................................................................................8-1

8.1 L12S................................................................................................................................................................8-3 8.1.1 Version Description................................................................................................................................8-3 8.1.2 Function and Feature..............................................................................................................................8-3 8.1.3 Working Principle and Signal Flow.......................................................................................................8-3 8.1.4 Front Panel............................................................................................................................................. 8-4 8.1.5 Valid Slots..............................................................................................................................................8-5 8.1.6 Technical Specifications........................................................................................................................ 8-5 8.2 D12B............................................................................................................................................................... 8-5 8.2.1 Version Description................................................................................................................................8-6 8.2.2 Function and Feature..............................................................................................................................8-6 8.2.3 Working Principle and Signal Flow.......................................................................................................8-6 8.2.4 Front Panel............................................................................................................................................. 8-6 8.2.5 Valid Slots..............................................................................................................................................8-8 8.2.6 Technical Specifications........................................................................................................................ 8-9 8.3 D12S................................................................................................................................................................8-9 8.3.1 Version Description................................................................................................................................8-9 8.3.2 Function and Feature..............................................................................................................................8-9 8.3.3 Working Principle and Signal Flow.......................................................................................................8-9 8.3.4 Front Panel...........................................................................................................................................8-10 8.3.5 Valid Slots............................................................................................................................................8-12 8.3.6 Technical Specifications......................................................................................................................8-13 8.4 L75S..............................................................................................................................................................8-13 8.4.1 Version Description..............................................................................................................................8-13 Issue 02 (2007-03-29) Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd xi

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description 8.4.2 Function and Feature............................................................................................................................8-13 8.4.3 Working Principle and Signal Flow.....................................................................................................8-14 8.4.4 Front Panel...........................................................................................................................................8-14 8.4.5 Valid Slots............................................................................................................................................8-15 8.4.6 Technical Specifications......................................................................................................................8-15

8.5 D75S..............................................................................................................................................................8-16 8.5.1 Version Description..............................................................................................................................8-16 8.5.2 Function and Feature............................................................................................................................8-16 8.5.3 Working Principle and Signal Flow.....................................................................................................8-16 8.5.4 Front Panel...........................................................................................................................................8-17 8.5.5 Valid Slots............................................................................................................................................8-19 8.5.6 Technical Specifications......................................................................................................................8-20 8.6 D34S..............................................................................................................................................................8-20 8.6.1 Version Description..............................................................................................................................8-20 8.6.2 Function and Feature............................................................................................................................8-20 8.6.3 Working Principle and Signal Flow.....................................................................................................8-20 8.6.4 Front Panel...........................................................................................................................................8-21 8.6.5 Valid Slots............................................................................................................................................8-22 8.6.6 Technical Specifications......................................................................................................................8-22 8.7 C34S..............................................................................................................................................................8-23 8.7.1 Version Description..............................................................................................................................8-24 8.7.2 Function and Feature............................................................................................................................8-24 8.7.3 Working Principle and Signal Flow.....................................................................................................8-24 8.7.4 Front Panel...........................................................................................................................................8-25 8.7.5 Valid Slots............................................................................................................................................8-26 8.7.6 Technical Specifications......................................................................................................................8-26 8.8 EU04..............................................................................................................................................................8-27 8.8.1 Version Description..............................................................................................................................8-27 8.8.2 Function and Feature............................................................................................................................8-27 8.8.3 Working Principle and Signal Flow.....................................................................................................8-27 8.8.4 Front Panel...........................................................................................................................................8-28 8.8.5 Valid Slots............................................................................................................................................8-29 8.8.6 Technical Specifications......................................................................................................................8-30 8.9 EU08..............................................................................................................................................................8-30 8.9.1 Version Description..............................................................................................................................8-31 8.9.2 Function and Feature............................................................................................................................8-31 8.9.3 Working Principle and Signal Flow.....................................................................................................8-31 8.9.4 Front Panel...........................................................................................................................................8-32 8.9.5 Valid Slots............................................................................................................................................8-33 8.9.6 Technical Specifications......................................................................................................................8-33 8.10 OU08 ..........................................................................................................................................................8-34 8.10.1 Version 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8.10.2 Function and Feature..........................................................................................................................8-35 8.10.3 Working Principle and Signal Flow...................................................................................................8-35 8.10.4 Front Panel.........................................................................................................................................8-36 8.10.5 Valid Slots..........................................................................................................................................8-38 8.10.6 Technical Specifications....................................................................................................................8-38 8.11 MU04..........................................................................................................................................................8-39 8.11.1 Version Description............................................................................................................................8-39 8.11.2 Function and Feature..........................................................................................................................8-39 8.11.3 Working Principle and Signal Flow...................................................................................................8-40 8.11.4 Front Panel.........................................................................................................................................8-40 8.11.5 Valid Slots..........................................................................................................................................8-41 8.11.6 Technical Specifications....................................................................................................................8-42 8.12 TSB4............................................................................................................................................................8-42 8.12.1 Version Description............................................................................................................................8-43 8.12.2 Function and Feature..........................................................................................................................8-43 8.12.3 Working Principle and Signal Flow...................................................................................................8-43 8.12.4 Front Panel.........................................................................................................................................8-44 8.12.5 Valid Slots..........................................................................................................................................8-45 8.12.6 Technical Specifications....................................................................................................................8-45 8.13 TSB8............................................................................................................................................................8-46 8.13.1 Version Description............................................................................................................................8-46 8.13.2 Function and Feature..........................................................................................................................8-46 8.13.3 Working Principle and Signal Flow...................................................................................................8-46 8.13.4 Front Panel.........................................................................................................................................8-47 8.13.5 Valid Slots..........................................................................................................................................8-48 8.13.6 Technical Specifications....................................................................................................................8-50 8.14 EFF8............................................................................................................................................................8-50 8.14.1 Version Description............................................................................................................................8-51 8.14.2 Function and Feature..........................................................................................................................8-51 8.14.3 Working Principle and Signal Flow...................................................................................................8-51 8.14.4 Front Panel.........................................................................................................................................8-52 8.14.5 Valid Slots..........................................................................................................................................8-53 8.14.6 Technical Specifications....................................................................................................................8-54 8.15 ETF8............................................................................................................................................................8-55 8.15.1 Version Description............................................................................................................................8-55 8.15.2 Function and Feature..........................................................................................................................8-55 8.15.3 Working Principle and Signal Flow...................................................................................................8-56 8.15.4 Front Panel.........................................................................................................................................8-56 8.15.5 Valid Slots..........................................................................................................................................8-58 8.15.6 Technical Specifications....................................................................................................................8-59 8.16 ETS8............................................................................................................................................................8-60 8.16.1 Version Description............................................................................................................................8-60 Issue 02 (2007-03-29) Huawei Proprietary and Confidential Copyright Huawei Technologies Co., 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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description 8.16.2 Function and Feature..........................................................................................................................8-60 8.16.3 Working Principle and Signal Flow...................................................................................................8-60 8.16.4 Front Panel......................................................................................................................................... 8-61 8.16.5 Valid Slots..........................................................................................................................................8-63 8.16.6 Technical Specifications.................................................................................................................... 8-63

8.17 DM12.......................................................................................................................................................... 8-64 8.17.1 Version Description............................................................................................................................8-64 8.17.2 Function and Feature..........................................................................................................................8-64 8.17.3 Working Principle and Signal Flow...................................................................................................8-65 8.17.4 Front Panel......................................................................................................................................... 8-65 8.17.5 Valid Slots..........................................................................................................................................8-68 8.17.6 Technical Specifications.................................................................................................................... 8-68

9 Cross-Connect and System Control Boards..........................................................................9-1

9.1 CXL1...............................................................................................................................................................9-3 9.1.1 Version Description................................................................................................................................9-3 9.1.2 Function and Feature..............................................................................................................................9-4 9.1.3 Working Principle and Signal Flow.......................................................................................................9-7 9.1.4 Jumper and DIP Switch........................................................................................................................9-12 9.1.5 Front Panel........................................................................................................................................... 9-14 9.1.6 Valid Slots............................................................................................................................................9-18 9.1.7 Board Feature Code..............................................................................................................................9-18 9.1.8 Board Configuration Reference........................................................................................................... 9-18 9.1.9 Technical Specifications...................................................................................................................... 9-19 9.2 CXL4.............................................................................................................................................................9-20 9.2.1 Version Description..............................................................................................................................9-21 9.2.2 Function and Feature............................................................................................................................9-22 9.2.3 Working Principle and Signal Flow.....................................................................................................9-25 9.2.4 Jumper and DIP Switch........................................................................................................................9-30 9.2.5 Front Panel........................................................................................................................................... 9-32 9.2.6 Valid Slots............................................................................................................................................9-36 9.2.7 Board Feature Code..............................................................................................................................9-36 9.2.8 Board Configuration Reference........................................................................................................... 9-36 9.2.9 Technical Specifications...................................................................................................................... 9-37 9.3 CXL16...........................................................................................................................................................9-38 9.3.1 Version Description..............................................................................................................................9-39 9.3.2 Function and Feature............................................................................................................................9-40 9.3.3 Working Principle and Signal Flow.....................................................................................................9-43 9.3.4 Jumper and DIP Switch........................................................................................................................9-48 9.3.5 Front Panel........................................................................................................................................... 9-50 9.3.6 Valid Slots............................................................................................................................................9-54 9.3.7 Board Feature Code..............................................................................................................................9-54 9.3.8 Board Configuration Reference........................................................................................................... 9-54 xiv Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd Issue 02 (2007-03-29)

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9.3.9 Technical Specifications......................................................................................................................9-55 9.4 CXLL1..........................................................................................................................................................9-56 9.4.1 Version Description..............................................................................................................................9-57 9.4.2 Function and Feature............................................................................................................................9-57 9.4.3 Working Principle and Signal Flow.....................................................................................................9-60 9.4.4 Jumper and DIP Switch........................................................................................................................9-65 9.4.5 Front Panel...........................................................................................................................................9-66 9.4.6 Valid Slots............................................................................................................................................9-68 9.4.7 Board Feature Code..............................................................................................................................9-68 9.4.8 Board Configuration Reference...........................................................................................................9-69 9.4.9 Technical Specifications......................................................................................................................9-69 9.5 CXLL4..........................................................................................................................................................9-71 9.5.1 Version Description..............................................................................................................................9-71 9.5.2 Function and Feature............................................................................................................................9-71 9.5.3 Working Principle and Signal Flow.....................................................................................................9-74 9.5.4 Jumper and DIP Switch........................................................................................................................9-79 9.5.5 Front Panel...........................................................................................................................................9-80 9.5.6 Valid Slots............................................................................................................................................9-82 9.5.7 Board Feature Code..............................................................................................................................9-82 9.5.8 Board Configuration Reference...........................................................................................................9-83 9.5.9 Technical Specifications......................................................................................................................9-83 9.6 CXLL16........................................................................................................................................................9-85 9.6.1 Version Description..............................................................................................................................9-85 9.6.2 Function and Feature............................................................................................................................9-85 9.6.3 Working Principle and Signal Flow.....................................................................................................9-88 9.6.4 Jumper and DIP Switch........................................................................................................................9-93 9.6.5 Front Panel...........................................................................................................................................9-94 9.6.6 Valid Slots............................................................................................................................................9-96 9.6.7 Board Feature Code..............................................................................................................................9-96 9.6.8 Board Configuration Reference...........................................................................................................9-97 9.6.9 Technical Specifications......................................................................................................................9-97 9.7 CXLD1..........................................................................................................................................................9-99 9.7.1 Version Description..............................................................................................................................9-99 9.7.2 Function and Feature............................................................................................................................9-99 9.7.3 Working Principle and Signal Flow...................................................................................................9-102 9.7.4 Jumper and DIP Switch......................................................................................................................9-107 9.7.5 Front Panel.........................................................................................................................................9-108 9.7.6 Valid Slots..........................................................................................................................................9-110 9.7.7 Board Feature Code............................................................................................................................9-110 9.7.8 Board Configuration Reference.........................................................................................................9-111 9.7.9 Technical Specifications....................................................................................................................9-111 9.8 CXLD4........................................................................................................................................................9-113 Issue 02 (2007-03-29) Huawei Proprietary and Confidential Copyright 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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description 9.8.1 Version Description............................................................................................................................9-113 9.8.2 Function and Feature..........................................................................................................................9-113 9.8.3 Working Principle and Signal Flow...................................................................................................9-116 9.8.4 Jumper and DIP Switch......................................................................................................................9-121 9.8.5 Front Panel.........................................................................................................................................9-122 9.8.6 Valid Slots..........................................................................................................................................9-124 9.8.7 Board Feature Code............................................................................................................................9-124 9.8.8 Board Configuration Reference.........................................................................................................9-125 9.8.9 Technical Specifications....................................................................................................................9-125

9.9 CXLQ1........................................................................................................................................................9-127 9.9.1 Version Description............................................................................................................................9-127 9.9.2 Function and Feature..........................................................................................................................9-127 9.9.3 Working Principle and Signal Flow...................................................................................................9-130 9.9.4 Jumper and DIP Switch......................................................................................................................9-135 9.9.5 Front Panel.........................................................................................................................................9-136 9.9.6 Valid Slots..........................................................................................................................................9-138 9.9.7 Board Feature Code............................................................................................................................9-138 9.9.8 Board Configuration Reference.........................................................................................................9-139 9.9.9 Technical Specifications....................................................................................................................9-139 9.10 CXLQ4......................................................................................................................................................9-141 9.10.1 Version Description..........................................................................................................................9-141 9.10.2 Function and Feature........................................................................................................................9-141 9.10.3 Working Principle and Signal Flow.................................................................................................9-144 9.10.4 Jumper and DIP Switch....................................................................................................................9-149 9.10.5 Front Panel.......................................................................................................................................9-150 9.10.6 Valid Slots........................................................................................................................................9-152 9.10.7 Board Feature Code..........................................................................................................................9-152 9.10.8 Board Configuration Reference.......................................................................................................9-153 9.10.9 Technical Specifications..................................................................................................................9-153

10 Auxiliary Boards.....................................................................................................................10-1
10.1 EOW............................................................................................................................................................10-2 10.1.1 Version Description............................................................................................................................10-2 10.1.2 Function and Feature..........................................................................................................................10-2 10.1.3 Working Principle and Signal Flow...................................................................................................10-3 10.1.4 Front Panel......................................................................................................................................... 10-4 10.1.5 Valid Slots..........................................................................................................................................10-6 10.1.6 Technical Specifications.................................................................................................................... 10-6 10.2 AUX............................................................................................................................................................10-6 10.2.1 Version Description............................................................................................................................10-6 10.2.2 Function and Feature..........................................................................................................................10-7 10.2.3 Working Principle and Signal Flow...................................................................................................10-7 10.2.4 Front Panel.......................................................................................................................................10-11 xvi Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd Issue 02 (2007-03-29)

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10.2.5 Valid Slots........................................................................................................................................10-14 10.2.6 Technical Specifications..................................................................................................................10-14 10.3 AMU..........................................................................................................................................................10-14 10.3.1 Version Description..........................................................................................................................10-15 10.3.2 Function and Feature........................................................................................................................10-15 10.3.3 Working Principle and Signal Flow.................................................................................................10-15 10.3.4 Front Panel.......................................................................................................................................10-17 10.3.5 Valid Slots........................................................................................................................................10-20 10.3.6 Technical Specifications..................................................................................................................10-20 10.4 FAN...........................................................................................................................................................10-20 10.4.1 Version Description..........................................................................................................................10-20 10.4.2 Function and Feature........................................................................................................................10-20 10.4.3 Working Principle and Signal Flow.................................................................................................10-21 10.4.4 Front Panel.......................................................................................................................................10-21 10.4.5 Valid Slots........................................................................................................................................10-22 10.4.6 Technical Specifications..................................................................................................................10-22

11 WDM Processing Boards......................................................................................................11-1

11.1 CMR2..........................................................................................................................................................11-3 11.1.1 Version Description............................................................................................................................11-3 11.1.2 Function and Feature..........................................................................................................................11-3 11.1.3 Working Principle and Signal Flow...................................................................................................11-4 11.1.4 Front Panel.........................................................................................................................................11-5 11.1.5 Valid Slots..........................................................................................................................................11-7 11.1.6 Board Feature Code............................................................................................................................11-7 11.1.7 Technical Specifications....................................................................................................................11-8 11.2 CMR4..........................................................................................................................................................11-9 11.2.1 Version Description............................................................................................................................11-9 11.2.2 Function and Feature..........................................................................................................................11-9 11.2.3 Working Principle and Signal Flow.................................................................................................11-10 11.2.4 Front Panel.......................................................................................................................................11-11 11.2.5 Valid Slots........................................................................................................................................11-13 11.2.6 Board Feature Code..........................................................................................................................11-13 11.2.7 Technical Specifications..................................................................................................................11-14 11.3 MR2...........................................................................................................................................................11-15 11.3.1 Version Description..........................................................................................................................11-16 11.3.2 Function and Feature........................................................................................................................11-16 11.3.3 Working Principle and Signal Flow.................................................................................................11-16 11.3.4 Front Panel.......................................................................................................................................11-17 11.3.5 Valid Slots........................................................................................................................................11-19 11.3.6 Board Feature Code..........................................................................................................................11-19 11.3.7 Technical Specifications..................................................................................................................11-20 11.4 MR2A........................................................................................................................................................11-21 Issue 02 (2007-03-29) Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd xvii

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description 11.4.1 Version Description..........................................................................................................................11-21 11.4.2 Function and Feature........................................................................................................................11-21 11.4.3 Working Principle and Signal Flow.................................................................................................11-23 11.4.4 Front Panel.......................................................................................................................................11-24 11.4.5 Valid Slots........................................................................................................................................11-25 11.4.6 Technical Specifications..................................................................................................................11-25

11.5 MR2B........................................................................................................................................................11-26 11.5.1 Version Description..........................................................................................................................11-27 11.5.2 Function and Feature........................................................................................................................11-27 11.5.3 Working Principle and Signal Flow.................................................................................................11-28 11.5.4 Front Panel.......................................................................................................................................11-29 11.5.5 Valid Slots........................................................................................................................................11-30 11.5.6 Technical Specifications..................................................................................................................11-30 11.6 MR2C........................................................................................................................................................11-31 11.6.1 Version Description..........................................................................................................................11-32 11.6.2 Function and Feature........................................................................................................................11-32 11.6.3 Working Principle and Signal Flow.................................................................................................11-33 11.6.4 Front Panel.......................................................................................................................................11-34 11.6.5 Valid Slots........................................................................................................................................11-36 11.6.6 Technical Specifications..................................................................................................................11-36 11.7 MR4...........................................................................................................................................................11-37 11.7.1 Version Description..........................................................................................................................11-37 11.7.2 Function and Feature........................................................................................................................11-37 11.7.3 Working Principle and Signal Flow.................................................................................................11-38 11.7.4 Front Panel.......................................................................................................................................11-39 11.7.5 Valid Slots........................................................................................................................................11-40 11.7.6 Board Feature Code..........................................................................................................................11-40 11.7.7 Technical Specifications..................................................................................................................11-41 11.8 LWX..........................................................................................................................................................11-42 11.8.1 Version Description..........................................................................................................................11-43 11.8.2 Function and Feature........................................................................................................................11-43 11.8.3 Working Principle and Signal Flow.................................................................................................11-44 11.8.4 Front Panel.......................................................................................................................................11-46 11.8.5 Valid Slots........................................................................................................................................11-48 11.8.6 Board Feature Code..........................................................................................................................11-48 11.8.7 Technical Specifications..................................................................................................................11-48 11.9 OBU1........................................................................................................................................................11-51 11.9.1 Version Description..........................................................................................................................11-52 11.9.2 Function and Feature........................................................................................................................11-52 11.9.3 Working Principle and Signal Flow.................................................................................................11-53 11.9.4 Front Panel.......................................................................................................................................11-54 11.9.5 Valid Slots........................................................................................................................................11-56 xviii Huawei Proprietary and Confidential Copyright Huawei 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11.9.6 Board Feature Code..........................................................................................................................11-56 11.9.7 Technical Specifications..................................................................................................................11-56 11.10 FIB...........................................................................................................................................................11-58 11.10.1 Version Description........................................................................................................................11-58 11.10.2 Function and Feature......................................................................................................................11-58 11.10.3 Working Principle and Signal Flow...............................................................................................11-59 11.10.4 Front Panel.....................................................................................................................................11-59 11.10.5 Valid Slots......................................................................................................................................11-60 11.10.6 Technical Specifications................................................................................................................11-61

12 Optical Amplifier Boards and Dispersion Compensation Boards...............................12-1

12.1 BA2............................................................................................................................................................. 12-2 12.1.1 Version Description............................................................................................................................12-2 12.1.2 Function and Feature..........................................................................................................................12-2 12.1.3 Working Principle and Signal Flow...................................................................................................12-3 12.1.4 Front Panel......................................................................................................................................... 12-5 12.1.5 Valid Slots..........................................................................................................................................12-8 12.1.6 Board Feature Code............................................................................................................................12-8 12.1.7 Technical Specifications.................................................................................................................... 12-9 12.2 BPA...........................................................................................................................................................12-10 12.2.1 Version Description..........................................................................................................................12-10 12.2.2 Function and Feature........................................................................................................................12-11 12.2.3 Working Principle and Signal Flow.................................................................................................12-12 12.2.4 Front Panel.......................................................................................................................................12-13 12.2.5 Valid Slots........................................................................................................................................12-15 12.2.6 Board Feature Code..........................................................................................................................12-15 12.2.7 Technical Specifications..................................................................................................................12-15 12.3 COA..........................................................................................................................................................12-16 12.3.1 Version Description..........................................................................................................................12-17 12.3.2 Function and Feature........................................................................................................................12-17 12.3.3 Working Principle and Signal Flow.................................................................................................12-20 12.3.4 Front Panel.......................................................................................................................................12-22 12.3.5 Installation Position..........................................................................................................................12-26 12.3.6 Board Feature Code..........................................................................................................................12-27 12.3.7 Technical Specifications..................................................................................................................12-27

13 Power Interface Boards.........................................................................................................13-1

13.1 UPM............................................................................................................................................................13-2 13.1.1 Version Description............................................................................................................................13-2 13.1.2 Function and Feature..........................................................................................................................13-2 13.1.3 Working Principle and Signal Flow...................................................................................................13-3 13.1.4 Rear Panel.......................................................................................................................................... 13-4 13.1.5 Valid Slots..........................................................................................................................................13-6 13.1.6 Technical Specifications.................................................................................................................... 13-6 Issue 02 (2007-03-29) Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd xix

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

13.2 PIU..............................................................................................................................................................13-7 13.2.1 Version Description............................................................................................................................13-8 13.2.2 Function and Feature..........................................................................................................................13-8 13.2.3 Working Principle and Signal Flow...................................................................................................13-8 13.2.4 Front Panel.........................................................................................................................................13-9 13.2.5 Valid Slots........................................................................................................................................13-10 13.2.6 Technical Specifications..................................................................................................................13-10 13.3 PIUA..........................................................................................................................................................13-11 13.3.1 Version Description..........................................................................................................................13-11 13.3.2 Function and Feature........................................................................................................................13-12 13.3.3 Working Principle and Signal Flow.................................................................................................13-12 13.3.4 Front Panel.......................................................................................................................................13-13 13.3.5 Valid Slots........................................................................................................................................13-14 13.3.6 Technical Specifications..................................................................................................................13-14

14 Cables.......................................................................................................................................14-1
14.1 Fiber Jumper................................................................................................................................................14-2 14.1.1 Types of Fiber Jumpers......................................................................................................................14-2 14.1.2 Connector...........................................................................................................................................14-3 14.2 Power Cables and Grounding Cables..........................................................................................................14-5 14.2.1 Cabinet 48 V/BGND/PGND Power Cable.......................................................................................14-5 14.2.2 Equipment 48 V/60 V Power Cable/PGND Grounding Cable......................................................14-7 14.2.3 UPM Power Cable..............................................................................................................................14-9 14.3 Alarm Cable..............................................................................................................................................14-10 14.3.1 Alarm Input/Output Cable................................................................................................................14-10 14.4 Management Cable....................................................................................................................................14-12 14.4.1 OAM Serial Port Cable....................................................................................................................14-13 14.4.2 Serial 14/F1/F&f Serial Port Cable................................................................................................14-14 14.4.3 RS232/RS422 Serial Port Cable.......................................................................................................14-15 14.4.4 Ordinary Telephone Wire.................................................................................................................14-17 14.4.5 COA Concatenating Cable...............................................................................................................14-18 14.4.6 Straight Through Cable....................................................................................................................14-19 14.4.7 Crossover Cable...............................................................................................................................14-20 14.5 Signal Cable..............................................................................................................................................14-21 14.5.1 75-ohm 8 x E1 Cable........................................................................................................................14-22 14.5.2 75-ohm 16 x E1 Cable......................................................................................................................14-24 14.5.3 120-ohm 8 x E1 Cable......................................................................................................................14-26 14.5.4 120-ohm 16 x E1 Cable....................................................................................................................14-28 14.5.5 E3/T3/STM-1 Cable.........................................................................................................................14-31 14.5.6 Framed E1 Cable..............................................................................................................................14-32 14.5.7 N x 64 kbit/s Cables.........................................................................................................................14-32 14.6 Clock Cable...............................................................................................................................................14-49 14.6.1 Clock Cable......................................................................................................................................14-49 xx Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd Issue 02 (2007-03-29)

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14.6.2 One-Channel and Two-Channel Clock Transfer Cables..................................................................14-51

A Equipment and Board Alarm Indicators.............................................................................A-1

A.1 Indicators on the Cabinet...............................................................................................................................A-2 A.2 Board Alarm Indicator...................................................................................................................................A-2

B Labels..........................................................................................................................................B-1
B.1 Safety Label...................................................................................................................................................B-2 B.1.1 Label Description..................................................................................................................................B-2 B.1.2 Label Position.......................................................................................................................................B-3 B.2 Optical Module Labels...................................................................................................................................B-5 B.3 Engineering Labels........................................................................................................................................B-7

C Power Consumption and Weight of Boards........................................................................C-1 D Board Version Configuration................................................................................................D-1 E Board Loopbacks.......................................................................................................................E-1 F Board Configuration Reference..............................................................................................F-1
F.1 SDH Processing Boards..................................................................................................................................F-2 F.2 PDH Processing Board...................................................................................................................................F-2 F.3 Data Processing Board....................................................................................................................................F-4 F.3.1 SDH Parameters.....................................................................................................................................F-5 F.3.2 Ethernet Parameters...............................................................................................................................F-6 F.3.3 ATM Parameter.....................................................................................................................................F-7 F.4 Cross-Connect and Timing Unit.....................................................................................................................F-8

G Glossary.....................................................................................................................................G-1 H Acronyms and Abbreviations...............................................................................................H-1 Index.................................................................................................................................................i-1

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Figures

Figures
Figure 1-1 Appearance of the OptiX OSN 1500A...............................................................................................1-1 Figure 1-2 Appearance of the OptiX OSN 1500B...............................................................................................1-1 Figure 2-1 ETSI cabinet.......................................................................................................................................2-2 Figure 2-2 Appearance of the DC PDU...............................................................................................................2-4 Figure 3-1 Structure of the OptiX OSN 1500A subrack......................................................................................3-2 Figure 3-2 Structure of the OptiX OSN 1500B subrack......................................................................................3-3 Figure 3-3 Slot access capacity of the OptiX OSN 1500A..................................................................................3-4 Figure 3-4 Slot access capacity of the OptiX OSN 1500B..................................................................................3-4 Figure 3-5 Slot layout of the OptiX OSN 1500A subrack...................................................................................3-5 Figure 3-6 Slot layout of the OptiX OSN 1500A subrack after the division of slots..........................................3-5 Figure 3-7 Slot layout of the OptiX OSN 1500B subrack.................................................................................3-13 Figure 3-8 Slot layout of the OptiX OSN 1500B subrack (after the division of slots)......................................3-13 Figure 4-1 Barcode of a board..............................................................................................................................4-3 Figure 5-1 Block diagram for the working principle of the SL1..........................................................................5-5 Figure 5-2 Front panel of the N1SL1/N2SL1......................................................................................................5-7 Figure 5-3 Front panel of the R1SL1...................................................................................................................5-8 Figure 5-4 Block diagram for the working principle of the SL1A.....................................................................5-13 Figure 5-5 Front panel of the SL1A...................................................................................................................5-14 Figure 5-6 Block diagram for the working principle of the SLQ1.....................................................................5-19 Figure 5-7 Front panel of the N1SLQ1/N2SLQ1...............................................................................................5-21 Figure 5-8 Front panel of the R1SLQ1..............................................................................................................5-22 Figure 5-9 Block diagram for the working principle of the SLQ1A board........................................................5-27 Figure 5-10 Front panel of the SLQ1A board....................................................................................................5-29 Figure 5-11 Block diagram for the working principle of the SLO1...................................................................5-34 Figure 5-12 Front panel of the SLO1.................................................................................................................5-36 Figure 5-13 Block diagram for the working principle of the SLT1...................................................................5-41 Figure 5-14 Front panel of the SLT1..................................................................................................................5-43 Figure 5-15 Block diagram for the working principle of the SEP1...................................................................5-48 Figure 5-16 Block diagram for the working principle of the SEP used with the EU08.....................................5-48 Figure 5-17 Block diagram for the working principle of the SEP used with the OU08....................................5-49 Figure 5-18 Front panel of the SEP1..................................................................................................................5-51 Figure 5-19 Principle of the TPS protection for the SEP1 ................................................................................5-52 Figure 5-20 Slot configuration for the 1:1 TPS protection for the SEP1...........................................................5-53 Issue 02 (2007-03-29) Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd xxiii

Figures

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Figure 5-21 Block diagram for the working principle of the SL4......................................................................5-57 Figure 5-22 Front panel of the N1SL4/N2SL4..................................................................................................5-59 Figure 5-23 Front panel of the R1SL4...............................................................................................................5-59 Figure 5-24 Block diagram for the working principle of the SL4A...................................................................5-64 Figure 5-25 Front panel of the SL4A board.......................................................................................................5-66 Figure 5-26 Block diagram for the working principle of the SLD4...................................................................5-71 Figure 5-27 Front panel of the N1SLD4/N2SLD4.............................................................................................5-73 Figure 5-28 Front panel of the R1SLD4............................................................................................................5-74 Figure 5-29 Block diagram for the working principle of the SL4A board.........................................................5-79 Figure 5-30 Front panel of the SLD4A board....................................................................................................5-80 Figure 5-31 Block diagram for the working principle of the SLQ4...................................................................5-85 Figure 5-32 Front panel of the SLQ4.................................................................................................................5-87 Figure 5-33 Block diagram for the working principle of the SLQ4A................................................................5-92 Figure 5-34 Front panel of the SLQ4A board....................................................................................................5-93 Figure 5-35 Block diagram for the working principle of the SL16....................................................................5-99 Figure 5-36 Front panel of the SL16................................................................................................................5-101 Figure 5-37 Block diagram for the working principle of the N1SL16A and N2SL16A..................................5-107 Figure 5-38 Block diagram for the working principle of the N3SL16A..........................................................5-107 Figure 5-39 Front panel of the SL16A.............................................................................................................5-109 Figure 5-40 Block diagram for the working principle of the SF16..................................................................5-114 Figure 5-41 Front panel of the SF16................................................................................................................5-117 Figure 6-1 Block diagram for the functions of the PL1.......................................................................................6-4 Figure 6-2 Block diagram of the E1 mapping/demapping...................................................................................6-5 Figure 6-3 Front panel of the PL1........................................................................................................................6-6 Figure 6-4 Block diagram for the functions of the PD1.....................................................................................6-11 Figure 6-5 Block diagram of the E1 mapping/ demapping ...............................................................................6-11 Figure 6-6 Front panel of the PD1......................................................................................................................6-13 Figure 6-7 Principle of the TPS protection for the PD1 in the OptiX OSN 1500A subrack..............................6-15 Figure 6-8 Principle of the TPS protection for the PD1 in the OptiX OSN 1500B subrack..............................6-16 Figure 6-9 Slot configuration for the 1:1 TPS protection for the PD1 in the OptiX OSN 1500A subrack........6-16 Figure 6-10 Block diagram for the functions of the PQ1...................................................................................6-20 Figure 6-11 Block diagram of the E1/T1 mapping/ demapping ........................................................................6-21 Figure 6-12 Front panel of the PQ1....................................................................................................................6-23 Figure 6-13 Principle of the TPS protection for the PQ1 in the OptiX OSN 1500B subrack............................6-25 Figure 6-14 Slot configuration for 1:2 TPS protection of the PQ1....................................................................6-26 Figure 6-15 Block diagram for the functions of the PQM.................................................................................6-29 Figure 6-16 Block diagram of the E1/T1 mapping/ demapping ........................................................................6-29 Figure 6-17 Front panel of the PQM..................................................................................................................6-31 Figure 6-18 Principle of the TPS protection for the PQM in the OptiX OSN 1500B subrack..........................6-33 Figure 6-19 Slot configuration for the 1:2 TPS protection for the PQM in the OptiX OSN 1500B subrack .............................................................................................................................................................................6-34 Figure 6-20 Block diagram for the functions of the PL3...................................................................................6-37 Figure 6-21 Block diagram of the E3/T3 mapping/demapping .........................................................................6-37 xxiv Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd Issue 02 (2007-03-29)

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Figures

Figure 6-22 Front panel of the PL3....................................................................................................................6-39 Figure 6-23 Principle of the TPS protection for the PL3 in the OptiX OSN 1500B subrack............................6-41 Figure 6-24 Slot configuration for the 1:1 TPS protection for the PL3 in the OptiX OSN 1500B subrack......6-42 Figure 6-25 Block diagram for the functions of the PL3A................................................................................6-45 Figure 6-26 Block diagram of the E3/T3 mapping/demapping .........................................................................6-46 Figure 6-27 Front panel of the PL3A.................................................................................................................6-48 Figure 6-28 Block diagram for the functions of the PD3...................................................................................6-52 Figure 6-29 Block diagram of the E3/T3 mapping/demapping .........................................................................6-52 Figure 6-30 Front panel of the PD3....................................................................................................................6-54 Figure 6-31 Principle of the TPS protection for the PD3 in the OptiX OSN 1500B subrack............................6-55 Figure 6-32 Slot configuration for the 1:1 TPS protection for the PD3 in the OptiX OSN 1500B subrack .............................................................................................................................................................................6-56 Figure 6-33 Block diagram for the functions of the PQ3...................................................................................6-59 Figure 6-34 Block diagram of the E3/T3 mapping/demapping .........................................................................6-60 Figure 6-35 Front panel of the PQ3....................................................................................................................6-62 Figure 6-36 Principle of the TPS protection for the PQ3 in the OptiX OSN 1500B subrack............................6-63 Figure 6-37 Slot configuration for the 1:1 TPS protection for the PQ3 in the OptiX OSN 1500B subrack .............................................................................................................................................................................6-64 Figure 6-38 Block diagram for the functions of the DX1..................................................................................6-67 Figure 6-39 Front panel of the DX1...................................................................................................................6-68 Figure 6-40 Principle of the TPS protection for the DX1 in the OptiX OSN 1500B subrack...........................6-70 Figure 6-41 Slot configuration for the 1:2 TPS protection for the DX1 in the OptiX OSN 1500B subrack .............................................................................................................................................................................6-71 Figure 6-42 Block diagram for the functions of the DXA.................................................................................6-73 Figure 6-43 Front panel of the DXA..................................................................................................................6-75 Figure 6-44 Block diagram for the functions of the SPQ4.................................................................................6-79 Figure 6-45 Block diagram of the 140M mapping/demapping .........................................................................6-79 Figure 6-46 Block diagram of the SDH overhead processing module...............................................................6-80 Figure 6-47 Front panel of the SPQ4.................................................................................................................6-83 Figure 6-48 Principle of the TPS protection for the SPQ4 in the OptiX OSN 1500B subrack.........................6-84 Figure 6-49 Slot configuration for the 1:1 TPS protection for the SPQ4...........................................................6-85 Figure 7-1 Block diagram for the functions of the EFT4.....................................................................................7-5 Figure 7-2 Front panel of the EFT4......................................................................................................................7-7 Figure 7-3 Block diagram for the functions of the EFT8...................................................................................7-11 Figure 7-4 Front panel of the EFT8....................................................................................................................7-13 Figure 7-5 Block diagram for the functions of the EFT8A................................................................................7-18 Figure 7-6 Front panel of the EFT8A.................................................................................................................7-20 Figure 7-7 Block diagram for the functions of the EGT2..................................................................................7-25 Figure 7-8 Front panel of the EGT2...................................................................................................................7-27 Figure 7-9 Block diagram for the functions of the EFS0...................................................................................7-34 Figure 7-10 Front panel of the EFS0..................................................................................................................7-36 Figure 7-11 Slot configuration for the 1:1 TPS protection for the EFS0 in the OptiX OSN 1500B subrack .............................................................................................................................................................................7-38 Issue 02 (2007-03-29) Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd xxv

Figures

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Figure 7-12 Block diagram for the functions of the EFS4.................................................................................7-42 Figure 7-13 Front panel of the EFS4..................................................................................................................7-44 Figure 7-14 Block diagram for the functions of the EGS2................................................................................7-50 Figure 7-15 Front panel of the EGS2.................................................................................................................7-53 Figure 7-16 Block diagram for the functions of the EMS4................................................................................7-59 Figure 7-17 Front panel of the EMS4................................................................................................................7-62 Figure 7-18 Normal working of the EMS4........................................................................................................7-65 Figure 7-19 Principle of the BPS protection for the EMS4...............................................................................7-66 Figure 7-20 Principle of the PPS protection for the EMS4................................................................................7-67 Figure 7-21 Block diagram for the functions of the EGS4................................................................................7-73 Figure 7-22 Front panel of the EGS4.................................................................................................................7-76 Figure 7-23 Normal working of the EGS4.........................................................................................................7-78 Figure 7-24 Principle of the BPS protection for the EGS4................................................................................7-79 Figure 7-25 Principle of the PPS protection for the EGS4.................................................................................7-80 Figure 7-26 Block diagram for the functions of the EGS4A..............................................................................7-85 Figure 7-27 Front panel of the EGS4A..............................................................................................................7-88 Figure 7-28 Normal working of the EGS4A......................................................................................................7-90 Figure 7-29 Principle of the BPS protection for the EGS4A.............................................................................7-91 Figure 7-30 Block diagram for the functions of the EGR2................................................................................7-96 Figure 7-31 Front panel of the EGR2.................................................................................................................7-99 Figure 7-32 Block diagram for the functions of the EMR0.............................................................................7-106 Figure 7-33 Front panel of the N1EMR0.........................................................................................................7-109 Figure 7-34 Front panel of the N2EMR0.........................................................................................................7-110 Figure 7-35 Block diagram for the functions of the ADL4..............................................................................7-116 Figure 7-36 Front panel of the ADL4.............................................................................................................. 7-118 Figure 7-37 Block diagram for the functions of the ADQ1............................................................................. 7-123 Figure 7-38 Front panel of the ADQ1..............................................................................................................7-125 Figure 7-39 Block diagram for the functions of the IDL4............................................................................... 7-131 Figure 7-40 Front panel of the IDL4................................................................................................................7-133 Figure 7-41 Block diagram for the functions of the IDQ1...............................................................................7-139 Figure 7-42 Front panel of the IDQ1................................................................................................................7-141 Figure 7-43 Block diagram for the functions of the MST4..............................................................................7-146 Figure 7-44 Front panel of the MST4.............................................................................................................. 7-148 Figure 8-1 Block diagram for the functions of the L12S.....................................................................................8-3 Figure 8-2 Front panel of the L12S......................................................................................................................8-4 Figure 8-3 Block diagram for the functions of the D12B....................................................................................8-6 Figure 8-4 Front panel of the D12B.....................................................................................................................8-7 Figure 8-5 Block diagram for the functions of the D12S...................................................................................8-10 Figure 8-6 Front panel of the D12S....................................................................................................................8-11 Figure 8-7 Block diagram for the functions of the L75S...................................................................................8-14 Figure 8-8 Front panel of the L75S....................................................................................................................8-15 Figure 8-9 Block diagram for the functions of the D75S...................................................................................8-17 xxvi Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd Issue 02 (2007-03-29)

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Figures

Figure 8-10 Front panel of the D75S..................................................................................................................8-18 Figure 8-11 Block diagram for the functions of the D34S.................................................................................8-21 Figure 8-12 Front panel of the D34S..................................................................................................................8-22 Figure 8-13 Block diagram for the functions of the C34S.................................................................................8-24 Figure 8-14 Front panel of the C34S..................................................................................................................8-25 Figure 8-15 Block diagram for the functions of the EU04.................................................................................8-28 Figure 8-16 Front panel of the EU04.................................................................................................................8-29 Figure 8-17 Block diagram for the functions of the EU08.................................................................................8-31 Figure 8-18 Front panel of the EU08.................................................................................................................8-32 Figure 8-19 Block diagram for the functions of the OU08................................................................................8-35 Figure 8-20 Front panel of the N1OU08............................................................................................................8-36 Figure 8-21 Front panel of the N2OU08............................................................................................................8-37 Figure 8-22 Block diagram for the functions of the MU04................................................................................8-40 Figure 8-23 Front panel of the MU04................................................................................................................8-41 Figure 8-24 Block diagram for the functions of the TSB4.................................................................................8-43 Figure 8-25 Front panel of the TSB4.................................................................................................................8-44 Figure 8-26 Block diagram for the functions of the TSB8.................................................................................8-47 Figure 8-27 Front panel of the TSB8.................................................................................................................8-48 Figure 8-28 Block diagram for the functions of the EFF8.................................................................................8-51 Figure 8-29 Front panel of the EFF8..................................................................................................................8-52 Figure 8-30 Block diagram for the functions of the ETF8.................................................................................8-56 Figure 8-31 Front panel of the ETF8..................................................................................................................8-57 Figure 8-32 Block diagram for the functions of the ETS8.................................................................................8-61 Figure 8-33 Front panel of the ETS8..................................................................................................................8-62 Figure 8-34 Block diagram for the functions of the DM12................................................................................8-65 Figure 8-35 Front panel of the DM12................................................................................................................8-66 Figure 9-1 Block diagram for the functions of the Q2CXL1...............................................................................9-7 Figure 9-2 Block diagram for the functions of the Q3CXL1 board.....................................................................9-8 Figure 9-3 Block diagram of higher and lower order cross-connect modules..................................................9-11 Figure 9-4 Jumper and DIP switch of the CXL1 board.....................................................................................9-13 Figure 9-5 Front panel of the Q2CXL1..............................................................................................................9-15 Figure 9-6 Front panel the Q3CXL1 board .......................................................................................................9-16 Figure 9-7 Block diagram for the functions of the Q2CXL4.............................................................................9-25 Figure 9-8 Block diagram for the functions of the Q3CXL4 board...................................................................9-26 Figure 9-9 Block diagram of higher and lower order cross-connect modules..................................................9-29 Figure 9-10 Jumper and DIP switch of the CXL4 board...................................................................................9-31 Figure 9-11 Front panel of the Q2CXL4............................................................................................................9-33 Figure 9-12 Front panel the Q3CXL4 board .....................................................................................................9-34 Figure 9-13 Block diagram for the functions of the Q2CXL16.........................................................................9-43 Figure 9-14 Block diagram for the functions of the Q3CXL16 board...............................................................9-44 Figure 9-15 Block diagram of higher and lower order cross-connect modules................................................9-47 Figure 9-16 Jumper and DIP switch of the CXL16 board.................................................................................9-49 Issue 02 (2007-03-29) Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd xxvii

Figures

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Figure 9-17 Front panel of the Q2CXL16..........................................................................................................9-51 Figure 9-18 Front panel the Q3CXL16 board ...................................................................................................9-52 Figure 9-19 Block diagram for the functions of the CXLL1..............................................................................9-61 Figure 9-20 Block diagram of higher and lower order cross-connect modules................................................9-64 Figure 9-21 Jumper and DIP switch of the CXL board.....................................................................................9-65 Figure 9-22 Front panel the CXLL1 board .......................................................................................................9-67 Figure 9-23 Block diagram for the functions of the CXLL4..............................................................................9-75 Figure 9-24 Block diagram of higher and lower order cross-connect modules................................................9-78 Figure 9-25 Jumper and DIP switch of the CXL board.....................................................................................9-79 Figure 9-26 Front panel the CXLL4 board .......................................................................................................9-81 Figure 9-27 Block diagram for the functions of the CXLL16............................................................................9-89 Figure 9-28 Block diagram of higher and lower order cross-connect modules................................................9-92 Figure 9-29 Jumper and DIP switch of the CXL board.....................................................................................9-93 Figure 9-30 Front panel the CXLL16 board .....................................................................................................9-95 Figure 9-31 Block diagram for the functions of the CXLD1...........................................................................9-103 Figure 9-32 Block diagram of higher and lower order cross-connect modules..............................................9-106 Figure 9-33 Jumper and DIP switch of the CXL board...................................................................................9-107 Figure 9-34 Front panel the CXLD1 board .....................................................................................................9-109 Figure 9-35 Block diagram for the functions of the CXLD4...........................................................................9-117 Figure 9-36 Block diagram of higher and lower order cross-connect modules..............................................9-120 Figure 9-37 Jumper and DIP switch of the CXLD4 board...............................................................................9-121 Figure 9-38 Front panel the CXLD4 board .....................................................................................................9-123 Figure 9-39 Block diagram for the functions of the CXLQ1...........................................................................9-131 Figure 9-40 Block diagram of higher and lower order cross-connect modules..............................................9-134 Figure 9-41 Jumper and DIP switch of the CXLQ1 board...............................................................................9-135 Figure 9-42 Front panel the CXLQ1 board .....................................................................................................9-137 Figure 9-43 Block diagram for the functions of the CXLQ4...........................................................................9-145 Figure 9-44 Block diagram of higher and lower order cross-connect modules..............................................9-148 Figure 9-45 Jumper and DIP switch of the CXLQ4 board...............................................................................9-149 Figure 9-46 Front panel the CXLQ4 board .....................................................................................................9-151 Figure 10-1 Block diagram for the functions of the EOW.................................................................................10-3 Figure 10-2 Front panel of the EOW..................................................................................................................10-4 Figure 10-3 Block diagram for the functions of the R1AUX.............................................................................10-8 Figure 10-4 Block diagram for the functions of the R2AUX.............................................................................10-9 Figure 10-5 Front panel of the AUX................................................................................................................10-11 Figure 10-6 Block diagram for the functions of the AMU...............................................................................10-16 Figure 10-7 Positions of orderwire bytes in the SDH frame............................................................................10-16 Figure 10-8 Front panel of the AMU...............................................................................................................10-17 Figure 10-9 Connection of the cabinet alarm indicators..................................................................................10-19 Figure 10-10 Block diagram for the functions of the FAN..............................................................................10-21 Figure 10-11 Front panel of the FAN...............................................................................................................10-22 Figure 11-1 Block diagram for the functions of the CMR2...............................................................................11-4 xxviii Huawei Proprietary and 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Figures

Figure 11-2 Front panel of the CMR2................................................................................................................11-6 Figure 11-3 Block diagram for the functions of the CMR4.............................................................................11-10 Figure 11-4 Front panel of the CMR4..............................................................................................................11-12 Figure 11-5 Block diagram for the functions of the MR2................................................................................11-17 Figure 11-6 Front panel of the MR2................................................................................................................ 11-18 Figure 11-7 MR2A used as the OTM station...................................................................................................11-22 Figure 11-8 MR2A and LWX used as the two-channel wavelength adding/dropping OADM station...........11-22 Figure 11-9 Block diagram for the functions of the MR2A.............................................................................11-23 Figure 11-10 Front panel of the MR2A............................................................................................................11-24 Figure 11-11 MR2B used as the OTM station.................................................................................................11-27 Figure 11-12 MR2B and LWX used as the two-channel wavelength adding/dropping OADM station......... 11-28 Figure 11-13 Block diagram for the functions of the MR2B...........................................................................11-28 Figure 11-14 Front panel of the MR2B............................................................................................................11-29 Figure 11-15 MR2C used as the OTM station.................................................................................................11-32 Figure 11-16 Two-channel wavelength adding/dropping OADM station realized by the MR2C and LWX ...........................................................................................................................................................................11-33 Figure 11-17 Block diagram for the functions of the MR2C...........................................................................11-33 Figure 11-18 Front panel of the MR2C............................................................................................................11-35 Figure 11-19 Block diagram for the functions of the MR4..............................................................................11-38 Figure 11-20 Front panel of the MR4.............................................................................................................. 11-39 Figure 11-21 Block diagram for the functions of the LWX.............................................................................11-45 Figure 11-22 Front panel of the LWX..............................................................................................................11-47 Figure 11-23 Block diagram for the functions of the OBU1............................................................................11-53 Figure 11-24 Front panel of the OBU1............................................................................................................11-55 Figure 11-25 Location of the FIB in the optical transmission system............................................................. 11-58 Figure 11-26 Block diagram for the working principle of the FIB..................................................................11-59 Figure 11-27 Front panel of the FIB................................................................................................................ 11-60 Figure 12-1 Location of the BA in the optical transmission system..................................................................12-2 Figure 12-2 Block diagram for the functions of the BA2..................................................................................12-4 Figure 12-3 Front panel of the single-interface BA2.........................................................................................12-6 Figure 12-4 Front panel of the double-interface BA2........................................................................................12-7 Figure 12-5 Location of the BA and PA in the optical transmission system...................................................12-11 Figure 12-6 Block diagram for the working principle of the N1BPA..............................................................12-12 Figure 12-7 Block diagram for the working principle of the N2BPA..............................................................12-13 Figure 12-8 Front panel of the BPA.................................................................................................................12-14 Figure 12-9 Appearance of the case-shaped 61COA and N1COA (PA)......................................................... 12-18 Figure 12-10 Appearance of the case-shaped 62COA.....................................................................................12-19 Figure 12-11 Application of the optical Raman amplifier (62COA)...............................................................12-19 Figure 12-12 Block diagram for the functions of the 61COA and N1COA.................................................... 12-21 Figure 12-13 Front panel of the 61COA and N1COA.....................................................................................12-22 Figure 12-14 Front panel of the 62COA..........................................................................................................12-23 Figure 12-15 SC/PC fiber connector................................................................................................................12-24 Figure 12-16 LSH flange and fiber connector..................................................................................................12-24 Issue 02 (2007-03-29) Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd xxix

Figures

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Figure 12-17 Position of the 61COA in the ETSI cabinet...............................................................................12-27 Figure 13-1 Appearance of the power supply case............................................................................................13-2 Figure 13-2 Rear view of the UPM....................................................................................................................13-4 Figure 13-3 Block diagram for the functions of the PIU....................................................................................13-9 Figure 13-4 Front panel of the PIU..................................................................................................................13-10 Figure 13-5 Block diagram for the functions of the PIUA...............................................................................13-12 Figure 13-6 Front panel of the PIUA...............................................................................................................13-13 Figure 14-1 LC/PC optical connector................................................................................................................14-3 Figure 14-2 SC/PC optical connector.................................................................................................................14-4 Figure 14-3 FC/PC optical connector.................................................................................................................14-4 Figure 14-4 LSH/APC optical connector...........................................................................................................14-5 Figure 14-5 Cabinet 48 V power cable and BGND power grounding cable....................................................14-6 Figure 14-6 Cabinet PGND protection grounding cable (JG2)..........................................................................14-6 Figure 14-7 Cabinet PGND protection grounding cable (OT)...........................................................................14-6 Figure 14-8 Structure of the equipment 48 V/60 V Power Cable..................................................................14-8 Figure 14-9 PGND power cable.........................................................................................................................14-8 Figure 14-10 Structure of the UPM power cable...............................................................................................14-9 Figure 14-11 Structure of the alarm input/output cable...................................................................................14-11 Figure 14-12 Structure of the OAM serial port cable.......................................................................................14-13 Figure 14-13 Structure of the Serial 14/F1/F&f serial port cable..................................................................14-14 Figure 14-14 Structure of the RS232/RS422 serial port cable.........................................................................14-16 Figure 14-15 Structure of the ordinary telephone wire....................................................................................14-17 Figure 14-16 Structure of the COA concatenating cable.................................................................................14-18 Figure 14-17 Structure of the straight through cable........................................................................................14-19 Figure 14-18 Structure of the crossover cable..................................................................................................14-20 Figure 14-19 Structure of the 75-ohm 8 x E1 cable.........................................................................................14-22 Figure 14-20 Structure of the 75-ohm 16 x E1 cable.......................................................................................14-24 Figure 14-21 Structure of the 120-ohm 8 x E1 cable.......................................................................................14-27 Figure 14-22 Structure of the 120-ohm 16 x E1 cable.....................................................................................14-29 Figure 14-23 Structure of the E3/T3/STM-1 cable..........................................................................................14-31 Figure 14-24 Structure of the V.35 DCE cable................................................................................................14-34 Figure 14-25 Structure of the V.35 DTE cable................................................................................................14-35 Figure 14-26 Structure of the V.24 DCE cable................................................................................................14-37 Figure 14-27 Structure of the V.24 DTE cable................................................................................................14-38 Figure 14-28 Structure of the X.21 DCE cable................................................................................................14-40 Figure 14-29 Structure of the X.21 DTE cable................................................................................................14-41 Figure 14-30 Structure of the RS449 DCE cable.............................................................................................14-42 Figure 14-31 Structure of the RS449 DTE cable.............................................................................................14-44 Figure 14-32 Structure of the RS530 DCE cable.............................................................................................14-46 Figure 14-33 Structure of the RS530 DTE cable.............................................................................................14-48 Figure 14-34 Structure of the 75-ohm clock cable...........................................................................................14-50 Figure 14-35 Structure of the 120-ohm clock cable.........................................................................................14-50 xxx Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd Issue 02 (2007-03-29)

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Figures

Figure 14-36 Structure of the one-channel clock transfer cable (75 ohms to 120 ohms)................................14-51 Figure 14-37 Structure of the two-channel clock transfer cable (75 ohms to 120 ohms)................................14-52 Figure B-1 Labels on the OptiX OSN 1500B subrack........................................................................................B-4 Figure B-2 Labels on the OptiX OSN 1500A subrack........................................................................................B-4 Figure B-3 Labels on a board..............................................................................................................................B-5 Figure B-4 Optical module labels........................................................................................................................B-5

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Tables

Tables
Table 2-1 Indicators on the ETSI cabinet.............................................................................................................2-3 Table 2-2 Connection of power terminals at side A and side B...........................................................................2-4 Table 2-3 Technical specifications of the ETSI cabinet.......................................................................................2-5 Table 3-1 Mapping relation between slots for the interface boards and slots for the processing boards of the OptiX OSN 1500A...........................................................................................................................................................3-5 Table 3-2 CXL series boards and their valid slots of the OptiX OSN 1500A.....................................................3-6 Table 3-3 SDH processing boards and their valid slots of the OptiX OSN 1500A.............................................3-7 Table 3-4 PDH processing boards and their valid slots of the OptiX OSN 1500A.............................................3-8 Table 3-5 Interface Boards and their valid slots of the OptiX OSN 1500A.........................................................3-9 Table 3-6 Data processing boards and their valid slots of the OptiX OSN 1500A..............................................3-9 Table 3-7 WDM boards and their valid slots of the OptiX OSN 1500A...........................................................3-11 Table 3-8 Optical booster amplifier boards and their valid slots of the OptiX OSN 1500A.............................3-12 Table 3-9 Auxiliary boards and their valid slots of the OptiX OSN 1500A......................................................3-12 Table 3-10 Mapping relation between slots for the interface boards and slots for the processing boards of the OptiX OSN 1500B.........................................................................................................................................................3-14 Table 3-11 CXL series boards and their valid slots for the OptiX OSN 1500B................................................3-14 Table 3-12 SDH processing boards and their valid slots for the OptiX OSN 1500B........................................3-15 Table 3-13 PDH processing boards and their valid slots for the OptiX OSN 1500B........................................3-17 Table 3-14 Interface/protection switching boards and their valid slots for the OptiX OSN 1500B..................3-18 Table 3-15 Data processing boards and their valid slots for the OptiX OSN 1500B.........................................3-19 Table 3-16 WDM boards and their valid slots for the OptiX OSN 1500B........................................................3-23 Table 3-17 Optical booster amplifier boards and their valid slots for the OptiX OSN 1500B..........................3-23 Table 3-18 Auxiliary boards and their valid slots for the OptiX OSN 1500B...................................................3-24 Table 3-19 Technical specifications of the OptiX OSN 1500A subrack............................................................3-24 Table 3-20 Maximum power consumption of the OptiX OSN 1500A subrack.................................................3-24 Table 3-21 Technical specifications of the OptiX OSN 1500B subrack............................................................3-25 Table 3-22 Maximum power consumption of the OptiX OSN 1500B subrack.................................................3-25 Table 4-1 Appearance and dimensions of boards for the OptiX OSN 1500........................................................4-2 Table 4-2 SDH processing boards for the OptiX OSN 1500A.............................................................................4-4 Table 4-3 SDH processing boards for the OptiX OSN 1500B.............................................................................4-5 Table 4-4 PDH processing boards for the OptiX OSN 1500A.............................................................................4-7 Table 4-5 PDH processing boards for the OptiX OSN 1500B.............................................................................4-7 Table 4-6 Data processing boards for the OptiX OSN 1500A.............................................................................4-8 Table 4-7 Data processing boards for the OptiX OSN 1500B.............................................................................4-8 Issue 02 (2007-03-29) Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd xxxiii

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description Table 4-8 Interface boards and switching boards supported by the OptiX OSN 1500A.....................................4-9 Table 4-9 Interface boards and switching boards supported by the OptiX OSN 1500B......................................4-9 Table 4-10 Cross-connect boards and SCC boards supported by the OptiX OSN 1500A and the OptiX OSN 1500B .............................................................................................................................................................................4-10 Table 4-11 Auxiliary boards supported by the OptiX OSN 1500A and the OptiX OSN 1500B......................4-11 Table 4-12 Optical add/drop multiplexing boards supported by the OptiX OSN 1500A..................................4-11 Table 4-13 Optical add/drop multiplexing boards supported by the OptiX OSN 1500B..................................4-11 Table 4-14 Optical amplifier boards and dispersion compensation boards supported by the OptiX OSN 1500A/B .............................................................................................................................................................................4-12 Table 5-1 Version Description of the SL1............................................................................................................5-3 Table 5-2 Functions and features of the SL1........................................................................................................5-4 Table 5-3 Optical interfaces of the SL1................................................................................................................5-8 Table 5-4 Relation between the board feature code and the optical interface type..............................................5-9 Table 5-5 Specifications of the optical interfaces of the SL1.............................................................................5-10 Table 5-6 Functions and features of the SL16A board.......................................................................................5-12 Table 5-7 Optical interfaces of the SL1A...........................................................................................................5-15 Table 5-8 Relation between the board feature code and optical interface type of the SL1A.............................5-15 Table 5-9 Specifications of the optical interfaces of the SL1A board................................................................5-16 Table 5-10 Version Description of the SLQ1.....................................................................................................5-18 Table 5-11 Functions and features of the SLQ1.................................................................................................5-18 Table 5-12 Optical interfaces of the SLQ1.........................................................................................................5-22 Table 5-13 Relation between the board feature code and the optical interface type..........................................5-23 Table 5-14 Specifications of the optical interfaces of the SLQ1........................................................................5-24 Table 5-15 Functions and features of the SLQ1A board....................................................................................5-26 Table 5-16 Optical interfaces of the SLQ1A board............................................................................................5-29 Table 5-17 Relation between the board feature code and optical interface type of the SLQ1A........................5-30 Table 5-18 Specifications of the optical interfaces of the SLQ1A board...........................................................5-31 Table 5-19 Functions and features of the SLO1 board.......................................................................................5-33 Table 5-20 Optical interfaces of the SLO1.........................................................................................................5-36 Table 5-21 Relation between the board feature code and the optical interface type..........................................5-37 Table 5-22 Specifications of the optical interfaces of the SLO1........................................................................5-38 Table 5-23 Functions and features of the SLT1.................................................................................................5-39 Table 5-24 Optical interfaces of the SLT1.........................................................................................................5-43 Table 5-25 Specifications of the optical interfaces of the SLT1........................................................................5-44 Table 5-26 Functions and features of the SEP1.................................................................................................5-46 Table 5-27 Access capabilities for the SEP1......................................................................................................5-47 Table 5-28 Electrical interfaces of the SEP1......................................................................................................5-52 Table 5-29 Slots for the SEP1, EU08 and TSB8................................................................................................5-53 Table 5-30 Technical specifications of the SEP1 board.....................................................................................5-54 Table 5-31 Version Description of the SL4........................................................................................................5-55 Table 5-32 Functions and features of the SL4....................................................................................................5-56 Table 5-33 Optical interfaces of the SL4............................................................................................................5-60 Table 5-34 Relation between the board feature code and the optical interface type of the SL4........................5-60

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Table 5-35 Specifications of the optical interfaces of the SL4...........................................................................5-61 Table 5-36 Functions and features of the SL4A.................................................................................................5-63 Table 5-37 Optical interfaces of the SL4A.........................................................................................................5-66 Table 5-38 Relation between the board feature code and optical interface type of the SL4A...........................5-67 Table 5-39 Specifications of the optical interfaces of the SL4A board..............................................................5-68 Table 5-40 Version Description of the SLD4.....................................................................................................5-69 Table 5-41 Functions and features of the SLD4.................................................................................................5-70 Table 5-42 Optical interfaces of the SLD4.........................................................................................................5-74 Table 5-43 Relation between the board feature code and the optical interface type of the SLD4.....................5-75 Table 5-44 Specifications of the optical interfaces of the SLD4........................................................................5-76 Table 5-45 Functions and features of the SLD4A board....................................................................................5-78 Table 5-46 Optical interfaces of the SLD4A board............................................................................................5-80 Table 5-47 Relation between the board feature code and optical interface type of the SLD4A........................5-81 Table 5-48 Specifications of the optical interfaces of the SLD4A board...........................................................5-82 Table 5-49 Version Description of the SLQ4.....................................................................................................5-83 Table 5-50 Functions and features of the SLQ4.................................................................................................5-84 Table 5-51 Optical interfaces of the SLQ4.........................................................................................................5-88 Table 5-52 Relation between the board feature code and the optical interface type of the SLQ4.....................5-88 Table 5-53 Specifications of the optical interfaces of the SLQ4........................................................................5-89 Table 5-54 Functions and features of the SLQ4A board....................................................................................5-91 Table 5-55 Optical interfaces of the SLQ4A board............................................................................................5-94 Table 5-56 Relation between the board feature code and optical interface type of the SLQ4A........................5-94 Table 5-57 Specifications of the optical interfaces of the SLQ4A board...........................................................5-95 Table 5-58 Version Description of the SL16......................................................................................................5-97 Table 5-59 Functions and features of the SL16..................................................................................................5-97 Table 5-60 Optical interfaces of the SL16........................................................................................................5-101 Table 5-61 Relation between the board feature code and the optical interface type for the SL16...................5-102 Table 5-62 Specifications of the optical interfaces of the SL16.......................................................................5-103 Table 5-63 Specifications of the ITU-T G.692-compliant optical interfaces that output standard wavelengths ...........................................................................................................................................................................5-103 Table 5-64 Version Description of the SL16A.................................................................................................5-105 Table 5-65 Functions and features of the SL16A.............................................................................................5-106 Table 5-66 Optical interfaces of the SL16A.....................................................................................................5-110 Table 5-67 Relation between the board feature code and the optical interface type........................................5-110 Table 5-68 Specifications of the optical interfaces of the SL16A....................................................................5-111 Table 5-69 Functions and features of the SF16................................................................................................5-113 Table 5-70 Optical interfaces of the SF16........................................................................................................5-118 Table 5-71 Specifications of the optical interfaces of the SF16.......................................................................5-118 Table 5-72 Specifications of the ITU-T G.692-compliant optical interfaces that output standard wavelengths ...........................................................................................................................................................................5-119 Table 6-1 Functions and features of the PL1........................................................................................................6-3 Table 6-2 Interfaces on the front panel of the PL1...............................................................................................6-7 Table 6-3 Relation between the board feature code and the optical interface type of the PL1............................6-7 Issue 02 (2007-03-29) Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd xxxv

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description Table 6-4 Specifications of the electrical interfaces of the PL1...........................................................................6-8 Table 6-5 Version Description of the PD1...........................................................................................................6-9 Table 6-6 Functions and features of the PD1.....................................................................................................6-10 Table 6-7 Valid slots for the PD1 and corresponding slots for the L75S and L12S in the OptiX OSN 1500A subrack .............................................................................................................................................................................6-14 Table 6-8 Valid slots for the PD1 and corresponding slots for the D75S and D12S in the OptiX OSN 1500B subrack .............................................................................................................................................................................6-14 Table 6-9 Relation between the board feature code and the interface impedance type.....................................6-15 Table 6-10 Slot configuration for the 1:2 TPS protection for the PD1 in the OptiX OSN 1500B subrack .............................................................................................................................................................................6-17 Table 6-11 Version Description of the PQ1.......................................................................................................6-19 Table 6-12 Functions and features of the PQ1...................................................................................................6-19 Table 6-13 Valid slots for the PQ1 and corresponding slots for the D75S, D12S or D12B in the OptiX OSN 1500B subrack................................................................................................................................................................6-24 Table 6-14 Relation between the board feature code and the interface impedance type...................................6-24 Table 6-15 Slot configuration for the 1:2 TPS protection for the PQ1 in the OptiX OSN 1500B subrack .............................................................................................................................................................................6-25 Table 6-16 Functions and features of the PQM..................................................................................................6-27 Table 6-17 Valid slots for the PQM and corresponding slots for the D12S and D12B in the OptiX OSN 1500B subrack................................................................................................................................................................6-32 Table 6-18 Slot configuration for the 1:2 TPS protection for the PQM in the OptiX OSN 1500B subrack .............................................................................................................................................................................6-33 Table 6-19 Version description of the PL3........................................................................................................6-35 Table 6-20 Functions and features of the PL3....................................................................................................6-36 Table 6-21 Valid slots for the PL3 and corresponding slots for the C34S in the OptiX OSN 1500B subrack .............................................................................................................................................................................6-40 Table 6-22 Slot configuration for the 1:1 TPS protection for the PL3 in the OptiX OSN 1500B subrack .............................................................................................................................................................................6-41 Table 6-23 Slots for the PL3, C34S and TSB8 in the OptiX OSN 1500B subrack...........................................6-42 Table 6-24 Version description of the PL3A......................................................................................................6-44 Table 6-25 Functions and features of the PL3A.................................................................................................6-44 Table 6-26 Specifications of the electrical interfaces of the PL3A....................................................................6-49 Table 6-27 Version Description of the PD3.......................................................................................................6-50 Table 6-28 Functions and features of the PD3...................................................................................................6-51 Table 6-29 Valid slots for the PD3 and corresponding slots for the D34S in the OptiX OSN 1500B subrack .............................................................................................................................................................................6-55 Table 6-30 Slot configuration for the 1:1 TPS protection for the PD3 in the OptiX OSN 1500B subrack .............................................................................................................................................................................6-56 Table 6-31 Slots for the PD3, D34S and TSB8 in the OptiX OSN 1500B subrack...........................................6-56 Table 6-32 Functions and features of the PQ3...................................................................................................6-58 Table 6-33 Valid slots for the PQ3 and corresponding slots for the D34S in the OptiX OSN 1500B subrack .............................................................................................................................................................................6-63 Table 6-34 Slot configuration for the 1:1 TPS protection for the PQ3 in the OptiX OSN 1500B subrack .............................................................................................................................................................................6-64 Table 6-35 Slots for the PQ3, D34S and TSB8 in the OptiX OSN 1500B subrack...........................................6-64 Table 6-36 Functions and features of the DX1...................................................................................................6-66

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Table 6-37 Valid slots for the DX1 and corresponding slots for the DM12 in the OptiX OSN 1500B subrack .............................................................................................................................................................................6-69 Table 6-38 Relation between the board feature code and the interface impedance type...................................6-69 Table 6-39 Slots for the DX1 and DM12 in the OptiX OSN 1500B subrack....................................................6-71 Table 6-40 Functions and features of the DXA..................................................................................................6-73 Table 6-41 Version Description of the SPQ4.....................................................................................................6-77 Table 6-42 Functions and features of the SPQ4.................................................................................................6-77 Table 6-43 Valid slots for the SPQ4 and corresponding slots for the MU04 in the OptiX OSN 1500B subrack .............................................................................................................................................................................6-84 Table 6-44 Slots for the SPQ4, MU04 and TSB8 in the OptiX OSN 1500B subrack.......................................6-85 Table 7-1 Functions and features of the EFT4.....................................................................................................7-3 Table 7-2 Optical interfaces of the EFT4.............................................................................................................7-7 Table 7-3 Pins of the RJ-45 of the EFT4..............................................................................................................7-8 Table 7-4 Functions and features of the EFT8.....................................................................................................7-9 Table 7-5 Optical interfaces of the EFT8...........................................................................................................7-14 Table 7-6 Pins of the RJ-45 of the EFT8............................................................................................................7-14 Table 7-7 Valid slots for the EFT8 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500A .............................................................................................................................................................................7-15 Table 7-8 Valid slots for the EFT8 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500B .............................................................................................................................................................................7-15 Table 7-9 Functions and features of the EFT8A................................................................................................7-16 Table 7-10 Optical interfaces of the EFT8A......................................................................................................7-21 Table 7-11 Pins of the RJ-45 of the EFT8A.......................................................................................................7-21 Table 7-12 Functions and features of the EGT2.................................................................................................7-23 Table 7-13 Optical interfaces of the EGT2.........................................................................................................7-28 Table 7-14 Relation between the board feature code and the optical interface type..........................................7-28 Table 7-15 Specifications of the optical interfaces of the EGT2........................................................................7-29 Table 7-16 Version Description of the EFS0.....................................................................................................7-30 Table 7-17 Functions and features of the EFS0.................................................................................................7-31 Table 7-18 Valid slots for the EFS0 and corresponding slots for the ETF8, EFF8 and ETS8 in the OptiX OSN 1500B subrack.....................................................................................................................................................7-37 Table 7-19 Version Description of the EFS4.....................................................................................................7-39 Table 7-20 Functions and features of the EFS4.................................................................................................7-40 Table 7-21 Optical interfaces of the EFS4.........................................................................................................7-45 Table 7-22 Pins of the RJ-45 of the EFS4..........................................................................................................7-45 Table 7-23 Version Description of the EGS2.....................................................................................................7-47 Table 7-24 Functions and features of the EGS2.................................................................................................7-48 Table 7-25 Optical interfaces of the EGS2.........................................................................................................7-54 Table 7-26 Relation between the board feature code and the optical interface type..........................................7-54 Table 7-27 Specifications of the optical interfaces of the EGS2........................................................................7-55 Table 7-28 Functions and features of the EMS4................................................................................................7-56 Table 7-29 Optical interfaces of the EMS4........................................................................................................7-63 Table 7-30 Valid slots for the EMS4 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500A subrack................................................................................................................................................................7-63 Issue 02 (2007-03-29) Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd xxxvii

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description Table 7-31 Valid slots for the EMS4 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500B subrack................................................................................................................................................................7-63 Table 7-32 Relation between the board feature code and the optical interface type..........................................7-64 Table 7-33 Specifications of the optical interfaces of the EMS4.......................................................................7-68 Table 7-34 Version Description of the EGS4.....................................................................................................7-70 Table 7-35 Functions and features of the EGS4.................................................................................................7-70 Table 7-36 Optical interfaces of the EGS4.........................................................................................................7-77 Table 7-37 Relation between the board feature code and the optical interface type..........................................7-77 Table 7-38 Specifications of the optical interfaces of the EGS4........................................................................7-81 Table 7-39 Functions and features of the EGS4A..............................................................................................7-83 Table 7-40 Optical interfaces of the EGS4A......................................................................................................7-89 Table 7-41 Relation between the board feature code and the optical interface type..........................................7-89 Table 7-42 Specifications of the optical interfaces of the EGS4A.....................................................................7-92 Table 7-43 Functions and features of the EGR2................................................................................................7-93 Table 7-44 Optical interfaces of the EGR2 .....................................................................................................7-100 Table 7-45 Relation between the board feature code and the optical interface type........................................7-100 Table 7-46 Specifications of the interfaces of the EGR2.................................................................................7-101 Table 7-47 Version description of the EMR0..................................................................................................7-102 Table 7-48 Comparison of features of the N1EMR0 and N2EMR0................................................................7-102 Table 7-49 Functions and features of the EMR0..............................................................................................7-103 Table 7-50 Optical interfaces of the EMR0 .....................................................................................................7-111 Table 7-51 Valid slots for the EMR0 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500A subrack..............................................................................................................................................................7-111 Table 7-52 Valid slots for the EMR0 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500B subrack..............................................................................................................................................................7-111 Table 7-53 Relation between the board feature code and the optical interface type........................................7-112 Table 7-54 Specifications of the optical interfaces of the EMR0.....................................................................7-113 Table 7-55 Functions and features of the ADL4..............................................................................................7-114 Table 7-56 Optical interface of the ADL4 .......................................................................................................7-119 Table 7-57 Relation between the board feature code and the optical interface type........................................7-119 Table 7-58 Specifications of the optical interfaces of the ADL4.....................................................................7-120 Table 7-59 Functions and features of the ADQ1..............................................................................................7-121 Table 7-60 Optical interfaces of the ADQ1 .....................................................................................................7-126 Table 7-61 Relation between the board feature code and the optical interface type........................................7-126 Table 7-62 Specifications of the optical interfaces of the ADQ1.....................................................................7-127 Table 7-63 Functions and features of the IDL4................................................................................................7-129 Table 7-64 Optical interface of the IDL4 ........................................................................................................7-134 Table 7-65 Relation between the board feature code and the optical interface type........................................7-134 Table 7-66 Specifications of the optical interfaces of the IDL4.......................................................................7-135 Table 7-67 Functions and features of the IDQ1...............................................................................................7-137 Table 7-68 Optical interfaces of the IDQ1 ......................................................................................................7-142 Table 7-69 Relation between the board feature code and the optical interface type........................................7-142 Table 7-70 Specifications of the optical interfaces of the IDQ1......................................................................7-143

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Table 7-71 Functions and features of the MST4..............................................................................................7-145 Table 7-72 Services and service rates provided by the MST4.........................................................................7-145 Table 7-73 Optical interfaces of the MST4......................................................................................................7-149 Table 7-74 Relation between the board feature code and service type............................................................7-149 Table 7-75 Specifications of the optical interfaces of the MST4.....................................................................7-150 Table 8-1 Valid slots for the PD1 and corresponding slots for the L12S in the OptiX OSN 1500A subrack ...............................................................................................................................................................................8-5 Table 8-2 Interfaces on the front panel of the D12B............................................................................................8-7 Table 8-3 Pins of the DB44 interfaces of the D12B.............................................................................................8-8 Table 8-4 Valid slots for the PQ1/PQM and corresponding slots for the D12B in the OptiX OSN 1500B subrack ...............................................................................................................................................................................8-8 Table 8-5 Interfaces on the front panel of the D12S..........................................................................................8-11 Table 8-6 Pins of the DB44 interfaces of the D12S...........................................................................................8-12 Table 8-7 Valid slots for the PQ1/PQM and corresponding slots for the D12S in the OptiX OSN 1500B subrack .............................................................................................................................................................................8-12 Table 8-8 Valid slots for the PD1 and corresponding slots for the L75S...........................................................8-15 Table 8-9 Interfaces on the front panel of the D75S..........................................................................................8-18 Table 8-10 Pins of the DB44 interfaces of the D75S.........................................................................................8-19 Table 8-11 Valid slots for the PQ1 and corresponding slots for the D75S in the OptiX OSN 1500B subrack .............................................................................................................................................................................8-19 Table 8-12 Interfaces of the D34S......................................................................................................................8-22 Table 8-13 Specifications of the electrical interfaces of the D34S....................................................................8-23 Table 8-14 Interfaces of the C34S......................................................................................................................8-25 Table 8-15 Valid slots for the PL3 and corresponding slots for the C34S in the OptiX OSN 1500B subrack .............................................................................................................................................................................8-26 Table 8-16 Specifications of the electrical interfaces of the C34S.....................................................................8-26 Table 8-17 Interfaces of the EU04.....................................................................................................................8-29 Table 8-18 Valid slots for the SEP and corresponding slots for the EU04........................................................8-30 Table 8-19 Specifications of the electrical interfaces of the EU04....................................................................8-30 Table 8-20 Interfaces of the EU08.....................................................................................................................8-33 Table 8-21 Valid slots for the SEP and corresponding slots for the EU08........................................................8-33 Table 8-22 Specifications of the electrical interfaces of the EU08....................................................................8-33 Table 8-23 Version description of the OU08.....................................................................................................8-35 Table 8-24 Interfaces of the N1OU08................................................................................................................8-37 Table 8-25 Interfaces of the N2OU08................................................................................................................8-38 Table 8-26 Valid slots for the SEP and corresponding slots for the OU08........................................................8-38 Table 8-27 Specifications of the optical interfaces of the OU08........................................................................8-38 Table 8-28 Interfaces of the MU04....................................................................................................................8-41 Table 8-29 Valid slots for the SPQ4 and corresponding slots for the MU04.....................................................8-42 Table 8-30 Specifications of the electrical interfaces of the MU04...................................................................8-42 Table 8-31 Valid slots for the TSB4 and corresponding slots for the SPQ4 and MU04....................................8-45 Table 8-32 Valid slots for the TSB4 and corresponding slots for the SEP and EU04.......................................8-45 Table 8-33 Valid slots for the TSB4 and corresponding slots for the EFS0 and ETS8.....................................8-45 Table 8-34 Valid slots for the TSB8 and corresponding slots for the SPQ4 and MU04....................................8-48 Issue 02 (2007-03-29) Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd xxxix

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description Table 8-35 Valid slots for the TSB8 and corresponding slots for the PD3 and D34S.......................................8-49 Table 8-36 Valid slots for the TSB8 and corresponding slots for the SEP and EU04.......................................8-49 Table 8-37 Valid slots for the TSB8 and corresponding slots for the SEP and EU08.......................................8-49 Table 8-38 Valid slots for the TSB8 and corresponding slots for the EFS0 and ETS8.....................................8-49 Table 8-39 Valid slots for the TSB8 and corresponding slots for the PL3 and C34S........................................8-50 Table 8-40 Valid slots for the TSB8 and corresponding slots for the PQ3 and D34S.......................................8-50 Table 8-41 Interfaces of the EFF8......................................................................................................................8-53 Table 8-42 Valid slots for the EFT8 and corresponding slots for the EFF8......................................................8-53 Table 8-43 Valid slots for the EFS0 and corresponding slots for the EFF8.......................................................8-53 Table 8-44 Valid slots for the EMS4 and corresponding slots for the EFF8.....................................................8-54 Table 8-45 Valid slots for the EMR0 and corresponding slots for the EFF8.....................................................8-54 Table 8-46 Specifications of the optical interfaces of the EFF8........................................................................8-54 Table 8-47 Interfaces of the ETF8......................................................................................................................8-57 Table 8-48 Pins of the RJ-45 connector of the ETF8.........................................................................................8-58 Table 8-49 Valid slots for the EFT8 and corresponding slots for the ETF8......................................................8-58 Table 8-50 Valid slots for the EFS0 and corresponding slots for the ETF8......................................................8-59 Table 8-51 Valid slots for the EMS4 and corresponding slots for the ETF8.....................................................8-59 Table 8-52 Valid slots for the EMR0 and corresponding slots for the ETF8.....................................................8-59 Table 8-53 Specifications of the electrical interfaces of the ETF8....................................................................8-59 Table 8-54 Interfaces of the ETS8......................................................................................................................8-62 Table 8-55 Pins of the RJ-45 connector of the ETS8.........................................................................................8-63 Table 8-56 Valid slots for the EFS0 and corresponding slots for the ETS8......................................................8-63 Table 8-57 Specifications of the electrical interfaces of the ETS8....................................................................8-63 Table 8-58 Interfaces on the front panel of the DM12.......................................................................................8-66 Table 8-59 Pins of the DB44 interfaces of the DM12........................................................................................8-67 Table 8-60 Pins of the DB28 interfaces of the DM12........................................................................................8-68 Table 8-61 Valid slots for the DX1 and corresponding slots for the DM12......................................................8-68 Table 9-1 Version description of the CXL1 board...............................................................................................9-4 Table 9-2 Function and feature of the SDH processing unit of the CXL1...........................................................9-4 Table 9-3 Function and feature of the SCC unit of the CXL1............................................................................. 9-5 Table 9-4 Function and feature of the cross-connect unit of the CXL1...............................................................9-6 Table 9-5 Function and feature of the clock unit of the CXL1............................................................................ 9-6 Table 9-6 Jumper on the CXL1 board................................................................................................................9-13 Table 9-7 DIP switch on the CXL1 board..........................................................................................................9-13 Table 9-8 Description of the DIP switch SW1...................................................................................................9-14 Table 9-9 Optical interface and switches on the CXL1......................................................................................9-17 Table 9-10 Relation between the board feature code and the optical interface type..........................................9-18 Table 9-11 Logical slots displayed on the T2000 for the CXL1........................................................................9-19 Table 9-12 Specifications for the optical interfaces of the CXL1......................................................................9-19 Table 9-13 Version description of the CXL4 board...........................................................................................9-21 Table 9-14 Function and feature of the SDH processing unit of the CXL4.......................................................9-22 Table 9-15 Function and feature of the SCC unit of the CXL4.........................................................................9-23

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Table 9-16 Function and feature of the cross-connect unit of the CXL4...........................................................9-24 Table 9-17 Function and feature of the clock unit of the CXL4........................................................................9-24 Table 9-18 Jumper on the CXL4 board..............................................................................................................9-31 Table 9-19 DIP switch on the CXL4 board........................................................................................................9-31 Table 9-20 Description of DIP switch SW1.......................................................................................................9-32 Table 9-21 Optical interface and switches on the CXL4....................................................................................9-35 Table 9-22 Relation between the board feature code and the optical interface type..........................................9-36 Table 9-23 Logical slots displayed on the T2000 for the CXL4........................................................................9-37 Table 9-24 Specifications for the optical interfaces of the CXL4......................................................................9-37 Table 9-25 Version description of the CXL16 board.........................................................................................9-39 Table 9-26 Function and feature of the SDH processing unit of the CXL16.....................................................9-40 Table 9-27 Function and feature of the SCC unit of the CXL16.......................................................................9-41 Table 9-28 Function and feature of the cross-connect unit of the CXL16.........................................................9-42 Table 9-29 Function and feature of the clock unit of the CXL16......................................................................9-42 Table 9-30 Jumper on the CXL16 board............................................................................................................9-49 Table 9-31 DIP switch on the CXL16 board......................................................................................................9-49 Table 9-32 Description of the DIP switch SW1.................................................................................................9-50 Table 9-33 Optical interface and switches on the CXL16..................................................................................9-53 Table 9-34 Relation between the board feature code and the optical interface type..........................................9-54 Table 9-35 Logical slots displayed on the T2000 for the CXL16......................................................................9-54 Table 9-36 Specifications for the optical interfaces of the CXL16....................................................................9-55 Table 9-37 Function and feature of the SDH processing unit of the CXLL1.....................................................9-57 Table 9-38 Function and feature of the SCC unit of the CXLL1.......................................................................9-58 Table 9-39 Function and feature of the cross-connect unit of the CXLL1.........................................................9-59 Table 9-40 Function and feature of the clock unit of the CXLL1......................................................................9-59 Table 9-41 Jumper on the CXL board................................................................................................................9-66 Table 9-42 DIP switch on the CXL board..........................................................................................................9-66 Table 9-43 Description of the DIP switch SW2.................................................................................................9-66 Table 9-44 Optical interface and switches on the CXLL1.................................................................................9-68 Table 9-45 Relation between the board feature code and the optical interface type..........................................9-69 Table 9-46 Logical slots displayed on the T2000 for the CXLL1......................................................................9-69 Table 9-47 Specifications for the optical interfaces of the CXLL1....................................................................9-70 Table 9-48 Function and feature of the SDH processing unit of the CXLL4.....................................................9-72 Table 9-49 Function and feature of the SCC unit of the CXLL4.......................................................................9-73 Table 9-50 Function and feature of the cross-connect unit of the CXLL4.........................................................9-73 Table 9-51 Function and feature of the clock unit of the CXLL4......................................................................9-74 Table 9-52 Jumper on the CXL board................................................................................................................9-80 Table 9-53 DIP switch on the CXL board..........................................................................................................9-80 Table 9-54 Description of DIP switch SW2.......................................................................................................9-80 Table 9-55 Optical interface and switches on the CXLL4.................................................................................9-82 Table 9-56 Relation between the board feature code and the optical interface type..........................................9-83 Table 9-57 Logical slots displayed on the T2000 for the CXLL4......................................................................9-83 Issue 02 (2007-03-29) Huawei Proprietary and Confidential Copyright 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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description Table 9-58 Specifications for the optical interfaces of the CXLL4....................................................................9-84 Table 9-59 Function and feature of the SDH processing unit of the CXLL16...................................................9-86 Table 9-60 Function and feature of the SCC unit of the CXLL16.....................................................................9-87 Table 9-61 Function and feature of the cross-connect unit of the CXLL16.......................................................9-87 Table 9-62 Function and feature of the clock unit of the CXLL16....................................................................9-88 Table 9-63 Jumper on the CXL board................................................................................................................9-94 Table 9-64 DIP switch on the CXL board..........................................................................................................9-94 Table 9-65 Description of the DIP switch SW2.................................................................................................9-94 Table 9-66 Optical interface and switches on the CXLL16...............................................................................9-96 Table 9-67 Relation between the board feature code and the optical interface type..........................................9-97 Table 9-68 Logical slots displayed on the T2000 for the CXLL16....................................................................9-97 Table 9-69 Specifications for the optical interfaces of the CXLL16..................................................................9-98 Table 9-70 Function and feature of the SDH processing unit of the CXLD1..................................................9-100 Table 9-71 Function and feature of the SCC unit of the CXLD1.....................................................................9-100 Table 9-72 Function and feature of the cross-connect unit of the CXLD1......................................................9-101 Table 9-73 Function and feature of the clock unit of the CXLD1....................................................................9-102 Table 9-74 Jumper on the CXL board..............................................................................................................9-108 Table 9-75 DIP switch on the CXL board........................................................................................................9-108 Table 9-76 Description of DIP switch SW2.....................................................................................................9-108 Table 9-77 Optical interface and switches on the CXLD1...............................................................................9-110 Table 9-78 Relation between the board feature code and the optical interface type........................................9-111 Table 9-79 Logical slots displayed on the T2000 for the CXLD1...................................................................9-111 Table 9-80 Specifications for the optical interfaces of the CXLD1.................................................................9-112 Table 9-81 Function and feature of the SDH processing unit of the CXLD4..................................................9-114 Table 9-82 Function and feature of the SCC unit of the CXLD4.....................................................................9-115 Table 9-83 Function and feature of the cross-connect unit of the CXLD4......................................................9-115 Table 9-84 Function and feature of the clock unit of the CXLD4....................................................................9-116 Table 9-85 Jumper on the CXLD4 board.........................................................................................................9-122 Table 9-86 DIP switch on the CXLD4 board...................................................................................................9-122 Table 9-87 Description of DIP switch SW2.....................................................................................................9-122 Table 9-88 Optical interface and switches on the CXLD4...............................................................................9-124 Table 9-89 Relation between the board feature code and the optical interface type........................................9-125 Table 9-90 Logical slots displayed on the T2000 for the CXLD1...................................................................9-125 Table 9-91 Specifications for the optical interfaces of the CXLD4.................................................................9-126 Table 9-92 Function and feature of the SDH processing unit of the CXLQ1..................................................9-128 Table 9-93 Function and feature of the SCC unit of the CXLQ1.....................................................................9-129 Table 9-94 Function and feature of the cross-connect unit of the CXLQ1......................................................9-129 Table 9-95 Function and feature of the clock unit of the CXLQ1....................................................................9-130 Table 9-96 Jumper on the CXLQ1 board.........................................................................................................9-136 Table 9-97 DIP switch on the CXLQ1 board...................................................................................................9-136 Table 9-98 Description of DIP switch SW2.....................................................................................................9-136 Table 9-99 Optical interface and switches on the CXLQ1...............................................................................9-138

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Tables

Table 9-100 Relation between the board feature code and the optical interface type......................................9-139 Table 9-101 Logical slots displayed on the T2000 for the CXLQ1.................................................................9-139 Table 9-102 Specifications for the optical interfaces of the CXLQ1...............................................................9-140 Table 9-103 Function and feature of the SDH processing unit of the CXLQ4................................................9-142 Table 9-104 Function and feature of the SCC unit of the CXLQ4...................................................................9-143 Table 9-105 Function and feature of the cross-connect unit of the CXLQ4....................................................9-143 Table 9-106 Function and feature of the clock unit of the CXLQ4..................................................................9-144 Table 9-107 Jumper on the CXLQ4 board.......................................................................................................9-150 Table 9-108 DIP switch on the CXLQ4 board.................................................................................................9-150 Table 9-109 Description of DIP switch SW2...................................................................................................9-150 Table 9-110 Optical interface and switches on the CXLQ4.............................................................................9-152 Table 9-111 Relation between the board feature code and the optical interface type......................................9-153 Table 9-112 Logical slots displayed on the T2000 for the CXLQ1.................................................................9-153 Table 9-113 Specifications for the optical interfaces of the CXLQ4...............................................................9-154 Table 10-1 Functions and features of the EOW.................................................................................................10-2 Table 10-2 Interfaces on the front panel of the EOW........................................................................................10-5 Table 10-3 Pins of the PHONE interface of the EOW.......................................................................................10-5 Table 10-4 Pins of the S1, S2, S3 and S4 interfaces of the EOW......................................................................10-5 Table 10-5 Functions and features of the AUX..................................................................................................10-7 Table 10-6 Interfaces on the front panel of the AUX.......................................................................................10-12 Table 10-7 Pins of the CLK interface of the AUX...........................................................................................10-12 Table 10-8 Pins of the ETH and COM interfaces of the AUX.........................................................................10-12 Table 10-9 Pins of the ALM interface of the AUX..........................................................................................10-13 Table 10-10 Pins of the OAM interface of the AUX.......................................................................................10-13 Table 10-11 Pins of the F&f interface of the AUX..........................................................................................10-14 Table 10-12 Functions and features of the AMU.............................................................................................10-15 Table 10-13 Interfaces on the front panel of the AMU....................................................................................10-17 Table 10-14 Pins of the PHONE interface of the AMU...................................................................................10-18 Table 10-15 Pins of the S1 and S2 interfaces of the AMU..............................................................................10-18 Table 10-16 Pins of the LAMP1 and LAMP2 interfaces of the AMU.............................................................10-19 Table 10-17 Functions and features of the FAN..............................................................................................10-21 Table 11-1 Functions and features of the CMR2...............................................................................................11-3 Table 11-2 Optical interfaces of the CMR2.......................................................................................................11-7 Table 11-3 Feature code of the CMR2...............................................................................................................11-7 Table 11-4 Specifications of the optical interfaces of the CMR2......................................................................11-8 Table 11-5 Functions and features of the CMR4.............................................................................................11-10 Table 11-6 Optical interfaces of the CMR4.....................................................................................................11-13 Table 11-7 Feature code of the CMR4.............................................................................................................11-13 Table 11-8 Specifications of the optical interfaces of the CMR4....................................................................11-14 Table 11-9 Functions and features of the MR2................................................................................................11-16 Table 11-10 Optical interfaces of the MR2......................................................................................................11-19 Table 11-11 Feature code of the MR2..............................................................................................................11-19 Issue 02 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Tables

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description Table 11-12 Specifications of the optical interfaces of the MR2.....................................................................11-20 Table 11-13 Functions and features of the MR2A...........................................................................................11-22 Table 11-14 Optical interfaces of the MR2A...................................................................................................11-25 Table 11-15 Specifications of the optical interfaces of the MR2A..................................................................11-25 Table 11-16 Functions and features of the MR2B...........................................................................................11-27 Table 11-17 Optical interfaces of the MR2B...................................................................................................11-30 Table 11-18 Specifications of the optical interfaces of the MR2B..................................................................11-30 Table 11-19 Functions and features of the MR2C...........................................................................................11-32 Table 11-20 Optical interfaces of the MR2C...................................................................................................11-35 Table 11-21 Specifications of the optical interfaces of the MR2C..................................................................11-36 Table 11-22 Functions and features of the MR4..............................................................................................11-37 Table 11-23 Optical interfaces of the MR4......................................................................................................11-40 Table 11-24 Board feature code.......................................................................................................................11-41 Table 11-25 Specifications of the optical interfaces of the MR4.....................................................................11-41 Table 11-26 Functions and features of the LWX.............................................................................................11-43 Table 11-27 Optical interfaces on the front panel of the LWX........................................................................11-48 Table 11-28 Relation between the board feature code and the receive/transmit scheme.................................11-48 Table 11-29 Specifications of the client-side optical interfaces of the LWX...................................................11-49 Table 11-30 Specifications of the WDM-side optical interfaces of the LWX.................................................11-50 Table 11-31 Functions and features of the OBU1............................................................................................11-52 Table 11-32 Optical interfaces of the OBU1....................................................................................................11-56 Table 11-33 Feature code of the OBU1............................................................................................................11-56 Table 11-34 Specifications of optical interfaces of the OBU1.........................................................................11-57 Table 11-35 Functions and features of the FIB................................................................................................11-59 Table 11-36 Optical interfaces of the FIB .......................................................................................................11-60 Table 11-37 Specifications of the optical interfaces of the FIB.......................................................................11-61 Table 12-1 Functions and features of the BA2...................................................................................................12-3 Table 12-2 Optical interfaces of the single-interface BA2.................................................................................12-8 Table 12-3 Optical interfaces of the double-interface BA2................................................................................12-8 Table 12-4 Relation between the board feature code and output optical power for the BA2............................12-9 Table 12-5 Specifications of the optical interfaces of the BA2..........................................................................12-9 Table 12-6 Version description of the BPA board...........................................................................................12-10 Table 12-7 Functions and features of the BPA.................................................................................................12-11 Table 12-8 Optical interfaces of the BPA .......................................................................................................12-14 Table 12-9 Relation between the board feature code and output optical power of the BPA...........................12-15 Table 12-10 Specifications for the optical interfaces of the BPA....................................................................12-16 Table 12-11 Version Description of the COA..................................................................................................12-17 Table 12-12 Functions and features of the 61COA and N1COA.....................................................................12-18 Table 12-13 Functions and features of the 62COA..........................................................................................12-20 Table 12-14 Pins of the RS232 interface..........................................................................................................12-25 Table 12-15 Pins of the MONITOR-1 and MONITOR-2 interfaces...............................................................12-25 Table 12-16 Pins of the RJ-45 connector of the 62COA..................................................................................12-26

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Tables

Table 12-17 Relation between the board feature code and output optical power for the 61COA...................12-27 Table 12-18 Specifications of the optical interfaces of the COA.....................................................................12-28 Table 13-1 Functions and features of the UPM..................................................................................................13-3 Table 13-2 Interfaces on the rear panel of the UPM.......................................................................................... 13-5 Table 13-3 Pins of the RS232 interface of the UPM..........................................................................................13-5 Table 13-4 Specifications of the power supply of the UPM.............................................................................. 13-6 Table 13-5 Functions and features of the PIU....................................................................................................13-8 Table 13-6 Interfaces on the front panel of the PIU.........................................................................................13-10 Table 13-7 Functions and features of the PIUA...............................................................................................13-12 Table 13-8 Interfaces and switch on the front panel of the PIUA....................................................................13-14 Table 14-1 Types of fiber jumpers.....................................................................................................................14-2 Table 14-2 Types of connectors......................................................................................................................... 14-3 Table 14-3 Equipment 48 V/60 V power cable..............................................................................................14-8 Table 14-4 Connection of the UPM power cable...............................................................................................14-9 Table 14-5 Specifications of the UPM power cable.........................................................................................14-10 Table 14-6 Pin assignment of the alarm input/output cable.............................................................................14-11 Table 14-7 Pin assignment of the OAM serial port cable................................................................................14-13 Table 14-8 Pin assignment of the Serial 14/F1/F&f serial port cable............................................................14-15 Table 14-9 Pin assignment of the RS232/RS422 serial port cable...................................................................14-16 Table 14-10 Pin assignment of the ordinary telephone wire............................................................................14-17 Table 14-11 Pin assignment of the COA concatenating cable.........................................................................14-18 Table 14-12 Pin assignment of the straight through cable...............................................................................14-19 Table 14-13 Pin assignment of the crossover cable.........................................................................................14-21 Table 14-14 Pin assignment of the 75-ohm 8 x E1 cable.................................................................................14-23 Table 14-15 Pin assignment of the 75-ohm 16 x E1 cable...............................................................................14-24 Table 14-16 Pin assignment of the 120-ohm E1 cable.....................................................................................14-27 Table 14-17 Pin assignment of the 120-ohm 16 x E1 cable.............................................................................14-29 Table 14-18 Pin assignment of the DB28 connector of the DM12..................................................................14-32 Table 14-19 Pin assignment of the V.35 DCE cable........................................................................................14-34 Table 14-20 Pin assignment of the V.35 DTE cable........................................................................................14-36 Table 14-21 Pin assignment of the V.24 DCE cable........................................................................................14-37 Table 14-22 Technical specifications of the V.24 DCE cable..........................................................................14-38 Table 14-23 Pin assignment of the V.24 DTE cable........................................................................................14-38 Table 14-24 Technical specifications of the V.24 DTE cable..........................................................................14-39 Table 14-25 Pin assignment of the X.21 DCE cable........................................................................................14-40 Table 14-26 Technical specifications of the X.21 DCE cable..........................................................................14-40 Table 14-27 Pin assignment of the X.21 DTE cable........................................................................................14-41 Table 14-28 Technical specifications of the X.12 DTE cable..........................................................................14-42 Table 14-29 Pin assignment of the RS449 DCE cable.....................................................................................14-43 Table 14-30 Specifications of the RS449 DCE cable.......................................................................................14-43 Table 14-31 Pin assignment of the RS449 DTE cable.....................................................................................14-44 Table 14-32 Specifications of the RS449 DTE 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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description Table 14-33 Pin assignment of the RS530 DCE cable.....................................................................................14-46 Table 14-34 Specifications of the RS530 DCE cable.......................................................................................14-47 Table 14-35 Pin assignment of the RS530 DTE cable.....................................................................................14-48 Table 14-36 Specifications of the RS530 DTE cable.......................................................................................14-49 Table 14-37 Pin assignment of the 120-ohm clock cable.................................................................................14-50 Table 14-38 Pin assignment of the two-channel clock transfer cable (75 ohms to 120 ohms)........................14-52 Table B-1 Labels on the equipment.....................................................................................................................B-2 Table B-2 Optical module code and type mapping table.....................................................................................B-5 Table B-3 Huawei specifications for engineering labels.....................................................................................B-7 Table C-1 Power consumption and weight of the boards....................................................................................C-1 Table D-1 Board versions that are compatible with the OptiX OSN products....................................................D-1 Table E-1 Loopbacks of the SDH boards for the OptiX OSN equipment...........................................................E-1 Table E-2 the capability of inserting the AUAIS to port.....................................................................................E-3 Table E-3 Loopbacks of the PDH boards for the OptiX OSN equipment...........................................................E-4 Table E-4 Loopbacks of the Ethernet boards for the OptiX OSN equipment.....................................................E-5 Table E-5 Loopbacks of the ATM/IMA boards for the OptiX OSN equipment.................................................E-6 Table F-1 Mapping relation between the service type and setting of the C2.......................................................F-2 Table F-2 Mapping relation between the service type and setting of the C2.......................................................F-3 Table F-3 Mapping relation between the service type and setting of the V5.......................................................F-3 Table F-4 Mapping relation between the service type and setting of the V5.......................................................F-6

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About This Document

About This Document

Overview
This document describes the equipment structure, subrack structure and board classification. This document also describes each board of different classes in details. This document helps you get the detailed information on the equipment hardware.

Product Versions
The following table lists the product versions related to this document. Product Name OptiX OSN 1500 OptiX iManager T2000 Version V100R008 V200R006C03

Intended Audience
The intended audiences of this document are:
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Network planning engineer Hardware installation engineer

Organization
This document describes the cabinet, subrack, boards and each unit of the boards in terms of the function and working principle. Chapter 1 Equipment Structure Description This chapter describes the structure of the equipment.

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Chapter 2 Cabinet

Description This chapter describes the dimensions, appearance and technical specifications of the cabinet. This chapter also describes the configuration of the equipment in each cabinet. This chapter describes the structure of the subrack. This chapter describes the classification of boards and appearance of the boards. This chapter describes the SDH processing boards in terms of the function, principle, front panel, interface and technical specifications. This chapter describes the PDH processing boards in terms of the function, principle, front panel, interface and technical specifications. This chapter describes the data processing boards in terms of the function, principle, front panel, interface and technical specifications. This chapter describes the interface boards and switching boards in terms of the function, principle, front panel, interface and technical specifications. This chapter describes the cross-connect and system control boards in terms of the function, principle, front panel, interface and technical specifications. This chapter describes the auxiliary boards in terms of the function, principle, front panel, interface and technical specifications. This chapter describes the WDM processing boards in terms of the function, principle, front panel, interface and technical specifications. This chapter describes the optical amplifier boards and dispersion compensation boards in terms of the function, principle, front panel, interface and technical specifications. This chapter describes the power interface boards in terms of the function, principle, front panel, interface and technical specifications. This chapter describes the external cables and internal cables in terms of the structure, appearance, pin assignment and technical specifications. This appendix describes the indication of the equipment and board alarm indicators.

3 Subrack 4 Board List and Classification 5 SDH Processing Boards

6 PDH Processing Boards

7 Data Processing Boards

8 Interface Boards and Switching Boards 9 Cross-Connect and System Control Boards 10 Auxiliary Boards

11 WDM Processing Boards

12 Optical Amplifier Boards and Dispersion Compensation Boards 13 Power Interface Boards

14 Cables

A Equipment and Board Alarm Indicators

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Chapter B Labels C Power Consumption and Weight of Boards D Board Version Configuration E Board Loopbacks F Board Configuration Reference G Glossary H Acronyms and Abbreviations

Description This appendix describes the safety labels, optical module labels and engineering labels. This appendix describes the power consumption and weight of each board. This appendix describes the compatibility among the product versions. This appendix describes the loopback capabilities of the boards. This appendix describes the parameters that can be configured by using the T2000. This appendix lists the terms used in this document. This appendix lists the acronyms and abbreviations used in this document.

Conventions
Symbol Conventions
The following symbols may be found in this document. They are defined as follows. Symbol Description

DANGER

Indicates a hazard with a high level of risk which, if not avoided, will result in death or serious injury. Indicates a hazard with a medium or low level of risk which, if not avoided, could result in minor or moderate injury. Indicates a potentially hazardous situation that, if not avoided, could cause equipment damage, data loss, and performance degradation, or unexpected results. Indicates a tip that may help you solve a problem or save you time. Provides additional information to emphasize or supplement important points of the main text.

WARNING

CAUTION
TIP

NOTE

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

General Conventions
Convention Times New Roman Boldface Italic Courier New Description Normal paragraphs are in Times New Roman. Names of files, directories, folders, and users are in boldface. For example, log in as user root. Book titles are in italics. Terminal display is in Courier New.

Command Conventions
Convention Boldface Italic [] { x | y | ... } [ x | y | ... ] { x | y | ... } * Description The keywords of a command line are in boldface. Command arguments are in italic. Items (keywords or arguments) in square brackets [ ] are optional. Alternative items are grouped in braces and separated by vertical bars. One is selected. Optional alternative items are grouped in square brackets and separated by vertical bars. One or none is selected. Alternative items are grouped in braces and separated by vertical bars. A minimum of one or a maximum of all can be selected.

GUI Conventions
Convention Boldface > Description Buttons, menus, parameters, tabs, window, and dialog titles are in boldface. For example, click OK. Multi-level menus are in boldface and separated by the > signs. For example, choose File > Create > Folder.

Keyboard Operation
Format Key Key 1+Key 2 Description Press the key. For example, press Enter and press Tab. Press the keys concurrently. For example, pressing Ctrl+Alt+A means the three keys should be pressed concurrently.

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About This Document

Format Key 1, Key 2

Description Press the keys in turn. For example, pressing Alt, A means the two keys should be pressed in turn.

Mouse Operation
Action Click Double-click Drag Description Select and release the primary mouse button without moving the pointer. Press the primary mouse button twice continuously and quickly without moving the pointer. Press and hold the primary mouse button and move the pointer to a certain position.

Update History
Updates between document versions are cumulative. Therefore, the latest document version contains all updates made to previous versions.

Updates in Issue 02 (2008-03-29) Based on Product Version V100R008

This document of the V100R008 version is of the second release. The updated contents are as follows. N2EGS4A, R1CXLL1, R1CXLL4, R1CXLL16, R1CXLD1, R1CXLD4, R1CXLQ1, R1CXLQ4 are added.

Updates in Issue 01 (2007-12-25) Based on Product Version V100R008

This document of the V100R008 version is of the first release.Compared with the V100R007, this version has the following new or optimized content: The N1SL1A, N1SLQ1A, N1SL4A, N1SLD4A, N1SLQ4A, Q3CXL1, Q3CXL4, Q3CXL16, N2BPA are added.

Updates in Issue 03 (2007-12-15) Based on Product Version V100R007

This document of the V100R007 version is of the third release. The updated contents are as follows.
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The N3EGS4 board is added. Several bugs are fixed.

Updates in Issue 02 (2007-09-10) Based on Product Version V100R007

This document of the V100R007 version is of the second release. The updated contents are as follows.
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About This Document

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

This release of the document fixes several bugs, adds product labels. It also checks the parameters of the dimensions and weight.

Updates in Issue 01 (2007-06-15) Based on Product Version V100R007

This document of the V100R007 version is of the first release. Compared with the V100R006, this version has the following new or optimized content:
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The N3SL16, N3SL16A, N2PQ3, N2PD3, N2PL3, N2PL3A, TN11OBU1, TN11MR2, TN11MR4, TN11CMR2, TN11CMR4 are added. Appendix E "Board Loopbacks" and Appendix F "Board Configuration Reference" are added. The structure of the board description is adjusted and optimized. First the board version is described, and then the board function and feature, working principle and signal flow, front panel, valid slots, board feature code, board configuration reference, technical specifications and so on are described.

Updates in Issue 03 (2007-03-30) Based on Product Version V100R006

The updated contents are as follows. This release of the document fixes several bugs, adds product labels. It also checks the parameters of the slots and optical interfaces. In addition, it adds the description on the N1SL64 board.

Updates in Issue 02 (2007-01-10) Based on Product Version V100R006

The updated contents are as follows. This release of the document fixes several bugs in the document of previous version. The T2000 is upgraded from V200R003C02 to V200R004C01.

Updates in Issue 01 (2006-09-20) Based on Product Version V100R006

This document of the V100R006 version is of the first release.

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1 Equipment Structure

Equipment Structure

The OptiX OSN 1500A and the OptiX OSN 1500B are both case-shaped equipment. The OptiX OSN 1500A/B subrack can be installed in a 300-mm or 600-mm ETSI cabinet, or a 19-inch cabinet. The OptiX OSN 1500A/B can also be installed against the wall. The OptiX OSN 1500A can be installed on the desk. Figure 1-1 shows the appearance of the OptiX OSN 1500A. Figure 1-1 Appearance of the OptiX OSN 1500A

Figure 1-2 shows the appearance of the OptiX OSN 1500B. Figure 1-2 Appearance of the OptiX OSN 1500B

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

2 Cabinet

2
About This Chapter
The OptiX OSN subracks are installed in the cabinets.

Cabinet

2.1 Cabinet Type The OptiX OSN 1500 subrack can be installed in a 300-mm or 600-mm ETSI cabinet, 19-inch cabinet or the cabinet used for the access network equipment. The OptiX OSN 1500 subrack can be installed against the wall. 2.2 Cabinet Configuration On the top of the ETSI cabinet, there are cabinet indicators and a DC power distribution unit (PDU). 2.3 Technical Specifications The specifications of the cabinet cover the dimensions, weight and number of allowed subracks.

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2-1

2 Cabinet

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

2.1 Cabinet Type

The OptiX OSN 1500 subrack can be installed in a 300-mm or 600-mm ETSI cabinet, 19-inch cabinet or the cabinet used for the access network equipment. The OptiX OSN 1500 subrack can be installed against the wall. The OptiX OSN 1500 can be installed in the following cabinets:
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300-mm deep ETSI cabinet 600-mm deep ETSI cabinet 19-inch cabinet Cabinet used for the access network equipment

2.2 Cabinet Configuration

On the top of the ETSI cabinet, there are cabinet indicators and a DC power distribution unit (PDU). Figure 2-1 shows where the cabinet indicators and the DC PDU are on the cabinet. Figure 2-1 ETSI cabinet
1 2
PowerCritical MajorMinor

Power distribution unit

H W D

1. Cabinet indicator

2. DC PDU

2.2.1 Cabinet Indicator The indicators on the ETSI cabinet are power supply indicators and alarm severity indicators. 2.2.2 DC PDU The DC PDU is on the top of the cabinet and used to supply power for the equipment. 2.2.3 Other Configuration
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The external case-shaped devices can be installed in the cabinet as required.

2.2.1 Cabinet Indicator

The indicators on the ETSI cabinet are power supply indicators and alarm severity indicators. Table 2-1 lists the information about the indicators on the ETSI cabinet. Table 2-1 Indicators on the ETSI cabinet Indicator Normal power supply indicator: Power (green) State Lit Unlit Critical alarm indicator: Critical (red) Lit Indication The power is supplied to the equipment. No power is supplied to the equipment. Critical alarms are generated in the equipment. No critical alarms are generated in the equipment. Major alarms are generated in the equipment. No major alarms are generated in the equipment. Minor alarms are generated in the equipment. No minor alarms are generated in the equipment.

Unlit

Major alarm indicator: Major (orange)

Lit

Unlit

Minor alarm indicator: Minor (yellow)

Lit

Unlit

CAUTION
The cabinet indicators are driven by the subrack. The cabinet indicators can be lit only after the cables are correctly connected and the subrack is powered on.

2.2.2 DC PDU
The DC PDU is on the top of the cabinet and used to supply power for the equipment. Figure 2-2 shows the appearance of the DC PDU.
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Figure 2-2 Appearance of the DC PDU

2 3 4 5

3 2 OUTPUT

A
RTN1(+) RTN2(+) NEG1(-) NEG2(-)

B
ON OFF
32A

3 2 OUTPUT

ON OFF
32A 32A 20A 20A

INPUT

32A

20A

20A

1. Power terminal (A) 3. Power cable RTN2 (+) 5. Power cable NEG2 () 7. PGND

2. Power cable RTN1 (+) 4. Power cable NEG1 () 6. Power terminal (B) 8. Power switch

For the OptiX OSN 1500A, the power terminals at side A and side B supply power to the PIU boards at side A and side B of the subrack respectively. Table 2-2 shows the connections of the power terminals at side A and side B. For the OptiX OSN 1500B, the power terminals at sides A and B supply power to the PIU boards at the upper and lower subrack respectively. Table 2-2 Connection of power terminals at side A and side B Power Terminal at Side A 1 2 3 4 Corresponding Subrack and PIU Board The PIU board at side A of the first subrack The PIU board at side A of the second subrack The PIU board at side A of the third subrack The PIU board at side A of the fourth subrack Power Terminal at Side B 1 2 3 4 Corresponding Subrack and PIU Board The PIU board at side B of the first subrack The PIU board at side B of the second subrack The PIU board at side B of the third subrack The PIU board at side B of the fourth subrack

2.2.3 Other Configuration

The external case-shaped devices can be installed in the cabinet as required.
l

UPM

The UPM numbered GIE4805S can directly supply power to the OptiX OSN 1500. The UPM directly converts the 220 V mains supply to the 48 V DC power supply required by the
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communication equipment. If operators cannot provide the 48 V DC power supply for the equipment or require that the battery be used, the UPM can be applied.
l l

COA Fiber management spool, which is used to spool the redundant fibers inside the cabinet.

2.3 Technical Specifications

The specifications of the cabinet cover the dimensions, weight and number of allowed subracks. Table 2-3 lists the technical specifications of the ETSI cabinet. Table 2-3 Technical specifications of the ETSI cabinet Dimensions (mm) 600 (W) x 300 (D) x 2000 (H) 600 (W) x 600 (D) x 2000 (H) 600 (W) x 300 (D) x 2200 (H) 600 (W) x 600 (D) x 2200 (H) 600 (W) x 300 (D) x 2600 (H) 600 (W) x 600 (D) x 2600 (H) Weight (kg) 55 79 60 84 70 94 Number of Allowed OptiX OSN 1500A/1500B Subracks The number of allowed OptiX OSN 1500A/1500B subracks varies with the cabinet capacity and the number of the power supplies.

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3
About This Chapter

Subrack

This chapter describes the cabinet in terms of the structure, capacity, slot allocation and technical specifications. 3.1 Structure The OptiX OSN 1500A subrack is of a one-layer structure. The subrack consists of the slot area for boards, power supply area, fan area and fiber routing area. The OptiX OSN 1500B subrack is of a two-layer structure. The subrack consists of the slot area for processing boards, slot area for interface boards, slot area for the auxiliary interface board, power supply area and fan area. 3.2 Capacity Both the OptiX OSN 1500A and the OptiX OSN 1500B have slots that can be divided into halfwidth slots. These slots have different service access capacities before and after the slot division. 3.3 Slot Allocation The OptiX OSN 1500A subrack has only one layer, where 12 slots are available before the division of slots. 3.4 Slot Allocation The OptiX OSN 1500B subrack has two layers. The upper layer of the subrack, where four slots are present, is the slot area for the interface boards and PIU boards. The lower layer of the subrack, where ten slots are available before the division of slots (including slots 4 and 5), is the slot area for the processing boards and auxiliary boards. 3.5 Technical Specifications The specifications of the subrack cover dimensions, weight and maximum power consumption.

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3.1 Structure
The OptiX OSN 1500A subrack is of a one-layer structure. The subrack consists of the slot area for boards, power supply area, fan area and fiber routing area. The OptiX OSN 1500B subrack is of a two-layer structure. The subrack consists of the slot area for processing boards, slot area for interface boards, slot area for the auxiliary interface board, power supply area and fan area. Figure 3-1 shows the structure of the OptiX OSN 1500A subrack. Figure 3-1 Structure of the OptiX OSN 1500A subrack

2 3 4 6 5

H W D

1. Fan area 4. Slot area for interface boards

2. Slot area for boards 5. Fiber routing area

3. Power supply area 6. Mounting ear

The functions of these areas are as follows:

l l

Slot area for boards: This area is used to house the boards for the OptiX OSN 1500A. Fan area: This area is used to house one fan module, which dissipates heat generated by the equipment. Power supply area: This area is used to house two PIU boards, which are used to supply power for the equipment. Fiber routing area: This area is used to route fibers and cables in the subrack.

Figure 3-2 shows the structure of the OptiX OSN 1500B subrack.

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Figure 3-2 Structure of the OptiX OSN 1500B subrack

4 4

H W
7 6

1. Slot area for interface boards 4. Slot area for processing boards 7. Mounting ear

2. Power supply area 5. Slot area for the auxiliary interface board

3. Fan area 6. Fiber routing area

The functions of these areas are as follows:

l

Slot area for interface boards: This area is used to house the tributary interface boards and Ethernet interface boards for the OptiX OSN 1500B. Slot area for processing boards: This area is used to house the line, tributary and Ethernet processing boards for the OptiX OSN 1500B. Fan area: This area is used to house one fan module, which dissipates heat generated by the equipment. Slot area for the auxiliary interface board: This area is used to house the auxiliary interface board, which provides alarm interfaces, orderwire phone interface, management and maintenance interface, and clock interface. Power supply area: This area is used to house two PIU boards, which are used to supply power for the equipment. Fiber routing area: This area is used to route fibers and cables in the subrack.

3.2 Capacity
Both the OptiX OSN 1500A and the OptiX OSN 1500B have slots that can be divided into halfwidth slots. These slots have different service access capacities before and after the slot division. In the OptiX OSN 1500A subrack, slots 12 and 13 can be divided into half-width slots. In the OptiX OSN 1500B subrack, slots 1113 can be divided into half-width slots. Figure 3-3 shows
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the slot access capacity of the OptiX OSN 1500A. Figure 3-4 shows the slot access capacity of the OptiX OSN 1500B. In the OptiX OSN 1500A subrack, slots 12 and 13 can be divided into half-width slots.
l l l l

When slot 12 is divided, the two half-width slots are numbered slot 2 and slot 12. When slot 13 is divided, the two half-width slots are numbered slot 3 and slot 13. When slots 12 and 13 are not divided, the access capacity of each slot is 2.5 Gbit/s. When slots 12 and 13 are divided, the access capacity of each half-width slot is 1.25 Gbit/ s.

In the OptiX OSN 1500B subrack, slots 1113 can be divided into half-width slots.
l l l l l

When slot 11 is divided, the two half-width slots are numbered slot 1 and slot 11. When slot 12 is divided, the two half-width slots are numbered slot 2 and slot 12. When slot 13 is divided, the two half-width slots are numbered slot 3 and slot 13. When slots 1113 are not divided, the access capacity of each slot is 2.5 Gbit/s. When slots 1113 are divided, the access capacity of each half-width slot is 1.25 Gbit/s.

Figure 3-3 Slot access capacity of the OptiX OSN 1500A

Slot XCS1A PIU Slot 2/12 Slot20 FAN Slot 3/13 Slot 4 Slot 5 Slot 11 PIU 2.5Gbit/s 2.5Gbit/s 2.5Gbit/s 2.5Gbit/s XCS B Slot 6 1.25Gbit/s Slot 7 1.25Gbit/s Slot 8 1.25Gbit/s Slot 9 1.25Gbit/s Slot 10 AUX

Figure 3-4 Slot access capacity of the OptiX OSN 1500B

Slot 14 Slot 15 Slot 16 Slot 17 Slot 1/11 Slot 20 FAN Slot 2/12 Slot 3/13 Slot 4 Slot 5 2.5Gbit/s 2.5Gbit/s 2.5Gbit/s 2.5Gbit/s 2.5Gbit/s Slot 19 Slot 6 Slot 7 Slot 8 Slot 9 Slot 10 PIU 622Mbit/s 622Mbit/s 622Mbit/s 622Mbit/s AUX Slot 18 PIU

3.3 Slot Allocation

The OptiX OSN 1500A subrack has only one layer, where 12 slots are available before the division of slots.
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Figure 3-5 shows the slot layout of the OptiX OSN 1500A subrack. Figure 3-5 Slot layout of the OptiX OSN 1500A subrack
Slot 1 Slot 20 FAN Slot 12 Slot 13 Slot 4 Slot 5 CXL CXL Slot 11 Slot 6 Slot 7 Slot 8 Slot 9 Slot 10 EOW AUX

Slots 12 and 13 in the OptiX OSN 1500A subrack can be divided into two half-width slots. See Figure 3-6. Figure 3-6 Slot layout of the OptiX OSN 1500A subrack after the division of slots
Slot 1 Slot 20 FAN Slot 2 Slot 3 Slot 4 Slot 5 Slot 11 Slot 12 Slot 13 CXL CXL Slot 6 Slot 7 Slot 8 Slot 9 Slot 10 EOW AUX

The slots in the OptiX OSN 1500A subrack are allocated as follows:
l l l l l l l

Slots for integrated boards of the line, SCC, cross-connect and timing units: slots 45 Slots for processing boards before the division of slots: slots 69 and 1213 Slots for processing boards after the division of slots: slots 69, 1213, and 23 Slot for the orderwire board: slot 9 (also for the processing board) Slot for the auxiliary interface board: slot 10 Slots for PIU boards: slots 1 and 11 Slots for the fan board: slot 20

Mapping Relation Between Slots for Interface Boards and Slots for Processing Boards
Table 3-1 lists the mapping relation between slots for the interface boards and slots for the processing boards of the OptiX OSN 1500A. Table 3-1 Mapping relation between slots for the interface boards and slots for the processing boards of the OptiX OSN 1500A. Slots for Processing Boards Slot 12 Slots for Interface Boards Slots 6 and 7

Boards and Their Valid Slots

Table 3-2 lists the CXL series boards and their valid slots of the OptiX OSN 1500A.
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Table 3-2 CXL series boards and their valid slots of the OptiX OSN 1500A Board Q2CXL16, Q3CXL16 R1CXLL16 Full Name 1 x STM-16 integrated board of the SCC, cross-connect, timing and line units 1 x STM-16 integrated board of the SCC, cross-connect, timing and line units 1 x STM-4 integrated board of the SCC, cross-connect, timing and line units 1 x STM-4 integrated board of the SCC, cross-connect, timing and line units 2 x STM-4 integrated board of the SCC, cross-connect, timing and line units 4 x STM-4 integrated board of the SCC, cross-connect, timing and line units 1 x STM-1 integrated board of the SCC, cross-connect, timing and line units 1 x STM-1 integrated board of the SCC, cross-connect, timing and line units 2 x STM-1 integrated board of the SCC, cross-connect, timing and line units 4 x STM-1 integrated board of the SCC, cross-connect, timing and line units Valid Slots Slots 4 and 5

Slots 4 and 5

Q2CXL4, Q3CXL4

Slots 4 and 5

R1CXLL4

Slots 4 and 5

R1CXLD4

Slots 4 and 5

R1CXLQ4

Slots 4 and 5

Q2CXL1, Q3CXL1

Slots 4 and 5

R1CXLL1

Slots 4 and 5

R1CXLD1

Slots 4 and 5

R1CXLQ1

Slots 4 and 5

NOTE a: The CXL is a board that integrates the SCC, cross-connect, timing, and line units for the OptiX OSN 1500A. It is one physical board and can be housed in slot 4 or slot 5 on the subrack. On the T2000, the Q2/ Q3CXL is displayed as ECXL, GSCC and SL1/SL4/SL16, and the R1CXL is displayed as RCXL, GSCC and SLN/SLD41/SLQ41, seated in the logical slots 8081, 8283 and 45.

Table 3-3 lists the SDH processing boards and their valid slots of the OptiX OSN 1500A.

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Table 3-3 SDH processing boards and their valid slots of the OptiX OSN 1500A Board N1SL16, N2SL16, N3SL16 Full Name 1 x STM-16 optical interface board Valid Slots Valid slots when the crossconnect capacity is 20 Gbit/s: slots 12 and 13 If the cross-connect capacity is 15 Gbit/s, these slots are unavailable. N1SL16A, N2SL16A, N3SL16A 1 x STM-16 optical interface board Valid slots when the crossconnect capacity is 20 Gbit/s: slots 12 and 13. If the cross-connect capacity is 15 Gbit/s, these slots are unavailable. N1SF16 1 x STM-16 optical interface board (with FEC) Valid slots when the crossconnect capacity is 20 Gbit/s: slots 12 and 13 If the cross-connect capacity is 15 Gbit/s, these slots are unavailable. N1SLQ4, N2SLQ4, N1SLQ4A 4 x STM-4 optical interface board Valid slots when the crossconnect capacity is 20 Gbit/s: slots 12 and 13 If the cross-connect capacity is 15 Gbit/s, these slots are unavailable. N1SLD4, N1SLD4A, N2SLD4 R1SLD4 2 x STM-4 optical interface board Slots 12 and 13

2 x STM-4 optical interface board (half-width)

Valid slots when the crossconnect capacity is 20 Gbit/s: slots 23, 69, and 1213 Valid slots when the crossconnect capacity is 15 Gbit/s: slots 1213

N1SL4, N1SL4A, N2SL4 R1SL4

1 x STM-4 optical interface board 1 x STM-4 optical interface board (half-width)

Slots 12 and 13 Valid slots when the crossconnect capacity is 20 Gbit/s: slot 2-3, 6-9, 12-13 Valid slots when the crossconnect capacity is 15 Gbit/s: slot 2, 6-8, 12-13

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Board N1SLT1

Full Name 12 x STM-1 optical interface board

Valid Slots Valid slots when the crossconnect capacity is 20 Gbit/s: slots 12 and 13 If the cross-connect capacity is 15 Gbit/s, these slots are unavailable.

N2SLO1 N1SLQ1, N1SLQ1A, N2SLQ1 R1SLQ1

8 x STM-1 optical interface board 4 x STM-1 optical interface board

Slots 12 and 13 Slots 12 and 13

4 x STM-1 optical interface board (half-width)

Valid slots when the crossconnect capacity is 20 Gbit/s: slot 2-3, 6-9, 12-13 Valid slots when the crossconnect capacity is 15 Gbit/s: slot 2, 6-8, 12-13

N1SL1, N1SL1A, N2SL1 R1SL1

1 x STM-1 optical interface board 1 x STM-1 optical interface board (half-width)

Slots 12 and 13 Valid slots when the crossconnect capacity is 20 Gbit/s: slot 2-3, 6-9, 12-13 Valid slots when the crossconnect capacity is 15 Gbit/s: slot 2, 6-8, 12-13

N1SEP1

2 x STM-1 line processing board

Slots 12 and 13

Table 3-4 lists the PDH processing boards and their valid slots of the OptiX OSN 1500A. Table 3-4 PDH processing boards and their valid slots of the OptiX OSN 1500A Board N1PL3A (not used with the interface board) N2PL3A (not used with the interface board) R1PD1(A/B) Full Name 3 x E3/T3 processing board Valid Slots Slots 12 and 13

3 x E3/T3 processing board

Slots 12 and 13

32 x E1 75-ohm/120-ohm processing board (half-width)

Slots 2 and 12

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Board R2PD1(A/B) R1PL1(A/B)

Full Name 32 x E1 75-ohm/120-ohm processing board (half-width ) 16 x E1 75-ohm/120-ohm processing board (half-width)

Valid Slots Slots 2 and 12 Valid slots when the crossconnect capacity is 20 Gbit/s: slot 6-9 Valid slots when the crossconnect capacity is 15 Gbit/s: slot 6-8

N1DXA

DDN service convergence and processing board

Slots 12 and 13

Table 3-5 lists the interface boards and their valid slots of the OptiX OSN 1500A. Table 3-5 Interface Boards and their valid slots of the OptiX OSN 1500A Board R1L75S R1L12S Full Name 16 x EI 75-ohm interface board (half-width) 16 x E1 120-ohm interface board (half-width) Valid Slots Slots 6 and 7 Slots 6 and 7

Table 3-6 lists the data processing boards and their valid slots of the OptiX OSN 1500A. Table 3-6 Data processing boards and their valid slots of the OptiX OSN 1500A Board N1EMS4 Full Name 4 x GE Ethernet processing board with Lanswitch Valid Slots Valid slots when the crossconnect capacity is 20 Gbit/s: slot 12-13 (2.5 Gbit/s) Valid slots when the crossconnect capacity is 15 Gbit/s: slot 12-13 (1.25 Gbit/s) N2EGS2 2 x GE Ethernet processing board with Lanswitch Valid slots when the crossconnect capacity is 20 Gbit/s: slot 12-13 (2.5 Gbit/s) Valid slots when the crossconnect capacity is 15 Gbit/s: slot 12-13 (1.25 Gbit/s)

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Board N1EGS4

Full Name 4 x GE Ethernet processing board with Lanswitch

Valid Slots Valid slots when the crossconnect capacity is 20 Gbit/s: slot 12-13 (2.5 Gbit/s) Valid slots when the crossconnect capacity is 15 Gbit/s: slot 12-13 (1.25 Gbit/s)

N3EGS4

4 x GE Ethernet processing board with Lanswitch

Valid slots when the crossconnect capacity is 20 Gbit/s: slot 12-13 (2.5 Gbit/s) Valid slots when the crossconnect capacity is 15 Gbit/s: slot 12-13 (1.25 Gbit/s)

N2EGS4A

4 x GE Ethernet processing board with Lanswitch

Valid slots when the crossconnect capacity is 20 Gbit/s: slot 12-13 (2.5 Gbit/s) Valid slots when the crossconnect capacity is 15 Gbit/s: slot 12-13 (1.25 Gbit/s)

N1EGT2

2 x GE Ethernet transparent transmission board

Valid slots when the crossconnect capacity is 20 Gbit/s: slot 12-13 (2.5 Gbit/s) Valid slots when the crossconnect capacity is 15 Gbit/s: slot 12-13 (1.25 Gbit/s)

N1EFS4 N2EFS4 R1EFT4

4 x FE Ethernet processing board with Lanswitch 4 x FE Ethernet processing board with Lanswitch 4 x FE Ethernet transparent transmission board (half-width)

Slots 12 and 13 Slots 12 and 13 (1.25 Gbit/s) Valid slots when the crossconnect capacity is 20 Gbit/s: slot 23, 69 and 1213 (622 Mbit/s) Valid slots when the crossconnect capacity is 15 Gbit/s: slot 2, 68 and 1213 (622 Mbit/s)

N1EFT8 (not used with the interface board) N1EFT8A

8 x FE Ethernet transparent transmission board 8 x FE transparent transmission board (interfaces are available on the front panel)

Slots 1213 (622 Mbit/s)

Slots 12 and 13 (622 Mbit/s)

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Board N2EGR2

Full Name 2 x GE Ethernet ring processing board

Valid Slots Valid slots when the crossconnect capacity is 20 Gbit/s: slot 12-13 (2.5 Gbit/s) Valid slots when the crossconnect capacity is 15 Gbit/s: slot 12-13 (1.25 Gbit/s)

N2EMR0 (not used with the interface board)

1 x GE and 4 x FE Ethernet processing board

Valid slots when the crossconnect capacity is 20 Gbit/s: slot 12-13 (2.5 Gbit/s) Valid slots when the crossconnect capacity is 15 Gbit/s: slot 12-13 (1.25 Gbit/s)

N1ADL4 N1ADQ1 N1IDL4 N1IDQ1 N1MST4

1 x STM-4 ATM processing board 4 x STM-1 ATM processing board 1 x STM-4 IMA processing board 4 x STM-1 IMA processing board 4-channel multiservice (SAN or video service) transparent transmission board

Slots 12 and 13 (1.25 Gbit/s) Slots 12 and 13 (1.25 Gbit/s) Slots 12 and 13 (1.25 Gbit/s) Slots 12 and 13 (1.25 Gbit/s) Valid slots when the crossconnect capacity is 20 Gbit/s: slot 12-13 (2.5 Gbit/s) Valid slots when the crossconnect capacity is 15 Gbit/s: slot 12-13 (1.25 Gbit/s)

Table 3-7 lists the WDM boards and their valid slots of the OptiX OSN 1500A. Table 3-7 WDM boards and their valid slots of the OptiX OSN 1500A Board N1LWX TN11OBU1 N1FIB N1MR2A N1MR2B TN11MR2 Full Name Arbitrary rate access board Optical booster amplifier board Filter isolating board Arbitrary two-wavelength add/ drop board (processing board) Arbitrary two-wavelength add/ drop board (half-width) 2-channel optical add/drop multiplexing board
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Valid Slots Slots 12 and 13 Slots 12 and 13 Slots 12 and 13 Slots 12 and 13 slot 2-3, 69 and 1213 (622 Mbit/s) Slots 12 and 13

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Board TN11MR4 TN11CMR2 TN11CMR4

Full Name 4-channel optical add/drop multiplexing board 2-channel CWDM optical add/ drop multiplexing board 4-channel CWDM optical add/ drop multiplexing board

Valid Slots Slots 12 and 13 Slots 12 and 13 Slots 12 and 13

Table 3-8 lists the optical booster amplifier boards and their valid slots of the OptiX OSN 1500A. Table 3-8 Optical booster amplifier boards and their valid slots of the OptiX OSN 1500A Board N1BA2 N1BPA, N2BPA 61COA, 62COA, N1COA ROP Full Name 2-channel optical booster amplifier board 1-channel amplifier and 1channel preamplifier board COA board Single wavelength long-haul board (remote pumping) Valid Slots Slots 12 and 13 Slots 12 and 13 Slots 101 and 102 Slot 103 (external)

Table 3-9 lists the auxiliary boards and their valid slots of the OptiX OSN 1500A. Table 3-9 Auxiliary boards and their valid slots of the OptiX OSN 1500A Board R1AMU R1AUX R2AUX R1PIUA R1FAN R1EOW UPMa Full Name Orderwire processing or alarm concatenation board System auxiliary processing unit System auxiliary processing unit PIU board Fan board Orderwire communication board Uninterruptable power module Valid Slots Slot 9 Slot 10 Slot 10 Slots 1 and 11 Slot 20 Slot 9 Slot 50

a: The UPM is in case shape. On the T2000, it is displayed as CAU board seated in the logical slot 50.

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3.4 Slot Allocation

The OptiX OSN 1500B subrack has two layers. The upper layer of the subrack, where four slots are present, is the slot area for the interface boards and PIU boards. The lower layer of the subrack, where ten slots are available before the division of slots (including slots 4 and 5), is the slot area for the processing boards and auxiliary boards. Figure 3-7 shows the slot layout of the OptiX OSN 1500B subrack. Figure 3-7 Slot layout of the OptiX OSN 1500B subrack
Slot 14 Slot 15 Slot 16 Slot 17 Slot 11 Slot 20 FAN Slot 12 Slot 13 Slot 4 Slot 5 CXL CXL Slot 18 PIU

Slot 19 Slot 6 Slot 7 Slot 8 Slot 9 Slot 10

PIU

EOW AUX

Slots 11-13 in the OptiX OSN 1500B subrack can be divided. As shown in Figure 3-8, the divided slots are in the dashed area. The slots in the left portion of the original slots are slots 1-3, and the slots in the right portion of the original slots are slots 11-13. Figure 3-8 Slot layout of the OptiX OSN 1500B subrack (after the division of slots)
Slot 14 Slot 15 Slot 16 Slot 17 Slot 1 Slot 20 FAN Slot 2 Slot 3 Slot 4 Slot 5 Slot 11 Slot 12 Slot 13 CXL CXL Slot 18 PIU

Slot 19 Slot 6 Slot 7 Slot 8 Slot 9 Slot 10

PIU

EOW AUX

The slots in the OptiX OSN 1500B subrack are allocated as follows:
l l l l l l l

Slots for integrated boards of the line, SCC, cross-connect and timing units: slots 4-5 Slots for processing boards before the division of slots: slots 6-9 and 11-13 Slots for processing boards after the division of slots: slots 1-9 and 11-13 Slots for the interface boards: slots 14-17 Slot for the orderwire board: slot 9 (also for the processing board) Slot for the auxiliary interface board: slot 10 Slots for PIU boards: slots 18 and 19
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Slot for the fan board: slot 20

Mapping Relation Between Slots for Interface Boards and Slots for Processing Boards
Table 3-10 lists the mapping relation between slots for the interface boards and slots for the processing boards of the OptiX OSN 1500B. Table 3-10 Mapping relation between slots for the interface boards and slots for the processing boards of the OptiX OSN 1500B. Slots for Processing Boards Slot 2 Slot 7 Slot 12 Slots for Interface Boards Slot 14 Slot 15 Slots 14 and 15 Slots for Processing Boards Slot 3 Slot 8 Slot 13 Slots for Interface Boards Slot 16 Slot 17 Slots 16 and 17

The corresponding interface boards of the PD3, PL3, SEP, and SPQ4 can be housed only in slots of even numbers. For the OptiX OSN 1500B, the boards housed in slots 12 and 7 share the same interface board housed in slot 15, and the boards housed in slots 13 and 8 share the same interface board housed in slot 17. Therefore, when you configure the boards, ensure the following:
l

If slot 12 houses the N1EMS4 (used with an interface board) or R1PD1, slot 7 cannot house any board used with an interface board. If slot 13 houses the N1EMS4 (used with an interface board) or R1PD1, slot 8 cannot house any board used with an interface board.

Boards and Their Valid Slots

Table 3-11 lists the CXL series boards and their valid slots for the OptiX OSN 1500B. Table 3-11 CXL series boards and their valid slots for the OptiX OSN 1500B Board Q2CXL16, Q3CXL16 R1CXLL16 Q2CXL4, Q3CXL4 R1CXLL4 Full Name 1 x STM-16 integrated board of the SCC, cross-connect, timing and line units 1 x STM-16 integrated board of the SCC, cross-connect, timing and line units 1 x STM-4 integrated board of the SCC, crossconnect, timing and line units 1 x STM-4 integrated board of the SCC, crossconnect, timing and line units
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Valid Slots Slots 4 and 5 Slots 4 and 5 Slots 4 and 5 Slots 4 and 5

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Board R1CXLD4 R1CXLQ4 Q2CXL1, Q3CXL1 R1CXLL1 R1CXLD1 R1CXLQ1

Full Name 2 x STM-4 integrated board of the SCC, crossconnect, timing and line units 4 x STM-4 integrated board of the SCC, crossconnect, timing and line units 1 x STM-1 integrated board of the SCC, crossconnect, timing and line units 1 x STM-1 integrated board of the SCC, crossconnect, timing and line units 2 x STM-1 integrated board of the SCC, crossconnect, timing and line units 4 x STM-1 integrated board of the SCC, crossconnect, timing and line units

Valid Slots Slots 4 and 5 Slots 4 and 5 Slots 4 and 5 Slots 4 and 5 Slots 4 and 5 Slots 4 and 5

NOTE a: The CXL is a board that integrates the SCC, cross-connect, timing, and line units for the OptiX OSN 1500B. It is one physical board and can be housed in slot 4 or slot 5 on the subrack. On the T2000, the Q2/ Q3CXL is displayed as ECXL, GSCC and SL1/SL4/SL16, and the R1CXL is displayed as RCXL, GSCC and SLN/SLD41/SLQ41, seated in the logical slots 8081, 8283 and 45.

Table 3-12 lists the SDH processing boards and their valid slots for the OptiX OSN 1500B. Table 3-12 SDH processing boards and their valid slots for the OptiX OSN 1500B Board N1SL16, N2SL16, N3SL16 Full Name 1 x STM-16 optical interface board Valid Slots Valid slots if the cross-connect capacity is 20 Gbit/s: slots 11-13 If the cross-connect capacity is 15 Gbit/s, these slots are unavailable. N1SL16A, N2SL16A, N3SL16A 1 x STM-16 optical interface board Valid slots if the cross-connect capacity is 20 Gbit/s: slots 11-13 If the cross-connect capacity is 15 Gbit/s, these slots are unavailable. 1 x STM-16 outband optical interface board (with FEC) Valid slots if the cross-connect capacity is 20 Gbit/s: slots 11-13 If the cross-connect capacity is 15 Gbit/s, these slots are unavailable.

N1SF16

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Board N1SLQ4, N1SLQ4A, N2SLQ4

Full Name 4 x STM-4 optical interface board

Valid Slots Valid slots if the cross-connect capacity is 20 Gbit/s: slots 11-13 If the cross-connect capacity is 15 Gbit/s, these slots are unavailable.

N1SLD4, N2SLD4A, N2SLD4

2 x STM-4 optical interface board

Valid slots if the cross-connect capacity is 20 Gbit/s: slots 11-13 Valid slots if the cross-connect capacity is 15 Gbit/s: slots 12-13

N1SL4, N1SL4A, N2SL4 R1SLD4

1 x STM-4 optical interface board 2 x STM-4 optical interface board (half-width)

Slots 11-13 Valid slots if the cross-connect capacity is 20 Gbit/s: slots 1-3, 11-13 (up to two optical interfaces can be configured), slots 6-9 (one optical interfaces can be configured). Valid slots if the cross-connect capacity is 15 Gbit/s: slot 11 (one optical interfaces can be configured), slots 12-13 (up to two optical interfaces can be configured).

R1SL4

1 x STM-4 optical interface board (half-width)

Valid slots if the cross-connect capacity is 20 Gbit/s: slots 1-3, 6-9, 11-13 Valid slots if the cross-connect capacity is 15 Gbit/s: slots 6-8, 11-13

N1SLT1

12 x STM-1 optical interface board

Valid slots if the cross-connect capacity is 20 Gbit/s: slots 11-13 If the cross-connect capacity is 15 Gbit/s, these slots are unavailable.

N2SLO1

8 x AU-3 high density access board

Valid slots if the cross-connect capacity is 20 Gbit/s: slots 11-13 Valid slots if the cross-connect capacity is 15 Gbit/s: slots 12-13

N1SLQ1, N1SLQ1A, N2SLQ1 N1SL1, N1SL1A, N2SL1

4 x STM-1 optical interface board

Slots 11-13

1 x STM-1 optical interface board

Slots 11-13

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Board R1SLQ1

Full Name 4 x STM-1 optical interface board (half-width)

Valid Slots Valid slots if the cross-connect capacity is 20 Gbit/s: slots 1-3, 6-9, 11-13 Valid slots if the cross-connect capacity is 15 Gbit/s: slots 6-8, 11-13

R1SL1

1 x STM-1 optical interface board (half-width)

Valid slots if the cross-connect capacity is 20 Gbit/s: slots 1-3, 6-9, 11-13 Valid slots if the cross-connect capacity is 15 Gbit/s: slots 6-8, 11-13

N1SEP (used with the interface board)a N1SEP1 (not used with the interface board)a

8 x STM-1 (e) processing board 2 x STM-1 (e) processing board

Slots 1213 Slots 1113

a: The SEP1 board is displayed as the SEP1 or SEP on the T2000, depending on the interfacing mode of the board. When the SEP1 provides interfaces on the front panel, it is displayed as the SEP1 on the T2000. When the SEP1 is used with an interface board, it is displayed as the SEP on the T2000.

Table 3-13 lists the PDH processing boards and their valid slots for the OptiX OSN 1500B. Table 3-13 PDH processing boards and their valid slots for the OptiX OSN 1500B Board N1SPQ4 N2SPQ4 (used with the interface board) R1PL1(A/B) (interfaces available on the front panel) N2PQ3 N1PD3 N2PD3 N2PL3 Full Name 4 x E4/STM-1 processing board 4 x E4/STM-1 processing board 16 x E1 75-ohm/120-ohm interface and processing board 12 x E3/T3 processing board 6 x E3/T3 processing board 6 x E3/T3 processing board 3 x E3/T3 processing board Valid Slots Slots 12 and 13 Slots 12 and 13 Slots 69

Slots 12 and 13 Slots 12 and 13 Slots 12 and 13 Slots 12 and 13

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Board N1PL3A (not used with the interface board) N2PL3A (not used with the interface board) N1PL3 N1PQ1(A/B) N2PQ1(A/B) R1PD1(A/B)

Full Name 3 x E3/T3 processing board

Valid Slots Slots 1113

3 x E3/T3 processing board

Slots 1113

3 x E3/T3 processing board 63 x E1 75-ohm/120-ohm processing board 63 x E1 75-ohm/120-ohm processing board 32 x E1 75-ohm/120-ohm processing board (half-width)

Slots 12 and 13 Slots 1113 Slots 1113 Valid slots if the cross-connect capacity is 20 Gbit/s: slots 1-3, 6-8, 11-13 Valid slots if the cross-connect capacity is 15 Gbit/s: slots 6-8, 11-13

R2PD1(A/B)

32 x E1 75-ohm/120-ohm processing board (half-width)

Valid slots if the cross-connect capacity is 20 Gbit/s: slots 1-3, 6-8, 11-13 Valid slots if the cross-connect capacity is 15 Gbit/s: slots 6-8, 11-13

N1PQM N1DX1 N1DXA

63 x E1/T1 processing board DDN service access and convergence board DDN service convergence and processing board

Slots 1113 Slots 11-13 Slots 11-13

Table 3-14 lists the interface boards or protection switching boards and their valid slots for the OptiX OSN 1500B. Table 3-14 Interface/protection switching boards and their valid slots for the OptiX OSN 1500B Board N1EU08 N1OU08 N2OU08 Full Name 8 x STM-1 (e) electrical interface board 8 x STM-1 optical interface board 8 x STM-1 optical interface board Valid Slots Slots 14 and 16 Slots 14 and 16 Slots 14 and 16

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Board N1EU04 N1MU04 N1C34S N1D34S N1D75S N1D12S N1D12B N1DM12 N1TSB8 N1TSB4 N1ETF8 N1EFF8 N1ETS8

Full Name 4 x STM-1 (e) electrical interface board 4 x E4/STM-1 interface board 3 x 34M/45M electrical interface switching board 6 x 34M/45M electrical interface switching board 32 x E1/T1 75-ohm electrical interface switching board 32 x E1/T1 120-ohm electrical interface switching board 32 x E1/T1 120-ohm electrical interface board DDN service interface board 8-channel electrical interface switching board 4-channel electrical interface switching board 8 x FE Ethernet electrical interface board 8-channel Ethernet optical interface board 8 x 10/100M Ethernet twisted pair interface switching board

Valid Slots Slots 14 and 16 Slots 14 and 16 Slots 14 and 16 Slots 1417 Slots 14-17 Slots 14-17 Slots 14-17 Slots 14-17 Slots 14 and 15 Slot 14 Slots 1417 Slots 1417 Slots 14 and 16

Table 3-15 lists the data processing boards and their valid slots for the OptiX OSN 1500B. Table 3-15 Data processing boards and their valid slots for the OptiX OSN 1500B Board N1EMS4 (used with the interface board) Full Name 4 x GE and 16 x FE Ethernet processing board with Lanswitch Valid Slots Valid slots if the cross-connect capacity is 20 Gbit/s: slots 12-13 (2.5 Gbit/s) Valid slots if the cross-connect capacity is 15 Gbit/s: slots 12-13 (1.25 Gbit/s)

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Board N1EMS4 (not used with the interface board)

Full Name 4 x GE Ethernet processing board with Lanswitch

Valid Slots Valid slots if the cross-connect capacity is 20 Gbit/s: slots 11-13 (2.5 Gbit/s) Valid slots if the cross-connect capacity is 15 Gbit/s: slot 11 (622 Mbit/s), slots 12-13 (1.25 Gbit/s)

N1EGS4

4 x GE Ethernet processing board with Lanswitch

Valid slots if the cross-connect capacity is 20 Gbit/s: slots 11-13 (2.5 Gbit/s) Valid slots if the cross-connect capacity is 15 Gbit/s: slot 11 (622 Mbit/s), slots 12-13 (1.25 Gbit/s)

N3EGS4

4 x GE Ethernet processing board with Lanswitch

Valid slots if the cross-connect capacity is 20 Gbit/s: slots 11-13 (2.5 Gbit/s) Valid slots if the cross-connect capacity is 15 Gbit/s: slot 11 (622 Mbit/s), slots 12-13 (1.25 Gbit/s)

N2EGS4A

4 x GE Ethernet processing board with Lanswitch

Valid slots if the cross-connect capacity is 20 Gbit/s: slots 11-13 (2.5 Gbit/s) Valid slots if the cross-connect capacity is 15 Gbit/s: slot 11 (622 Mbit/s), slots 12-13 (1.25 Gbit/s)

N2EGS2

2 x GE Ethernet processing board with Lanswitch

Valid slots if the cross-connect capacity is 20 Gbit/s: slots 11-13 (2.5 Gbit/s) Valid slots if the cross-connect capacity is 15 Gbit/s: slots 11 (622 Mbit/s), 12-13 (1.25 Gbit/s)

N1EGT2

2 x GE Ethernet transparent transmission board

Valid slots if the cross-connect capacity is 20 Gbit/s: slots 11-13 (2.5 Gbit/s) Valid slots if the cross-connect capacity is 15 Gbit/s: slots 11 (622 Mbit/s), 12-13 (1.25 Gbit/s)

N1EFS4

4 x FE Ethernet processing board with Lanswitch

Slots 1113

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Board N2EFS4

Full Name 4 x FE Ethernet processing board with Lanswitch

Valid Slots Valid slots if the cross-connect capacity is 20 Gbit/s: slots 11-13 (1.25 Gbit/s) Valid slots if the cross-connect capacity is 15 Gbit/s: slot 11 (622 Mbit/s), slots 12-13 (1.25 Gbit/s)

N1EFS0 (used with the interface board) N2EFS0 (used with the interface board) N4EFS0 (used with the interface board)

8 x FE Ethernet processing board with Lanswitch 8 x FE Ethernet processing board with Lanswitch 8 x FE Ethernet processing board with Lanswitch

Slots 1213 (622 Mbit/s) Slots 1213 (1.25 Gbit/s) Valid slots if the cross-connect capacity is 20 Gbit/s: slots 11-13 (1.25 Gbit/s) Valid slots if the cross-connect capacity is 15 Gbit/s: slot 11 (622 Mbit/s), slots 12-13 (1.25 Gbit/s)

N1EFT8 (not used with the interface board) N1EFT8 (used with the interface board) N1EFT8A (interfaces available on the front panel) N2EGR2

8 x 10M/100M Ethernet transparent transmission board 16 x 10M/100M Ethernet transparent transmission board 8 x FE transparent transmission board 2 x GE Ethernet ring processing board

Slots 1113 (622 Mbit/s)

Slots 12 and 13 (1.25 Gbit/s) Slots 1113 (622 Mbit/s)

Valid slots if the cross-connect capacity is 20 Gbit/s: slots 11-13 (2.5 Gbit/s) Valid slots if the cross-connect capacity is 15 Gbit/s: slot 11 (622 Mbit/s), slot 12-13 (1.25 Gbit/s)

N2EMR0 (used with the interface board)

1 x GE and 12 x FE Ethernet processing board

Valid slots if the cross-connect capacity is 20 Gbit/s: slots 12-13 (2.5 Gbit/s) Valid slots if the cross-connect capacity is 15 Gbit/s: slot 12-13 (1.25 Gbit/s)

N2EMR0 (not used with the interface board)

1 x GE and 4 x FE Ethernet processing board

Valid slots if the cross-connect capacity is 20 Gbit/s: slots 11-13 (2.5 Gbit/s) Valid slots if the cross-connect capacity is 15 Gbit/s: slot 11 (622 Mbit/s), slots 12-13 (1.25 Gbit/s)

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Board R1EFT4 (interfaces available on the front panel)

Full Name 4 x FE processing board

Valid Slots Valid slots if the cross-connect capacity is 20 Gbit/s: slots 1-3, 6-9, 11-13 (622 Gbit/s) Valid slots if the cross-connect capacity is 15 Gbit/s: slots 6-8, 11-13 (622 Gbit/s)

N1EFF8 N1ETS8 N1MST4

8-channel Ethernet optical interface board 8 x 10/100M Ethernet twisted pair interface switching board 4-channel multiservice transparent transmission board

Slots 1417 Slots 14 and 16 Valid slots if the cross-connect capacity is 20 Gbit/s: slots 11-13 (2.5 Gbit/s) Valid slots if the cross-connect capacity is 15 Gbit/s: slots 11 (622 Mbit/s), 12-13 (1.25 Gbit/s)

N1ADQ1

4 x STM-1 ATM processing board

Valid slots if the cross-connect capacity is 20 Gbit/s: slots 11-13 (1.25 Gbit/s) Valid slots if the cross-connect capacity is 15 Gbit/s: slot 11 (622 Mbit/s), slots 12-13 (1.25 Gbit/s)

N1ADL4

1 x STM-4 ATM processing board

Valid slots if the cross-connect capacity is 20 Gbit/s: slots 11-13 (1.25 Gbit/s) Valid slots if the cross-connect capacity is 15 Gbit/s: slot 11 (622 Mbit/s), slots 12-13 (1.25 Gbit/s)

N1IDQ1

4 x STM-1 IMA processing board

Valid slots if the cross-connect capacity is 20 Gbit/s: slots 11-13 (1.25 Gbit/s) Valid slots if the cross-connect capacity is 15 Gbit/s: slots 12-13 (1.25 Gbit/s)

N1IDL4

1 x STM-4 IMA processing board

Valid slots if the cross-connect capacity is 20 Gbit/s: slots 11-13 (1.25 Gbit/s) Valid slots if the cross-connect capacity is 15 Gbit/s: slots 12-13 (1.25 Gbit/s)

Table 3-16 lists the WDM boards and their valid slots for the OptiX OSN 1500B.
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Table 3-16 WDM boards and their valid slots for the OptiX OSN 1500B Board N1LWX N1MR2A N1MR2B N1MR2C TN11MR2 TN11MR4 TN11CMR2 TN11CMR4 Full Name Arbitrary rate access board Arbitrary two-wavelength add/ drop board Arbitrary two-wavelength add/ drop board (half-width) Arbitrary two-wavelength add/ drop board 2-channel optical add/drop multiplexing board 4-channel optical add/drop multiplexing board 2-channel CWDM optical add/ drop multiplexing board 4-channel CWDM optical add/ drop multiplexing board Valid Slots Slots 1113 Slots 1113 Slots 13, 69 and 1113 Slots 1417 Slots 1113 Slots 1113 Slots 1113 Slots 1113

Table 3-17 lists the optical booster amplifier boards and their valid slots for the OptiX OSN 1500B. Table 3-17 Optical booster amplifier boards and their valid slots for the OptiX OSN 1500B Board N1BA2 N1BPA, N2BPA TN11OBU1 N1FIB 61COA, 62COA, N1COA ROP Full Name 2-channel optical booster amplifier board Optical booster preamplifier board Optical booster amplifier board Filter isolating board COA board Single wavelength long-haul board (remote pumping) Valid Slots Slots 1113 Slots 1113 Slots 1113 Slots 12 and 13 Slots 101102 Slot 103 (external)

Table 3-18 lists the auxiliary boards and their valid slots for the OptiX OSN 1500B.

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Table 3-18 Auxiliary boards and their valid slots for the OptiX OSN 1500B Board R1AMU R1AUX R2AUX R1FAN R1EOW R1PIU UPMa Full Name Orderwire processing or alarm concatenation board System auxiliary processing unit System auxiliary interface board Fan board Orderwire communication board PIU board Uninterruptable power module Valid Slots Slot 9 Slot 10 Slot 10 Slot 20 Slot 9 Slots 1819 Slot 50

a: The UPM is in case shape. On the T2000, it is displayed as CAU board seated in the logical slot 50.

3.5 Technical Specifications

The specifications of the subrack cover dimensions, weight and maximum power consumption. Table 3-19 lists the technical specifications of the OptiX OSN 1500A subrack. Table 3-19 Technical specifications of the OptiX OSN 1500A subrack Dimensions (mm) 444 (W) x 262 (D) x 131 (H) Weight (kg) 8 (the backplane, fans and two PIU boards included)

Table 3-20 lists power consumption of the OptiX OSN 1500A subrack. Table 3-20 Maximum power consumption of the OptiX OSN 1500A subrack Subrack Type OptiX OSN 1500A general subrack Maximum Power Consumption 200 W Fuse Capacity 20 A

Table 3-21 lists the technical specifications of the OptiX OSN 1500B subrack.

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Table 3-21 Technical specifications of the OptiX OSN 1500B subrack Dimensions (mm) 444 (W) x 263 (D) x 221 (H) Weight (kg) 9 (the backplane, fans and two PIU boards included)

Table 3-22 lists power consumption of the OptiX OSN 1500B subrack. Table 3-22 Maximum power consumption of the OptiX OSN 1500B subrack Subrack Type OptiX OSN 1500B general subrack Maximum Power Consumption 280 W Fuse Capacity 20 A

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4
About This Chapter

Board List and Classification

This chapter describes the appearance, barcode and classification of boards used for the OptiX OSN systems. 4.1 Appearance and Dimensions of Boards Different boards have different appearance and dimensions. 4.2 Description of the Barcode on the Board The barcode on the front panel of the board indicates the board version, name and board features. 4.3 Board Classification By function, the boards can be classified into SDH processing boards, PDH processing boards, data processing boards, WDM processing boards and auxiliary boards.

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4.1 Appearance and Dimensions of Boards

Different boards have different appearance and dimensions. Table 4-1 lists the appearance figures and dimensions of boards for the OptiX OSN 1500. Table 4-1 Appearance and dimensions of boards for the OptiX OSN 1500 Item Board appearance Appearance and Dimensions

Board classificatio n Height (mm) Depth (mm) Width (mm)

Integrated board of the SCC, cross-connect and line units (CXL) 262.05 220 25.4

Board housed in a divided slot (PD1/PIUA/AUX/ EOW) 111.8 220 25.4

Service interface board (D75S, for example) 262.05 110 22

H D W

Note: The figure in the right cell illustrates the three dimensions. The height and width are measured for the front panel and the depth is measured for the printed circuit board (PCB).

CAUTION
Wear the anti-static wrist strap when holding the board with hands. Make sure that the anti-static wrist strap is well grounded. Otherwise, the static discharge may cause damage to the board.

DANGER
Avoid direct eye exposure to laser beams launched from the optical interface board or optical interfaces. Otherwise, damage may be caused to the eyes.

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CAUTION
l

Do not directly insert the attenuators into the level optical modules. If the attenuators are required, use the attenautors at the ODF side. If a board requires an attenuator, insert the attenuator in the IN interface instead of the OUT interface. When performing the loopback, use attenuators to prevent damage to the optical modules.

4.2 Description of the Barcode on the Board

The barcode on the front panel of the board indicates the board version, name and board features. Two types of barcodes are used for the boards of the OptiX OSN 1500.
l l

16-character manufacturing code + board version + board name + board feature code 20-character manufacturing code + board version + board name + board feature code

The barcode is stuck on the front panel of a board. Figure 4-1 shows a barcode with 16-character manufacturing code. Figure 4-1 Barcode of a board

Bar code

0364401055000015 -SSN3SL16A01

Last 6-character serial code of BOM Internal code Board version Board name 5 Board feature code

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NOTE

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

For details on the board feature code, see the section that describes the board feature code for each board.

4.3 Board Classification

By function, the boards can be classified into SDH processing boards, PDH processing boards, data processing boards, WDM processing boards and auxiliary boards. 4.3.1 SDH Processing Boards The OptiX OSN 1500 supports the SDH processing boards at the STM-16, STM-4 and STM-1 levels. 4.3.2 PDH Processing Boards The OptiX OSN 1500 supports PDH processing boards at different rates and of different impedance. 4.3.3 Data Processing Boards The OptiX OSN 1500 supports data processing boards with the transparent transmission, switching or RPR function. 4.3.4 Interface Boards and Switching Boards The OptiX OSN 1500 supports the optical interface boards, electrical interface boards and switching boards. 4.3.5 Cross-Connect Boards and SCC Boards The OptiX OSN 1500 supports the integrated boards of the cross-connect, SCC and line units at different rates. 4.3.6 Auxiliary Boards The OptiX OSN 1500 supports auxiliary boards such as the system auxiliary interface boards and fan boards. 4.3.7 WDM Processing Boards The OptiX OSN 1500 supports WDM processing boards such as the optical add/drop multiplexing boards and optical power amplifier boards. 4.3.8 Optical Amplifier Boards and Dispersion Compensation Board The OptiX OSN 1500 supports several optical booster amplifier boards. 4.3.9 Power Interface Boards The OptiX OSN 1500A supports the UPM and R1PIUA. The OptiX OSN 1500B supports the UPM and R1PIU.

4.3.1 SDH Processing Boards

The OptiX OSN 1500 supports the SDH processing boards at the STM-16, STM-4 and STM-1 levels. Table 4-2 lists the SDH processing boards supported by the OptiX OSN 1500A. Table 4-2 SDH processing boards for the OptiX OSN 1500A Board N1SL16
4-4

Full Name 1 x STM-16 optical interface board

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Board N2SL16 N3SL16 N1SL16A N2SL16A N3SL16A N1SF16 N1SL4(A) N2SL4 R1SL4 N1SLQ4(A) N2SLQ4 N1SLD4(A) N2SLD4 R1SLD4 N1SLT1 N1SLQ1(A) N2SLQ1 R1SLQ1 N1SL1(A) N2SL1 R1SL1 N1SEP1 N2SLO1

Full Name 1 x STM-16 optical interface board 1 x STM-16 optical interface board 1 x STM-16 optical interface board 1 x STM-16 optical interface board 1 x STM-16 optical interface board 1 x STM-16 optical interface board (with FEC) 1 x STM-4 optical interface board 1 x STM-4 optical interface board 1 x STM-4 optical interface board (half-width) 1 x STM-4 optical interface board 4 x STM-4 optical interface board 2 x STM-4 optical interface board 2 x STM-4 optical interface board 2 x STM-4 optical interface board (half-width) 12 x STM-1 optical interface board 4 x STM-1 optical interface board 4 x STM-1 optical interface board 4 x STM-1 optical interface board (half-width) 1 x STM-1 optical interface board 1 x STM-1 optical interface board 1 x STM-1 optical interface board (half-width) 2 x STM-1 line processing board when interfaces are available on the front panel 8 x STM-1 optical interface board

Table 4-3 lists the SDH processing boards supported by the OptiX OSN 1500B. Table 4-3 SDH processing boards for the OptiX OSN 1500B Board N1SL16 N2SL16
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Full Name 1 x STM-16 optical interface board 1 x STM-16 optical interface board
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Board N3SL16 N1SL16A N2SL16A N3SL16A N1SF16 N1SL4(A) N2SL4 R1SL4 N1SLQ4(A) N2SLQ4 N1SLD4(A) N2SLD4 R1SLD4 N1SLT1 N1SLQ1(A) N2SLQ1 R1SLQ1 N1SL1(A) N2SL1 R1SL1 N1SEP1

Full Name 1 x STM-16 optical interface board 1 x STM-16 optical interface board 1 x STM-16 optical interface board 1 x STM-16 optical interface board 1 x STM-16 optical interface board (with FEC) 1 x STM-4 optical interface board 1 x STM-4 optical interface board 1 x STM-4 optical interface board (half-width) 4 x STM-4 optical interface board 4 x STM-4 optical interface board 2 x STM-4 optical interface board 2 x STM-4 optical interface board 2 x STM-4 optical interface board (half-width) 12 x STM-1 optical interface board 4 x STM-1 optical interface board 4 x STM-1 optical interface board 4 x STM-1 optical interface board (half-width) 1 x STM-1 optical interface board 1 x STM-1 optical interface board 1 x STM-1 optical interface board (half-width) 2 x STM-1 line processing board when interfaces are available on the front panel 8 x STM-1 line processing board when used with an interface board

N2SLO1

8 x STM-1 optical interface board

4.3.2 PDH Processing Boards

The OptiX OSN 1500 supports PDH processing boards at different rates and of different impedance. Table 4-4 lists the PDH processing boards supported by the OptiX OSN 1500A.

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Table 4-4 PDH processing boards for the OptiX OSN 1500A Board R1PL1 Full Name 16 x E1 processing board Board N1PL3A Full Name 3 x E3/T3 processing board (interfaces available on the front panel) 3 x E3/T3 processing board (interfaces available on the front panel) DDN service convergence board

R1PD1

32 x E1 processing board

N2PL3A

R2PD1

32 x E1 processing board

N1DXA

Table 4-5 lists the PDH processing boards supported by the OptiX OSN 1500B. Table 4-5 PDH processing boards for the OptiX OSN 1500B Board R1PL1 Full Name 16 x E1 processing board Board N2PL3A Full Name 3 x E3/T3 processing board (interfaces available on the front panel) 6 x E3/T3 processing board 6 x E3/T3 processing board 12 x E3/T3 processing board DDN service access and convergence board DDN service convergence board 4 x E4/STM-1 electrical processing board 4 x E4/STM-1 electrical processing board -

R1PD1 R2PD1 N1PQ1 N2PQ1 N1PQM N1PL3 N2PL3 N1PL3A

32 x E1 processing board 32 x E1 processing board 63 x E1 processing board 63 x E1 processing board 63 x E1/T1 processing board 3 x E3/T3 processing board 3 x E3/T3 processing board 3 x E3/T3 processing board (interfaces available on the front panel)

N1PD3 N2PD3 N2PQ3 N1DX1 N1DXA N1SPQ4 N2SPQ4 -

4.3.3 Data Processing Boards

The OptiX OSN 1500 supports data processing boards with the transparent transmission, switching or RPR function. Table 4-6 lists the data processing boards supported by the OptiX OSN 1500A.
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Table 4-6 Data processing boards for the OptiX OSN 1500A Board N1EFT4 Full Name 4 x FE Ethernet transparent transmission board (halfwidth) 8 x FE Ethernet transparent transmission board 4 x GE Ethernet convergence board 8 x FE Ethernet transparent transmission board 2 x GE Ethernet transparent transmission board 4 x FE Ethernet processing board with Lanswitch 4 x FE Ethernet processing board with Lanswitch 2 x GE Ethernet processing board with Lanswitch 4 x GE Ethernet transparent transmission and convergence board Board N1EGS4 Full Name 4 x GE Ethernet convergence board 4 x GE Ethernet convergence board 2 x GE Ethernet ring processing board 4 x FE and 1 x GE Ethernet ring processing board 1 x STM-4 ATM processing board 1 x STM-4 ATM processing board 1 x STM-4 ATM processing board 4 x STM-1 ATM processing board 4-port multi-service transparent transmission board

N1EFT8 N2EGS4A N1EFT8A N1EGT2 N1EFS4 N2EFS4 N2EGS2 N1EMS4

N3EGS4 N2EGR2 N2EMR0 N1ADL4 N1ADQ1 N1IDL4 N1IDQ1 N1MST4

Table 4-7 lists the data processing boards supported by the OptiX OSN 1500B. Table 4-7 Data processing boards for the OptiX OSN 1500B Board N1EFT4 Full Name 4 x FE Ethernet transparent transmission board (halfwidth) 8 x FE or 16 x FE Ethernet transparent transmission board 8 x FE Ethernet transparent transmission board 4 x GE Ethernet convergence board 2 x GE Ethernet transparent transmission board Board N1EMS4 Full Name 4 x GE and 16 x FE Ethernet transparent transmission and convergence board 4 x GE Ethernet convergence board 4 x GE Ethernet convergence board 2 x GE Ethernet ring processing board 12 x FE and 1 x GE Ethernet ring processing board

N1EFT8 N1EFT8A N2EGS4A N1EGT2

N1EGS4 N3EGS4 N2EGR2 N2EMR0

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Board N1EFS0 N2EFS0 N4EFS0 N1EFS4 N2EFS4 N2EGS2

Full Name 8-port Fast Ethernet processing board with Lanswitch 8 x FE Ethernet processing board with Lanswitch 8 x FE Ethernet processing board with Lanswitch 4 x FE Ethernet processing board with Lanswitch 4 x FE Ethernet processing board with Lanswitch 2 x GE Ethernet processing board with Lanswitch

Board N1ADL4 N1ADQ1 N1IDL4 N1IDQ1 N1MST4 -

Full Name 1 x STM-4 ATM processing board 1 x STM-4 ATM processing board 1 x STM-4 ATM processing board 4 x STM-1 ATM processing board 4-port multi-service transparent transmission board -

4.3.4 Interface Boards and Switching Boards

The OptiX OSN 1500 supports the optical interface boards, electrical interface boards and switching boards. Table 4-8 lists the interface boards and switching boards supported by the OptiX OSN 1500A. Table 4-8 Interface boards and switching boards supported by the OptiX OSN 1500A Board R1L12S R1L75S Full Name 16 x E1/T1 120-ohm electrical interface switching board 16 x E1 75-ohm electrical interface switching board

Table 4-9 lists the interface boards and switching boards supported by the OptiX OSN 1500B. Table 4-9 Interface boards and switching boards supported by the OptiX OSN 1500B Board N1EU08 Full Name 8 x STM-1 electrical interface board 8 x STM-1 optical interface board (LC) 8 x STM-1 optical interface board (SC) Board N1D12S Full Name 32 x E1/T1 120-ohm electrical interface switching board 32 x E1/T1 120-ohm electrical interface board 8 x 100M Ethernet optical interface board

N1OU08 N2OU08

N1D12B N1EFF8

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Board N1D75S N1MU04

Full Name 32 x E1/T1 75-ohm electrical interface switching board 4 x STM-1 electrical interface board 6 x E3/T3 electrical interface switching board 3 x E3/T3 electrical interface switching board 4 x STM-1 electrical interface board

Board N1ETF8 N1ETS8

Full Name 8 x 100M Ethernet twisted pair interface board 8 x 10/100M Ethernet twisted pair interface switching board DDN service interface board 4-channel electrical interface switching board 8-channel electrical interface switching board

N1D34S N1C34S N1EU04

N1DM12 N1TSB4 N1TSB8

4.3.5 Cross-Connect Boards and SCC Boards

The OptiX OSN 1500 supports the integrated boards of the cross-connect, SCC and line units at different rates. Table 4-10 lists the cross-connect boards and SCC boards supported by the OptiX OSN 1500A and the OptiX OSN 1500B. Table 4-10 Cross-connect boards and SCC boards supported by the OptiX OSN 1500A and the OptiX OSN 1500B Board Q2CXL1, Q3CXL1, R1CXLL1, R1CXLD1, R1CXLQ1 Q2CXL4, Q3CXL4, R1CXLL4, R1CXLD4, R1CXLQ4 Q2CXL16, Q3CXL16, R1CXLL16 Full Name Integrated board of the SCC, cross-connect and line units at the STM-1 level Integrated board of the SCC, cross-connect and line units at the STM-4 level Integrated board of the SCC, cross-connect and line units at the STM-16 level

4.3.6 Auxiliary Boards

The OptiX OSN 1500 supports auxiliary boards such as the system auxiliary interface boards and fan boards. Table 4-11 lists the auxiliary boards supported by the OptiX OSN 1500A and the OptiX OSN 1500B.

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Table 4-11 Auxiliary boards supported by the OptiX OSN 1500A and the OptiX OSN 1500B Board R1EOW R1AMU Full Name Orderwire phone processing board Orderwire processing or alarm concatenation board Board R1AUX/ R2AUX R1FAN Full Name System auxiliary interface board Fan board

4.3.7 WDM Processing Boards

The OptiX OSN 1500 supports WDM processing boards such as the optical add/drop multiplexing boards and optical power amplifier boards. Table 4-12 lists the optical add/drop multiplexing boards supported by the OptiX OSN 1500A. Table 4-12 Optical add/drop multiplexing boards supported by the OptiX OSN 1500A Board TN11CMR2 TN11CMR4 TN11MR2 TN11MR4 N1MR2A Full Name 2-channel optical add/drop multiplexing board 4-channel optical add/drop multiplexing board 2-channel optical add/drop multiplexing board 4-channel optical add/drop multiplexing board 2-channel optical add/drop multiplexing board Board N1MR2C N1LWX TN11OBU1 N1FIB Full Name 2-channel optical add/drop multiplexing board Arbitrary bit rate wavelength conversion board Optical booster amplifier board Filter isolating board -

Table 4-13 lists the optical add/drop multiplexing boards supported by the OptiX OSN 1500B. Table 4-13 Optical add/drop multiplexing boards supported by the OptiX OSN 1500B Board TN11CMR2 TN11CMR4 TN11MR2 Full Name 2-channel optical add/drop multiplexing board 4-channel optical add/drop multiplexing board 2-channel optical add/drop multiplexing board Board N1MR2B N1MR2C N1LWX Full Name 2-channel optical add/drop multiplexing board 2-channel optical add/drop multiplexing board Arbitrary bit rate wavelength conversion board
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Board TN11MR4 N1MR2A

Full Name 42-channel optical add/drop multiplexing board 2-channel optical add/drop multiplexing board

Board TN11OBU1 N1FIB

Full Name Optical booster amplifier board Filter isolating board

4.3.8 Optical Amplifier Boards and Dispersion Compensation Board

The OptiX OSN 1500 supports several optical booster amplifier boards. Table 4-14 lists the optical amplifier boards and dispersion compensation boards supported by the OptiX OSN 1500A and the OptiX OSN 1500B. Table 4-14 Optical amplifier boards and dispersion compensation boards supported by the OptiX OSN 1500A/B Board N1BPA, N2BPA N1BA2 N1COA, 61COA, 62COA Full Name Optical booster and pre-amplifier board Optical booster amplifier board Case-shaped optical amplifier

4.3.9 Power Interface Boards

The OptiX OSN 1500A supports the UPM and R1PIUA. The OptiX OSN 1500B supports the UPM and R1PIU. The UPM is an uninterruptible power module. The R1PIUA is used for the OptiX OSN 1500A as the power interface board. The R1PIU is used for the OptiX OSN 1500B as the power interface board.

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5
About This Chapter

SDH Processing Boards

This chapter describes the SDH processing boards at the STM-1, STM-4, and STM-16 levels. 5.1 SL1 This section describes the SL1, a 1 x STM-1 optical interface board, in terms of the version, function, working principle, front panel and specifications. 5.2 SL1A This section describes the SL1A, a 1 x STM-1 optical interface board, in terms of version, function, principle, front panel and technical specifications. 5.3 SLQ1 This section describes the SLQ1, a 4 x STM-1 optical interface board, in terms of the version, function, working principle, front panel and parameters. 5.4 SLQ1A This section describes the SLQ1A, a 4 x STM-1 optical interface board, in terms of version, function, principle, front panel and technical specifications. 5.5 SLO1 This section describes the SLO1, an 8 x STM-1 optical interface board, in terms of the version, function, working principle, front panel and parameters. 5.6 SLT1 This section describes the SLT1, a 12 x STM-1 optical interface board, in terms of the version, function, working principle, front panel and specifications. 5.7 SEP1 This section describes the SEP1 board, in terms of the version, function, working principle, front panel, and specifications. 5.8 SL4 This section describes the SL4, a 1 x STM-4 optical interface board, in terms of the version, function, working principle, front panel and specifications. 5.9 SL4A This section describes the SL4A, a 1 x STM-4 optical interface board, in terms of version, function, principle, front panel and technical specifications.
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5.10 SLD4 This section describes the SLD4, a 2 x STM-4 optical interface board, in terms of the version, function, working principle, front panel and specifications. 5.11 SLD4A This section describes the SLD4A, a 2 x STM-4 optical interface board, in terms of version, function, principle, front panel and technical specifications. 5.12 SLQ4 This section describes the SLQ4, a 4 x STM-4 optical interface board, in terms of the version, function, working principle, front panel and specifications. 5.13 SLQ4A This section describes the SLQ4A, a 4 x STM-4 optical interface board, in terms of version, function, principle, front panel and technical specifications. 5.14 SL16 This section describes the SL16, a 1 x STM-16 optical interface board, in terms of the version, function, working principle, front panel and specifications. 5.15 SL16A This section describes the SL16A, a 1 x STM-16 optical interface board, in terms of the version, function, working principle, front panel and specifications. 5.16 SF16 This section describes the SF16, a 1 x STM-16 optical interface board with the out-band FEC function, in terms of the version, function, working principle, front panel and specifications.

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5.1 SL1
This section describes the SL1, a 1 x STM-1 optical interface board, in terms of the version, function, working principle, front panel and specifications. 5.1.1 Version Description The SL1 board has three versions: R1, N1 and N2. The difference among the three versions lies in the support for the TCM function. The R1SL1 is a 1 x STM-1 optical interface board, which is housed in a divided slot in a subrack. 5.1.2 Function and Feature The SL1 is used to transmit and receive STM-1 optical signals, to perform O/E conversion for the STM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals. 5.1.3 Working Principle and Signal Flow The SL1 board consists of the O/E conversion module, CDR module, SDH overhead processing module, RST and so on. 5.1.4 Front Panel On the front panel of the N1L1/N2SL1, there are indicators, interfaces, barcode and laser safety class label. On the front panel of the R1SL1, there are indicators, interfaces and barcode. 5.1.5 Valid Slots The slots valid for the SL1 vary with the version of the board. 5.1.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the SL1 indicates the optical interface type. 5.1.7 Board Configuration Reference You can use the T2000 to set parameters for the SL1. 5.1.8 Technical Specifications The technical specifications of the SL1 cover the optical interface specifications, board dimensions, weight and power consumption.

5.1.1 Version Description

The SL1 board has three versions: R1, N1 and N2. The difference among the three versions lies in the support for the TCM function. The R1SL1 is a 1 x STM-1 optical interface board, which is housed in a divided slot in a subrack. Table 5-1 lists the details on the versions of the SL1 board. Table 5-1 Version Description of the SL1 Item Functional version Difference Description The SL1 has three versions, R1, N1 and N2. The N2SL1 supports the TCM function. The N1SL1 and R1SL1 do not support the TCM function. The R1SL1 is housed in a divided slot.

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Item Replaceability

Description The versions cannot be replaced by each other.

NOTE

The N2SL1 board supports the TCM function, which are not supported by the N1SL1 or R1SL1 board. For this reason, when configuring MSP and SNCP, you cannot configure the N1SL1 or R1SL1 board as the protection board if the working board is N2SL1 configured with the TCM service . Otherwise, the service may be interrupted due to the switching operation.

5.1.2 Function and Feature

The SL1 is used to transmit and receive STM-1 optical signals, to perform O/E conversion for the STM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals. Table 5-2 lists the functions and features of the SL1. Table 5-2 Functions and features of the SL1 Function and Feature Basic function Specification of the optical interface Specification of the optical module SL1 Transmits and receives 1 x STM-1 optical signals. Supports standard optical interfaces of the I-1, S-1.1, L-1.1, L-1.2 and Ve-1.2 types. The optical interfaces of the I-1, S-1.1, L-1.1 and L-1.2 types comply with ITU-T G.957 in features. The optical interface of the Ve-1.2 type complies with the standards defined by Huawei. Supports detection and query of the information on the optical module. Supports the usage and detection of the pluggable optical module SFP for easy maintenance. The optical interface supports the function of setting the on/off state of the laser and the ALS function. Service processing Overhead processing Supports the processing of the VC-12, VC-3 and VC-4 services. Supports the processing of the SOH bytes of the STM-1 signals. Supports the transparent transmission and termination of the POH bytes. Supports the setting and query of the J0/J1/C2 bytes. Alarm and performance event Protection scheme Provides rich alarms and performance events for easy management and maintenance of the equipment. Supports the two-fiber bidirectional MSP protection ring, four-fiber MSP protection ring, linear MPS, SNCP, SNCTP and SNCMP.

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Function and Feature Maintenance feature

SL1 Supports inloop and outloop for optical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services.

5.1.3 Working Principle and Signal Flow

The SL1 board consists of the O/E conversion module, CDR module, SDH overhead processing module, RST and so on. Figure 5-1 shows the block diagram for the working principle of the SL1. Figure 5-1 Block diagram for the working principle of the SL1
155 MHz

155 MHz PLL

Reference clock

Cross-connect unit

155Mbit/s 155Mbit/s

O/E O/E

S P I

155Mbit/s

CDR

155Mbit/s

K1 and K2 insertion/extration
155Mbit/s

K1 and K2

Cross-connect unit

High speed bus

....
155Mbit/s 155Mbit/s

....
155Mbit/s

Cross-connect unit A

RST
155Mbit/s 155Mbit/s

MST

MSA

HPT
High speed bus Cross-connect unit B

O/E O/E

S P I

CDR

DCC SDH overhead processing module

SCC unit

IIC LOS Laser shut down

Communication and control module

+3.3 V

Frame header Communication

Cross-connect unit SCC unit

+5 V +1.8 V

DC/DC converter

DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse

+3.3 V

+3.3 V backup power

PLL: phase-locked loop RST: regenerator section termination

SPI: SDH physical interface

SDH: synchronous digital hierarchy

MST: multiplex section termination MSA: multiplex section adaptation CDR: clock and data recovery

HPT: higher order path termination IIC: inter-integrated circuit

The function modules of the STM-1 units are described below:

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O/E Conversion Module

l

In the receive direction, the module converts the received optical signals into electrical signals. In the transmit direction, the module converts the electrical signals into SDH optical signals, and then sends optical signals to fibers for transmission. The SPI detects the R_LOS alarm and provides function to shut down the laser.

CDR Module
l

It recovers the data signal and the clock signal.

SDH Overhead Processing Module

This module includes RST, MST, MSA and HPT. It provides inloop and outloop function.
l

RST

In the receive direction, RST performs frame alignment detection (A1, A2), regenerator section trace recovery (J0) and mismatch detection, BIP-8 errored block count. In the transmit direction, RST performs frame alignment insertion, regenerator section path trace insertion, BIP-8 calculation and insertion. In the receive direction, MST performs BIP-24 errored block count, multiplex sectionremote error indication (MS_REI) recovery, multiplex section-remote defect indication (MS_RDI) and multiplex section-alarm indication signal (MS_AIS) detection. In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI MS_RDI and MS_AIS insertion. MST provides extraction or insertion of K1 byte and K2 byte. In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS detection, pointer justification. In the transmit direction, MST it performs administration unit group (AUG) assembly, AU-4 pointer generation, AU_AIS generation. OH termination J1 path trace message recovery REI information recovering HP_RDI detection (path status monitoring) UNEQ and AIS detection (signal label monitoring) VC-4 BIP-8 errored block count

MST

MSA

HPT

Communication and Control Module

l l l

Manages and configures other modules of the boards. Performs inter-board communication through internal Ethernet interface. Traces the clock signal from the active and the standby cross-connect units.
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Controls the laser. Realizes the pass-through of orderwire and embedded control channel (ECC) bytes between the paired slots constituting the add/ drop multiplexer (ADM) when the CXL is not online. Selects the clock and frame header from the active or the standby cross-connect units. Controls the indicator on the board.

l l

DC/DC Converter
It provides the board with required DC voltages. It converts the 48/60 V power supply to the following voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3 V power supply.

5.1.4 Front Panel

On the front panel of the N1L1/N2SL1, there are indicators, interfaces, barcode and laser safety class label. On the front panel of the R1SL1, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 5-2 shows the appearance of the front panel of the N1SL1/N2SL1. Figure 5-2 Front panel of the N1SL1/N2SL1
SL1
STAT ACT PROG SRV
CLASS1 LASER PRODUCT

OUT

IN

SL1

Figure 5-3 shows the appearance of the front panel of the R1SL1.

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Figure 5-3 Front panel of the R1SL1

SL1
STAT ACT PROG SRV

OUT IN

SL1

Indicators
The following indicators are present on the front panel of the board:
l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There is one pair of optical interfaces on the front panel of the SL1. Table 5-3 lists the type and usage of the optical interfaces. Table 5-3 Optical interfaces of the SL1 Interfaces on the Front Panel IN OUT Interface Type LC LC Usage Receives optical signals. Transmits optical signals.

5.1.5 Valid Slots

The slots valid for the SL1 vary with the version of the board. The slots valid for the SL1 are as follows:
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The R1SL1 can be housed in any of slots 23, 69 and 1213 in the OptiX OSN 1500A subrack. The N1SL1 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The N2SL1 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The R1SL1 can be housed in any of slots 13, 69 and 1113 in the OptiX OSN 1500B subrack. The N1SL1 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack. The N2SL1 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

l l l

l l

5.1.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code of the SL1 indicates the optical interface type. Table 5-4 lists the relation between the board feature code and optical interface type for the SL1. Table 5-4 Relation between the board feature code and the optical interface type Board SSN1SL110, SSN2SL110 SSN1SL111, SSN2SL111 SSN1SL112, SSN2SL112 SSN1SL113, SSN2SL113 SSN1SL114, SSN2SL114 Feature Code 10 11 12 13 14 Optical Interface Type S-1.1 L-1.1 L-1.2 Ve-1.2 I-1

5.1.7 Board Configuration Reference

You can use the T2000 to set parameters for the SL1. You can use the T2000 to set the following parameters for the SL1:
l l l

J0 J1 C2

For details on the parameters, refer to F Board Configuration Reference.

5.1.8 Technical Specifications

The technical specifications of the SL1 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications

Table 5-5 lists the specifications of the optical interfaces of the SL1.
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Table 5-5 Specifications of the optical interfaces of the SL1 Item Nominal bit rate Line code Optical interface type Optical source type Working wavelengt h (nm) Launched optical power (dBm) Receiver sensitivity (dBm) Overload optical power (dBm) Min. extinction ratio (dB) Specification 155.52 Mbit/s NRZ I-1 S-1.1 L-1.1 L-1.2 Ve-1.2

MLM 12601360

MLM 12611360

MLM, SLM 12631360

SLM 14801580

SLM 14801580

15 to 8

15 to 8

5 to 0

5 to 0

3 to 0

23

28

34

34

34

10

10

10

8.2

8.2

10

10

10

Note: MLM indicates the multi-longitudinal mode and SLM indicates the single-longitudinal mode.

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the N1SL1/N2SL1 are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 1.0

The mechanical specifications of the R1SL1 are as follows:

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Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W) Weight (kg): 0.3

Power Consumption
In the normal temperature (25), the maximum power consumption of the N1SL1/N2SL1 is 14 W. In the normal temperature (25), the maximum power consumption of the R1SL1 is 10.3 W.

5.2 SL1A
This section describes the SL1A, a 1 x STM-1 optical interface board, in terms of version, function, principle, front panel and technical specifications. 5.2.1 Version Description The functional version of the SL1A board is N1. 5.2.2 Function and Feature The SL1A is used to transmit and receive STM-1 optical signals, to perform O/E conversion for the STM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals. 5.2.3 Working Principle and Signal Flow The SL1A board consists of the O/E conversion module, data clock recovery unit, SDH overhead processing module, logic control module and power supply module. 5.2.4 Front Panel On the front panel of the SL1A board, there are indicators, interfaces, barcode and laser safety class label. 5.2.5 Valid Slots The SL1A board can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, and any of slots 1113 in the OptiX OSN 1500B subrack. 5.2.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the SL1A indicates the optical interface type. 5.2.7 Board Configuration Reference You can set parameters for the SL1A board on the T2000. 5.2.8 Technical Specifications The technical specifications of the SL1A board cover the optical interface specifications, board dimensions, weight and power consumption.

5.2.1 Version Description

The functional version of the SL1A board is N1.

5.2.2 Function and Feature

The SL1A is used to transmit and receive STM-1 optical signals, to perform O/E conversion for the STM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals. Table 5-6 lists the functions and features of the SL1A board.
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Table 5-6 Functions and features of the SL1A board Function and Feature Basic function Specification of the optical interface Description Transmits and receives 1 x STM-1 optical signals. Supports standard optical interfaces of the I-1, S-1.1, L-1.1, L-1.2 and Ve-1.2 types. The optical interfaces of the I-1, S-1.1, L-1.1 and L-1.2 types comply with ITU-T G.957 Recommendations in features. The optical interface of the Ve-1.2 type complies with the standards defined by Huawei. Supports detection and query of the information on the optical module. Supports the usage and detection of the pluggable optical module SFP for easy maintenance. The optical interface supports the function of setting the on/off state of the laser and the ALS function. Service processing Overhead processing Supports processing the VC-12, VC-3 or VC-4 service. Supports processing the SOH bytes of the STM-1 signals. Supports the transparent transmission and termination of the POH bytes. Supports setting and querying the J0, J1 or C2 byte. Alarm and performance event Protection scheme Provides abundant alarms and performance events to easily manage and maintain the equipment. Supports the two-fiber unidirectional MSP protection ring, four-fiber MSP protection ring, linear MSP protection ring, sub-network connection protection (SNCP), sub-network connection tunnel protection (SNCTP), and sub-network connection multi-protection (SNCMP). Supports inloop and outloop for optical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports querying the manufacturing information of the board. Supports loading the FPGA in-service. Supports upgrading the board software without affecting services.

Specification of the optical module

Maintenance feature

5.2.3 Working Principle and Signal Flow

The SL1A board consists of the O/E conversion module, data clock recovery unit, SDH overhead processing module, logic control module and power supply module. Figure 5-4 shows the block diagram for the working principle of the SL1A board.

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Figure 5-4 Block diagram for the working principle of the SL1A
155 MHz

155 MHz PLL

Reference clock

Cross-connect unit

155Mbit/s 155Mbit/s

O/E O/E

S P I

155Mbit/s

CDR

155Mbit/s

K1 and K2 insertion/extration
155Mbit/s

K1 and K2

Cross-connect unit

High speed bus

....
155Mbit/s 155Mbit/s

....
155Mbit/s

Cross-connect unit A

RST
155Mbit/s 155Mbit/s

MST

MSA

HPT
High speed bus Cross-connect unit B

O/E O/E

S P I

CDR

DCC SDH overhead processing module

SCC unit

IIC LOS Laser shut down

Communication and control module

+3.3 V

Frame header Communication

Cross-connect unit SCC unit

+5 V +1.8 V

DC/DC converter

DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse

+3.3 V

+3.3 V backup power

In the receive direction

The O/E conversion module converts the received STM-1 optical signals into STM-1 electrical signals and detects the R_LOS alarm. The data clock recovery unit recovers the clock signals, and transmits the STM-1 electrical signals along with the clock signals to the overhead processing module. The overhead processing module detects the R_LOF and R_OOF alarm signals. The overhead processing module also extracts overhead bytes from the received STM-1 signals and transmits the signals to the cross-connect unit through the backplane bus.

In the transmit direction

The overhead processing unit inserts the overhead bytes into the electrical signals from the crossconnect units and then transmits the signals to the E/O conversion module. The E/O conversion module converts the received STM-1 electrical signals into STM-1 optical signals, which are then transmitted through fibers.

Auxiliary Unit
The auxiliary unit consists of the logic control unit and the power supply module.
l

Logic Control Module The logic control module traces the clock signals, which are received from the active or standby cross-connect board, and the frame header signals. This module controls the laser and passes through the orderwire and ECC bytes between the two optical interface boards that form the ADM. This module also selects the clock frame headers from the active or standby cross-connect board.

Power Supply Module

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The power supply module provides the DC voltages required by the modules of the board.

5.2.4 Front Panel

On the front panel of the SL1A board, there are indicators, interfaces, barcode and laser safety class label.

Appearance of the Front Panel

Figure 5-5 shows the appearance of the front panel of the SL1A. Figure 5-5 Front panel of the SL1A
SL1A
STAT ACT PROG SRV
CLASS1 LASER PRODUCT

OUT

IN

SL1A

Indicators
The following indicators are present on the front panel of the board:
l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
On the front panel of the SL1A board, there is one pair of optical interfaces. Table 5-7 lists the type and usage of these optical interfaces.
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Table 5-7 Optical interfaces of the SL1A Interface IN OUT Interface Type LC LC Usage Receives optical signals. Transmits optical signals.

5.2.5 Valid Slots

The SL1A board can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, and any of slots 1113 in the OptiX OSN 1500B subrack.

5.2.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code of the SL1A indicates the optical interface type. Table 5-8 lists the relation between the board feature code and optical interface type of the SL1A. Table 5-8 Relation between the board feature code and optical interface type of the SL1A Board SSN1SL1A10 SSN1SL1A11 SSN1SL1A12 SSN1SL1A13 SSN1SL1A14 Feature Code 10 11 12 13 14 Optical Interface Type S-1.1 L-1.1 L-1.2 Ve-1.2 I-1

5.2.7 Board Configuration Reference

You can set parameters for the SL1A board on the T2000. On the T2000, you can set the following parameters for the SL1A board.
l l l

J0 J1 C2

For details of the parameters, see F Board Configuration Reference.

5.2.8 Technical Specifications

The technical specifications of the SL1A board cover the optical interface specifications, board dimensions, weight and power consumption.
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Optical Interface Specifications

Table 5-9 lists the specifications of the optical interfaces of the SL1A board. Table 5-9 Specifications of the optical interfaces of the SL1A board Item Nominal bit rate Line code Optical interface type Optical source type Working wavelengt h (nm) Launched optical power (dBm) Receiver sensitivity (dBm) Overload optical power (dBm) Minimum extinction ratio (dB) Specification 155520kbit/s NRZ I-1 S-1.1 L-1.1 L-1.2 Ve-1.2

MLM 1260-1360

MLM 1261-1360

MLM, SLM 1263-1360

SLM 1480-1580

SLM 1480-1580

15-8

15-8

5-0

5-0

3-0

23

28

34

34

34

10

10

10

8.2

8.2

10

10

10

Note: MLM stands for multi-longitudinal mode and SLM for single-longitudinal mode.

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SL1A board are as follows:
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Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

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Weight (kg): 1.0

Power Consumption
At normal ambient temperature (25), the maximum power consumption of the SL1A is 17 W.

5.3 SLQ1
This section describes the SLQ1, a 4 x STM-1 optical interface board, in terms of the version, function, working principle, front panel and parameters. 5.3.1 Version Description The SLQ1 board has three versions, R1, N1 and N2. The difference among the three versions lies in the support for the TCM function and AU-3 service. The R1SLQ1 is a 4 x STM-1 optical interface board, which is housed in a divided slot in a subrack. 5.3.2 Function and Feature The SLQ1 is used to transmit and receive STM-1 optical signals, to perform O/E conversion for the STM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals. 5.3.3 Working Principle and Signal Flow The SLQ1 board consists of the O/E conversion module, CDR module, SDH overhead processing module, RST and so on. 5.3.4 Front Panel On the front panel of the N1SLQ1/N2SLQ1, there are indicators, interfaces, barcode and laser safety class label.On the front panel of the R1SLQ1, there are indicators, interfaces and barcode. 5.3.5 Valid Slots The slots valid for the SLQ1 vary with the version of the board. 5.3.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the SLQ1 indicates the optical interface type. 5.3.7 Board Configuration Reference You can use the T2000 to set parameters for the SLQ1. 5.3.8 Technical Specifications The technical specifications of the SLQ1 cover the optical interface specifications, board dimensions, weight and power consumption.

5.3.1 Version Description

The SLQ1 board has three versions, R1, N1 and N2. The difference among the three versions lies in the support for the TCM function and AU-3 service. The R1SLQ1 is a 4 x STM-1 optical interface board, which is housed in a divided slot in a subrack. Table 5-10 lists the details on the versions of the SLQ1 board.

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Table 5-10 Version Description of the SLQ1 Item Functional version Difference Description The SLQ1 has three versions, R1, N1 and N2. The N2SLQ1 supports the TCM function and AU-3 service. The N1SLQ1 and R1SLQ1 do not support the TCM function and AU-3 service. The R1SLQ1 is housed in a divided slot. Replaceability The versions cannot be replaced by each other.

NOTE

The N2SLQ1 board supports the TCM function and AU-3 service, which are not supported by the N1SLQ1 or R1SLQ1 board. For this reason, when configuring MSP and SNCP, you cannot configure the N1SLQ1 or R1SLQ1 board as the protection board if the working board is N2SLQ1 configured with the TCM service or AU-3 service. Otherwise, the service may be interrupted due to the switching operation.

5.3.2 Function and Feature

The SLQ1 is used to transmit and receive STM-1 optical signals, to perform O/E conversion for the STM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals. Table 5-11 lists the functions and features of the SLQ1. Table 5-11 Functions and features of the SLQ1 Function and Feature Basic function Specification of the optical interface Specification of the optical module SLQ1 Transmits and receives 4 x STM-1 optical signals. Supports standard optical interfaces of the I-1, S-1.1, L-1.1, L-1.2, Ie-1 and Ve-1.2 types. The optical interfaces of the I-1, S-1.1, L-1.1 and L-1.2 types comply with ITU-T G.957 in features. The optical interface of the Ve-1.2 type complies with the standards defined by Huawei. Supports detection and query of the information on the optical module. The optical interface supports the function of setting the on/off state of the laser and the ALS function. Supports the usage and detection of the pluggable optical module SFP for easy maintenance. Service processing Overhead processing Supports the processing of the VC-12, VC-3 and VC-4 services. N2SLQ1 supports AU-3 service. Supports the processing of the SOH bytes of the STM-1 signals. Supports the transparent transmission and termination of the POH bytes. Supports the setting and query of the J0/J1/C2 bytes. Supports one to four channels of ECC communication.
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Function and Feature Alarm and performance event Protection scheme Maintenance feature

SLQ1 Provides rich alarms and performance events for easy management and maintenance of the equipment. Supports the two-fiber unidirectional MSP protection ring, four-fiber MSP protection ring, linear MSP, SNCP, SNCTP and SNCMP. Supports inloop and outloop for optical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services.

5.3.3 Working Principle and Signal Flow

The SLQ1 board consists of the O/E conversion module, CDR module, SDH overhead processing module, RST and so on. Figure 5-6 shows the block diagram for the working principle of the SLQ1. Figure 5-6 Block diagram for the working principle of the SLQ1
155 MHz

155 MHz PLL

Reference clock

Cross-connect unit

155Mbit/s 155Mbit/s

O/E O/E

S P I

155Mbit/s

CDR

155Mbit/s

K1 and K2 insertion/extration
155Mbit/s

K1 and K2

Cross-connect unit

High speed bus

....
155Mbit/s 155Mbit/s

....
155Mbit/s

Cross-connect unit A

RST
155Mbit/s 155Mbit/s

MST

MSA

HPT
High speed bus Cross-connect unit B

O/E O/E

S P I

CDR

DCC SDH overhead processing module

SCC unit

IIC LOS Laser shut down

Communication and control module

+3.3 V

Frame header Communication

Cross-connect unit SCC unit

+5 V +1.8 V

DC/DC converter

DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse

+3.3 V

+3.3 V backup power

PLL: phase-locked loop

SPI: SDH physical interface

SDH: synchronous digital hierarchy

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RST: regenerator section termination

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

MST: multiplex section termination MSA: multiplex section adaptation CDR: clock and data recovery

HPT: higher order path termination IIC: inter-integrated circuit

The function modules of the STM-1 units are described below:

O/E Conversion Module

l

In the receive direction, the module converts the received optical signals into electrical signals. In the transmit direction, the module converts the electrical signals into SDH optical signals, and then sends optical signals to fibers for transmission. The SPI detects the R_LOS alarm and provides function to shut down the laser.

CDR Module
l

It recovers the data signal and the clock signal.

SDH Overhead Processing Module

This module includes RST, MST, MSA and HPT. It provides inloop and outloop function.
l

RST

In the receive direction, RST performs frame alignment detection (A1, A2), regenerator section trace recovery (J0) and mismatch detection, BIP-8 errored block count. In the transmit direction, RST performs frame alignment insertion, regenerator section path trace insertion, BIP-8 calculation and insertion. In the receive direction, MST performs BIP-24 errored block count, multiplex sectionremote error indication (MS_REI) recovery, multiplex section-remote defect indication (MS_RDI) and multiplex section-alarm indication signal (MS_AIS) detection. In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI MS_RDI and MS_AIS insertion. MST provides extraction or insertion of K1 byte and K2 byte. In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS detection, pointer justification. In the transmit direction, MST it performs administration unit group (AUG) assembly, AU-4 pointer generation, AU_AIS generation. OH termination J1 path trace message recovery REI information recovering HP_RDI detection (path status monitoring) UNEQ and AIS detection (signal label monitoring) VC-4 BIP-8 errored block count
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MST

MSA

HPT

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Communication and Control Module

l l l l l

Manages and configures other modules of the boards. Performs inter-board communication through internal Ethernet interface. Traces the clock signal from the active and the standby cross-connect units. Controls the laser. Realizes the pass-through of orderwire and embedded control channel (ECC) bytes between the paired slots constituting the add/ drop multiplexer (ADM) when the CXL is not online. Selects the clock and frame header from the active or the standby cross-connect units. Controls the indicator on the board.

l l

DC/DC Converter
It provides the board with required DC voltages. It converts the 48/60 V power supply to the following voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3 V power supply.

5.3.4 Front Panel

On the front panel of the N1SLQ1/N2SLQ1, there are indicators, interfaces, barcode and laser safety class label.On the front panel of the R1SLQ1, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 5-7 shows the appearance of the front panel of the N1SLQ1/N2SLQ1. Figure 5-7 Front panel of the N1SLQ1/N2SLQ1
SLQ1
STAT ACT PROG SRV
CLASS1 LASER PRODUCT

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4

SLQ1

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Figure 5-8 shows the appearance of the front panel of the R1SLQ1. Figure 5-8 Front panel of the R1SLQ1

SLQ1
STAT ACT PROG SRV

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4

SLQ1

Indicators
The following indicators are present on the front panel of the board:
l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are four pairs of optical interfaces on the front panel of the SLQ1. Table 5-12 lists the type and usage of the optical interfaces. Table 5-12 Optical interfaces of the SLQ1 Interfaces IN1-IN4 OUT1-OUT4 Interface Type LC LC Usage Receives optical signals. Transmits optical signals.

5.3.5 Valid Slots

The slots valid for the SLQ1 vary with the version of the board. The slots valid for the SLQ1 are as follows:
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The R1SLQ1 can be housed in any of slots 23, 69 and 1213 in the OptiX OSN 1500A subrack. The N1SLQ1 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The N2SLQ1 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The R1SLQ1 can be housed in any of slots 13, 69 and 1113 in the OptiX OSN 1500B subrack. The N1SLQ1 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack. The N2SLQ1 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

l l l

l l

5.3.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code of the SLQ1 indicates the optical interface type. Table 5-13 lists the relation between the board feature code and optical interface type for the SLQ1. Table 5-13 Relation between the board feature code and the optical interface type Board SSN2SLQ110, SSN1SLQ110 SSN2SLQ111, SSN1SLQ111 SSN2SLQ112, SSN1SLQ112 SSN2SLQ113, SSN1SLQ113 SSN2SLQ114, SSN1SLQ114 SSN1SLQ115 Feature Code 10 11 12 13 14 15 Optical Interface Type S-1.1 L-1.1 L-1.2 Ve-1.2 I-1 Ie-1

5.3.7 Board Configuration Reference

You can use the T2000 to set parameters for the SLQ1. You can use the T2000 to set the following parameters for the SLQ1:
l l l

J0 J1 C2

For details on the parameters, refer to F Board Configuration Reference.

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5.3.8 Technical Specifications

The technical specifications of the SLQ1 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications

Table 5-14 lists the specifications of the optical interfaces of the SLQ1. Table 5-14 Specifications of the optical interfaces of the SLQ1 Item Nominal bit rate Line code Optical interface type Optical source type Working wavelength (nm) Launched optical power (dBm) Receiver sensitivity (dBm) Overload optical power (dBm) Min. extinction ratio (dB) Specification 155.52 Mbit/s NRZ I-1 S-1.1 L-1.1 L-1.2 Ve-1.2 Ie-1

MLM 1260 1360 15 to 8

MLM 1261 1360 15 to 8

MLM, SLM 1263 1360 5 to 0

SLM 1480 1580 5 to 0

SLM 14801580

MLM 1260 1360 -19 -14

3 to 0

23

28

34

34

34

31

10

10

10

14

8.2

8.2

10

10

10

10

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

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Mechanical Specifications
The mechanical specifications of the N1SLQ1/N2SLQ1 are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 1.0

The mechanical specifications of the R1SLQ1 are as follows:

l l

Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W) Weight (kg): 0.4

Power Consumption
In the normal temperature (25), the maximum power consumption of the N1SLQ1/ N2SLQ1 is 15 W. In the normal temperature (25), the maximum power consumption of the R1SLQ1 is 12 W.

5.4 SLQ1A
This section describes the SLQ1A, a 4 x STM-1 optical interface board, in terms of version, function, principle, front panel and technical specifications. 5.4.1 Version Description The functional version of the SLQ1A board is N1. 5.4.2 Function and Feature The SLQ1A is used to transmit and receive STM-1 optical signals, to perform O/E conversion for the STM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals. 5.4.3 Working Principle and Signal Flow The SLQ1A board consists of the O/E conversion module, data clock recovery unit, SDH overhead processing module, logic control module, and power supply module. 5.4.4 Front Panel On the front panel of the SLQ1A board, there are indicators, interfaces, barcode and laser safety class label. 5.4.5 Valid Slots The SLQ1A board can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, and any of slots 1113 in the OptiX OSN 1500B subrack. 5.4.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the SLQ1A indicates the optical interface type. 5.4.7 Board Configuration Reference You can set parameters for the SLQ1A board on the T2000. 5.4.8 Technical Specifications The technical specifications of the SLQ1A board cover the optical interface specifications, board dimensions, weight and power consumption.
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5.4.1 Version Description

The functional version of the SLQ1A board is N1.

5.4.2 Function and Feature

The SLQ1A is used to transmit and receive STM-1 optical signals, to perform O/E conversion for the STM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals. Table 5-15 lists the functions and features of the SLQ1A board. Table 5-15 Functions and features of the SLQ1A board Function and Feature Basic function Specification of the optical interface Description Transmits and receives 4 x STM-1 optical signals. Supports standard optical interfaces of the I-1, S-1.1, L-1.1, L-1.2, Ie-1 and Ve-1.2 types. The optical interfaces of the I-1, S-1.1, L-1.1 and L-1.2 types comply with ITU-T G.957 Recommendations in features. The optical interface of the Ve-1.2 type complies with the standards defined by Huawei. Supports detection and query of the information on the optical module. The optical interface supports the function of setting the on/off state of the laser and the ALS function. Supports the usage and detection of the pluggable optical module SFP for easy maintenance. Service processing Overhead processing Supports processing the VC-12, VC-3 or VC-4 service. Supports processing the SOH bytes of the STM-1 signals. Supports the transparent transmission and termination of the POH bytes. Supports setting and querying the J0, J1 or C2 byte. Supports one to four channels of ECC communication. Alarm and performance event Protection scheme Provides abundant alarms and performance events to easily manage and maintain the equipment. Supports the two-fiber unidirectional MSP protection ring, four-fiber MSP protection ring, linear MSP protection ring, sub-network connection protection (SNCP), sub-network connection tunnel protection (SNCTP), and sub-network connection multi-protection (SNCMP).

Specification of the optical module

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Function and Feature Maintenance feature

Description Supports inloop and outloop for optical interfaces. Supports inloop and outloop at a path level. Supports warm reset and cold reset. The warm reset does not affect services. Supports querying the manufacturing information of the board. Supports loading the FPGA in-service. Supports upgrading the board software without affecting services.

5.4.3 Working Principle and Signal Flow

The SLQ1A board consists of the O/E conversion module, data clock recovery unit, SDH overhead processing module, logic control module, and power supply module. Figure 5-9 shows the block diagram for the working principle of the SLQ1A board. Figure 5-9 Block diagram for the working principle of the SLQ1A board
155 MHz

155 MHz PLL

Reference clock

Cross-connect unit

155Mbit/s 155Mbit/s

O/E O/E

S P I

155Mbit/s

CDR

155Mbit/s

K1 and K2 insertion/extration
155Mbit/s

K1 and K2

Cross-connect unit

High speed bus

....
155Mbit/s 155Mbit/s

....
155Mbit/s

Cross-connect unit A

RST
155Mbit/s 155Mbit/s

MST

MSA

HPT
High speed bus Cross-connect unit B

O/E O/E

S P I

CDR

DCC SDH overhead processing module

SCC unit

IIC LOS Laser shut down

Communication and control module

+3.3 V

Frame header Communication

Cross-connect unit SCC unit

+5 V +1.8 V

DC/DC converter

DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse

+3.3 V

+3.3 V backup power

In the receive direction

The O/E conversion module converts the received STM-1 optical signals into STM-1 electrical signals and detects the R_LOS alarm. The data clock recovery unit recovers the clock signals, and transmits the STM-1 electrical signals along with the clock signals to the overhead processing module. The overhead processing module detects the R_LOF and R_OOF alarm signals.
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The overhead processing module also extracts overhead bytes from the received STM-1 signals and transmits the signals to the cross-connect unit through the backplane bus.

In the transmit direction

The overhead processing unit inserts the overhead bytes into the electrical signals from the crossconnect units and then transmits the signals to the E/O conversion module. The E/O conversion module converts the received STM-1 electrical signals into STM-1 optical signals, which are then transmitted through fibers.

Auxiliary Unit
The auxiliary unit consists of the logic control unit and the power supply module.
l

Logic Control Module The logic control module traces the clock signals, which are received from the active or standby cross-connect board, and the frame header signals. This module controls the laser and passes through the orderwire and ECC bytes between the two optical interface boards that form the ADM. This module also selects the clock frame headers from the active or standby cross-connect board.

Power Supply Module The power supply module provides the DC voltages required by the modules of the board.

5.4.4 Front Panel

On the front panel of the SLQ1A board, there are indicators, interfaces, barcode and laser safety class label.

Appearance of the Front Panel

Figure 5-10 shows the appearance of the front panel of the SLQ1A board.

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Figure 5-10 Front panel of the SLQ1A board

SLQ1A
STAT ACT PROG SRV
CLASS1 LASER PRODUCT

SLQ1A

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4

Indicators
The following indicators are present on the front panel of the board:
l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
On the front panel of the SLQ1A board, there are four pairs of optical interfaces. Table 5-16 lists the type and usage of the optical interfaces. Table 5-16 Optical interfaces of the SLQ1A board Interface IN1-IN4 OUT1OUT4 Interface Type LC LC Usage Receives optical signals. Transmits optical signals.

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5.4.5 Valid Slots

The SLQ1A board can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, and any of slots 1113 in the OptiX OSN 1500B subrack.

5.4.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code of the SLQ1A indicates the optical interface type. Table 5-17 lists the relation between the board feature code and optical interface type of the SLQ1A. Table 5-17 Relation between the board feature code and optical interface type of the SLQ1A Board SSN1SLQ1A10 SSN1SLQ1A11 SSN1SLQ1A12 SSN1SLQ1A13 SSN1SLQ1A14 SSN1SLQ1A15 Feature Code 10 11 12 13 14 15 Optical interface type S-1.1 L-1.1 L-1.2 Ve-1.2 I-1 Ie-1

5.4.7 Board Configuration Reference

You can set parameters for the SLQ1A board on the T2000. On the T2000, you can set the following parameters for the SLQ1A board.
l l l

J0 J1 C2

For details of the parameters, see F Board Configuration Reference.

5.4.8 Technical Specifications

The technical specifications of the SLQ1A board cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications

Table 5-18 lists the specifications of the optical interfaces of the SLQ1A board.

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Table 5-18 Specifications of the optical interfaces of the SLQ1A board Item Nominal bit rate Line code Optical interface type Optical source type Working wavelength (nm) Launched optical power (dBm) Receiver sensitivity (dBm) Overload optical power (dBm) Minimum extinction ratio (dB) Specification 155520kbit/s NRZ I-1 S-1.1 L-1.1 L-1.2 Ve-1.2 Ie-1

MLM 1260-13 60 15-8

MLM 1261-136 0 15-8

MLM, SLM 1263-13 60 5-0

SLM 1480-158 0 5-0

SLM 1480-1580

MLM 1260 1360 -19 -14

3-0

23

28

34

34

34

31

10

10

10

14

8.2

8.2

10

10

10

10

Note: MLM stands for multi-longitudinal mode and SLM for single-longitudinal mode.

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SLQ1A board are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 1.0

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Power Consumption
At normal ambient temperature (25), the maximum power consumption of the SLQ1A board is 17 W.

5.5 SLO1
This section describes the SLO1, an 8 x STM-1 optical interface board, in terms of the version, function, working principle, front panel and parameters. 5.5.1 Version Description The functional version of the SLO1 board is N1. 5.5.2 Function and Feature The SLO1 is used to access 8 x STM-1 optical signals, to perform the O/E conversion to the signals, to insert or extract the overhead bytes, and to generate alarm signals. 5.5.3 Working Principle and Signal Flow The SLO1 board consists of the O/E conversion module, CDR module, SDH overhead processing module, RST and so on. 5.5.4 Front Panel On the front panel of the SLO1, there are indicators, interfaces, barcode and laser safety class label. 5.5.5 Valid Slots If the SLO1 is housed in any of slots 1213 of the OptiX OSN 1500A subrack, one to eight optical interfaces can be configured. If the SLO1 is housed in any of slots 1113 of the OptiX OSN 1500B subrack, one to eight optical interfaces can be configured. 5.5.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the SLO1 indicates the optical interface type. 5.5.7 Board Configuration Reference You can use the T2000 to set parameters for the SLO1. 5.5.8 Technical Specifications The technical specifications of the SLO1 cover the optical interface specifications, board dimensions, weight and power consumption.

5.5.1 Version Description

The functional version of the SLO1 board is N1.

5.5.2 Function and Feature

The SLO1 is used to access 8 x STM-1 optical signals, to perform the O/E conversion to the signals, to insert or extract the overhead bytes, and to generate alarm signals. Table 5-19 lists the functions and features of the SLO1.

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Table 5-19 Functions and features of the SLO1 board Function and Feature Basic function Specification of the optical interface SLO1 Receives and transmits 8 x STM-1 optical signals. Supports standard optical interfaces of the I-1.1, S-1.1, L-1.1, L-1.2 and Ve-1.2 types. The optical interfaces of the I-1, S-1.1, L-1.1 and L-1.2 types comply with ITU-T G.957 in features. The optical interface of the Ve-1.2 type complies with the standards defined by Huawei. The optical module is pluggable. When optical modules of other types are inserted, an alarm indicating the mismatch of the optical module is reported. Supports detection and query of the information on the optical module. Supports the default off state of the laser. The laser is turned off before the software finishes the initialization when the board is powered on. Supports the usage and detection of the pluggable optical module SFP. Supports the setting and query of the on/off state of the laser. An alarm is generated when the laser is turned off. Performance events are reported to indicate the performance of the optical module. Service processing Supports the processing of the VC-12, VC-3 and VC-4 services. Supports AU-3 services. Overhead processing Supports the processing of the SOH bytes of the STM-1 signals. Supports the transparent transmission and termination of the POH bytes. If the two SCC boards are not in service, the SLO1 does not transmit overhead bytes (long 0s) to the two SCC boards. Supports one to eight channels of ECC communication. Alarm and performance event Protection scheme Maintenance feature Provides rich alarms and performance events for easy management and maintenance of the equipment. Supports the two-fiber unidirectional MSP protection ring, four-fiber MSP protection ring, linear MSP, SNCP, SNCTP and SNCMP. Supports inloop and outloop for optical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services.

Specification of the optical module

5.5.3 Working Principle and Signal Flow

The SLO1 board consists of the O/E conversion module, CDR module, SDH overhead processing module, RST and so on.
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Figure 5-11 shows the block diagram for the working principle of the SLO1. Figure 5-11 Block diagram for the working principle of the SLO1
155 MHz

155 MHz PLL

Reference clock

Cross-connect unit

155Mbit/s 155Mbit/s

O/E O/E

S P I

155Mbit/s

CDR

155Mbit/s

K1 and K2 insertion/extration
155Mbit/s

K1 and K2

Cross-connect unit

High speed bus

....
155Mbit/s 155Mbit/s

....
155Mbit/s

Cross-connect unit A

RST
155Mbit/s 155Mbit/s

MST

MSA

HPT
High speed bus Cross-connect unit B

O/E O/E

S P I

CDR

DCC SDH overhead processing module

SCC unit

IIC LOS Laser shut down

Communication and control module

+3.3 V

Frame header Communication

Cross-connect unit SCC unit

+5 V +1.8 V

DC/DC converter

DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse

+3.3 V

+3.3 V backup power

PLL: phase-locked loop RST: regenerator section termination

SPI: SDH physical interface

SDH: synchronous digital hierarchy

MST: multiplex section termination MSA: multiplex section adaptation CDR: clock and data recovery

HPT: higher order path termination IIC: inter-integrated circuit

The function modules of the STM-1 units are described below:

O/E Conversion Module

l

In the receive direction, the module converts the received optical signals into electrical signals. In the transmit direction, the module converts the electrical signals into SDH optical signals, and then sends optical signals to fibers for transmission. The SPI detects the R_LOS alarm and provides function to shut down the laser.

CDR Module
l

It recovers the data signal and the clock signal.

SDH Overhead Processing Module

This module includes RST, MST, MSA and HPT. It provides inloop and outloop function.
l

RST

In the receive direction, RST performs frame alignment detection (A1, A2), regenerator section trace recovery (J0) and mismatch detection, BIP-8 errored block count.
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In the transmit direction, RST performs frame alignment insertion, regenerator section path trace insertion, BIP-8 calculation and insertion. In the receive direction, MST performs BIP-24 errored block count, multiplex sectionremote error indication (MS_REI) recovery, multiplex section-remote defect indication (MS_RDI) and multiplex section-alarm indication signal (MS_AIS) detection. In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI MS_RDI and MS_AIS insertion. MST provides extraction or insertion of K1 byte and K2 byte. In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS detection, pointer justification. In the transmit direction, MST it performs administration unit group (AUG) assembly, AU-4 pointer generation, AU_AIS generation. OH termination J1 path trace message recovery REI information recovering HP_RDI detection (path status monitoring) UNEQ and AIS detection (signal label monitoring) VC-4 BIP-8 errored block count

MST

MSA

HPT

Communication and Control Module

l l l l l

Manages and configures other modules of the boards. Performs inter-board communication through internal Ethernet interface. Traces the clock signal from the active and the standby cross-connect units. Controls the laser. Realizes the pass-through of orderwire and embedded control channel (ECC) bytes between the paired slots constituting the add/ drop multiplexer (ADM) when the CXL is not online. Selects the clock and frame header from the active or the standby cross-connect units. Controls the indicator on the board.

l l

DC/DC Converter
It provides the board with required DC voltages. It converts the 48/60 V power supply to the following voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3 V power supply.

5.5.4 Front Panel

On the front panel of the SLO1, there are indicators, interfaces, barcode and laser safety class label. Figure 5-12 shows the front panel of the SLO1.
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Figure 5-12 Front panel of the SLO1

SLO1
STAT ACT PROG SRV

CLASS1 LASER PRODUCT

SLO1

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4 OUT5 IN5 OUT6 IN6 OUT7 IN7 OUT8 IN8

Indicators
The following indicators are present on the front panel of the board:
l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are eight pairs of optical interfaces on the front panel of the SLO1. Table 5-20 lists the type and usage of the optical interfaces. Table 5-20 Optical interfaces of the SLO1 Interfaces IN1IN8 OUT1OUT8 Interface Type LC LC Usage Receives optical signals. Transmits optical signals.

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The optical interfaces of the SLO1 are level optical interfaces and indented by 20 mm. The SLO1 board can use the pluggable optical modules for easy maintenance.

WARNING
The optical interfaces of the SLO1 board are level optical interfaces. Thus, use the optical attenuator only at the ODF side.

5.5.5 Valid Slots

If the SLO1 is housed in any of slots 1213 of the OptiX OSN 1500A subrack, one to eight optical interfaces can be configured. If the SLO1 is housed in any of slots 1113 of the OptiX OSN 1500B subrack, one to eight optical interfaces can be configured.

5.5.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code of the SLO1 indicates the optical interface type. Table 5-21 lists the relation between the board feature code and optical interface type for the SLO1. Table 5-21 Relation between the board feature code and the optical interface type Board SSN2SLO110 SSN2SLO111 SSN2SLO112 SSN2SLO113 SSN2SLO114 Feature Code 10 11 12 13 14 Optical Interface Type S-1.1 L-1.1 L-1.2 Ve-1.2 I-1

5.5.7 Board Configuration Reference

You can use the T2000 to set parameters for the SLO1. You can use the T2000 to set the following parameters for the SLO1:
l l l

J0 J1 C2

For details on the parameters, refer to F Board Configuration Reference.

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5.5.8 Technical Specifications

The technical specifications of the SLO1 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications

Table 5-22 lists the specifications of the optical interfaces of the SLO1. Table 5-22 Specifications of the optical interfaces of the SLO1 Item Nominal bit rate Line code Optical interface type Optical source type Working wavelength (nm) Launched optical power (dBm) Receiver sensitivity (dBm) Overload optical power (dBm) Min. extinction ratio (dB) Specification 155520 kbit/s NRZ I-1.1 MLM 12611360 15 to 8 23 8 8.2 S-1.1 MLM 1261 1360 15 to 8 28 8 8.2 L-1.1 MLM, SLM 1263 1360 5 to 0 34 10 10 L-1.2 SLM 1480 1580 5 to 0 34 10 10 Ve-1.2 SLM 1480 1580 3 to 0 34 10 10

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SLO1 are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 1.1

Power Consumption
In the normal temperature (25), the maximum power consumption of the SLO1 is 26W.
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5.6 SLT1
This section describes the SLT1, a 12 x STM-1 optical interface board, in terms of the version, function, working principle, front panel and specifications. 5.6.1 Version Description The functional version of the SLT1 board is N1. 5.6.2 Function and Feature The SLT1 is used to transmit and receive STM-1 optical signals, to perform O/E conversion for STM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals. 5.6.3 Working Principle and Signal Flow The SLT1 board consists of the O/E conversion module, CDR module, SDH overhead processing module, RST and so on. The external services are accessed by the external interface boards EU08 and OU08 . The EU08 is an electrical interface board, and the OU08 is an optical interface board. 5.6.4 Front Panel On the front panel of the SLT1, there are indicators, interfaces, barcode and laser safety class label. 5.6.5 Valid Slots The SLT1, housed in any of slots 1213 of the OptiX OSN 1500A subrack, one to twelve optical interfaces can be configured. For the SLT1, housed in any of slots 1113 of the OptiX OSN 1500B subrack, one to twelve optical interfaces can be configured. 5.6.6 Board Configuration Reference You can use the T2000 to set parameters for the SLT1. 5.6.7 Technical Specifications The technical specifications of the SLT1 cover the optical interface specifications, board dimensions, weight and power consumption.

5.6.1 Version Description

The functional version of the SLT1 board is N1.

5.6.2 Function and Feature

The SLT1 is used to transmit and receive STM-1 optical signals, to perform O/E conversion for STM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals. Table 5-23 lists the functions and features of the SLT1. Table 5-23 Functions and features of the SLT1 Function and Feature Basic function SLT1 Transmits and receives 12 x STM-1 optical signals.

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Function and Feature Specification of the optical interface Specification of the optical module

SLT1 Supports S-1.1 standard optical interfaces compliant with ITU-T G.957 in features. Supports detection and query of the information on the optical module. The optical interface supports the function of setting the on/off state of the laser and the ALS function. Supports the usage and detection of the pluggable optical module SFP for easy maintenance.

Service processing Overhead processing

Supports the processing of the VC-12, VC-3 and VC-4 services. Supports the processing of the SOH bytes of the STM-1 signals. Supports the transparent transmission and termination of the POH bytes. Supports the setting and query of the J0/J1/C2 bytes. The port one to port eight support one to eight channels of ECC communication(D1 D12), The port nine to port twelve support one to four channels of ECC communication(D1 D3) .

Alarm and performance event Protection scheme Maintenance feature

Provides rich alarms and performance events for easy management and maintenance of the equipment. Supports the two-fiber unidirectional MSP protection ring, four-fiber MSP protection ring, linear MSP protection ring, SNCP, SNCTP, and SNCMP. Supports inloop and outloop for optical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services.

5.6.3 Working Principle and Signal Flow

The SLT1 board consists of the O/E conversion module, CDR module, SDH overhead processing module, RST and so on. The external services are accessed by the external interface boards EU08 and OU08 . The EU08 is an electrical interface board, and the OU08 is an optical interface board. Figure 5-13 shows the block diagram for the working principle of the SLT1.

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Figure 5-13 Block diagram for the working principle of the SLT1
155 MHz

155 MHz PLL

Reference clock

Cross-connect unit

155Mbit/s 155Mbit/s

O/E O/E

S P I

155Mbit/s

CDR

155Mbit/s

K1 and K2 insertion/extration
155Mbit/s

K1 and K2

Cross-connect unit

High speed bus

....
155Mbit/s 155Mbit/s

....
155Mbit/s

Cross-connect unit A

RST
155Mbit/s 155Mbit/s

MST

MSA

HPT
High speed bus Cross-connect unit B

O/E O/E

S P I

CDR

DCC SDH overhead processing module

SCC unit

IIC LOS Laser shut down

Communication and control module

+3.3 V

Frame header Communication

Cross-connect unit SCC unit

+5 V +1.8 V

DC/DC converter

DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse

+3.3 V

+3.3 V backup power

PLL: phase-locked loop RST: regenerator section termination

SPI: SDH physical interface

SDH: synchronous digital hierarchy

MST: multiplex section termination MSA: multiplex section adaptation CDR: clock and data recovery

HPT: higher order path termination IIC: inter-integrated circuit

The function modules of the STM-1 units are described below:

O/E Conversion Module

l

In the receive direction, the module converts the received optical signals into electrical signals. In the transmit direction, the module converts the electrical signals into SDH optical signals, and then sends optical signals to fibers for transmission. The SPI detects the R_LOS alarm and provides function to shut down the laser.

CDR Module
l

It recovers the data signal and the clock signal.

SDH Overhead Processing Module

This module includes RST, MST, MSA and HPT. It provides inloop and outloop function.
l

RST

In the receive direction, RST performs frame alignment detection (A1, A2), regenerator section trace recovery (J0) and mismatch detection, BIP-8 errored block count. In the transmit direction, RST performs frame alignment insertion, regenerator section path trace insertion, BIP-8 calculation and insertion.
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l

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

MST

In the receive direction, MST performs BIP-24 errored block count, multiplex sectionremote error indication (MS_REI) recovery, multiplex section-remote defect indication (MS_RDI) and multiplex section-alarm indication signal (MS_AIS) detection. In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI MS_RDI and MS_AIS insertion. MST provides extraction or insertion of K1 byte and K2 byte. In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS detection, pointer justification. In the transmit direction, MST it performs administration unit group (AUG) assembly, AU-4 pointer generation, AU_AIS generation. OH termination J1 path trace message recovery REI information recovering HP_RDI detection (path status monitoring) UNEQ and AIS detection (signal label monitoring) VC-4 BIP-8 errored block count

MSA

HPT

Communication and Control Module

l l l l l

Manages and configures other modules of the boards. Performs inter-board communication through internal Ethernet interface. Traces the clock signal from the active and the standby cross-connect units. Controls the laser. Realizes the pass-through of orderwire and embedded control channel (ECC) bytes between the paired slots constituting the add/ drop multiplexer (ADM) when the CXL is not online. Selects the clock and frame header from the active or the standby cross-connect units. Controls the indicator on the board.

l l

DC/DC Converter
It provides the board with required DC voltages. It converts the 48/60 V power supply to the following voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3 V power supply.

5.6.4 Front Panel

On the front panel of the SLT1, there are indicators, interfaces, barcode and laser safety class label.

Appearance of the Front Panel

Figure 5-14 shows the appearance of the front panel of the SLT1.
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Figure 5-14 Front panel of the SLT1

SLT1
STAT ACT PROG SRV
CLASS1 LASER PRODUCT

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4 OUT5 IN5 OUT6 IN6 OUT7 IN7 OUT8 IN8 OUT9 IN9 OUT10 IN10 OUT11 IN11 OUT12 IN12

SLT1

Indicators
The following indicators are present on the front panel of the board:
l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are 12 pairs of optical interfaces on the front panel of the SLT1. Table 5-24 lists the type and usage of the optical interfaces. Table 5-24 Optical interfaces of the SLT1 Interface IN1-IN12 OUT1-OUT12 Interface Type LC LC Usage Receives optical signals. Transmits optical signals.

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WARNING
The optical interfaces of the SLT1 board are level optical interfaces. Thus, use the optical attenuator only at the ODF side.

5.6.5 Valid Slots

The SLT1, housed in any of slots 1213 of the OptiX OSN 1500A subrack, one to twelve optical interfaces can be configured. For the SLT1, housed in any of slots 1113 of the OptiX OSN 1500B subrack, one to twelve optical interfaces can be configured.

5.6.6 Board Configuration Reference

You can use the T2000 to set parameters for the SLT1. You can use the T2000 to set the following parameters for the SLT1:
l l l

J0 J1 C2

For details on the parameters, refer to F Board Configuration Reference.

5.6.7 Technical Specifications

The technical specifications of the SLT1 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications

Table 5-25 lists the specifications of the optical interfaces of the SLT1. Table 5-25 Specifications of the optical interfaces of the SLT1 Item Nominal bit rate Line code Optical interface type Optical source type Working wavelength (nm) Launched optical power (dBm) Receiver sensitivity (dBm) Overload optical power (dBm) Min. extinction ratio (dB) Specification 155.52 Mbit/s NRZ S-1.1 MLM 12611360 15 to 8 28 8 8.2

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Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SLT1 are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 1.2

Power Consumption
In the normal temperature (25), the maximum power consumption of the SLT1 is 15 W.

5.7 SEP1
This section describes the SEP1 board, in terms of the version, function, working principle, front panel, and specifications. 5.7.1 Version Description The functional version of the SEP1 board is N1. 5.7.2 Function and Feature The SEP1 board processes STM-1 electrical signals. 5.7.3 Working Principle and Signal Flow The SEP1 board consists of the line interface module and CDR module, SDH overhead processing module, RST and so on. The external services are accessed by the external interface boards EU08 and OU08. The EU08 is an electrical interface board, and the OU08 is an optical interface board. 5.7.4 Front Panel On the front panel of the SEP1, there are indicators, interfaces and barcode. 5.7.5 Valid Slots When the SEP1 board is housed in any of slots 1213 of the OptiX OSN 1500A subrack, it cannot be used with the interface board. In the OptiX OSN 1500B subrack, when interfaces are available on the front panel of the SEP1 board, it can be housed in any of slots 1113. When the SEP1 board is used with the interface board, it is defined as SEP. In this case, it can be housed in any of slots 1213. 5.7.6 TPS Protection for the Board The TPS protection is equipment-level protection. When the working board fails, the accessed services are switched to the protection board. 5.7.7 Board Configuration Reference You can use the T2000 to set parameters for the SEP1. 5.7.8 Technical Specifications The technical specifications of the SEP1 cover the board dimensions, weight and power consumption.
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5.7.1 Version Description

The functional version of the SEP1 board is N1. When interfaces are available on the front panel of the SEP1 (the logical board is displayed as the SEP1 on the T2000), the SEP1 processes 2 x STM-1 electrical signals. In this case, the SEP1 is a 2 x STM-1 signal processing board. When the SEP1 is used with the interface board (the logical board is displayed as the SEP on the T2000), the SEP1 processes 8 x STM-1 electrical signals. In this case, the SEP1 is an 8 x STM-1 signal processing board. The physical boards for the 2 x STM-1 signal processing board and 8 x STM-1 signal processing board are both the SEP1. Thus, they are defined as the SEP1 when the logical boards are not differentiated.

5.7.2 Function and Feature

The SEP1 board processes STM-1 electrical signals. Table 5-26 lists the functions and features of the SEP1. Table 5-26 Functions and features of the SEP1 Function and Feature Basic function SEP1 Processes 2 x STM-1 signals when interfaces are available on the front panel. Processes 8 x STM-1 signals when used with the interface board. Specification of the optical module Supports detection and query of the information on the optical module. The optical interface supports the function of setting the on/off state of the laser and the ALS function. Supports the usage and monitoring of the pluggable optical module SFP. Service processing Overhead processing Supports the processing of the VC-12, VC-3 and VC-4 services. Supports the processing of the SOH bytes of the STM-1 signals. Supports the transparent transmission and termination of the POH bytes. Supports the setting and query of the J0/J1/C2 bytes. Alarm and performance event Protection scheme Provides rich alarms and performance events for easy management and maintenance of the equipment. Supports the TPS protection when used with the interface board and the switching board. Supports the two-fiber unidirectional MSP protection ring, four-fiber MSP protection ring, linear MSP protection, and SNCP.

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Function and Feature Maintenance feature

SEP1 Supports inloop and outloop for optical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services.

When the SEP1 is used with different interface boards and electrical interface switching boards, the access capabilities for the STM-1 signals are different. See Table 5-27. Table 5-27 Access capabilities for the SEP1 Interface Board None EU08 OU08 EU08+OU08 EU08+TSB8 SEP1 Accesses and processes 2 x STM-1 electrical signals, and does not support the TPS protection. Accesses and processes 8 x STM-1 electrical signals. Accesses and processes 8 x STM-1 optical signals. The hybrid usage is not supported. Accesses and processes 8 x STM-1 electrical signals, and supports the TPS protection for the SEP1 board.

CAUTION
When the SEP1 is used with the interface board, the two interfaces on the front panel are invalid. The hybrid usage of the EU08 and OU08 is not supported.

5.7.3 Working Principle and Signal Flow

The SEP1 board consists of the line interface module and CDR module, SDH overhead processing module, RST and so on. The external services are accessed by the external interface boards EU08 and OU08. The EU08 is an electrical interface board, and the OU08 is an optical interface board. Figure 5-15 shows the block diagram for the working principle of the SEP1.

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Figure 5-15 Block diagram for the working principle of the SEP1
155 MHz PLL
Reference clock Cross-connect unit

SDH overhead processing module

K1 and K2 insertion/extration

K1 and K2

Cross-connect unit

high speed bus 155 Mbit/s Port 1 155 Mbit/s 155 Mbit/s Port 2 155 Mbit/s CMI

SPI Encode/ Decode Encode/ Decode

Transfo rmer
CMI

NRZ

CDR

155 Mbit/s 155 Mbit/s

RST

MST

MSA

HPT

Cross-connect unit A Cross-connect unit B

high speed bus

NRZ

Transfor mer

CDR

155 Mbit/s 155 Mbit/s DCC

SCC unit

LOS

Frame header

Communication and control module

+3.3 V

Communication

Cross-connect unit SCC unit

+1.8 V

DC/DC converter

DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse

+3.3 V backup power

Figure 5-16 shows the block diagram for the working principle of the SEP used with the EU08. Figure 5-16 Block diagram for the working principle of the SEP used with the EU08
155 MHz PLL
EU08 155 Mbit/s Port 1 155 Mbit/s SPI CMI 155 Mbit/s 155 Mbit/s Reference clock Cross-connect unit

Transfo rmer

Encode / Decode Encode / Decode

NRZ

CDR

SDH overhead processing module

K1 and K2 insertion/extration

K1 and K2

Cross-connect unit

Port 8

155 Mbit/s 155 Mbit/s

Transfo rmer

CMI

CDR

155 Mbit/s 155 Mbit/s high speed bus Cross-connect unit A Cross-connect unit B

155 Mbit/s Port 1 155 Mbit/s Port 2 155 Mbit/s 155 Mbit/s

CMI

Transfo rmer
CMI

Encode/ Decode Encode/ Decode

CDR

155 Mbit/s 155 Mbit/s

RST

MST

MSA

HPT

high speed bus

Transfor mer

NRZ

CDR

155 Mbit/s 155 Mbit/s DCC

SCC unit

LOS

Communication and control module

+3.3 V

Frame header Communication

Cross-connect unit SCC unit

+1.8 V

DC/DC converter

DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse

+3.3 V backup power

Figure 5-17 shows the block diagram for the working principle of the SEP used with the OU08.
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Figure 5-17 Block diagram for the working principle of the SEP used with the OU08
OU08 155 Mbit/s Port 1 155 Mbit/s

155 MHz PLL

155 Mbit/s

Reference clock

Cross-connect unit

O/E O/E O/E O/E S P I

NRZ

CDR

SDH overhead processing module 155 Mbit/s

K1 and K2 insertion/extration

K1 and K2

Cross-connect unit

Port 8 155 Mbit/s 155 Mbit/s

NRZ

CDR

155 Mbit/s 155 Mbit/s high speed bus Cross-connect unit A

Port 1

155 Mbit/s 155 Mbit/s 155 Mbit/s

Transfo rmer

CMI

SPI Encode/ Decode Encode/ Decode

NRZ

CDR

155 Mbit/s 155 Mbit/s

RST

MST

MSA

HPT

high speed bus

Cross-connect unit B

Port 2

155 Mbit/s Transfor

CMI

NRZ

CDR

155 Mbit/s 155 Mbit/s DCC SCC unit

mer

LOS LOS Laser shut down +3.3 V +1.8 V

Communication and control module

Frame header Communication

Cross-connect unit SCC unit

DC/DC converter

DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse

+3.3 V backup power

The function modules are described below:

Line Interface Module and CDR Module

l

In the receive direction, the received electrical signals (CMI code) are isolated through the converter and then transmitted to the decoding unit. The CDR module then recovers the data and clock signals after decoding. In the transmit direction, the SDH signals, which are processed by the overhead processing unit, are transmitted to the encoding unit. After isolation by converter, 155 Mbit/s electrical signals (CMI code) are output. The encoding and decoding unit monitors R_LOS alarms.

SDH Overhead Processing Module

This module includes RST, MST, MSA and HPT. It also provides inloop and outloop function.
l

RST

In the receive direction, RST performs frame alignment detection (A1, A2), regenerator section trace recovery (J0) and mismatch detection, BIP-8 errored block count. In the transmit direction, RST performs frame alignment insertion, regenerator section path trace insertion, BIP-8 calculation and insertion. In the receive direction, MST performs BIP-24 errored block count, MS_REI recovery, MS_RDI and MS_AIS detection. In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI MS_RDI and MS_AIS insertion. Provides extraction or insertion of K1 byte and K2 byte.

MST

MSA
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In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS detection, pointer justification. In the transmit direction, MSA performs AUG assembly, AU-4 pointer generation, AU_AIS generation. OH termination J1 path trace message recovery REI information recovering HP_RDI detection (path status monitoring) UNEQ and AIS detection (signal label monitoring) VC-4 BIP-8 errored block count

HPT

Communication and Control Module

l l l l l

Manages and configures other modules of the boards. Performs inter-board communication through internal Ethernet interface. Traces the clock signal from the active and the standby cross-connect unit. Controls the laser. Realizes the pass-through of orderwire and ECC bytes between the paired slots constituting the ADM when the CXL is not online. Selects the clock and frame header from the active or the standby cross-connect units. Controls the indicator on the board.

l l

DC/DC Converter Module

It provides the board with required DC voltages. It converts the 48 V/ 60 V power supply to the following voltages: + 3.3 V, + 1.8 V. It also provides protection for +3.3 V power supply.

5.7.4 Front Panel

On the front panel of the SEP1, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 5-18 shows the appearance of the front panel of the SEP1.

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Figure 5-18 Front panel of the SEP1

SEP1
STAT ACT PROG SRV

OUT1 IN1 OUT2 IN2

SEP1

Indicators
The following indicators are present on the front panel of the board:
l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are two pairs of optical interfaces on the front panel of the SEP1. Table 5-28 lists the type and usage of the optical interfaces.

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Table 5-28 Electrical interfaces of the SEP1 Interface IN1-IN2 OUT1-OUT2 Interface Type 75-ohm SMB 75-ohm SMB Usage Receives the STM-1 signals. Transmits the STM-1 signals.

Note: The SEP1 board can also be used with interface boards EU08 and OU08. In this case, the SEP1 is defined as the SEP. When the SEP1 is used with the interface board, the two interfaces on the front panel are invalid.

5.7.5 Valid Slots

When the SEP1 board is housed in any of slots 1213 of the OptiX OSN 1500A subrack, it cannot be used with the interface board. In the OptiX OSN 1500B subrack, when interfaces are available on the front panel of the SEP1 board, it can be housed in any of slots 1113. When the SEP1 board is used with the interface board, it is defined as SEP. In this case, it can be housed in any of slots 1213.

5.7.6 TPS Protection for the Board

The TPS protection is equipment-level protection. When the working board fails, the accessed services are switched to the protection board. In this way, complex network-level protection, such as the MSP and SNCP, are not triggered, but the reliability of the equipment can be ensured. The OptiX OSN 1500B supports the TPS protection for the SEP1. The SEP1 board can be used with the EU08 and TSB8 boards to realize the 1:1 TPS protection for 2 x STM-1 electrical signals. The OptiX OSN 1500A does not support the SEP1 board.

Protection Principle
Figure 5-19 shows the principle of the TPS protection for the SEP1 board. Figure 5-19 Principle of the TPS protection for the SEP1
8 STM-1(e) Switch control signal

TSB8

EU08

Crossconnect and timing board

SLOT 9/10 Protection SEP Working SEP Fail SLOT12 SLOT13

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Normal state: When the working boards are running normally, the control switch of the EU08 is in position 1 and the EU08 directly accesses the service signals to the SEP1 board. Switching state: When a failure is detected on the working board, the working board housed in each slot can be protected in the following ways.

When the working board housed in slot 13 fails, the control switch of the corresponding EU08 shifts from position 1 to position 2. At the same time, the control switch of the TSB8 shifts from position 1 to position 2, and thus the working board housed in slot 13 is protected by the protection board housed in slot 12.

Hardware Configuration
Figure 5-20 shows the slot configuration for the 1:1 TPS protection for the SEP1. Figure 5-20 Slot configuration for the 1:1 TPS protection for the SEP1
Slot 14 Slot 15 Slot 16 Slot 17 Slot 11 Slot 20 FAN Slot 12 Slot 13 Slot 4 Slot 5 Protection Working CXL16/4/1 CXL16/4/1 EU08 TSB8 Slot 18 PIU

Slot 19 Slot 6 Slot 7 Slot 8 Slot 9 Slot 10

PIU

EOW AUX

As shown in Figure 5-20, the protection board housed in slot 12 protects the board housed in slot 13. Table 5-29 lists the slots for the SEP1, EU08 and TSB8. Table 5-29 Slots for the SEP1, EU08 and TSB8 Board SEP1 (working board) TSB8 SEP1 (working board) EU08 Protection Group Slot 12 Slot 14 Slot 13 Slot 16

5.7.7 Board Configuration Reference

You can use the T2000 to set parameters for the SEP1. You can use the T2000 to set the following parameters for the SEP1:
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J0 J1 C2

For details on the parameters, refer to F Board Configuration Reference.

5.7.8 Technical Specifications

The technical specifications of the SEP1 cover the board dimensions, weight and power consumption. Table 5-30 Technical specifications of the SEP1 board Item Nominal bit rate Line code Connector Specification 155.520 Mbit/s Coded mark inversion (CMI), NRZ SMB

Mechanical Specifications
The mechanical specifications of the SEP1 are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 1.0

Power Consumption
In the normal temperature (25), the maximum power consumption of the SEP1 is 17 W.

5.8 SL4
This section describes the SL4, a 1 x STM-4 optical interface board, in terms of the version, function, working principle, front panel and specifications. 5.8.1 Version Description The SL4 board has three versions, R1, N1 and N2. The difference among the three versions lies in the support for the TCM function. The R1SL4 is an STM-1 optical interface board, which is housed in a divided slot in a subrack. 5.8.2 Function and Feature The SL4 board is used to receive and transmit 1 x STM-4 optical signals, to process the overhead bytes, and to perform the MSP protection. 5.8.3 Working Principle and Signal Flow The SL4 board consists of the O/E conversion module, CDR module, SDH overhead processing module, RST and so on. 5.8.4 Front Panel
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On the front panel of the N1SL4/N2SL4, there are indicators, interfaces, barcode and laser safety class label.On the front panel of the R1SL4, there are indicators, interfaces and barcode. 5.8.5 Valid Slots The slots valid for the SL4 vary with the version of the board. 5.8.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the SL4 indicates the optical interface type. 5.8.7 Board Configuration Reference You can use the T2000 to set parameters for the SL4. 5.8.8 Technical Specifications The technical specifications of the SL4 cover the optical interface specifications, board dimensions, weight and power consumption.

5.8.1 Version Description

The SL4 board has three versions, R1, N1 and N2. The difference among the three versions lies in the support for the TCM function. The R1SL4 is an STM-1 optical interface board, which is housed in a divided slot in a subrack. Table 5-31 lists the details on the versions of the SL4 board. Table 5-31 Version Description of the SL4 Item Functional version Difference Description The SL4 has three versions, R1, N1 and N2. The N2SL4 supports the TCM function and can be configured with AU-3 services. The N1 and R1SL4 do not support the TCM function and cannot be configured with AU-3 services. The R1SL4 is housed in a divided slot. Replaceability The versions cannot be replaced by each other.

NOTE

The N2SL4 board supports the TCM function and AU-3 services, which are not supported by the N1SL4 or R1SL4 board. For this reason, when configuring MSP and SNCP, you cannot configure the N1SL4 or R1SL4 board as the protection board if the working board is N2SL4 configured with the TCM service . Otherwise, the service may be interrupted due to the switching operation.

5.8.2 Function and Feature

The SL4 board is used to receive and transmit 1 x STM-4 optical signals, to process the overhead bytes, and to perform the MSP protection. The SL4 is used to transmit and receive STM-4 optical signals, to perform O/E conversion for STM-4 signals, to extract or insert overhead bytes, and to generate alarm signals on the line. Table 5-32 lists the functions and features of the SL4.
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Table 5-32 Functions and features of the SL4 Function and Feature Basic function Specification of the optical interface Specification of the optical module SL4 Receives and transmits 1 x STM-4 optical signals, and processes 1 x STM-4 standard or concatenation services. Supports standard optical interfaces of the I-4, S-4.1, L-4.1, L-4.2 and Ve-4.2 types. The optical interfaces of the I-4, S-4.1, L-4.1 and L-4.2 types comply with ITU-T G.957 in features. The optical interface of the Ve-4.2 type complies with the standards defined by Huawei. Supports detection and query of the information on the optical module. The optical interface supports the function of setting the on/off state of the laser and the ALS function. Supports the usage and monitoring of the pluggable optical module SFP. Service processing Overhead processing Supports VC-12, VC-3, and VC-4 services and VC4-4c concatenation services. Supports the processing of the SOH bytes of the STM-4 signals. Supports the transparent transmission and termination of the POH bytes. Supports the setting and query of the J0/J1/C2 bytes. Provides rich alarms and performance events for easy management and maintenance of the equipment. Supports the two-fiber MSP protection ring, four-fiber MSP protection ring, linear MSP, SNCP, SNCTP, and SNCMP. Supports the optical-path-shared MSP and SNCP protection. Maintenance feature Supports inloop and outloop for optical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services.

Alarm and performance event Protection scheme

5.8.3 Working Principle and Signal Flow

The SL4 board consists of the O/E conversion module, CDR module, SDH overhead processing module, RST and so on. Figure 5-21 shows the block diagram for the working principle of the SL4.

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Figure 5-21 Block diagram for the working principle of the SL4
155 MHz

155 MHz PLL

Reference clock

Cross-connect unit

622Mbit/s 622Mbit/s

O/E O/E

S P I

622Mbit/s

CDR

622Mbit/s

K1 and K2 insertion/extration
622Mbit/s

K1 and K2

Cross-connect unit

High speed bus

....
622Mbit/s 622Mbit/s

....
622Mbit/s

Cross-connect unit A

RST
622Mbit/s 622Mbit/s

MST

MSA

HPT
High speed bus Cross-connect unit B

O/E O/E

S P I

CDR

DCC SDH overhead processing module

SCC unit

IIC LOS Laser shut down

Communication and control module

+3.3 V

Frame header Communication

Cross-connect unit SCC unit

+5 V +1.8 V

DC/DC converter

DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse

+3.3 V

+3.3 V backup power

PLL: phase-locked loop RST: regenerator section termination

SPI: SDH physical interface

SDH: synchronous digital hierarchy

MST: multiplex section termination MSA: multiplex section adaptation CDR: clock and data recovery

HPT: higher order path termination IIC: inter-integrated circuit

The function modules of the STM-4 units are described below:

O/E Conversion Module

l

In the receive direction, the module converts the received optical signals into electrical signals. In the transmit direction, the module converts the electrical signals into SDH optical signals, and then sends optical signals to fibers for transmission. The SPI detects the R_LOS alarm and provides function to shut down the laser.

CDR Module
l

It recovers the data signal and the clock signal.

SDH Overhead Processing Module

This module includes RST, MST, MSA and HPT. It provides inloop and outloop function.
l

RST

In the receive direction, RST performs frame alignment detection (A1, A2), regenerator section trace recovery (J0) and mismatch detection, BIP-8 errored block count. In the transmit direction, RST performs frame alignment insertion, regenerator section path trace insertion, BIP-8 calculation and insertion.
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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

MST

In the receive direction, MST performs BIP-24 errored block count, multiplex sectionremote error indication (MS_REI) recovery, multiplex section-remote defect indication (MS_RDI) and multiplex section-alarm indication signal (MS_AIS) detection. In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI MS_RDI and MS_AIS insertion. MST provides extraction or insertion of K1 byte and K2 byte. In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS detection, pointer justification. In the transmit direction, MST it performs administration unit group (AUG) assembly, AU-4 pointer generation, AU_AIS generation. OH termination J1 path trace message recovery REI information recovering HP_RDI detection (path status monitoring) UNEQ and AIS detection (signal label monitoring) VC-4 BIP-8 errored block count

MSA

HPT

Communication and Control Module

l l l l l

Manages and configures other modules of the boards. Performs inter-board communication through internal Ethernet interface. Traces the clock signal from the active and the standby cross-connect units. Controls the laser. Realizes the pass-through of orderwire and embedded control channel (ECC) bytes between the paired slots constituting the add/ drop multiplexer (ADM) when the CXL is not online. Selects the clock and frame header from the active or the standby cross-connect units. Controls the indicator on the board.

l l

DC/DC Converter
It provides the board with required DC voltages. It converts the 48/60 V power supply to the following voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3 V power supply.

5.8.4 Front Panel

On the front panel of the N1SL4/N2SL4, there are indicators, interfaces, barcode and laser safety class label.On the front panel of the R1SL4, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 5-22 shows the appearance of the front panel of the N1SL4/N2SL4.
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Figure 5-22 Front panel of the N1SL4/N2SL4

SL4
STAT ACT PROG SRV

CLASS1 LASER PRODUCT

OUT

IN

SL4

Figure 5-23 shows the appearance of the front panel of the R1SL4. Figure 5-23 Front panel of the R1SL4

SL4
STAT ACT PROG SRV

OUT IN

SL4

Indicators
The following indicators are present on the front panel of the board:
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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There is one pair of optical interfaces on the front panel of the SL4. Table 5-33 lists the type and usage of the optical interfaces. Table 5-33 Optical interfaces of the SL4 Interface IN OUT Interface Type LC LC Usage Receives optical signals. Transmits optical signals.

The SL4 board can use the pluggable optical modules for easy maintenance.

5.8.5 Valid Slots

The slots valid for the SL4 vary with the version of the board. The slots valid for the SL4 are as follows:
l

The R1SL4 can be housed in any of slots 23, 69 and 1213 in the OptiX OSN 1500A subrack. The N1SL4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The N2SL4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The R1SL4 can be housed in any of slots 13, 69 and 1113 in the OptiX OSN 1500B subrack. The N1SL4 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack. The N2SL4 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

l l l

l l

5.8.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code of the SL4 indicates the optical interface type. Table 5-34 lists the relation between the board feature code and optical interface type for the SL4. Table 5-34 Relation between the board feature code and the optical interface type of the SL4 Board SSN1SL410, SSN2SL410
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Feature Code 10

Optical Interface Type S-4.1

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Board SSN1SL411, SSN2SL411 SSN1SL412, SSN2SL412 SSN1SL413, SSN2SL413 SSN1SL414, SSN2SL414

Feature Code 11 12 13 14

Optical Interface Type L-4.1 L-4.2 Ve-4.2 I-4

5.8.7 Board Configuration Reference

You can use the T2000 to set parameters for the SL4. You can use the T2000 to set the following parameters for the SL4:
l l l

J0 J1 C2

For details on the parameters, refer to F Board Configuration Reference.

5.8.8 Technical Specifications

The technical specifications of the SL4 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications

Table 5-35 lists the specifications of the optical interfaces of the SL4. Table 5-35 Specifications of the optical interfaces of the SL4 Item Nominal bit rate Line code Optical interface type Optical source type Working wavelength (nm) Launched optical power (dBm) Receiver sensitivity (dBm)
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Specification 622080 kbit/s NRZ I-4 MLM 12611360 15 to 8 23 S-4.1 MLM 12741356 15 to 8 28 L-4.1 SLM 12801335 3 to +2 28 L-4.2 SLM 14801580 3 to +2 28 Ve-4.2 SLM 14801580 3 to +2 34

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Item Overload optical power (dBm) Min. extinction ratio (dB)

Specification 8 8.2 8 8.2 8 10 8 10 13 10.5

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the N1SL4/N2SL4 are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 1.0

The mechanical specifications of the R1SL4 are as follows:

l l

Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W) Weight (kg): 0.5

Power Consumption
In the normal temperature (25), the maximum power consumption of the N1SL4/N2SL4 is 15 W. In the normal temperature (25), the maximum power consumption of the R1SL4 is 10 W.

5.9 SL4A
This section describes the SL4A, a 1 x STM-4 optical interface board, in terms of version, function, principle, front panel and technical specifications. 5.9.1 Version Description The functional version of the SL4A board is N1. 5.9.2 Function and Feature The SL4A board is used to receive and transmit 1 x STM-4 optical signals, to process the overhead bytes, and to perform the MSP protection. 5.9.3 Working Principle and Signal Flow The SL4A board consists of the O/E conversion module, data clock recovery unit, SDH overhead processing module, logic control module and power supply module. 5.9.4 Front Panel On the front panel of the SL4A board, there are indicators, interfaces, barcode and laser safety class label. 5.9.5 Valid Slots
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The SL4A board can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The SL4A board can be housed in any of slots 1113 in the OptiX OSN 1500B subrack. 5.9.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the SL4A indicates the optical interface type. 5.9.7 Board Configuration Reference You can set parameters for the SL4A board on the T2000. 5.9.8 Technical Specifications The technical specifications of the SL4A board cover the optical interface specifications, board dimensions, weight and power consumption.

5.9.1 Version Description

The functional version of the SL4A board is N1.

5.9.2 Function and Feature

The SL4A board is used to receive and transmit 1 x STM-4 optical signals, to process the overhead bytes, and to perform the MSP protection. The SL4A board is used to transmit and receive STM-4 optical signals, to perform O/E conversion on STM-4 signals, to extract or insert overhead bytes, and to generate alarm signals. Table 5-36 lists the functions and features of the SL4A board. Table 5-36 Functions and features of the SL4A Function and Feature Basic function Specification of the optical interface Description Receives and transmits 1 x STM-4 optical signals, and processes 1 x STM-4 standard or concatenation services. Supports standard optical interfaces of the I-4, S-4.1, L-4.1, L-4.2 and Ve-4.2 types. The optical interfaces of the I-4, S-4.1, L-4.1 and L-4.2 types comply with ITU-T G.957 Recommendations in features. The optical interface of the Ve-4.2 type complies with the standards defined by Huawei. Supports detection and query of the information on the optical module. The optical interface supports the function of setting the on/off state of the laser and the ALS function. Supports using and monitoring the SFP pluggable optical module. Service processing Overhead processing Supports VC-12, VC-3, VC-4 services and VC4-4c concatenation services. Supports processing the SOH bytes of the STM-4 signals. Supports the transparent transmission and termination of the POH bytes. Supports the setting and query of the J0, J1 and C2 bytes.

Specification of the optical module

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Function and Feature Alarm and performance event Protection scheme

Description Provides abundant alarms and performance events to easily manage and maintain the equipment. Supports the two-fiber MSP protection ring, four-fiber MSP protection ring, linear MSP, sub-network connection protection (SNCP), subnetwork connection tunnel protection (SNCTP) and sub-network connection multi-protection (SNCMP). Supports the optical-path-shared MSP and SNCP protection.

Maintenance feature

Supports inloop and outloop for optical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports querying the manufacturing information of the board. Supports loading the FPGA in-service. Supports upgrading the board software without affecting services.

5.9.3 Working Principle and Signal Flow

The SL4A board consists of the O/E conversion module, data clock recovery unit, SDH overhead processing module, logic control module and power supply module. Figure 5-24 shows the block diagram for the working principle of the SL4A. Figure 5-24 Block diagram for the working principle of the SL4A
155 MHz

155 MHz PLL

Reference clock

Cross-connect unit

622Mbit/s 622Mbit/s

O/E O/E

S P I

622Mbit/s

CDR

622Mbit/s

K1 and K2 insertion/extration
622Mbit/s

K1 and K2

Cross-connect unit

High speed bus

....
622Mbit/s 622Mbit/s

....
622Mbit/s

Cross-connect unit A

RST
622Mbit/s 622Mbit/s

MST

MSA

HPT
High speed bus Cross-connect unit B

O/E O/E

S P I

CDR

DCC SDH overhead processing module

SCC unit

IIC LOS Laser shut down

Communication and control module

+3.3 V

Frame header Communication

Cross-connect unit SCC unit

+5 V +1.8 V

DC/DC converter

DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse

+3.3 V

+3.3 V backup power

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In the receive direction

The O/E conversion module converts the received STM-4 optical signals into STM-4 electrical signals, detects the R_LOS alarm, and transmits the STM-4 electrical signals to the SDH overhead processing module. The overhead processing module detects the R_LOF and R_OOF alarm signals. The data clock recovery unit recovers the clock signals, and transmits the STM-4 electrical signals along with the clock signals to the overhead processing module. The overhead processing module detects the R_LOF and R_OOF alarm signals. extracts and processes the overhead bytes from the STM-4 signals, and transmits the signals to the cross-connect unit through the backplane bus.

In the transmit direction

The overhead processing unit inserts the overhead bytes into the electrical signals from the crossconnect units and then transmits the signals to the E/O conversion module. The E/O conversion module converts the received STM-4 electrical signals into STM-4 optical signals, which are then transmitted through fibers.

Auxiliary Unit
The auxiliary unit consists of the logic control unit and the power supply module.
l

Logic Control Module The logic control module traces the clock signals, which are received from the active or standby cross-connect board, and the frame header signals. This module controls the laser and passes through the orderwire and ECC bytes between the two optical interface boards that form the ADM. This module also selects the clock frame headers from the active or standby cross-connect board.

Power Supply Module The power supply module provides the DC voltages required by the modules of the board.

5.9.4 Front Panel

On the front panel of the SL4A board, there are indicators, interfaces, barcode and laser safety class label.

Appearance of the Front Panel

Figure 5-25 shows the appearance of the front panel of the SL4A board.

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Figure 5-25 Front panel of the SL4A board

SL4A
STAT ACT PROG SRV

CLASS1 LASER PRODUCT

OUT

IN

SL4A

Indicators
The following indicators are present on the front panel of the board:
l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
On the front panel of the SL4A board, there is one pair of optical interfaces. Table 5-37 lists the type and usage of the optical interfaces. Table 5-37 Optical interfaces of the SL4A Interface IN OUT Interface Type LC LC Usage Receives optical signals. Transmits optical signals.

The SL4A board can use the pluggable optical modules for easy maintenance.
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5.9.5 Valid Slots

The SL4A board can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The SL4A board can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

5.9.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code of the SL4A indicates the optical interface type. Table 5-38 lists the relation between the board feature code and optical interface type of the SL4A. Table 5-38 Relation between the board feature code and optical interface type of the SL4A Board SSN1SL4A10 SSN1SL4A11 SSN1SL4A12 SSN1SL4A13 SSN1SL4A14 Feature Code 10 11 12 13 14 Optical Interface Type S-4.1 L-4.1 L-4.2 Ve-4.2 I-4

5.9.7 Board Configuration Reference

You can set parameters for the SL4A board on the T2000. On the T2000, you can set the following parameters for the SL4A board.
l l l

J0 J1 C2

For details of the parameters, see F Board Configuration Reference.

5.9.8 Technical Specifications

The technical specifications of the SL4A board cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications

Table 5-39 lists the specifications of the optical interfaces of the SL4A board.

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Table 5-39 Specifications of the optical interfaces of the SL4A board Item Nominal bit rate Line code Optical interface type Optical source type Working wavelength (nm) Launched optical power (dBm) Receiver sensitivity (dBm) Overload optical power (dBm) Minimum extinction ratio (dB) Specification 622080 kbit/s NRZ I-4 MLM 1261-1360 15-8 23 8 8.2 S-4.1 MLM 1274-1356 15-8 28 8 8.2 L-4.1 SLM 1280-1335 3-2 28 8 10 L-4.2 SLM 1480-1580 3-2 28 8 10 Ve-4.2 SLM 1480-1580 3-2 34 13 10.5

Note: MLM stands for multi-longitudinal mode and SLM for single-longitudinal mode.

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SL4A board are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 1.0

Power Consumption
At normal ambient temperature (25), the maximum power consumption of the SL4A board is 17 W.

5.10 SLD4
This section describes the SLD4, a 2 x STM-4 optical interface board, in terms of the version, function, working principle, front panel and specifications.

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5.10.1 Version Description The SLD4 board has three versions, R1, N1 and N2. The difference among the three versions lies in the support for the TCM function. The R1SLD4 is a 2 x STM-1 optical interface board, which is housed in a divided slot in a subrack. 5.10.2 Function and Feature The SLD4 is used to transmit and receive STM-4 optical signals, to perform O/E conversion for STM-4 signals, to extract or insert overhead bytes, and to generate alarm signals on the line. 5.10.3 Working Principle and Signal Flow The SLD4 board consists of the O/E conversion module, CDR module, SDH overhead processing module so on. 5.10.4 Front Panel On the front panel of the N1SLD4/N2SLD4, there are indicators, interfaces, barcode and laser safety class label.On the front panel of the R1SLD4, there are indicators, interfaces and barcode. 5.10.5 Valid Slots The slots valid for the SLD4 vary with the cross-connect capacity of the subrack. 5.10.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the SLD4 indicates the optical interface type. 5.10.7 Board Configuration Reference You can use the T2000 to set parameters for the SLD4. 5.10.8 Technical Specifications The technical specifications of the SLD4 cover the optical interface specifications, board dimensions, weight and power consumption.

5.10.1 Version Description

The SLD4 board has three versions, R1, N1 and N2. The difference among the three versions lies in the support for the TCM function. The R1SLD4 is a 2 x STM-1 optical interface board, which is housed in a divided slot in a subrack. Table 5-40 lists the details on the versions of the SLD4 board. Table 5-40 Version Description of the SLD4 Item Functional version Difference Description The SLD4 has three versions, R1, N1 and N2. The N2SLD4 supports the TCM function and can be configured with AU-3 services. The N1SLD4 and R1SLD4 do not support the TCM function and cannot be configured with AU-3 services. The SLD4 board of the R1SLD4 is housed in a divided slot. Replaceability The versions cannot be replaced by each other.

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NOTE

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

The N2SLD4 board supports the TCM function and AU-3 services, which are not supported by the N1SLD4 or R1SLD4 board. For this reason, when configuring MSP and SNCP, you cannot configure the N1SLD4 or R1SLD4 board as the protection board if the working board is N2SLD4 configured with the TCM service .Otherwise, the service may be interrupted due to the switching operation.

5.10.2 Function and Feature

The SLD4 is used to transmit and receive STM-4 optical signals, to perform O/E conversion for STM-4 signals, to extract or insert overhead bytes, and to generate alarm signals on the line. Table 5-41 lists the functions and features of the SLD4. Table 5-41 Functions and features of the SLD4 Function and Feature Basic function Specification of the optical interface Specifications of the optical module SLD4 Receives and transmits 2 x STM-4 optical signals, and processes 2 x STM-4 standard or concatenation services. Supports standard optical interfaces of the I-4, S-4.1, L-4.1, L-4.2 and Ve-4.2 types. The optical interfaces of the I-4, S-4.1, L-4.1 and L-4.2 types comply with ITU-T G.957 in features. The optical interface of the Ve-4.2 type complies with the standards defined by Huawei. Supports detection and query of the information on the optical module. The optical interface supports the function of setting the on/off state of the laser and the ALS function. Supports the usage and monitoring of the pluggable optical module SFP. Service processing Overhead processing Supports VC-12, VC-3, and VC-4 services and VC4-4c concatenation services. Supports the processing of the SOH bytes of the STM-4 signals. Supports the transparent transmission or termination of the POH bytes. Supports the setting and query of the J0/J1/C2 bytes. Supports one to two channels of ECC communication. Alarm and performance event Protection scheme Provides rich alarms and performance events for easy management and maintenance of the equipment. Supports the two-fiber MSP protection ring, four-fiber MSP protection ring, linear MSP, SNCP, SNCTP, and SNCMP. Supports the optical-path-shared MSP and SNCP protection. Maintenance feature Supports inloop and outloop for optical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services.
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5.10.3 Working Principle and Signal Flow

The SLD4 board consists of the O/E conversion module, CDR module, SDH overhead processing module so on. Figure 5-26 shows the block diagram for the working principle of the SLD4. Figure 5-26 Block diagram for the working principle of the SLD4
155 MHz

155 MHz PLL

Reference clock

Cross-connect unit

622Mbit/s 622Mbit/s

O/E O/E

S P I

622Mbit/s

CDR

622Mbit/s

K1 and K2 insertion/extration
622Mbit/s

K1 and K2

Cross-connect unit

High speed bus

....
622Mbit/s 622Mbit/s

....
622Mbit/s

Cross-connect unit A

RST
622Mbit/s 622Mbit/s

MST

MSA

HPT
High speed bus Cross-connect unit B

O/E O/E

S P I

CDR

DCC SDH overhead processing module

SCC unit

IIC LOS Laser shut down

Communication and control module

+3.3 V

Frame header Communication

Cross-connect unit SCC unit

+5 V +1.8 V

DC/DC converter

DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse

+3.3 V

+3.3 V backup power

PLL: phase-locked loop RST: regenerator section termination

SPI: SDH physical interface

SDH: synchronous digital hierarchy

MST: multiplex section termination MSA: multiplex section adaptation CDR: clock and data recovery

HPT: higher order path termination IIC: inter-integrated circuit

The function modules of the STM-4 units are described below:

O/E Conversion Module

l

In the receive direction, the module converts the received optical signals into electrical signals. In the transmit direction, the module converts the electrical signals into SDH optical signals, and then sends optical signals to fibers for transmission. The SPI detects the R_LOS alarm and provides function to shut down the laser.

CDR Module
l

It recovers the data signal and the clock signal.

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SDH Overhead Processing Module

This module includes RST, MST, MSA and HPT. It provides inloop and outloop function.
l

RST

In the receive direction, RST performs frame alignment detection (A1, A2), regenerator section trace recovery (J0) and mismatch detection, BIP-8 errored block count. In the transmit direction, RST performs frame alignment insertion, regenerator section path trace insertion, BIP-8 calculation and insertion. In the receive direction, MST performs BIP-24 errored block count, multiplex sectionremote error indication (MS_REI) recovery, multiplex section-remote defect indication (MS_RDI) and multiplex section-alarm indication signal (MS_AIS) detection. In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI MS_RDI and MS_AIS insertion. MST provides extraction or insertion of K1 byte and K2 byte. In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS detection, pointer justification. In the transmit direction, MST it performs administration unit group (AUG) assembly, AU-4 pointer generation, AU_AIS generation. OH termination J1 path trace message recovery REI information recovering HP_RDI detection (path status monitoring) UNEQ and AIS detection (signal label monitoring) VC-4 BIP-8 errored block count

MST

MSA

HPT

Communication and Control Module

l l l l l

Manages and configures other modules of the boards. Performs inter-board communication through internal Ethernet interface. Traces the clock signal from the active and the standby cross-connect units. Controls the laser. Realizes the pass-through of orderwire and embedded control channel (ECC) bytes between the paired slots constituting the add/ drop multiplexer (ADM) when the CXL is not online. Selects the clock and frame header from the active or the standby cross-connect units. Controls the indicator on the board.

l l

DC/DC Converter
It provides the board with required DC voltages. It converts the 48/60 V power supply to the following voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3 V power supply.
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5.10.4 Front Panel

On the front panel of the N1SLD4/N2SLD4, there are indicators, interfaces, barcode and laser safety class label.On the front panel of the R1SLD4, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 5-27 shows the appearance of the front panel of the N1SLD4/N2SLD4. Figure 5-27 Front panel of the N1SLD4/N2SLD4
SLD4
STAT ACT PROG SRV
CLASS1 LASER PRODUCT

OUT1 IN1 OUT2 IN2

SLD4

Figure 5-28 shows the appearance of the front panel of the R1SLD4.

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Figure 5-28 Front panel of the R1SLD4

SLD4
STAT ACT PROG SRV

SLD4

OUT IN OUT IN

Indicators
The following indicators are present on the front panel of the board:
l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are two pairs of optical interfaces on the front panel of the SLD4. Table 5-42 lists the type and usage of the optical interfaces. Table 5-42 Optical interfaces of the SLD4 Interface IN1-IN2 OUT1-OUT2 Interface Type LC LC Usage Receives optical signals. Transmits optical signals.

The SLD4 board can use the pluggable optical modules for easy maintenance.

5.10.5 Valid Slots

The slots valid for the SLD4 vary with the cross-connect capacity of the subrack. The slots valid for the SLD4 are as follows:
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The R1SLD4 can be housed in any of slots 23, 69 and 1213 in the OptiX OSN 1500A subrack. The N1SLD4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The N2SLD4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The R1SLD4 can be housed in any of slots 13, 69 and 1113 in the OptiX OSN 1500B subrack. For the board housed in any of slots 13 and 1113, two optical interfaces can be configured. For the board housed in any of slots 69, one optical interface can be configured. The N1SLD4 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack. The N2SLD4 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

l l l

l l

5.10.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code of the SLD4 indicates the optical interface type. Table 5-43 lists the relation between the board feature code and optical interface type for the SLD4. Table 5-43 Relation between the board feature code and the optical interface type of the SLD4 Board SSN1SLD410, SSN2SLD410 SSN1SLD411, SSN2SLD411 SSN1SLD412, SSN2SLD412 SSN1SLD413, SSN2SLD413 SSN1SLD414, SSN2SLD414 Feature Code 10 11 12 13 14 Optical Interface Type S-4.1 L-4.1 L-4.2 Ve-4.2 I-4

5.10.7 Board Configuration Reference

You can use the T2000 to set parameters for the SLD4. You can use the T2000 to set the following parameters for the SLD4:
l l l

J0 J1 C2

For details on the parameters, refer to F Board Configuration Reference.

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5.10.8 Technical Specifications

The technical specifications of the SLD4 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications

Table 5-44 lists the specifications of the optical interfaces of the SLD4. Table 5-44 Specifications of the optical interfaces of the SLD4 Item Nominal bit rate Line code Optical interface type Optical source interface Working wavelength (nm) Launched optical power (dBm) Receiver sensitivity (dBm) Overload optical power (dBm) Min. extinction ratio (dB) Specification 622080 kbit/s NRZ I-4 MLM 12611360 S-4.1 MLM 12741356 L-4.1 SLM 12801335 L-4.2 SLM 14801580 Ve-4.2 SLM 14801580

15 to 8

15 to 8

3 to +2

3 to +2

3 to +2

23

28

28

28

34

13

8.2

8.2

10

10

10.5

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the N1SLD4/N2SLD4 are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 1.0
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The mechanical specifications of the R1SLD4 are as follows:

l l

Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W) Weight (kg): 0.5

Power Consumption
In the normal temperature (25), the maximum power consumption of the N1SLD4/N2SLD4 is 15 W. In the normal temperature (25), the maximum power consumption of the R1SLD4 is 11 W.

5.11 SLD4A
This section describes the SLD4A, a 2 x STM-4 optical interface board, in terms of version, function, principle, front panel and technical specifications. 5.11.1 Version Description The functional version of the SLD4A board is N1. 5.11.2 Function and Feature The SLD4A board is used to transmit and receive STM-4 optical signals, to perform O/E conversion for STM-4 signals, to extract or insert overhead bytes, and to generate alarm signals. 5.11.3 Working Principle and Signal Flow The SLD4A board consists of the O/E conversion module, SDH overhead processing module, logic control module and power supply module. 5.11.4 Front Panel On the front panel of the SLD4A board, there are indicators, interfaces, barcode and laser safety class label. 5.11.5 Valid Slots The SLD4A can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The SL4A board can be housed in any of slots 1113 in the OptiX OSN 1500B subrack. 5.11.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the SLD4A indicates the optical interface type. 5.11.7 Board Configuration Reference You can set parameters for the SLD4A board on the T2000. 5.11.8 Technical Specifications The technical specifications of the SLD4A board cover the optical interface specifications, board dimensions, weight and power consumption.

5.11.1 Version Description

The functional version of the SLD4A board is N1.

5.11.2 Function and Feature

The SLD4A board is used to transmit and receive STM-4 optical signals, to perform O/E conversion for STM-4 signals, to extract or insert overhead bytes, and to generate alarm signals.
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Table 5-45 lists the functions and features of the SLD4A board. Table 5-45 Functions and features of the SLD4A board Function and Feature Basic function Specification of the optical interface Description Receives and transmits 2 x STM-4 optical signals, and processes 2 x STM-4 standard or concatenation services. Supports standard optical interfaces of the I-4, S-4.1, L-4.1, L-4.2 and Ve-4.2 types. The optical interfaces of the I-4, S-4.1, L-4.1 and L-4.2 types comply with ITU-T G.957 Recommendations in features. The optical interface of the Ve-4.2 type complies with the standards defined by Huawei. Supports detection and query of the information on the optical module. The optical interface supports the function of setting the on/off state of the laser and the ALS function. Supports using and monitoring the SFP pluggable optical module. Service processing Overhead processing Supports VC-12, VC-3, VC-4 services and VC4-4c concatenation services. Supports processing the SOH bytes of the STM-4 signals. Supports the transparent transmission and termination of the POH bytes. Supports setting and querying the J0, J1 or C2 byte. Supports one to two channels of ECC communication. Alarm and performance event Protection scheme Provides abundant alarms and performance events to easily manage and maintain the equipment. Supports the two-fiber MSP protection ring, four-fiber MSP protection ring, linear MSP, sub-network connection protection (SNCP), subnetwork connection tunnel protection (SNCTP) and sub-network connection multi-protection (SNCMP). Supports the optical-path-shared MSP and SNCP protection. Maintenance feature Supports inloop and outloop for optical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports querying the manufacturing information of the board. Supports loading the FPGA in-service. Supports upgrading the board software without affecting services.

Specification of the optical module

5.11.3 Working Principle and Signal Flow

The SLD4A board consists of the O/E conversion module, SDH overhead processing module, logic control module and power supply module. Figure 5-29 shows the block diagram for the working principle of the SLD4A board.
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Figure 5-29 Block diagram for the working principle of the SL4A board
Slot 1 Slot 20 FAN Slot 12 Slot 13 Slot 4 Slot 5 CXL CXL Slot 11 Slot 6 Slot 7 Slot 8 Slot 9 Slot 10 EOW AUX

In the receive direction

The O/E conversion module converts the received STM-4 optical signals into STM-4 electrical signals, detects the R_LOS alarm, and transmits the STM-4 electrical signals to the SDH overhead processing module. The overhead processing module detects the R_LOF and R_OOF alarm signals. extracts and processes the overhead bytes from the STM-4 signals, and transmits the signals to the cross-connect unit through the backplane bus.

In the transmit direction

The overhead processing unit inserts the overhead bytes into the electrical signals from the crossconnect units and then transmits the signals to the E/O conversion module. The E/O conversion module converts the received STM-4 electrical signals into STM-4 optical signals, which are then transmitted through fibers.

Auxiliary Unit
The auxiliary unit consists of the logic control unit and the power supply module.
l

Logic Control Module The logic control module traces the clock signals, which are received from the active or standby cross-connect board, and the frame header signals. This module controls the laser and passes through the orderwire and ECC bytes between the two optical interface boards that form the ADM. This module also selects the clock frame headers from the active or standby cross-connect board.

Power Supply Module The power supply module provides the DC voltages required by the modules of the board.

5.11.4 Front Panel

On the front panel of the SLD4A board, there are indicators, interfaces, barcode and laser safety class label.

Appearance of the Front Panel

Figure 5-30 shows the appearance of the front panel of the SLD4A board.

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Figure 5-30 Front panel of the SLD4A board

SLD4A
STAT ACT PROG SRV
CLASS1 LASER PRODUCT

SLD4A

OUT1 IN1 OUT2 IN2

Indicators
The following indicators are present on the front panel of the board:
l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
On the front panel of the SLD4A board, there are two pairs of optical interfaces. Table 5-46 lists the type and usage of the optical interfaces. Table 5-46 Optical interfaces of the SLD4A board Interface IN1IN2 OUT1OUT2 Interface Type LC LC Usage Receives optical signals. Transmits optical signals.

The SLD4A board can use the pluggable optical modules for easy maintenance.
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5.11.5 Valid Slots

The SLD4A can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The SL4A board can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

5.11.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code of the SLD4A indicates the optical interface type. Table 5-47 lists the relation between the board feature code and optical interface type of the SLD4A. Table 5-47 Relation between the board feature code and optical interface type of the SLD4A Board SSN1SLD4A10 SSN1SLD4A11 SSN1SLD4A12 SSN1SLD4A13 SSN1SLD4A14 Feature Code 10 11 12 13 14 Optical Interface Type S-4.1 L-4.1 L-4.2 Ve-4.2 I-4

5.11.7 Board Configuration Reference

You can set parameters for the SLD4A board on the T2000. On the T2000, you can set the following parameters for the SLD4A board.
l l l

J0 J1 C2

For details of the parameters, see F Board Configuration Reference.

5.11.8 Technical Specifications

The technical specifications of the SLD4A board cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications

Table 5-48 lists the specifications of the optical interfaces of the SLD4A board.

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Table 5-48 Specifications of the optical interfaces of the SLD4A board Item Nominal bit rate Line code Optical interface type Optical source interface Working wavelength (nm) Launched optical power (dBm) Receiver sensitivity (dBm) Overload optical power (dBm) Minimum extinction ratio (dB) Specification 622080 kbit/s NRZ I-4 MLM 1261-1360 S-4.1 MLM 1274-1356 L-4.1 SLM 1280-1335 L-4.2 SLM 1480-1580 Ve-4.2 SLM 1480-1580

15-8

15-8

3-2

3-2

3-2

23

28

28

28

34

13

8.2

8.2

10

10

10.5

Note: MLM stands for multi-longitudinal mode and SLM for single-longitudinal mode.

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SLD4A board are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 1.0

Power Consumption
At normal ambient temperature (25), the maximum power consumption of the SLD4A is 17 W.

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5.12 SLQ4
This section describes the SLQ4, a 4 x STM-4 optical interface board, in terms of the version, function, working principle, front panel and specifications. 5.12.1 Version Description The SLQ4 board has two versions, N1 and N2. The difference between the two versions lies in the support for the TCM function. 5.12.2 Function and Feature The SLQ4 is used to transmit and receive STM-4 optical signals, to perform O/E conversion for STM-4 signals, to extract or insert overhead bytes, and to generate alarm signals on the line. 5.12.3 Working Principle and Signal Flow The SLQ4 board consists of the O/E conversion module, CDR module, SDH overhead processing module, RST and so on. 5.12.4 Front Panel On the front panel of the SLQ4, there are indicators, interfaces, barcode and laser safety class label. 5.12.5 Valid Slots The SLQ4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The SLQ4 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack. 5.12.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the SLQ4 indicates the optical interface type. 5.12.7 Board Configuration Reference You can use the T2000 to set parameters for the SLQ4. 5.12.8 Technical Specifications The technical specifications of the SLQ4 cover the optical interface specifications, board dimensions, weight and power consumption.

5.12.1 Version Description

The SLQ4 board has two versions, N1 and N2. The difference between the two versions lies in the support for the TCM function. Table 5-49 lists the details on the versions of the SLQ4 board. Table 5-49 Version Description of the SLQ4 Item Functional version Difference Description The SLQ4 has two versions, N1 and N2. The N2SLQ4 supports the TCM function and can be configured with AU-3 services. The N1SLQ4 does not support the TCM function and cannot be configured with AU-3 services.

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Item Replaceability

Description The versions cannot be replaced by each other.

NOTE

The N2SLQ4 board supports the TCM function and AU-3 services, which are not supported by the N1SLQ4 board. For this reason, when configuring MSP and SNCP, you cannot configure the N1SLQ4 board as the protection board if the working board is N2SLQ4 configured with the TCM service or AU-3 services. Otherwise, the service may be interrupted due to the switching operation.

5.12.2 Function and Feature

The SLQ4 is used to transmit and receive STM-4 optical signals, to perform O/E conversion for STM-4 signals, to extract or insert overhead bytes, and to generate alarm signals on the line. Table 5-50 lists the functions and features of the SLQ4. Table 5-50 Functions and features of the SLQ4 Function and Feature Basic function Specification of the optical interface Specification of the optical module SLQ4 Transmits and receives 4 x STM-4 optical signals. Supports standard optical interfaces of the I-4, S-4.1, L-4.1, L-4.2 and Ve-4.2 types. The optical interfaces of the I-4, S-4.1, L-4.1 and L-4.2 types comply with ITU-T G.957 in features. The optical interface of the Ve-4.2 type complies with the standards defined by Huawei. Supports detection and query of the information on the optical module. The optical interface supports the function of setting the on/off state of the laser and the ALS function. Supports the usage and monitoring of the pluggable optical module SFP . Service processing Overhead processing Supports VC-12, VC-3, and VC-4 services and VC4-4c concatenation services. Supports the processing of the SOH bytes of the STM-4 signals. Supports the transparent transmission or termination of the POH bytes. Supports the setting and query of the J0/J1/C2 bytes. Supports one to four channels of ECC communication. Alarm and performance event Protection scheme Provides rich alarms and performance events for easy management and maintenance of the equipment. Supports the two-fiber MSP protection ring, four-fiber MSP protection ring, linear MSP, SNCP, SNCTP and SNCMP. Supports the optical-path-shared MSP and SNCP protection.

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Function and Feature Maintenance feature

SLQ4 Supports inloop and outloop for optical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services.

5.12.3 Working Principle and Signal Flow

The SLQ4 board consists of the O/E conversion module, CDR module, SDH overhead processing module, RST and so on. Figure 5-31 shows the block diagram for the working principle of the SLQ4. Figure 5-31 Block diagram for the working principle of the SLQ4
155 MHz

155 MHz PLL

Reference clock

Cross-connect unit

622Mbit/s 622Mbit/s

O/E O/E

S P I

622Mbit/s

CDR

622Mbit/s

K1 and K2 insertion/extration
622Mbit/s

K1 and K2

Cross-connect unit

High speed bus

....
622Mbit/s 622Mbit/s

....
622Mbit/s

Cross-connect unit A

RST
622Mbit/s 622Mbit/s

MST

MSA

HPT
High speed bus Cross-connect unit B

O/E O/E

S P I

CDR

DCC SDH overhead processing module

SCC unit

IIC LOS Laser shut down

Communication and control module

+3.3 V

Frame header Communication

Cross-connect unit SCC unit

+5 V +1.8 V

DC/DC converter

DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse

+3.3 V

+3.3 V backup power

PLL: phase-locked loop RST: regenerator section termination

SPI: SDH physical interface

SDH: synchronous digital hierarchy

MST: multiplex section termination MSA: multiplex section adaptation CDR: clock and data recovery

HPT: higher order path termination IIC: inter-integrated circuit

The function modules of the STM-4 units are described below:

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O/E Conversion Module

l

In the receive direction, the module converts the received optical signals into electrical signals. In the transmit direction, the module converts the electrical signals into SDH optical signals, and then sends optical signals to fibers for transmission. The SPI detects the R_LOS alarm and provides function to shut down the laser.

CDR Module
l

It recovers the data signal and the clock signal.

SDH Overhead Processing Module

This module includes RST, MST, MSA and HPT. It provides inloop and outloop function.
l

RST

In the receive direction, RST performs frame alignment detection (A1, A2), regenerator section trace recovery (J0) and mismatch detection, BIP-8 errored block count. In the transmit direction, RST performs frame alignment insertion, regenerator section path trace insertion, BIP-8 calculation and insertion. In the receive direction, MST performs BIP-24 errored block count, multiplex sectionremote error indication (MS_REI) recovery, multiplex section-remote defect indication (MS_RDI) and multiplex section-alarm indication signal (MS_AIS) detection. In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI MS_RDI and MS_AIS insertion. MST provides extraction or insertion of K1 byte and K2 byte. In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS detection, pointer justification. In the transmit direction, MST it performs administration unit group (AUG) assembly, AU-4 pointer generation, AU_AIS generation. OH termination J1 path trace message recovery REI information recovering HP_RDI detection (path status monitoring) UNEQ and AIS detection (signal label monitoring) VC-4 BIP-8 errored block count

MST

MSA

HPT

Communication and Control Module

l l l

Manages and configures other modules of the boards. Performs inter-board communication through internal Ethernet interface. Traces the clock signal from the active and the standby cross-connect units.
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Controls the laser. Realizes the pass-through of orderwire and embedded control channel (ECC) bytes between the paired slots constituting the add/ drop multiplexer (ADM) when the CXL is not online. Selects the clock and frame header from the active or the standby cross-connect units. Controls the indicator on the board.

l l

DC/DC Converter
It provides the board with required DC voltages. It converts the 48/60 V power supply to the following voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3 V power supply.

5.12.4 Front Panel

On the front panel of the SLQ4, there are indicators, interfaces, barcode and laser safety class label.

Appearance of the Front Panel

Figure 5-32 shows the appearance of the front panel of the SLQ4. Figure 5-32 Front panel of the SLQ4
SLQ4
STAT ACT PROG SRV

CLASS1 LASER PRODUCT

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4

SLQ4

Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.
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l l l

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are four pairs of optical interfaces on the front panel of the SLQ4. Table 5-51 lists the type and usage of the optical interfaces. Table 5-51 Optical interfaces of the SLQ4 Interface IN1-IN4 OUT1-OUT4 Interface Type LC LC Usage Receives optical signals. Transmits optical signals.

The SLQ4 board can use the pluggable optical modules for easy maintenance.

5.12.5 Valid Slots

The SLQ4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The SLQ4 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

5.12.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code of the SLQ4 indicates the optical interface type. Table 5-52 lists the relation between the board feature code and optical interface type for the SLQ4. Table 5-52 Relation between the board feature code and the optical interface type of the SLQ4 Board SSN1SLQ410, SSN2SLQ410 SSN1SLQ411, SSN2SLQ411 SSN1SLQ412, SSN2SLQ412 SSN1SLQ413, SSN2SLQ413 SSN1SLQ414, SSN2SLQ414 Feature Code 10 11 12 13 14 Optical interface type S-4.1 L-4.1 L-4.2 Ve-4.2 I-4

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5.12.7 Board Configuration Reference

You can use the T2000 to set parameters for the SLQ4. You can use the T2000 to set the following parameters for the SLQ4:
l l l

J0 J1 C2

For details on the parameters, refer to F Board Configuration Reference.

5.12.8 Technical Specifications

The technical specifications of the SLQ4 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications

Table 5-53 lists the specifications of the optical interfaces of the SLQ4. Table 5-53 Specifications of the optical interfaces of the SLQ4 Item Nominal bit rate Line code Optical interface type Optical source type Working wavelength (nm) Launched optical power (dBm) Receiver sensitivity (dBm) Overload optical power (dBm) Min. extinction ratio (dB) Specification 622080 kbit/s NRZ I-4 MLM 12611360 S-4.1 MLM 12741356 L-4.1 SLM 12801335 L-4.2 SLM 14801580 Ve-4.2 SLM 14801580

15 to 8

15 to 8

3 to +2

3 to +2

3 to +2

23

28

28

28

34

8 8.2

8 8.2

8 10

8 10

13 10.5

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Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SLQ4 are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 1.0

Power Consumption
In the normal temperature (25), the maximum power consumption of the SLQ4 is 16 W.

5.13 SLQ4A
This section describes the SLQ4A, a 4 x STM-4 optical interface board, in terms of version, function, principle, front panel and technical specifications. 5.13.1 Version Description The functional version of the SLQ4A board is N1. 5.13.2 Function and Feature The SLQ4A board is used to transmit and receive STM-4 optical signals, to perform O/E conversion on STM-4 signals, to extract or insert overhead bytes, and to generate alarm signals. 5.13.3 Working Principle and Signal Flow The SLQ4A board consists of the O/E conversion module, SDH overhead processing module, logic control module and power supply module. 5.13.4 Front Panel On the front panel of the SLQ4A board, there are indicators, interfaces, barcode and laser safety class label. 5.13.5 Valid Slots The SLQ4A can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The SLQ4A board can be housed in any of slots 1113 in the OptiX OSN 1500B subrack. 5.13.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the SLQ4A indicates the optical interface type. 5.13.7 Board Configuration Reference You can set parameters for the SLQ4A board on the T2000. 5.13.8 Technical Specifications The technical specifications of the SLQ4A board cover the optical interface specifications, board dimensions, weight and power consumption.

5.13.1 Version Description

The functional version of the SLQ4A board is N1.
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5.13.2 Function and Feature

The SLQ4A board is used to transmit and receive STM-4 optical signals, to perform O/E conversion on STM-4 signals, to extract or insert overhead bytes, and to generate alarm signals. Table 5-54 lists the functions and features of the SLQ4A board. Table 5-54 Functions and features of the SLQ4A board Function and Feature Basic function Specification of the optical interface Description Transmits and receives 4 x STM-4 optical signals. Supports standard optical interfaces of the I-4, S-4.1, L-4.1, L-4.2 and Ve-4.2 types. The optical interfaces of the I-4, S-4.1, L-4.1 and L-4.2 types comply with ITU-T G.957 Recommendations in features. The optical interface of the Ve-4.2 type complies with the standards defined by Huawei. Supports detection and query of the information on the optical module. The optical interface supports the function of setting the on/off state of the laser and the ALS function. Supports using and monitoring the SFP pluggable optical module. Service processing Overhead processing Supports VC-12, VC-3, and VC-4 services and VC4-4c concatenation services. Supports processing the SOH bytes of the STM-4 signals. Supports the transparent transmission and termination of the POH bytes. Supports setting and querying the J0, J1 or C2 byte. Supports one to four channels of ECC communication. Alarm and performance event Protection scheme Provides abundant alarms and performance events to easily manage and maintain the equipment. Supports the two-fiber MSP protection ring, four-fiber MSP protection ring, linear MSP, sub-network connection protection (SNCP), subnetwork connection tunnel protection (SNCTP) and sub-network connection multi-protection (SNCMP). Supports the optical-path-shared MSP and SNCP protection. Maintenance feature Supports inloop and outloop for optical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports querying the manufacturing information of the board. Supports loading the FPGA in-service. Supports upgrading the board software without affecting services.

Specification of the optical module

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5.13.3 Working Principle and Signal Flow

The SLQ4A board consists of the O/E conversion module, SDH overhead processing module, logic control module and power supply module. Figure 5-33 shows the block diagram for the working principle of the SLQ4A board. Figure 5-33 Block diagram for the working principle of the SLQ4A
155 MHz

155 MHz PLL

Reference clock

Cross-connect unit

622Mbit/s 622Mbit/s

O/E O/E

S P I

622Mbit/s

CDR

622Mbit/s

K1 and K2 insertion/extration
622Mbit/s

K1 and K2

Cross-connect unit

High speed bus

....
622Mbit/s 622Mbit/s

....
622Mbit/s

Cross-connect unit A

RST
622Mbit/s 622Mbit/s

MST

MSA

HPT
High speed bus Cross-connect unit B

O/E O/E

S P I

CDR

DCC SDH overhead processing module

SCC unit

IIC LOS Laser shut down

Communication and control module

+3.3 V

Frame header Communication

Cross-connect unit SCC unit

+5 V +1.8 V

DC/DC converter

DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse

+3.3 V

+3.3 V backup power

In the receive direction

The O/E conversion module converts the received STM-4 optical signals into STM-4 electrical signals, detects the R_LOS alarm, and transmits the STM-4 electrical signals to the SDH overhead processing module. The overhead processing module detects the R_LOF and R_OOF alarm signals. extracts and processes the overhead bytes from the STM-4 signals, and transmits the signals to the cross-connect unit through the backplane bus.

In the transmit direction

The overhead processing unit inserts the overhead bytes into the electrical signals from the crossconnect units and then transmits the signals to the E/O conversion module. The E/O conversion module converts the received STM-4 electrical signals into STM-4 optical signals, which are then transmitted through fibers.

Auxiliary Unit
The auxiliary unit consists of the logic control unit and the power supply module.
l

Logic Control Module The logic control module traces the clock signals, which are received from the active or standby cross-connect board, and the frame header signals. This module controls the laser

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and passes through the orderwire and ECC bytes between the two optical interface boards that form the ADM. This module also selects the clock frame headers from the active or standby cross-connect board.
l

Power Supply Module The power supply module provides the DC voltages required by the modules of the board.

5.13.4 Front Panel

On the front panel of the SLQ4A board, there are indicators, interfaces, barcode and laser safety class label.

Appearance of the Front Panel

Figure 5-34 shows the appearance of the front panel of the SLQ4A board. Figure 5-34 Front panel of the SLQ4A board
SLQ4A
STAT ACT PROG SRV

CLASS1 LASER PRODUCT

SLQ4A

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4

Indicators
The following indicators are present on the front panel of the board:
l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.
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Interfaces
On the front panel of the SLQ4A board, there are four pairs of optical interfaces. Table 5-55 lists the type and usage of the optical interfaces. Table 5-55 Optical interfaces of the SLQ4A board Interface IN1-IN4 OUT1OUT4 Interface Type LC LC Usage Receives optical signals. Transmits optical signals.

The SLQ4A board can use the pluggable optical modules for easy maintenance.

5.13.5 Valid Slots

The SLQ4A can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The SLQ4A board can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

5.13.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code of the SLQ4A indicates the optical interface type. Table 5-56 lists the relation between the board feature code and optical interface type of the SLQ4A. Table 5-56 Relation between the board feature code and optical interface type of the SLQ4A Board SSN1SLQ4A10 SSN1SLQ4A11 SSN1SLQ4A12 SSN1SLQ4A13 SSN1SLQ4A14 Feature Code 10 11 12 13 14 Optical interface type S-4.1 L-4.1 L-4.2 Ve-4.2 I-4

5.13.7 Board Configuration Reference

You can set parameters for the SLQ4A board on the T2000. On the T2000, you can set the following parameters for the SLQ4A board.
l l l

J0 J1 C2
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For details of the parameters, see F Board Configuration Reference.

5.13.8 Technical Specifications

The technical specifications of the SLQ4A board cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications

Table 5-57 lists the specifications of the optical interfaces of the SLQ4A board. Table 5-57 Specifications of the optical interfaces of the SLQ4A board Item Nominal bit rate Line code Optical interface type Optical source type Working wavelength (nm) Launched optical power (dBm) Receiver sensitivity (dBm) Overload optical power (dBm) Minimum extinction ratio (dB) Specification 622080 kbit/s NRZ I-4 MLM 1261-1360 S-4.1 MLM 1274-1356 L-4.1 SLM 1280-1335 L-4.2 SLM 1480-1580 Ve-4.2 SLM 1480-1580

15-8

15-8

3-2

3-2

3-2

23

28

28

28

34

8 8.2

8 8.2

8 10

8 10

13 10.5

Note: MLM stands for multi-longitudinal mode and SLM for single-longitudinal mode.

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SLQ4A board are as follows:
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l l

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 1.0

Power Consumption
At normal ambient temperature (25), the maximum power consumption of the SLQ4A board is 17 W.

5.14 SL16
This section describes the SL16, a 1 x STM-16 optical interface board, in terms of the version, function, working principle, front panel and specifications. 5.14.1 Version Description The SL16 board has three versions, N1, N2 and N3. The difference among the three versions lies in the support for the TCM function and AU-3 services. 5.14.2 Function and Feature The SL16 board is used to receive and transmit 1 x STM-16 optical signals and to process the overhead. 5.14.3 Working Principle and Signal Flow The SL16 board consists of the O/E conversion module, MUX/DEMUX module, SDH overhead processing module, RST and so on. 5.14.4 Front Panel On the front panel of the SL16, there are indicators, interfaces, barcode, laser safety class label, and APD alarm label. 5.14.5 Valid Slots The SL16 board can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, and any of slots 1113 in the OptiX OSN 1500B subrack. 5.14.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the SL16 indicates the optical interface type. 5.14.7 Board Configuration Reference You can use the T2000 to set parameters for the SL16. 5.14.8 Technical Specifications The technical specifications of the SL16 cover the optical interface specifications, board dimensions, weight and power consumption.

5.14.1 Version Description

The SL16 board has three versions, N1, N2 and N3. The difference among the three versions lies in the support for the TCM function and AU-3 services. Table 5-58 lists the details on the versions of the SL16 board.

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Table 5-58 Version Description of the SL16 Item Functional version Difference Description The SL16 has three versions, N1, N2 and N3. The N1SL16 does not support the TCM function and AU-3 services. The N2SL16 supports the TCM function, and it can be configured with AU-3 services. The TCM function and AU-3 services cannot be configured on the N3SL16 at the same time. The N3SL16 supports the board version replacement function. Replaceability The N1SL16 and N2SL16 cannot be replaced by each other. When the TCM function and AU-3 services are not required, the N3SL16 can fully replace the N2SL16 and N1SL16. The N3SL16 supports the board version replacement function and can replace the N1SL16. After the N1SL16 is replaced, the N3SL16 is consistent with the N1SL16 in configuration and service status.

NOTE

The N3SL16 and N2SL16 board supports the TCM and AU3 services, which are not supported by the N1SL16 board. For this reason, when configuring MSP and SNCP, you cannot configure the N1SL16 board as the protection board if the working board is N3SL16 or N2SL16 configured with the TCM or AU3 service. Otherwise, the service may be interrupted due to the switching operation.

5.14.2 Function and Feature

The SL16 board is used to receive and transmit 1 x STM-16 optical signals and to process the overhead. Table 5-59 lists the functions and features of the SL16. Table 5-59 Functions and features of the SL16 Function and Feature Basic function Specification of the optical interface SL16 Transmits and receives 1 x STM-16 optical signals. Supports optical interfaces of the L-16.2, L-16.2Je, V-16.2Je (with BA), U-16.2Je (with BA and PA) types. The optical interface of the L-16.2 type complies with ITU-T G.957 and ITU-T G.692 in features. The optical interfaces of the L-16.2Je, V-16.2Je (with BA), and U-16.2Je (with BA and PA) comply with the standards defined by Huawei. Supports the output of standard wavelengths that comply with ITU-T G. 692. The U-16.2Je optical interface can be directly connected to the DWDM equipment.

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Function and Feature Specification of the optical module Service processing

SL16 Supports detection and query of the information on the optical module. The optical interface supports the function of setting the on/off state of the laser and the ALS function. Supports VC-12, VC-3, and VC-4 services and VC4-4c, VC4-8c, and VC4-16c concatenation services. Supports AU-3 services.

Overhead processing

Supports the processing of the SOH of the STM-16 signals. Supports the transparent transmission and termination of the POH bytes. Supports the setting and query of the J0/J1/C2 bytes.

Alarm and performance event Specifications of the REG Protection scheme

Provides rich alarms and performance events.

N2SL16/N3SL16 Supports the setting and query of the REG working mode. Supports the two-fiber MSP protection ring, four-fiber MSP protection ring, linear MSP protection, SNCP, SNCTP and SNCMP. Supports the optical-path-shared MSP and SNCP protection. Processes two sets of K bytes. One SL16 board supports a maximum of two MSP protection rings.

Maintenance feature

Supports inloop and outloop for optical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services. Supports the PRBS function.

5.14.3 Working Principle and Signal Flow

The SL16 board consists of the O/E conversion module, MUX/DEMUX module, SDH overhead processing module, RST and so on. Figure 5-35 shows the block diagram for the working principle of the SL16.

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Figure 5-35 Block diagram for the working principle of the SL16
155 MHz

155 MHz PLL

Reference clock

Cross-connect unit

2.488 Gbit/s

2.488 Gbit/s

16 x 155 Mbit/s

K1 and K2 insertion/extration

K1 and K2

Cross-connect unit

O/E S P I O/E

DEMUX
high speed bus 2.488 Gbit/s 16 x 155 Mbit/s Cross-connect unit A

2.488 Gbit/s

RST

MST

MSA

HPT
high speed bus Cross-connect unit B SCC unit

MUX

DCC SDH overhead processing module

IIC LOS Laser shut down

Communication and control module

+3.3 V

Frame header Communication

Cross-connect unit SCC unit

5V +1.8 V

DC/DC converter

DC/DC converter

Fuse

-48 V/-60 V -48 V/-60 V

Fuse

+3.3 V

+3.3 V backup power

O/E Conversion Module

l l

In the receive direction, it converts the received optical signals into electrical signals. In the transmit direction, it converts the electrical signals into SDH optical signals, and then send optical signals to fibers for transmission. The SPI detects the R_LOS alarm and provides the function to shut down the laser.

MUX/DEMUX Module
l

In the receive direction, the DEMUX part demultiplexes the high rate electrical signals into multiple parallel electrical signals, and recovery the clock signal at the same time. In the transmit direction, the MUX part multiplexes the parallel electrical signals received from the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing Module

It includes RST, MST, MSA and HPT, and provides outloop and inloop function.
l

RST

In the receiving direction, RST performs frame alignment detection (A1, A2), regenerator section trace recovery (J0) and mismatch detection, and BIP-8 errored block count. In the transmitting direction, RST performs frame alignment insertion, regenerator section path trace insertion, BIP-8 calculation and insertion. In the receiving direction, MST performs BIP-24 errored block count, MS_REI recovery, MS_RDI and MS_AIS detection.
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MST

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In the transmitting direction, MST performs calculation and insertion of BIP-24, insertion of MS_REI MS_RDI and MS_AIS. Provides extraction or insertion of K1 byte and K2 byte. In the receiving direction, MSA performs AU4 pointer interpretation, LOP and AIS detection, pointer justification. In the transmitting direction, MSA performs AUG assembly, AU-4 pointer generation, and AU_AIS generation. OH termination J1 path trace message recovery REI information recovering HP_RDI detection (path status monitoring) UNEQ and AIS detection (signal label monitoring) VC-4 BIP-8 errored block count

MSA

HPT

Communication and Control Module

l l l l l

Manages and configures other modules of the boards. Performs inter-board communication through internal Ethernet interface. Tracing the clock signal from the active and the standby cross-connect units. Implements laser controlling function. Realizes the pass-through of orderwire and ECC bytes between the paired slots constituting the ADM when the CXL is not online. Selects the clock and frame header from the active or the standby cross-connect units. Controls the indicator on the board.

l l

DC/DC Converter Module

l

This module provides the board with required DC voltages. It converts the 48/60 V power supply to the following voltages: + 3.3 V, + 1.8 V, + 5 V. This module also provides protection for the board +3.3V power supply.

5.14.4 Front Panel

On the front panel of the SL16, there are indicators, interfaces, barcode, laser safety class label, and APD alarm label.

Appearance of the Front Panel

Figure 5-36 shows the appearance of the front panel of the SL16.

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Figure 5-36 Front panel of the SL16

SL16
STAT ACT PROG SRV

CLASS 1 LASER PRODUCT

APD

Receiver MAX:-9dBm

OUT

IN

SL16

Indicators
The following indicators are present on the front panel of the board:
l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There is one pair of optical interfaces on the front panel of the SL16. Table 5-60 lists the type and usage of the optical interfaces. Table 5-60 Optical interfaces of the SL16 Interface IN OUT
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Interface Type LC LC

Usage Receives optical signals. Transmits optical signals.

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5.14.5 Valid Slots

The SL16 board can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, and any of slots 1113 in the OptiX OSN 1500B subrack.

5.14.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code of the SL16 indicates the optical interface type. Table 5-61 lists the relation between the board feature code and optical interface type for the SL16. Table 5-61 Relation between the board feature code and the optical interface type for the SL16 Board SSN1SL1601, SSN2SL1601 SSN1SL1602, SSN2SL1602, SSN3SL1602 SSN1SL1603, SSN2SL1603, SSN3SL1603 SSN1SL1604, SSN2SL1604, SSN3SL1604 Feature Code 01 02 03 04 Optical interface type L-16.2 L-16.2Je V-16.2Je U-16.2

5.14.7 Board Configuration Reference

You can use the T2000 to set parameters for the SL16. You can use the T2000 to set the following parameters for the SL16:
l l l

J0 J1 C2

For details on the parameters, refer to F Board Configuration Reference.

5.14.8 Technical Specifications

The technical specifications of the SL16 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications

Table 5-62 lists the specifications of the optical interfaces of the SL16.
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Table 5-62 Specifications of the optical interfaces of the SL16 Item Nominal bit rate Optical Interface Type Optical source type Working wavelengt h (nm) Launched optical power (dBm) Receiver sensitivity (dBm) Overload optical power (dBm) Min. extinction ratio (dB) Specification 2488320 kbit/s L-16.2 L-16.2Je V-16.2Je (BA) U-16.2Je (BA+PA)

SLM 15001580

SLM 15301560

SLM 15301565

SLM 1550.12

2 to +3

5 to 7

2 to +3 (without BA) 28

13 to 15 (with BA)

2 to +3 (without BA and PA) 28 (without PA and BA) 9 (without PA and BA) 8.2

15 to 18 (with BA)

28

28

32 (with PA)

10 (with PA)

8.2

8.2

8.2

Note: The optical interface of the Le-16.2 type is the same as the optical interface of the L-16.2Je type. The launched optical power of the optical interface of the V-16.2Je type is measured when the booster amplifer (BA) is added. The launched optical power of the optical interfaces of the V-16.2Je and U-16.2Je types ranges from 2 dBm to 3 dBm when no BA is added.

Table 5-63 Specifications of the ITU-T G.692-compliant optical interfaces that output standard wavelengths Item Nominal bit rate Dispersion limit (km) Mean launched optical power (dBm) Receiver sensitivity (dBm)
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Specification 2488320 kbit/s 170 2 to +3 28 640 5 to 1 28

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Item Min. overload (dBm) Max. allowed dispersion (ps/nm) Min. extinction ratio (dB)

Specification 9 3400 8.2 9 10880 10

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SL16 are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 1.1

Power Consumption
In the normal temperature (25), the maximum power consumption of the N1SL16 is 20 W. In the normal temperature (25), the maximum power consumption of the N2SL16 is 20 W. In the normal temperature (25), the maximum power consumption of the N3SL16 is 22 W.

5.15 SL16A
This section describes the SL16A, a 1 x STM-16 optical interface board, in terms of the version, function, working principle, front panel and specifications. 5.15.1 Version Description The SL16A board has three versions, N1, N2 and N3. The difference among the three versions lies in the support for the TCM function. 5.15.2 Function and Feature The SL16A board is used to receive and transmit 1 x STM-16 optical signals, to process the overhead bytes, and to perform the MSP protection. 5.15.3 Working Principle and Signal Flow The SL16A board consists of the O/E conversion module, MUX/DEMUX module, SDH overhead processing module, RST and so on. 5.15.4 Front Panel On the front panel of the SL16A, there are indicators, interfaces, barcode, laser safety class label, and APD alarm label. 5.15.5 Valid Slots The SL16A can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The SL16A can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.
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5.15.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the SL16A indicates the optical interface type. 5.15.7 Board Configuration Reference You can use the T2000 to set the J0 parameter for the SL16A. 5.15.8 Technical Specifications The technical specifications of the SL16A cover the optical interface specifications, board dimensions, weight and power consumption.

5.15.1 Version Description

The SL16A board has three versions, N1, N2 and N3. The difference among the three versions lies in the support for the TCM function. Table 5-64 lists the details on the versions of the SL16A board. Table 5-64 Version Description of the SL16A Item Functional version Difference Description The SL16A has three versions, N1, N2 and N3. The N1SL16A does not support the TCM function and AU-3 services. The N2SL16A supports the TCM function, and it can be configured with AU-3 services. The TCM function and AU-3 services cannot be configured on the N3SL16A at the same time. Replaceability The N1SL16A and N2SL16A cannot be replaced by each other. The N3SL16A supports the board version replacement function and can replace the N3SL16A and N1SL16A. After the N3SL16A and N1SL16A are replaced, the N3SL16A and N1SL16A are consistent with the N1SL16A in configuration and service status.

NOTE

The N3SL16A and N2SL16A board supports the TCM and AU3 services, which are not supported by the N1SL16A board. For this reason, when configuring MSP and SNCP, you cannot configure the N1SL16A board as the protection board if the working board is N3SL16A or N2SL16A configured with the TCM or AU3 service. Otherwise, the service may be interrupted due to the switching operation.

5.15.2 Function and Feature

The SL16A board is used to receive and transmit 1 x STM-16 optical signals, to process the overhead bytes, and to perform the MSP protection. Table 5-65 lists the functions and features of the SL16A.

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Table 5-65 Functions and features of the SL16A Function and Feature Basic function Specification of the optical interface Specification of the optical module SL16A Transmit and receive 1 x STM-16 optical signals. Supports optical interfaces of the I-16, S-16.1, L-16.1, and L-16.2 types. The optical interfaces comply with ITU-T G.957 and ITU-T G.692 in features. Supports detection and query of the information on the optical module. The optical interface supports the function of setting the on/off state of the laser and the ALS function. Supports the usage and monitoring of the SFP pluggable optical module. Service processing Overhead processing Supports VC-12, VC-3, and VC-4 services and VC4-4c, VC4-8c, and VC4-16c concatenation services. Supports the processing of the SOH bytes of the STM-16 signals. Supports the transparent transmission and termination of the POH bytes. Supports the setting and query of the J0 bytes. Alarm and performance event Specifications of the REG Protection scheme Provides rich alarms and performance events. The N2SL16A and N3SL16A support the setting and query of the REG working mode. Supports the two-fiber MSP protection ring, four-fiber MSP protection ring, linear MSP protection, SNCP, SNCTP and SNCMP. Processes two sets of the K bytes.Supports the optical-path-shared MSP and SNCP protection. Maintenance feature Supports inloop and outloop for optical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services. Supports AU-3 services.

5.15.3 Working Principle and Signal Flow

The SL16A board consists of the O/E conversion module, MUX/DEMUX module, SDH overhead processing module, RST and so on. Figure 5-37 shows the block diagram for the working principle of the N1SL16A and N2SL16A.
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Figure 5-37 Block diagram for the working principle of the N1SL16A and N2SL16A
155 MHz

155 MHz PLL

Reference clock

Cross-connect unit

2.488 Gbit/s

2.488 Gbit/s

16 x 155 Mbit/s

K1 and K2

K1 and K2 insertion/extration

Cross-connect unit

O/E S P I O/E

DEMUX
high speed bus 2.488 Gbit/s 16 x 155 Mbit/s Cross-connect unit A

2.488 Gbit/s

RST

MST

MSA

HPT
high speed bus Cross-connect unit B SCC unit

MUX

DCC SDH overhead processing module

IIC LOS Laser shut down

Communication and control module

+3.3 V

Frame header Communication

Cross-connect unit SCC unit

5V +1.8 V

DC/DC converter

DC/DC converter

Fuse

-48 V/-60 V -48 V/-60 V

Fuse

+3.3 V

+3.3 V backup power

Figure 5-38 shows the block diagram for the working principle of the N3SL16A. Figure 5-38 Block diagram for the working principle of the N3SL16A
155 MHz

155 MHz PLL

Reference clock

Cross-connect unit

2.488 Gbit/s

2.488 Gbit/s

16 x 155 Mbit/s

K1 and K2

K1 and K2 insertion/extration

Cross-connect unit

O/E S P I O/E

DEMUX
high speed bus 2.488 Gbit/s 16 x 155 Mbit/s Cross-connect unit A

2.488 Gbit/s

RST

MST

MSA

HPT
high speed bus Cross-connect unit B SCC unit

MUX

DCC SDH overhead processing module

IIC LOS Laser shut down

Communication and control module

+3.3 V

Frame header Communication

Cross-connect unit SCC unit

5V +1.8 V

DC/DC converter

DC/DC converter

Fuse

-48 V/-60 V -48 V/-60 V

Fuse

+3.3 V

+3.3 V backup power

O/E Conversion Module

l l

In the receive direction, it converts the received optical signals into electrical signals. In the transmit direction, it converts the electrical signals into SDH optical signals, and then send optical signals to fibers for transmission.
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l

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

The SPI detects the R_LOS alarm and provides the function to shut down the laser.

MUX/DEMUX Module
l

In the receive direction, the DEMUX part demultiplexes the high rate electrical signals into multiple parallel electrical signals, and recovery the clock signal at the same time. In the transmit direction, the MUX part multiplexes the parallel electrical signals received from the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing Module

It includes RST, MST, MSA and HPT, and provides outloop and inloop function.
l

RST

In the receiving direction, RST performs frame alignment detection (A1, A2), regenerator section trace recovery (J0) and mismatch detection, and BIP-8 errored block count. In the transmitting direction, RST performs frame alignment insertion, regenerator section path trace insertion, BIP-8 calculation and insertion. In the receiving direction, MST performs BIP-24 errored block count, MS_REI recovery, MS_RDI and MS_AIS detection. In the transmitting direction, MST performs calculation and insertion of BIP-24, insertion of MS_REI MS_RDI and MS_AIS. Provides extraction or insertion of K1 byte and K2 byte. In the receiving direction, MSA performs AU4 pointer interpretation, LOP and AIS detection, pointer justification. In the transmitting direction, MSA performs AUG assembly, AU-4 pointer generation, and AU_AIS generation. OH termination J1 path trace message recovery REI information recovering HP_RDI detection (path status monitoring) UNEQ and AIS detection (signal label monitoring) VC-4 BIP-8 errored block count

MST

MSA

HPT

Communication and Control Module

l l l l l

Manages and configures other modules of the boards. Performs inter-board communication through internal Ethernet interface. Tracing the clock signal from the active and the standby cross-connect units. Implements laser controlling function. Realizes the pass-through of orderwire and ECC bytes between the paired slots constituting the ADM when the CXL is not online.
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l l

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Selects the clock and frame header from the active or the standby cross-connect units. Controls the indicator on the board.

DC/DC Converter Module

l

This module provides the board with required DC voltages. It converts the 48/60 V power supply to the following voltages: + 3.3 V, + 1.8 V, + 5 V. This module also provides protection for the board +3.3V power supply.

5.15.4 Front Panel

On the front panel of the SL16A, there are indicators, interfaces, barcode, laser safety class label, and APD alarm label.

Appearance of the Front Panel

Figure 5-39 shows the appearance of the front panel of the SL16A. Figure 5-39 Front panel of the SL16A

SL16A
STAT ACT PROG SRV

CLASS 1 LASER PRODUCT

APD

Receiver MAX:-9dBm

OUT

IN

SL16A

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Indicators
The following indicators are present on the front panel of the board:
l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There is one pair of optical interfaces on the front panel of the SL16A. Table 5-66 lists the type and usage of the optical interfaces. Table 5-66 Optical interfaces of the SL16A Interface IN OUT Interface Type LC LC Usage Receives optical signals. Transmits optical signals.

5.15.5 Valid Slots

The SL16A can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The SL16A can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

5.15.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code of the SL16A indicates the optical interface type. Table 5-67 lists the relation between the board feature code and optical interface type for the SL16A. Table 5-67 Relation between the board feature code and the optical interface type Board SSN1SL16A01, SSN2SL16A01, SSN3SL16A01 SSN1SL16A02, SSN2SL16A02, SSN3SL16A02 SSN1SL16A03, SSN2SL16A03, SSN3SL16A03
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Feature Code 01

Optical Interface Type I-16

02

S-16.1

03

L-16.1

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Board SSN1SL16A04, SSN2SL16A04, SSN3SL16A04

Feature Code 04

Optical Interface Type L-16.2

5.15.7 Board Configuration Reference

You can use the T2000 to set the J0 parameter for the SL16A. For details on the parameter, refer to F Board Configuration Reference.

5.15.8 Technical Specifications

The technical specifications of the SL16A cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications

Table 5-68 lists the specifications of the optical interfaces of the SL16A. Table 5-68 Specifications of the optical interfaces of the SL16A Item Nominal bit rate Optical Interface Type Optical source type Working wavelength (nm) Launched optical power (dBm) Receiver sensitivity (dBm) Overload optical power (dBm)
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Specification 2488320 kbit/s I-16 S-16.1 L-16.1 L-16.2

MLM 12661360

SLM 12601360

SLM 12801335

SLM 15001580

10 to 3

5 to 0

2 to +3

2 to +3

18

18

27

28

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Item Min. extinction ratio (dB)

Specification 8.2 8.2 8.2 8.2

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SL16A are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg):

N1SL16A and N2SL16A:1.1 N3SL16A:0.9

Power Consumption
In the normal temperature (25), the maximum power consumption of the N1SL16A and N2SL16A are 20 W. In the normal temperature (25), the maximum power consumption of the N3SL16A is 17 W.

5.16 SF16
This section describes the SF16, a 1 x STM-16 optical interface board with the out-band FEC function, in terms of the version, function, working principle, front panel and specifications. 5.16.1 Version Description The functional version of the SF16 board is N1. 5.16.2 Function and Feature The SF16 board is used to receive and transmit one-channel OTU1 (2.666 Gbit/s, FEC) optical signals and to process the overhead. 5.16.3 Working Principle and Signal Flow The SF16 consists of the O/E conversion module, MUX/DEMUX module, FEC module, SDH overhead processing module and so on. 5.16.4 Front Panel On the front panel of the SF16, there are indicators, interfaces, barcode and laser safety class label. 5.16.5 Valid Slots The SF16 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The SF16 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack. 5.16.6 Board Configuration Reference
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You can use the T2000 to set parameters for the SF16. 5.16.7 Technical Specifications The technical specifications of the SF16 cover the optical interface specifications, board dimensions, weight and power consumption.

5.16.1 Version Description

The functional version of the SF16 board is N1.

5.16.2 Function and Feature

The SF16 board is used to receive and transmit one-channel OTU1 (2.666 Gbit/s, FEC) optical signals and to process the overhead. Table 5-69 lists the functions and features of the SF16. Table 5-69 Functions and features of the SF16 Function and Feature Basic function SF16 Receives and transmits 1 x OTU1 (2.666 Gbit/s, FEC) optical signals. Supports the enabling or disabling of the FEC function. Specification of the optical interface Supports optical interfaces of the Ve-16.2c, Ve-16.2d, and Ve-16.2f types. The optical interfaces of the Ve-16.2c, Ve-16.2d, and Ve-16.2f types comply with the standards defined by Huawei. The optical interface supports the output of standard wavelengths that comply with ITU-T G.692 and can be directly connected to the DWDM equipment. Specification of the optical module Service processing Supports detection and query of the information on the optical module. The optical interface supports the function of setting the on/off state of the laser and the ALS function. Supports VC-12, VC-3, and VC-4 services and VC4-4c, VC4-8c, and VC4-16c concatenation services. The SF16 board encapsulates and encodes signals with the FEC function, and processes overhead bytes, which comply with ITU-T G.709. Overhead processing Supports the processing of the OTU, ODU, and OPU overhead bytes, performance monitoring, and alarm detection, which comply with ITU-T G.709. Supports the processing of the SOH of the STM-16 signals. Supports the transparent transmission and termination of the POH bytes. Supports the setting and query of the J0/J1/C2 bytes. Alarm and performance event Provides rich alarms and performance events. Supports alarms and performance events related to the OTU, ODU, and OPU layers and the FEC function.
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Function and Feature Specification of the REG Protection scheme

SF16 Not supports. Supports the two-fiber MSP protection ring, four-fiber MSP protection ring, linear MSP protection, SNCP, SNCTP and SNCMP. Supports the optical-path-shared MSP and SNCP protection. Processes two sets of K bytes. One SF16 board supports a maximum of two MSP protection rings.

Maintenance feature

Supports inloop and outloop for optical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services.

5.16.3 Working Principle and Signal Flow

The SF16 consists of the O/E conversion module, MUX/DEMUX module, FEC module, SDH overhead processing module and so on. Figure 5-40 shows the block diagram for the working principle of the SF16. Figure 5-40 Block diagram for the working principle of the SF16
155 MHz PLL
155 MHz

155 MHz PLL

Reference clock

Cross-connect unit

2.666 Gbit/s

O/E S P I O/E

2.666 Gbit/s

DEMUX

16x166 Mbit/s

16x155 Mbit/s

K1 and K2 insertion/extration

K1 and K2

Cross-connect unit

high speed bus

FEC
2.666 Gbit/s 16x166 Mbit/s 16x155 Mbit/s

Cross-connect unit

2.666 Gbit/s

RST

MST

MSA

HPT
high speed bus DCC Cross-connect unit

MUX
SDH overhead processing module

SCC unit

166 MHz PLL

IIC LOS Laser shut down

Communication and control module

+3.3 V

Frame header Communication

Cross-connect unit SCC unit -48 V/-60 V -48 V/-60 V

5V +1.8 V

DC/DC converter

DC/DC converter

Fuse Fuse

+3.3 V backup power

The function modules are described below:

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O/E Conversion Module

l

In the receive direction, the module converts the received 2.666 Gbit/s FEC optical signals into electrical signals. In the transmit direction, the module converts the electrical signals into SDH optical signals, and then send optical signals to fibers for transmission. The SPI detects the R_LOS alarm and provides function to shut down the laser.

MUX/DEMUX Module
l

In the receive direction, the DEMUX part demultiplexes the high rate electrical signals into multiple parallel electrical signals, and recovers the clock signal at the same time. In the transmit direction, the MUX part multiplexes the parallel electrical signals received from the FEC module into high rate electrical signals.

FEC Module
l

In the downstream direction, the FEC encoding and decoding module receives 2.488 Gbit/ s SDH signals, which are sent by the SDH overhead processing chip. After frame search, FEC encoding, data packets encapsulation and scrambling, the 2.488 Gbit/s SDH signals are converted to 2.666 Gbit/s signals and then transmitted to the MUX module. In the upstream direction, signals take the reverse process. The FEC encoding and decoding module receives the 2.666 Gbit/s signals from the DEMUX module. After frame search, FEC encoding, data packets encapsulation and scrambling in the FEC module, the 2.488 Gbit/s signals are recovered and then transmitted to SDH overhead processing chip. The frame format of the 2.666 Gbit/s signals complies with ITU G.709. The FEC processing module connects to the communication and control unit through a CPU bus. The CPU controls working modes of the FEC module by configuring the internal register. The working mode can be regenerator mode, that is, REG mode. The CPU can monitor the performance through the internal register.

SDH Overhead Processing Module

This module includes RST, MST, MSA and HPT. It also provides inloop and outloop function.
l

RST

In the receive direction, RST performs frame alignment detection (A1, A2), regenerator section trace recovery (J0), mismatch detection, BIP-8 errored block count. In the transmit direction, RST performs frame alignment insertion, regenerator section path trace insertion, BIP-8 calculation and insertion. In the receive direction, MST performs BIP-24 errored block count, MS_REI recovery, MS_RDI and MS_AIS detection. In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI MS_RDI and MS_AIS insertion. Provides extraction or insertion of K1 byte and K2 byte. In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS detection, pointer justification.
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MST

MSA

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In the transmit direction, MSA performs AUG assembly, AU-4 pointer generation, and AU_AIS generation. OH termination J1 path trace message recovery REI information recovering HP_RDI detection (path status monitoring) UNEQ and AIS detection (signal label monitoring) VC-4 BIP-8 errored block count

HPT

Communication and Control Module

l l l l l

Manages and configures other modules of the boards. Performs inter-board communication through internal Ethernet interface. Traces the clock signal from the active and the standby cross-connect unit. Controls the laser. Realizes the pass-through of orderwire and ECC bytes between the paired slots constituting the ADM when the CXL is not online. Selects the clock and frame header from the active or the standby cross-connect units. Controls the indicator on the board.

l l

DC/DC Converter
It provides the board with required DC voltages. It converts the 48 V/60 V power supply to the following voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3V power supply.

5.16.4 Front Panel

On the front panel of the SF16, there are indicators, interfaces, barcode and laser safety class label.

Appearance of the Front Panel

Figure 5-41 shows the appearance of the front panel of the SF16.

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Figure 5-41 Front panel of the SF16

SF 16
STAT ACT PROG SRV

CLASS 1 LASER PRODUCT

OUT

IN

SF16

Indicators
The following indicators are present on the front panel of the board:
l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There is one pair of optical interfaces on the front panel of the SF16. Table 5-70 lists the type and usage of the optical interfaces.
NOTE

The SF16 uses the unpluggable optical module.

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Table 5-70 Optical interfaces of the SF16 Interface IN OUT Interface Type LC LC Usage Receives optical signals. Transmits optical signals.

5.16.5 Valid Slots

The SF16 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The SF16 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

5.16.6 Board Configuration Reference

You can use the T2000 to set parameters for the SF16. You can use the T2000 to set the following parameters for the SF16:
l l l

J0 J1 C2

For details on the parameters, refer to F Board Configuration Reference.

5.16.7 Technical Specifications

The technical specifications of the SF16 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications

Table 5-71 lists the specifications of the optical interfaces of the SF16. Table 5-71 Specifications of the optical interfaces of the SF16 Item Nominal bit rate Service processing capability Line code Optical Interface Typea Specification 2666057.143 kbit/s 1 x STM-16 standard services or concatenation services NRZ Ve-16.2c FEC+BA(14) +PA SLM Ve-16.2d FEC+BA(17) +PA SLM Ve-16.2f FEC+BA(17)+RA+PA SLM
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Optical source type

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Item Wavelength (nm) Launched optical power (dBm)b Launched optical power (dBm)c Receiver sensitivity (dBm)b Receiver sensitivity (dBm)d Overload optical power (dBm)d Min. extinction ratio (dB)b

Specification 1550.12 5 to 1 1315 27.5 37 10 10 5 to 1 1315 27.5 37 10 10 5 to 1 1518 27.5 42 10 10

a: The numbers in the brackets indicate the specifications. For example, BA (14) indicates that the optical power amplified by the BA is 14 dBm. "FEC+BA+PA+RA" indicates that the optical interface is used with the FEC, PA, Raman amplifier and BA. b: The specifications are for the optical module itself rather than for the amplifier. c: The specifications are for the BA. d: The specifications are for the PA.

Table 5-72 Specifications of the ITU-T G.692-compliant optical interfaces that output standard wavelengths Item Nominal bit rate Dispersion limit (km) Mean launched optical power (dBm) Receiver sensitivity (dBm) Min. overload (dBm) Max. allowed dispersion (ps/nm) Min. extinction ratio (dB) Specification 2666057.143 kbit/s 640 5 to 1 28 9 10880 8.2

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).
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Mechanical Specifications
The mechanical specifications of the SF16 are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 1.1

Power Consumption
In the normal temperature (25), the maximum power consumption of the SF16 is 26 W.

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6
About This Chapter

PDH Processing Boards

This chapter describes the PDH processing boards for the E1/T1, E3/T3, E4/STM-1, and DDN signals. 6.1 PL1 This section describes the PL1, a 16 x E1 processing board, in terms of the version, function, working principle, front panel and specifications. 6.2 PD1 This section describes the PD1, a 32 x E1 processing board, in terms of the version, function, working principle, front panel and specifications. 6.3 PQ1 This section describes the PQ1, a 63 x E1 processing board, in terms of the version, function, principle, front panel, configuration and specifications. 6.4 PQM This section describes the PQM, a 63 x E1/T1 processing board, in terms of the version, function, principle, front panel, configuration and specifications. 6.5 PL3 This section describes the PL3, a 3 x E3/T3 processing board, in terms of the version, function, principle, front panel, configuration and specifications. 6.6 PL3A This section describes the PL3A, a 3 x E3/T3 processing board, in terms of the version, function, principle, front panel, configuration and specifications. 6.7 PD3 This section describes the PD3, a 6 x E3/T3 processing board, in terms of the version, function, principle, front panel, configuration and specifications. 6.8 PQ3 This section describes the PQ3, a 12 x E3/T3 processing board, in terms of the version, function, principle, front panel, configuration and specifications. 6.9 DX1
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This section describes the DX1, a DDN interface convergence board, in terms of the version, function, principle, front panel, configuration and specifications. 6.10 DXA This section describes the DXA, a DDN convergence board, in terms of the version, function, principle, front panel, configuration and specifications. 6.11 SPQ4 This section describes the SPQ4, a 4 x E1/STM-1 processing board, in terms of the version, function, working principle, front panel and specifications.

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6.1 PL1
This section describes the PL1, a 16 x E1 processing board, in terms of the version, function, working principle, front panel and specifications. 6.1.1 Version Description The functional version of the PL1 is R1. 6.1.2 Function and Feature The PL1 is used to directly access and process E1 electrical signals, to process the overhead, to report alarms and performance events and to provide the maintenance features. 6.1.3 Working Principle and Signal Flow The PL1 consists of the PPI, E1 mapping/demapping, interface conversion module, communication and control module and so on. 6.1.4 Front Panel On the front panel of the PL1, there are indicators and interfaces. 6.1.5 Valid Slots The PL1 can be housed in any of slots 69 of the OptiX OSN 1500A subrack or the OptiX OSN 1500B subrack. 6.1.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the PL1 indicates the interface impedance type. 6.1.7 Board Configuration Reference You can use the T2000 to set parameters for the PL1. 6.1.8 Technical Specifications The technical specifications of the PL1 cover the optical interface specifications, board dimensions, weight and power consumption.

6.1.1 Version Description

The functional version of the PL1 is R1.

6.1.2 Function and Feature

The PL1 is used to directly access and process E1 electrical signals, to process the overhead, to report alarms and performance events and to provide the maintenance features. Table 6-1 lists the functions and features of the PL1. Table 6-1 Functions and features of the PL1 Function and Feature Basic function Service processing PL1 Processes 16 x E1 signals (interfaces available on the front panel). Directly accesses and processes 16 x E1 electrical signals.

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Function and Feature Overhead processing Alarm and performance event Maintenance feature

PL1 Supports the transparent transmission and termination of POH bytes at the VC-12 level, such as the J2 byte. Provides rich alarms and performance events for easy management and maintenance of the equipment. Supports inloop and outloop for electrical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services. Supports the PRBS function.

6.1.3 Working Principle and Signal Flow

The PL1 consists of the PPI, E1 mapping/demapping, interface conversion module, communication and control module and so on. Figure 6-1 shows the block diagram for the functions of the PL1. Figure 6-1 Block diagram for the functions of the PL1
1.5 MHz/ 2 MHz OSC 155 MHz PLL
Reference clock Cross-connect unit

E1

LIU P P I LIU

6 x 2 Mbit/s

155 Mbit/s

High speed bus

E1

E1 mapping/ demapping
6 x 2 Mbit/s

155 Mbit/s

Interface coversion module

Cross-connect unit A

High speed bus

Cross-connect unit B

LOS Outloop/Inloop control

Communication and control module

+3.3 V

Frame header Communication

Cross-connect unit SCC Unit

+2.5 V +1.8 V

DC/DC converter

DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse +3.3 V backup power

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Figure 6-2 shows the block diagram of the E1 mapping/demapping. Figure 6-2 Block diagram of the E1 mapping/demapping
E1 mapping/demapping E1 STM-1

LPA

LPT

HPA

HPT

PDH AIS Detector

LPOH(V5/J2/N2/ K4) insertion LPOH(V5/J2/N2/ K4) Extraction

TU-AIS/TU-LOP Detector

E1

STM-1

LPA

LPT

HPA

HPT

The function modules are described as follows.

PPI
The PPI module mainly consists of line interface units (LIUs). It provides inloop and outloop function. This module:
l l l

Encodes and decodes signals. Recovers data and clock. Processes the PDH LOS signals.

E1 mapping/demapping
l l

LPA The 2 Mbit/s plesiochronous stream is inserted in a VC-12 container to be adapted so as to be transported into the synchronous network for check of the PDH AIS. LPT The virtual container (VC-12) is formatted. The VC-12 is structured so that its octets are distributed within a 125 us interval (for example, one STM1 period), and consists of the VC-12 container and POH. The latter contains nine octets equally distributed within the frame bytes for VC-12: V5, J2, N2, and K4. HPA HPA generates and processes channel level TU-PTR. In the receive direction, the signals are split into VC-12s, which are located and isolated in TU-12. TU-PTR is processed. TUAIS and TU-LOP alarms are monitored. In the transmit direction, VC-12s are located precisely and added with TU-PTR. 63 TUG-3s are multiplexed into a VC-4 by bytes interleaving. The sequence is: TUG2->TUG3->VC-4. HPT
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l l

l l

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l

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are distributed within a 125 us interval (for example, one STM1 period), and consists of the C4 container and POH. MST and RST These two functions are necessary to create a proprietary STM1 signal in order to interface the E1 mapping/demapping block with the multiplex unit.

l l

Interface conversion module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals (LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane interface connects to low-rate interface chip of the transmitting system.

Communication and control module

l l l l l

Manages and configures other modules of the boards. Performs inter-board communication through internal Ethernet interface. Traces the clock signal from the active and the standby cross-connect units. Selects the clock and frame header from the active or the standby cross-connect units. Control the indicator on the board.

DC/DC converter
It provides the board with required DC voltages. It converts the 48 V/60 V power supply to the following voltages: + 2.5 V, + 3.3 V, + 1.8 V. In addition, protection for +3.3 V power are provided to the board.

6.1.4 Front Panel

On the front panel of the PL1, there are indicators and interfaces.

Appearance of the Front Panel

Figure 6-3 shows the appearance of the front panel of the PL1. Figure 6-3 Front panel of the PL1

PL1
STAT ACT PROG SRV

1-16

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Indicators
The following indicators are present on the front panel of the board:
l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are 16 2mmHM interfaces on the front panel of the PL1. Table 6-2 lists the type and usage of the interfaces. Table 6-2 Interfaces on the front panel of the PL1 Interface 18 916 Interface Type 2mmHM 2mmHM Usage Receives the first eight channels (18) of E1 signals. Receives the last eight channels (916) of E1 signals.

6.1.5 Valid Slots

The PL1 can be housed in any of slots 69 of the OptiX OSN 1500A subrack or the OptiX OSN 1500B subrack.

6.1.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code of the PL1 indicates the interface impedance type. Table 6-3 lists the relation between the board feature code and interface impedance type for the PL1. Table 6-3 Relation between the board feature code and the optical interface type of the PL1 Board SSR1PL1A01 SSR1PL1B01 Feature Code A01 B01 Interface Impedance Type 75 ohms 120 ohms

6.1.7 Board Configuration Reference

You can use the T2000 to set parameters for the PL1. You can use the T2000 to set the following parameters for the PL1:
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l l l l

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

J2 byte V5 byte Tributary loopback Service loading indication

For details on these parameters, see F Board Configuration Reference.

6.1.8 Technical Specifications

The technical specifications of the PL1 cover the optical interface specifications, board dimensions, weight and power consumption.

Electrical Interface Specifications

Table 6-4 lists the specifications of the optical interfaces of the PL1. Table 6-4 Specifications of the electrical interfaces of the PL1 Interface Type Code Output Signal Bit Rate Allowed Input Frequency Deviation Allowed Input Attenuatio n Input Jitter Tolerance

2048 kbit/s

HDB3

Compliant with ITU-T G.703

Mechanical Specifications
The mechanical specifications of the PL1 are as follows:
l l

Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W) Weight (kg): 0.5

Power Consumption
In the normal temperature (25), the maximum power consumption of the PL1 is 7 W.

6.2 PD1
This section describes the PD1, a 32 x E1 processing board, in terms of the version, function, working principle, front panel and specifications. 6.2.1 Version Description The PD1 has two versions, R1 and R2. The two versions have different functions. 6.2.2 Function and Feature The PD1 is used to process E1 signals and the overhead, to report alarms and performance events, and to provide the maintenance features and TPS protection. 6.2.3 Working Principle and Signal Flow
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The PD1 consists of the PPI, E1 mapping/demapping, interface conversion module, communication and control module and so on. 6.2.4 Front Panel On the front panel of the PD1, there are indicators. 6.2.5 Valid Slots The PD1 must be used with the L75S or L12S. 6.2.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the PD1 indicates the interface impedance type. 6.2.7 TPS Protection for the Board The PD1 supports the 1:N TPS protection. 6.2.8 Board Configuration Reference You can use the T2000 to set parameters for the PD1. 6.2.9 Technical Specifications The technical specifications of the PD1 cover the electrical interface specifications, board dimensions, weight and power consumption.

6.2.1 Version Description

The PD1 has two versions, R1 and R2. The two versions have different functions. Table 6-5 lists the details on the versions of the PD1 board. Table 6-5 Version Description of the PD1 Item Functional version Difference Replaceability Description The PD1 has two versions, R1 and R2. The R2PD1 supports the E13 function and the board version replacement function. The R1PD1A can be replaced by the R2PD1A. The R1PD1B can be replaced by the R2PD1B.

6.2.2 Function and Feature

The PD1 is used to process E1 signals and the overhead, to report alarms and performance events, and to provide the maintenance features and TPS protection. Table 6-6 lists the functions and features of the PD1.

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Table 6-6 Functions and features of the PD1 Function and Feature Basic function Service processing PD1 R1PD1 Processes 32 x E1 signals. Accesses and processes 32 x E1 electrical signals when used with the interface board. R2PD1 Processes 32 x E1 signals. Accesses and processes 32 x E1 electrical signals when used with the interface board. Supports the E13 function, which is used to converge E1 services into E3 services.

Overhead processing Alarm and performance event Maintenanc e feature

Supports the transparent transmission and termination of the POH bytes at the VC-12 level, such as the J2 byte. Provides rich alarms and performance events for easy management and maintenance of the equipment. Supports inloop and outloop for the electrical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services. Supports the PRBS function.

Protection scheme

Supports the TPS protection when used with the electrical interface switching board.

6.2.3 Working Principle and Signal Flow

The PD1 consists of the PPI, E1 mapping/demapping, interface conversion module, communication and control module and so on. Figure 6-4 shows the block diagram for the functions of the PD1.

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Figure 6-4 Block diagram for the functions of the PD1

1.5 MHz/ 2 MHz OSC 155 MHz PLL
Reference clock Cross-connect unit

E1

LIU P P I LIU

6 x 2 Mbit/s

155 Mbit/s

High speed bus

E1

E1 mapping/ demapping
6 x 2 Mbit/s

155 Mbit/s

Interface coversion module

Cross-connect unit A

High speed bus

Cross-connect unit B

LOS Outloop/Inloop control

Communication and control module

+3.3 V

Frame header Communication

Cross-connect unit SCC Unit

+2.5 V +1.8 V

DC/DC converter

DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse +3.3 V backup power

Figure 6-5 shows the block diagram of the E1mapping/ demapping. Figure 6-5 Block diagram of the E1 mapping/ demapping
E1 mapping/demapping E1 STM-1

LPA

LPT

HPA

HPT

PDH AIS Detector

LPOH(V5/J2/N2/ K4) insertion LPOH(V5/J2/N2/ K4) Extraction

TU-AIS/TU-LOP Detector

E1

STM-1

LPA

LPT

HPA

HPT

The function modules are described as follows.

PPI
The PPI module mainly consists of line interface units (LIUs). It provides inloop and outloop function. This module:
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l l l

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Encodes and decodes signals. Recovers data and clock. Processes the PDH LOS signals.

E1 mapping/demapping
l l

LPA The 2 Mbit/s plesiochronous stream is inserted in a VC-12 container to be adapted so as to be transported into the synchronous network for check of the PDH AIS. LPT The virtual container (VC-12) is formatted. The VC-12 is structured so that its octets are distributed within a 125 us interval (for example, one STM1 period), and consists of the VC-12 container and POH. The latter contains nine octets equally distributed within the frame bytes for VC-12: V5, J2, N2, and K4. HPA HPA generates and processes channel level TU-PTR. In the receive direction, the signals are split into VC-12s, which are located and isolated in TU-12. TU-PTR is processed. TUAIS and TU-LOP alarms are monitored. In the transmit direction, VC-12s are located precisely and added with TU-PTR. 63 TUG-3s are multiplexed into a VC-4 by bytes interleaving. The sequence is: TUG2->TUG3->VC-4. HPT The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are distributed within a 125 us interval (for example, one STM1 period), and consists of the C4 container and POH. MST and RST These two functions are necessary to create a proprietary STM1 signal in order to interface the E1 mapping/demapping block with the multiplex unit.

l l

l l

l l

l l

Interface conversion module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals (LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane interface connects to low-rate interface chip of the transmitting system.

Communication and control module

l l l l l

Manages and configures other modules of the boards. Performs inter-board communication through internal Ethernet interface. Traces the clock signal from the active and the standby cross-connect units. Selects the clock and frame header from the active or the standby cross-connect units. Control the indicator on the board.

DC/DC converter
It provides the board with required DC voltages. It converts the 48 V/60 V power supply to the following voltages: + 2.5 V, + 3.3 V, + 1.8 V. In addition, protection for +3.3 V power are provided to the board.
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6.2.4 Front Panel

On the front panel of the PD1, there are indicators.

Appearance of the Front Panel

Figure 6-6 shows the appearance of the front panel of the PD1. Figure 6-6 Front panel of the PD1

PD1
STAT ACT PROG SRV

Indicators
The following indicators are present on the front panel of the board:
l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are no interfaces on the front panel of the PD1. In the OptiX OSN 1500A subrack, the PD1 is used with the L75S or L12S, which provides 75ohm or 120-ohm E1 interfaces. For details, see the sections that describe the L75S and L12S. In the OptiX OSN 1500B subrack, the PD1 is used with the D75S or D12S, which provides 75ohm or 120-ohm E1 interfaces. For details, see the sections that describe the D75S and D12S.

6.2.5 Valid Slots

The PD1 must be used with the L75S or L12S. In the OptiX OSN 1500A subrack, the PD1 can be housed in any of half-width slots 2 and 12. Table 6-7 lists the valid slots for the PD1 and corresponding slots for the L75S and L12S.
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Table 6-7 Valid slots for the PD1 and corresponding slots for the L75S and L12S in the OptiX OSN 1500A subrack Valid Slot for the PD1 Slot 12 Corresponding Slot for the L75S and L12S Slot 7 (116 channels services) Slot 6 (1732 channels services)

NOTE

Slot 2 can house a protection board of the TPS protection. The board housed in slot 2 protects the board housed in slot 12.

In the OptiX OSN 1500B subrack, the PD1 can be housed in any of slots 13, 68 and 1113. Table 6-8 lists the valid slots for the PD1 and the corresponding slots for the D75S and D12S. Table 6-8 Valid slots for the PD1 and corresponding slots for the D75S and D12S in the OptiX OSN 1500B subrack Valid Slot for the PD1 Slot 2 Slot 3 Slots 7 and 12 Slots 8 and 13 Corresponding Slot for the D75S and D12S Slot 14 Slot 16 Slot 15 Slot 17

NOTE

Boards housed in slots 7 and 12 share the interface board housed in slot 15. The boards housed in slots 7 and 12 cannot be used with the interface board housed in slot 15 to add or drop services at the same time. Boards housed in slots 8 and 13 share the interface board housed in slot 17. The boards housed in slots 8 and 13 cannot be used with the interface board housed in slot 17 to add or drop services at the same time. Slot 1 can house a protection board of the TPS protection. The board housed in slot 1 protects the boards housed in slots 2 and 3. Slot 11 can house a protection board of the TPS protection. The board housed in slot 11 protects the boards housed in slots 12 and 13. Slot 6 can house a protection board of the TPS protection. The board housed in slot 6 protects the boards housed in slots 7 and 8.

l l l

6.2.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code of the PD1 indicates the interface impedance type. Table 6-9 lists the relation between the board feature code and interface impedance type for the PD1.
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Table 6-9 Relation between the board feature code and the interface impedance type Board SSR1PD1A01, SSR2PD1A01 SSR1PD1B01, SSR2PD1B01 Feature Code A01 B01 Interface Impedance Type 75 ohms 120 ohms

6.2.7 TPS Protection for the Board

The PD1 supports the 1:N TPS protection.

Protection Principle
In the OptiX OSN 1500A subrack, used with the L75S or L12S, two PD1 boards can get 1:1 TPS protection. Figure 6-7 shows the principle for the TPS protection of the PD1. Figure 6-7 Principle of the TPS protection for the PD1 in the OptiX OSN 1500A subrack

E1protection bus

S L O T 6

S L O T 7

L75S

S L O T 2

S L O T 12

Fail

L75S

E1 service bus

PD1

Cross-connect and timing board

In the OptiX OSN 1500B subrack, used with the D75S or D12S, the PD1 boards can get 1:N (12) TPS protection. Figure 6-8 shows the principle of the TPS protection for the PD1.

Protection

PD1

Detect board fault

Working
TPS switching control bus

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Figure 6-8 Principle of the TPS protection for the PD1 in the OptiX OSN 1500B subrack

E1 protection bus
D75S D75S

E1 service bus Fail Protection

PD1

Working
PD1

Working
PD1

Detect board fault

Cross-connect and timing board

TPS switching control bus

When detecting a failure in the working PD1 board, the cross-connect board issues a command to switch the services from the faulty PD1 to the protection PD1. In this way, services are protected.

Hardware Configuration
In the OptiX OSN 1500A subrack, PD1 boards can be housed in the half-width slots to realize the 1:1 TPS protection. Figure 6-9 shows the slot configuration for the 1:1 TPS protection for the PD1. Figure 6-9 Slot configuration for the 1:1 TPS protection for the PD1 in the OptiX OSN 1500A subrack
Slot 1 Slot 20 FAN PD1(P) Slot 2 Slot 3 Slot 4 Slot 5 Slot 11 Slot 12 PD1(W) Slot 13 CXL16/4/1 CXL16/4/1 Slot 6 L75S(17~32) Slot 7 L75S(1~16) Slot 8 Slot 9 Slot 10 EOW AUX

Table 6-10 shows the slot configuration for the 1:2 TPS protection for the PD1 in the OptiX OSN 1500B subrack.

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Table 6-10 Slot configuration for the 1:2 TPS protection for the PD1 in the OptiX OSN 1500B subrack Board PD1 (protection) PD1 (working) D75S/D12S Protection Group Before the Slot Division Slot 6 Slots 7 and 8 Slots 15 and 17 Protection Group After the Slot Division Slot 1 Slots 2 and 3 Slots 14 and 16 Slot 11 Slots 12 and 13 Slots 15 and 17 Slot 6 Slots 7 and 8 Slots 15 and 17

The two protection groups that contain slots 6 and 11 share the protection bus and thus cannot coexist. Before the slots are divided, the OptiX OSN 1500B supports one group of TPS protection for E1 services. After the slots are divided, when Q2CXL and Q3CXL are uesd, the OptiX OSN 1500B supports a maximum of two TPS protection groups for E1 services. when R1CXL is uesd, the OptiX OSN 1500B supports a maximum of one TPS protection group for E1 services.

6.2.8 Board Configuration Reference

You can use the T2000 to set parameters for the PD1. You can use the T2000 to set the following parameters for the PD1:
l l l l

J2 byte V5 byte Tributary loopback Service loading indication

For details on these parameters, see F Board Configuration Reference.

6.2.9 Technical Specifications

The technical specifications of the PD1 cover the electrical interface specifications, board dimensions, weight and power consumption.

Electrical Interface Specifications

The L12S, L75S, D12S or D75S board provides electrical interfaces for the PD1. For specifications of the electrical interfaces, see the sections that describe these boards.

Mechanical Specifications
The mechanical specifications of the PD1 are as follows:
l l

Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W) Weight (kg)

0.5 (R1PD1)
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0.56 (R2PD1)

Power Consumption
In the normal temperature (25), the maximum power consumption of the R1PD1 is 15 W. In the normal temperature (25), the maximum power consumption of the R2PD1 is 10.4 W.

6.3 PQ1
This section describes the PQ1, a 63 x E1 processing board, in terms of the version, function, principle, front panel, configuration and specifications. 6.3.1 Version Description The PQ1 has two versions, R1 and R2. The two versions have different functions. 6.3.2 Function and Feature The PQ1 can be used to process E1 signals and the overhead, to report alarms and performance events, to provide the maintenance feature and the TPS protection. 6.3.3 Working Principle and Signal Flow The PQ1 consists of the PPI, E1/T1 mapping/demapping, interface conversion module and so on. 6.3.4 Front Panel On the front panel of the PQ1, there are indicators. 6.3.5 Valid Slots The PQ1 must be used with the D75S, D12S or D12B. 6.3.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the PQ1 indicates the interface impedance type. 6.3.7 TPS Protection for the Board The PQ1 supports the 1:N TPS protection. 6.3.8 Board Configuration Reference You can use the T2000 to set parameters for the PQ1. 6.3.9 Technical Specifications The technical specifications of the PQ1 cover the electrical interface specifications, board dimensions, weight and power consumption.

6.3.1 Version Description

The PQ1 has two versions, R1 and R2. The two versions have different functions. Table 6-11 lists the details on the versions of the PQ1 board.

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Table 6-11 Version Description of the PQ1 Item Functional version Difference Description The PQ1 has two versions, N1 and N2. The N2PQ1 supports the E13 function and the board version replacement function. The N2PQ1 does not perform the tributary timing function. Replaceability When the tributary timing function is not required, the N1PQ1A can be replaced by the N2PQ1A. When the tributary timing function is not required, the N1PQ1B can be replaced by the N2PQ1B. NOTE: When the impedance of interfaces is ignored, the PQ1A (75 ohms) and PQ1B (100 ohms/120 ohms) are called PQ1 hereinafter.

6.3.2 Function and Feature

The PQ1 can be used to process E1 signals and the overhead, to report alarms and performance events, to provide the maintenance feature and the TPS protection. Table 6-12 lists the functions and features of the PQ1. Table 6-12 Functions and features of the PQ1 Function and Feature Basic function Service processing PQ1 N1PQ1 Processes 63 x E1 signals. Processes 63 x E1 electrical signals when used with an interface board. N2PQ1 Processes 63 x E1 signals. Processes 63 x E1 electrical signals when used with an interface board. Supports the E13 function, which is used to converge E1 services into E3 services.

Overhead processing Alarm and performanc e event

Supports the transparent transmission and termination of the POH bytes at the VC-12, such as the J2 byte. Provides rich alarms and performance events for easy management and maintenance of the equipment.

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Function and Feature Maintenan ce feature

PQ1 N1PQ1 N2PQ1

Supports inloop and outloop for electrical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services. Supports the PRBS function.

Protection scheme

Supports the TPS protection when used with the interface board. When the working board is the PQ1, the protection board can be the PQM. In this way, the hybrid protection is provided.

6.3.3 Working Principle and Signal Flow

The PQ1 consists of the PPI, E1/T1 mapping/demapping, interface conversion module and so on. Figure 6-10 shows the block diagram for the functions of the PQ1. Figure 6-10 Block diagram for the functions of the PQ1
1.5 MHz/ 2 MHz OSC 155 MHz PLL
Reference clock Cross-connect unit

E1/T1

LIU P P I LIU

6 x 1.5 Mbit/s/ 6 x 2 Mbit/s

155 Mbit/s

High speed bus

E1/T1

6 x 1.5 Mbit/s/ 6 x 2 Mbit/s

E1/T1 mapping/ demapping

155 Mbit/s

Interface coversion module

Cross-connect unit A

High speed bus

Cross-connect unit B

LOS Outloop/Inloop control

Communication and control module

+3.3 V

Frame header Communication

Cross-connect unit SCC Unit

+2.5 V +1.8 V

DC/DC converter

DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse +3.3 V backup power

Figure 6-11 shows the block diagram of the E1/T1 mapping/ demapping.
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Figure 6-11 Block diagram of the E1/T1 mapping/ demapping

E1/T1 mapping/demapping E1/T1 STM-1

LPA

LPT

HPA

HPT

PDH AIS Detector

LPOH(V5/J2/N2/ K4) insertion LPOH(V5/J2/N2/ K4) Extraction

TU-AIS/TU-LOP Detector

E1/T1

STM-1

LPA

LPT

HPA

HPT

The function modules are described as follows.

PPI
The PPI module mainly consists of line interface units (LIUs). It provides inloop and outloop function. This module:
l l l

Encodes and decodes signals. Recovers data and clock. Processes the PDH LOS signals.

E1/T1 mapping/demapping
l l

LPA The 2 Mbit/s (1.5 Mbit/s) plesiochronous stream is inserted in a VC-12 container to be adapted so as to be transported into the synchronous network for check of the PDH AIS. LPT The virtual container (VC-12) is formatted. The VC-12 is structured so that its octets are distributed within a 125 us interval (for example, one STM1 period), and consists of the VC-12 container and POH. The latter contains nine octets equally distributed within the frame bytes for VC-12: V5, J2, N2, and K4. HPA HPA generates and processes channel level TU-PTR. In the receive direction, the signals are split into VC-12s, which are located and isolated in TU-12. TU-PTR is processed. TUAIS and TU-LOP alarms are monitored. In the transmit direction, VC-12s are located precisely and added with TU-PTR. 63 TUG-3s are multiplexed into a VC-4 by bytes interleaving. The sequence is: TUG2->TUG3->VC-4. HPT

l l

l l

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are distributed within a 125 us interval (for example, one STM1 period), and consists of the C4 container and POH. MST and RST These two functions are necessary to create a proprietary STM1 signal in order to interface the E1/T1 mapping/demapping block with the multiplex unit.

l l

Interface conversion module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals (LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane interface connects to low-rate interface chip of the transmitting system.

Communication and control module

l l l l l

Manages and configures other modules of the boards. Performs inter-board communication through internal Ethernet interface. Traces the clock signal from the active and the standby cross-connect units. Selects the clock and frame header from the active or the standby cross-connect units. Control the indicator on the board.

DC/DC converter
It provides the board with required DC voltages. It converts the 48 V/60 V power supply to the following voltages: + 2.5 V, + 3.3 V, + 1.8 V. In addition, protection for +3.3 V power are provided to the board.

6.3.4 Front Panel

On the front panel of the PQ1, there are indicators.

Appearance of the Front Panel

Figure 6-12 shows the appearance of the front panel of the PQ1.

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Figure 6-12 Front panel of the PQ1

PQ1
STAT ACT PROG SRV

PQ1

Indicators
The following indicators are present on the front panel of the board:
l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are no interfaces on the front panel of the PQ1. The D75S, D12S or D12B provides 75-ohm or 120-ohm E1/T1 interfaces for the PQ1. For details, see the sections that describe the D75S, D12S and D12B.

6.3.5 Valid Slots

The PQ1 must be used with the D75S, D12S or D12B. The OptiX OSN 1500A does not support the PQ1 board.
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In the OptiX OSN 1500B subrack, the PQ1 can be housed in any of slots 1113, and must be used with the D75S, D12S or D12B. Table 6-13 lists the valid slots for the PQ1 and corresponding slots for the D75S, D12S or D12B. Table 6-13 Valid slots for the PQ1 and corresponding slots for the D75S, D12S or D12B in the OptiX OSN 1500B subrack Valid Slot for the PQ1 Slot 12 Corresponding Slot for the D75S, D12S and D12B Slot 14 (132 channels of services) Slot 15 (3363 channels of services) Slot 13 Slot 16 (132 channels of services) Slot 17 (3363 channels of services)

NOTE

l l

Slot 11 can house a protection board of the TPS protection. The board housed in slot 11 protects the boards housed in slots 12 and 13. If the interface board for the boards housed in slot 12 and 13 is the D12B, the boards housed in slot 12 and 13 cannot get the TPS protection.

6.3.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code of the PQ1 indicates the interface impedance type. Table 6-14 lists the relation between the board feature code and interface impedance type for the PQ1. Table 6-14 Relation between the board feature code and the interface impedance type Board SSN1PQ1A01, SSN2PQ1A01 SSN1PQ1B01, SSN2PQ1B01 Feature Code A01 B01 Interface Impedance Type 75 ohms 120 ohms

6.3.7 TPS Protection for the Board

The PQ1 supports the 1:N TPS protection.

Protection Principle
In the OptiX OSN 1500B subrack, used with the D75S or D12S, the PQ1 can get the 1:N (2) TPS protection. Figure 6-13 shows the principle of the TPS protection for the PQ1.
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Figure 6-13 Principle of the TPS protection for the PQ1 in the OptiX OSN 1500B subrack

E1 protection bus

S S L L O O T T 14 15

S L O T 16

S L O T 17

D75S D75S

D75S D75S

E1 service bus

SLOT 11

SLOT 12

SLOT 13

Fail

When detecting a failure in the working PD1 board, the cross-connect board issues a command to switch the services from the faulty PQ1 to the protection PQ1. In this way, services are protected.

Hardware Configuration
Table 6-15 lists the slot configuration for the 1:2 TPS protection for the PQ1 in the OptiX OSN 1500B subrack. Table 6-15 Slot configuration for the 1:2 TPS protection for the PQ1 in the OptiX OSN 1500B subrack Working Board PQ1A (75 ohms) PQ1B (120 ohms) Protection Board PQ1A (75 ohms) PQ1B (120 ohms) or PQM Slot Slot 11 can house the protection board. The board in slot 11 protects the boards in slots 12 and 13. Figure 6-14 shows the slot configuration for the 1:2 TPS protection for the PQ1.

Protection

Cross-connect and timing board

Working

Detect board fault

Working
TPS switching control bus

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Figure 6-14 Slot configuration for 1:2 TPS protection of the PQ1
Slot 14 Slot 15 Slot 16 Slot 17 Slot 11 Slot 20 Slot 12 Slot 13 Slot 4 Slot 5 D75S D75S D75S D75S Slot 19 Slot 6 Slot 7 Slot 8 Slot 9 Slot 10 EOW AUX PIU Slot 18 PIU

Protection Working Working

CXL16/4/1 CXL16/4/1

FAN

6.3.8 Board Configuration Reference

You can use the T2000 to set parameters for the PQ1. You can use the T2000 to set the following parameters for the PQ1:
l l l l

J2 byte V5 byte Tributary loopback Service loading indication

For details on these parameters, see F Board Configuration Reference.

6.3.9 Technical Specifications

The technical specifications of the PQ1 cover the electrical interface specifications, board dimensions, weight and power consumption.

Electrical Interface Specifications

The D75S, D12S or D12B provides electrical interfaces for the PQ1. For the specifications of these electrical interfaces, see the section that describes the D75S, D12S or D12B.

Mechanical Specifications
The mechanical specifications of the PQ1 are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 1.0

Power Consumption
In the normal temperature (25), the maximum power consumption of the N1PQ1 is 19 W. In the normal temperature (25), the maximum power consumption of the N2PQ1 is 13 W.
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6.4 PQM
This section describes the PQM, a 63 x E1/T1 processing board, in terms of the version, function, principle, front panel, configuration and specifications. 6.4.1 Version Description The functional version of the PQM board is N1. 6.4.2 Function and Feature The PQM is used to process E1/T1 signals and the overhead, to report alarms and performance events, and to provide the maintenance features and TPS protection. 6.4.3 Working Principle and Signal Flow The PQM consists the PPI, E1/T1 mapping/demapping, interface conversion module, communication and control module and so on. 6.4.4 Front Panel On the front panel of the PQM, there are indicators. 6.4.5 Valid Slots The OptiX OSN 1500A does not support the PQM board. 6.4.6 TPS Protection for the Board The PQM supports the 1:N TPS protection. 6.4.7 Board Configuration Reference You can use the T2000 to set parameters for the PQM. 6.4.8 Technical Specifications The technical specifications of the PQM cover the electrical interface specifications, board dimensions, weight and power consumption.

6.4.1 Version Description

The functional version of the PQM board is N1.

6.4.2 Function and Feature

The PQM is used to process E1/T1 signals and the overhead, to report alarms and performance events, and to provide the maintenance features and TPS protection. Table 6-16 lists the functions and features of the PQM. Table 6-16 Functions and features of the PQM Function and Feature Basic function Service processing PQM Processes 63 x E1/T1 signals. The PQM accesses and processes 63 x E1/T1 electrical signals when used with the interface board. Each channel can be configured as E1 or T1.

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Function and Feature Overhead processing Alarm and performance event Maintenance feature

PQM Supports the transparent transmission and termination of the POH bytes at the VC-12 level, such as the J2 byte. Provides rich alarms and performance events for easy management and maintenance of the equipment. Supports inloop and outloop for electrical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services. Supports the PRBS function.

Protection scheme

When used with the interface board, the PQM supports the TPS protection. When the working board is the PQ1, the protection board can be the PQM. In this way, the hybrid protection is provided.

6.4.3 Working Principle and Signal Flow

The PQM consists the PPI, E1/T1 mapping/demapping, interface conversion module, communication and control module and so on. Figure 6-15 shows the block diagram for the functions of the PQM.

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Figure 6-15 Block diagram for the functions of the PQM

1.5 MHz/ 2 MHz OSC 155 MHz PLL
Reference clock Cross-connect unit

E1/T1

LIU P P I LIU

6 x 1.5 Mbit/s/ 6 x 2 Mbit/s

155 Mbit/s

High speed bus

E1/T1

6 x 1.5 Mbit/s/ 6 x 2 Mbit/s

E1/T1 mapping/ demapping

155 Mbit/s

Interface coversion module

Cross-connect unit A

High speed bus

Cross-connect unit B

LOS Outloop/Inloop control

Communication and control module

+3.3 V

Frame header Communication

Cross-connect unit SCC Unit

+2.5 V +1.8 V

DC/DC converter

DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse +3.3 V backup power

Figure 6-16 shows the block diagram of the E1/T1 mapping/ demapping. Figure 6-16 Block diagram of the E1/T1 mapping/ demapping
E1/T1 mapping/demapping E1/T1 STM-1

LPA

LPT

HPA

HPT

PDH AIS Detector

LPOH(V5/J2/N2/ K4) insertion LPOH(V5/J2/N2/ K4) Extraction

TU-AIS/TU-LOP Detector

E1/T1

STM-1

LPA

LPT

HPA

HPT

The function modules are described as follows.

PPI
The PPI module mainly consists of line interface units (LIUs). It provides inloop and outloop function. This module:
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l l l

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Encodes and decodes signals. Recovers data and clock. Processes the PDH LOS signals.

E1/T1 mapping/demapping
l l

LPA The 2 Mbit/s (1.5 Mbit/s) plesiochronous stream is inserted in a VC-12 container to be adapted so as to be transported into the synchronous network for check of the PDH AIS. LPT The virtual container (VC-12) is formatted. The VC-12 is structured so that its octets are distributed within a 125 us interval (for example, one STM1 period), and consists of the VC-12 container and POH. The latter contains nine octets equally distributed within the frame bytes for VC-12: V5, J2, N2, and K4. HPA HPA generates and processes channel level TU-PTR. In the receive direction, the signals are split into VC-12s, which are located and isolated in TU-12. TU-PTR is processed. TUAIS and TU-LOP alarms are monitored. In the transmit direction, VC-12s are located precisely and added with TU-PTR. 63 TUG-3s are multiplexed into a VC-4 by bytes interleaving. The sequence is: TUG2->TUG3->VC-4. HPT The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are distributed within a 125 us interval (for example, one STM1 period), and consists of the C4 container and POH. MST and RST These two functions are necessary to create a proprietary STM1 signal in order to interface the E1/T1 mapping/demapping block with the multiplex unit.

l l

l l

l l

l l

Interface conversion module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals (LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane interface connects to low-rate interface chip of the transmitting system.

Communication and control module

l l l l l

Manages and configures other modules of the boards. Performs inter-board communication through internal Ethernet interface. Traces the clock signal from the active and the standby cross-connect units. Selects the clock and frame header from the active or the standby cross-connect units. Control the indicator on the board.

DC/DC converter
It provides the board with required DC voltages. It converts the 48 V/60 V power supply to the following voltages: + 2.5 V, + 3.3 V, + 1.8 V. In addition, protection for +3.3 V power are provided to the board.
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6.4.4 Front Panel

On the front panel of the PQM, there are indicators.

Appearance of the Front Panel

Figure 6-17 shows the appearance of the front panel of the PQM. Figure 6-17 Front panel of the PQM
PQM
STAT ACT PROG SRV

PQM

Indicators
The following indicators are present on the front panel of the board:
l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are no interfaces on the front panel of the PQM.
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The D12S or D12B provides 100-ohm T1/E1 interfaces for the PQM. For details, see the sections that describe the D12S and D12B.

6.4.5 Valid Slots

The OptiX OSN 1500A does not support the PQM board. In the OptiX OSN 1500B subrack, the PQM can be housed in any of slots 1113, and must be used with the D12S or D12B. Table 6-17 lists the valid slots for the PQM and corresponding slots for the D12S and D12B. Table 6-17 Valid slots for the PQM and corresponding slots for the D12S and D12B in the OptiX OSN 1500B subrack Valid Slot for the PQM Slot 12 Corresponding Slot for the D12S and D12B Slot 14 (132 channels of services) Slot 15 (3363 channels of services) Slot 13 Slot 16 (132 channels of services) Slot 17 (3363 channels of services)

NOTE

l l

Slot 11 can house a protection board of the TPS protection. The board housed in slot 11 protects the boards housed in slots 12 and 13. If the interface board for the boards housed in slots 12 and 13 is the D12B, the boards housed in slots 12 and 13 cannot get the TPS protection.

6.4.6 TPS Protection for the Board

The PQM supports the 1:N TPS protection.

Protection Principle
In the OptiX OSN 1500B, used with the D12S, the PQM can be configured into one 1:N (N 2) TPS protection group. Figure 6-18 shows the principle of the TPS protection for the PQM.

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Figure 6-18 Principle of the TPS protection for the PQM in the OptiX OSN 1500B subrack

E1/T1 protection bus

S S L L O O T T 14 15

S L O T 16

S L O T 17

D12S

D12S

D12S

D12S

E1/T1 service bus

SLOT 11

SLOT 12

SLOT 13

Fail

When detecting a fault in the working PQM board, the cross-connect board issues a command to switch the services from the faulty PQM to the protection PQM. In this way, services are protected.

Hardware Configuration
Table 6-18 lists the slot configuration for the 1:2 TPS protection for the PQM in the OptiX OSN 1500B subrack. Table 6-18 Slot configuration for the 1:2 TPS protection for the PQM in the OptiX OSN 1500B subrack Working Board PQM (E1) PQM (T1) Protection Board PQM (E1) PQM (T1) Slot Slot 11 can house the protection board. The board in slot 11 protects the boards in slots 12 and 13. Figure 6-19 shows the slot configuration for the 1:2 TPS protection for the PQM.

Protection

Cross-connect and timing board

Working

Detect board fault

Working
TPS switching control bus

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Figure 6-19 Slot configuration for the 1:2 TPS protection for the PQM in the OptiX OSN 1500B subrack
Slot 14 Slot 15 Slot 16 Slot 17 Slot 11 Slot 20 Slot 12 Slot 13 Slot 4 Slot 5 D12S D12S D12S D12S Slot 19 Slot 6 Slot 7 Slot 8 Slot 9 Slot 10 EOW AUX PIU Slot 18 PIU

Protection Working Working

CXL16/4/1 CXL16/4/1

FAN

6.4.7 Board Configuration Reference

You can use the T2000 to set parameters for the PQM. You can use the T2000 to set the following parameters for the PQM:
l l l l l

J2 byte V5 byte Tributary loopback Service loading indication Path service type

For details on these parameters, see F Board Configuration Reference.

6.4.8 Technical Specifications

The technical specifications of the PQM cover the electrical interface specifications, board dimensions, weight and power consumption.

Electrical Interface Specifications

The D12S or D12B provides electrical interfaces for the PQM. For the specifications of the electrical interfaces, see the sections that describe the D12S and D12B.

Mechanical Specifications
The mechanical specifications of the PQM are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 1.0

Power Consumption
In the normal temperature (25), the maximum power consumption of the PQM is 22 W.
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6.5 PL3
This section describes the PL3, a 3 x E3/T3 processing board, in terms of the version, function, principle, front panel, configuration and specifications. 6.5.1 Version Description The PL3 has two versions, N1 and N2. The two versions have different functions. 6.5.2 Function and Feature The PL3 can be used to process E3/T3 signals and the overhead, to report alarms and performance events, to provide the maintenance feature and the TPS protection. 6.5.3 Working Principle and Signal Flow The PL3 consists the PPI, E3/T3 mapping/demapping, interface conversion module, communication and control module and so on. 6.5.4 Front Panel On the front panel of the PL3, there are indicators. 6.5.5 Valid Slots The OptiX OSN 1500A does not support the PL3 board. 6.5.6 TPS Protection for the Board The PL3 supports the 1:N TPS protection. 6.5.7 Board Configuration Reference You can use the T2000 to set parameters for the PL3. 6.5.8 Technical Specifications The technical specifications of the PL3 cover the electrical interface specifications, board dimensions, weight and power consumption.

6.5.1 Version Description

The PL3 has two versions, N1 and N2. The two versions have different functions. Table 6-19 lists the details on the versions of the PL3 board. Table 6-19 Version description of the PL3 Item Functional version Difference Description The PL3 has two versions, N1 and N2. The N1PL3 does not support the E13/M13 function. The N2PL3 supports the E13/M13 function. The N2PL3 supports the board version replacement function and can replace the N1PL3. After the N1PL3 is replaced, the N2PL3 is consistent with the N1PL3 in configuration and service status. Replaceability The N2PL3 can fully replace the N1PL3.

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6.5.2 Function and Feature

The PL3 can be used to process E3/T3 signals and the overhead, to report alarms and performance events, to provide the maintenance feature and the TPS protection. Table 6-20 lists the functions and features of the PL3. Table 6-20 Functions and features of the PL3 Function and Feature Basic function Service processing Overhead processing Alarm and performance event Maintenance feature PL3 Processes 3 x E3/T3 signals. Accesses and processes 3 x E3/T3 electrical signals. Supports the setting and query of all path overhead bytes at the VC-3 level. Provides rich alarms and performance events for easy management and maintenance of the equipment. Supports inloop and outloop for electrical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services. Supports the PRBS function. Protection scheme Supports the TPS protection when used with the interface board and the switching board.

6.5.3 Working Principle and Signal Flow

The PL3 consists the PPI, E3/T3 mapping/demapping, interface conversion module, communication and control module and so on. Figure 6-20 shows the block diagram for the functions of the PL3.

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Figure 6-20 Block diagram for the functions of the PL3

34 MHz/ 45 MHz OSC 155 MHz PLL
Reference clock Cross-connect unit

E3/T3

LIU P P I LIU

6 x 34 Mbit/s/ 6 x 45 Mbit/s

2 x 155 Mbit/s

High speed bus

E3/T3

6 x 34 Mbit/s/ 6 x 45 Mbit/s

E3/T3 mapping/ demapping

2 x 155 Mbit/s

Interface coversion module

Cross-connect unit A

High speed bus

Cross-connect unit B

LOS Outloop/Inloop control

Communication and control module

+3.3 V

Frame header Communication

Cross-connect unit SCC Unit

+1.8 V

DC/DC converter

DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse +3.3 V backup power

OSC: Oscillator

PPI: PDH physical interface

Figure 6-21 shows the block diagram of the E3/T3 mapping/demapping. Figure 6-21 Block diagram of the E3/T3 mapping/demapping
E3/T3 mapping/demapping

E3/T3

LPA

LPT

HPA

HPT

STM-1

LPOH(J1/C2/B3) insertion PDH AIS Detector LPOH(J1/C2/B3) extraction TU-AIS/TU-LOP Detector

E3/T3

STM-1

LPA

LPT

HPA

HPT

LPA: Low order Path Adaptation HPA: High order Path Adaptation

LPT: Low order Path Termination HPT: High order Path Termination

The function modules are described as follows.

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PPI
l

The PPI module mainly consists of line interface units (LIUs). It provides inloop and outloop function. This module: Encodes and decodes signals. Recovers data and clock. Processes the A_LOS alarm.

l l l

E3/T3 mapping/demapping
l l

LPA The 45 Mbit/s (34 Mbit/s) plesiochronous stream is inserted in a C3 container to be adapted so as to be transported into the synchronous network. LPT The virtual container (VC-3) is formatted by lower order path termination (LPT). The VC-3 is structured so that its octets are distributed within a 125 us interval (for example, one STM1 period), and consists of the VC-3 container and POH. The latter contains nine octets equally distributed within the frame bytes for VC-3: J1, B3, C2, G1, F2, H4, F3, K3, and N1. HPA HPA generates and processes channel level TU-PTR. In the receive direction, the signals are split into VC-3s, which are located and isolated in TU-3. TU-PTR is processed. In the transmit direction, VC-3s are located precisely and added with TU-PTR. Three TUG-3s are multiplexed into a VC-4 by bytes interleaving. The sequence is: TU-3->TUG3->VC-4. HPT The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are distributed within a 125 us interval (for example, one STM1 period), and consists of the C4 container and POH. MST and RST The functions are necessary to create a proprietary STM1 signal in order to connect the interface conversion module.

l l l

l l

l l

l l

Interface conversion module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals (LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane interface connects to low-rate interface chip of the transmitting system.

Communication and control module

l l l l l

Manages and configures other modules of the boards. Performs inter-board communication through internal Ethernet interface. Traces the clock signal from the active and the standby cross-connect units. Selects the clock and frame header from the active or the standby cross-connect units. Controls the indicator on the board.
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DC/DC converter module

Through the DC/ DC converting module, different direct currents are provided to each chip on the board. Two direct currents are provided: +1.8 V and +3.3 V. In addition, protection for +3.3 V power are provided to the board.

6.5.4 Front Panel

On the front panel of the PL3, there are indicators.

Appearance of the Front Panel

Figure 6-22 shows the appearance of the front panel of the PL3. Figure 6-22 Front panel of the PL3

PL3
STAT ACT PROG SRV

PL3

Indicators
The following indicators are present on the front panel of the board:
l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit.
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l l

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are no interfaces on the front panel of the PL3. The C34S, an electrical interface switching board, provides the E3/T3 interfaces for the PL3. For details, see the section that describes the D34S.

6.5.5 Valid Slots

The OptiX OSN 1500A does not support the PL3 board. In the OptiX OSN 1500B subrack, the PL3 can be housed in any of slots 1213, and must be used with the C34S. Table 6-21 lists the valid slots for the PL3 and corresponding slots for the C34S. Table 6-21 Valid slots for the PL3 and corresponding slots for the C34S in the OptiX OSN 1500B subrack Valid Slot for the PL3 Slot 12 Slot 13 Corresponding Slot for the C34S Slot 14 Slot 16

6.5.6 TPS Protection for the Board

The PL3 supports the 1:N TPS protection.

Protection Principle
In the OptiX OSN 1500B, used with the C34S and TSB8, the PL3 can be configured into one 1:1 TPS protection group. Figure 6-23 shows the principle of the TPS protection for the PL3.

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Figure 6-23 Principle of the TPS protection for the PL3 in the OptiX OSN 1500B subrack
3 xE3/T3

TSB8

C34S

Switch control signal

Crossconnect and timing board

SLOT 4/5

Protection PL3

Working PL3
Fail

SLOT12

SLOT13

Normal state When the working boards are running normally, the control switch of the C34S is in position 1 and services are directly accessed to the PL3 board.

Switching state When the working board detects a fault and requires a switching, the control switch of the C34S is shifted to position 2 and the control switch of the TSB8 is shifted to a corresponding position. In this way, the protection board protects the faulty working board.

Hardware Configuration
Table 6-22 lists the slot configuration for the 1:1 TPS protection for the PL3 in the OptiX OSN 1500B subrack. Table 6-22 Slot configuration for the 1:1 TPS protection for the PL3 in the OptiX OSN 1500B subrack Working Board PL3 (E3) PL3 (T3) Protection Board PL3 (E3)/PD3 (E3) PL3 (T3)/PD3 (T3) Slot If the working board is the PL3, the PD3 can be the protection board. Figure 6-24 shows the slot configuration for the 1:1 TPS protection for the PL3.

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Figure 6-24 Slot configuration for the 1:1 TPS protection for the PL3 in the OptiX OSN 1500B subrack
Slot 14 Slot 15 Slot 16 Slot 17 Slot 11 Slot 20 FAN Slot 12 Slot 13 Slot 4 Slot 5 Protection Working CXL16/4/1 CXL16/4/1 C34S TSB8 Slot 18 PIU

Slot 19 Slot 6 Slot 7 Slot 8 Slot 9 Slot 10

PIU

EOW AUX

As shown in Figure 6-24, the protection board housed in slot 12 protects the board housed in slot 13. Table 6-23 lists the slots for the PL3, C34S and TSB8. Table 6-23 Slots for the PL3, C34S and TSB8 in the OptiX OSN 1500B subrack Board PL3 (working) PL3/PD3 (protection) TSB8 C34S Protection Group Slot 13 Slot 12 Slot 14 Slot 16

6.5.7 Board Configuration Reference

You can use the T2000 to set parameters for the PL3. You can use the T2000 to set the following parameters for the PL3:
l l l l l

J1 byte C2 byte Tributary loopback Service loading indication Path service type

For details on these parameters, see F Board Configuration Reference.

6.5.8 Technical Specifications

The technical specifications of the PL3 cover the electrical interface specifications, board dimensions, weight and power consumption.
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Electrical Interface Specifications

The C34S provides electrical interfaces for the PL3. For the specifications of the electrical interfaces, see the section that describes the C34S.

Mechanical Specifications
The mechanical specifications of the PL3 are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 1.0

Power Consumption
In the normal temperature (25), the maximum power consumption of the N1PL3 is 15 W. In the normal temperature (25), the maximum power consumption of the N2PL3 is 12 W.

6.6 PL3A
This section describes the PL3A, a 3 x E3/T3 processing board, in terms of the version, function, principle, front panel, configuration and specifications. 6.6.1 Version Description The PL3A board has two functional versions, N1 and N2. The difference between the two versions lies in the support for the E13/M13 function. 6.6.2 Function and Feature The PL3A can be used to process E3/T3 signals and the overhead, to report alarms and performance events, to provide the maintenance feature and the TPS protection. 6.6.3 Working Principle and Signal Flow The PL3A consists of the PPI, E3/T3 mapping/demapping, interface conversion module, communication and control module and so on. 6.6.4 Front Panel On the front panel of the PL3A, there are indicators and interfaces. 6.6.5 Valid Slots The PL3A can be housed in different slots in the OptiX OSN 1500A and OptiX OSN 1500B subracks 6.6.6 Board Configuration Reference You can use the T2000 to set parameters for the PL3A. 6.6.7 Technical Specifications The technical specifications of the PL3A cover the electrical interface specifications, board dimensions, weight and power consumption.

6.6.1 Version Description

The PL3A board has two functional versions, N1 and N2. The difference between the two versions lies in the support for the E13/M13 function. Table 6-24 lists the details on the versions of the PL3A board.
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Table 6-24 Version description of the PL3A Item Functional version Difference Description The PL3A has two versions, N1 and N2. The N1PL3A does not support the E13/M13 function. The N2PL3A supports the E13/M13 function. The N2PL3A supports the board version replacement function and can replace the N1PL3A. After the N1PD3A is replaced, the N2PD3A is consistent with the N1PD3A in configuration and service status. Replaceability The N2PD3A can fully replace the N1PD3A.

6.6.2 Function and Feature

The PL3A can be used to process E3/T3 signals and the overhead, to report alarms and performance events, to provide the maintenance feature and the TPS protection. Table 6-25 lists the functions and features of the PL3A. Table 6-25 Functions and features of the PL3A Function and Feature Basic function PL3A Processes 3 x E3/T3 signals. The N2PL3A supports the E13 function, which is used to converge E1 services into E3 services. The N2PL3A supports the M13 function, which is used to converge T1 services into T3 services. Service processing Overhead processing Alarm and performance event Accesses and processes 3 x E3/T3 electrical signals. Supports the setting and query of all path overhead bytes at the VC-3 level. Provides rich alarms and performance events for easy management and maintenance of the equipment.

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Function and Feature Maintenance feature

PL3A Supports inloop and outloop for electrical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services. Supports the PRBS function.

6.6.3 Working Principle and Signal Flow

The PL3A consists of the PPI, E3/T3 mapping/demapping, interface conversion module, communication and control module and so on. Figure 6-25 shows the block diagram for the functions of the PL3A. Figure 6-25 Block diagram for the functions of the PL3A
34 MHz/ 45 MHz OSC 155 MHz PLL
Reference clock Cross-connect unit

E3/T3

LIU P P I LIU

6 x 34 Mbit/s/ 6 x 45 Mbit/s

2 x 155 Mbit/s

High speed bus

E3/T3

6 x 34 Mbit/s/ 6 x 45 Mbit/s

E3/T3 mapping/ demapping

2 x 155 Mbit/s

Interface coversion module

Cross-connect unit A

High speed bus

Cross-connect unit B

LOS Outloop/Inloop control

Communication and control module

+3.3 V

Frame header Communication

Cross-connect unit SCC Unit

+1.8 V

DC/DC converter

DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse +3.3 V backup power

OSC: Oscillator

PPI: PDH physical interface

Figure 6-26 shows the block diagram of the E3/T3 mapping/demapping.

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Figure 6-26 Block diagram of the E3/T3 mapping/demapping

E3/T3 mapping/demapping

E3/T3

LPA

LPT

HPA

HPT

STM-1

LPOH(J1/C2/B3) insertion PDH AIS Detector LPOH(J1/C2/B3) extraction TU-AIS/TU-LOP Detector

E3/T3

STM-1

LPA

LPT

HPA

HPT

LPA: Low order Path Adaptation HPA: High order Path Adaptation

LPT: Low order Path Termination HPT: High order Path Termination

The function modules are described as follows.

PPI
l

The PPI module mainly consists of line interface units (LIUs). It provides inloop and outloop function. This module: Encodes and decodes signals. Recovers data and clock. Processes the A_LOS alarm.

l l l

E3/T3 mapping/demapping
l l

LPA The 45 Mbit/s (34 Mbit/s) plesiochronous stream is inserted in a C3 container to be adapted so as to be transported into the synchronous network. LPT The virtual container (VC-3) is formatted by lower order path termination (LPT). The VC-3 is structured so that its octets are distributed within a 125 us interval (for example, one STM1 period), and consists of the VC-3 container and POH. The latter contains nine octets equally distributed within the frame bytes for VC-3: J1, B3, C2, G1, F2, H4, F3, K3, and N1. HPA HPA generates and processes channel level TU-PTR. In the receive direction, the signals are split into VC-3s, which are located and isolated in TU-3. TU-PTR is processed. In the transmit direction, VC-3s are located precisely and added with TU-PTR. Three TUG-3s are multiplexed into a VC-4 by bytes interleaving. The sequence is: TU-3->TUG3->VC-4. HPT The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are distributed within a 125 us interval (for example, one STM1 period), and consists of the C4 container and POH.
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l l

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MST and RST The functions are necessary to create a proprietary STM1 signal in order to connect the interface conversion module.

Interface conversion module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals (LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane interface connects to low-rate interface chip of the transmitting system.

Communication and control module

l l l l l

Manages and configures other modules of the boards. Performs inter-board communication through internal Ethernet interface. Traces the clock signal from the active and the standby cross-connect units. Selects the clock and frame header from the active or the standby cross-connect units. Controls the indicator on the board.

DC/DC converter module

Through the DC/ DC converting module, different direct currents are provided to each chip on the board. Two direct currents are provided: +1.8 V and +3.3 V. In addition, protection for +3.3 V power are provided to the board.

6.6.4 Front Panel

On the front panel of the PL3A, there are indicators and interfaces.

Appearance of the Front Panel

Figure 6-27 shows the appearance of the front panel of the PL3A.

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Figure 6-27 Front panel of the PL3A

PL3A
STAT ACT PROG SRV

OUT1 IN1 OUT2 IN2 OUT3 IN3

PL3A

Indicators
The following indicators are present on the front panel of the board:
l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are three pairs of 75-ohm unbalanced interfaces, which are of the SMB type.

6.6.5 Valid Slots

The PL3A can be housed in different slots in the OptiX OSN 1500A and OptiX OSN 1500B subracks The PL3A can be housed in any of slots 1213 in the OptiX OSN 1500A subrack.
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The PL3A can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

6.6.6 Board Configuration Reference

You can use the T2000 to set parameters for the PL3A. You can use the T2000 to set the following parameters for the PL3A:
l l l l l

J1 byte C2 byte Tributary loopback Service loading indication Path service type

For details on these parameters, see F Board Configuration Reference.

6.6.7 Technical Specifications

The technical specifications of the PL3A cover the electrical interface specifications, board dimensions, weight and power consumption.

Electrical Interface Specifications

Table 6-26 lists the specifications of the electrical interfaces of the PL3A. Table 6-26 Specifications of the electrical interfaces of the PL3A Interface Type Code Output Signal Bit Rate Allowed Input Frequency Deviation Allowed Input Attenuatio n Input Jitter Tolerance

34368 kbit/s 44736 kbit/s

HDB3 B3ZS

Compliant with ITU-T G.703 Compliant with ITU-T G.703

Mechanical Specifications
The mechanical specifications of the PL3A are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 1.0

Power Consumption
In the normal temperature (25), the maximum power consumption of the N1PL3A is 15 W. In the normal temperature (25), the maximum power consumption of the N2PL3A is 12 W.
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6.7 PD3
This section describes the PD3, a 6 x E3/T3 processing board, in terms of the version, function, principle, front panel, configuration and specifications. 6.7.1 Version Description The PD3 board has two functional versions, N1 and N2. The difference between the two versions lies in the support for the E13/M13 function. 6.7.2 Function and Feature The PD3 can be used to process E3/T3 signals and the overhead, to report alarms and performance events, to provide the maintenance feature and the TPS protection. 6.7.3 Working Principle and Signal Flow The PD3 consists of the PPI, E3/T3 mapping/demapping, interface conversion module, communication and control module and so on. 6.7.4 Front Panel On the front panel of the PD3, there are indicators. 6.7.5 Valid Slots The OptiX OSN 1500A does not support the PD3 board. 6.7.6 TPS Protection for the Board The PD3 supports the 1:N TPS protection. 6.7.7 Board Configuration Reference You can use the T2000 to set parameters for the PD3. 6.7.8 Technical Specifications The technical specifications of the PD3 cover the electrical interface specifications, board dimensions, weight and power consumption.

6.7.1 Version Description

The PD3 board has two functional versions, N1 and N2. The difference between the two versions lies in the support for the E13/M13 function. Table 6-27 lists the details on the versions of the PD3 board. Table 6-27 Version Description of the PD3 Item Functional version Difference Description The PD3 has two functional versions, N1 and N2. The N1PD3 does not support the E13/M13 function. The N2PD3 supports the E13/M13 function. The N2PD3 supports the board version replacement function and can replace the N1PD3. After the N1PD3 is replaced, the N2PD3 is consistent with the N1PD3 in configuration and service status. Replaceability
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The N2PD3 can fully replace the N1PD3.

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6.7.2 Function and Feature

The PD3 can be used to process E3/T3 signals and the overhead, to report alarms and performance events, to provide the maintenance feature and the TPS protection. Table 6-28 lists the functions and features of the PD3. Table 6-28 Functions and features of the PD3 Function and Feature Basic function Service processing PD3 Processes 6 x E3/T3 signals. Accesses and processes 6 x E3/T3 electrical signals. The N2PD3 supports the E13 function, which is used to converge E1 services into E3 services. The N2PD3 supports the M13 function, which is used to converge T1 services into T3 services. Overhead processing Alarm and performance event Maintenance feature Supports the setting and query of all path overhead bytes at the VC-3 level. Provides rich alarms and performance events for easy management and maintenance of the equipment. Supports inloop and outloop for electrical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services. Supports the PRBS function. Protection scheme Supports the TPS protection when used with the interface and switching boards.

6.7.3 Working Principle and Signal Flow

The PD3 consists of the PPI, E3/T3 mapping/demapping, interface conversion module, communication and control module and so on. Figure 6-28 shows the block diagram for the functions of the PD3.

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Figure 6-28 Block diagram for the functions of the PD3

34 MHz/ 45 MHz OSC 155 MHz PLL
Reference clock Cross-connect unit

E3/T3

LIU P P I LIU

6 x 34 Mbit/s/ 6 x 45 Mbit/s

2 x 155 Mbit/s

High speed bus

E3/T3

6 x 34 Mbit/s/ 6 x 45 Mbit/s

E3/T3 mapping/ demapping

2 x 155 Mbit/s

Interface coversion module

Cross-connect unit A

High speed bus

Cross-connect unit B

LOS Outloop/Inloop control

Communication and control module

+3.3 V

Frame header Communication

Cross-connect unit SCC Unit

+1.8 V

DC/DC converter

DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse +3.3 V backup power

OSC: Oscillator

PPI: PDH physical interface

Figure 6-29 shows the block diagram of the E3/T3 mapping/demapping. Figure 6-29 Block diagram of the E3/T3 mapping/demapping
E3/T3 mapping/demapping

E3/T3

LPA

LPT

HPA

HPT

STM-1

LPOH(J1/C2/B3) insertion PDH AIS Detector LPOH(J1/C2/B3) extraction TU-AIS/TU-LOP Detector

E3/T3

STM-1

LPA

LPT

HPA

HPT

LPA: Low order Path Adaptation HPA: High order Path Adaptation

LPT: Low order Path Termination HPT: High order Path Termination

The function modules are described as follows.

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PPI
l

The PPI module mainly consists of line interface units (LIUs). It provides inloop and outloop function. This module: Encodes and decodes signals. Recovers data and clock. Processes the A_LOS alarm.

l l l

E3/T3 mapping/demapping
l l

LPA The 45 Mbit/s (34 Mbit/s) plesiochronous stream is inserted in a C3 container to be adapted so as to be transported into the synchronous network. LPT The virtual container (VC-3) is formatted by lower order path termination (LPT). The VC-3 is structured so that its octets are distributed within a 125 us interval (for example, one STM1 period), and consists of the VC-3 container and POH. The latter contains nine octets equally distributed within the frame bytes for VC-3: J1, B3, C2, G1, F2, H4, F3, K3, and N1. HPA HPA generates and processes channel level TU-PTR. In the receive direction, the signals are split into VC-3s, which are located and isolated in TU-3. TU-PTR is processed. In the transmit direction, VC-3s are located precisely and added with TU-PTR. Three TUG-3s are multiplexed into a VC-4 by bytes interleaving. The sequence is: TU-3->TUG3->VC-4. HPT The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are distributed within a 125 us interval (for example, one STM1 period), and consists of the C4 container and POH. MST and RST The functions are necessary to create a proprietary STM1 signal in order to connect the interface conversion module.

l l l

l l

l l

l l

Interface converting module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals (LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane interface connects to low-rate interface chip of the transmitting system.

Communication and control module

l l l l l

Manages and configures other modules of the boards. Performs inter-board communication through internal Ethernet interface. Traces the clock signal from the active and the standby cross-connect units. Selects the clock and frame header from the active or the standby cross-connect units. Controls the indicator on the board.
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DC/DC converter module

Through the DC/ DC converting module, different direct currents are provided to each chip on the board. Two direct currents are provided: +1.8 V and +3.3 V. In addition, protection for +3.3 V power are provided to the board.

6.7.4 Front Panel

On the front panel of the PD3, there are indicators.

Appearance of the Front Panel

Figure 6-30 shows the appearance of the front panel of the PD3. Figure 6-30 Front panel of the PD3
PD3
STAT ACT PROG SRV

PD3

Indicators
The following indicators are present on the front panel of the board:
l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.
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Interfaces
No interfaces are present on the front panel of the PD3. The D34S, an electrical interface switching board, provides the E3/T3 interfaces for the PD3. For details, see the section that describes the D34S.

6.7.5 Valid Slots

The OptiX OSN 1500A does not support the PD3 board. In the OptiX OSN 1500B subrack, the PD3 can be housed in any of slots 1213, and must be used with the D34S. Table 6-29 lists the valid slots for the PD3 and corresponding slots for the D34S. Table 6-29 Valid slots for the PD3 and corresponding slots for the D34S in the OptiX OSN 1500B subrack Valid Slot for the PD3 Slot 12 Slot 13 Corresponding Slot for the D34S Slot 14 Slot 16

6.7.6 TPS Protection for the Board

The PD3 supports the 1:N TPS protection.

Protection Principle
For the OptiX OSN 1500B, when used with the D34S and TSB8, the PD3 can be configured into one 1:1 TPS protection group. Figure 6-31 shows the principle of the TPS protection for the PD3. Figure 6-31 Principle of the TPS protection for the PD3 in the OptiX OSN 1500B subrack
6 xE3/T3

TSB8

D34S

Switch control signal

Crossconnect and timing board

SLOT 4/5
Protection

Working
PD3
Fail

PD3

SLOT12

SLOT13

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Normal state When the working boards are running normally, the control switch of the D34S is in position 1 and services are directly accessed to the PD3 board.

Switching state When the working board detects a fault and requires a switching, the control switch of the D34S is shifted to position 2 and the control switch of the TSB8 is shifted to a corresponding position. In this way, the protection board protects the faulty working board.

Hardware Configuration
Table 6-30 lists the slot configuration for the TPS protection for the PD3 in the OptiX OSN 1500B subrack. Table 6-30 Slot configuration for the 1:1 TPS protection for the PD3 in the OptiX OSN 1500B subrack Working Board PD3 (E3) PD3 (T3) Protection Board PD3 (E3) PD3 (T3) Slot Figure 6-32 shows the slot configuration for the 1:1TPS protection for the PD3

Figure 6-32 Slot configuration for the 1:1 TPS protection for the PD3 in the OptiX OSN 1500B subrack
Slot 14 Slot 15 Slot 16 Slot 17 Slot 11 Slot 20 FAN Slot 12 Slot 13 Slot 4 Slot 5 Protection Working CXL16/4/1 CXL16/4/1 D34S TSB8 Slot 18 PIU

Slot 19 Slot 6 Slot 7 Slot 8 Slot 9 Slot 10

PIU

EOW AUX

As shown in Figure 6-32, the protection board housed in slot 12 protects the board housed in slot 13. Table 6-31 lists the slots for the PD3, D34S and TSB8. Table 6-31 Slots for the PD3, D34S and TSB8 in the OptiX OSN 1500B subrack Board PD3 (working) PD3 (protection) TSB8
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Protection Group Slot 13 Slot 12 Slot 14

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Board D34S

Protection Group Slot 16

6.7.7 Board Configuration Reference

You can use the T2000 to set parameters for the PD3. You can use the T2000 to set the following parameters for the PD3:
l l l l l

J1 byte C2 byte Tributary loopback Service loading indication Path service type

For details on these parameters, see F Board Configuration Reference.

6.7.8 Technical Specifications

The technical specifications of the PD3 cover the electrical interface specifications, board dimensions, weight and power consumption.

Electrical Interface Specifications

The D34S provides electrical interfaces for the PD3. For the specifications of the electrical interfaces, see the section that describes the D34S.

Mechanical Specifications
The mechanical specifications of the PD3 are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 1.1

Power Consumption
In the normal temperature (25), the maximum power consumption of the N1PD3 is 19 W. In the normal temperature (25), the maximum power consumption of the N2PD3 is 12 W.

6.8 PQ3
This section describes the PQ3, a 12 x E3/T3 processing board, in terms of the version, function, principle, front panel, configuration and specifications. 6.8.1 Version Description The functional version of the PQ3 board is N2. 6.8.2 Function and Feature
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The PQ3 can be used to process E3/T3 signals and the overhead, to report alarms and performance events, to provide the maintenance feature and the TPS protection. 6.8.3 Working Principle and Signal Flow The PQ3 consists the PPI, E3/T3 mapping/demapping, interface conversion module, communication and control module and so on. 6.8.4 Front Panel On the front panel of the PQ3, there are indicators. 6.8.5 Valid Slots The OptiX OSN 1500A does not support the PQ3 board. 6.8.6 TPS Protection for the Board The PQ3 supports the 1:N TPS protection. 6.8.7 Board Configuration Reference You can use the T2000 to set parameters for the PQ3. 6.8.8 Technical Specifications The technical specifications of the PQ3 cover the electrical interface specifications, board dimensions, weight and power consumption.

6.8.1 Version Description

The functional version of the PQ3 board is N2.

6.8.2 Function and Feature

The PQ3 can be used to process E3/T3 signals and the overhead, to report alarms and performance events, to provide the maintenance feature and the TPS protection. Table 6-32 lists the functions and features of the PQ3. Table 6-32 Functions and features of the PQ3 Function and Feature Basic function Service processing PQ3 Processes 12 x E3/T3 signals. Accesses and processes 12 x E3/T3 electrical signals. Supports the E13 function, which is used to converge E1 services into E3 services. Supports the M13 function, which is used to converge T1 services into T3 services. Overhead processing Alarm and performance event Supports the setting and query of all path overhead bytes at the VC-3 level. Provides rich alarms and performance events for easy management and maintenance of the equipment.

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Function and Feature Maintenance feature

PQ3 Supports inloop and outloop for electrical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services. Supports the PRBS function.

Protection scheme

Supports the TPS protection when used with the interface board and the switching board.

6.8.3 Working Principle and Signal Flow

The PQ3 consists the PPI, E3/T3 mapping/demapping, interface conversion module, communication and control module and so on. Figure 6-33 shows the block diagram for the functions of the PQ3. Figure 6-33 Block diagram for the functions of the PQ3
34 MHz/ 45 MHz OSC 155 MHz PLL
Reference clock Cross-connect unit

E3/T3

LIU P P I LIU

6 x 34 Mbit/s/ 6 x 45 Mbit/s

2 x 155 Mbit/s

High speed bus

E3/T3

6 x 34 Mbit/s/ 6 x 45 Mbit/s

E3/T3 mapping/ demapping

2 x 155 Mbit/s

Interface coversion module

Cross-connect unit A

High speed bus

Cross-connect unit B

LOS Outloop/Inloop control

Communication and control module

+3.3 V

Frame header Communication

Cross-connect unit SCC Unit

+1.8 V

DC/DC converter

DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse +3.3 V backup power

OSC: Oscillator

PPI: PDH physical interface

Figure 6-34 shows the block diagram of the E3/T3 mapping/demapping.

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Figure 6-34 Block diagram of the E3/T3 mapping/demapping

E3/T3 mapping/demapping

E3/T3

LPA

LPT

HPA

HPT

STM-1

LPOH(J1/C2/B3) insertion PDH AIS Detector LPOH(J1/C2/B3) extraction TU-AIS/TU-LOP Detector

E3/T3

STM-1

LPA

LPT

HPA

HPT

LPA: Low order Path Adaptation HPA: High order Path Adaptation

LPT: Low order Path Termination HPT: High order Path Termination

The function modules are described as follows.

PPI
l

The PPI module mainly consists of line interface units (LIUs). It provides inloop and outloop function. This module: Encodes and decodes signals. Recovers data and clock. Processes the A_LOS alarm.

l l l

E3/T3 mapping/demapping
l l

LPA The 45 Mbit/s (34 Mbit/s) plesiochronous stream is inserted in a C3 container to be adapted so as to be transported into the synchronous network. LPT The virtual container (VC-3) is formatted by lower order path termination (LPT). The VC-3 is structured so that its octets are distributed within a 125 us interval (for example, one STM1 period), and consists of the VC-3 container and POH. The latter contains nine octets equally distributed within the frame bytes for VC-3: J1, B3, C2, G1, F2, H4, F3, K3, and N1. HPA HPA generates and processes channel level TU-PTR. In the receive direction, the signals are split into VC-3s, which are located and isolated in TU-3. TU-PTR is processed. In the transmit direction, VC-3s are located precisely and added with TU-PTR. Three TUG-3s are multiplexed into a VC-4 by bytes interleaving. The sequence is: TU-3->TUG3->VC-4. HPT The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are distributed within a 125 us interval (for example, one STM1 period), and consists of the C4 container and POH.
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MST and RST The functions are necessary to create a proprietary STM1 signal in order to connect the interface conversion module.

Interface conversion module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals (LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane interface connects to low-rate interface chip of the transmitting system.

Communication and control module

l l l l l

Manages and configures other modules of the boards. Performs inter-board communication through internal Ethernet interface. Traces the clock signal from the active and the standby cross-connect units. Selects the clock and frame header from the active or the standby cross-connect units. Controls the indicator on the board.

DC/DC converter module

Through the DC/ DC converting module, different direct currents are provided to each chip on the board. Two direct currents are provided: +1.8 V and +3.3 V. In addition, protection for +3.3 V power are provided to the board.

6.8.4 Front Panel

On the front panel of the PQ3, there are indicators.

Appearance of the Front Panel

Figure 6-35 shows the appearance of the front panel of the PQ3.

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Figure 6-35 Front panel of the PQ3

PQ3
STAT ACT PROG SRV

PQ3

Indicators
The following indicators are present on the front panel of the board:
l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are no interfaces on the front panel of the PQ3. The D34S, an electrical interface switching board, provides the E3/T3 interfaces for the PQ3. For details, see the section that describes the D34S.

6.8.5 Valid Slots

The OptiX OSN 1500A does not support the PQ3 board. In the OptiX OSN 1500B subrack, the PQ3 can be housed in any of slots 1213, and must be used with the D34S. Table 6-33 lists the valid slots for the PQ3 and corresponding slots for the D34S.
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Table 6-33 Valid slots for the PQ3 and corresponding slots for the D34S in the OptiX OSN 1500B subrack Valid Slot for the PQ1 Slot 12 Slot 13 Corresponding Slot for the D34S Slots 14 and 15 Slots 16 and 17

6.8.6 TPS Protection for the Board

The PQ3 supports the 1:N TPS protection.

Protection Principle
In the OptiX OSN 1500B, used with the D34S and TSB8, the PQ3 can be configured into one 1:1 TPS protection group. Figure 6-36 shows the principle of the TPS protection for the PQ3. Figure 6-36 Principle of the TPS protection for the PQ3 in the OptiX OSN 1500B subrack
6 xE3/T3 6 xE3/T3

TSB8

TSB8

D34S

D34S

Switch control signal

Crossconnect and timing board

Protection

Working PQ3
Fail

SLOT 4/5

PQ3

SLOT12

SLOT13

Normal state When the working boards are running normally, the control switch of the D34S is in position 1 and services are directly accessed to the PQ3 board.

Switching state When the working board detects a fault and requires a switching, the control switch of the D34S is shifted to position 2 and the control switch of the TSB8 is shifted to a corresponding position. In this way, the protection board protects the faulty working board.

Hardware Configuration
NOTE

Two TSB8 boards are required to configure the TPS protection for the N2PQ3.

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Table 6-34 lists the slot configuration for the TPS protection for the PQ3 in the OptiX OSN 1500B subrack. Table 6-34 Slot configuration for the 1:1 TPS protection for the PQ3 in the OptiX OSN 1500B subrack Working Board PQ3 (E3) PQ3 (T3) Protection Board PQ3 (E3) PQ3 (T3) Slot Figure 6-37 shows the slot configuration for the 1:3 TPS protection for the PQ3.

Figure 6-37 Slot configuration for the 1:1 TPS protection for the PQ3 in the OptiX OSN 1500B subrack
Slot 14 Slot 15 Slot 16 Slot 17 Slot 11 Slot 20 FAN Slot 12 Slot 13 Slot 4 Slot 5 Protection Working CXL16/4/1 CXL16/4/1 TSB8 TSB8 D34S D34S Slot 18 PIU

Slot 19 Slot 6 Slot 7 Slot 8 Slot 9 Slot 10

PIU

EOW AUX

As shown in Figure 6-37, the protection board housed in slot 12 protects the board housed in slot 13. Table 6-35 lists the slots for the PQ3, D34S and TSB8. Table 6-35 Slots for the PQ3, D34S and TSB8 in the OptiX OSN 1500B subrack Board PQ3 (working) PQ3 (protection) TSB8 D34S Protection Group Slot 13 Slot 12 Slots 1415 Slots 1617

6.8.7 Board Configuration Reference

You can use the T2000 to set parameters for the PQ3. You can use the T2000 to set the following parameters for the PQ3:
l

J1 byte
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l l l l

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C2 byte Tributary loopback Service loading indication Path service type

For details on these parameters, see F Board Configuration Reference.

6.8.8 Technical Specifications

The technical specifications of the PQ3 cover the electrical interface specifications, board dimensions, weight and power consumption.

Electrical Interface Specifications

The D34S provides electrical interfaces for the PQ3. For the specifications of the electrical interfaces, see the section that describes the D34S.

Mechanical Specifications
The mechanical specifications of the PL1 are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 1.1

Power Consumption
In the normal temperature (25), the maximum power consumption of the PQ3 is 13 W.

6.9 DX1
This section describes the DX1, a DDN interface convergence board, in terms of the version, function, principle, front panel, configuration and specifications. 6.9.1 Version Description The functional version of the DX1 board is N1. 6.9.2 Function and Feature The DX1, a DDN interface convergence board, cross-connects 48 x E1 signals at the 64k level at the system side. 6.9.3 Working Principle and Signal Flow The DX1 consists of the interface and frame processing module, encoding/decoding module, timeslot cross-connect module, framing/deframing module and so on. 6.9.4 Front Panel On the front panel of the DX1, there are indicators. 6.9.5 Valid Slots The OptiX OSN 1500A does not support the DX1 board. 6.9.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the DX1 indicates the interface impedance type.
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6.9.7 TPS Protection for the Board The DX1 supports the 1:N TPS protection. 6.9.8 Board Configuration Reference You can use the T2000 to set parameters for the DX1. 6.9.9 Technical Specifications The technical specifications of the DX1 cover the electrical interface specifications, board dimensions, weight and power consumption.

6.9.1 Version Description

The functional version of the DX1 board is N1.

6.9.2 Function and Feature

The DX1, a DDN interface convergence board, cross-connects 48 x E1 signals at the 64k level at the system side. Table 6-36 lists the functions and features of the DX1. Table 6-36 Functions and features of the DX1 Function and Feature Basic function Used with the interface board Alarm and performance event Connector DX1

Processes eight channels of N x 64 kbit/s services and 8 x framed E1 services. Cross-connects 48 channels of N x 64 kbit/s signals at the system side. Accesses eight channels of N x 64 kbit/s and 8 x framed E1 services and realizes the 1:N TPS protection when used with the DM12. One DX1 board should be used with two DM12 boards. Provides rich alarms and performance events for easy management and maintenance of the equipment. The connectors of the DB28 and DB44 are present on the front panel of the DM12. The DB28 is for the N x 64 kbit/s signals, and the DB44 is for the framed E1 signals. Supports inloop and outloop. Supported.

Loopback function PRBS selftest

6.9.3 Working Principle and Signal Flow

The DX1 consists of the interface and frame processing module, encoding/decoding module, timeslot cross-connect module, framing/deframing module and so on. Figure 6-38 shows the block diagram for the functions of the DX1.
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Figure 6-38 Block diagram for the functions of the DX1

Backplane Backplane DX1 Frame E1 encoding/decoding and frame processing module Nx64k bit/s interface and frame processing module

8X Frame E1

DM12 Frame E1 interface module N x 64 kbit/s interface module Power DM12

8X Nx64 kbit/s

64kbit/s Timeslot crossconnect module

Framing/ deframing module

mapping/ demapping module

Crossconnect unit

8X Nx64 kbit/s

N x 64 kbit/s interface module Power Frame E1 interface module

Communication and control module

+3.3 V

SCC unit

DC/DC converter

DC/DC converter

Fuse

-48 V/-60 V -48 V/-60 V +3.3 V backup power

Fuse

In the transmit direction

The SDH cross-connect board transmits the VC-4 signals to the mapping/demapping module, which recovers the signals. The framing/deframing module converts the signals to framed E1 signals and transmits the signals to the timeslot cross-connect module. The timeslot crossconnect module cross-connects and grooms the signals in the 64 kbit/s granularities, and transmits the services that are dropped at the NE to the interface module.

In the receive direction

The DX1 accesses 8 x framed E1 signals from the framed E1 interface module and eight channels of N x 64 kbit/s services from the N x 64 kbit/s interface module of the DM12. In addition, the DX1 recovers the clock and data signals. The DX1 decodes the framed E1 signals and processes the frames. The DX1 also converts the N x 64 kbit/s signals, processes the frames. The DX1 then transmits the signals to the 64 kbit/s cross-connect module. The timeslot cross-connect module cross-connects and grooms the signals in the 64 kbit/s granularities. The timeslot cross-connect module then transmits the signals to the framing/deframing module. The framing/deframing module then maps the signals into the VC-4 and transmits the signals into the SDH cross-connect board.

Control and communication module

The control and communication module performs the board communication, control and service configuration.

DC/DC converter module

The DC/DC converter module provides the DC voltages required by the modules of the board.
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6.9.4 Front Panel

On the front panel of the DX1, there are indicators.

Appearance of the Front Panel

Figure 6-39 shows the appearance of the front panel of the DX1. Figure 6-39 Front panel of the DX1

DX1
STAT ACT PROG SRV

DX1

Indicators
The following indicators are present on the front panel of the board:
l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

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Interfaces
There are no interfaces on the front panel of the DX1. When used with the DM12, the DX1 can input and output the framed E1 and N x 64 kbit/s signals. For details, see the section that describes the DM12.

6.9.5 Valid Slots

The OptiX OSN 1500A does not support the DX1 board. In the OptiX OSN 1500B subrack, the DX1 can be housed in any of slots 1113, and must be used with the DM12. Table 6-37 lists the valid slots for the DX1 and corresponding slots for the DM12. Table 6-37 Valid slots for the DX1 and corresponding slots for the DM12 in the OptiX OSN 1500B subrack Valid Slot for the DX1 Slot 12 Slot 13 Corresponding Slot for the DM12 Slots 14 and 15 Slots 16 and 17

NOTE

l l

Slot 11 can house a protection board of the TPS protection. The board housed in slot 11 protects the boards housed in slots 12 and 13. One DX1 should be used with two DM12 to access eight channels of N x 64 kbit/s signals. The DM12 board housed in the slot with a smaller slot number is used to access 8 x framed E1 and four channels of N x 64 kbit/s signals. The DM12 board housed in the slot with a larger slot number is used to access four channels of N x 64 kbit/s signals.

6.9.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code of the DX1 indicates the interface impedance type. Table 6-38 lists the relation between the board feature code and interface impedance type for the DX1. Table 6-38 Relation between the board feature code and the interface impedance type Board Barcode SSN1DX1A01 SSN1DX1B01 Feature Code A01 B01 Interface Impedance Type 75 ohms 120 ohms

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6.9.7 TPS Protection for the Board

The DX1 supports the 1:N TPS protection.

Protection Principle
In the OptiX OSN 1500B, used with the DM12, the DX1 can be configured into one 1:N (N 2) TPS protection group. Figure 6-40 shows the principle of the TPS protection for the DX1. Figure 6-40 Principle of the TPS protection for the DX1 in the OptiX OSN 1500B subrack

S S L L protection bus O O T T 14 15

S L O T 16

S L O T 17

DM12 DM12

DM12 DM12
S L O T 12

service bus
S L O T 11 S L O T 13

Fail

Cross-connect and timing board

When detecting a fault in the working DX1 board, the cross-connect board issues a command to switch the services from the faulty DX1 to the protection DX1. In this way, services are protected.

Hardware Configuration
Figure 6-41 shows the slot configuration for the 1:2 TPS protection for the DX1 in the OptiX OSN 1500B subrack.

Protection

Working

Detect board fault

Working
TPS switching control bus

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Figure 6-41 Slot configuration for the 1:2 TPS protection for the DX1 in the OptiX OSN 1500B subrack
Slot 14 Slot 15 Slot 16 Slot 17 Slot 11 Slot 20 FAN Slot 12 Slot 13 Slot Slot 4 5 DM12 DM12 DM12 DM12 Slot 18 Slot 19 Slot 6 Slot 7 Slot 8 Slot 9 Slot 10 EOW AUX PIU PIU

Protection Working Working

CXL16/4/1 CXL16/4/1

As shown in Figure 6-41, the protection board housed in slot 11 protects the boards housed in slots 1213. Table 6-39 lists the slots for the DX1 and DM12 in the OptiX OSN 1500B subrack. Table 6-39 Slots for the DX1 and DM12 in the OptiX OSN 1500B subrack Board DX1 (working) DX1 (protection) DM12 Protection Group Slots 12 and 13 Slot 11 Slots 1417

6.9.8 Board Configuration Reference

You can use the T2000 to set parameters for the DX1. You can use the T2000 to set the following parameters for the DX1:
l l l l l

J2 byte Tributary loopback Service loading indication Protocol mode of serial ports DDN clock source management

For details on these parameters, see F Board Configuration Reference.

6.9.9 Technical Specifications

The technical specifications of the DX1 cover the electrical interface specifications, board dimensions, weight and power consumption.
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Electrical Interface Specifications

The DM12 provides electrical interfaces for the DX1. For the specifications of the electrical interfaces, see the section that describes the DM12.

Mechanical Specifications
The mechanical specifications of the DX1 are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 1.0

Power Consumption
In the normal temperature (25), the maximum power consumption of the DX1 is 15 W.
NOTE

After the TPS protection is performed, the power consumption of the DX1 is 31 W.

6.10 DXA
This section describes the DXA, a DDN convergence board, in terms of the version, function, principle, front panel, configuration and specifications. 6.10.1 Version Description The functional version of the DXA board is N1. 6.10.2 Function and Feature The DXA, a DDN interface convergence board, cross-connects 63 x E1 signals at the 64k level at the system side. 6.10.3 Working Principle and Signal Flow The DXA consists of the timeslot cross-connect module, framing/deframing module, mapping/ demapping module, control and communication module and power supply module. 6.10.4 Front Panel On the front panel of the DXA, there are indicators. 6.10.5 Valid Slots The DXA can be housed in different slots in the OptiX OSN 1500A and OptiX OSN 1500B subracks. 6.10.6 Board Configuration Reference You can use the T2000 to set parameters for the DXA. 6.10.7 Technical Specifications The technical specifications of the DXA cover the optical interface specifications, board dimensions, weight and power consumption.

6.10.1 Version Description

The functional version of the DXA board is N1.
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6.10.2 Function and Feature

The DXA, a DDN interface convergence board, cross-connects 63 x E1 signals at the 64k level at the system side. Table 6-40 lists the functions and features of the DXA. Table 6-40 Functions and features of the DXA Function and Feature Basic function Alarm and performance event Loopback function PRBS self-test DXA Cross-connects 63 x framed E1 signals. Provides rich alarms and performance events for easy management and maintenance of the equipment. Supports inloop and outloop. Not supported.

6.10.3 Working Principle and Signal Flow

The DXA consists of the timeslot cross-connect module, framing/deframing module, mapping/ demapping module, control and communication module and power supply module. Figure 6-42 shows the block diagram for the functions of the DXA. Figure 6-42 Block diagram for the functions of the DXA
Backplane

64 kbit/s timeslot crossconnect module

Framing/ deframing module

Mapping/ demapping module

Crossconnect unit

Control and communication module +3.3 V DC/DC converter Fuse

Crossconnect unit

DC/DC converter

-48 V/-60 V -48 V/-60 V

Fuse

+3.3 V Backup Power

In the transmit direction

The SDH cross-connect board transmits the VC-4 signals to the mapping/demapping module, which recovers the signals. The framing/deframing module converts the signals to framed E1
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signals and transmits the signals to the timeslot cross-connect module. The timeslot crossconnect module cross-connects and grooms the signals in the 64 kbit/s granularities.

In the receive direction

The timeslot cross-connect module cross-connects and grooms the signals in the 64 kbit/s granularities. The timeslot cross-connect module then transmits the signals to the framing/ deframing module. The framing/deframing module then maps the signals into the VC-4 and transmits the signals into the SDH cross-connect board.

Control and communication module

The control and communication module performs the board communication, control and service configuration.

DC/DC converter module

The DC/DC converter module provides the DC voltages required by the modules of the board.

6.10.4 Front Panel

On the front panel of the DXA, there are indicators.

Appearance of the Front Panel

Figure 6-43 shows the appearance of the front panel of the DXA.

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Figure 6-43 Front panel of the DXA

DXA
STAT ACT PROG SRV

DXA

Indicators
The following indicators are present on the front panel of the board:
l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are no interfaces on the front panel of the DXA.

6.10.5 Valid Slots

The DXA can be housed in different slots in the OptiX OSN 1500A and OptiX OSN 1500B subracks. The DXA can be housed in any of slots 1213 in the OptiX OSN 1500A subrack.
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The DXA can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

6.10.6 Board Configuration Reference

You can use the T2000 to set parameters for the DXA. You can use the T2000 to set the following parameters for the DXA:
l l l l l

J2 byte Tributary loopback Service loading indication Protocol mode of serial ports DDN clock source management

For details on these parameters, see F Board Configuration Reference.

6.10.7 Technical Specifications

The technical specifications of the DXA cover the optical interface specifications, board dimensions, weight and power consumption.

Mechanical Specifications
The mechanical specifications of the DXA are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 0.8

Power Consumption
In the normal temperature (25), the maximum power consumption of the DXA is 10 W.

6.11 SPQ4
This section describes the SPQ4, a 4 x E1/STM-1 processing board, in terms of the version, function, working principle, front panel and specifications. 6.11.1 Version Description The SPQ4 has two versions, N1 and N2. The two versions have different functions. 6.11.2 Function and Feature The SPQ4 is used to process 4 x E4/STM-1 electrical signals and the overhead, to report alarms and performance events, and to provide the maintenance features and protection. 6.11.3 Working Principle and Signal Flow The SPQ4 consists of the interface module, encoding/decoding module, frame synchronization and scramble processing module, mapping/demapping module, SDH overhead processing module, logic control module, and power supply module. 6.11.4 Front Panel On the front panel of the SPQ4, there are indicators. 6.11.5 Valid Slots
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The OptiX OSN 1500A does not support the SPQ4 board. 6.11.6 TPS Protection for the Board The SPQ4 supports the 1:N TPS protection. 6.11.7 Board Configuration Reference You can use the T2000 to set parameters for the SPQ4. 6.11.8 Technical Specifications The technical specifications of the SPQ4 cover the electrical interface specifications, board dimensions, weight and power consumption.

6.11.1 Version Description

The SPQ4 has two versions, N1 and N2. The two versions have different functions. Table 6-41 lists the details on the versions of the SPQ4 board. Table 6-41 Version Description of the SPQ4 Item Functional version Difference Description The SPQ4 has two versions, N1 and N2. The equipment of the V100R001 and V100R002 versions support the N1SPQ4. The equipment of the V100R003 and later versions support the N2SPQ2. The N1SPQ4 can be replaced by the N2SPQ4. When the N1SPQ4 is replaced, the NE should be upgraded.

Replaceability

6.11.2 Function and Feature

The SPQ4 is used to process 4 x E4/STM-1 electrical signals and the overhead, to report alarms and performance events, and to provide the maintenance features and protection. Table 6-42 lists the functions and features of the SPQ4. Table 6-42 Functions and features of the SPQ4 Function and Feature Basic function Service processing SPQ4 Processes 4 x STM-1/E4 signals. Accesses and processes 4 x E4/STM-1 electrical signals. For each channel, the E4 and STM-1 signals are compatible. Supports the processing of the VC-12, VC-3 and VC-4 services.

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Function and Feature Overhead processing

SPQ4 Supports the processing of SOH bytes for the STM-1 signals, such as B1, B2, K1, K2, M1, F1, and D1D12. Supports the transparent transmission and termination of POH bytes, including J1, B3, C2, G1, and H4. Supports the setting and query of the J0/J1/C2 bytes.

Alarm and performance event Protection scheme

Provides rich alarms and performance events for easy management and maintenance of the equipment. Supports the TPS protection when used with the interface board and the switching board. Supports the two-fiber unidirectional MSP protection ring, linear MSP protection, and SNCP.

Maintenance feature

Supports inloop and outloop for optical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services.

6.11.3 Working Principle and Signal Flow

The SPQ4 consists of the interface module, encoding/decoding module, frame synchronization and scramble processing module, mapping/demapping module, SDH overhead processing module, logic control module, and power supply module. Figure 6-44 shows the block diagram for the functions of the SPQ4.Figure 6-45 shows the block diagram of the 140M mapping/ demapping. Figure 6-46 shows the block diagram of the SDH overhead processing module.

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Figure 6-44 Block diagram for the functions of the SPQ4

34 MHz OSC 155 MHz PLL
Reference clock Crossconnect unit

4x139 Mbit/s E4/STM-1

140M mapping/demapping

4x155 Mbit/s

High speed bus

LIU

LIU

P P I/ S P I

Cross-connect unit A

4x155 Mbit/s

Interface conversion module SDH overhead processing module

4x155 Mbit/s High speed bus Cross-connect unit B

DCC K1 and K2

SCC unit Cross-connect unit Frame header Communication

EN 140M/155M LOS Outloop/Inloop control

Communication and control module

+3.3 V

Cross-connect unit SCC unit

5V +1.8V +2.5V

DC/DC converter

DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse

+3.3 V backup power

Figure 6-45 Block diagram of the 140M mapping/demapping

140M mapping/demapping
139Mbit/s 155Mbit/s

LPA

HPT

PG

MST

RST

PDH AIS detector

E4 AIS insertion

J1/C2/B3

E4 AIS insertion

139Mbit/s

155Mbit/s

SIPO

LPA

HPT

MST

RST

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Figure 6-46 Block diagram of the SDH overhead processing module

SDH overhead processing module

K1 and K2 insertion/extration

Crossconnect unit

155 Mbit/s 155 Mbit/s

RST
155 Mbit/s

MST

MSA

HPT
155 Mbit/s

DCC

SCC unit

The principle of the E4/ STM-1 electrical interface units is described below.

PPI/SPI
l

The PPI module mainly consists of line interface units (LIUs). It provides inloop and outloop function. This module: Encodes and decodes signals. Recovers data and clock. Processes the PDH LOS signals. The SPI module mainly consists of line interface units (LIUs). It provides inloop and outloop function. This module: Encodes and decodes signals. Recovers data and clock. Processes the R_LOS signals.

l l l l

l l l

SDH Overhead Processing Module and 140M Mapping/Demapping Module SDH Overhead Processing Module (155Mbit/s SDH Signals)
The functions required to manage 155 Mbit/s SDH signals are implemented by the SDH overhead processing module.

RST
l

In the receive direction, RST performs frame alignment detection (A1, A2), regenerator section trace recovery (J0) and mismatch detection, BIP-8 errored block count. In the transmit direction, RST performs frame alignment insertion, regenerator section path trace insertion, BIP-8 calculation and insertion.

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MST
l

In the receive direction, MST performs BIP-24 errored block count, MS_REI recovery, MS_RDI and MS_AIS detection. In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI MS_RDI and MS_AIS insertion. Provides extraction or insertion of K1 byte and K2 byte.

MSA
l

In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS detection, pointer justification. In the transmit direction, MSA performs AUG assembly, AU-4 pointer generation, AU_AIS generation.

HPT
l l l l l l

OH termination J1 path trace message recover REI information recovering HP_RDI detection (path status monitoring UNEQ and AIS detection (signal label monitoring) VC-4 BIP-8 errored block count

140M mapping/demapping (140Mbit/s PDH signals)

The functions required to manage 140 Mbit/s PDH signals are implemented by the 140M mapping/demapping module.

LPA
The 140 Mbit/s plesiochronous stream is inserted in a C4 container to be adapted so as to be transported into the synchronous network. PDH AIS is monitored and E4 AIS in inserted.

HPT
The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are distributed within a 125 us interval (for example, one STM1 period), and consists of the C4 container and POH. The latter contains nine octets equally distributing within the frame. These overhead bytes can be extracted: J1, B3. C2, G1, F2, H4, F3, K3 and N1.E4 AIS can be inserted in downstream direction. PG (Pointer generator) A fixed pointer value is inserted in the SOH to structure the AU4 signal.

MST and RST

These two functions are necessary to create a proprietary STM1 signal in order to connect with interface conversion module. In the receive direction, MST and RST perform frame alignment detection (A1, A2).
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Interface converting module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals (LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane interface connects to low-rate interface chip of the transmitting system.

Communication and control module

l l l l

Manages and configures other modules of the boards. Performs inter-board communication through internal Ethernet interface. Traces the clock signal from the active and the standby cross-connect units. Realizes the pass-through of orderwire and ECC bytes between the two service processing boards constituting the ADM when the GSCC is not online. Selects the clock and frame header from the active or the standby cross-connect units. Control the indicator on the board.

l l

DC/DC converter module

It provides the board with required DC voltages. It converts the 48 V/60 V power supply to the following voltages: +2.5 V, + 3.3 V, + 1.8 V, + 5 V. In addition, protection for +3.3 V power are provided to the board.

6.11.4 Front Panel

On the front panel of the SPQ4, there are indicators.

Appearance of the Front Panel

Figure 6-47 shows the appearance of the front panel of the SPQ4.

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Figure 6-47 Front panel of the SPQ4

SPQ4
STAT ACT PROG SRV

SPQ4

Indicators
The following indicators are present on the front panel of the board:
l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are no interfaces on the front panel of the SPQ4. When used with the MU04, the SPQ4 can input or output the E4/STM-1 signals. For details, see the section that describes the MU04.

6.11.5 Valid Slots

The OptiX OSN 1500A does not support the SPQ4 board. In the OptiX OSN 1500B subrack, the SPQ4 can be housed in any of slots 1213, and must be used with the MU04.
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Table 6-43 lists the valid slots for the SPQ4 and corresponding slots for the MU04. Table 6-43 Valid slots for the SPQ4 and corresponding slots for the MU04 in the OptiX OSN 1500B subrack Valid Slot for the SPQ4 Slot 12 Slot 13 Corresponding Slot for the DMU04 Slot 14 Slot 16

6.11.6 TPS Protection for the Board

The SPQ4 supports the 1:N TPS protection.

Protection Principle
In the OptiX OSN 1500B, used with the MU04 and TSB8, the SPQ4 can be configured into one 1:1 TPS protection group. Figure 6-48 shows the principle of the TPS protection for the SPQ4. Figure 6-48 Principle of the TPS protection for the SPQ4 in the OptiX OSN 1500B subrack
4 E4/STM-1
Switch control signal

TSB8

MU04
1 2

Crossconnect and timing board

SLOT 4/5
Protection

SPQ4

Working SPQ4
Fail

SLOT12

SLOT13

Normal state When the working boards are running normally, the control switch of the MU04 is in position 1 and the MU04 directly accesses the service signals to the SLH1.

Switching state When the working board detects a fault and requires a switching, the control switch of the MU04 is shifted to position 2 and the control switch of the TSB8 is shifted to a corresponding position. In this way, the protection board protects the faulty working board.

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Hardware Configuration
Figure 6-49 shows the slot configuration for the 1:2 TPS protection for the SPQ4 in the OptiX OSN 1500B subrack. Figure 6-49 Slot configuration for the 1:1 TPS protection for the SPQ4
Slot 14 Slot 15 Slot 16 Slot 17 Slot 11 Slot 20 FAN Slot 12 Slot 13 Slot 4 Slot 5 Protection Working CXL16/4/1 CXL16/4/1 MU04 TSB8 Slot 18 PIU

Slot 19 Slot 6 Slot 7 Slot 8 Slot 9 Slot 10

PIU

EOW AUX

As shown in Figure 6-49, the protection board housed in slot 12 protects the board housed in slot 13. Table 6-44 lists the slots for the SPQ4, MU04 and TSB8. Table 6-44 Slots for the SPQ4, MU04 and TSB8 in the OptiX OSN 1500B subrack Board SPQ4 (working) SPQ4 (protection) MU04 TSB8 Protection Group Slot 13 Slot 12 Slot 16 Slot 14

6.11.7 Board Configuration Reference

You can use the T2000 to set parameters for the SPQ4. You can use the T2000 to set the following parameters for the SPQ4:
l l

J1 byte C2 byte

For details on these parameters, see F Board Configuration Reference.

6.11.8 Technical Specifications

The technical specifications of the SPQ4 cover the electrical interface specifications, board dimensions, weight and power consumption.
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Electrical Interface Specifications

The MU04 provides electrical interfaces for the SPQ4. For the specifications of the electrical interfaces, see the section that describes the MU04.

Mechanical Specifications
The mechanical specifications of the SPQ4 are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 0.9

Power Consumption
In the normal temperature (25), the maximum power consumption of the SPQ4 is 24 W.

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7
About This Chapter

Data Processing Boards

This chapter describes the data processing boards for the FE, GE, ATM, and SAN signals. 7.1 EFT4 This section describes the EFT4, a 4 x FE Ethernet transparent transmission board, in terms of the version, function, principle, front panel, configuration and specifications. 7.2 EFT8 This section describes the EFT8, an 8/16 x FE Ethernet transparent transmission board, in terms of the version, function, principle, front panel, configuration and specifications. 7.3 EFT8A This section describes the EFT8A, an 8 x FE Ethernet transparent transmission board, in terms of the version, function, principle, front panel, configuration and specifications. 7.4 EGT2 This section describes the EGT2, a 2 x GE Ethernet transparent transmission board, in terms of the version, function, principle, front panel, configuration and specifications. 7.5 EFS0 This section describes the EFS0, an 8 x FE Ethernet processing board with Lanswitch, in terms of the version, function, principle, front panel, configuration and specifications. 7.6 EFS4 This section describes the EFS4, a 4 x FE Ethernet processing board with Lanswitch, in terms of the version, function, principle, front panel, configuration and specifications. 7.7 EGS2 This section describes the EGS2, a 2 x GE Ethernet processing board with Lanswitch, in terms of the version, function, principle, front panel, configuration and specifications. 7.8 EMS4 This section describes the EMS4, a 4 x GE and 16 x FE Ethernet transparent transmission and convergence board, in terms of the version, function, principle, front panel, configuration and specifications. 7.9 EGS4
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This section describes the EGS4, a 4 x GE Ethernet convergence board, in terms of the version, function, principle, front panel, configuration and specifications. 7.10 EGS4A This section describes the EGS4A, a 4 x GE Ethernet convergence board, in terms of the version, function, principle, front panel, configuration and specifications. 7.11 EGR2 This section describes the EGR2, a 2 x GE Ethernet processing board, in terms of the version, function, principle, front panel, configuration and specifications. 7.12 EMR0 This section describes the EMR0, a 12 x FE and 1 x GE Ethernet ring processing board, in terms of the version, function, principle, front panel, configuration and specifications. 7.13 ADL4 This section describes the ADL4, a 1 x STM-4 ATM processing board, in terms of the version, function, principle, front panel, configuration and specifications. 7.14 ADQ1 This section describes the ADQ1, a 4 x STM-1 ATM processing board, in terms of the version, function, principle, front panel, configuration and specifications. 7.15 IDL4 This section describes the IDL4, a 1 x STM-4 ATM processing board, in terms of the version, function, principle, front panel, configuration and specifications. 7.16 IDQ1 This section describes the IDQ1, a 4 x STM-1 ATM processing board, in terms of the version, function, principle, front panel, configuration and specifications. 7.17 MST4 This section describes the MST4, a 4-channel multi-service transparent transmission board, in terms of the version, function, principle, front panel, configuration and specifications.

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7.1 EFT4
This section describes the EFT4, a 4 x FE Ethernet transparent transmission board, in terms of the version, function, principle, front panel, configuration and specifications. 7.1.1 Version Description The functional version of the EFT4 board is R1. 7.1.2 Function and Feature The EFT4 supports transparent transmission of Ethernet services, LCAS, and test frames. 7.1.3 Working Principle and Signal Flow The EFT4 consists of the ethernet access module, mapping module, interface converting module, Communication and control module and so on. 7.1.4 Front Panel On the front panel of the EFT4, there are indicators, interfaces and barcode. 7.1.5 Valid Slots The EFT4 can be housed in any of slots 2, 3, 69 and 1213 in the OptiX OSN 1500A subrack. The EFT4 can be housed in any of slots 13, 69 and 1113 in the OptiX OSN 1500B subrack. 7.1.6 Board Configuration Reference You can use the T2000 to set parameters for the EFT4. 7.1.7 Technical Specifications The specifications of the EFT4 cover the mechanical specifications and power consumption.

7.1.1 Version Description

The functional version of the EFT4 board is R1.

7.1.2 Function and Feature

The EFT4 supports transparent transmission of Ethernet services, LCAS, and test frames. Table 7-1 lists the functions and features of the EFT4. Table 7-1 Functions and features of the EFT4 Function and Feature Basic function Specification of the optical interface Format of service frames EFT4 Transmits 4 x FE services. Supports 10Base-T/100Base-TX signals. The optical interfaces comply with IEEE 802.3u. Supports Ethernet II, IEEE 802.3, and IEEE 802.1q TAG. Supports frames with a length ranging from 64 bytes to 9600 bytes. Supports Jumbo frames with a length less than 9600 bytes.
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Function and Feature Max. uplink bandwidth Number of VCTRUNKs Encapsulation format Mapping granularity Ethernet service type MTU

EFT4 622 Mbit/s. 4. HDLC, LAPS, GFP-F. Supports VC-12, VC-3, VC-12-Xv (X63), and VC-3-Xv (X3). Supports EPL. Supports setting of the packet length, which ranges from 1518 bytes to 1535 bytes. After the setting becomes valid, the length of the packets that enter or exit the IP ports is limited. Not supported. Supports VLAN transparent transmission. Supports the LPT in the GFP-carrying mode. Not supported. Supports the IEEE 802.3x flow control based on FE port. Dynamically increases or decreases the bandwidth, and realizes the protection function, compliant with ITU-T G.7042. Not supported. Receives and transmits Ethernet test frames. Supports Ethernet performance monitoring at the port level.

MPLS VLAN LPT CAR Flow control function LCAS ETH-OAM Test frame Ethernet performance monitoring Alarm and performance event

Provides rich alarms and performance events for easy management and maintenance of the equipment.

7.1.3 Working Principle and Signal Flow

The EFT4 consists of the ethernet access module, mapping module, interface converting module, Communication and control module and so on. Figure 7-1 shows the block diagram for the functions of the EFT4.

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Figure 7-1 Block diagram for the functions of the EFT4

ENCP
FE

Cross-connect unit

Ethernet access module

VCP DENCP Mapping module

Interface converting module

Cross-connect unit

Laser shutdown

LOS

Communication and control module

Communication Reference clock and frame header SCC unit SCC unit

+3.3 V

Clock module

+1.5 V +1.8 V +2.5 V

DC/DC converter
Fuse

Fuse

- 48 V/-60V - 48 V/-60V

DC/DC converter

+3.3 V

+3.3 V backup power

77 125 155 MHz MHz MHz

The function modules of ethernet switching boards are described below: ENCP: data encapsulation module VCP: virtual concatenation processing module DENCP: decapsulation module

Ethernet access module

In the receive direction, the optical signals from Ethernet equipment, such as switch and router, are converted into electrical signals. For the signals accessed from electrical interfaces, O/E conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS alarms are tested. The electrical signals are converted from serial signals to parallel signals and then sent to network processor. In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer, signals are encoded and converted from electrical signals to optical signals.

Mapping module
The mapping module consists of encapsulation and mapping. In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP format. The concatenation is processed. Ethernet signals are then converted into SDH signals. In the downstream direction, SDH signals are demapped. The time delay of virtual concatenation is compensated. After aligning, packets are decapsulated as per encapsulation format. The decapsulated data are transmitted to the network processor module in packets.
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Interface converting module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals (LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane interface connects to low-rate interface chip of the transmitting system.

Communication and control module

The communication and control module consists of CPU, register, oscillator, Ethernet port and HDLC controller. This module connects to external circuits through bus. The communication and control module:
l l

Manages and configures other modules of the boards. Performs inter-board communication through internal Ethernet interface.

The control module also contains basic logic units. This module enjoys the following functions:
l l l l l l l l

Writes and reads register Provides interface for CPU Checks, selects clock Performs phase discrimination and frequency division to the clock Checks the in-service state of the cross-connect, the SCC and the line boards Controls the shutting down of the optical module Processes communication Control indicators

Clock unit
This clock unit tracing the system reference clock and generates the required working clocks for each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.

DC/DC converter module

Through the DC/DC module, the power unit generates required voltages for each chip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition, this unit also provides protection for the board +3.3 V power supply.

7.1.4 Front Panel

On the front panel of the EFT4, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 7-2 shows the appearance of the front panel of the EFT4.

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Figure 7-2 Front panel of the EFT4

EFT4
STAT ACT PROG SRV

FE1 FE2 FE3 FE4

Indicators
The following indicators are present on the front panel of the board:
l l l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit. Connection status indicator (LINK), which is green when lit. Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are four FE interfaces on the front panel of the EFT4. Table 7-2 lists the type and usage of the interfaces. Table 7-2 Optical interfaces of the EFT4 Interface FE1 FE2 FE3 FE4 Interface Type RJ-45 RJ-45 RJ-45 RJ-45 Usage Transmits and receives the 10Base-T/100Base-TX signals. Transmits and receives the 10Base-T/100Base-TX signals. Transmits and receives the 10Base-T/100Base-TX signals. Transmits and receives the 10Base-T/100Base-TX signals.

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Table 7-3 lists the pins of the RJ-45 interface. Table 7-3 Pins of the RJ-45 of the EFT4 Pin 1 2 3 4 5 6 7 8 Description Transmitting positive Transmitting negative Receiving positive Grounding Grounding Receiving negative Grounding Grounding

7.1.5 Valid Slots

The EFT4 can be housed in any of slots 2, 3, 69 and 1213 in the OptiX OSN 1500A subrack. The EFT4 can be housed in any of slots 13, 69 and 1113 in the OptiX OSN 1500B subrack.
NOTE

The slots are divided slots.

7.1.6 Board Configuration Reference

You can use the T2000 to set parameters for the EFT4. You can use the T2000 to set the following parameters for the EFT4:
l l l l

Working mode Enabling of the LCAS Maximum packet length Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.1.7 Technical Specifications

The specifications of the EFT4 cover the mechanical specifications and power consumption.

Mechanical Specifications
The mechanical specifications of the EFT4 are as follows:
l l

Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W) Weight (kg): 0.5
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Power Consumption
In the normal temperature (25), the maximum power consumption of the EFT4 is 14 W.

7.2 EFT8
This section describes the EFT8, an 8/16 x FE Ethernet transparent transmission board, in terms of the version, function, principle, front panel, configuration and specifications. 7.2.1 Version Description The functional version of the EFT8 board is N1. 7.2.2 Function and Feature The EFT8 supports transparent transmission of Ethernet services, LCAS, and test frames. 7.2.3 Working Principle and Signal Flow The EFT8 consists of the ethernet access module, mapping module, interface converting module, communication and control module and so on. 7.2.4 Front Panel On the front panel of the EFT8, there are indicators, interfaces and barcode. 7.2.5 Valid Slots The EFT8 can be used with the ETF8 and EFF8. 7.2.6 Board Configuration Reference You can use the T2000 to set parameters for the EFT8. 7.2.7 Technical Specifications The specifications of the EFT8 cover the mechanical specifications and power consumption.

7.2.1 Version Description

The functional version of the EFT8 board is N1.

7.2.2 Function and Feature

The EFT8 supports transparent transmission of Ethernet services, LCAS, and test frames. Table 7-4 lists the functions and features of the EFT8. Table 7-4 Functions and features of the EFT8 Function and Feature Basic function Used with the interface board EFT8 Transmits 8 x FE or 16 x FE services Accesses 8 x Ethernet signals at the electrical port. Accesses 16 x Ethernet signals at the electrical port when used with the ETF8. Accesses 8 x Ethernet optical signals and 8 x Ethernet electrical signals when used with the EFF8.
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Function and Feature Specification of the optical interface Format of service frames Max. uplink bandwidth Number of VCTRUNKs Encapsulation format Mapping granularity Ethernet service type MPLS VLAN LPT CAR ETH-OAM Flow control function LCAS ETH-OAM Test frame Ethernet performance monitoring Alarms and performance events

EFT8 Supports the 10Base-T/100Base-TX signals when used with the ETF8. Supports the 100Base-FX/100Base-TX signals when used with the EFF8. The optical interfaces comply with IEEE 802.3u. Supports Ethernet II, IEEE 802.3, and IEEE 802.1q TAG. Supports frames with a length ranging from 64 bytes to 9600 bytes. Supports Jumbo frames with a length less than 9600 bytes. 1.25 Gbit/s. 16. Supports HDLC, LAPS, and GFP-F. Supports VC-12, VC-3, VC-12-Xv (X63), and VC-3-Xv (X3). Supports EPL. Not supported. Supports the VLAN transparent transmission. Supports the LPT in the GFP-carrying mode. Not supported. Supports ETH-OAM in compliance with 802.1ag. The EFT8 supports CC for the multicast. Supports the IEEE 802.3x flow control based on FE port. Dynamically increases or decreases the bandwidth, and realizes the protection function, compliant with ITU-T G.7042. Not supported. Receives and transmits GFP test frames. Supports Ethernet performance monitoring at the port level.

Provides rich alarms and performance events for easy management and maintenance of the equipment.

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7.2.3 Working Principle and Signal Flow

The EFT8 consists of the ethernet access module, mapping module, interface converting module, communication and control module and so on. Figure 7-3 shows the block diagram for the functions of the EFT8. Figure 7-3 Block diagram for the functions of the EFT8

ENCP
FE

Cross-connect unit

Ethernet access module

VCP DENCP Mapping module

Interface converting module

Cross-connect unit

Laser shutdown

LOS

Communication and control module

Communication Reference clock and frame header SCC unit SCC unit

+3.3 V

Clock module

+1.5 V +1.8 V +2.5 V

DC/DC converter
Fuse

Fuse

- 48 V/-60V - 48 V/-60V

DC/DC converter

+3.3 V

+3.3 V backup power

77 125 155 MHz MHz MHz

ENCP: data encapsulation module VCP: virtual concatenation processing module

DENCP: decapsulation module

The function modules of ethernet switching boards are described below:

Ethernet Access Module

In the receive direction, the optical signals from Ethernet equipment, such as switch and router, are converted into electrical signals. For the signals accessed from electrical interfaces, O/E conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS alarms are tested. The electrical signals are converted from serial signals to parallel signals and then sent to network processor. In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer, signals are encoded and converted from electrical signals to optical signals.

Mapping Module
The mapping module consists of encapsulation and mapping. In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP format. The concatenation is processed. Ethernet signals are then converted into SDH signals.
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In the downstream direction, SDH signals are demapped. The time delay of virtual concatenation is compensated. After aligning, packets are decapsulated as per encapsulation format. The decapsulated data are transmitted to the network processor module in packets.

Interface Converting Module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals (LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane interface connects to low-rate interface chip of the transmitting system.

Communication and Control Module

The communication and control module consists of CPU, register, oscillator, Ethernet port and HDLC controller. This module connects to external circuits through bus. The communication and control module:
l l

Manages and configures other modules of the boards. Performs inter-board communication through internal Ethernet interface.

The control module also contains basic logic units. This module enjoys the following functions:
l l l l l l l l

Writes and reads register Provides interface for CPU Checks, selects clock Performs phase discrimination and frequency division to the clock Checks the in-service state of the cross-connect, the SCC and the line boards Controls the shutting down of the optical module Processes communication Control indicators

Clock Unit
This clock unit tracing the system reference clock and generates the required working clocks for each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.

DC/DC Converter Module

Through the DC/DC module, the power unit generates required voltages for each chip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition, this unit also provides protection for the board +3.3 V power supply.

7.2.4 Front Panel

On the front panel of the EFT8, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 7-4 shows the appearance of the front panel of the EFT8.
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Figure 7-4 Front panel of the EFT8

EFT8
STAT ACT PROG SRV
FE1

FE2

FE3

FE4

FE5

FE6

FE7

FE8

EFT8

Indicators
The following indicators are present on the front panel of the board:
l l l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit. Connection status indicator (LINK), which is green when lit. Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are eight interfaces on the front panel of the EFT8. Table 7-5 lists the type and usage of the interfaces.

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Table 7-5 Optical interfaces of the EFT8 Interface FE1 FE2 FE3 FE4 FE5 FE6 FE7 FE8 Interface Type RJ-45 RJ-45 RJ-45 RJ-45 RJ-45 RJ-45 RJ-45 RJ-45 Usage Transmits and receives the 10Base-T/100Base-TX signals. Transmits and receives the 10Base-T/100Base-TX signals. Transmits and receives the 10Base-T/100Base-TX signals. Transmits and receives the 10Base-T/100Base-TX signals. Transmits and receives the 10Base-T/100Base-TX signals. Transmits and receives the 10Base-T/100Base-TX signals. Transmits and receives the 10Base-T/100Base-TX signals. Transmits and receives the 10Base-T/100Base-TX signals.

Table 7-6 lists the pins of the RJ-45 interface. Table 7-6 Pins of the RJ-45 of the EFT8 Pin 1 2 3 4 5 6 7 8 Description Transmitting positive Transmitting negative Receiving positive Grounding Grounding Receiving negative Grounding Grounding

7.2.5 Valid Slots

The EFT8 can be used with the ETF8 and EFF8.
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Table 7-7 and Table 7-8 list the valid slots for the EFT8 and corresponding slots for the ETF8 and EFF8. Table 7-7 Valid slots for the EFT8 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500A Valid Slot for the EFT8 Slot 12 Slot 13 Corresponding Slot for the ETF8 and EFF8 Without the interface board Without the interface board

Table 7-8 Valid slots for the EFT8 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500B Valid Slot for the EFT8 Slot 11 Slot 12 Slot 13 Corresponding Slot for the ETF8 and EFF8 Without the interface board Slot 14 Slot 16

7.2.6 Board Configuration Reference

You can use the T2000 to set parameters for the EFT8. You can use the T2000 to set the following parameters for the EFT8:
l l l l

Working mode Enabling of the LCAS Maximum packet length Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.2.7 Technical Specifications

The specifications of the EFT8 cover the mechanical specifications and power consumption.

Mechanical Specifications
The mechanical specifications of the EFT8 are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 1.0

Power Consumption
In the normal temperature (25), the maximum power consumption of the EFT8 is 26 W.
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7.3 EFT8A
This section describes the EFT8A, an 8 x FE Ethernet transparent transmission board, in terms of the version, function, principle, front panel, configuration and specifications. 7.3.1 Version Description The functional version of the EFT8A board is N1. 7.3.2 Function and Feature The EFT8A supports transparent transmission of Ethernet services, LCAS, and test frames. 7.3.3 Working Principle and Signal Flow The EFT8A consists of the ethernet access module, mapping module, interface converting module, communication and control module and so on. 7.3.4 Front Panel On the front panel of the EFT8A, there are indicators, interfaces and barcode. 7.3.5 Valid Slots The EFT8A can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The EFT8A can be housed in any of slots 1113 in the OptiX OSN 1500B subrack. 7.3.6 Board Configuration Reference You can use the T2000 to set parameters for the EFT8A. 7.3.7 Technical Specifications The specifications of the EFT8A cover the mechanical specifications and power consumption.

7.3.1 Version Description

The functional version of the EFT8A board is N1.

7.3.2 Function and Feature

The EFT8A supports transparent transmission of Ethernet services, LCAS, and test frames. Table 7-9 lists the functions and features of the EFT8A. Table 7-9 Functions and features of the EFT8A Function and Feature Basic function Specification of the optical interface Format of service frames Max. uplink bandwidth
7-16

EFT8A Transparently transmits 8 x FE services. Supports 10Base-T/100Base-TX signals. The optical interfaces comply with IEEE 802.3u. Supports Ethernet II, IEEE 802.3, and IEEE 802.1q TAG. Supports frames with a length ranging from 64 bytes to 9600 bytes. Supports Jumbo frames with a length less than 9600 bytes. 622 Mbit/s.

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Function and Feature Number of VCTRUNKs Encapsulation format Mapping granularity Ethernet service type MPLS VLAN LPT CAR ETH-OAM Flow control function LCAS ETH-OAM Test frame Ethernet performance monitoring Alarm and performance event

EFT8A 8. Supports HDLC, LAPS, and GFP-F. Supports VC-12, VC-3, VC-12-Xv (X63), and VC-3-Xv (X3). Supports EPL. Not supported. Supports VLAN transparent transmission. Supports the LPT in the GFP-carrying mode. Not supported. Supports the ETH-OAM in compliance with 802.1ag. The EFT8 supports CC for the multicast. Supports the IEEE 802.3x flow control based on FE port. Dynamically increases or decreases the bandwidth, and realizes the protection function, compliant with ITU-T G.7042. Not supported. Receives and transmits GFP test frames. Supports Ethernet performance monitoring at the port level.

Provides rich alarms and performance events for easy management and maintenance of the equipment.

7.3.3 Working Principle and Signal Flow

The EFT8A consists of the ethernet access module, mapping module, interface converting module, communication and control module and so on. Figure 7-5 shows the block diagram for the functions of the EFT8A.

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Figure 7-5 Block diagram for the functions of the EFT8A

ENCP
FE

Cross-connect unit

Ethernet access module

VCP DENCP Mapping module

Interface converting module

Cross-connect unit

Laser shutdown

LOS

Communication and control module

Communication Reference clock and frame header SCC unit SCC unit

+3.3 V

Clock module

+1.5 V +1.8 V +2.5 V

DC/DC converter
Fuse

Fuse

- 48 V/-60V - 48 V/-60V

DC/DC converter

+3.3 V

+3.3 V backup power

77 125 155 MHz MHz MHz

ENCP: data encapsulation module VCP: virtual concatenation processing module

DENCP: decapsulation module

The function modules of ethernet switching boards are described below:

Ethernet Access Module

In the receive direction, the optical signals from Ethernet equipment, such as switch and router, are converted into electrical signals. For the signals accessed from electrical interfaces, O/E conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS alarms are tested. The electrical signals are converted from serial signals to parallel signals and then sent to network processor. In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer, signals are encoded and converted from electrical signals to optical signals.

Mapping Module
The mapping module consists of encapsulation and mapping. In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP format. The concatenation is processed. Ethernet signals are then converted into SDH signals. In the downstream direction, SDH signals are demapped. The time delay of virtual concatenation is compensated. After aligning, packets are decapsulated as per encapsulation format. The decapsulated data are transmitted to the network processor module in packets.

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Interface Converting Module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals (LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane interface connects to low-rate interface chip of the transmitting system.

Communication and Control Module

The communication and control module consists of CPU, register, oscillator, Ethernet port and HDLC controller. This module connects to external circuits through bus. The communication and control module:
l l

Manages and configures other modules of the boards. Performs inter-board communication through internal Ethernet interface.

The control module also contains basic logic units. This module enjoys the following functions:
l l l l l l l l

Writes and reads register Provides interface for CPU Checks, selects clock Performs phase discrimination and frequency division to the clock Checks the in-service state of the cross-connect, the SCC and the line boards Controls the shutting down of the optical module Processes communication Control indicators

Clock Unit
This clock unit tracing the system reference clock and generates the required working clocks for each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.

DC/DC Converter Module

Through the DC/DC module, the power unit generates required voltages for each chip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition, this unit also provides protection for the board +3.3 V power supply.

7.3.4 Front Panel

On the front panel of the EFT8A, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 7-6 shows the appearance of the front panel of the EFT8A.

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Figure 7-6 Front panel of the EFT8A

EFT8A
STAT ACT PROG SRV
FE1

FE2

FE3

FE4

FE5

FE6

FE7

FE8

EFT8A

Indicators
The following indicators are present on the front panel of the board:
l l l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit. Connection status indicator (LINK), which is green when lit. Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are eight FE interfaces on the front panel of the EFT8A. Table 7-10 lists the type and usage of the interfaces.
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Table 7-10 Optical interfaces of the EFT8A Interface FE1 FE2 FE3 FE4 FE5 FE6 FE7 FE8 Interface Type RJ-45 RJ-45 RJ-45 RJ-45 RJ-45 RJ-45 RJ-45 RJ-45 Usage Transmits and receives the 10Base-T/100Base-TX signals. Transmits and receives the 10Base-T/100Base-TX signals. Transmits and receives the 10Base-T/100Base-TX signals. Transmits and receives the 10Base-T/100Base-TX signals. Transmits and receives the 10Base-T/100Base-TX signals. Transmits and receives the 10Base-T/100Base-TX signals. Transmits and receives the 10Base-T/100Base-TX signals. Transmits and receives the 10Base-T/100Base-TX signals.

Table 7-11 lists the pins of the RJ-45 interface. Table 7-11 Pins of the RJ-45 of the EFT8A Pin 1 2 3 4 5 6 7 8 Description Transmitting positive Transmitting negative Receiving positive Grounding Grounding Receiving negative Grounding Grounding

7.3.5 Valid Slots

The EFT8A can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The EFT8A can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.
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7.3.6 Board Configuration Reference

You can use the T2000 to set parameters for the EFT8A. You can use the T2000 to set the following parameters for the EFT8A:
l l l l

Working mode Enabling of the LCAS Maximum packet length Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.3.7 Technical Specifications

The specifications of the EFT8A cover the mechanical specifications and power consumption.

Mechanical Specifications
The mechanical specifications of the EFT8A are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 1.0

Power Consumption
In the normal temperature (25), the maximum power consumption of the EFT8A is 26 W.

7.4 EGT2
This section describes the EGT2, a 2 x GE Ethernet transparent transmission board, in terms of the version, function, principle, front panel, configuration and specifications. 7.4.1 Version Description The functional version of the EGT2 board is N1. 7.4.2 Function and Feature The EGT2 supports transparent transmission of Ethernet services, LCAS, and test frames. 7.4.3 Working Principle and Signal Flow The EGT2 consists of the ethernet access module, mapping module, interface converting module, interface converting module, Communication and Control Module and so on. 7.4.4 Front Panel On the front panel of the EGT2, there are indicators, interfaces and barcode. 7.4.5 Valid Slots The EGT2 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The EGT2 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack. 7.4.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the EGT2 indicates the optical interface type.
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7.4.7 Board Configuration Reference You can use the T2000 to set parameters for the EGT2. 7.4.8 Technical Specifications The specifications of the EGT2 cover the optical interface specifications, mechanical specifications and power consumption.

7.4.1 Version Description

The functional version of the EGT2 board is N1.

7.4.2 Function and Feature

The EGT2 supports transparent transmission of Ethernet services, LCAS, and test frames. Table 7-12 lists the functions and features of the EGT2. Table 7-12 Functions and features of the EGT2 Function and Feature Basic function Specification of the optical interface EGT2 Transparently transmits 2 x GE services. The optical interfaces are 1000Base-SX/LX/ZX Ethernet optical interfaces. The optical interfaces support the auto-negotiation, compliant with IEEE 802.3z. The optical interfaces use the hot-swappable optical module SFP. When multimode optical fiber is used, the maximum transmission distance is 550 m. When single-mode optical fiber is used, the maximum transmission distance is 10 km. The optical modules can be used for different requirements for the transmission distance, such as 40 km and 70 km. Supports Ethernet II, IEEE 802.3, and IEEE 802.1q TAG. Supports frames with a length ranging from 64 bytes to 9600 bytes. Supports Jumbo frames with a length less than 9600 bytes. 2.5 Gbit/s. 2. Supports HDLC, LAPS, and GFP-F. Supports VC-4, VC-3, VC-3-Xv (X24), and VC-4-Xv (X8). Supports EPL. Not supported. Supports VLAN transparent transmission. Supports the LPT in the GFP-carrying mode.
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Format of service frames Max. uplink bandwidth Number of VCTRUNKs Encapsulation format Mapping granularity Ethernet service type MPLS VLAN LPT
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Function and Feature CAR Flow control function LCAS ETH-OAM Test frame Ethernet performance monitoring Alarm and performance event

EGT2 Not supported. Supports the IEEE 802.3x flow control based on GE port. Dynamically increases or decreases the bandwidth and realizes the protection function, compliant with ITU-T G.7042. Not supported. Receives and transmits Ethernet test frames. Supports Ethernet performance monitoring at the port level.

Provides rich alarms and performance events for easy management and maintenance of the equipment.

7.4.3 Working Principle and Signal Flow

The EGT2 consists of the ethernet access module, mapping module, interface converting module, interface converting module, Communication and Control Module and so on. Figure 7-7 shows the block diagram for the functions of the EGT2.

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Figure 7-7 Block diagram for the functions of the EGT2

ENCP
GE

Cross-connect unit

Ethernet access module

VCP DENCP Mapping module

Interface converting module

Cross-connect unit

Laser shutdown

LOS

Communication and control module

Communication Reference clock and frame header SCC unit SCC unit

+3.3 V

Clock module

+1.5 V +1.8 V +2.5 V

DC/DC converter
Fuse

Fuse

- 48 V/-60V - 48 V/-60V

DC/DC converter

+3.3 V

+3.3 V backup power

77 125 155 MHz MHz MHz

ENCP: data encapsulation module VCP: virtual concatenation processing module

DENCP: decapsulation module

The function modules of ethernet switching boards are described below:

Ethernet Access Module

In the receive direction, the optical signals from Ethernet equipment, such as switch and router, are converted into electrical signals. For the signals accessed from electrical interfaces, O/E conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS alarms are tested. The electrical signals are converted from serial signals to parallel signals and then sent to network processor. In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer, signals are encoded and converted from electrical signals to optical signals.

Mapping Module
The mapping module consists of encapsulation and mapping. In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP format. The concatenation is processed. Ethernet signals are then converted into SDH signals. In the downstream direction, SDH signals are demapped. The time delay of virtual concatenation is compensated. After aligning, packets are decapsulated as per encapsulation format. The decapsulated data are transmitted to the network processor module in packets.

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Interface Converting Module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals (LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane interface connects to low-rate interface chip of the transmitting system.

Communication and Control Module

The communication and control module consists of CPU, register, oscillator, Ethernet port and HDLC controller. This module connects to external circuits through bus. The communication and control module:
l l

Manages and configures other modules of the boards. Performs inter-board communication through internal Ethernet interface.

The control module also contains basic logic units. This module enjoys the following functions:
l l l l l l l l

Writes and reads register Provides interface for CPU Checks, selects clock Performs phase discrimination and frequency division to the clock Checks the in-service state of the cross-connect, the SCC and the line boards Controls the shutting down of the optical module Processes communication Control indicators

Clock Unit
This clock unit tracing the system reference clock and generates the required working clocks for each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.

DC/DC Converter Module

Through the DC/DC module, the power unit generates required voltages for each chip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition, this unit also provides protection for the board +3.3 V power supply.

7.4.4 Front Panel

On the front panel of the EGT2, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 7-8 shows the appearance of the front panel of the EGT2.

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Figure 7-8 Front panel of the EGT2

EGT2
STAT ACT PROG SRV LINK1 ACT1 LINK2 ACT2

CLASS 1 LASER PRODUCT

OUT1 IN1 OUT2 IN2

EGT2

Indicators
The following indicators are present on the front panel of the board:
l l l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit. Connection status indicator (LINK), which is green when lit. Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are two GE interfaces on the front panel of the EGT2. Table 7-13 lists the type and usage of the interfaces.

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Table 7-13 Optical interfaces of the EGT2 Interface IN1/OUT1 IN2/OUT2 Interface Type LC (pluggable) LC (pluggable) Usage Transmits and receives the 1000Base-SX/LX/ZX signals. Transmits and receives the 1000Base-SX/LX/ZX signals.

7.4.5 Valid Slots

The EGT2 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The EGT2 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

7.4.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code of the EGT2 indicates the optical interface type. Table 7-14 lists the relation between the board feature code and optical interface type for the EGT2. Table 7-14 Relation between the board feature code and the optical interface type Board Barcode SSN1EGT210 SSN1EGT211 SSN1EGT212 SSN1EGT213 Feature Code 10 11 12 13 Optical Interface Type 1000Base-SX (0.55 km) 1000Base-LX (10 km) 1000Base-ZX (40 km) 1000Base-ZX (70 km)

7.4.7 Board Configuration Reference

You can use the T2000 to set parameters for the EGT2. You can use the T2000 to set the following parameters for the EGT2:
l l l l

Working mode Enabling of the LCAS Maximum packet length Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.4.8 Technical Specifications

The specifications of the EGT2 cover the optical interface specifications, mechanical specifications and power consumption.
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Optical Interface Specifications

Table 7-15 lists the specifications of the interfaces of the EGT2. Table 7-15 Specifications of the optical interfaces of the EGT2 Item Optical interface type Optical source type Launched optical power (dBm) Central wavelength (nm) Overload optical power (dBm) Receiver sensitivity (dBm) Extinction ratio (dB) Specification 1000Base-ZX (70 km) MLM 4 to +2 1000Base-ZX (40 km) MLM 2 to +5 1000Base-LX (10 km) MLM 9 to 3 1000Base-SX (0.55 km) MLM 9.5 to 0

1480 to 1580

1270 to 1355

1270 to 1355

770 to 860

22

23

19

17

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the EGT2 are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 0.9

Power Consumption
In the normal temperature (25), the maximum power consumption of the EGT2 is 29 W.

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7.5 EFS0
This section describes the EFS0, an 8 x FE Ethernet processing board with Lanswitch, in terms of the version, function, principle, front panel, configuration and specifications. 7.5.1 Version Description The EFS0 has three functional versions, N1, N2 and N4. The production of the N1 version is stopped. 7.5.2 Function and Feature The EFS0 supports Layer 2 switching, MPLS and broadcast. 7.5.3 Working Principle and Signal Flow The EFS0 consists of the ethernet access module, network processor module, mapping module, interface converting module and so on. 7.5.4 Front Panel On the front panel of the EFS0, there are indicators, interfaces and barcode. 7.5.5 Valid Slots The EFS0 can be housed in any of slots 1213 in the OptiX OSN 1500B subrack. 7.5.6 TPS Protection The EFS0 supports the 1:N TPS protection. 7.5.7 Board Configuration Reference You can use the T2000 to set parameters for the EFS0. 7.5.8 Technical Specifications The specifications of the EFS0 cover the mechanical specifications and power consumption.

7.5.1 Version Description

The EFS0 has three functional versions, N1, N2 and N4. The production of the N1 version is stopped. The OptiX OSN 1500A does not support the EFS0. The OptiX OSN 1500B supports the EFS0. Table 7-16 lists the details on the versions of the EFS0 board. Table 7-16 Version Description of the EFS0 Item Functional version Difference Description The EFS0 has three versions, N1, N2, and N4. The maximum uplink bandwidth of the N1EFS0 is 622 Mbit/s. The maximum uplink bandwidth of the N2EFS0 is 1.25 Gbit/s. The N1EFS0 supports the port flow, port+VLAN ID flow, and port +VLAN PRI flow. The N2EFS0 and N4EFS0 support the port flow, port+VLAN ID flow, and port+VLAN PRI flow.
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Item Replaceability

Description The N2EFS0 supports the board version replacement function and can replace the N1EFS0. The N4EFS0 supports the board version replacement function and can replace the N1EFS0 and N2EFS0.

7.5.2 Function and Feature

The EFS0 supports Layer 2 switching, MPLS and broadcast. Table 7-17 lists the functions and features of the EFS0. Table 7-17 Functions and features of the EFS0 Function and Feature Basic function Used with the interface board EFS0 Processes 8 x FE services. Accesses 8 x FE signals at the electrical interface when used with the ETF8. Accesses 8 x FE signals at the optical interface when used with the EFF8. Realizes the TPS protection for 8 x FE signals at the electrical interface when used with the ETS8 and TSB8. Specification of the optical interface Supports the 10Base-T/100Base-TX signals when used with the ETF8. Supports the 100Base-FX signals when used with the EFF8. The optical inerfaces comply with IEEE 802.3u. Supports Ethernet II, IEEE 802.3, and IEEE 802.1 q/p. Supports frames with a length ranging from 64 bytes to 9600 bytes. Supports Jumbo frames with a length less than 9600 bytes. The maximum uplink bandwidth of the N1EFS0 is 622 Mbit/s. The maximum uplink bandwidth of the N2EFS0 is 1.25 Gbit/s. The maximum uplink bandwidth of the N4EFS0 is 1.25 Gbit/s. Number of VCTRUNKs The number of the VCTRUNKs of the N1EFS0 is 12. The number of the VCTRUNKs of the N2EFS0 is 24. The number of the VCTRUNKs of the N4EFS0 is 24. Mapping granularity Encapsulation format EPL Supports VC-12, VC-3, VC-12-Xv (X63), and VC-3-Xv (X12). GFP-F. Supports transparent transmission based on port.

Format of service frames Max. uplink bandwidth

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Function and Feature EVPL EPLAN

EFS0 Supports EVPL services based on port+VLAN that use the frame encapsulation formats of MartinioE and stack VLAN. Supports the Layer 2 convergence and point to multipoint convergence. Supports the Layer 2 forwarding function. Supports switching at the client and SDH sides. Supports the function of self-learning the source MAC address. The length of the MAC address table is 16k. The aging time of the MAC address can be set and queried. Supports the configuration of static MAC route. The N1EFS0 and N2EFS0 support the dynamic query of the MAC address. The N4EFS0 does not support the dynamic query of the MAC address. Supports the creation, deletion and query of the VB. The maximum number of the VBs is 16. The maximum number of logical ports for each VB is 30.

EVPLAN

Supports data isolation based on VB+VLAN. Supports the query of the number of the learned MAC addresses according to VB+VLAN or VB+LP.

MTU

The packet length can be set from 1518 bytes to 9600 bytes. After the packet length setting takes effect, the maximum length of the packets entering or going out from the IP port are limited by the MTU setting. Supported. Compliant with IEEE 802.1q/p. Supported (4k VLAN). Supports broadcast packet suppression and RSTP, compliant with IEEE 802.1w. Supported. The N4EFS0 supports CC for the multicast, LB test for the unicast, Link Trance test(LT), loop detection (LD), auto-negotiation, fault diagnosis, and link performance detection. Supported. The granularity is 64 kbit/s.

MPLS VLAN VLAN convergence RSTP Multicast (IGMP Snooping) ETH-OAM

CAR

Service based QoS flow classification

The N1EFS0 supports the port service, port+VLAN ID service, and port+VLAN PRI service. The N2EFS0 and N4EFS0 support the port flow, port+VLAN ID flow, and port+VLAN PRI flow.

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Function and Feature LCAS LPT Link Aggreation Flow control function Test frame Loopback function Ethernet performance monitoring Alarm and performance event

EFS0 Dynamically increases or decreases the bandwidth and realizes the protection function, compliant with ITU-T G.7042. Supports the LPT function, which can be enabled or disabled. Supported. Supports the IEEE 802.3x flow control based on port. Receives and transmits Ethernet test frames. Supports inloop at the Ethernet port (PHY layer or MAC layer). Supports inloop and outloop at the VC-3 level. Supports Ethernet performance monitoring at the port level.

Provides rich alarms and performance events for easy management and maintenance of the equipment.

7.5.3 Working Principle and Signal Flow

The EFS0 consists of the ethernet access module, network processor module, mapping module, interface converting module and so on. Figure 7-9 shows the block diagram for the functions of the EFS0.

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Figure 7-9 Block diagram for the functions of the EFS0

E N C P Switch fabric
Data Cross-connect unit

Control FE

Ethernet access module

Network processor

D E N C P

V C P

Interface coversion module

Cross-connect unit

Network processor module

Laser shutdown

Mapping module

LOS

Communication and control module

Communication Reference clock and frame header SCC unit SCC unit

+3.3 V +1.5 V

Clock module

+1.8 V +2.5 V

DC/DC converter

DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse

50 77 125 155 MHz MHz MHz MHz

+3.3 V backup power

ENCP: data encapsulation module VCP: virtual concatenation processing module

DENCP: decapsulation module

The function modules of ethernet switching boards are described below:

Ethernet Access Module

In the receive direction, the optical signals from Ethernet equipment, such as switch and router, are converted into electrical signals. For the signals accessed from electrical interfaces, O/E conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS alarms are tested. The electrical signals are converted from serial signals to parallel signals and then sent to network processor. In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer, signals are encoded and converted from electrical signals to optical signals.

Network Processor Module

The network processor module consists of network processor and switch fabric. The network processor first performs MAC functions, which include code conversion, framing of Ethernet packets, CRC check and Ethernet performance statistics. After the striped Ethernet frame enters the core of network processor, the flow is classified as per service type and configuration requirements. The frame is encapsulated or decapsulated. These packets formats are supported:
l l l

Multi-protocol label switching (MPLS) L2MPLS VPN Ethernet/ VLAN

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In the receive direction, services are mapped and forwarded by adding Tunnel and VC double labels as per service configuration. In the transmit direction, Tunnel or VC is extracted as per the level (P or PE) of the equipment. Services are then routed or forwarded. The network processor module:
l l l l l

Supports flow sense and flow classification Supports uni-cast, multi-cast and broadcast of the flow Provides data priority setting Provides weighted fair queuing (WFQ) Provides four classes of services (CoS)

Mapping Module
The mapping module consists of encapsulation and mapping. In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP-F format. The concatenation is processed. The LCAS function is supported. Ethernet signals are then converted into SDH signals. In the downstream direction, SDH signals are demapped. The time delay of virtual concatenation is compensated. After aligning, packets are decapsulated as per encapsulation format. The decapsulated data are transmitted to the network processor module in packets.

Interface Conversion Module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals (LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane interface connects to low-rate interface chip of the transmitting system.

Communication and Control Module

The communication and control module consists of CPU, register, oscillator, Ethernet port and HDLC controller. This module connects to external circuits through bus. The communication and control module:
l l

Manages and configures other modules of the boards. Performs inter-board communication through internal Ethernet interface.

The control module also contains basic logic units. This module enjoys the following functions:
l l l l l l l l

Writes and reads register Provides interface for CPU Checks, selects clock Performs phase discrimination and frequency division to the clock Checks the in-service state of the cross-connect, the SCC and the line boards Controls the shutting down of the optical module Processes communication Control indicators
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Clock Unit
This clock unit tracing the system reference clock and generates the required working clocks for each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.

DC/DC Converter Module

Through the DC/DC module, the power converting unit generates required voltages for each chip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition, this unit also provides protection for the board +3.3 V power supply.

7.5.4 Front Panel

On the front panel of the EFS0, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 7-10 shows the appearance of the front panel of the EFS0. Figure 7-10 Front panel of the EFS0

EFS0
STAT ACT PROG SRV

EFS0

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Indicators
The following indicators are present on the front panel of the board:
l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are no interfaces on the front panel of the EFS0. The interfaces are present on the ETF8, EFF8 or ETS8.

7.5.5 Valid Slots

The EFS0 can be housed in any of slots 1213 in the OptiX OSN 1500B subrack. When the N1EFS0 is housed in any of slots 1213 in the OptiX OSN 1500B subrack, the bandwidth is 622 Mbit/s. When the N2EFS0 or N4EFS0 is housed in any of slots 1213 in the OptiX OSN 1500B subrack, the bandwidth is 1.25 Gbit/s. The EFS0 can be used with the ETF8, EFF8 and ETS8. Table 7-18 lists the valid slots for the EFS0 and corresponding slots for the ETF8, EFF8 and ETS8. Table 7-18 Valid slots for the EFS0 and corresponding slots for the ETF8, EFF8 and ETS8 in the OptiX OSN 1500B subrack Valid Slot for the EFS0 Slot 12 Slot 13 Corresponding Slot for the ETF8, EFF8 and ETS8 Slot 14 Slot 16

7.5.6 TPS Protection

The EFS0 supports the 1:N TPS protection. Figure 7-11 shows the slot configuration for the 1:1 TPS protection for the EFS0.

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Figure 7-11 Slot configuration for the 1:1 TPS protection for the EFS0 in the OptiX OSN 1500B subrack
Slot 14 Slot 15 Slot 16 Slot 17 Slot 11 Slot 20 FAN Slot 12 Slot 13 Slot 4 Slot 5 EFS0 Protection EFS0 Working CXL16/4/1 CXL16/4/1 ETS8 TSB8 Slot 18 PIU

Slot 19 Slot 6 Slot 7 Slot 8 Slot 9 Slot 10

PIU

EOW AUX

As shown in Figure 7-11, the protection board housed in slot 12 protects the board housed in slot 13. The ETS8, housed in slot 16, is used with the working ETS0. The TSB8, housed in slot 14, is used with the protection EFS0.

7.5.7 Board Configuration Reference

You can use the T2000 to set parameters for the EFS0. You can use the T2000 to set the following parameters for the EFS0:
l l l l

Working mode Enabling of the LCAS Maximum packet length Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.5.8 Technical Specifications

The specifications of the EFS0 cover the mechanical specifications and power consumption.

Mechanical Specifications
The mechanical specifications of the EFS0 are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 1.0

Power Consumption
In the normal temperature (25), the maximum power consumption of the EFS0 is 35 W.

7.6 EFS4
This section describes the EFS4, a 4 x FE Ethernet processing board with Lanswitch, in terms of the version, function, principle, front panel, configuration and specifications.
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7.6.1 Version Description The EFS4 has two functional versions, N1 and N2. The two versions have different maximum uplink bandwidth. 7.6.2 Function and Feature The EFS4 supports Layer 2 switching, MPLS and broadcast. 7.6.3 Working Principle and Signal Flow The EFS4 consists of the interface module, service processing module, encapsulation and mapping module, interface converting module, control and communication Module and the power supply module 7.6.4 Front Panel On the front panel of the EFS4, there are indicators, interfaces and barcode. 7.6.5 Valid Slots The EFS4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The EFS4 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack. 7.6.6 Board Configuration Reference You can use the T2000 to set parameters for the EFS4. 7.6.7 Technical Specifications The specifications of the EFS4 cover the mechanical specifications and power consumption.

7.6.1 Version Description

The EFS4 has two functional versions, N1 and N2. The two versions have different maximum uplink bandwidth. Table 7-19 lists the details on the versions of the EFS4 board. Table 7-19 Version Description of the EFS4 Item Functional version Difference Description The EFS4 has two versions, N1 and N2. The maximum uplink bandwidth of the N1EFS4 is 622 Mbit/s. The maximum uplink bandwidth of the N2EFS4 is 1.25 Gbit/s. The N2EFS4 supports the board version replacement function. Replaceability The N2EFS4 supports the board version replacement function and can replace the N1EFS4.

7.6.2 Function and Feature

The EFS4 supports Layer 2 switching, MPLS and broadcast. Table 7-20 lists the functions and features of the EFS4.

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Table 7-20 Functions and features of the EFS4 Function and Feature Basic function Specification of the optical interfaces Format of service frames Max. uplink bandwidth Number of VCTRUNKs Mapping granularity Encapsulation format EPL EVPL EPLAN EFS4 Processes 4 x FE services. Supports 10Base-T/100Base-TX signals. The optical interfaces comply with IEEE 802.3u. Supports Ethernet II, IEEE 802.3, and IEEE 802.1 q/p. Supports frames with a length ranging from 64 bytes to 9600 bytes. Supports Jumbo frames with a length less than 9600 bytes. The maximum uplink bandwidth of the N1EFS4 is 622 Mbit/s. The maximum uplink bandwidth of the N2EFS4 is 1.25 Gbit/s. The number of the VCTRUNKs of the N1EFS4 is 12. The number of the VCTRUNKs of the N2EFS4 is 24. Supports VC-12, VC-3, VC-12-Xv (X63), and VC-3-Xv (X12). GFP-F. Supports transparent transmission based on port. Supports EVPL services based on port+VLAN that use the frame encapsulation formats of MartinioE and stack VLAN. Supports the Layer 2 convergence and point to multipoint convergence. Supports the Layer 2 forwarding function and switching at the client and SDH sides. Supports the function of self-learning the source MAC address. The length of the MAC address table is 16k. The aging time of the MAC address can be set and queried. Supports the configuration of static MAC route. The N1EFS4 supports the dynamic query of the MAC address. The N2EFS4 does not support the dynamic query of the MAC address. Supports the creation, deletion and query of the VB. The maximum number of the VBs is 16 (a maximum of two VBs for the N2EGS2). The maximum number of logical ports for each VB is 30. EVPLAN Supports data isolation based on VB+VLAN. Supports the query of the number of the learned MAC addresses according to VB+VLAN or VB+LP. MTU The packet length can be set from 1518 bytes to 9600 bytes. After the packet length setting takes effect, the maximum length of the packets entering or going out from the IP port are limited by the MTU setting. Supported.

MPLS

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Function and Feature VLAN VLAN convergence RSTP Multicast (IGMP Snooping) ETH-OAM

EFS4 Compliant with IEEE 802.1q/p. Supported (4k VLAN). Supports broadcast packet suppression and RSTP, compliant with IEEE 802.1w. Supported. The N2EFS4 supports CC for the multicast, LB test for the unicast, Link Trance test(LT), loop detection (LD), auto-negotiation, fault diagnosis, and link performance detection. Supported. The granularity is 64 kbit/s.

CAR

Service based QoS flow classification LCAS LPT Link Aggreation Flow control function Test frame Loopback function Ethernet performance monitoring Alarm and performance event

The N1EFS4 supports the port service, port+VLAN ID service, and port +VLAN PRI service. The N2EFS4 supports the port flow, port+VLAN ID flow, and port +VLAN PRI flow. Dynamically increases or decreases the bandwidth, and realizes the protection function, compliant with ITU-T G.7042. Supports the LPT function, which can be enabled or disabled. Supported. Supports the IEEE 802.3x flow control based on port. Receives and transmits Ethernet test frames. Supports inloop at the Ethernet port (PHY layer or MAC layer). Supports inloop and outloop at the VC-3 level. Supports Ethernet performance monitoring at the port level.

Provides rich alarms and performance events for easy management and maintenance of the equipment.

7.6.3 Working Principle and Signal Flow

The EFS4 consists of the interface module, service processing module, encapsulation and mapping module, interface converting module, control and communication Module and the power supply module
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Figure 7-12 shows the block diagram for the functions of the EFS4. Figure 7-12 Block diagram for the functions of the EFS4
E N C P Switch fabric
Data Cross-connect unit

Control FE

Ethernet access module

Network processor

D E N C P

V C P

Interface coversion module

Cross-connect unit

Network processor module

Laser shutdown

Mapping module

LOS

Communication and control module

Communication Reference clock and frame header SCC unit SCC unit

+3.3 V +1.5 V

Clock module

+1.8 V +2.5 V

DC/DC converter

DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse

50 77 125 155 MHz MHz MHz MHz

+3.3 V backup power

ENCP: data encapsulation module VCP: virtual concatenation processing module

DENCP: decapsulation module

The function modules of ethernet switching boards are described below:

Ethernet Access Module

In the receive direction, the optical signals from Ethernet equipment, such as switch and router, are converted into electrical signals. For the signals accessed from electrical interfaces, O/E conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS alarms are tested. The electrical signals are converted from serial signals to parallel signals and then sent to network processor. In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer, signals are encoded and converted from electrical signals to optical signals.

Network Processor Module

The network processor module consists of network processor and switch fabric. The network processor first performs MAC functions, which include code conversion, framing of Ethernet packets, CRC check and Ethernet performance statistics. After the striped Ethernet frame enters the core of network processor, the flow is classified as per service type and configuration requirements. The frame is encapsulated or decapsulated. These packets formats are supported:
l l

Multi-protocol label switching (MPLS) L2MPLS VPN

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l

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Ethernet/ VLAN

In the receive direction, services are mapped and forwarded by adding Tunnel and VC double labels as per service configuration. In the transmit direction, Tunnel or VC is extracted as per the level (P or PE) of the equipment. Services are then routed or forwarded. The network processor module:
l l l l l

Supports flow sense and flow classification Supports uni-cast, multi-cast and broadcast of the flow Provides data priority setting Provides weighted fair queuing (WFQ) Provides four classes of services (CoS)

Mapping Module
The mapping module consists of encapsulation and mapping. In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP-F format. The concatenation is processed. The LCAS function is supported. Ethernet signals are then converted into SDH signals. In the downstream direction, SDH signals are demapped. The time delay of virtual concatenation is compensated. After aligning, packets are decapsulated as per encapsulation format. The decapsulated data are transmitted to the network processor module in packets.

Interface Conversion Module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals (LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane interface connects to low-rate interface chip of the transmitting system.

Communication and Control Module

The communication and control module consists of CPU, register, oscillator, Ethernet port and HDLC controller. This module connects to external circuits through bus. The communication and control module:
l l

Manages and configures other modules of the boards. Performs inter-board communication through internal Ethernet interface.

The control module also contains basic logic units. This module enjoys the following functions:
l l l l l l l l

Writes and reads register Provides interface for CPU Checks, selects clock Performs phase discrimination and frequency division to the clock Checks the in-service state of the cross-connect, the SCC and the line boards Controls the shutting down of the optical module Processes communication Control indicators
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Clock Unit
This clock unit tracing the system reference clock and generates the required working clocks for each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.

DC/DC Converter Module

Through the DC/DC module, the power converting unit generates required voltages for each chip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition, this unit also provides protection for the board +3.3 V power supply.

7.6.4 Front Panel

On the front panel of the EFS4, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 7-13 shows the appearance of the front panel of the EFS4. Figure 7-13 Front panel of the EFS4

EFS4
STAT ACT PROG SRV

FE1

FE2

FE3

FE4

EFS4

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Indicators
The following indicators are present on the front panel of the board:
l l l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit. Connection status indicator (LINK), which is green when lit. Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are four FE interfaces on the front panel of the EFS4. Table 7-21 lists the type and usage of the interfaces. Table 7-21 Optical interfaces of the EFS4 Interface FE1 FE2 FE3 FE4 Interface Type RJ-45 RJ-45 RJ-45 RJ-45 Usage Transmits and receives the 10Base-T/100Base-TX signals. Transmits and receives the 10Base-T/100Base-TX signals. Transmits and receives the 10Base-T/100Base-TX signals. Transmits and receives the 10Base-T/100Base-TX signals.

Table 7-22 lists the pins of the RJ-45 interface. Table 7-22 Pins of the RJ-45 of the EFS4 Pin 1 2 3 4 5 6
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Description Transmitting positive Transmitting negative Receiving positive Grounding Grounding Receiving negative
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Pin 7 8

Description Grounding Grounding

7.6.5 Valid Slots

The EFS4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The EFS4 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

7.6.6 Board Configuration Reference

You can use the T2000 to set parameters for the EFS4. You can use the T2000 to set the following parameters for the EFS4:
l l l l

Working mode Enabling of the LCAS Maximum packet length Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.6.7 Technical Specifications

The specifications of the EFS4 cover the mechanical specifications and power consumption.

Mechanical Specifications
The mechanical specifications of the EFS4 are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 1.0

Power Consumption
In the normal temperature (25), the maximum power consumption of the EFS4 is 30 W.

7.7 EGS2
This section describes the EGS2, a 2 x GE Ethernet processing board with Lanswitch, in terms of the version, function, principle, front panel, configuration and specifications. 7.7.1 Version Description The EGS2 has two functional versions, N1 and N2. The two versions have different functions and features. 7.7.2 Function and Feature The EGS2 supports Layer 2 switching, MPLS and broadcast.
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7.7.3 Working Principle and Signal Flow The EGS2 consists of the ethernet access module, network processor module, mapping module, interface converting module, communication and control module and so on. 7.7.4 Front Panel On the front panel of the EGS2, there are indicators, interfaces and barcode. 7.7.5 Valid Slots The EGS2 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The EGS2 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack. 7.7.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the EGS2 indicates the optical interface type. 7.7.7 Board Configuration Reference You can use the T2000 to set parameters for the EGS2. 7.7.8 Technical Specifications The specifications of the EGS2 cover the optical interface specifications, mechanical specifications and power consumption.

7.7.1 Version Description

The EGS2 has two functional versions, N1 and N2. The two versions have different functions and features. Table 7-23 lists the details on the versions of the EGS2 board. Table 7-23 Version Description of the EGS2 Item Functional version Difference Description The EGS2 has two versions, N1 and N2. The maximum uplink bandwidth of the N1EGS2 is 1.25 Gbit/s. The maximum uplink bandwidth of the N2EGS2 is 2.5 Gbit/s. The number of the VCTRUNKs of the N1EGS2 is 24. The number of the VCTRUNKs of the N2EGS2 is 48. The encapsulation formats of the N1EGS2 are GFP, LAPS, and HDLC. The encapsulation format of the N1EGS2 is GFP. The N1EGS2 supports the MartinioP encapsulation of the MPLS. The N2EGS2 does not support the MartinioP encapsulation. The N2EGS2 supports the board version replacement function. Replaceability On certain conditions, the N2EGS2 can replace the N1EGS2. When the N2EGS2 replaces the N1EGS2, the N1EGS2 should not be configured with MartinioP or CoS of the MPLS.

7.7.2 Function and Feature

The EGS2 supports Layer 2 switching, MPLS and broadcast.
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Table 7-24 lists the functions and features of the EGS2. Table 7-24 Functions and features of the EGS2 Function and Feature Basic function Specification of the optical interface EGS2 Processes 2 x GE services. The optical interfaces are 1000Base-SX/LX/ZX Ethernet optical interfaces. The optical interfaces support the auto-negotiation, compliant with IEEE 802.3z. The optical interfaces use the hot-swappable optical module SFP. When multimode optical fiber is used, the maximum transmission distance is 550 m. When single-mode optical fiber is used, the maximum transmission distance is 10 km. The optical modules can be used for different requirements for the transmission distance, such as 40 km and 70 km. Format of service frames Max. uplink bandwidth Number of VCTRUNKs Mapping granularity Encapsulation format Supports Ethernet II, IEEE 802.3, and IEEE 802.1q/p. Supports frames with a length ranging from 64 bytes to 9600 bytes. Supports Jumbo frames with a length less than 9600 bytes. The maximum uplink bandwidth of the N1EGS2 is 1.25 Gbit/s. The maximum uplink bandwidth of the N2EGS2 is 2.5 Gbit/s. The number of the VCTRUNKs of the N1EGS2 is 24. The number of the VCTRUNKs of the N2EGS2 is 48. Supports VC-12, VC-3, VC-12-Xv (X63), and VC-3-Xv (X12). The encapsulation formats for the N1EGS2 are GFP-F, LAPS, and HDLC. The encapsulation format for the N2EGS2 is GFP-F. EPL EVPL Supports transparent transmission based on port. Not supported by the N1EGS2. The N2EGS2 supports EVPL services based on port+VLAN that use the frame encapsulation formats of MartinioE and stack VLAN.

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Function and Feature EPLAN

EGS2 Supports the Layer 2 convergence and point to multipoint convergence. Supports the Layer 2 forwarding function and switching at the client and SDH sides. Supports the function of self-learning the source MAC address. The length of the MAC address table is 16k. The aging time of the MAC address can be set and queried. Supports the configuration of the static MAC route. Supports the creation, deletion and query of the VB. The maximum number of the VBs is 2. The maximum number of logical ports for each VB is 30.

EVPLAN MTU

Supports data isolation based on VB+VLAN. The packet length can be set from 1518 bytes to 9600 bytes. After the packet length setting takes effect, the maximum length of the packets entering or going out from the IP port are limited by the MTU setting. Not supported by the N1EGS2. Supported by the N2EGS2.

MPLS

VLAN VLAN convergence RSTP

Compliant with IEEE 802.1q/p. Supported (4k VLAN). Not supported by the N1EGS2. The N2EGS2 supports broadcast packet suppression and RSTP, compliant with IEEE 802.1w.

Multicast (IGMP Snooping) CAR

Not supported by the N1EGS2. Supported by the N2EGS2. Supported. The granularity is 64 kbit/s.

Service based QoS flow classification LCAS

The N1EGS2 supports the port service, port+VLAN ID service, and port +VLAN PRI service. The N2EGS2 supports the port flow, port+VLAN ID flow, and port +VLAN PRI flow. Not supported by the N1EGS2. The N2EGS2 supports LCAS, compliant with ITU-T G.7042. Dynamically increases or decreases the bandwidth, and realizes the protection function.

LPT Link Aggreation

Supports the LPT function, which can be enabled or disabled. Supported.

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Function and Feature Flow control function Test frame Loopback function Ethernet performance monitoring Alarm and performance event

EGS2 Supports the IEEE 802.3x flow control based on port. Receives and transmits Ethernet test frames. Supports inloop at the Ethernet port (PHY layer or MAC layer). Supports inloop and outloop at the VC-3 level. Supports Ethernet performance monitoring at the port level.

Provides rich alarms and performance events for easy management and maintenance of the equipment.

7.7.3 Working Principle and Signal Flow

The EGS2 consists of the ethernet access module, network processor module, mapping module, interface converting module, communication and control module and so on. Figure 7-14 shows the block diagram for the functions of the EGS2. Figure 7-14 Block diagram for the functions of the EGS2
E N C P Switch fabric
Data Cross-connect unit

Control GE

Ethernet access module

Network processor

D E N C P

V C P

Interface coversion module

Cross-connect unit

Network processor module

Laser shutdown

Mapping module

LOS

Communication and control module

Communication Reference clock and frame header SCC unit SCC unit

+3.3 V +1.5 V

Clock module

+1.8 V +2.5 V

DC/DC converter

DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse

50 77 125 155 MHz MHz MHz MHz

+3.3 V backup power

ENCP: data encapsulation module VCP: virtual concatenation processing module

DENCP: decapsulation module

The function modules of ethernet switching boards are described below:

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Ethernet Access Module

In the receive direction, the optical signals from Ethernet equipment, such as switch and router, are converted into electrical signals. For the signals accessed from electrical interfaces, O/E conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS alarms are tested. The electrical signals are converted from serial signals to parallel signals and then sent to network processor. In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer, signals are encoded and converted from electrical signals to optical signals.

Network Processor Module

The network processor module consists of network processor and switch fabric. The network processor first performs MAC functions, which include code conversion, framing of Ethernet packets, CRC check and Ethernet performance statistics. After the striped Ethernet frame enters the core of network processor, the flow is classified as per service type and configuration requirements. The frame is encapsulated or decapsulated. These packets formats are supported:
l l l

Multi-protocol label switching (MPLS) L2MPLS VPN Ethernet/ VLAN

In the receive direction, services are mapped and forwarded by adding Tunnel and VC double labels as per service configuration. In the transmit direction, Tunnel or VC is extracted as per the level (P or PE) of the equipment. Services are then routed or forwarded. The network processor module:
l l l l l

Supports flow sense and flow classification Supports uni-cast, multi-cast and broadcast of the flow Provides data priority setting Provides weighted fair queuing (WFQ) Provides four classes of services (CoS)

Mapping Module
The mapping module consists of encapsulation and mapping. In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP format. The concatenation is processed. The LCAS function is supported. Ethernet signals are then converted into SDH signals. In the downstream direction, SDH signals are demapped. The time delay of virtual concatenation is compensated. After aligning, packets are decapsulated as per encapsulation format. The decapsulated data are transmitted to the network processor module in packets.

Interface Conversion Module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals (LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane interface connects to low-rate interface chip of the transmitting system.
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Communication and Control Module

The communication and control module consists of CPU, register, oscillator, Ethernet port and HDLC controller. This module connects to external circuits through bus. The communication and control module:
l l

Manages and configures other modules of the boards. Performs inter-board communication through internal Ethernet interface.

The control module also contains basic logic units. This module enjoys the following functions:
l l l l l l l l

Writes and reads register Provides interface for CPU Checks, selects clock Performs phase discrimination and frequency division to the clock Checks the in-service state of the cross-connect, the SCC and the line boards Controls the shutting down of the optical module Processes communication Control indicators

Clock Unit
This clock unit tracing the system reference clock and generates the required working clocks for each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.

DC/DC Converter Module

Through the DC/DC module, the power converting unit generates required voltages for each chip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition, this unit also provides protection for the board +3.3 V power supply.

7.7.4 Front Panel

On the front panel of the EGS2, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 7-15 shows the appearance of the front panel of the EGS2.

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Figure 7-15 Front panel of the EGS2

EGS2
STAT ACT PROG SRV LINK1 ACT1 LINK2 ACT2

CLASS 1 LASER PRODUCT

OUT1 IN1 OUT2 IN2

EGS2

Indicators
The following indicators are present on the front panel of the board:
l l l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit. Connection status indicator (LINK), which is green when lit. Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are two GE interfaces on the front panel of the EGS2. Table 7-25 lists the type and usage of the interfaces.
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Table 7-25 Optical interfaces of the EGS2 Interface OUT1/IN1 OUT2/IN2 Interface Type LC (pluggable) LC (pluggable) Usage Transmits and receives the 1000Base-SX/LX/ZX signals. Transmits and receives the 1000Base-SX/LX/ZX signals.

7.7.5 Valid Slots

The EGS2 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The EGS2 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

7.7.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code of the EGS2 indicates the optical interface type. Table 7-26 lists the relation between the board feature code and optical interface type for the EGS2. Table 7-26 Relation between the board feature code and the optical interface type Board Barcode SSN2EGS210 SSN2EGS211 SSN2EGS212 SSN2EGS213 Feature Code 10 11 12 13 Optical Interface Type 1000Base-SX (0.55 km) 1000Base-LX (10 km) 1000Base-ZX (40 km) 1000Base-ZX (70 km)

7.7.7 Board Configuration Reference

You can use the T2000 to set parameters for the EGS2. You can use the T2000 to set the following parameters for the EGS2:
l l l l

Working mode Enabling of the LCAS Maximum packet length Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.7.8 Technical Specifications

The specifications of the EGS2 cover the optical interface specifications, mechanical specifications and power consumption.
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Optical Interface Specifications

Table 7-27 lists the specifications of the interfaces of the EGS2. Table 7-27 Specifications of the optical interfaces of the EGS2 Item Optical interface type Optical source type Launched optical power (dBm) Central wavelength (nm) Overload optical power (dBm) Receiver sensitivity (dBm) Extinction ratio (dB) Specification 1000Base-ZX (70 km) MLM 4 to +2 1480 to 1580 3 22 9 1000Base-ZX (40 km) MLM 2 to +5 1270 to 1355 3 23 9 1000Base-SX (10 km) MLM 9 to 3 1270 to 1355 3 19 9 1000Base-LX (0.55 km) MLM 9.5 to 0 770 to 860 0 17 9

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the EGS2 are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 1.0

Power Consumption
In the normal temperature (25), the maximum power consumption of the EGS2 is 43 W.

7.8 EMS4
This section describes the EMS4, a 4 x GE and 16 x FE Ethernet transparent transmission and convergence board, in terms of the version, function, principle, front panel, configuration and specifications.

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7.8.1 Version Description The functional version of the EMS4 board is N1. 7.8.2 Function and Feature The EMS4 supports Layer 2 switching, link convergence, and multicast. 7.8.3 Working Principle and Signal Flow The EMS4 consists of the ethernet access module, mapping module, interface conversion module and so on. 7.8.4 Front Panel On the front panel of the EMS4, there are indicators, interfaces and barcode. 7.8.5 Valid Slots The EMS4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. Without the interface board, the EMS4 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack. With the interface board, the EMS4 can be housed in any of slots 1213 in the OptiX OSN 1500B subrack. 7.8.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the EMS4 indicates the optical interface type. 7.8.7 Board Protection The EMS4 supports the board protection switching (BPS) and port protection switching (PPS) protection. 7.8.8 Board Configuration Reference You can use the T2000 to set parameters for the EMS4. 7.8.9 Technical Specifications The specifications of the EMS4 cover the optical interface specifications, laser safety class, mechanical specifications and power consumption.

7.8.1 Version Description

The functional version of the EMS4 board is N1.

7.8.2 Function and Feature

The EMS4 supports Layer 2 switching, link convergence, and multicast. Table 7-28 lists the functions and features of the EMS4. Table 7-28 Functions and features of the EMS4 Function and Feature Basic function EMS4 Accesses and processes 4 x GE services, and processes 16 x FE services.

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Function and Feature Used with the interface board

EMS4 Accesses 16 x FE signals at the electrical interface when used with the ETF8. Accesses 16 x FE signals at the optical interface when used with the EFF8. Accesses 8 x FE signals at the electrical interface and 8 x FE signals at the optical interface when used with the ETF8 and EFF8.

Specification of the optical interface

The optical interfaces are 1000Base-SX/LX/ZX Ethernet optical interfaces. Supports the auto-negotiation, compliant with IEEE 802.3z. The optical interfaces use the hot-swappable optical module SFP. When multimode optical fiber is used, the maximum transmission distance is 550 m. When single-mode optical fiber is used, the maximum transmission distance is 10 km. The optical modules can be used for different requirements for the transmission distance, such as 40 km and 70 km. Supports 10Base-T/100Base-TX signals when used with the ETF8. Supports 100Base-FX signals when used with the EFF8. The optical interfaces are compliant with IEEE 802.3u.

Format of service frames

Supports Ethernet II, IEEE 802.3, IEEE 802.1q TAG, and IEEE 802.1p TAG. Supports frames with a length ranging from 64 bytes to 9216 bytes. Supports Jumbo frames with a length less than 9216 bytes.

Max. uplink bandwidth Mapping granularity VCG Encapsulation format EPL EVPL

2.5 Gbit/s. Virtual concatenation: VC-12, VC-3, VC-4, VC12-Xv (X64), VC3-Xv (X24), and VC4-Xv (X8). A maximum of 64. Supports GFP-F, LAPS, and HDLG. Supports transparent transmission based on port. Supports 42 x bidirectional services. Supports EVPL services based on port+VLAN. Supports a maximum of 8000 links. Supports EVPL services based on QinQ. Supports service forwarding based on port.

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Function and Feature EPLAN

EMS4 Supports the Layer 2 forwarding function and switching at the client and SDH sides. Supports 1k MAC switching or 4K VLAN MAC switching. Supports the function of self-learning the source MAC address. The length of the MAC address table is 128k. The aging time of the MAC address can be set and queried. The configuration of static MAC routes is supported. Supports the creation, deletion and query of VB. The maximum number of VBs is two.

EVPLAN VLAN MTU

Supports data isolation based on VB+VLAN. Supports VLAN and QinQ, the addition, deletion and switching of VLAN labels, compliant with IEEE 802.1q/p. The packet length can be set from 1518 bytes to 9216 bytes. After the packet length setting takes effect, the maximum length of the packets entering or going out from the IP port are limited by the MTU setting. Not supports broadcast packet suppression Supports RSTP, compliant with IEEE 802.1w.

RSTP

Multicast(IGMPSnooping) ETH-OAM

Supported. Supports CC for the multicast and LB test for the unicast, loop detection (LD), auto-negotiation, fault diagnosis, and link performance detection.. Supported. Not supported. Supports manual link convergence and static link convergence. Supported (4096 VLAN) in QinQ service. Supported (4095 VLAN) in EVPL service.

Test frame Service mirroring Link convergence VLAN convergence

Protection CAR

Supports the 1+1 hot backup for the board and the PPS protection. Supported. The granularity is 64 kbit/s.

Flow classification LCAS LPT

Supports the PORT flow, PORT+VLAN ID flow and PORT +SVLAN ID flow. Dynamically increases or decreases the bandwidth, and realizes the protection function, compliant with ITU-T G.7042. Supported.

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Function and Feature Distributed link aggregation Flow control function Loopback function Ethernet performance monitoring Alarm and performance event

EMS4 Supports inter-board link aggregation. Supports the IEEE 802.3x flow control based on port. Supports inloop at the Ethernet port (PHY layer) and outloop at the SDH side. Supports Ethernet performance monitoring RMON at the port level and VCTRUNK. Provides rich alarms and performance events for easy management and maintenance of the equipment.

7.8.3 Working Principle and Signal Flow

The EMS4 consists of the ethernet access module, mapping module, interface conversion module and so on. Figure 7-16 shows the block diagram for the functions of the EMS4. Figure 7-16 Block diagram for the functions of the EMS4
E N C P Switch fabric
Data Cross-connect unit

Control GE/FE Ethernet

access module

Network processor

D E N C P

V C P

Interface coversion module

Cross-connect unit

Network processor module

Laser shutdown

Mapping module

LOS

Communication and control module

Communication Reference clock and frame header SCC unit SCC unit

+3.3 V +1.5 V

Clock module

+1.8 V +2.5 V

DC/DC converter

DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V

50 77 125 155 MHz MHz MHz MHz

ENCP: data encapsulation module VCP: virtual concatenation processing module

DENCP: decapsulation module

In the Transmit Direction

The cross-connect unit transmits the VC-4/VC-3/VC-12 or the virtual concatenation signals to the EGS4 through the backplane. The interface module transmits the signals to the encapsulation
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and mapping module. The encapsulation and mapping module then compensates for the time delay of the virtual concatenation services, aligns frames, demaps and decapsulates the frames, strips the data packets, and transmits the data packets to the service processing module. Finally, the service processing module converges the data and transmits the data through the ethernet physical interface.

In the Receive Direction

The interface module accesses the signals from external Ethernet device, such as the Ethernet switch and router. The interface module then decodes the signals and converts the series signals into parallel signals. The service processing module then aligns the frames, strips the preamble code, terminates the CRC code and performs the Ethernet statistics for the Ethernet performance. In addition, the service processing module classifies the flow (Ethernet or VLAN packet formats) according to the service type and configuration. If the switch is not required on the local, the data services are forwarded to other local ports according to the configuration. If the data services are to be transmitted to the upstream SDH line, the encapsulation module encapsulates the Ethernet frames in the GFP, LAPS or HDLC formats. Finally, the encapsulation module transmits the frames to the mapping module, which maps frames into VC-4/VC-3/VC-12, concatenated frames or a single VC-3 concatenated frame. The interface module then transmits the frames to the cross-connect unit.

Ethernet Access Module

In the receive direction, the optical signals from Ethernet equipment, such as switch and router, are converted into electrical signals. For the signals accessed from electrical interfaces, O/E conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS alarms are tested. The electrical signals are converted from serial signals to parallel signals and then sent to network processor. In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer, signals are encoded and converted from electrical signals to optical signals.

Network Processor Module

The network processor module consists of network processor and switch fabric. The network processor first performs MAC functions, which include code conversion, framing of Ethernet packets, CRC check and Ethernet performance statistics. After the striped Ethernet frame enters the core of network processor, the flow is classified as per service type and configuration requirements. The frame is encapsulated or decapsulated. These packets formats are supported:
l

Ethernet/ VLAN

The network processor module:

l l l l l

Supports flow sense and flow classification Supports uni-cast, multi-cast and broadcast of the flow Provides data priority setting Provides weighted fair queuing (WFQ) Provides four classes of services (CoS)
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Mapping Module
The mapping module consists of encapsulation and mapping. In the upstream direction, this module first encapsulates Ethernet signals in LAPS, GFP-F or HDLC format. The concatenation is processed. The LCAS function is supported. Ethernet signals are then converted into SDH signals. In the downstream direction, SDH signals are demapped. The time delay of virtual concatenation is compensated. After aligning, packets are decapsulated as per encapsulation format. The decapsulated data are transmitted to the network processor module in packets.

Interface Conversion Module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals (LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane interface connects to low-rate interface chip of the transmitting system.

Communication and Control Module

The communication and control module consists of CPU, register, oscillator, Ethernet port and HDLC controller. This module connects to external circuits through bus. The communication and control module:
l l

Manages and configures other modules of the boards. Performs inter-board communication through internal Ethernet interface.

The control module also contains basic logic units. This module enjoys the following functions:
l l l l l l l l

Writes and reads register Provides interface for CPU Checks, selects clock Performs phase discrimination and frequency division to the clock Checks the in-service state of the cross-connect, the SCC and the line boards Controls the shutting down of the optical module Processes communication Control indicators

Clock Unit
This clock unit tracing the system reference clock and generates the required working clocks for each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.

DC/DC Converter Module

Through the DC/DC module, the power converting unit generates required voltages for each chip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V.

7.8.4 Front Panel

On the front panel of the EMS4, there are indicators, interfaces and barcode.
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Appearance of the Front Panel

Figure 7-17 shows the appearance of the front panel of the EMS4. Figure 7-17 Front panel of the EMS4

EMS4
STAT ACT PROG SRV

CLASS 1 LASER PRODUCT

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4

LINK ACT

EMS4

Indicators
The following indicators are present on the front panel of the board:
l l l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit. Connection status indicator (LINK), which is green when lit. Data receiving and transmission indicator (ACT), which is orange when lit.
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For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are four pairs of optical interfaces on the front panel of the EMS4. Table 7-29 lists the type and usage of the optical interfaces. Table 7-29 Optical interfaces of the EMS4 Interface OUT1/IN1 OUT2/IN2 OUT3/IN3 OUT4/IN4 Interface Type LC (pluggable) LC (pluggable) LC (pluggable) LC (pluggable) Usage Transmits and receives the 1000Base-SX/LX/ZX signals. Transmits and receives the 1000Base-SX/LX/ZX signals. Transmits and receives the 1000Base-SX/LX/ZX signals. Transmits and receives the 1000Base-SX/LX/ZX signals.

7.8.5 Valid Slots

The EMS4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. Without the interface board, the EMS4 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack. With the interface board, the EMS4 can be housed in any of slots 1213 in the OptiX OSN 1500B subrack. The EMS4 can be used with the ETF8 and EFF8. Table 7-30 and Table 7-31 list the valid slots for the EMS4 and corresponding slots for the ETF8 and EFF8. Table 7-30 Valid slots for the EMS4 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500A subrack Valid Slot for the EMS4 Slot 12 Slot 13 Corresponding Slot for the ETF8 and EFF8 Without the interface board Without the interface board

Table 7-31 Valid slots for the EMS4 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500B subrack Valid Slot for the EMS4 Slot 11
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Corresponding Slot for the ETF8 and EFF8 Without the interface board

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Valid Slot for the EMS4 Slot 12 Slot 13

Corresponding Slot for the ETF8 and EFF8 Slots 14 and 15 Slots 16 and 17

7.8.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code of the EMS4 indicates the optical interface type. Table 7-32 lists the relation between the board feature code and optical interface type for the EMS4. Table 7-32 Relation between the board feature code and the optical interface type Board Barcode SSN1EMS410 SSN1EMS411 SSN1EMS412 SSN1EMS413 Feature Code 10 11 12 13 Optical Interface Type 1000Base-LX (0.55 km) 1000Base-SX (10 km) 1000Base-ZX (40 km) 1000Base-ZX (70 km)

7.8.7 Board Protection

The EMS4 supports the board protection switching (BPS) and port protection switching (PPS) protection.

Protection Principle
When the BPS protection is performed to the EMS4, the GE and FE ports use the single-fed dual-selective scheme to get protected. The EMS4 has four four GE ports and 16 FE ports, which may be connected to many communication devices. Normally, the active board is working and services are transmitted in the two directions of the active link. On the backup link, the EMS4 disables the transmission of all ports. In this case, the ports of opposite board are in the Linkdown state. At the same time, the opposite board enables the transmission and does not transmit services. In this way, the receive ports of the backup EMS4 are not in the Linkdown state. The solid lines in Figure 7-18 show how the EMS4 normally works.

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Figure 7-18 Normal working of the EMS4

Active communication equipment

No.1

A
Standby communication equipment

Active EMS4
No.2

No.3

XCS

Active communication equipment

B
No.1 No.2

Standby communication equipment

Standby EMS4

No.3

Active communication equipment Standby communication equipment

BPS Protection

For the BPS protection, when the active board detects the Linkdown fault of any link or any board fault, the cross-connect board switches all services to the standby board. In this way, services are protected. As the solid lines shown in Figure 7-19. The services numbered 1, 2 and 3 are all switched to the standby EMS4 and corresponding communication equipment.

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Figure 7-19 Principle of the BPS protection for the EMS4

Active communication equipment Standby communication equipment

No.1

Active EMS4
No.2

No.3

XCS

Active communication equipment

B
No.1 No.2

Standby communication equipment

Standby EMS4

No.3

Active communication equipment Standby communication equipment

PPS Protection

For the PPS protection, when the active board detects the Linkdown fault of any link or any board fault, the cross-connect board switches all services to the standby board. In this way, services are protected. The solid lines in Figure 7-20 show how the PPS protection is performed. Only the service numbered 1 is switched to the standby EMS4 and the standby communication equipment.

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Figure 7-20 Principle of the PPS protection for the EMS4

Active communication equipment

No.1

A
Standby communication equipment

Active EMS4
No.2

No.3 Active communication equipment

XCS

B
No.1 No.2 Standby communication equipment

Standby EMS4

No.3

Active communication equipment

Standby communication equipment

The conditions that trigger the protection for the EMS4 are as follows:
l l

Fault at at the PHY layer of the MAC port, also Linkdown Fault in key board hardware units, such as the power supply module and the optical module

WARNING
When the board-level protection is performed, FE ports only support the 100M full duplex mode and GE ports support the auto-negotiation and 1000M full duplex mode.

Board Configuration
Two EMS4 boards should be configured for the protection. One EMS4 is the active board and the other is the standby board. For the configuration of the EMS4 board protection, it is required that the access capacity of the protection slot must be not less than the access capacity of the working slot.

7.8.8 Board Configuration Reference

You can use the T2000 to set parameters for the EMS4. You can use the T2000 to set the following parameters for the EMS4:
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l l l l

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Working mode Enabling of the LCAS Maximum packet length Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.8.9 Technical Specifications

The specifications of the EMS4 cover the optical interface specifications, laser safety class, mechanical specifications and power consumption.

Optical Interface Specifications

Table 7-33 lists the specifications of the interfaces of the EMS4. Table 7-33 Specifications of the optical interfaces of the EMS4 Item Optical interface type Optical source type Launched optical power (dBm) Central wavelength (nm) Overload optical power (dBm) Receiver sensitivity (dBm) Extinction ratio (dB) Specification 1000Base-ZX (70 km) MLM 4 to +2 1480 to 1580 3 22 9 1000Base-ZX (40 km) MLM 2 to +5 1270 to 1355 3 23 9 1000Base-SX (10 km) MLM 9 to 3 1270 to 1355 3 19 9 1000Base-LX (0.55 km) MLM 9.5 to 0 770 to 860 0 17 9

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the EMS4 are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 1.1
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Power Consumption
In the normal temperature (25), the maximum power consumption of the EMS4 is 65 W if the EMS4 is not used with an interface board. In the normal temperature (25), the maximum power consumption of the EMS4 is 75 W if the EMS4 is used with an interface board.

7.9 EGS4
This section describes the EGS4, a 4 x GE Ethernet convergence board, in terms of the version, function, principle, front panel, configuration and specifications. 7.9.1 Version Description The EGS4 has two functional versions, N1 and N3. 7.9.2 Function and Feature The EGS4 supports Layer 2 switching, MPLS and broadcast. 7.9.3 Working Principle and Signal Flow The EGS4 consists of the interface module, service processing module, encapsulation and mapping module, interface converting module, control and communication module and the power supply module. 7.9.4 Front Panel On the front panel of the EGS4, there are indicators, interfaces and barcode. 7.9.5 Valid Slots The EGS4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The EGS4 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack. 7.9.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the EGS4 indicates the optical interface type. 7.9.7 Board Protection The EGS4 supports the board protection switching (BPS) and port protection switching (PPS) protection. 7.9.8 Board Configuration Reference You can use the T2000 to set parameters for the EGS4. 7.9.9 Technical Specifications The specifications of the EGS4 cover the optical interface specifications, laser safety class, mechanical specifications and power consumption.

7.9.1 Version Description

The EGS4 has two functional versions, N1 and N3. Table 7-34 lists the details on the versions of the EGS4 board.

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Table 7-34 Version Description of the EGS4 Item Functional version Difference Description The EGS4 has two functional versions, N1 and N3. The N1EGS4 supports the binding to a maximum of 1008 VC12s. The N3EGS4 supports the binding to a maximum of 504 VC12s:
l

VC4/VC3:These VC4s/VC3s belong in the following two ranges: VC4-1 to VC4-8 and VC4-9 to VC4-16. The VC4s/VC3s of only one range can be bound at a time. VC12:These VC12s belong in the following two ranges: VC4-1 to VC4-4 and VC4-9 to VC4-12. The VC12s of only one range can be bound at a time.

Replaceability

The versions cannot be replaced by each other.

7.9.2 Function and Feature

The EGS4 supports Layer 2 switching, MPLS and broadcast. Table 7-35 lists the functions and features of the EGS4. Table 7-35 Functions and features of the EGS4 Function and Feature Basic function Specification of the optical interface EGS4 Accesses and processes 4 x GE services. The optical interfaces are 1000Base-SX/LX/ZX Ethernet optical interfaces. The optical interfaces support the auto-negotiation, compliant with IEEE 802.3z. The optical interfaces use the hot-swappable optical module SFP. When multimode optical fiber is used, the maximum transmission distance is 550 m. When single-mode optical fiber is used, the maximum transmission distance is 10 km. The optical modules can be used for different requirements for the transmission distance, such as 40 km and 70 km. Format of service frames Supports Ethernet II, IEEE 802.3, IEEE 802.1q TAG, and IEEE 802.1p TAG. Supports frames with a length ranging from 64 bytes to 9216 bytes. Supports Jumbo frames with a length less than 9216 bytes. Max. uplink bandwidth 2.5 Gbit/s.

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Function and Feature Mapping granularity VCG Encapsulation format EPL EVPL

EGS4 Virtual concatenation: VC-12, VC-3, VC-4, VC12-Xv (X64), VC3-Xv (X24), and VC4-Xv (X8). 64 to the maximum. Supports GFP-F, LAPS, and HDLG. Supports transparent transmission based on port. Supports EVPL services based on port+VLAN. Supports a maximum of 8000 links. Supports EVPL services based on QinQ. Supports service forwarding based on port.

EPLAN

Supports the Layer 2 forwarding function and switching at the client and SDH sides. Supports 1k MAC switching or 4k VLAN MAC switching. Supports the function of self-learning the source MAC address. The length of the MAC address table is 128k. The aging time of the MAC address can be set and queried. The configuration of static MAC routes is supported. Supports data isolation based on VB+VLAN. Supports the creation, deletion and query of VB. The maximum number of VBs is two.

VLAN MTU

Supports VLAN and QinQ, the addition, deletion and switching of VLAN labels, compliant with IEEE 802.1q/p. The packet length can be set from 1518 bytes to 9216 bytes. After the packet length setting takes effect, the maximum length of the packets entering or going out from the IP port are limited by the MTU setting. Not supports broadcast packet suppression Supports RSTP, compliant with IEEE 802.1w.

RST

Multicast(IGMPSnooping) ETH-OAM

Supported. Supports CC for the multicast and LB test for the unicast, loop detection (LD), auto-negotiation, fault diagnosis, and link performance detection... Supported. Not supported. Supports manual link convergence and static link convergence. Supported (4096 VLAN) in QinQ service. Supported (4095 VLAN) in EVPL service.

Test frame Service mirroring Link convergence VLAN convergence

Protection
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Supports the 1+1 hot backup for the board and the PPS protection.
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Function and Feature CAR

EGS4 Supported. The granularity is 64 kbit/s. N1EGS4 Supports 512 rate, EGS4 Supports 60 rate.

Flow classification LCAS LPT Distributed link aggregation Flow control function Loopback function Ethernet performance monitoring Alarm and performance event

Supports the port flow and port+VLAN ID flow. Dynamically increases or decreases the bandwidth, and realizes the protection function, compliant with ITU-T G.7042. Supported. Supports inter-board link aggregation. Supports the IEEE 802.3x flow control based on port. Supports inloop at the Ethernet port (PHY layer). Supports Ethernet performance monitoring RMON at the port level and VCTRUNK. Provides rich alarms and performance events for easy management and maintenance of the equipment.

7.9.3 Working Principle and Signal Flow

The EGS4 consists of the interface module, service processing module, encapsulation and mapping module, interface converting module, control and communication module and the power supply module. Figure 7-21 shows the block diagram for the functions of the EGS4.

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Figure 7-21 Block diagram for the functions of the EGS4

E N C P Switch fabric
Data Cross-connect unit

Control GE

Ethernet access module

Network processor

D E N C P

V C P

Interface coversion module

Cross-connect unit

Network processor module

Laser shutdown

Mapping module

LOS

Communication and control module

Communication Reference clock and frame header SCC unit SCC unit

+3.3 V +1.5 V

Clock module

+1.8 V +2.5 V

DC/DC converter

DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V

50 77 125 155 MHz MHz MHz MHz

In the Transmit Direction

The cross-connect unit transmits the VC-4/VC-3/VC-12 or the virtual concatenation signals to the EGS4 through the backplane. The interface module transmits the signals to the encapsulation and mapping module. The encapsulation and mapping module then compensates for the time delay of the virtual concatenation services, aligns frames, demaps and decapsulates the frames, strips the data packets, and transmits the data packets to the service processing module. Finally, the service processing module converges the data and transmits the data through the ethernet physical interface.

In the Receive Direction

The interface module accesses the 1000Base-SX/LX/ZX signals from external Ethernet device, such as the Ethernet switch and router. The interface module then decodes the signals and converts the series signals into parallel signals. The service processing module then aligns the frames, strips the preamble code, terminates the CRC code and performs the Ethernet statistics for the Ethernet performance. In addition, the service processing module classifies the flow (Ethernet or VLAN packet formats) according to the service type and configuration. If the switch is not required on the local, the data services are forwarded to other local ports according to the configuration. If the data services are to be transmitted to the upstream SDH line, the encapsulation module encapsulates the Ethernet frames in the GFP-F, LAPS or HDLC formats. Finally, the encapsulation module transmits the frames to the mapping module, which maps frames into VC-4/VC-3/VC-12 or concatenated frames. The interface module then transmits the frames to the cross-connect unit.

Ethernet Access Module

In the receive direction, the optical signals from Ethernet equipment, such as switch and router, are converted into electrical signals. For the signals accessed from electrical interfaces, O/E
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conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS alarms are tested. The electrical signals are converted from serial signals to parallel signals and then sent to network processor. In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer, signals are encoded and converted from electrical signals to optical signals.

Network Processor Module

The network processor module consists of network processor and switch fabric. The network processor first performs MAC functions, which include code conversion, framing of Ethernet packets, CRC check and Ethernet performance statistics. After the striped Ethernet frame enters the core of network processor, the flow is classified as per service type and configuration requirements. The frame is encapsulated or decapsulated. These packets formats are supported:
l

Ethernet/ VLAN

The network processor module:

l l l l l

Supports flow sense and flow classification Supports uni-cast, multi-cast and broadcast of the flow Provides data priority setting Provides weighted fair queuing (WFQ) Provides four classes of services (CoS)

Mapping Module
The mapping module consists of encapsulation and mapping. In the upstream direction, this module first encapsulates Ethernet signals in LAPS, GFP-F or HDLC format. The concatenation is processed. The LCAS function is supported. Ethernet signals are then converted into SDH signals. In the downstream direction, SDH signals are demapped. The time delay of virtual concatenation is compensated. After aligning, packets are decapsulated as per encapsulation format. The decapsulated data are transmitted to the network processor module in packets.

Interface Conversion Module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals (LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane interface connects to low-rate interface chip of the transmitting system.

Communication and Control Module

The communication and control module consists of CPU, register, oscillator, Ethernet port and HDLC controller. This module connects to external circuits through bus. The communication and control module:
l l

Manages and configures other modules of the boards. Performs inter-board communication through internal Ethernet interface.
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The control module also contains basic logic units. This module enjoys the following functions:
l l l l l l l l

Writes and reads register Provides interface for CPU Checks, selects clock Performs phase discrimination and frequency division to the clock Checks the in-service state of the cross-connect, the SCC and the line boards Controls the shutting down of the optical module Processes communication Control indicators

Clock Unit
This clock unit tracing the system reference clock and generates the required working clocks for each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.

DC/DC Converter Module

Through the DC/DC module, the power converting unit generates required voltages for each chip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V.

7.9.4 Front Panel

On the front panel of the EGS4, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 7-22 shows the appearance of the front panel of the EGS4.

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Figure 7-22 Front panel of the EGS4

EGS4
STAT ACT PROG SRV

CLASS 1 LASER PRODUCT

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4

LINK ACT

EGS4

Indicators
The following indicators are present on the front panel of the board:
l l l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit. Connection status indicator (LINK), which is green when lit. Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are four pairs of optical interfaces on the front panel of the EGS4. Table 7-36 lists the type and usage of the optical interfaces.

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Table 7-36 Optical interfaces of the EGS4 Interface OUT1/IN1 OUT2/IN2 OUT3/IN3 OUT4/IN4 Interface Type LC (pluggable) LC (pluggable) LC (pluggable) LC (pluggable) Usage Transmits and receives the 1000Base-SX/LX/ZX signals. Transmits and receives the 1000Base-SX/LX/ZX signals. Transmits and receives the 1000Base-SX/LX/ZX signals. Transmits and receives the 1000Base-SX/LX/ZX signals.

7.9.5 Valid Slots

The EGS4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The EGS4 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

7.9.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code of the EGS4 indicates the optical interface type. Table 7-37 lists the relation between the board feature code and optical interface type for the EGS4. Table 7-37 Relation between the board feature code and the optical interface type Board Barcode SSN1EGS410, SSN3EGS410 SSN1EGS411, SSN3EGS411 SSN1EGS412, SSN3EGS412 SSN1EGS413, SSN3EGS413 Feature Code 10 11 12 13 Optical Interface Type 1000Base-SX (0.55 km) 1000Base-LX (10 km) 1000Base-ZX (40 km) 1000Base-ZX (70 km)

7.9.7 Board Protection

The EGS4 supports the board protection switching (BPS) and port protection switching (PPS) protection.

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Protection Principle
When the BPS protection is performed to the EGS4, the GE and FE ports use the single-fed dualselective scheme to get protected. The EGS4 has four four GE ports and 16 FE ports, which may be connected to many communication devices. Normally, the active board is working and services are transmitted in the two directions of the active link. On the standby link, the EGS4 disables the transmission of all ports. In this case, the ports of the opposite board are in the Linkdown state. At the same time, the opposite board enables the transmission and does not transmit services. In this way, the receive ports of the standby EGS4 are not in the Linkdown state. The solid lines in Figure 7-23 show how the EGS4 normally works. Figure 7-23 Normal working of the EGS4
Active communication equipment Standby communication equipment

No.1

Active EGS4
No.2

No.3

XCS

Active communication equipment

B
No.1 No.2

Standby communication equipment

Standby EGS4

No.3

Active communication equipment Standby communication equipment

BPS Protection

For the BPS protection, when the active board detects the Linkdown fault of any link or any board fault, the cross-connect board switches all services to the standby board. In this way, services are protected. The lines in Figure 7-24 show how the BPS protection is performed. The services numbered 1, 2 and 3 are all switched to the standby EGS4 and corresponding communication equipment.

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Figure 7-24 Principle of the BPS protection for the EGS4

Active communication equipment Standby communication equipment

No.1

Active EGS4
No.2

No.3

XCS
No.1 No.2

Active communication equipment

B
Standby communication equipment

Standby EGS4

No.3

Active communication equipment Standby communication equipment

PPS Protection

For the PPS protection, when the active board detects the Linkdown fault of any link or any board fault, the cross-connect board switches all services to the standby board. In this way, services are protected. The solid lines in Figure 7-25 show how the PPS protection is performed. Only the service numbered 1 is switched to the standby EGS4 and the standby communication equipment.

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Figure 7-25 Principle of the PPS protection for the EGS4

Active communication equipment

No.1

A
Standby communication equipment

Active EGS4
No.2

No.3 Active communication equipment

XCS
No.1 No.2

B
Standby communication equipment

Standby EGS4

No.3

Active communication equipment

Standby communication equipment

The conditions that trigger the protection for the EGS4 are as follows:
l l

Fault at at the PHY layer of the MAC port, also Linkdown Fault in key board hardware units, such as the power supply module and the optical module

WARNING
When the protection is performed, the GE ports support auto-negotiation and 1000M full duplex modes.

Board Configuration
Two EGS4 boards should be configured for the protection. One EGS4 is the active board and the other is the standby board. For the configuration of the EGS4 board protection, it is required that the access capacity of the protection slot must be not less than the access capacity of the working slot.

7.9.8 Board Configuration Reference

You can use the T2000 to set parameters for the EGS4. You can use the T2000 to set the following parameters for the EGS4:
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l l l l

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Working mode Enabling of the LCAS Maximum packet length Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.9.9 Technical Specifications

The specifications of the EGS4 cover the optical interface specifications, laser safety class, mechanical specifications and power consumption.

Optical Interface Specifications

Table 7-38 lists the specifications of the interfaces of the EGS4. Table 7-38 Specifications of the optical interfaces of the EGS4 Item Optical interface type Optical source type Launched optical power (dBm) Central wavelength (nm) Overload optical power (dBm) Receiver sensitivity (dBm) Extinction ratio (dB) Specification 1000Base-ZX (70 km) MLM 4 to +2 14801580 3 22 9 1000Base-ZX (40 km) MLM 2 to +5 12701355 3 23 9 1000Base-LX (10 km) MLM 9 to 3 12701355 3 19 9 1000Base-SX (0.55 km) MLM 9.5 to 0 770860 0 17 9

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the EGS4 are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 1.1
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Power Consumption
In the normal temperature (25), the maximum power consumption of the EGS4 is 70 W.

7.10 EGS4A
This section describes the EGS4A, a 4 x GE Ethernet convergence board, in terms of the version, function, principle, front panel, configuration and specifications. 7.10.1 Version Description The functional version of the EGS4A board is N2. 7.10.2 Function and Feature The EGS4A supports Layer 2 switching, MPLS and broadcast. 7.10.3 Working Principle and Signal Flow The EGS4A consists of the interface module, service processing module, encapsulation and mapping module, interface converting module, control and communication module and the power supply module. 7.10.4 Front Panel On the front panel of the EGS4A, there are indicators, interfaces and barcode. 7.10.5 Valid Slots The EGS4A can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The EGS4A can be housed in any of slots 1113 in the OptiX OSN 1500B subrack. 7.10.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the EGS4A indicates the optical interface type. 7.10.7 Board Protection The EGS4A supports the board protection switching (BPS). 7.10.8 Board Configuration Reference You can use the T2000 to set parameters for the EGS4A. 7.10.9 Technical Specifications The specifications of the EGS4A cover the optical interface specifications, laser safety class, mechanical specifications and power consumption.

7.10.1 Version Description

The functional version of the EGS4A board is N2.

7.10.2 Function and Feature

The EGS4A supports Layer 2 switching, MPLS and broadcast. Table 7-39 lists the functions and features of the EGS4A.

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Table 7-39 Functions and features of the EGS4A Function and Feature Basic function Specification of the optical interface EGS4A Accesses and processes 4 x GE services. The optical interfaces are 1000Base-SX/LX/ZX Ethernet optical interfaces. The optical interfaces support the auto-negotiation, compliant with IEEE 802.3z. The optical interfaces use the hot-swappable optical module SFP. When multimode optical fiber is used, the maximum transmission distance is 550 m. When single-mode optical fiber is used, the maximum transmission distance is 10 km. The optical modules can be used for different requirements for the transmission distance, such as 40 km and 70 km. Format of service frames Supports Ethernet II, IEEE 802.3, IEEE 802.1q TAG, and IEEE 802.1p TAG. Supports frames with a length ranging from 64 bytes to 9216 bytes. Supports Jumbo frames with a length less than 9216 bytes. Max. uplink bandwidth Mapping granularity VCG Encapsulation format EPL EVPL 2.5 Gbit/s. VC4-4c, VC4-16c, VC3-Xv (X48), and VC4-Xv (X16). 32 Supports GFP-F, LAPS, and HDLG. Supports transparent transmission based on port. Support port+VLAN-based EVPL service and service forward. Support QinQ-based EVPL service and service forward. Support port-based service forward. EPLAN Support Layer 2 switching. Support self-learning of MAC address. Support setting and querying the MAC address aging time. The MAC address table has 64k entries. Support configuration of static MAC route. Support creating, deleting and querying a VB. The maximum number of VBs is 30 and that of logic ports is 64 for each VB. EVPLAN Support virtual bridge (VB) + VLAN based data isolation. Support creating, deleting and querying the VLAN broadcast table. VLAN Supports VLAN and QinQ, the addition, deletion and switching of VLAN labels, compliant with IEEE 802.1q/p.

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Function and Feature MTU

EGS4A The packet length can be set from 1518 bytes to 1535 bytes. After the packet length setting takes effect, the maximum length of the packets entering or going out from the IP port are limited by the MTU setting. Not support. Not support. Support Multicast CC, LB testing, fault detection in compliance with IEEE 802.1ag and 802.3ah. Supported. Not supported. Support manual link aggregation and static link aggregation. Supported (4096 VLAN). Supports the BPS protection. Support the settings of four parameters: CIR, CBS, PIR and PBS. Support the traffic classification based on PORT, PORT+VLAN, PORT+VLAN+PRI, PORT+S and PORT+S+C. Dynamically increases or decreases the bandwidth, and realizes the protection function, compliant with ITU-T G.7042. Not supported. Supports inter-board link aggregation. Supports the IEEE 802.3x flow control based on port. Supports inloop at the Ethernet port (PHY layer). Supports Ethernet performance monitoring RMON at the port level and VCTRUNK. Provides rich alarms and performance events for easy management and maintenance of the equipment.

RST Multicast(IGMPSnooping) ETH-OAM Test frame Service mirroring Link convergence VLAN convergence Protection CAR Flow classification LCAS LPT Distributed link aggregation Flow control function Loopback function Ethernet performance monitoring Alarm and performance event

7.10.3 Working Principle and Signal Flow

The EGS4A consists of the interface module, service processing module, encapsulation and mapping module, interface converting module, control and communication module and the power supply module. Figure 7-26 shows the block diagram for the functions of the EGS4A.
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Figure 7-26 Block diagram for the functions of the EGS4A

E N C P Switch fabric
Data Cross-connect unit

Control GE

Ethernet access module

Network processor

D E N C P

V C P

Interface coversion module

Cross-connect unit

Network processor module

Laser shutdown

Mapping module

LOS

Communication and control module

Communication Reference clock and frame header SCC unit SCC unit

+3.3 V +1.5 V

Clock module

+1.8 V +2.5 V

DC/DC converter

DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V

50 77 125 155 MHz MHz MHz MHz

In the Transmit Direction

The cross-connect unit transmits the VC-4/VC-3/VC-12 or the virtual concatenation signals to the EGS4A through the backplane. The interface module transmits the signals to the encapsulation and mapping module. The encapsulation and mapping module then compensates for the time delay of the virtual concatenation services, aligns frames, demaps and decapsulates the frames, strips the data packets, and transmits the data packets to the service processing module. Finally, the service processing module converges the data and transmits the data through the ethernet physical interface.

In the Receive Direction

The interface module accesses the 1000Base-SX/LX/ZX signals from external Ethernet device, such as the Ethernet switch and router. The interface module then decodes the signals and converts the series signals into parallel signals. The service processing module then aligns the frames, strips the preamble code, terminates the CRC code and performs the Ethernet statistics for the Ethernet performance. In addition, the service processing module classifies the flow (Ethernet or VLAN packet formats) according to the service type and configuration. If the switch is not required on the local, the data services are forwarded to other local ports according to the configuration. If the data services are to be transmitted to the upstream SDH line, the encapsulation module encapsulates the Ethernet frames in the GFP, LAPS or HDLC formats. Finally, the encapsulation module transmits the frames to the mapping module, which maps frames into VC-4/VC-3/VC-12 or concatenated frames. The interface module then transmits the frames to the cross-connect unit.

Ethernet Access Module

In the receive direction, the optical signals from Ethernet equipment, such as switch and router, are converted into electrical signals. For the signals accessed from electrical interfaces, O/E
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conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS alarms are tested. The electrical signals are converted from serial signals to parallel signals and then sent to network processor. In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer, signals are encoded and converted from electrical signals to optical signals.

Network Processor Module

The network processor module consists of network processor and switch fabric. The network processor first performs MAC functions, which include code conversion, framing of Ethernet packets, CRC check and Ethernet performance statistics. After the striped Ethernet frame enters the core of network processor, the flow is classified as per service type and configuration requirements. The frame is encapsulated or decapsulated. These packets formats are supported:
l

Ethernet/ VLAN

The network processor module:

l l l l l

Supports flow sense and flow classification Supports uni-cast, multi-cast and broadcast of the flow Provides data priority setting Provides weighted fair queuing (WFQ) Provides four classes of services (CoS)

Mapping Module
The mapping module consists of encapsulation and mapping. In the upstream direction, this module first encapsulates Ethernet signals in LAPS, GFP or HDLC format. The concatenation is processed. The LCAS function is supported. Ethernet signals are then converted into SDH signals. In the downstream direction, SDH signals are demapped. The time delay of virtual concatenation is compensated. After aligning, packets are decapsulated as per encapsulation format. The decapsulated data are transmitted to the network processor module in packets.

Interface Conversion Module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals (LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane interface connects to low-rate interface chip of the transmitting system.

Communication and Control Module

The communication and control module consists of CPU, register, oscillator, Ethernet port and HDLC controller. This module connects to external circuits through bus. The communication and control module:
l l

Manages and configures other modules of the boards. Performs inter-board communication through internal Ethernet interface.
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The control module also contains basic logic units. This module enjoys the following functions:
l l l l l l l l

Writes and reads register Provides interface for CPU Checks, selects clock Performs phase discrimination and frequency division to the clock Checks the in-service state of the cross-connect, the SCC and the line boards Controls the shutting down of the optical module Processes communication Control indicators

Clock Unit
This clock unit tracing the system reference clock and generates the required working clocks for each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.

DC/DC Converter Module

Through the DC/DC module, the power converting unit generates required voltages for each chip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V.

7.10.4 Front Panel

On the front panel of the EGS4A, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 7-27 shows the appearance of the front panel of the EGS4A.

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Figure 7-27 Front panel of the EGS4A

EGS4A
STAT ACT PROG SRV

CLASS 1 LASER PRODUCT

LINK ACT

EGS4A

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4

Indicators
The following indicators are present on the front panel of the board:
l l l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit. Connection status indicator (LINK), which is green when lit. Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are four pairs of optical interfaces on the front panel of the EGS4A. Table 7-40 lists the type and usage of the optical interfaces.
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Table 7-40 Optical interfaces of the EGS4A Interface OUT1/IN1 OUT2/IN2 OUT3/IN3 OUT4/IN4 Interface Type LC (pluggable) LC (pluggable) LC (pluggable) LC (pluggable) Usage Transmits and receives the 1000Base-SX/LX/ZX signals. Transmits and receives the 1000Base-SX/LX/ZX signals. Transmits and receives the 1000Base-SX/LX/ZX signals. Transmits and receives the 1000Base-SX/LX/ZX signals.

7.10.5 Valid Slots

The EGS4A can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The EGS4A can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

7.10.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code of the EGS4A indicates the optical interface type. Table 7-41 lists the relation between the board feature code and optical interface type for the EGS4A. Table 7-41 Relation between the board feature code and the optical interface type Board Barcode SSN1EGS4A10 SSN1EGS4A11 SSN1EGS4A12 SSN1EGS4A13 Feature Code 10 11 12 13 Optical Interface Type 1000Base-SX (0.55 km) 1000Base-LX (10 km) 1000Base-ZX (40 km) 1000Base-ZX (70 km)

7.10.7 Board Protection

The EGS4A supports the board protection switching (BPS).

Protection Principle
When the BPS protection is performed to the EGS4A, the GE and FE ports use the single-fed dual-selective scheme to get protected. The EGS4A has four four GE ports and 16 FE ports, which may be connected to many communication devices. Normally, the active board is working and services are transmitted in the two directions of the active link. On the standby link, the EGS4A disables the transmission of all ports. In this case, the ports of the opposite board are in
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the Linkdown state. At the same time, the opposite board enables the transmission and does not transmit services. In this way, the receive ports of the standby EGS4A are not in the Linkdown state. The solid lines in Figure 7-28 show how the EGS4A normally works. Figure 7-28 Normal working of the EGS4A
Active communication equipment Standby communication equipment

No.1

Active EGS4
No.2

No.3

XCS

Active communication equipment

B
No.1 No.2

Standby communication equipment

Standby EGS4

No.3

Active communication equipment Standby communication equipment

BPS Protection For the BPS protection, when the active board detects the Linkdown fault of any link or any board fault, the cross-connect board switches all services to the standby board. In this way, services are protected. The lines in Figure 7-29 show how the BPS protection is performed. The services numbered 1, 2 and 3 are all switched to the standby EGS4A and corresponding communication equipment.

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Figure 7-29 Principle of the BPS protection for the EGS4A

Active communication equipment Standby communication equipment

No.1

Active EGS4
No.2

No.3

XCS
No.1 No.2

Active communication equipment

B
Standby communication equipment

Standby EGS4

No.3

Active communication equipment Standby communication equipment

The conditions that trigger the protection for the EGS4A are as follows:
l l

Fault at at the PHY layer of the MAC port, also Linkdown Fault in key board hardware units, such as the power supply module and the optical module

WARNING
When the protection is performed, the GE ports support auto-negotiation and 1000M full duplex modes.

Board Configuration
Two EGS4A boards should be configured for the protection. One EGS4A is the active board and the other is the standby board. For the protection, the access capacity of the slot for the standby board must be larger than that of the slot for the active board.

7.10.8 Board Configuration Reference

You can use the T2000 to set parameters for the EGS4A. You can use the T2000 to set the following parameters for the EGS4A:
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l l l l

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Working mode Enabling of the LCAS Maximum packet length Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.10.9 Technical Specifications

The specifications of the EGS4A cover the optical interface specifications, laser safety class, mechanical specifications and power consumption.

Optical Interface Specifications

Table 7-42 lists the specifications of the interfaces of the EGS4A. Table 7-42 Specifications of the optical interfaces of the EGS4A Item Optical interface type Optical source type Launched optical power (dBm) Central wavelength (nm) Overload optical power (dBm) Receiver sensitivity (dBm) Extinction ratio (dB) Specification 1000Base-ZX (70 km) MLM 4 to +2 14801580 3 22 9 1000Base-ZX (40 km) MLM 2 to +5 12701355 3 23 9 1000Base-LX (10 km) MLM 9 to 3 12701355 3 19 9 1000Base-SX (0.55 km) MLM 9.5 to 0 770860 0 17 9

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the EGS4A are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 1.1
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Power Consumption
In the normal temperature (25), the maximum power consumption of the EGS4A is 53 W.

7.11 EGR2
This section describes the EGR2, a 2 x GE Ethernet processing board, in terms of the version, function, principle, front panel, configuration and specifications. 7.11.1 Version Description The functional version of the EGR2 board is N2. 7.11.2 Function and Feature The EGR2 supports Layer 2 switching, port convergence, and RPR. 7.11.3 Working Principle and Signal Flow The EGR2 consists of the ethernet processing module, network processor module, RPR protocol processing module and so on. 7.11.4 Front Panel On the front panel of the EGR2, there are indicators, interfaces, barcode and laser safety class label. 7.11.5 Valid Slots The EGR2 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The EGR2 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack. 7.11.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the EGR2 indicates the optical interface type. 7.11.7 Board Configuration Reference You can use the T2000 to set parameters for the EGR2. 7.11.8 Technical Specifications The technical specifications of the EGR2 cover the optical interface specifications, board dimensions, weight and power consumption.

7.11.1 Version Description

The functional version of the EGR2 board is N2.

7.11.2 Function and Feature

The EGR2 supports Layer 2 switching, port convergence, and RPR. Table 7-43 lists the functions and features of the EGR2. Table 7-43 Functions and features of the EGR2 Function and Feature Basic function
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EGR2 Accesses and processes 2 x GE services. Supports the RPR feature.

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Function and Feature Specification of the optical interface

EGR2 The optical interfaces are 1000Base-SX/LX/ZX Ethernet optical interfaces. The optical interfaces support the auto-negotiation, compliant with IEEE 802.3z. The optical interfaces use the hot-swappable optical module SFP. When multimode optical fiber is used, the maximum transmission distance is 550 m. When single-mode optical fiber is used, the maximum transmission distance is 10 km. The optical modules can be used for different requirements for the transmission distance, such as 40 km and 70 km.

Format of service frames

Supports Ethernet II, IEEE 802.3, and IEEE 802.1q TAG. Supports frames with a length ranging from 64 bytes to 9600 bytes. Supports Jumbo frames with a length less than 9600 bytes.

Max. uplink bandwidth Mapping granularity Encapsulation format EVPL

2.5 Gbit/s. Supports VC-3, VC3-2v, VC-4, and VC4-Xv (X8). Supports GFP-F and LAPS. Supports EVPL services. The frame format can be Ethernet II, IEEE 802.3, IEEE 802.1q TAG, or MPLS Martini. Supports the MPLS encapsulation and forwarding based on port and port+VLAN. Supports five types of LSP, including ingress LSP, egress LSP, transit LSP, RPR ingress LSP, and RPR transit LSP. Supports 512 LSPs.

EVPLAN

Supports EVPLAN services and uses the stack VLAN encapsulation. Supports the function of self-learning the source MAC address. For the N2EGR2, the capacity of the MAC address table is 64k. The aging time of the MAC address can be set and queried. Supports the configuration of static MAC routes (maximum: 4k). Supports data isolation based on VB+VLAN. Supports the creation, deletion and query of the VB. The maximum number of the VBs is 16. The maximum number of logical ports for each VB is 32.

MTU

The packet length can be set from 1518 bytes to 9600 bytes. After the packet length setting takes effect, the maximum length of the packets entering or going out from the IP port are limited by the MTU setting. Supports MartinioE. Supported. Supports 4096 VLAN labels, the addition and deletion of VLAN labels, and the switching function, compliant with IEEE 802.1q/p.
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Function and Feature VLAN convergence VLAN switching Port convergence RPR

EGR2 Supported (4k VLAN). Supports the replacement of VLAN in Ethernet signal frames. Supports the convergence at a maximum of two GE ports. Supports RPR, compliant with IEEE 802.17. The ring network supports a maximum of 255 nodes, and it supports the dropping of sink nodes and weighted fairness algorithm. Supports five priority levels, including A0, A1, B_EIR, B_CIR and C. Provides topology automatic discovery function, and detects the network status in real time. Supports three protection modes, including Steering, Wrapping, and Wrapping+Steering. The invalid time for signals is less than 50 ms. Supports the manual configuration of the ringlet route in the RPR ring network. Supports the ringlet self-learning, which learns the mapping relation between the MAC address and node number.

RSTP Multicast (IGMP Snooping) CAR

Supports broadcast packet suppression and RSTP, compliant with IEEE 802.1w. Supported. Supported. The granularity is 64 kbit/s.

Flow classification LCAS Flow control function Echo test frame Loopback function Ethernet performance monitoring Alarm and performance event Weighted fairness algorithm

Supports the port flow, port+VLAN ID flow, and port+VLAN ID +VLAN PRI flow. Dynamically increases or decreases the bandwidth, and realizes the protection function, compliant with ITU-T G.7042. Supports the IEEE 802.3x flow control based on port. Supports the Echo function of the PRP OAM, which is used to test the availability of the link. Supports inloop at the Ethernet port (PHY layer or MAC layer). Supports Ethernet performance monitoring at the port level.

Provides rich alarms and performance events for easy management and maintenance of the equipment. Supported.

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Function and Feature Topology automatic discovery Max. number of nodes Service priority level

EGR2 Supported.

255. Supports A0, A1, B_CIR, B_EIR and C.

7.11.3 Working Principle and Signal Flow

The EGR2 consists of the ethernet processing module, network processor module, RPR protocol processing module and so on. Figure 7-30 shows the block diagram for the functions of the EGR2. Figure 7-30 Block diagram for the functions of the EGR2

Control singnal GE/FE Ethernet

E N C P

Crossconnect unit V C P

access module

Network processor
Data

Switch fabric

RPR MAC east

RPR MAC west

D N C P

Interface conversion module

Network processor module

RPR protocol process module

Crossconnect unit

Mapping module

Laser shut down LOS

Communication

Communication and control module

SCC unit Cross-connect unit

Reference clock and frame header

50 MHZ 77 MHZ 125 MHZ 100 MHZ +3.3 V +1.5 V +2.5 V

Clock module

DC/DC +1.8 V converter

DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse

+3.3 V backup power

RPR: resilient package ring

The function modules are described as follows:

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Ethernet Access Module

In the receive direction, the optical signals from Ethernet equipment, such as switch and router, are converted into electrical signals. For the signals accessed from electrical interfaces, O/E conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS alarms are tested. The electrical signals are converted from serial signals to parallel signals and then sent to network processor. In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer, signals are encoded and converted from electrical signals to optical signals.

Network Processor Module

The network processor module consists of network processor and switch fabric. The network processor first performs MAC functions, which include code conversion, framing of Ethernet packets, CRC check and Ethernet performance statistics. After the striped Ethernet frame enters the core of network processor, the flow is classified as per service type and configuration requirements. The frame is encapsulated or decapsulated. These packets formats are supported:
l l l

MPLS L2MPLS VPN Ethernet/ VLAN

In the receive direction, services are mapped and forwarded by adding Tunnel and VC double labels as per service configuration. In the transmit direction, Tunnel or VC is extracted as per the level (P or PE) of the equipment. Services are then routed or forwarded. The network processor module:
l l l l l

Supports flow sense and flow classification Supports uni-cast, multi-cast and broadcast of the flow Provides data priority setting Provides weighted fair queuing (WFQ) Provides four classes of services (CoS)

RPR Protocol Processing Module

RPR realizes fair weight and statistic multiplex for ring bandwidth. RPR provides protection switching schemes. By applying the RPR protocol and RPR weight fair algorithm, this module controls the bandwidth of each node to access the ring network. Therefore, the RPR ring features spatial reuse and statistic multiplex. Bandwidth utilization is then improved. Topology auto-discovery ensures the plug-and-play feature of the RPR. The protocol for topology auto-discovery provides correct and reliable means to fast find topologies of all nodes and the changes to these topologies. RPR uni-cast frames are striped at the destination node and thus bandwidth in the ring is reused spatially. The entire RPR ring accommodates 255 nodes to the maximum.
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Mapping Module
The mapping module consists of encapsulation and mapping. In the upstream direction, the virtual concatenation supports LCAS function. The encapsulation formats are LAPS and GFP-F. In the downstream direction, virtual concatenations are received. The time delay of virtual concatenation is compensated. After aligning, packets are decapsulated as per encapsulation format. The decapsulated data are transmitted to the RPR protocol processing module in packets.

Interface Converting Module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals (LVDS) bus of SDH system into serial bus. Through this module, the high-rate backplane interface connects to low-rate interface chip of the transmitting system.

Communication and Control Module

The communication and control module consists of CPU, register, oscillator, Ethernet port and HDLC controller. This module connects to external circuits through bus. The communication and control module:
l l

Manages and configures other modules of the boards. Performs inter-board communication through internal Ethernet interface.

The control module also contains basic logic units. This module enjoys the following functions:
l l l l l l l l

Writes and reads register Provides interface for CPU Checks, selects clock Performs phase discrimination and frequency division to the clock Checks the in-service state of the cross-connect, the SCC and the line boards Controls the shutting down of the optical module Processes communication Control indicators

Clock Unit
This clock unit tracing the system reference clock and generates the required working clocks for each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 100 MHz.

DC/DC Converter Module

Through the DC/DC module, the power unit generates required voltages for each chip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition, this unit also provides protection for the board +3.3 V power supply.

7.11.4 Front Panel

On the front panel of the EGR2, there are indicators, interfaces, barcode and laser safety class label.
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Appearance of the Front Panel

Figure 7-31 shows the appearance of the front panel of the EGR2. Figure 7-31 Front panel of the EGR2
EGR2
STAT ACT PROG SRV LINK1 ACT1 LINK2 ACT2

CLASS 1 LASER PRODUCT

OUT1 IN1 OUT2 IN2

EGR2

Indicators
The following indicators are present on the front panel of the board:
l l l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit. Connection status indicator (LINK), which is green when lit. Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are two optical interfaces on the front panel of the EGR2. Table 7-44 lists the type and usage of the optical interfaces.
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Table 7-44 Optical interfaces of the EGR2 Interface OUT1/IN1 OUT2/IN2 Interface Type LC (pluggable) LC (pluggable) Usage Transmits and receives the 1000Base-SX/LX/ZX signals. Transmits and receives the 1000Base-SX/LX/ZX signals.

7.11.5 Valid Slots

The EGR2 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The EGR2 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

7.11.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code of the EGR2 indicates the optical interface type. Table 7-45 lists the relation between the board feature code and optical interface type for the EGR2. Table 7-45 Relation between the board feature code and the optical interface type Board Barcode SSN2EGR210 SSN2EGR211 SSN2EGR212 SSN2EGR213 Feature Code 10 11 12 13 Optical Interface Type 1000Base-SX (0.55 km) 1000Base-LX (10 km) 1000Base-ZX (40 km) 1000Base-ZX (70 km)

7.11.7 Board Configuration Reference

You can use the T2000 to set parameters for the EGR2. You can use the T2000 to set the following parameters for the EGR2:
l l l l

Working mode Enabling of the LCAS Maximum packet length Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.11.8 Technical Specifications

The technical specifications of the EGR2 cover the optical interface specifications, board dimensions, weight and power consumption.
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Table 7-46 lists the specifications of the interfaces of the EGR2. Table 7-46 Specifications of the interfaces of the EGR2 Optical Optical Interface Type Source Type 1000Base-ZX (70 km) 1000Base-ZX (40 km) 1000Base-LX (10 km) 1000Base-SX (0.55 km) MLM MLM MLM MLM Launched Optical Power (dBm) 4 to +2 2 to +5 9 to 3 9.5 to 0 Central Wavele ngth (nm) 1480 to 1580 1270 to 1355 1270 to 1355 770 to 860 Overloa d Optical Power (dBm) 3 3 3 0 Receiver Sensitivit y (dBm) 22 23 19 17 Extin ction Ratio (dB) 9 9 9 9

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the EGR2 are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 1.1

Power Consumption
In the normal temperature (25), the maximum power consumption of the EGR2 is 40 W.

7.12 EMR0
This section describes the EMR0, a 12 x FE and 1 x GE Ethernet ring processing board, in terms of the version, function, principle, front panel, configuration and specifications. 7.12.1 Version Description The EMR0 has two versions, N1 and N2. The production of the N1 version is stopped. 7.12.2 Function and Feature The EMR0 supports Layer 2 switching, port convergence, and RPR. 7.12.3 Working Principle and Signal Flow The EMR0 consists of the ethernet processing module, network processor module, RPR protocol processing module, mapping module and so on.
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7.12.4 Front Panel On the front panel of the EMR0, there are indicators, interfaces, barcode and laser safety class label. 7.12.5 Valid Slots The EMR0 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. Without the interface board, the EMR0 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack. With the interface board, the EMR0 can be housed in any of slots 1213 in the OptiX OSN 1500B subrack. 7.12.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the EMR0 indicates the optical interface type. 7.12.7 Board Configuration Reference You can use the T2000 to set parameters for the EMR0. 7.12.8 Technical Specifications The technical specifications of the EMR0 cover the optical interface specifications, board dimensions, weight and power consumption.

7.12.1 Version Description

The EMR0 has two versions, N1 and N2. The production of the N1 version is stopped. Table 7-47 lists the details on the versions of the EMR0 board. Table 7-47 Version description of the EMR0 Item Functional version Difference Description The EMR0 has two versions, N1 and N2. The N2EMR0 supports all functions of the N1EMR0. The N2EMR0 also has some new functions and extends some functions of the N1EMR0. For details, see Table 7-48. The N2EMR0 can replace the N1EMR0.

Replaceability

Table 7-48 Comparison of features of the N1EMR0 and N2EMR0 Item Port convergence function VLAN label switching EVPLAN services N1EMR0 Supports EVPLAN services and uses the stack VLAN encapsulation. N2EMR0 Supports the convergence function at a maximum of eight FE ports. Supports the VLAN label switching for the Ethernet data. Supports EVPLAN services and uses the stack VLAN encapsulation.

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Item MAC address table VB features

N1EMR0 Supports the 16k MAC address table. Supports the creation, deletion and query of the VB. The maximum number of the VBs is 32. The maximum number of logical ports for each VB is 16. -

N2EMR0 Supports the 64k MAC address table. Supports the creation, deletion and query of the VB. The maximum number of the VBs is 16. The maximum number of logical ports for each VB is 32.

PRP ring network

Supports the manual configuration of the ringlet route in the RPR ring network. Supports the Echo function of the PRP OAM, which is used to test the availability of the link. Supported. Supports the port flow, port+VLAN ID flow, and port+VLAN ID+VLAN PRI flow.

RPR OAM

CAR Flow classification

Supported. Supports the port flow, port +VLAN ID flow, and port +VLAN PRI flow.

7.12.2 Function and Feature

The EMR0 supports Layer 2 switching, port convergence, and RPR. Table 7-49 lists the functions and features of the EMR0. Table 7-49 Functions and features of the EMR0 Function and Feature Basic function Used with the interface board EMR0 Accesses and processes 12 x FE services and 1 x GE services. Supports the RPR feature. Supports four FE ports and one GE ports. Accesses 12 x FE signals at the electrical interface when used with the ETF8. Accesses 8 x FE signals at the optical interface when used with the EFF8. Specification of the optical interface Supports the 10Base-T/100Base-TX signals when used with the ETF8. The maximum transmission distance is 100 m. Supports the 100Base-FX signals when used with the EFF8, compliant with IEEE 802.3u.

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Function and Feature Format of service frames Max. uplink bandwidth Mapping granularity Encapsulation format EVPL

EMR0 Supports Ethernet II, IEEE 802.3, and IEEE 802.1q TAG . Supports frames with a length ranging from 64 bytes to 9600 bytes. Supports Jumbo frames with a length less than 9600 bytes. 2.5 Gbit/s. VC-3, VC3-2v, VC-4, and VC4-Xv (X8). Supports GFP-F and LAPS. Supports EVPL services. The frame format can be Ethernet II, IEEE 802.3, IEEE 802.1q TAG, or MPLS Martini. EVPL services support the MPLS encapsulation and forwarding based on port and port +VLAN. Supports five types of LSP, including ingress LSP, egress LSP, transit LSP, RPR ingress LSP, and RPR transit LSP. Supports 512 LSPs. Supports EVPLAN services and uses the stack VLAN encapsulation. Supports the function of self-learning the source MAC address. For the N2EMR0, the capacity of the MAC address table is 16k. The aging time of the MAC address can be set and queried. Supports the configuration of static MAC routes (maximum: 4k). Supports data isolation based on VB+VLAN. Supports the creation, deletion and query of the VB. The N2EMR0 supports a maximum of 16 VBs. The maximum number of logical ports for each VB is 32.

EVPLAN

MTU

The packet length can be set from 1518 bytes to 9600 bytes. After the packet length setting takes effect, the maximum length of the packets entering or going out from the IP port are limited by the MTU setting. Supports MartinioE. Supported. Supports 4096 VLAN labels, the addition and deletion of VLAN labels, and the switching function, compliant with IEEE 802.1q/p. Supported (4k VLAN). Supports the replacement of VLAN in Ethernet signal frames. Supports the convergence function at a maximum of eight FE ports.

MPLS Stack VLAN VLAN VLAN convergence VLAN switching Port convergence

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Function and Feature RPR

EMR0 Supported and compliant with IEEE 802.17. Supports a maximum of 255 nodes in the ring network, and the dropping of sink nodes. Supports weighted fairness algorithm. Supports five priority levels, including A0, A1, B_EIR, B_CIR and C. Provides topology automatic discovery function, and detects the network status in real time. Supports three protection modes, including Steering, Wrapping, and Wrapping+Steering. The invalid time for signals is less than 50 ms. Supports the ringlet self-learning, which learns the mapping relation between the MAC address and node number. The N2EMR0 supports the manual configuration of the ringlet route in the RPR ring network.

RSTP Multicast (IGMP Snooping) CAR

Supports broadcast packet suppression and RSTP, compliant with IEEE 802.1w. Supported. Supported. The granularity is 64 kbit/s.

Flow classification LCAS Flow control function Echo test frame Loopback function Ethernet performance monitoring Alarm and performance events Weighted fairness algorithm Topology automatic discovery

The N2EMR0 supports the port flow, port+VLAN ID flow, and port +VLAN ID+VLAN PRI flow. Dynamically increases or decreases the bandwidth and realizes the protection function, compliant with ITU-T G.7042. Supports the IEEE 802.3x flow control based on port. Supports the Echo function of the PRP OAM, which is used to test the availability of the link. Supports inloop at the Ethernet port (PHY layer or MAC layer). Supports Ethernet performance monitoring at the port level.

Provides rich alarms and performance events for easy management and maintenance of the equipment. Supported. Supported.

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Function and Feature Max. number of nodes Service priority levels

EMR0 255. Supports A0, A1, B_CIR, B_EIR and C.

7.12.3 Working Principle and Signal Flow

The EMR0 consists of the ethernet processing module, network processor module, RPR protocol processing module, mapping module and so on. Figure 7-32 shows the block diagram for the functions of the EMR0. Figure 7-32 Block diagram for the functions of the EMR0

Control singnal GE/FE Ethernet

E N C P

Crossconnect unit V C P

access module

Network processor
Data

Switch fabric

RPR MAC east

RPR MAC west

D N C P

Interface conversion module

Network processor module

RPR protocol process module

Crossconnect unit

Mapping module

Laser shut down LOS

Communication

Communication and control module

SCC unit Cross-connect unit

Reference clock and frame header

50 MHZ 77 MHZ 125 MHZ 100 MHZ +3.3 V +1.5 V +2.5 V

Clock module

DC/DC +1.8 V converter

DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse

+3.3 V backup power

RPR: resilient package ring

The function modules are described as follows:

Ethernet Access Module

In the receive direction, the optical signals from Ethernet equipment, such as switch and router, are converted into electrical signals. For the signals accessed from electrical interfaces, O/E conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS
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alarms are tested. The electrical signals are converted from serial signals to parallel signals and then sent to network processor. In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer, signals are encoded and converted from electrical signals to optical signals.

Network Processor Module

The network processor module consists of network processor and switch fabric. The network processor first performs MAC functions, which include code conversion, framing of Ethernet packets, CRC check and Ethernet performance statistics. After the striped Ethernet frame enters the core of network processor, the flow is classified as per service type and configuration requirements. The frame is encapsulated or decapsulated. These packets formats are supported:
l l l

MPLS L2MPLS VPN Ethernet/ VLAN

In the receive direction, services are mapped and forwarded by adding Tunnel and VC double labels as per service configuration. In the transmit direction, Tunnel or VC is extracted as per the level (P or PE) of the equipment. Services are then routed or forwarded. The network processor module:
l l l l l

Supports flow sense and flow classification Supports uni-cast, multi-cast and broadcast of the flow Provides data priority setting Provides weighted fair queuing (WFQ) Provides four classes of services (CoS)

RPR Protocol Processing Module

RPR realizes fair weight and statistic multiplex for ring bandwidth. RPR provides protection switching schemes. By applying the RPR protocol and RPR weight fair algorithm, this module controls the bandwidth of each node to access the ring network. Therefore, the RPR ring features spatial reuse and statistic multiplex. Bandwidth utilization is then improved. Topology auto-discovery ensures the plug-and-play feature of the RPR. The protocol for topology auto-discovery provides correct and reliable means to fast find topologies of all nodes and the changes to these topologies. RPR uni-cast frames are striped at the destination node and thus bandwidth in the ring is reused spatially. The entire RPR ring accommodates 255 nodes to the maximum.

Mapping Module
The mapping module consists of encapsulation and mapping. In the upstream direction, the virtual concatenation supports LCAS function. The encapsulation formats are LAPS and GFP-F.
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In the downstream direction, virtual concatenations are received. The time delay of virtual concatenation is compensated. After aligning, packets are decapsulated as per encapsulation format. The decapsulated data are transmitted to the RPR protocol processing module in packets.

Interface Converting Module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals (LVDS) bus of SDH system into serial bus. Through this module, the high-rate backplane interface connects to low-rate interface chip of the transmitting system.

Communication and Control Module

The communication and control module consists of CPU, register, oscillator, Ethernet port and HDLC controller. This module connects to external circuits through bus. The communication and control module:
l l

Manages and configures other modules of the boards. Performs inter-board communication through internal Ethernet interface.

The control module also contains basic logic units. This module enjoys the following functions:
l l l l l l l l

Writes and reads register Provides interface for CPU Checks, selects clock Performs phase discrimination and frequency division to the clock Checks the in-service state of the cross-connect, the SCC and the line boards Controls the shutting down of the optical module Processes communication Control indicators

Clock Unit
This clock unit tracing the system reference clock and generates the required working clocks for each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 100 MHz.

DC/DC Converter Module

Through the DC/DC module, the power unit generates required voltages for each chip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition, this unit also provides protection for the board +3.3 V power supply.

7.12.4 Front Panel

On the front panel of the EMR0, there are indicators, interfaces, barcode and laser safety class label.

Appearance of the Front Panel

Figure 7-33 shows the appearance of the front panel of the N1EMR0. Figure 7-34 shows the appearance of the front panel of the N2EMR0.
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Figure 7-33 Front panel of the N1EMR0

EMR0 STAT ACT PROG SRV LINK ACT

CLASS 1 LASER PRODUCT

OUT1 IN1

FE1

FE2

FE3

FE4

EMR0

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Figure 7-34 Front panel of the N2EMR0

EMR0 STAT ACT PROG SRV LINK ACT

CLASS 1 LASER PRODUCT

OUT1 IN1

FE1

FE2

FE3

FE4

EMR0

Indicators
The following indicators are present on the front panel of the board:
l l l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit. Connection status indicator (LINK), which is green when lit. Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.
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Interfaces
There are five interfaces on the front panel of the EMR0. Table 7-50 lists the type and usage of the interfaces. Table 7-50 Optical interfaces of the EMR0 Interface OUT1/IN1 FE1 FE2 FE3 FE4 Interface Type LC (pluggable) RJ-45 RJ-45 RJ-45 RJ-45 Usage Transmits and receives the 1000Base-SX/LX/ZX signals. Transmits and receives the 10Base-T/100Base-TX signals. Transmits and receives the 10Base-T/100Base-TX signals. Transmits and receives the 10Base-T/100Base-TX signals. Transmits and receives the 10Base-T/100Base-TX signals.

7.12.5 Valid Slots

The EMR0 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. Without the interface board, the EMR0 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack. With the interface board, the EMR0 can be housed in any of slots 1213 in the OptiX OSN 1500B subrack. The EMR0 can be used with the ETF8 and EFF8. Table 7-51 and Table 7-52 list the valid slots for the EMR0 and corresponding slots for the ETF8 and EFF8. Table 7-51 Valid slots for the EMR0 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500A subrack Valid Slot for the EMR0 Slot 12 Slot 13 Corresponding Slot for the ETF8 and EFF8 Without the interface board Without the interface board

Table 7-52 Valid slots for the EMR0 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500B subrack Valid Slot for the EMR0 Slot 11
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Corresponding Slot for the ETF8 and EFF8 Without the interface board

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Valid Slot for the EMR0 Slot 12 Slot 13

Corresponding Slot for the ETF8 and EFF8 Slot 15 Slot 17

7.12.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code of the EMR0 indicates the optical interface type. Table 7-53 lists the relation between the board feature code and optical interface type for the EMR0. Table 7-53 Relation between the board feature code and the optical interface type Board Barcode SSN2EMR010 SSN2EMR011 SSN2EMR012 SSN2EMR013 Feature Code 10 11 12 13 Optical Interface Type 1000Base-SX (0.55 km) 1000Base-LX (10 km) 1000Base-ZX (40 km) 1000Base-ZX (70 km)

7.12.7 Board Configuration Reference

You can use the T2000 to set parameters for the EMR0. You can use the T2000 to set the following parameters for the EMR0:
l l l l

Working mode Enabling of the LCAS Maximum packet length Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.12.8 Technical Specifications

The technical specifications of the EMR0 cover the optical interface specifications, board dimensions, weight and power consumption. Table 7-54 lists the specifications of the interfaces of the EMR0.

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Table 7-54 Specifications of the optical interfaces of the EMR0 Item Optical interface type Optical source type Launched optical power (dBm) Central wavelength (nm) Overload optical power (dBm) Receiver sensitivity (dBm) Extinction ratio (dB) Specification 1000Base-ZX (70 km) MLM 4 to +2 1480 to 1580 3 22 9 1000Base-ZX (40 km) MLM 2 to +5 1270 to 1355 3 23 9 1000Base-LX (10 km) MLM 9 to 3 1270 to 1355 3 19 9 1000Base-SX (0.55 km) MLM 9.5 to 0 770 to 860 0 17 9

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the EMR0 are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 1.2

Power Consumption
In the normal temperature (25), the maximum power consumption of the EMR0 is 50 W.

7.13 ADL4
This section describes the ADL4, a 1 x STM-4 ATM processing board, in terms of the version, function, principle, front panel, configuration and specifications. 7.13.1 Version Description The functional version of the ADL4 board is N1. 7.13.2 Function and Feature The ADL4 supports the ATM switching and ATM protection. 7.13.3 Working Principle and Signal Flow
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The ADL4 consists of the O/E converting module, physical layer module, ATM module and so on. 7.13.4 Front Panel On the front panel of the ADL4, there are indicators, interfaces, barcode and laser safety class label. 7.13.5 Valid Slots The ADL4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The ADL4 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack. 7.13.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the ADL4 indicates the optical interface type. 7.13.7 Board Configuration Reference You can use the T2000 to set parameters for the ADL4. 7.13.8 Technical Specifications The technical specifications of the ADL4 cover the optical interface specifications, board dimensions, weight and power consumption.

7.13.1 Version Description

The functional version of the ADL4 board is N1.

7.13.2 Function and Feature

The ADL4 supports the ATM switching and ATM protection. Table 7-55 lists the functions and features of the ADL4. Table 7-55 Functions and features of the ADL4 Function and Feature Basic function Optical interface type Connector type Optical module type E3 ATM interface IMA function Max. uplink bandwidth ATM switching capability Mapping granularity
7-114

ADL4 Accesses and processes 1 x STM-4 ATM services. Supports the optical interfaces of the S-4.1, L-4.1, L-4.2 and Ve-4.2 types. LC. SFP. Supports 12 x E3 signals, which are accessed by the PD3/PL3/ N1PL3A. Not supported. Supports 8 x VC-4, or 12 x VC-3 and 4 x VC-4. 1.2 Gbit/s. Supports VC-3, VC-4, or VC4-Xv (X: 14).
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Function and Feature Service type ATM connection Statistical multiplexing Flow type and QoS ATM multicast connection ATM protection (ITUT I.630) OAM function (ITU-T I.610) Maintenance feature

ADL4 Supports CBR, rt-VBR, nrt-VBR and UBR. 2048. Supported. Supports IETF RFC2514, ATM forum TM4.0. Supports spacial multicast and logical multicast. Supports unidirectional or bidirectional 1+1, 1:1, VP-Ring, VCRing protection schemes. Supports AIS, RDI, LB , and CC. Supports inloop and outloop at the ATM layer levels and the optical interface (except the outloop at external port), which are used for maintenance and fault locating. Provides rich alarms and performance events. The loopback is used for maintenance and fault locating.

Alarm and performance event

7.13.3 Working Principle and Signal Flow

The ADL4 consists of the O/E converting module, physical layer module, ATM module and so on. Figure 7-35 shows the block diagram for the functions of the ADL4.

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Figure 7-35 Block diagram for the functions of the ADL4

622Mbit/s

E/O

622Mbit/s

high speed bus

Cross-connet unit A

PHY module O/E

622Mbit/s 622Mbit/s

ATM module E3 module

Mapping module
high speed bus Cross-connet unit B

LOS

Reference clock and frame header

Cross-connet unit

Laser shut down

Communication and control module

Communication

Scc unit

50 MHz 77 MHz 100 MHz

Clock module
3.3 V

DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V

+1.2 V Fuse +1.5 V +1.8 V +2.5 V +3.3 V backup power

DC/DC converter

The function modules are described as follows.

O/E Converting Module

In the receive direction, optical signals are converted to electrical signals. In the transmit direction, electrical signals are converted to optical signals.

Physical Layer Module

The physical layer module mainly:
l l l

Mappings ATM cells into SDH frames Demappings SDH frames to ATM cells Processes ATM service physical layer functions: cell delimitation, test and generation of HEC series

ATM Module
The ATM module mainly performs ATM layer functions in the ATM protocol. These functions include:
l l l

Flow control Extraction and generation of cell headers ATM switching

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E3 Module
The E3 module mainly processes the ATM services at E3 rate. This module:
l l l

Mappings the ATM cells into E3 containers Demappings E3 containers to ATM cells Perform ATM physical layer function to the ATM service at E3 rate

Mapping Module
The mapping module:
l l l l

Mappings ATM cells into SDH frame payload Demappings SDH frame payload to ATM cells Supports ATM physical layer functions Supports VC4-Xv (X4) virtual concatenation

Communication and Control Module

The communication and control module:
l l l l l l

Controls writing and reading of each chip Communicates with the NE Issues configured services Reports alarms of each functional module Checks R_LOS alarms of optical modules Controls the shutting of transmission

Clock Module
This module mainly generates working clocks for each chip. The frequencies of the clocks are 50 MHz, 77 MHz and 100 MHz.

DC/DC Converter Module

Through the DC/DC module, the power unit generates required voltages for each chip on the board. The following DC voltages are provided: +1.2 V, +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition, this unit also provides protection for the board +3.3 V power supply.

7.13.4 Front Panel

On the front panel of the ADL4, there are indicators, interfaces, barcode and laser safety class label.

Appearance of the Front Panel

Figure 7-36 shows the appearance of the front panel of the ADL4.
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Figure 7-36 Front panel of the ADL4

ADL4
STAT ACT PROG SRV

CLASS 1 LASER PRODUCT

OUT1 IN1
ADL4

Indicators
The following indicators are present on the front panel of the board:
l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There is one optical interface on the front panel of the ADL4. Table 7-56 lists the type and usage of the optical interface.

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Table 7-56 Optical interface of the ADL4 Interface OUT1/IN1 Interface Type LC (pluggable) Usage Transmits and receives STM-4 optical signals.

7.13.5 Valid Slots

The ADL4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The ADL4 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

7.13.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code of the ADL4 indicates the optical interface type. Table 7-57 lists the relation between the board feature code and optical interface type of the ADL4. Table 7-57 Relation between the board feature code and the optical interface type Board SSN1ADL410 SSN1ADL411 SSN1ADL412 SSN1ADL413 Feature Code 10 11 12 13 Optical Interface Type S-4.1 L-4.1 L-4.2 Ve-4.2

7.13.7 Board Configuration Reference

You can use the T2000 to set parameters for the ADL4. You can use the T2000 to set the following parameters for the ADL4:
l l l l l l l

Port type Flow type Service type Peak cell rate (PCR) Sustainable cell rate (SCR) Maximum cell burst size Cell delay variation tolerance (CDVT)

For details on these parameters, refer to F Board Configuration Reference.

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7.13.8 Technical Specifications

The technical specifications of the ADL4 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications

Table 7-58 lists the specifications of the optical interfaces of the ADL4. Table 7-58 Specifications of the optical interfaces of the ADL4 Item Optical interface type Optical source type Transmission distance (km) Wavelength (nm) Overload optical power (dBm) Receiver sensitivity (dBm) Launched optical power (dBm) Minimum extinction ratio (dB) Specification S-4.1 MLM 215 12741356 8 23 15 to 8 8.2 L-4.1 SLM 1540 12801335 8 28 3 to +2 10 L-4.2 SLM 4080 14801580 8 28 3 to +2 10 Ve-4.2 SLM 80100 14801580 8 33 2 to +2 10.5

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the ADL4 are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 0.9

Power Consumption
In the normal temperature (25), the maximum power consumption of the ADL4 is 41 W.
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7.14 ADQ1
This section describes the ADQ1, a 4 x STM-1 ATM processing board, in terms of the version, function, principle, front panel, configuration and specifications. 7.14.1 Version Description The functional version of the ADQ1 board is N1. 7.14.2 Function and Feature The ADQ1 supports the ATM switching and ATM protection. 7.14.3 Working Principle and Signal Flow The ADQ1 consists of the O/E converting module, physical layer module, ATM module and so on. 7.14.4 Front Panel On the front panel of the ADQ1, there are indicators, interfaces, barcode and laser safety class label. 7.14.5 Valid Slots The ADQ1 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The ADQ1 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack. 7.14.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the ADQ1 indicates the optical interface type. 7.14.7 Board Configuration Reference You can use the T2000 to set parameters for the ADQ1. 7.14.8 Technical Specifications The technical specifications of the ADQ1 cover the optical interface specifications, board dimensions, weight and power consumption.

7.14.1 Version Description

The functional version of the ADQ1 board is N1.

7.14.2 Function and Feature

The ADQ1 supports the ATM switching and ATM protection. Table 7-59 lists the functions and features of the ADQ1. Table 7-59 Functions and features of the ADQ1 Function and Feature Basic function Optical interface type ADQ1 Accesses and processes 4 x STM-1 ATM services. Supports the optical interfaces of the Ie-1, S-1.1, L-1.1, L-1.2 and Ve-1.2 types.
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Function and Feature Connector type Optical module type E3 ATM interface IMA function Max. uplink bandwidth ATM switching capability Mapping granularity Service type ATM connection Statistical multiplexing Flow type and QoS ATM multicast connection ATM protection (ITUT I.630) OAM function (ITU-T I.610) Maintenance feature

ADQ1 LC. SFP. Supports 12 x E3 signals, which are accessed by the PD3/PL3/ N1PL3A. Not supported. Supports 8 x VC-4, or 12 x VC-3 and 4 x VC-4. 1.2 Gbit/s. Supports VC-3, VC-4, or VC4-Xv (X: 14). Supports CBR, rt-VBR, nrt-VBR and UBR. 2048. Supported. Supports IETF RFC2514 and ATM forum TM4.0. Supports spacial multicast and logical multicast. Supports unidirectional or bidirectional 1+1, 1:1, VP-Ring, VCRing protection schemes. Supports AIS, RDI, LB , and CC. Supports inloop and outloop at the ATM layer levels and the optical interface (except the outloop at external port), which are used for maintenance and fault locating. Provides rich alarms and performance events, which are used for maintenance and fault locating.

Alarm and performance event

7.14.3 Working Principle and Signal Flow

The ADQ1 consists of the O/E converting module, physical layer module, ATM module and so on. Figure 7-37 shows the block diagram for the functions of the ADQ1.

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Figure 7-37 Block diagram for the functions of the ADQ1

4x155 Mbit/s

E/O

4x155Mbit/s

high speed bus

Cross-connet unit A

PHY module
4x155Mbit/s

ATM module E3 module

Mapping module
high speed bus Cross-connet unit B

O/E

4x155Mbit/s

LOS

Reference clock and frame header

Cross-connet unit

Laser shut down

Communication and control module

Communication

Scc unit

50 MHz 77 MHz 100 MHz

Clock module
3.3 V

DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V

+1.2 V Fuse +1.5 V +1.8 V +2.5 V +3.3 V backup power

DC/DC converter

The function modules are described as follows.

O/E Converting Module

In the receive direction, optical signals are converted to electrical signals. In the transmit direction, electrical signals are converted to optical signals.

Physical Layer Module

The physical layer module mainly:
l l l

Mappings ATM cells into SDH frames Demappings SDH frames to ATM cells Processes ATM service physical layer functions: cell delimitation, test and generation of HEC series

ATM Module
The ATM module mainly performs ATM layer functions in the ATM protocol. These functions include:
l l l

Flow control Extraction and generation of cell headers ATM switching

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E3 Module
The E3 module mainly processes the ATM services at E3 rate. This module:
l l l

Mappings the ATM cells into E3 containers Demappings E3 containers to ATM cells Perform ATM physical layer function to the ATM service at E3 rate

Mapping Module
The mapping module:
l l l l

Mappings ATM cells into SDH frame payload Demappings SDH frame payload to ATM cells Supports ATM physical layer functions Supports VC4-Xv (X4) virtual concatenation

Communication and Control Module

The communication and control module:
l l l l l l

Controls writing and reading of each chip Communicates with the NE Issues configured services Reports alarms of each functional module Checks R_LOS alarms of optical modules Controls the shutting of transmission

Clock Module
This module mainly generates working clocks for each chip. The frequencies of the clocks are 50 MHz, 77 MHz and 100 MHz.

DC/DC Converter Module

Through the DC/DC module, the power unit generates required voltages for each chip on the board. The following DC voltages are provided: +1.2 V, +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition, this unit also provides protection for the board +3.3 V power supply.

7.14.4 Front Panel

On the front panel of the ADQ1, there are indicators, interfaces, barcode and laser safety class label.

Appearance of the Front Panel

Figure 7-38 shows the appearance of the front panel of the ADQ1.
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Figure 7-38 Front panel of the ADQ1

ADQ1
STAT ACT PROG SRV
CLASS 1 LASER PRODUCT

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4

ADQ1

Indicators
The following indicators are present on the front panel of the board:
l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are four pairs of optical interfaces on the front panel of the ADQ1. Table 7-60 lists the type and usage of the optical interfaces.

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Table 7-60 Optical interfaces of the ADQ1 Interface OUT1/IN1 OUT2/IN2 OUT3/IN3 OUT4/IN4 Interface Type LC (pluggable) LC (pluggable) LC (pluggable) LC (pluggable) Usage Transmits and receives STM-1 optical signals. Transmits and receives STM-1 optical signals. Transmits and receives STM-1 optical signals. Transmits and receives STM-1 optical signals.

7.14.5 Valid Slots

The ADQ1 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The ADQ1 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

7.14.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code of the ADQ1 indicates the optical interface type. Table 7-61 lists the relation between the board feature code and optical interface type for the ADQ1. Table 7-61 Relation between the board feature code and the optical interface type Board SSN1ADQ110 SSN1ADQ111 SSN1ADQ112 SSN1ADQ113 SSN1ADQ114 Feature Code 10 11 12 13 14 Optical Interface Type S-1.1 L-1.1 L-1.2 Ve-1.2 Ie-1

7.14.7 Board Configuration Reference

You can use the T2000 to set parameters for the ADQ1. You can use the T2000 to set the following parameters for the ADQ1:
l l l l l

Port type Flow type Service type Peak cell rate (PCR) Sustainable cell rate (SCR)
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l l

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Maximum cell burst size Cell delay variation tolerance (CDVT)

For details on the parameters, refer to F Board Configuration Reference.

7.14.8 Technical Specifications

The technical specifications of the ADQ1 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications

Table 7-62 lists the specifications of the optical interfaces of the ADQ1. Table 7-62 Specifications of the optical interfaces of the ADQ1 Item Optical interface type Optical source type Wavelength (nm) Transmission distance (km) Launched optical power (dBm) Receiving optical power (dBm) Overload optical power (dBm) Minimum extinction ratio (dB) Specification Ie-1 MLM 1260 to 1360 0 to 0.5 19 to 14 S-1.1 MLM 1261 to 1360 2 to 15 15 to 8 L-1.1 MLM, SLM 1263 to 1360 15 to 40 5 to 0 L-1.2 SLM 1480 to 1580 40 to 80 5 to 0 Ve-1.2 SLM 1480 to 1580 80 to 100 3 to 0

31

28

34

34

34

14

10

10

10

10

8.2

10

10

10

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the ADQ1 are as follows:
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l l

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 0.9

Power Consumption
In the normal temperature (25), the maximum power consumption of the ADQ1 is 37 W.

7.15 IDL4
This section describes the IDL4, a 1 x STM-4 ATM processing board, in terms of the version, function, principle, front panel, configuration and specifications. 7.15.1 Version Description The functional version of the IDL4 board is N1. 7.15.2 Function and Feature The IDL4 supports the ATM switching, IMA, and ATM protection. 7.15.3 Working Principle The IDL4 consists of the O/E converting module, physical layer module, ATM module and so on. 7.15.4 Front Panel On the front panel of the IDL4, there are indicators, interfaces, barcode and laser safety class label. 7.15.5 Valid Slots The IDL4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The IDL4 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack. 7.15.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the IDL4 indicates the optical interface type. 7.15.7 Board Protection The IDL4 supports the 1+1 board-level protection. The active and standby IDL4 should be housed in paired slots. 7.15.8 Board Configuration Reference You can use the T2000 to set parameters for the IDL4. 7.15.9 Technical Specifications The technical specifications of the IDL4 cover the optical interface specifications, board dimensions, weight and power consumption.

7.15.1 Version Description

The functional version of the IDL4 board is N1.

7.15.2 Function and Feature

The IDL4 supports the ATM switching, IMA, and ATM protection. Table 7-63 lists the functions and features of the IDL4.
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Table 7-63 Functions and features of the IDL4 Function and Feature Basic function Optical interface type Connector type Optical module type E3 ATM interface IMA function (ATM Forum IMA 1.1 standard) IDL4 Accesses and processes 1 x STM-4 ATM services. Supports the optical interfaces of the S-4.1, L-4.1, L-4.2 and Ve-4.2 types. LC. SFP. Not supported. Accesses and processes IMA services when used with E1 service processing board N1PQ1/N1PQM. Supports a maximum of 63 IMA E1 services. One ATM port supports a maximum of 16 IMA groups. Each IMA group supports 132 E1 signals. One ATM port supports a maximum of E1 links of 16 non-IMA groups. The maximum IMA multichannel delay is 226 ms. Max. uplink bandwidth ATM switching capability Mapping granularity IMA feature Supports 8 x VC-4, or 63 x VC-12 and +7 x VC-4. 1.0 Gbit/s. Supports VC-12, VC-4, or VC4-Xc (X:14), VC12-Xv (X:132). Accesses and processes IMA services when used with E1 service processing board. Processes IMA services for a maximum of 63 x E1 signals. Supports a maximum of 16 IMA groups. Each IMA group supports 1 32 E1 signals. The maximum IMA multichannel delay is 226 ms. Service type ATM connection Statistical multiplexing Flow type and QoS ATM multicast connection ATM protection (ITU-T I.630) Supports CBR, rt-VBR, nrt-VBR and UBR. 2048. Supported. Supports IETF RFC2514 and ATM forum TM4.0. Supports spacial multicast and logical multicast. Supports unidirectional or bidirectional 1+1, 1:1, VP-Ring, VC-Ring protection schemes.

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Function and Feature Board level 1+1 protection OAM function (ITU-T I.610) Maintenance feature Alarm and performance event

IDL4 Supported. Supports AIS, RDI, LB , and CC. Supports inloop and outloop at the ATM layer levels and the optical interface (except the outloop at external port), which are used for maintenance and fault locating. Provides rich alarms and performance events, which are used for maintenance and fault locating.

Note: The IMA function can encapsulate ATM cells into E1 signals. The IMA group can coexist with single E1. The IMA group can dynamically increase or decrease the bandwidth to enhance the bandwidth utilization. The IMA group can also converge 2M services, and can connect to other IMA equipment.

7.15.3 Working Principle

The IDL4 consists of the O/E converting module, physical layer module, ATM module and so on. Figure 7-39 shows the block diagram for the functions of the IDL4.

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Figure 7-39 Block diagram for the functions of the IDL4

622 Mbit/s

E/O

622 Mbit/s

high speed bus Cross-connet unit A

PHY module O/E

622 Mbit/s 622 Mbit/s

ATM module IMA module

Mapping module
high speed bus Cross-connet unit B

LOS Laser shut down

Communication and control module

Reference clock and frame header Communication

Cross-connet unit Scc unit

50 MHz 77 MHz 100 MHz

Clock module
+3.3 V

DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V

+1.2 V +1.5 V +1.8 V +2.5 V

Fuse

DC/DC converters

+3.3 V backup power

E/O Converting Module

The E/O converting module is responsible for E/O conversion.

Physical Layer Module

The physical layer module mainly:
l l l

Mappings ATM cells into SDH frames Demappings SDH frames to ATM cells Processes ATM service physical layer functions: cell delimitation, test and generation of header error control (HEC) sequence

ATM Module
The ATM module mainly performs ATM layer functions in the ATM protocol. These functions include:
l l l

Flow control Extraction and generation of cell headers ATM switching

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IMA Module
This module mainly performs IMA protocol functions. These functions are:
l l l l

Separation and re-creation of ATM cells Frame synchronization Insertion and extraction of IMA control protocol (ICP) cells Management of IMA groups

Mapping Module
The mapping module:
l l l l

Mappings ATM cells into SDH frame payload Demappings SDH frame payload to ATM cells Supports ATM physical layer functions Supports VC4-Xv (X4) virtual concatenation

Communication and Control Module

The communication and control module:
l l l l l l

Controls writing and reading of each chip Communicates with the NE Issues configured services Reports alarms of each functional module Checks R_LOS alarms of optical modules Controls the shutting of transmission

Clock Module
This module mainly generates working clocks for each chip. The frequencies of the clocks are 50 MHz, 77 MHz and 100 MHz.

DC/DC Converter Module

Through the DC/DC module, the power unit generates required voltages for each chip on the board. The following DC voltages are provided: +1.2 V, +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition, this unit also provides protection for the board +3.3 V power supply.

7.15.4 Front Panel

On the front panel of the IDL4, there are indicators, interfaces, barcode and laser safety class label.

Appearance of the Front Panel

Figure 7-40 shows the appearance of the front panel of the IDL4.
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Figure 7-40 Front panel of the IDL4

IDL4
STAT ACT PROG SRV

CLASS 1 LASER PRODUCT

OUT1 IN1
IDL4

Indicators
The following indicators are present on the front panel of the board:
l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are one optical interface on the front panel of the IDL4. Table 7-64 lists the type and usage of the optical interface.

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Table 7-64 Optical interface of the IDL4 Interface OUT1/IN1 Interface Type LC (pluggable) Usage Transmits and receives STM-4 optical signals.

7.15.5 Valid Slots

The IDL4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The IDL4 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

7.15.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code of the IDL4 indicates the optical interface type. Table 7-65 lists the relation between the board feature code and optical interface type for the IDL4. Table 7-65 Relation between the board feature code and the optical interface type Board SSN1IDL410 SSN1IDL411 SSN1IDL412 SSN1IDL413 Feature Code 10 11 12 13 Optical Interface Type S-4.1 L-4.1 L-4.2 Ve-4.2

7.15.7 Board Protection

The IDL4 supports the 1+1 board-level protection. The active and standby IDL4 should be housed in paired slots. The paired slots for the IDL4 are slots 13 and 12.

7.15.8 Board Configuration Reference

You can use the T2000 to set parameters for the IDL4. You can use the T2000 to set the following parameters for the IDL4:
l l l l

Port type Flow type Service type Peak cell rate (PCR)
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Sustainable cell rate (SCR) Maximum cell burst size Cell delay variation tolerance (CDVT)

For details on the parameters, refer to F Board Configuration Reference.

7.15.9 Technical Specifications

The technical specifications of the IDL4 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications

Table 7-66 lists the specifications of the optical interfaces of the IDL4. Table 7-66 Specifications of the optical interfaces of the IDL4 Item Optical interface type Optical source type Wavelength (nm) Transmission distance (km) Launched optical power (dBm) Receiver sensitivity (dBm) Overload optical power (dBm) Specification S-4.1 MLM 1274 to 1356 2 to 15 15 to 8 28 8 L-4.1 SLM 1280 to 1335 15 to 40 3 to +2 28 8 10 L-4.2 SLM 1480 to 1580 40 to 80 3 to +2 28 8 10 Ve-4.2 SLM 1480 to 1580 80 to 100 3 to +2 33 13 10.5

Minimum extinction 8.2 ratio (dB)

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the IDL4 are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 1.0
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Power Consumption
In the normal temperature (25), the maximum power consumption of the IDL4 is 41 W.

7.16 IDQ1
This section describes the IDQ1, a 4 x STM-1 ATM processing board, in terms of the version, function, principle, front panel, configuration and specifications. 7.16.1 Version Description The functional version of the IDQ1 board is N1. 7.16.2 Function and Feature The IDQ1 supports the ATM switching, IMA, and ATM protection. 7.16.3 Working Principle and Signal Flow The ADQ1 consists of the O/E converting module, physical layer module, ATM module and so on. 7.16.4 Front Panel On the front panel of the IDQ1, there are indicators, interfaces, barcode and laser safety class label. 7.16.5 Valid Slots The IDQ1 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The IDQ1 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack. 7.16.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the IDQ1 indicates the optical interface type. 7.16.7 Board Protection The IDQ1 supports the 1+1 board-level protection. The active and standby IDQ1 should be housed in paired slots. 7.16.8 Board Configuration Reference You can use the T2000 to set parameters for the IDQ1. 7.16.9 Technical Specifications The technical specifications of the IDQ1 cover the optical interface specifications, board dimensions, weight and power consumption.

7.16.1 Version Description

The functional version of the IDQ1 board is N1.

7.16.2 Function and Feature

The IDQ1 supports the ATM switching, IMA, and ATM protection. Table 7-67 lists the functions and features of the IDQ1.

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Table 7-67 Functions and features of the IDQ1 Function and Feature Basic function Optical interface type Connector type Optical module type E3 ATM interface IMA function (ATM Forum IMA 1.1 standard) IDQ1 Accesses and processes 4 x STM-1 ATM services. Supports the optical interfaces of the Ie-1, S-1.1, L-1.1, L-1.2 and Ve-1.2 types. LC. SFP. Not supported. Accesses and processes IMA services when used with E1 service processing board N1PQ1/N1PQM. Supports a maximum of 63 IMA E1 services. One ATM port supports a maximum of 16 IMA groups. Each IMA group supports 132 E1 signals. One ATM port supports a maximum of E1 links of 16 non-IMA groups. The maximum IMA multichannel delay is 226 ms. Max. uplink bandwidth ATM switching capability Mapping granularity IMA feature Supports 8 x VC-4, or 63 x VC-12 and 7 x VC-4. 1.0 Gbit/s. Suppports VC-12, VC-4, or VC4-Xc (X:14), VC12-Xv (X:132). Accesses and processes IMA services when used with E1 service processing board. Processes IMA services for a maximum of 63 x E1 signals. Supports a maximum of 16 IMA groups. Each IMA group supports 1 32 E1 signals. The maximum IMA multichannel delay is 226 ms. Service type ATM connection Statistical multiplexing Flow type and QoS ATM multicast connection ATM protection (ITU-T I.630) Supports CBR, rt-VBR, nrt-VBR and UBR. 2048. Supported. Supports IETF RFC2514 and ATM forum TM4.0. Supports spacial multicast and logical multicast. Supports unidirectional or bidirectional 1+1, 1:1, VP-Ring, VC-Ring protection schemes.

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Function and Feature Board level 1+1 protection OAM function (ITU-T I.610) Maintenance feature Alarm and performance event

IDQ1 Supported. Supports AIS, RDI, LB , and CC. Supports inloop and outloop at the ATM layer levels and the optical interface (except the outloop at external port), which are used for maintenance and fault locating. Provides rich alarms and performance events, which are used for maintenance and fault locating.

Note: The IMA function can encapsulate ATM cells into E1 signals. The IMA group can coexist with single E1. The IMA group can dynamically increase or decrease the bandwidth to enhance the bandwidth utilization. The IMA group can also converge 2M services, and can connect to other IMA equipment.

7.16.3 Working Principle and Signal Flow

The ADQ1 consists of the O/E converting module, physical layer module, ATM module and so on. Figure 7-41 shows the block diagram for the functions of the IDQ1.

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Figure 7-41 Block diagram for the functions of the IDQ1

4 x 155 Mbit/s

E/O

4 x 155 Mbit/s

high speed bus Cross-connet unit A

4 x 155 Mbit/s

O/E

4 x 155 Mbit/s

PHY module

ATM module IMA module

Mapping module
high speed bus Cross-connet unit B

LOS Laser shut down

Communication and control module

Reference clock and frame header Communication

Cross-connet unit Scc unit

50 MHz 77 MHz 100 MHz

Clock module
+3.3 V

DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V

+1.2 V +1.5 V +1.8 V +2.5 V

Fuse

DC/DC converters

+3.3 V backup power

E/O Converting Module

The E/O converting module is responsible for E/O conversion.

Physical Layer Module

The physical layer module mainly:
l l l

Mappings ATM cells into SDH frames Demappings SDH frames to ATM cells Processes ATM service physical layer functions: cell delimitation, test and generation of header error control (HEC) sequence

ATM Module
The ATM module mainly performs ATM layer functions in the ATM protocol. These functions include:
l l l

Flow control Extraction and generation of cell headers ATM switching

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IMA Module
This module mainly performs IMA protocol functions. These functions are:
l l l l

Separation and re-creation of ATM cells Frame synchronization Insertion and extraction of IMA control protocol (ICP) cells Management of IMA groups

Mapping Module
The mapping module:
l l l l

Mappings ATM cells into SDH frame payload Demappings SDH frame payload to ATM cells Supports ATM physical layer functions Supports VC4-Xv (X4) virtual concatenation

Communication and Control Module

The communication and control module:
l l l l l l

Controls writing and reading of each chip Communicates with the NE Issues configured services Reports alarms of each functional module Checks R_LOS alarms of optical modules Controls the shutting of transmission

Clock Module
This module mainly generates working clocks for each chip. The frequencies of the clocks are 50 MHz, 77 MHz and 100 MHz.

DC/DC Converter Module

Through the DC/DC module, the power unit generates required voltages for each chip on the board. The following DC voltages are provided: +1.2 V, +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition, this unit also provides protection for the board +3.3 V power supply.

7.16.4 Front Panel

On the front panel of the IDQ1, there are indicators, interfaces, barcode and laser safety class label.

Appearance of the Front Panel

Figure 7-42 shows the appearance of the front panel of the IDQ1.
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Figure 7-42 Front panel of the IDQ1

IDQ1
STAT ACT PROG SRV
CLASS 1 LASER PRODUCT

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4

IDQ1

Indicators
The following indicators are present on the front panel of the board:
l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are four optical interfaces on the front panel of the IDQ1. Table 7-68 lists the type and usage of the optical interfaces.

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Table 7-68 Optical interfaces of the IDQ1 Interface OUT1/IN1 OUT2/IN2 OUT3/IN3 OUT4/IN4 Interface Type LC (pluggable) LC (pluggable) LC (pluggable) LC (pluggable) Usage Transmits and receives STM-1 optical signals. Transmits and receives STM-1 optical signals. Transmits and receives STM-1 optical signals. Transmits and receives STM-1 optical signals.

7.16.5 Valid Slots

The IDQ1 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The IDQ1 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

7.16.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code of the IDQ1 indicates the optical interface type. Table 7-69 lists the relation between the board feature code and optical interface type for the IDQ1. Table 7-69 Relation between the board feature code and the optical interface type Board Barcode SSN1IDQ110 SSN1IDQ111 SSN1IDQ112 SSN1IDQ113 SSN1IDQ114 Feature Code 10 11 12 13 14 Optical Interface Type S-1.1 L-1.1 L-1.2 Ve-1.2 Ie-1

7.16.7 Board Protection

The IDQ1 supports the 1+1 board-level protection. The active and standby IDQ1 should be housed in paired slots. The paired slots for the IDQ1 are slots 13 and 12.

7.16.8 Board Configuration Reference

You can use the T2000 to set parameters for the IDQ1. You can use the T2000 to set the following parameters for the IDQ1:
l

Port type
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Flow type Service type Peak cell rate (PCR) Sustainable cell rate (SCR) Maximum cell burst size Cell delay variation tolerance (CDVT)

For details on the parameters, refer to F Board Configuration Reference.

7.16.9 Technical Specifications

The technical specifications of the IDQ1 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications

Table 7-70 lists the specifications of the optical interfaces of the IDQ1. Table 7-70 Specifications of the optical interfaces of the IDQ1 Item Optical interface type Optical source type Wavelength (nm) Transmission distance (km) Launched optical power (dBm) Receiver sensitivity (dBm) Overload optical power (dBm) Minimum extinction ratio (dB) Specification Ie-1 MLM 1260 to 1360 0 to 0.5 19 to 14 31 S-1.1 MLM 1261 to 1360 2 to 15 15 to 8 28 L-1.2 SLM 1480 to 1580 40 to 80 5 to 0 34 Ve-1.2 SLM 1480 to 1580 80 to 100 3 to 0 34 L-1.1 MLM, SLM 1263 to 1360 15 to 40 5 to 0 34

14 10

8 8.2

10 10

10 10

10 10

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).
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Mechanical Specifications
The mechanical specifications of the IDQ1 are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 1.0

Power Consumption
In the normal temperature (25), the maximum power consumption of the IDQ1 is 41 W.

7.17 MST4
This section describes the MST4, a 4-channel multi-service transparent transmission board, in terms of the version, function, principle, front panel, configuration and specifications. 7.17.1 Version Description The functional version of the MST4 board is N1. 7.17.2 Function and Feature The MST4 is used to access multiple services, and to maintain alarms. 7.17.3 Working Principle and Signal Flow The MST4 consists of the client-side access module, FC protocol processing module, encapsulation and mapping module, Communication and control module and so on. 7.17.4 Front Panel On the front panel of the MST4, there are indicators, interfaces and barcode. 7.17.5 Valid Slots The MST4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The MST4 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack. 7.17.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the MST4 indicates the service type, optical interface type and transmission distance. 7.17.7 Board Configuration Reference You can use the T2000 to set parameters for the MST4. 7.17.8 Technical Specifications The specifications of the MST4 cover the optical interface specifications, mechanical specifications and power consumption.

7.17.1 Version Description

The functional version of the MST4 board is N1.

7.17.2 Function and Feature

The MST4 is used to access multiple services, and to maintain alarms. Table 7-71 lists the functions and features of the MST4.
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Table 7-71 Functions and features of the MST4 Function and Feature Basic function Connector type Optical module type Service type MST4 Provides four independent ports to access multiple services, and supports the transparent transmission of the SAN and Video services. LC. SFP. Supports the FC100/FICON, FC200, ESCON, and DVB-ASI services.Table 7-72 lists types and rates of the services. Accesses four-channel FC services (FC100/FICON and FC200) at the same time, and the total bandwidth is less than 2.5 Gbit/s. Supports the full-rate transmission of the FC services (one-channel FC200 services or two-channel FC100 services). Accesses four-channel ESCON or DVB-ASI services, and the total bandwidth is less than 2.5 Gbit/s. Distance extension Max. uplink bandwidth Mapping granularity ESCON DVB-ASI Encapsulation format Maintenance feature Alarm and performance event The first and second ports support the distance extension function at the SDH side. (FC100: 3000 km; FC200: 1500 km) 2.5 Gbit/s (Four 622 Mbit/s buses are present on the backplane to directly connect to the cross-connect unit.) Supports VC4-Xc (X: 4, 8, 16). Accesses four-channel ESCON services, and the total bandwidth is less than 2.5 Gbit/s. Accesses four-channel DVB-ASI services, and the total bandwidth is less than 2.5 Gbit/s. Supports GFP-T, compliant with ITU-T G.7041. Supports the inloop at the port level of the client side. The loopack is used for maintenance and fault locating. Provides rich alarms and performance events, which are used for maintenance and fault locating.

Table 7-72 Services and service rates provided by the MST4 Service Type FC100/FICON FC200 Rate 1062.5 Mbit/s 2125 Mbit/s Remarks SAN service SAN service

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Service Type ESCON DVB-ASI

Rate 200 Mbit/s. 270 Mbit/s

Remarks SAN service. Video service

7.17.3 Working Principle and Signal Flow

The MST4 consists of the client-side access module, FC protocol processing module, encapsulation and mapping module, Communication and control module and so on. Figure 7-43 shows the block diagram for the functions of the MST4. Figure 7-43 Block diagram for the functions of the MST4

FC50 FC100 FC200 FICON DVB-ASI ESCON

Clientside access module

FC1_ RCV

FC2

FC1_ SND

Encaps ulation Mapping Interface conversion module

Cross-connect unit A/B

FC1_ SND

FC2

FC1_ RCV

Decaps ulation

Cross-connect unit A/B

FC processing module Encapsulation and mapping module

Communication

Communication and control module

SCC unit Crossconnect unit

Reference clock and frame header

100 MHz 125 MHz 135 MHz 212.5 MHz 622 MHz

Clock module
+3.3 V +1.2 V +1.5 V +1.8 V +2.5 V

DC/DC converter DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse

+3.3 V backup power

The function modules are described as follows:

Client-side Access Module

The client-side access module accesses FC50, FC100, FC200, FICON, DVB-ASI and ESCON services. The client-side interface unit performs O/E conversion for services and monitors the optical signals at client side. In the upstream direction, the client-side data interface (CDI) receives serial data signals input by the SFP optical module. The serial data signals are then transmitted to the PCS function module for physical layer and 8B/10B line performance monitoring. In the downstream direction, 8B/ 10B conversion is performed to the signals from FC. The signals are then adapted into client reference clock by inserting or discarding idle packets. After being converted from parallel signals to serial signals, the signals are transmitted through the CDI interface to the optical module at client side.
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FC protocol Processing Module

The FC protocol processing unit mainly extends the distance the FC services. This module supports transmitting 2 x FC100 services up to 3,000 km or 1 x FC200 services up to 1500 km. The FC protocol processing unit performs FC1 layer and FC2 layer functions. The FC1 layer functions include:
l l l

8B/10B conversion Synchronous processing Extraction of primitive signal and primitive sequence

The FC2 layer functions include:

l l l

Check and statistics of all special frames Modification of values of some special frames (FLOG1, PLOG1 and ELP) CRC check

Encapsulation and Mapping Module

The encapsulation and mapping module mainly:
l l

Encapsulates and mappings data Decapsulates and demappings data

According to signal flow direction, the function modules inside the chip can be classified into modules in ingress direction and ones in egress direction. The ingress direction is for processing from client side to line side. The egress direction is for line-side processing. Ingress direction: Through GFP encapsulation, 64B/65B conversion is performed to data bytes after decoding. The data bytes are then mapped under GFP protocol. Egress direction: SDH data frames are received from the line-side interface module. After the overhead is processed, GFP data frames are extracted from SDH concatenated channels and then are transmitted to the decapsulating module for decapsulation.

Communication and Control Module

The communication and control module consists of CPU, register, oscillator, Ethernet port and HDLC controller. This module connects to external circuits through bus. The communication and control module manages and configures other modules of the boards. This module contains basic logic units:
l l l l l l

Writes and reads register Provides interface for CPU Checks and selects clock Performs phase discrimination and frequency division to the clock Checks the in-service state of the cross-connect, the SCC and the line boards Checks reset control circuits of each chip
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l l l

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Controls the shutting down of the optical module Processes communications Controls indicators

System Clock Module

This module provides required reference clocks for boards. The clock frequencies are 100 MHz, 125 MHz and so on.

DC/DC Converter Module

Through the DC/DC module, the power unit generates direct currents for each chip on the board. The 48 V/ 60 V powers are converted to the following direct currents: +1.2 V, +1.8 V, +2.5 V and +3.3 V. In addition, this unit also provides protection for the board +3.3 V power.

7.17.4 Front Panel

On the front panel of the MST4, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 7-44 shows the appearance of the front panel of the MST4. Figure 7-44 Front panel of the MST4
MST4
STAT ACT PROG SRV

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4

MST4

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Indicators
The following indicators are present on the front panel of the board:
l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are four pairs of optical interfaces on the front panel of the MST4. Table 7-73 lists the type and usage of the optical interfaces. Table 7-73 Optical interfaces of the MST4 Interface IN1-IN4 OUT1-OUT4 Interface Type LC LC Usage Receives multi-service optical signals. Transmits multi-service optical signals.

7.17.5 Valid Slots

The MST4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The MST4 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

7.17.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code of the MST4 indicates the service type, optical interface type and transmission distance. Table 7-74 lists the relation between the board feature code and service type. Table 7-74 Relation between the board feature code and service type Board Barcode SSN1MST410 SSN1MST411 SSN1MST412 SSN1MST413 SSN1MST414 SSN1MST415
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Feature Code 10 11 12 13 14 15

Service Type (Optical Interface Type) 2 x FC (SM) 2 x FC (SM) 2 x FC (MM) 4 x ESCON/DVB-ASI (SM) 4 x ESCON/DVB-ASI (MM) 1 x FC2 (MM)

Transmission Distance 2 km 15 km 0.5 km 15 km 2 km 7-149

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Board Barcode

Feature Code

Service Type (Optical Interface Type) ESCON/DVB-ASI (MM)

Transmission Distance

SSN1MST416

16

1 x FC2 (MM) ESCON/DVB-ASI (SM)

SSN1MST417

17

1 x FC (SM) 2 x ESCON/DVB-ASI (SM)

2 km 2 km -

SSN1MST418

18

1 x FC (SM) 2 x ESCON/DVB-ASI (MM)

7.17.7 Board Configuration Reference

You can use the T2000 to set parameters for the MST4. You can use the T2000 to set the following parameters for the MST4:
l l

J1 byte C2 byte

For details on the parameters, refer to F Board Configuration Reference.

7.17.8 Technical Specifications

The specifications of the MST4 cover the optical interface specifications, mechanical specifications and power consumption.

Optical Interface Specifications

The optical interfaces of the MST4 can use several types of the optical interfaces. Table 7-75 lists the specifications of the optical interfaces. Table 7-75 Specifications of the optical interfaces of the MST4 Item Optical interface type Specification X3.296/(DVB-ASI ) EN50083-9 200-M5-SN-I Optical module code Service type Service rate
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200-SM-LC-I 34060287 34060325 FC200, FC100 STM-1 2.125 Gbit/s STM-16

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34060277 ESCON/DVB STM-4

34060288

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Item Optical source type Wavelength (nm) Transmission distance (km) Max. launched optical power (dBm) Min. launched optical power (dBm) Receiver sensitivity (dBm) Overload optical power (dBm)

Specification SLM 1310 15 8 2 14 LED LED 850 0.5 -2.5 MLM 1310 2 -3 15 0 SLM

15

19

-9.5

-10

-5

31

30

17

21

14

Mechanical Specifications
The mechanical specifications of the MST4 are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 0.9

Power Consumption
In the normal temperature (25), the maximum power consumption of the MST4 is 26 W.

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Interface Boards and Switching Boards

About This Chapter

This chapter describes the interface and switching boards. The interface boards are used to access cables and fibers. The switching boards are used to provide the TPS protection. 8.1 L12S This section describes the L12S, a 16 x E1/T1 electrical interface switching board, in terms of the version, function, principle, front panel and specifications. 8.2 D12B This section describes the D12B, a 32 x E1/T1 electrical interface board, in terms of the version, function, principle, front panel and specifications. 8.3 D12S This section describes the D12S, a 32 x E1/T1 electrical interface switching board, in terms of the version, function, principle, front panel and specifications. 8.4 L75S This section describes the L75S, a 16 x E1 electrical interface switching board, in terms of the version, function, principle, front panel and specifications. 8.5 D75S This section describes the D75S, a 32 x E1/T1 electrical interface switching board, in terms of the version, function, principle, front panel and specifications. 8.6 D34S This section describes the D34S, a 6 x E3/T3 electrical interface switching board, in terms of the version, function, principle, front panel and specifications. 8.7 C34S This section describes the C34S, a 3 x E3/T3 electrical interface switching board, in terms of the version, function, principle, front panel and specifications. 8.8 EU04 This section describes the EU04, a 4 x STM-1 electrical interface board, in terms of the version, function, working principle, front panel and specifications. 8.9 EU08
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This section describes the EU08, an 8 x STM-1 electrical interface board, in terms of the version, function, working principle, front panel and specifications. 8.10 OU08 This section describes the OU08, an 8 x STM-1 optical interface board, in terms of the version, function, working principle, front panel and parameters. 8.11 MU04 This section describes the MU04, a 4 x E4/STM-1 electrical interface board, in terms of the version, function, principle, front panel and specifications. 8.12 TSB4 This section describes the TSB4, a 4-channel interface switching board. 8.13 TSB8 This section describes the TSB8, an 8-channel optical interface switching board, in terms of the version, function, principle, front panel and specifications. 8.14 EFF8 This section describes the EFF8, an 8 x 100M Ethernet optical interface board, in terms of the version, function, principle, front panel and specifications. 8.15 ETF8 This section describes the ETF8, an 8 x 100M Ethernet twisted pair interface board, in terms of the version, function, principle, front panel and specifications. 8.16 ETS8 This section describes the ETS8, an 8 x 10/100M Ethernet twisted pair interface switching board, in terms of the version, function, principle, front panel and specifications. 8.17 DM12 This section describes the DM12, a DDN interface board, in terms of the version, function, principle, front panel and specifications.

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8.1 L12S
This section describes the L12S, a 16 x E1/T1 electrical interface switching board, in terms of the version, function, principle, front panel and specifications. 8.1.1 Version Description The functional version of the L12S is R1. 8.1.2 Function and Feature The L12S is used to receive and transmit 16 x E1/T1 electrical signals, and the L12S must be used with the PD1. 8.1.3 Working Principle and Signal Flow The L12S consists of the interface module, switch matrix module, and power supply module. 8.1.4 Front Panel On the front panel of the L12S, there are interfaces and barcode. 8.1.5 Valid Slots As the interface board for the PD1, the L12S can be housed in any of slots 6 and 7 in the OptiX OSN 1500A subrack. 8.1.6 Technical Specifications The technical specifications of the L12S cover the board dimensions, weight and power consumption.

8.1.1 Version Description

The functional version of the L12S is R1.

8.1.2 Function and Feature

The L12S is used to receive and transmit 16 x E1/T1 electrical signals, and the L12S must be used with the PD1.

8.1.3 Working Principle and Signal Flow

The L12S consists of the interface module, switch matrix module, and power supply module. Figure 8-1 shows the block diagram for the functions of the L12S. Figure 8-1 Block diagram for the functions of the L12S
Backplane Crossconnect board
E1/T1

Interface module
E1/T1

Swictch matrix module

PD1

PD1

+3.3 V

Power supply module

Fuse

+3.3 V

Power

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Interface Module
The interface module receives and transmits the E1/T1 electrical signals.

Switch Matrix Module

In the receive direction, the switch matrix module accesses signals from the interface module, and selects the output direction of the signals according to the TPS protection control signals from the cross-connect board. When the TPS protection is not performed, the switch matrix module transmits the signals to the PD1 board. When the TPS protection is performed, the switch matrix module transmits the signals to the protection board for bridging. In the transmit direction, the working direction of the switch matrix module is the reverse of the receive direction.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.1.4 Front Panel

On the front panel of the L12S, there are interfaces and barcode.

Appearance of the Front Panel

Figure 8-2 shows the appearance of the front panel of the L12S. Figure 8-2 Front panel of the L12S

L12S

1-16

Interfaces
On the front panel of the L12S, there are two 2mmHM connectors, which are used to access 16 x E1/T1 electrical signals.

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8.1.5 Valid Slots

As the interface board for the PD1, the L12S can be housed in any of slots 6 and 7 in the OptiX OSN 1500A subrack. Table 8-1 lists the valid slots for the PD1 and corresponding slots for the L12S. The L12S housed in the slot with a smaller number accesses the first 16 (116) channels of E1/T1 electrical signals. The L12S housed in the slot with a larger number accesses the last 16 (1732) channels of E1/ T1 electrical signals. Table 8-1 Valid slots for the PD1 and corresponding slots for the L12S in the OptiX OSN 1500A subrack Valid Slot for the PD1 Slot 12 Corresponding Slot for the L12S Slots 6 and 7

8.1.6 Technical Specifications

The technical specifications of the L12S cover the board dimensions, weight and power consumption.

Mechanical Specifications
The mechanical specifications of the L12S are as follows:
l l

Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W) Weight (kg): 0.27

Power Consumption
In the normal temperature (25), the maximum power consumption of the L12S is 4.5 W.

8.2 D12B
This section describes the D12B, a 32 x E1/T1 electrical interface board, in terms of the version, function, principle, front panel and specifications. 8.2.1 Version Description The functional version of the D12B board is N1. 8.2.2 Function and Feature The D12B is used to receive and transmit 32 x E1/T1 electrical signals, and the D12B must be used with the PQ1 or PQM. 8.2.3 Working Principle and Signal Flow The D12B consists of the interface module and power supply module. 8.2.4 Front Panel On the front panel of the D12B, there are interfaces and barcode. 8.2.5 Valid Slots
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The D12B can be housed in any of slots 1417 in the OptiX OSN 1500B subrack. The D12B can be used as the interface board for the PQ1 or PQM. 8.2.6 Technical Specifications The technical specifications of the D12B cover the board dimensions, weight and power consumption.

8.2.1 Version Description

The functional version of the D12B board is N1.

8.2.2 Function and Feature

The D12B is used to receive and transmit 32 x E1/T1 electrical signals, and the D12B must be used with the PQ1 or PQM.

8.2.3 Working Principle and Signal Flow

The D12B consists of the interface module and power supply module. Figure 8-3 shows the block diagram for the functions of the D12B. Figure 8-3 Block diagram for the functions of the D12B
Backplane

E1/T1

PQ1/PQM

Interface module
E1/T1 PQ1/PQM

+3.3 V

Power supply module

Fuse

+3.3 V Power

Interface Module
The interface module receives and transmits the E1/T1 electrical signals.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.2.4 Front Panel

On the front panel of the D12B, there are interfaces and barcode.

Appearance of the Front Panel

Figure 8-4 shows the appearance of the front panel of the D12B.
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Figure 8-4 Front panel of the D12B

D12B

1 8 9 16 17 24 25 32

D12B

Interfaces
There are four DB44 interfaces on the front panel of the D12B. Table 8-2 lists the type and usage of the interfaces. Table 8-2 Interfaces on the front panel of the D12B Interface 18 916 1724 2532 Interface Type DB44 DB44 DB44 DB44 Usage Receive eight channels (18) of E1/T1 signals. Receive eight channels (916) of E1/T1 signals. Receive eight channels (1724) of E1/T1 signals. Receive eight channels (25-32) of E1/T1 signals.

Table 8-3 lists the pins of the DB44 interfaces.

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Table 8-3 Pins of the DB44 interfaces of the D12B Front View
1

Pin 38 23 37 22 36 21

Usage R1 to receive the first channel of signals. R2 to receive the second channel of signals. R3 to receive the third channel of signals. R4 to receive the fourth channel of signals. T1 to transmit the first channel of signals. T2 to transmit the second channel of signals. T3 to transmit the third channel of signals. T4 to transmit the fourth channel of signals.

Pin 34 19 33 18 32 17 31 16 11 26 10 25 9 24 8 7

Usage R5 to receive the fifth channel of signals. R6 to receive the sixth channel of signals. R7 to receive the seventh channel of signals. R8 to receive the eighth channel of signals. T5 to transmit the fifth channel of signals. T6 to transmit the sixth channel of signals. T7 to transmit the seventh channel of signals. T8 to transmit the eighth channel of signals.

44

35 20 15 30 14 29 13 28 12 27

8.2.5 Valid Slots

The D12B can be housed in any of slots 1417 in the OptiX OSN 1500B subrack. The D12B can be used as the interface board for the PQ1 or PQM. Table 8-4 lists the valid slots for the PQ1/PQM and corresponding slots for the D12B. The D12B housed in the slot with a smaller number accesses the first 32 (132) channels of E1/T1 electrical signals. The D12B housed in the slot with a larger number accesses the last 31 (3363) channels of E1/T1 electrical signals. Table 8-4 Valid slots for the PQ1/PQM and corresponding slots for the D12B in the OptiX OSN 1500B subrack Valid Slot for the PQ1/PQM Slot 12 Slot 13 Corresponding Slot for the D12B Slots 14 and 15 Slots 16 and 17

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8.2.6 Technical Specifications

The technical specifications of the D12B cover the board dimensions, weight and power consumption.

Mechanical Specifications
The mechanical specifications of the D12B are as follows:
l l

Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W) Weight (kg): 0.3

Power Consumption
In the normal temperature (25), the maximum power consumption of the D12B is 0 W.

8.3 D12S
This section describes the D12S, a 32 x E1/T1 electrical interface switching board, in terms of the version, function, principle, front panel and specifications. 8.3.1 Version Description The functional version of the D12S board is N1. 8.3.2 Function and Feature The D12S is used to receive and transmit 32 x E1/T1 electrical signals, and the D12S must be used with the PQ1 or PQM. 8.3.3 Working Principle and Signal Flow The D12S consists of the interface module, switch matrix module, and power supply module. 8.3.4 Front Panel On the front panel of the D12S, there are interfaces and barcode. 8.3.5 Valid Slots The D12S can be housed in any of slots 1417 in the OptiX OSN 1500B subrack. The D12S can be used as the interface board for the PQ1 or PQM. 8.3.6 Technical Specifications The technical specifications of the D12S cover the board dimensions, weight and power consumption.

8.3.1 Version Description

The functional version of the D12S board is N1.

8.3.2 Function and Feature

The D12S is used to receive and transmit 32 x E1/T1 electrical signals, and the D12S must be used with the PQ1 or PQM.

8.3.3 Working Principle and Signal Flow

The D12S consists of the interface module, switch matrix module, and power supply module.
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Figure 8-5 shows the block diagram for the functions of the D12S. Figure 8-5 Block diagram for the functions of the D12S
Backplane Crossconnect board
E1/T1

Interface module
E1/T1

Swictch matrix module

PQ1/ PQM

PQ1/ PQM

+3.3 V

Power supply module

Fuse

+3.3 V

Power

Interface Module
The interface module receives and transmits the E1/T1 electrical signals.

Switch Matrix Module

In the receive direction, the switch matrix module accesses signals from the interface module, and selects the output direction of the signals according to the TPS protection control signals from the cross-connect board. When the TPS protection is not performed, the switch matrix module transmits the signals to the PD1 or PQM board. When the TPS protection is performed, the switch matrix module transmits the signals to the protection board for bridging. In the transmit direction, the working direction of the switch matrix module is the reverse of the receive direction.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.3.4 Front Panel

On the front panel of the D12S, there are interfaces and barcode.

Appearance of the Front Panel

Figure 8-6 shows the appearance of the front panel of the D12S.

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Figure 8-6 Front panel of the D12S

D12S

18 9 16 1724 25 32

D12S

Interfaces
There are four DB44 interfaces on the front panel of the D12S. Table 8-5 lists the type and usage of the optical interfaces. Table 8-5 Interfaces on the front panel of the D12S Interface 18 916 1724 2532 Interface Type DB44 DB44 DB44 DB44 Usage Receive eight channels (18) of E1/T1 signals. Receive eight channels (916) of E1/T1 signals. Receive eight channels (1724) of E1/T1 signals. Receive eight channels (2532) of E1/T1 signals.

Table 8-6 lists the pins of the DB44 interfaces.

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Table 8-6 Pins of the DB44 interfaces of the D12S Front View
1

Pin 38 23 37 22 36 21

Usage R1 to receive the first channel of signals. R2 to receive the second channel of signals. R3 to receive the third channel of signals. R4 to receive the fourth channel of signals. T1 to transmit the first channel of signals. T2 to transmit the second channel of signals. T3 to transmit the third channel of signals. T4 to transmit the fourth channel of signals.

Pin 34 19 33 18 32 17 31 16 11 26 10 25 9 24 8 7

Usage R5 to receive the fifth channel of signals. R6 to receive the sixth channel of signals. R7 to receive the seventh channel of signals. R8 to receive the eighth channel of signals. T5 to transmit the fifth channel of signals. T6 to transmit the sixth channel of signals. T7 to transmit the seventh channel of signals. T8 to transmit the eighth channel of signals.

44

35 20 15 30 14 29 13 28 12 27

8.3.5 Valid Slots

The D12S can be housed in any of slots 1417 in the OptiX OSN 1500B subrack. The D12S can be used as the interface board for the PQ1 or PQM. Table 8-7 lists the valid slots for the PQ1/PQM and corresponding slots for the D12S. The D12S housed in the slot with a smaller number accesses the first 32 (132) channels of E1/T1 electrical signals. The D12S housed in the slot with a larger number accesses the last 31 (3363) channels of E1/T1 electrical signals. Table 8-7 Valid slots for the PQ1/PQM and corresponding slots for the D12S in the OptiX OSN 1500B subrack Valid Slot for the PQ1/PQM Slot 12 Slot 13 Corresponding Slot for the D12S Slots 14 and 15 Slots 16 and 17

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8.3.6 Technical Specifications

The technical specifications of the D12S cover the board dimensions, weight and power consumption.

Mechanical Specifications
The mechanical specifications of the D12S are as follows:
l l

Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W) Weight (kg): 0.4

Power Consumption
In the normal temperature (25), the maximum power consumption of the D12S in the switching state is 9 W and that of the D12S in the normal state is 0 W.

8.4 L75S
This section describes the L75S, a 16 x E1 electrical interface switching board, in terms of the version, function, principle, front panel and specifications. 8.4.1 Version Description The functional version of the L75S is R1. 8.4.2 Function and Feature The L75S is used to receive and transmit 16 x E1 electrical signals, and the L75S must be used with the PD1. 8.4.3 Working Principle and Signal Flow The L75S consists of the interface module, switch matrix module, and power supply module. 8.4.4 Front Panel On the front panel of the L75S, there are interfaces and barcode. 8.4.5 Valid Slots The L75S can be housed in any slots of 67 in the subrack. The L75S can be used as the interface board for the PD1. 8.4.6 Technical Specifications The technical specifications of the L75S cover the board dimensions, weight and power consumption.

8.4.1 Version Description

The functional version of the L75S is R1.

8.4.2 Function and Feature

The L75S is used to receive and transmit 16 x E1 electrical signals, and the L75S must be used with the PD1.
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8.4.3 Working Principle and Signal Flow

The L75S consists of the interface module, switch matrix module, and power supply module. Figure 8-7 shows the block diagram for the functions of the L75S. Figure 8-7 Block diagram for the functions of the L75S
Backplane Crossconnect board
E1

Interface module
E1

Swictch matrix module

PD1

PD1

+3.3 V

Power supply module

Fuse

+3.3 V

Power

Interface Module
The interface module receives and transmits the E1 electrical signals.

Switch Matrix Module

In the receive direction, the switch matrix module accesses signals from the interface module, and selects the output direction of the signals according to the TPS protection control signals from the cross-connect board. When the TPS protection is not performed, the switch matrix module transmits the signals to the PD1 board. When the TPS protection is performed, the switch matrix module transmits the signals to the protection board for bridging. In the transmit direction, the working direction of the switch matrix module is the reverse of the receive direction.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.4.4 Front Panel

On the front panel of the L75S, there are interfaces and barcode.

Appearance of the Front Panel

Figure 8-8 shows the appearance of the front panel of the L75S.

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Figure 8-8 Front panel of the L75S

L75S

1-16

Interfaces
On the front panel of the L75S, there are two 2mmHM connectors, which are used to access 16 x E1 electrical signals.

8.4.5 Valid Slots

The L75S can be housed in any slots of 67 in the subrack. The L75S can be used as the interface board for the PD1. Table 8-8 lists the valid slots for the PD1 and corresponding slots for the L75S. The L75S housed in the slot with a smaller number accesses the first 16 (116) channels of E1 electrical signals. The L75S housed in the slot with a larger number accesses the last 16 (1732) channels of E1 electrical signals. Table 8-8 Valid slots for the PD1 and corresponding slots for the L75S Valid Slot for the PD1 Slot 12 Corresponding Slot for the L75S Slots 6 and 7

8.4.6 Technical Specifications

The technical specifications of the L75S cover the board dimensions, weight and power consumption.

Mechanical Specifications
The mechanical specifications of the L75S are as follows:
l l

Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W) Weight (kg): 0.24
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Power Consumption
In the normal temperature (25), the maximum power consumption of the L75S is 2.7 W.

8.5 D75S
This section describes the D75S, a 32 x E1/T1 electrical interface switching board, in terms of the version, function, principle, front panel and specifications. 8.5.1 Version Description The functional version of the D75S board is N1. 8.5.2 Function and Feature The D75S is used to receive and transmit 32 x E1/T1 electrical signals, and the D75S must be used with the PQ1. 8.5.3 Working Principle and Signal Flow The D75S consists of the interface module, switch matrix module, and power supply module. 8.5.4 Front Panel On the front panel of the D75S, there are interfaces and barcode. 8.5.5 Valid Slots As the interface board for the PQ1, the D75S can be housed in any of slots 1417 in the OptiX OSN 1500B subrack. 8.5.6 Technical Specifications The technical specifications of the D75S cover the board dimensions, weight and power consumption.

8.5.1 Version Description

The functional version of the D75S board is N1.

8.5.2 Function and Feature

The D75S is used to receive and transmit 32 x E1/T1 electrical signals, and the D75S must be used with the PQ1.

8.5.3 Working Principle and Signal Flow

The D75S consists of the interface module, switch matrix module, and power supply module. Figure 8-9 shows the block diagram for the functions of the D75S.

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Figure 8-9 Block diagram for the functions of the D75S

Backplane Crossconnect board
E1/T1

Interface module
E1/T1

Swictch matrix module

PQ1/ PQM

PQ1/ PQM

+3.3 V

Power supply module

Fuse

+3.3 V

Power

Interface Module
The interface module receives and transmits the E1/T1 electrical signals.

Switch Matrix Module

In the receive direction, the switch matrix module accesses signals from the interface module, and selects the output direction of the signals according to the TPS protection control signals from the cross-connect board. When the TPS protection is not performed, the switch matrix module transmits the signals to the PQ1 board. When the TPS protection is performed, the switch matrix module transmits the signals to the protection board for bridging. In the transmit direction, the working direction of the switch matrix module is the reverse of the receive direction.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.5.4 Front Panel

On the front panel of the D75S, there are interfaces and barcode.

Appearance of the Front Panel

Figure 8-10 shows the appearance of the front panel of the D75S.

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Figure 8-10 Front panel of the D75S

D75S

18 9 16 1724 25 32

D75S

Interfaces
There are four DB44 interfaces on the front panel of the D75S. Table 8-9 lists the type and usage of the DB44 interfaces. Table 8-9 Interfaces on the front panel of the D75S Interface 18 916 1724 2532 Interface Type DB44 DB44 DB44 DB44 Usage Receive eight channels (18) of E1/T1 signals. Receive eight channels (916) of E1/T1 signals. Receive eight channels (1724) of E1/T1 signals. Receive eight channels (2532) of E1/T1 signals.

Table 8-10 lists the pins of the DB44 interface.

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Table 8-10 Pins of the DB44 interfaces of the D75S Front View
1

Pin 38 23 37 22 36 21

Usage R1 to receive the first channel of signals. R2 to receive the second channel of signals. R3 to receive the third channel of signals. R4 to receive the fourth channel of signals. T1 to transmit the first channel of signals. T2 to transmit the second channel of signals. T3 to transmit the third channel of signals. T4 to transmit the fourth channel of signals.

Pin 34 19 33 18 32 17 31 16 11 26 10 25 9 24 8 7

Usage R5 to receive the fifth channel of signals. R6 to receive the sixth channel of signals. R7 to receive the seventh channel of signals. R8 to receive the eighth channel of signals. T5 to transmit the fifth channel of signals. T6 to transmit the sixth channel of signals. T7 to transmit the seventh channel of signals. T8 to transmit the eighth channel of signals.

44

35 20 15 30 14 29 13 28 12 27

8.5.5 Valid Slots

As the interface board for the PQ1, the D75S can be housed in any of slots 1417 in the OptiX OSN 1500B subrack. Table 8-11 lists the valid slots for the PQ1 and corresponding slots for the D75S. The D75S housed in the slot with a smaller number accesses the first 32 (132) channels of E1/T1 electrical signals. The D75S housed in the slot with a larger number accesses the last 31 (3363) channels of E1/T1 electrical signals. Table 8-11 Valid slots for the PQ1 and corresponding slots for the D75S in the OptiX OSN 1500B subrack Valid Slot for the PQ1 Slot 12 Slot 13 Corresponding Slot for the D75S Slots 14 and 15 Slots 16 and 17

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8.5.6 Technical Specifications

The technical specifications of the D75S cover the board dimensions, weight and power consumption.

Mechanical Specifications
The mechanical specifications of the D75S are as follows:
l l

Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W) Weight (kg): 0.4

Power Consumption
In the normal temperature (25), the maximum power consumption of the D75S in the switching state is 6 W and that of the D75S in the normal state is 0 W.

8.6 D34S
This section describes the D34S, a 6 x E3/T3 electrical interface switching board, in terms of the version, function, principle, front panel and specifications. 8.6.1 Version Description The functional version of the D34S board is N1. 8.6.2 Function and Feature The D34S is used to receive and transmit 6 x E3/T3 electrical signals, and the D34S must be used with the PD3 and PQ3. 8.6.3 Working Principle and Signal Flow The D34S consists of the interface module, switch matrix module, and power supply module. 8.6.4 Front Panel On the front panel of the D34S, there are interfaces and barcode. 8.6.5 Valid Slots the D34S can be housed in any of slots 14-17 in the OptiX OSN 1500B subrack. 8.6.6 Technical Specifications The technical specifications of the D34S cover the electrical interface specifications, board dimensions, weight and power consumption.

8.6.1 Version Description

The functional version of the D34S board is N1.

8.6.2 Function and Feature

The D34S is used to receive and transmit 6 x E3/T3 electrical signals, and the D34S must be used with the PD3 and PQ3.

8.6.3 Working Principle and Signal Flow

The D34S consists of the interface module, switch matrix module, and power supply module.
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Figure 8-11 shows the block diagram for the functions of the D34S. Figure 8-11 Block diagram for the functions of the D34S
Backplane Crossconnect board E3/T3 Interface module E3/T3 Swictch matrix module PD3 TSB8 TSB8 PD3

+3.3 V

Power supply module

Fuse

+3.3 V Power

Interface Module
The interface module receives and transmits the E3/T3 electrical signals.

Switch Matrix Module

In the receive direction, the switch matrix module accesses signals from the interface module, and selects the output direction of the signals according to the TPS protection control signals from the cross-connect board. When the TPS protection is not performed, the switch matrix module transmits the signals to the PD3 or PQ3 board. When the TPS protection is performed, the switch matrix module transmits the signals to the TSB8 board for bridging. In the transmit direction, the working direction of the switch matrix module is the reverse of the receive direction.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.6.4 Front Panel

On the front panel of the D34S, there are interfaces and barcode.

Appearance of the Front Panel

Figure 8-12 shows the appearance of the front panel of the D34S.

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Figure 8-12 Front panel of the D34S

D34S

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4 OUT5 IN5 OUT6 IN6

D34S

Interfaces
There are six pairs of electrical interfaces on the front panel of the D34S. Table 8-12 lists the type and usage of interfaces on the D34S. Table 8-12 Interfaces of the D34S Interface IN1IN6 OUT1OUT6 Interface Type SMB SMB Usage Receive six channels (16) of E3/T3 electrical signals. Transmit six channels (16) of E3/T3 electrical signals.

8.6.5 Valid Slots

the D34S can be housed in any of slots 14-17 in the OptiX OSN 1500B subrack.

8.6.6 Technical Specifications

The technical specifications of the D34S cover the electrical interface specifications, board dimensions, weight and power consumption.
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Electrical Interface Specifications

Table 8-13 lists the specifications of the electrical interfaces of the D34S. Table 8-13 Specifications of the electrical interfaces of the D34S Item Interface type Code Output signal bit rate Allowed input frequency deviation Allowed input attenuation Input jitter tolerance Specification 34368 kbit/s and 44736k bit/s HDB3 (E3) and B3ZS (T3) Compliant with ITU-T G.703

Mechanical Specifications
The mechanical specifications of the D34S are as follows:
l l

Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W) Weight (kg): 0.4

Power Consumption
In the normal temperature (25), the maximum power consumption of the D34S in the switching state is 2 W and that of the D34S in the normal state is 0 W.

8.7 C34S
This section describes the C34S, a 3 x E3/T3 electrical interface switching board, in terms of the version, function, principle, front panel and specifications. 8.7.1 Version Description The functional version of the C34S board is N1. 8.7.2 Function and Feature The C34S is used to receive and transmit 3 x E3/T3 electrical signals, and the C34S must be used with the PL3. 8.7.3 Working Principle and Signal Flow The C34S consists of the interface module, switch matrix module, and power supply module. 8.7.4 Front Panel On the front panel of the C34S, there are interfaces and barcode. 8.7.5 Valid Slots As the interface board for the PL3, the C34S can be housed in any of slots 14 and 16 in the OptiX OSN 1500B subrack.
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8.7.6 Technical Specifications The technical specifications of the C34S cover the electrical interface specifications, board dimensions, weight and power consumption.

8.7.1 Version Description

The functional version of the C34S board is N1.

8.7.2 Function and Feature

The C34S is used to receive and transmit 3 x E3/T3 electrical signals, and the C34S must be used with the PL3.

8.7.3 Working Principle and Signal Flow

The C34S consists of the interface module, switch matrix module, and power supply module. Figure 8-13 shows the block diagram for the functions of the C34S. Figure 8-13 Block diagram for the functions of the C34S
Backplane Crossconnect board E3/T3

Interface module
E3/T3

Swictch matrix module

PL3 TSB8 TSB8 PL3

+3.3 V

Power supply module

Power supply module

Fuse

-48 V/-60 V -48 V/-60 V

Fuse

+3.3 V backeup power

Interface Module
The interface module receives and transmits the E3/T3 electrical signals.

Switch Matrix Module

In the receive direction, the switch matrix module accesses signals from the interface module, and selects the output direction of the signals according to the TPS protection control signals from the cross-connect board. When the TPS protection is not performed, the switch matrix module transmits the signals to the PL3 board. When the TPS protection is performed, the switch matrix module transmits the signals to the TSB8 board for bridging. In the transmit direction, the working direction of the switch matrix module is the reverse of the receive direction.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.
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8.7.4 Front Panel

On the front panel of the C34S, there are interfaces and barcode.

Appearance of the Front Panel

Figure 8-14 shows the appearance of the front panel of the C34S. Figure 8-14 Front panel of the C34S
C34S

OUT1 IN1 OUT2 IN2 OUT3 IN3

C34S

Interfaces
There are three pairs of electrical interfaces on the front panel of the C34S. Table 8-14 lists the type and usage of interfaces on the C34S. Table 8-14 Interfaces of the C34S Interface IN1IN3 OUT1OUT3 Interface Type SMB SMB Usage Receive the first three channels (13) of E3/T3 electrical signals. Transmit the first three channels (13) of E3/T3 electrical signals.

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8.7.5 Valid Slots

As the interface board for the PL3, the C34S can be housed in any of slots 14 and 16 in the OptiX OSN 1500B subrack. Table 8-15 lists the valid slots for the PL3 and corresponding slots for the C34S. Table 8-15 Valid slots for the PL3 and corresponding slots for the C34S in the OptiX OSN 1500B subrack Valid Slot for the PL3 Slot 12 Slot 13 Corresponding Slot for the C34S Slot 14 Slot 16

8.7.6 Technical Specifications

The technical specifications of the C34S cover the electrical interface specifications, board dimensions, weight and power consumption.

Electrical Interface Specifications

Table 8-16 lists the specifications of the electrical interfaces of the C34S. Table 8-16 Specifications of the electrical interfaces of the C34S Item Interface type Code Output signal bit rate Allowed input frequency deviation Allowed input attenuation Input jitter tolerance Specification 34368 kbit/s and 44736 kbit/s HDB3 (E3) and B3ZS (T3) Compliant with ITU-T G.703

Mechanical Specifications
The mechanical specifications of the C34S are as follows:
l l

Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W) Weight (kg): 0.3

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Power Consumption
In the normal temperature (25), the maximum power consumption of the C34S in the switching state is 2 W and that of the C34S in the normal state is 0 W.

8.8 EU04
This section describes the EU04, a 4 x STM-1 electrical interface board, in terms of the version, function, working principle, front panel and specifications. 8.8.1 Version Description The functional version of the EU04 board is N1. 8.8.2 Function and Feature The EU04 is used to receive and transmit 4 x STM-1 electrical signals, and the EU04 must be used with the SEP. 8.8.3 Working Principle and Signal Flow The EU04 consists of the interface module, switch matrix module, and power supply module. 8.8.4 Front Panel On the front panel of the EU04, there are interfaces and barcode. 8.8.5 Valid Slots As the interface board for the SEP, the EU04 can be housed in any of slots 14 and 16 in the OptiX OSN 1500B subrack. 8.8.6 Technical Specifications The technical specifications of the EU04 cover the electrical interface specifications, board dimensions, weight and power consumption.

8.8.1 Version Description

The functional version of the EU04 board is N1.

8.8.2 Function and Feature

The EU04 is used to receive and transmit 4 x STM-1 electrical signals, and the EU04 must be used with the SEP.

8.8.3 Working Principle and Signal Flow

The EU04 consists of the interface module, switch matrix module, and power supply module. Figure 8-15 shows the block diagram for the functions of the EU04 when it processes 1 x STM-1 signals.

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Figure 8-15 Block diagram for the functions of the EU04

Backplane Crossconnect board

STM-1(e)

Interface module
STM-1(e)

Swictch matrix module

SEP TSB8 TSB8 SEP

+3.3 V

Power supply module

Power supply module

Fuse

-48 V/-60 V -48 V/-60 V

Fuse

+3.3 V backeup power

Interface Module
The interface module receives and transmits the STM-1 electrical signals.

Switch Matrix Module

In the receive direction, the switch matrix module accesses signals from the interface module, and selects the output direction of the signals according to the TPS protection control signals from the cross-connect board. When the TPS protection is not performed, the switch matrix module transmits the signals to the SEP board. When the TPS protection is performed, the switch matrix module transmits the signals to the TSB8 board for bridging. In the transmit direction, the working direction of the switch matrix module is the reverse of the receive direction.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.8.4 Front Panel

On the front panel of the EU04, there are interfaces and barcode.

Appearance of the Front Panel

Figure 8-16 shows the appearance of the front panel of the EU04.

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Figure 8-16 Front panel of the EU04

EU04

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4

EU04

Interfaces
There are four pairs of electrical interfaces on the front panel of the EU04. Table 8-17 lists the type and usage of interfaces on the EU04. Table 8-17 Interfaces of the EU04 Interface IN1IN4 OUT1OUT4 Interface Type SMB SMB Usage Receive four (14) channels of electrical interfaces. Transmit four (14) channels of electrical interfaces.

8.8.5 Valid Slots

As the interface board for the SEP, the EU04 can be housed in any of slots 14 and 16 in the OptiX OSN 1500B subrack. Table 8-18 lists the valid slots for the SEP and corresponding slots for the EU04.
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Table 8-18 Valid slots for the SEP and corresponding slots for the EU04 Valid Slot for the SEP Slot 12 Slot 13 Corresponding Slot for the EU04 Slot 14 Slot 16

8.8.6 Technical Specifications

The technical specifications of the EU04 cover the electrical interface specifications, board dimensions, weight and power consumption.

Electrical Interface Specifications

Table 8-19 lists the specifications of the electrical interfaces of the EU04. Table 8-19 Specifications of the electrical interfaces of the EU04 Item Interface Type Code Output signal bit rate Allowed input frequency deviation Allowed input attenuation Specification 155520 kbit/s CMI Compliant with ITU-T G.703

Mechanical Specifications
The mechanical specifications of the EU04 are as follows:
l l

Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W) Weight (kg): 0.4

Power Consumption
In the normal temperature (25), the maximum power consumption of the EU04 is 6 W.

8.9 EU08
This section describes the EU08, an 8 x STM-1 electrical interface board, in terms of the version, function, working principle, front panel and specifications. 8.9.1 Version Description The functional version of the EU08 board is N1.
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8.9.2 Function and Feature The EU08 is used to receive and transmit 8 x STM-1 electrical signals, and the EU08 must be used with the SEP. 8.9.3 Working Principle and Signal Flow The EU08 consists of the interface module, switch matrix module, and power supply module. 8.9.4 Front Panel On the front panel of the EU08, there are interfaces and barcode. 8.9.5 Valid Slots As the interface board for the SEP, the EU08 can be housed in any of slots 14 and 16 in the OptiX OSN 1500B subrack. 8.9.6 Technical Specifications The technical specifications of the EU08 cover the electrical interface specifications, board dimensions, weight and power consumption.

8.9.1 Version Description

The functional version of the EU08 board is N1.

8.9.2 Function and Feature

The EU08 is used to receive and transmit 8 x STM-1 electrical signals, and the EU08 must be used with the SEP.

8.9.3 Working Principle and Signal Flow

The EU08 consists of the interface module, switch matrix module, and power supply module. Figure 8-17 shows the block diagram for the functions of the EU08. Figure 8-17 Block diagram for the functions of the EU08
Backplane Crossconnect board

STM-1(e)

Interface module
STM-1(e)

Swictch matrix module

SEP TSB8 TSB8 SEP +3.3 V backeup power

+3.3 V

Power supply module

Fuse

Interface Module
The interface module receives and transmits the STM-1 electrical signals.

Switch Matrix Module

In the receive direction, the switch matrix module accesses signals from the interface module, and selects the output direction of the signals according to the TPS protection control signals
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from the cross-connect board. When the TPS protection is not performed, the switch matrix module transmits the signals to the SEP board. When the TPS protection is performed, the switch matrix module transmits the signals to the TSB8 board for bridging. In the transmit direction, the working direction of the switch matrix module is the reverse of the receive direction.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.9.4 Front Panel

On the front panel of the EU08, there are interfaces and barcode.

Appearance of the Front Panel

Figure 8-18 shows the appearance of the front panel of the EU08. Figure 8-18 Front panel of the EU08
EU08

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4 OUT5 IN5 OUT6 IN6 OUT7 IN7 OUT8 IN8
EU08

Interfaces
There are eight pairs of electrical interfaces on the front panel of the EU08.
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Table 8-20 lists the type and usage of interfaces on the EU08. Table 8-20 Interfaces of the EU08 Interface IN1IN8 OUT1OUT8 Interface Type SMB SMB Usage Receive eight (18) channels of electrical interfaces. Transmit eight (18) channels of electrical interfaces.

8.9.5 Valid Slots

As the interface board for the SEP, the EU08 can be housed in any of slots 14 and 16 in the OptiX OSN 1500B subrack. Table 8-21 lists the valid slots for the SEP and corresponding slots for the EU08 in the OptiX OSN 1500B.
NOTE

The OptiX OSN 1500A does not support the EU08 board.

Table 8-21 Valid slots for the SEP and corresponding slots for the EU08 Valid Slot for the SEP Slot 12 Slot 13 Corresponding Slot for the EU08 Slot 14 Slot 16

8.9.6 Technical Specifications

The technical specifications of the EU08 cover the electrical interface specifications, board dimensions, weight and power consumption.

Electrical Interface Specifications

Table 8-22 lists the specifications of the electrical interfaces of the EU08. Table 8-22 Specifications of the electrical interfaces of the EU08 Item Interface type Code Output signal bit rate Allowed input frequency deviation
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Item Allowed input attenuation Input jitter tolerance

Specification

Mechanical Specifications
The mechanical specifications of the EU08 are as follows:
l l

Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W) Weight (kg): 0.4

Power Consumption
In the normal temperature (25), the maximum power consumption of the EU08 is 11 W.

8.10 OU08
This section describes the OU08, an 8 x STM-1 optical interface board, in terms of the version, function, working principle, front panel and parameters. 8.10.1 Version Description The OU08 has two versions, N1 and N2. The main difference between the two versions lies in the connector type for optical interfaces and the pluggability of the optical modules. 8.10.2 Function and Feature The OU08 is used to receive and transmit 8 x STM-1 optical signals, and the OU08 must be used with the SEP. 8.10.3 Working Principle and Signal Flow The OU08 consists of the interface module and power supply module. 8.10.4 Front Panel On the front panel of the OU08, there are interfaces and barcode. 8.10.5 Valid Slots As the interface board for the SEP, the OU08 can be housed in any of slots 14 and 16 in the OptiX OSN 1500B subrack. 8.10.6 Technical Specifications The technical specifications of the OU08 cover the optical interface specifications, board dimensions, weight and power consumption.

8.10.1 Version Description

The OU08 has two versions, N1 and N2. The main difference between the two versions lies in the connector type for optical interfaces and the pluggability of the optical modules. Table 8-23 lists the details on the two versions of the OU08 board.

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Table 8-23 Version description of the OU08 Item Functional version Commonness Difference Specification The OU08 has two versions, N1 and N2. The N1 and N2 versions share the same working principle. The optical interface of the N1OU08 uses the LC connector. The optical interface of the N2OU08 uses the SC connector. The N1OU08 uses the pluggable optical module. The N2OU08 does not use the pluggable optical module. None.

Replaceability

8.10.2 Function and Feature

The OU08 is used to receive and transmit 8 x STM-1 optical signals, and the OU08 must be used with the SEP.

8.10.3 Working Principle and Signal Flow

The OU08 consists of the interface module and power supply module. Figure 8-19 shows the block diagram for the functions of the OU08. Figure 8-19 Block diagram for the functions of the OU08
Backplane

STM-1(o)
Interface module

SEP

STM-1(o)

SEP

+3.3 V

Power supply module

Fuse

+3.3 V Power

Interface Module
In the receive direction, the interface module performs O/E convertion for the STM-1 signals, and transmits the signals to the SEP board. In the transmit direction, the interface module performs the E/O convertion for the STM-1 signals, and transmits the signals to the optical interface.
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Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.10.4 Front Panel

On the front panel of the OU08, there are interfaces and barcode.

Appearance of the Front Panel

Figure 8-20 and Figure 8-21 show the appearance of the front panels of the N1OU08 and N2OU08 respectively. Figure 8-20 Front panel of the N1OU08
OU08

OUT1IN1OUT2 IN2 OUT3IN3 OUT4 IN4OUT5IN5 OUT6IN6 OUT7IN7OUT8 IN8

OU08

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Figure 8-21 Front panel of the N2OU08

OU08

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4 OUT5 IN5 OUT6 IN6 OUT7 OUT8 IN7 IN8
OU08

Interfaces
There are eight pairs of optical interfaces on each front panel of the N1OU08 and N2OU08. Table 8-24 lists the interface type and usage for the N1OU08. Table 8-25 lists the interface type and usage for the N2OU08. Table 8-24 Interfaces of the N1OU08 Interface IN1IN8 OUT1OUT8 Interface Type LC LC Usage Receive eight (18) channels of STM-1 optical signals. Transmit eight (18) channels of STM-1 optical signals.

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Table 8-25 Interfaces of the N2OU08 Interface IN1IN8 OUT1OUT8 Interface Type SC SC Usage Receive eight (18) channels of STM-1 optical signals. Transmit eight (18) channels of STM-1 optical signals.

8.10.5 Valid Slots

As the interface board for the SEP, the OU08 can be housed in any of slots 14 and 16 in the OptiX OSN 1500B subrack. Table 8-26 lists the valid slots for the SEP and corresponding slots for the OU08. Table 8-26 Valid slots for the SEP and corresponding slots for the OU08 Valid Slot for the SEP Slot 12 Slot 13 Corresponding Slot for the OU08 Slot 14 Slot 16

8.10.6 Technical Specifications

The technical specifications of the OU08 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications

Table 8-27 lists the specifications of the optical interfaces of the OU08. Table 8-27 Specifications of the optical interfaces of the OU08 Item Nominal bit rate Line code Optical interface type Working wavelength (nm) Optical source type Mean launched optical power (dBm)
8-38

Specification 155520 kbit/s NRZ S-1.1 N1OU08 (12601360) N2OU08 (12611360) MLM 15 to 8

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Item Receiver sensitivity (dBm)

Specification 28

Mechanical Specifications
The mechanical specifications of the OU08 are as follows:
l l

Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W) Weight (kg): 0.4

Power Consumption
In the normal temperature (25), the maximum power consumption of the OU08 is 6 W.

8.11 MU04
This section describes the MU04, a 4 x E4/STM-1 electrical interface board, in terms of the version, function, principle, front panel and specifications. 8.11.1 Version Description The functional version of the MU04 board is N1. 8.11.2 Function and Feature The MU04 is used to receive and transmit 4 x E4/STM-1 electrical signals, and the MU04 must be used with the SPQ4. 8.11.3 Working Principle and Signal Flow The MU04 consists of the interface module, switch matrix module, and power supply module. 8.11.4 Front Panel On the front panel of the MU04, there are interfaces and barcode. 8.11.5 Valid Slots As the interface board for the SPQ4, the MU04 can be housed in any of slots 14 and 16 in the OptiX OSN 1500B subrack. 8.11.6 Technical Specifications The technical specifications of the MU04 cover the optical interface specifications, board dimensions, weight and power consumption.

8.11.1 Version Description

The functional version of the MU04 board is N1.

8.11.2 Function and Feature

The MU04 is used to receive and transmit 4 x E4/STM-1 electrical signals, and the MU04 must be used with the SPQ4.
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8.11.3 Working Principle and Signal Flow

The MU04 consists of the interface module, switch matrix module, and power supply module. Figure 8-22 shows the block diagram for the functions of the MU04. Figure 8-22 Block diagram for the functions of the MU04
Backplane Crossconnect board

E4/STM-1(e)

Interface module
E4/STM-1(e)

Swictch matrix module

SPQ4 TSB8 TSB8 SPQ4 +3.3 V backeup power

+3.3 V

Power supply module

Fuse

Interface Module
The interface module receives and transmits the E4/STM-1 electrical signals.

Switch Matrix Module

In the receive direction, the switch matrix module accesses signals from the interface module, and selects the output direction of the signals according to the TPS protection control signals from the cross-connect board. When the TPS protection is not performed, the switch matrix module transmits the signals to the SPQ4 board. When the TPS protection is performed, the switch matrix module transmits the signals to the TSB8 board for bridging. In the transmit direction, the working direction of the switch matrix module is the reverse of the receive direction.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.11.4 Front Panel

On the front panel of the MU04, there are interfaces and barcode.

Appearance of the Front Panel

Figure 8-23 shows the appearance of the front panel of the MU04.

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Figure 8-23 Front panel of the MU04

MU04

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4

MU04

Interfaces
There are four pairs of electrical interfaces on the front panel of the MU04. Table 8-28 lists the type and usage of interfaces on the MU04. Table 8-28 Interfaces of the MU04 Interface IN1IN4 OUT1OUT4 Interface Type SMB SMB Usage Receive four (14) channels of E4/STM-1 electrical interfaces. Transmit four (14) channels of E4/STM-1 electrical interfaces.

8.11.5 Valid Slots

As the interface board for the SPQ4, the MU04 can be housed in any of slots 14 and 16 in the OptiX OSN 1500B subrack. Table 8-29 lists the valid slots for the SPQ4 and corresponding slots for the MU04.

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Table 8-29 Valid slots for the SPQ4 and corresponding slots for the MU04 Valid Slot for the SPQ4 Slot 12 Slot 13 Corresponding Slot for the MU04 Slot 14 Slot 16

8.11.6 Technical Specifications

The technical specifications of the MU04 cover the optical interface specifications, board dimensions, weight and power consumption.

Electrical Interface Specifications

Table 8-30 lists the specifications of the electrical interfaces of the MU04. Table 8-30 Specifications of the electrical interfaces of the MU04 Item Interface Type Code Output signal bit rate Allowed input frequency deviation Allowed input attenuation Specification 139264 kbit/s and 155520 kbit/s CMI Compliant with ITU-T G.703

Mechanical Specifications
The mechanical specifications of the MU04 are as follows:
l l

Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W) Weight (kg): 0.4

Power Consumption
In the normal temperature (25), the maximum power consumption of the MU04 is 2 W.

8.12 TSB4
This section describes the TSB4, a 4-channel interface switching board. 8.12.1 Version Description The functional version of the TSB4 board is N1. 8.12.2 Function and Feature
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The TSB4, an four-channel electrical interface switching board, is used to provide the TPS protection. 8.12.3 Working Principle and Signal Flow The TSB4 consists of the switch matrix module and power supply module. 8.12.4 Front Panel On the front panel of the TSB4, there is the barcode. 8.12.5 Valid Slots When used with different processing boards and interface boards to realize the TPS protection, the TSB4 can be housed in different slots.The OptiX OSN 1500A does not support the TSB4. 8.12.6 Technical Specifications The technical specifications of the TSB4 cover the board dimensions, weight and power consumption.

8.12.1 Version Description

The functional version of the TSB4 board is N1.

8.12.2 Function and Feature

The TSB4, an four-channel electrical interface switching board, is used to provide the TPS protection.
l l l

When used with the MU04, the TSB8 provides the TPS protection for the SPQ4. When used with the C34S, the TSB8 provides the TPS protection for the PL3. When used with the EU04, the TSB8 provides the TPS protection for the SEP.

8.12.3 Working Principle and Signal Flow

The TSB4 consists of the switch matrix module and power supply module. Figure 8-24 shows the block diagram for the functions of the TSB4. Figure 8-24 Block diagram for the functions of the TSB4
Backplane Backplane Crossconnect board Standby processing board Swictch matrix module

Interface board 1 Interface board 2 Interface board 3

+3.3 V

Power supply module

Fuse

+3.3 V backup power

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Switch Matrix Module

In the receive direction, the switch matrix module selects signals from one of the three interface boards according to the TPS protection control signals from the cross-connect board, and outputs the signals to the backup processing board. In the transmit direction, the working direction of the switch matrix module is the reverse of the receive direction.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.12.4 Front Panel

On the front panel of the TSB4, there is the barcode.

Appearance of the Front Panel

Figure 8-25 shows the appearance of the front panel of the TSB4. Figure 8-25 Front panel of the TSB4
TSB4

TSB4

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8.12.5 Valid Slots

When used with different processing boards and interface boards to realize the TPS protection, the TSB4 can be housed in different slots.The OptiX OSN 1500A does not support the TSB4. Table 8-31 lists the valid slots for the TSB4 and corresponding slots for the SPQ4 and MU04. Table 8-31 Valid slots for the TSB4 and corresponding slots for the SPQ4 and MU04 Valid Slot for the TSB4 Slot 14 Valid Slot for the SPQ4 Slot 13 Corresponding Slot for the MU04 Slot 16

Table 8-32 lists the valid slots for the TSB4 and corresponding slots for the SEP and EU04. Table 8-32 Valid slots for the TSB4 and corresponding slots for the SEP and EU04 Valid Slot for the TSB4 Slot 14 Valid Slot for the SEP Slot 13 Corresponding Slot for the EU04 Slot 16

NOTE

On the T2000, the SEP is displayed as the SEP or SEP1. When interfaces are available on the front panel of the SEP, the SEP is displayed as the SEP1 on the T2000. When the SEP is used with the interface board to realize the TPS protection, the SEP is displayed as the SEP on the T2000.

Table 8-33 lists the valid slots for the TSB4 and corresponding slots for the EFS0 and ETS8. Table 8-33 Valid slots for the TSB4 and corresponding slots for the EFS0 and ETS8 Valid Slot for the TSB4 Slot 14 Valid Slot for the EFS0 Slot 13 Corresponding Slot for the ETS8 Slot 16

8.12.6 Technical Specifications

The technical specifications of the TSB4 cover the board dimensions, weight and power consumption.

Mechanical Specifications
The mechanical specifications of the TSB4 are as follows:
l

Dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)

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l

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Weight (kg): 0.28

Power Consumption
In the normal temperature (25), the maximum power consumption of the TSB4 is 2.5 W.

8.13 TSB8
This section describes the TSB8, an 8-channel optical interface switching board, in terms of the version, function, principle, front panel and specifications. 8.13.1 Version Description The functional version of the TSB8 board is N1. 8.13.2 Function and Feature The TSB8, an eight-channel electrical interface switching board, is used to provide the TPS protection. 8.13.3 Working Principle and Signal Flow The TSB8 consists of the switch matrix module and power supply module. 8.13.4 Front Panel On the front panel of the TSB8, there is the barcode. 8.13.5 Valid Slots When used with different processing boards and interface boards to realize the TPS protection, the TSB8 can be housed in different slots.The OptiX OSN 1500A does not support the TSB8. 8.13.6 Technical Specifications The technical specifications of the TSB8 cover the board dimensions, weight and power consumption.

8.13.1 Version Description

The functional version of the TSB8 board is N1.

8.13.2 Function and Feature

The TSB8, an eight-channel electrical interface switching board, is used to provide the TPS protection.
l l l l l l l

When used with the MU04, the TSB8 provides the TPS protection for the SPQ4. When used with the C34S, the TSB8 provides the TPS protection for the PL3. When used with the D34S, the TSB8 provides the TPS protection for the PD3. When used with the D34S, the TSB8 provides the TPS protection for the PQ3. When used with the EU04, the TSB8 provides the TPS protection for the SEP1. When used with the EU08, the TSB8 provides the TPS protection for the SLH1/SEP1. When used with the ETS8, the TSB8 provides the TPS protection for the EFS0.

8.13.3 Working Principle and Signal Flow

The TSB8 consists of the switch matrix module and power supply module.
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Figure 8-26 shows the block diagram for the functions of the TSB8 when it processes onechannel signals. Figure 8-26 Block diagram for the functions of the TSB8
Backplane Backplane Crossconnect board Standby processing board Swictch matrix module +3.3 V

Interface board 1 Interface board 2 Interface board 3

Power module

Fuse

+3.3 V Power

Switch Matrix Module

In the receive direction, the switch matrix module selects signals from one of the three interface boards according to the TPS protection control signals from the cross-connect board, and outputs the signals to the backup processing board. In the transmit direction, the working direction of the switch matrix module is the reverse of the receive direction.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.13.4 Front Panel

On the front panel of the TSB8, there is the barcode.

Appearance of the Front Panel

Figure 8-27 shows the appearance of the front panel of the TSB8.

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Figure 8-27 Front panel of the TSB8

TSB8

TSB8

8.13.5 Valid Slots

When used with different processing boards and interface boards to realize the TPS protection, the TSB8 can be housed in different slots.The OptiX OSN 1500A does not support the TSB8. Table 8-34 lists the valid slots for the TSB8 and corresponding slots for the SPQ4 and MU04. Table 8-34 Valid slots for the TSB8 and corresponding slots for the SPQ4 and MU04 Valid Slot for the TSB8 Slot 14 Valid Slot for the SPQ4 Slot 13 Corresponding Slot for the MU04 Slot 16

Table 8-35 lists the valid slots for the TSB8 and corresponding slots for the PD3 and D34S.

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Table 8-35 Valid slots for the TSB8 and corresponding slots for the PD3 and D34S Valid Slot for the TSB8 Slot 14 Valid Slot for the PD3 Slot 13 Corresponding Slot for the D34S Slot 16

Table 8-36 lists the valid slots for the TSB8 and corresponding slots for the SEP and EU04. Table 8-36 Valid slots for the TSB8 and corresponding slots for the SEP and EU04 Valid Slot for the TSB8 Slot 14 Valid Slot for the SEP Slot 13 Corresponding Slot for the EU04 Slot 16

Table 8-37 lists the valid slots for the TSB8 and corresponding slots for the SEP and EU08. Table 8-37 Valid slots for the TSB8 and corresponding slots for the SEP and EU08 Valid Slot for the TSB8 Slot 14 Valid Slot for the SEP Slot 13 Corresponding Slot for the EU08 Slot 16

NOTE

On the T2000, the SEP is displayed as the SEP or SEP1. When interfaces are available on the front panel of the SEP, the SEP is displayed as the SEP1 on the T2000. When the SEP is used with the interface board to realize the TPS protection, the SEP is displayed as the SEP on the T2000.

Table 8-38 lists the valid slots for the TSB8 and corresponding slots for the EFS0 and ETS8. Table 8-38 Valid slots for the TSB8 and corresponding slots for the EFS0 and ETS8 Valid Slot for the TSB8 Slot 14 Valid Slot for the EFS0 Slot 13 Corresponding Slot for the ETS8 Slot 16

Table 8-39 lists the valid slots for the TSB8 and corresponding slots for the PL3 and C34S.

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Table 8-39 Valid slots for the TSB8 and corresponding slots for the PL3 and C34S Valid Slot for the TSB8 Slot 14 Valid Slot for the PL3 Slot 13 Corresponding Slot for the C34S Slot 16

Table 8-40 lists the valid slots for the TSB8 and corresponding slots for the PQ3 and D34S. Table 8-40 Valid slots for the TSB8 and corresponding slots for the PQ3 and D34S Valid Slot for the TSB8 Slot 14 and 15 Valid Slot for the PQ3 Slot 12 and 13 Corresponding Slot for the D34S Slot 16 and 17

8.13.6 Technical Specifications

The technical specifications of the TSB8 cover the board dimensions, weight and power consumption.

Mechanical Specifications
The mechanical specifications of the TSB8 are as follows:
l l

Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W) Weight (kg): 0.3

Power Consumption
In the normal temperature (25), the maximum power consumption of the TSB8 in the switching state is 5 W and that of the TSB8 in the normal state is 0 W.

8.14 EFF8
This section describes the EFF8, an 8 x 100M Ethernet optical interface board, in terms of the version, function, principle, front panel and specifications. 8.14.1 Version Description The functional version of the EFF8 board is N1. 8.14.2 Function and Feature The EFF8 is used to receive and transmit 8 x 100M Ethernet optical signals, and the EFF8 must be used with the Ethernet processing board. 8.14.3 Working Principle and Signal Flow The EFF8 consists of the interface module, switch matrix module, and power supply module. 8.14.4 Front Panel
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On the front panel of the EFF8, there are indicators, interfaces, barcode and laser safety class label. 8.14.5 Valid Slots When used with different Ethernet processing boards, the EFF8 can be housed in different slots. 8.14.6 Technical Specifications The technical specifications of the EFF8 cover the optical interface specifications, board dimensions, weight and power consumption.

8.14.1 Version Description

The functional version of the EFF8 board is N1.

8.14.2 Function and Feature

The EFF8 is used to receive and transmit 8 x 100M Ethernet optical signals, and the EFF8 must be used with the Ethernet processing board.

8.14.3 Working Principle and Signal Flow

The EFF8 consists of the interface module, switch matrix module, and power supply module. Figure 8-28 shows the block diagram for the functions of the EFF8 when it processes 1 x 100M Ethernet signals. Figure 8-28 Block diagram for the functions of the EFF8
Backplane

100M

EFT8/ EFS0/EMS4/EMR0

Interface module
100M EFT8/EFS0/EMS4/EMR0

+3.3 V

Power module

Fuse

+3.3 V Backup Power

Interface Module
In the receive direction, the interface module performs the O/E convertion for the Ethernet signals, and transmits the signals to the EFT8, EFS0, EMS4, or EMR0 board. In the transmit direction, the interface module performs the E/O convertion for the Ethernet signals, and transmits the signals to the optical interface.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.
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8.14.4 Front Panel

On the front panel of the EFF8, there are indicators, interfaces, barcode and laser safety class label.

Appearance of the Front Panel

Figure 8-29 shows the appearance of the front panel of the EFF8. Figure 8-29 Front panel of the EFF8

EFF8

1 2 3 4 5 6 7 8
LINKACT

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4 OUT5 IN5 OUT6 IN6 OUT7 IN7 OUT8 IN8
CLASS 1 LASER PRODUCT

EFF8

Indicators
For indication of indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are eight pairs of optical interfaces on the front panel of the EFF8. Table 8-41 lists the type and usage of interfaces on the EFF8.

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Table 8-41 Interfaces of the EFF8 Interface IN1IN8 OUT1 OUT8 Interface Type LC LC Usage Receives eight (18) channels of Ethernet optical signals. Transmits eight (18) channels of Ethernet optical signals.

8.14.5 Valid Slots

When used with different Ethernet processing boards, the EFF8 can be housed in different slots. The slots valid for the EFF8 are as follows:
l

As the interface board for the EFT8, the EFF8 can be housed in any of slots 1417 in the OptiX OSN 1500B subrack. As the interface board for the EFS0, the EFF8 can be housed in any of slots 1417 in the OptiX OSN 1500B subrack. As the interface board for the EMS4, the EFF8 can be housed in any of slots 1417 in the OptiX OSN 1500B subrack. As the interface board for the EMR0, the EFF8 can be housed in any of slots 1417 in the OptiX OSN 1500B subrack.

Table 8-42 lists the valid slots for the EFT8 and corresponding slots for the EFF8. Table 8-42 Valid slots for the EFT8 and corresponding slots for the EFF8 Valid Slot for the EFT8 Slot 12 Slot 13 Corresponding Slot for the EFF8 Slots 14 and 15 Slots 16 and 17

Table 8-43 lists the valid slots for the EFS0 and corresponding slots for the EFF8. Table 8-43 Valid slots for the EFS0 and corresponding slots for the EFF8 Valid Slot for the EFS0 Slot 12 Slot 13 Corresponding Slot for the EFF8 Slots 14 and 15 Slots 16 and 17

Table 8-44 lists the valid slots for the EMS4 and corresponding slots for the EFF8.

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Table 8-44 Valid slots for the EMS4 and corresponding slots for the EFF8 Valid Slot for the EMS4 Slot 12 Slot 13 Corresponding Slot for the EFF8 Slots 14 and 15 Slots 16 and 17

Table 8-45 lists the valid slots for the EMR0 and corresponding slots for the EFF8. Table 8-45 Valid slots for the EMR0 and corresponding slots for the EFF8 Valid Slot for the EMR0 Slot 12 Slot 13 Corresponding Slot for the EFF8 Slots 14 and 15 Slots 16 and 17

8.14.6 Technical Specifications

The technical specifications of the EFF8 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications

Table 8-46 lists the specifications of the optical interfaces of the EFF8. Table 8-46 Specifications of the optical interfaces of the EFF8 Item Nominal bit rate Line code Optical interface type Working wavelength (nm) Optical source type Mean launched optical power (dBm) Receiver sensitivity (dBm) Min. overload (dBm)
8-54

Specification 10 Mbit/s or 100 Mbit/s Manchester encoding signal (10M) or MLT-3 encoding signal (100M) 100Base-FX 100Base-FX (15 km): 1261 to 1360 100Base-FX (2 km): 1270 to 1380 MLM 100Base-FX (15 km): 15 to 8 100Base-FX (2 km): 19 to 14 100Base-FX (15 km): 28 100Base-FX (2 km): 30 100Base-FX (15 km): 7
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Item

Specification 100Base-FX (2 km): 14

Min. extinction ratio (dB)

10

Mechanical Specifications
The mechanical specifications of the EFF8 are as follows:
l l

Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W) Weight (kg): 0.4

Power Consumption
In the normal temperature (25), the maximum power consumption of the EFF8 is 6 W.

8.15 ETF8
This section describes the ETF8, an 8 x 100M Ethernet twisted pair interface board, in terms of the version, function, principle, front panel and specifications. 8.15.1 Version Description The functional version of the ETF8 board is N1. 8.15.2 Function and Feature The ETF8 is used to receive and transmit 8 x 100M Ethernet electrical signals, and the ETF8 must be used with the Ethernet processing board. 8.15.3 Working Principle and Signal Flow The ETF8 consists of the interface module, switch matrix module, and power supply module. 8.15.4 Front Panel On the front panel of the ETF8, there are interfaces and barcode. 8.15.5 Valid Slots When used with different Ethernet processing boards, the ETF8 can be housed in different slots. 8.15.6 Technical Specifications The technical specifications of the ETF8 cover the electrical interface specifications, board dimensions, weight and power consumption.

8.15.1 Version Description

The functional version of the ETF8 board is N1.

8.15.2 Function and Feature

The ETF8 is used to receive and transmit 8 x 100M Ethernet electrical signals, and the ETF8 must be used with the Ethernet processing board.
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8.15.3 Working Principle and Signal Flow

The ETF8 consists of the interface module, switch matrix module, and power supply module. Figure 8-30 shows the block diagram for the functions of the ETF8 when it processes 1 x 100M Ethernet signals. Figure 8-30 Block diagram for the functions of the ETF8
Backplane

100M

EFT8/ EFS0/EMS4/EMR0

Interface module
100M EFT8/EFS0/EMS4/EMR0

+3.3 V

Power module

Fuse

+3.3 V Power

Interface Module
In the receive direction, the interface module performs the O/E convertion for the Ethernet signals, and transmits the signals to the EFT8, EFS0, EMS4, or EMR0 board. In the transmit direction, the interface module performs the E/O convertion for the Ethernet signals, and transmits the signals to the optical interface.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.15.4 Front Panel

On the front panel of the ETF8, there are interfaces and barcode.

Appearance of the Front Panel

Figure 8-31 shows the appearance of the front panel of the ETF8.

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Figure 8-31 Front panel of the ETF8

ETF8

FE1 FE2 FE3 FE4 FE5 FE6 FE7 FE8

ETF8

Interfaces
There are eight electrical interfaces on the front panel of the ETF8. Table 8-47 lists the type and usage of interfaces on the ETF8. Table 8-47 Interfaces of the ETF8 Interface FE1FE8 Interface Type RJ-45 Usage Receive eight (18) channels of Ethernet electrical signals.

Table 8-48 lists the pins of the RJ-45 connector of the ETF8.

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Table 8-48 Pins of the RJ-45 connector of the ETF8 Front View Pin 1 2 3
8 7 6 5 4 3 2 1

Specification Transmitting positive Transmitting negative Receiving positive Grounding Grounding Receiving negative Grounding Grounding

4 5 6 7 8

8.15.5 Valid Slots

When used with different Ethernet processing boards, the ETF8 can be housed in different slots. The slots valid for the ETF8 are as follows:
l

As the interface board for the EFT8, the ETF8 can be housed in any of slots 1417 in the OptiX OSN 1500B subrack. As the interface board for the EFS0, the ETF8 can be housed in any of slots 1417 in the OptiX OSN 1500B subrack. As the interface board for the EMS4, the ETF8 can be housed in any of slots 1417 in the OptiX OSN 1500B subrack. As the interface board for the EMR0, the ETF8 can be housed in any of slots 1417 in the OptiX OSN 1500B subrack.

Table 8-49 lists the valid slots for the EFT8 and corresponding slots for the ETF8. Table 8-49 Valid slots for the EFT8 and corresponding slots for the ETF8 Valid Slot for the EFT8 Slot 12 Slot 13 Corresponding Slot for the ETF8 Slots 14 and 15 Slots 16 and 17

Table 8-50 lists the valid slots for the EFS0 and corresponding slots for the ETF8.

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Table 8-50 Valid slots for the EFS0 and corresponding slots for the ETF8 Valid Slot for the EFS0 Slot 12 Slot 13 Corresponding Slot for the ETF8 Slots 14 and 15 Slots 16 and 17

Table 8-51 lists the valid slots for the EMS4 and corresponding slots for the ETF8. Table 8-51 Valid slots for the EMS4 and corresponding slots for the ETF8 Valid Slot for the EMS4 Slot 12 Slot 13 Corresponding Slot for the ETF8 Slots 14 and 15 Slots 16 and 17

Table 8-52 lists the valid slots for the EMR0 and corresponding slots for the ETF8. Table 8-52 Valid slots for the EMR0 and corresponding slots for the ETF8 Valid Slot for the EMR0 Slot 12 Slot 13 Corresponding Slot for the ETF8 Slots 14 and 15 Slots 16 and 17

8.15.6 Technical Specifications

The technical specifications of the ETF8 cover the electrical interface specifications, board dimensions, weight and power consumption.

Electrical Interface Specifications

Table 8-53 lists the specifications of the electrical interfaces of the ETF8. Table 8-53 Specifications of the electrical interfaces of the ETF8 Item Rate Code Interface standard Specification 10 Mbit/s or 100 Mbit/s Manchester encoding signal (10M) or MLT-3 encoding signal (100M) Compliant with IEEE 802.3u

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Mechanical Specifications
The mechanical specifications of the ETF8 are as follows:
l l

Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W) Weight (kg): 0.4

Power Consumption
In the normal temperature (25), the maximum power consumption of the ETF8 is 2 W.

8.16 ETS8
This section describes the ETS8, an 8 x 10/100M Ethernet twisted pair interface switching board, in terms of the version, function, principle, front panel and specifications. 8.16.1 Version Description The functional version of the ETS8 board is N1. 8.16.2 Function and Feature The ETS8 is used to provide the TPS protection for 8 x FE signals at the electrical interface, and the ETS8 must be used with the EFS0. 8.16.3 Working Principle and Signal Flow The ETS8 consists of the interface module, switch matrix module, and power supply module. 8.16.4 Front Panel On the front panel of the ETS8, there are interfaces and barcode. 8.16.5 Valid Slots As the interface board for the EFS0, the ETS8 can be housed in any of slots 14 and 16 in the OptiX OSN 1500B subrack. 8.16.6 Technical Specifications The technical specifications of the ETS8 cover the electrical interface specifications, board dimensions, weight and power consumption.

8.16.1 Version Description

The functional version of the ETS8 board is N1.

8.16.2 Function and Feature

The ETS8 is used to provide the TPS protection for 8 x FE signals at the electrical interface, and the ETS8 must be used with the EFS0.

8.16.3 Working Principle and Signal Flow

The ETS8 consists of the interface module, switch matrix module, and power supply module. Figure 8-32 shows the block diagram for the functions of the ETS8 when it processes 1 x 100M Ethernet signals.
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Figure 8-32 Block diagram for the functions of the ETS8

Backplane Crossconnect board

100M

Interface module
100M

Swictch matrix module

EFS0 TSB8 TSB8 EFS0 +3.3 V backeup power

+3.3 V

Power supply module

Fuse

Interface Module
The interface module receives and transmits the Ethernet optical signals.

Switch Matrix Module

In the receive direction, the switch matrix module accesses signals from the interface module, and selects the output direction of the signals according to the TPS protection control signals from the cross-connect board. When the TPS protection is not performed, the switch matrix module transmits the signals to the EFS0 board. When the TPS protection is performed, the switch matrix module transmits the signals to the TSB8 board for bridging. In the transmit direction, the working direction of the switch matrix module is the reverse of the receive direction.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.16.4 Front Panel

On the front panel of the ETS8, there are interfaces and barcode.

Appearance of the Front Panel

Figure 8-33 shows the appearance of the front panel of the ETS8.

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Figure 8-33 Front panel of the ETS8

ETS8

FE1 FE2 FE3 FE4 FE5 FE6 FE7 FE8

ETS8

Interfaces
There are eight electrical interfaces on the front panel of the ETS8. Table 8-54 lists the type and usage of interfaces on the ETS8. Table 8-54 Interfaces of the ETS8 Interface FE1FE8 Interface Type RJ-45 Usage Receive eight (18) channels of Ethernet electrical signals.

Table 8-55 lists the pins of the RJ-45 connector of the ETS8.

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Table 8-55 Pins of the RJ-45 connector of the ETS8 Front View Pin 1 2 3 4 5
8 7 6 5 4 3 2 1

Specification Transmitting positive Transmitting negative Receiving positive Grounding Grounding Receiving negative Grounding Grounding

6 7 8

8.16.5 Valid Slots

As the interface board for the EFS0, the ETS8 can be housed in any of slots 14 and 16 in the OptiX OSN 1500B subrack. Table 8-56 lists the valid slots for the EFS0 and corresponding slots for the ETS8. Table 8-56 Valid slots for the EFS0 and corresponding slots for the ETS8 Valid Slot for the EFS0 Slot 12 Slot 13 Corresponding Slot for the ETS8 Slot 14 Slot 16

8.16.6 Technical Specifications

The technical specifications of the ETS8 cover the electrical interface specifications, board dimensions, weight and power consumption.

Electrical Interface Specifications

Table 8-57 lists the specifications of the electrical interfaces of the ETS8. Table 8-57 Specifications of the electrical interfaces of the ETS8 Item Rate Code Specification 10 Mbit/s or 100 Mbit/s Manchester encoding signal (10M) or MLT-3 encoding signal (100M)
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Item Interface standard

Specification Compliant with IEEE 802.3u

Mechanical Specifications
The mechanical specifications of the ETS8 are as follows:
l l

Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W) Weight (kg): 0.37

Power Consumption
In the normal temperature (25), the maximum power consumption of the ETS8 in the switching state is 3 W and that of the ETS8 in the normal state is 0 W.

8.17 DM12
This section describes the DM12, a DDN interface board, in terms of the version, function, principle, front panel and specifications. 8.17.1 Version Description The functional version of the DM12 board is N1. 8.17.2 Function and Feature The DM12 is used to receive and transmit four channels of N x 64 kbit/s and 8 x framed E1 electrical signals, and the DM12 must be used with the DX1. 8.17.3 Working Principle and Signal Flow The DM12 consists of the interface module, switch matrix module, and power supply module. 8.17.4 Front Panel On the front panel of the DM12, there are interfaces and barcode. 8.17.5 Valid Slots As the interface board for the DX1, the DM12 can be housed in any of slots 1417 in the OptiX OSN 1500B subrack. 8.17.6 Technical Specifications The technical specifications of the DM12 cover the board dimensions, weight and power consumption.

8.17.1 Version Description

The functional version of the DM12 board is N1.

8.17.2 Function and Feature

The DM12 is used to receive and transmit four channels of N x 64 kbit/s and 8 x framed E1 electrical signals, and the DM12 must be used with the DX1.
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8.17.3 Working Principle and Signal Flow

The DM12 consists of the interface module, switch matrix module, and power supply module. Figure 8-34 shows the block diagram for the functions of the DM12 when it processes one channel of N x 64 kbit/s or framed E1 electrical signals. Figure 8-34 Block diagram for the functions of the DM12
Backplane Crossconnect board Interface module Swictch matrix module DX1

Nx64kbit/s / Frame E1

Nx64kbit/s / Frame E1

DX1

+3.3 V

Power supply module

Fuse

+3.3 V Power

Interface Module
The interface module receives and transmits one channel of N x 64 kbit/s or framed E1 electrical signals.

Switch Matrix Module

In the receive direction, the switch matrix module accesses signals from the interface module, and selects the output direction of the signals according to the TPS protection control signals from the cross-connect board. When the TPS protection is not performed, the switch matrix module transmits the signals to the DX1 board. When the TPS protection is performed, the switch matrix module transmits the signals to the DX1 board for bridging. In the transmit direction, the working direction of the switch matrix module is the reverse of the receive direction.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.17.4 Front Panel

On the front panel of the DM12, there are interfaces and barcode.

Appearance of the Front Panel

Figure 8-35 shows the appearance of the front panel of the DM12.
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Figure 8-35 Front panel of the DM12

DM12

E1(1-8) DDN1 DDN2 DDN3 DDN4

DM12

Interfaces
On the front panel of the DM12, there are DB44 and DB28 interfaces. Table 8-58 lists the specifications of the interfaces. Table 8-58 Interfaces on the front panel of the DM12 Interface E1 (18) DDN1DDN4 Interface Type DB44 DB28 Usage Access 8 x framed E1 signals. Access four channels of N x 64 kbit/s signals.

Table 8-59 lists the pins of the DB44 interfaces.

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Table 8-59 Pins of the DB44 interfaces of the DM12 Front View
1

Pin 30 15 29 14 28 13

Specification T1 to transmit the first channel of signals. T2 to transmit the second channel of signals. T3 to transmit the third channel of signals. T4 to transmit the fourth channel of signals. T5 to transmit the fifth channel of signals. T6 to transmit the sixth channel of signals. T7 to transmit the seventh channel of signals. R1 to receive the first channel of signals. R2 to receive the second channel of signals.

Pin 8 7 36 21 35 20 34 19 33 18 32 17 31 16 4439, 61

Specification T8 to transmit the eighth channel of signals. R3 to receive the third channel of signals. R4 to receive the fourth channel of siganls. R5 to receive the fifth channel of signals. R6 to receive the sixth channel of signals. R7 to receive the seventh channel of signals. R8 to receive the eighth channel of signals. Grounding

44

27 12 26 11 25 10 24 9 38 23 37 22

Table 8-60 lists the pins of the DB28 interfaces.

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Table 8-60 Pins of the DB28 interfaces of the DM12 Front View
1

Pin 1 2 3 4 11 12

Specification Transmits data signals. Transmits the clock signals.

Pin 19 20 21 22 23 24 25 26 27 28 -

Specification Receives data signals.

Grounds. Loopbacks the control signals. Permits the transmission. Prepares the terminating equipment. Prepares the terminal equipment.

Detects the carrier. Requests for transmission. Transmits the clock of the external equipment. Receives the clock signals.

28

13 14 15 16 17 18

8.17.5 Valid Slots

As the interface board for the DX1, the DM12 can be housed in any of slots 1417 in the OptiX OSN 1500B subrack. Table 8-61 lists the valid slots for the DX1 and corresponding slots for the DM12. The DM12 housed in the slot with a smaller number accesses the 8 x framed E1 signals and four channels of N x 64 kbit/s signals. The DM12 housed in the slot with a larger number accesses only four channels of N x 64 kbit/s signals. Table 8-61 Valid slots for the DX1 and corresponding slots for the DM12 Valid Slot for the DX1 Slot 12 Slot 13 Corresponding Slot for the DM12 Slots 1 and 2 Slots 3 and 4

8.17.6 Technical Specifications

The technical specifications of the DM12 cover the board dimensions, weight and power consumption.
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Mechanical Specifications
The mechanical specifications of the DM12 are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 0.5

Power Consumption
In the normal temperature (25), the maximum power consumption of the DM12 in the switching state is 8 W and that of the DM12 in the normal state is 0 W.

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Cross-Connect and System Control Boards

About This Chapter

The chapter describes the integrated boards of the cross-connect, SCC and line units at different rates. 9.1 CXL1 This section describes the CXL1, an integrated board of the SCC, cross-connect, clock and line units, in terms of the version, principle, function, principle, front panel and specifications. 9.2 CXL4 This section describes the CXL4, an integrated board of the SCC, cross-connect, clock and line units, in terms of the version, principle, function, principle, front panel and specifications. 9.3 CXL16 This section describes the CXL16, an integrated board of the SCC, cross-connect, clock and line units, in terms of the version, principle, function, principle, front panel and specifications. 9.4 CXLL1 This section describes the CXLL1, an integrated board of the SCC, cross-connect, clock and line units, in terms of the version, principle, function, principle, front panel and specifications. 9.5 CXLL4 This section describes the CXLL4, an integrated board of the SCC, cross-connect, clock and line units, in terms of the version, principle, function, principle, front panel and specifications. 9.6 CXLL16 This section describes the CXLL16, an integrated board of the SCC, cross-connect, clock and line units, in terms of the version, principle, function, principle, front panel and specifications. 9.7 CXLD1 This section describes the CXLD1, an integrated board of the SCC, cross-connect, clock and line units, in terms of the version, principle, function, principle, front panel and specifications. 9.8 CXLD4 This section describes the CXLD4, an integrated board of the SCC, cross-connect, clock and line units, in terms of the version, principle, function, principle, front panel and specifications. 9.9 CXLQ1
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This section describes the CXLQ1, an integrated board of the SCC, cross-connect, clock and line units, in terms of the version, principle, function, principle, front panel and specifications. 9.10 CXLQ4 This section describes the CXLQ4, an integrated board of the SCC, cross-connect, clock and line units, in terms of the version, principle, function, principle, front panel and specifications.

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9.1 CXL1
This section describes the CXL1, an integrated board of the SCC, cross-connect, clock and line units, in terms of the version, principle, function, principle, front panel and specifications. 9.1.1 Version Description The CXL1 board has two functional versions, Q2 and Q3. The main differences between the Q2 and Q3 versions are that the Q3 version supports transmitting the DCC overhead information at a two-port external clock interface, supports transparently transmitting DCC bytes in TPS group and supports the CF card and package loading function. 9.1.2 Function and Feature The CXL1 is used to process SDH signals, control communication, groom services, and to input and output the clock. 9.1.3 Working Principle and Signal Flow The CXL1 consists of the SDH overhead processing module, RST, MST and so on. 9.1.4 Jumper and DIP Switch On the CXL1, there are a jumper and a DIP switch, which are used to set the input voltage and running state of the board. 9.1.5 Front Panel On the front panel of the Q2CXL1, there are indicators, interfaces, functional button switch, barcode and laser safety class label. On the front panel of the Q3CXL1 board, there are indicators, interfaces, barcode, functional button switch, laser safety class label, and CF card slot. 9.1.6 Valid Slots The CXL1 can be housed in any of or slots 45 in the subrack. 9.1.7 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the CXL1 indicates the optical interface type. 9.1.8 Board Configuration Reference The physical slot that houses the CXL1 is different from the logical slot displayed on the T2000. You can use the T2000 to set parameters for the CXL1. 9.1.9 Technical Specifications The technical specifications for the CXL1 cover the optical interface specifications, board dimensions, weight and power consumption.

9.1.1 Version Description

The CXL1 board has two functional versions, Q2 and Q3. The main differences between the Q2 and Q3 versions are that the Q3 version supports transmitting the DCC overhead information at a two-port external clock interface, supports transparently transmitting DCC bytes in TPS group and supports the CF card and package loading function. Table 9-1lists the version description of the CXL1 board.

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Table 9-1 Version description of the CXL1 board Item Functional Version Difference Description The CXL1 board has two functional versions, Q2 and Q3. The Q3CXL1 board supports transmitting the DCC information at a two-channel external clock interface. The Q3CXL1 hardware supports the CF card, and the Q3CXL1 supports software package loading function. Q3CXL1 supports transparently transmitting DCC bytes in TPS group. Replaceability The Q3CXL1 board can fully replace the Q2CXL1 board.

9.1.2 Function and Feature

The CXL1 is used to process SDH signals, control communication, groom services, and to input and output the clock.

SDH Processing Unit

Table 9-2 lists the function and feature of the SDH processing unit of the CXL1. Table 9-2 Function and feature of the SDH processing unit of the CXL1 Function and Feature Basic function Specification of the optical interface Specification of the optical module CXL1 Transmits and receives 1 x STM-1 optical signals. Supports the optical interfaces of the I-1, S-1.1, L-1.1, L-1.2, and Ve-1.2 types.
l

Supports detection and query of the information on the optical module. Supports the function of setting the on/off state of the laser and the ALS function.

Service processing Overhead processing

Supports the processing of the VC-12, VC-3 and VC-4 services.

l l

Supports the processing of the SOH bytes of the STM-1 signals. Supports the transparent transmission and termination of the POH bytes. Supports the setting and query of the J0/J1/C2 bytes.

Alarm and performance event Protection scheme

Provides rich alarms and performance events for easy management and maintenance of the equipment. Supports multiple protection modes such as two-fiber MSP protection ring, four-fiber MSP protection ring, linear MSP protection, and SNCP..

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Function and Feature Maintenance feature

CXL1
l l

Supports inloop and outloop for optical interfaces. Supports the warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services. The Q3CXL1 board hardware supports the CF card, and the Q3CXL1 software supports the package loading function. The CF card is hot pluggable. The capacity is 512 MB and can be expanded to 1 GB.

l l

SCC Unit
Table 9-3 lists the function and feature of the SCC unit of the CXL1. Table 9-3 Function and feature of the SCC unit of the CXL1 Function and Feature Basic function Specification of the optical interface CXL1 Configures and monitors services, monitors the service performance, and collects performance events and alarm information.
l l

Provides 10M/100M compatible Ethernet NMS interface. Provides one 10M/100M Ethernet interface, which is used for inter-board communication. Provides one 10M Ethernet interface, which is used for communication between the active and standby SCC boards. Provides the RS232 OAM interface that is present on the auxiliary interface board to connect to the PC or workstation. Supports the remote maintenance by using the RS232 DCE modem. The Q3CXL1 board supports receiving the BIP-8 check for the overhead of the SCC unit, and provides the interface to query the check result.

DCC processing capability Fan alarm management PIU management

Q2CXL1 processes 40-channel DCC, Q3CXL1 processes 80-channel DCC. Manages fan alarms. Provides the in-service check function for the PIU board, and the failure check function for the lightning protection module of the PIU.

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Function and Feature Protection scheme

CXL1 Supports 1+1 hot backup for the SCC unit.

Cross-Connect Unit
Table 9-4 lists the function and feature of the cross-connect unit of the CXL1. Table 9-4 Function and feature of the cross-connect unit of the CXL1 Function and Feature Basic function CXL1 Completes 20 Gbit/s non-blocking full cross-connection at the VC-4 level, and 20 Gbit/s non-blocking full cross-connection at the VC-12 or VC-3 level. Provides two 4M HDLC fast emergency channels, which are used for the MSP and SNCP protection switching.
l l l

Fast emergency channel Service processing

Dynamically grooms services. Adds or deletes services without interrupting services. Supports the SNCP protection at the VC-3 and VC-12 levels.

Protection scheme

Supports the 1+1 hot backup (non-revertive) for the cross-connect unit.

Clock Unit
Table 9-5 lists the function and feature of the clock unit of the CXL1. Table 9-5 Function and feature of the clock unit of the CXL1 Function and Feature Basic function Other function CXL1 Provides standard system synchronization clock. Supports the extraction, insertion and management of the SSM and clock ID. The Q3CXL1 board supports transmitting the DCC overhead information at a two-channel external clock interface. Input and output
l

Inputs two-channel 2048 kHz or 2048 kbit/s timing signals, and selects the external timing source. Outputs two-channel 2048 Hz or 2048 kbit/s timing signals.

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9.1.3 Working Principle and Signal Flow

The CXL1 consists of the SDH overhead processing module, RST, MST and so on. Figure 9-1 shows the block diagram for the functions of the Q2CXL1. Figure 9-1 Block diagram for the functions of the Q2CXL1
38MHz OSC
Time & synchronizaton (SETS) T1 T2 T3 T4(Clock external output) T0 Line units Tributary units PIU AUX

SETG

Frame header T0 (reference clock)

Service units Service units

155MHz PLL

155 MHz 16x155 Mbit/s data

SDH overhead processing module

Cross-connect unit A high speed bus

high speed bus

STM-1

Another CXL unit

O/E

DEMUX

RST
STM-1 16x155 Mbit/s data

MST

MSA

HPT

O/E

MUX

XC Cross Connect (HPC)

high speed bus SCC unit Another connect unit

K1/K2 insertion/ extration

Performance report

Laser shut down

K1/K2 bytes

DCC

XC Cross Connect (LPC)

high speed bus Cross-connect unit B

Laser control

K1/K2 bytes process

DCC process

DCC

Line unit

ETH channels comunication

Other unit Another CXL

Communication and control module

Master and slaver board comunication

ETH interface OAM interface

AUX AUX

F&f interface

Power monitor

Phone interface S1-S4 interface

EOW

Boot ROM

FLASH

RAM

NVRAM

+3.3 V +5V +1.6V +1.8V +1.2V

DC/DC converter

Fuse

-48 V/-60V -48 V/-60V

DC/DC converter

Figure 9-2 shows the block diagram for the functions of the Q3CXL1 board.

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Figure 9-2 Block diagram for the functions of the Q3CXL1 board
Time & synchronizaton (SETS) T1 T2 T3 T4(Clock external output) T0 Line units

38MHz OSC

Tributary units PIU AUX

SETG

Frame header T0 (reference clock)

Service units Service units

155MHz PLL

155 MHz 16x155 Mbit/s data

SDH overhead processing module

Cross-connect unit A high speed bus

high speed bus

STM-1

Another CXL unit

O/E

DEMUX

RST
STM-1 16x155 Mbit/s data

MST

MSA

HPT

O/E

MUX

XC Cross Connect (HPC)

high speed bus SCC unit Another connect unit

K1/K2 insertion/ extration

Performance report

Laser shut down

K1/K2 bytes

DCC

XC Cross Connect (LPC)

high speed bus

Cross-connec unit B

Laser control

K1/K2 bytes process

DCC process

DCC

Line unit

ETH channels comunication

Other unit

Communication and control module

Master and slaver board comunication

Another CXL

ETH interface OAM interface

AUX AUX

F&f interface

Power monitor

Phone interface S1-S4 interface

EOW

Boot ROM

FLASH

RAM

NVRAM

+3.3 V +5V +1.6V +1.8V +1.2V

DC/DC converter

Fuse

-48 V/-60V -48 V/-60V

DC/DC converter

The function modules are described as follows:

Synchronous Timing Unit

The synchronous timing unit provides system clock T0 to the service board, the control unit and the cross-connect unit in central timing distribution mode. This unit also selects one from 12 reference clock sources as the reference clock for synchronous timing. The 12 reference clock sources are from the line board (T1), the tributary board (T2), the external synchronous clock source (T3) and so on. The synchronous system clock source (T0) and 2 M external synchronous
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source (T4) are generated. The boards apply 1 + 1 hot backup. Therefore, both the active and the standby boards tracing the same reference source to ensure the identity between the system clocks of the active and the standby boards. The synchronous timing unit can extract timing from three types of timing signal:
l l l

Timing signal (T1) from STM-N Timing signal (T2) from PDH Reference signal (T3) from external synchronous clock source (2MHz or 2Mbit/s)

The clock module outputs:

l l

T0, system clock (38 MHz) T4, external timing (2 Mbit/s or 2 MHz) output by line

O/E Conversion Module

l l

In receive direction, it converts the received optical signals into electrical signals. In transmit direction, it converts the electrical signals into SDH optical signals, and then send optical signals to fibers for transmission. The SPI detects the R_LOS alarm and provides the laser shut down function.

MUX/DEMUX Module
l

In receive direction, the DEMUX part demultiplexes the high rate electrical signals into multiple parallel electrical signals, and recovery the clock signal at the same time. In transmit direction, the MUX part multiplexes the parallel electrical signals received from the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing Module

It includes RST, MST, MSA and HPT, provides inloop and outloop function.
l

RST

In receiving direction, performs frame alignment detection (A1, A2), regenerator section trace recovery (J0) and mismatch detection, BIP-8 errored block count. In transmitting direction, it performs frame alignment insertion, regenerator section path trace insertion, BIP-8 calculation and insertion. In receiving direction, performs BIP-24 errored block count, MS_REI recovery, MS_RDI and MS_AIS detection. In transmitting direction, it performs BIP-24 calculation and insertion, MS_REI, MS_RDI and MS_AIS insertion. Provides extraction or insertion of K1 byte and K2 byte. In receiving direction, performs AU4's pointer interpretation, LOP and AIS detection, pointer justification. In transmitting direction, it performs AUG assembly, AU-4 pointer regeneration, AU_AIS generation.
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MST

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

HPT

OH termination J1 path trace message recovery REI information recovering HP_RDI detection (path status monitoring UNEQ and AIS detection (signal label monitoring) VC-4 BIP-8 errored block count

Communication and Control Module

l l l l l

Traces the clock signal from the active and the standby cross-connect unit. Implements laser controlling function. Selects the clock and frame header from the active or the standby cross-connect units. Controls the indicator on the board. CPU control unit, which controls and monitors other function modules. The unit also initializes other function modules after power on. ETH interface, which provides 10/ 100 Mbit/s Ethernet interface for network management. OAM interface, which provides serial port for network management. This port can be used as the MODEM port and thus can be configured as a serial port to connect to MODEM port in running state. COM interface for commissioning port Ethernet port for inter-board communication: 10 Mbit/s Ethernet port between the active and the standby CXL unit. The Q3CXL1 board supports receiving the BIP-8 check for the overhead of the SCC unit, and provides the interface to query the check result.

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Cross-connect Module
The cross-connect module consists of two parts:
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SNCP module, which tests relative alarms and reports the alarm to software to trigger SNCP switching Higher and lower order cross-connect module, which performs the functions of higher and lower order cross-connect units. This module consists of higher order cross-connect unit and lower order cross-connect unit.

Figure 9-3 illustrates the block diagram of higher and lower order cross-connect modules.

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Figure 9-3 Block diagram of higher and lower order cross-connect modules
Time & synchronizaton (SETS) T1 T2 T3 T4(Clock external output) T0 Line units

38MHz OSC

Tributary units SEI AUX

SETG

Frame header T0 (reference clock)

Service units Service units

155MHz PLL

155 MHz 16x155 Mbit/s data

SDH overhead processing module

Cross-connect unit A high speed bus

high speed bus

STM-1

Another CXL unit

O/E

DEMUX

RST
STM-1 16x155 Mbit/s data

MST

MSA

HPT

O/E

MUX

XC Cross Connect (HPC)

high speed bus SCC unit Another connect unit

K1/K2 insertion/ extration

Performance report

Laser shut down

K1/K2 bytes

DCC

XC Cross Connect (LPC)

high speed bus

Cross-connec unit B

Laser control

K1/K2 bytes process

DCC process

DCC

Line unit

ETH channels comunication

Other unit

Communication and control module

Master and slaver board comunication

Another CXL

ETH interface OAM interface

SAP SAP

F&f interface

Power monitor

Phone interface SEI S1-S4 interface

Boot ROM

FLASH

RAM

NVRAM

+3.3 V +5V +1.6V +1.8V +1.2V

DC/DC converter

Fuse

-48 V/-60V -48 V/-60V

DC/DC converter

The upper half part is the higher order cross-connect unit, which fully cross-connects 20 G higher order services with VC-4 as the minimum service grooming granularity. The lower half part is the lower order cross-connect unit, which cross-connects 20 G lower order services.

Other Functions
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Responses to and processes k bytes

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Collects performance data of the optical module and shuts output of the optical module Collects and processes DCC of each board Inserts the DCC back into each line board after processing Monitors the power supply of the board Resets the unit Cuts alarms

DC/DC Converter Module

This module provides the board with required DC voltages. It converts the 48/60 V power supply to the following voltages: +5V, +1.6V, +1.8V +1.2V and+3.3V.

CF Card
The CF card serves as the storage area of the database, system parameters, NE software package, logs and black box. The CF card is hot pluggable. The capacity is 512 MB and can be expanded to 1 GB.

9.1.4 Jumper and DIP Switch

On the CXL1, there are a jumper and a DIP switch, which are used to set the input voltage and running state of the board.

CAUTION
Jumpers are used for test and maintenance. Do not change the setting of jumpers at random. Otherwise, the board may become faulty. Figure 9-4 shows the layout of the J3 jumper and DIP switch SW1 on the CXL1 board.

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Figure 9-4 Jumper and DIP switch of the CXL1 board

3 2 1

J3

CF card

SCC Unit
1 2 3 4

SW1

Table 9-6 lists the jumper on the CXL1 board. Table 9-6 Jumper on the CXL1 board Jumper J3 Function Enable the battery. Description 1-2: When jumpers 1 and 2 are capped, the battery is enabled.

Table 9-7 lists the DIP switch on the CXL1 board. Table 9-7 DIP switch on the CXL1 board DIP Switch SW1 Function Set the board running state Description On: indicates the binary value 1. The DIP switch adopts four bits, which are queued according to the switch numbering. The number 4 indicates the highest bit. For details, refer to Table 9-8.

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Table 9-8 Description of the DIP switch SW1 Value 0b0000 0b0001 0b0011 0b0100 0b1011 0b1100 0b1101 0b1110 0b1111 Description Indicates the running state when the watchdog is started. It is the default state. Changes to the self-test state of the SDRAM Burst. Indicates the commissioning state. Indicates the running state when the watchdog is stopped. Erases the database. Erases the NE software, including the patch. Erases the database and NE software (including the patch). Erases the database, NE software and NE.ini file. Erases the extended BIOS and system parameter zone in the file system and FLASH memory.

9.1.5 Front Panel

On the front panel of the Q2CXL1, there are indicators, interfaces, functional button switch, barcode and laser safety class label. On the front panel of the Q3CXL1 board, there are indicators, interfaces, barcode, functional button switch, laser safety class label, and CF card slot.

Appearance of the Front Panel

Figure 9-5 shows the front panel of the Q2CXL1.

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Figure 9-5 Front panel of the Q2CXL1

CXL1
STAT ACTX ACTC PROG SRVX SRVL SYNC ALMC
CLASS 1 LASER PRODUCT

OUT IN

RESET ALM CUT

CXL1

Figure 9-6 shows the front panel of the Q3CXL1 board.

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Figure 9-6 Front panel the Q3CXL1 board

CXL1
STAT ACTX ACTC PROG SRVX SRVL SYNC ALMC

CLASS 1 LASER PRODUCT

OUT IN
RESET ALM CUT CF R/W CF ON/OFF

CXL1

Indicators
The following indicators are present on the front panel of the board:
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Board hardware state indicator (STAT), which is green or red when lit. Activating state indicator for the services at the cross-connect unit (ACTX), which is green when lit. Active/standby state indicator for the SCC units (ACTC), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Alarm indicator (SRVX) for services at the cross-connect unit, which is red, green or yellow when lit. Alarm indicator (SRVL) for services at the line units , which is red, green or yellow when lit. Synchronization clock state indicator (SYNC), which is red or green when lit. Alarm cutting indicator (ALMC), which is yellow when lit.

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For indication of these indicators, see A Equipment and Board Alarm Indicators.

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CF Card Read-Write Indicator (CF R/W)

State On (green) Flash (green) On (red) Description The CF card is in the read/write state of the system. The system is reading data from or writing data to the CF card. The CF card is off-line or is in the read/write prohibited state. The CF card is in the pluggable state. Flash (red) The system is processing the data after receiving the instruction for pre-processing data from the CF card.

Interfaces
On the front panel of the CXL1, there are one optical interface and two switches. Table 9-9 lists the type and usage of the optical interface and switches on the CXL1. Table 9-9 Optical interface and switches on the CXL1 Interface IN OUT RESET ALM CUT Interface Type LC LC Warm reset switch Alarm cut switch CF card insersion / removal switch Usage Receives optical signals. The pluggable optical module is used for easy maintenance. Transmits optical signals. The pluggable optical module is used for easy maintenance. Press the switch to reset the SCC unit. Press the switch to mute the alarm. Press the switch for three seconds to mute the alarm permanently. Press the switch again for three seconds to resume the alarm sound. Changes the state of the CF card.
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CF ON/OFF

When the CF card is in the read/write state, or when it is reading or writing data, the indicator changes to red and then the CF card changes to the read/write prohibited state if the switch is pressed for five seconds. In this case, you can remove the CF card. When the CF card is in the read/write prohibited state, the indicator changes to green if the switch is pressed for five seconds. Then the CF card restores to the read/ write state.

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9.1.6 Valid Slots

The CXL1 can be housed in any of or slots 45 in the subrack.

9.1.7 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code of the CXL1 indicates the optical interface type. Table 9-10 lists the relation between the board feature code and optical interface type of the CXL1. Table 9-10 Relation between the board feature code and the optical interface type Board Barcode SSQ3CXL110, SSQ2CXL110, SSQ1CXL110 SSQ3CXL111, SSQ2CXL111, SSQ1CXL111 SSQ3CXL112, SSQ2CXL112, SSQ1CXL112 SSQ3CXL113, SSQ2CXL113, SSQ1CXL113 SSQ2CXL114, SSQ2CXL114, SSQ1CXL114 Feature Code 10 Optical Interface Type S-1.1 (LC)

11

L-1.1 (LC)

12

L-1.2 (LC)

13

Ve-1.2 (LC)

14

I-1 (LC)

9.1.8 Board Configuration Reference

The physical slot that houses the CXL1 is different from the logical slot displayed on the T2000. You can use the T2000 to set parameters for the CXL1.

Displayed Slot
The CXL1 is housed in one slot in the subrack. The logical boards for the CXL1 are the Q1SL1, EXCL and GSCC. Table 9-11 lists the logical slots displayed on the T2000.

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Table 9-11 Logical slots displayed on the T2000 for the CXL1 Board CXL1 Logical Board Q1SL1 ECXL GSCC Logical Slot Slots 45 Slots 8081 Slots 8283

Board Parameters
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J1 byte C2 byte Clock parameters

For details on the parameters, refer to F Board Configuration Reference.

9.1.9 Technical Specifications

The technical specifications for the CXL1 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications

Table 9-12 lists the specifications for the optical interfaces of the CXL1. Table 9-12 Specifications for the optical interfaces of the CXL1 Item Nominal bit rate Line code Optical interface type Working wavelength (nm) Optical source type Mean launched optical power (dBm) Receiver sensitivity (dBm) Min. overload (dBm)
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Specification 155520 kbit/s NRZ I-1 1260 to 1360 MLM, LED 15 to 8 S-1.1 1261 to 1360 MLM 15 to 8 L-1.1 1263 to 1360 MLM, SLM 5 to 0 L-1.2 1480 to 1580 SLM 5 to 0 Ve-1.2 1480 to 1580 SLM 3 to 0

23 8

28 8

34 10

34 10

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Item Min. extinction ratio (dB)

Specification 8.2 8.2 10 10 10

Cross-Connect Capacity
The cross-connect capacity of the CXL1 is as follows:
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Higher order cross-connect capacity: 20 Gbit/s Lower order cross-connect capacity: 20 Gbit/s Access capacity: 18.75 Gbit/s

Clock Access Capability

The clock access capability of the CXL1 is described as follows:
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External input clock: two channels, 2048 kbit/s or 2048 kHz External output clock: two channels, 2048 kbit/s or 2048 kHz

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications for the CXL1 are as follows:
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Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg):

Q2CXL1: 1.1kg Q3CXL1: 1.2kg

Power Consumption
At the normal temperature (25), the maximum power consumption for the CXL1 is as follows:
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Q2CXL1: 40W Q3CXL1: 46W

9.2 CXL4
This section describes the CXL4, an integrated board of the SCC, cross-connect, clock and line units, in terms of the version, principle, function, principle, front panel and specifications. 9.2.1 Version Description The CXL4 board has two functional versions, Q2 and Q3. The main differences between the Q2 and Q3 versions are that the Q3 version supports transmitting the DCC overhead information at
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a two-port external clock interface, supports transparently transmitting DCC bytes in TPS group and supports the CF card and package loading function. 9.2.2 Function and Feature The CXL4 is used to process SDH signals, control communication, groom services, and to input and output the clock. 9.2.3 Working Principle and Signal Flow The CXL4 consists of the SDH overhead processing module, RST, MST and so on. 9.2.4 Jumper and DIP Switch On the CXL4, there are a jumper and a DIP switch, which are used to set the input voltage and running state of the board. 9.2.5 Front Panel On the front panel of the Q2CXL4, there are indicators, interfaces, functional button switch, barcode and laser safety class label. On the front panel of the Q3CXL4 board, there are indicators, interfaces, barcode, functional button switch, laser safety class label, and CF card slot. 9.2.6 Valid Slots The CXL4 can be housed in any of or slots 45 in the subrack. 9.2.7 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the CXL4 indicates the optical interface type. 9.2.8 Board Configuration Reference The physical slot that houses the CXL4 is different from the logical slot displayed on the T2000. You can use the T2000 to set parameters for the CXL4. 9.2.9 Technical Specifications The technical specifications for the CXL4 cover the optical interface specifications, board dimensions, weight and power consumption.

9.2.1 Version Description

The CXL4 board has two functional versions, Q2 and Q3. The main differences between the Q2 and Q3 versions are that the Q3 version supports transmitting the DCC overhead information at a two-port external clock interface, supports transparently transmitting DCC bytes in TPS group and supports the CF card and package loading function. Table 9-13 lists the version description of the CXL4 board. Table 9-13 Version description of the CXL4 board Item Functional Version Difference Description The CXL4 board has two functional versions, Q2 and Q3. The Q3CXL4 board supports transmitting the DCC information at a two-port external clock interface. The Q3CXL4 hardware supports the CF card, and the Q3CXL4 software supports package loading function. Q3CXL4 supports transparently transmitting DCC bytes in TPS group.

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Item Replaceability

Description The Q3CXL4 board can fully replace the Q2CXL4 board.

9.2.2 Function and Feature

The CXL4 is used to process SDH signals, control communication, groom services, and to input and output the clock.

SDH Processing Unit

Table 9-14 lists the function and feature of the SDH processing unit of the CXL4. Table 9-14 Function and feature of the SDH processing unit of the CXL4 Function and Feature Basic function Specifications of optical interfaces Specifications of the optical module CXL4 Transmits and receives 1 x STM-4 optical signals. Supports the optical interfaces of the I-4, S-4.1, L-4.1, L-4.2, and Ve-4.2 types.
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Supports detection and query of the information on the optical module. Supports the function of setting the on/off state of the laser and the ALS function.

Service processing Overhead processing

Supports VC-12, VC-3, and VC-4 services and VC4-4c concatenation services.
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Supports the processing of the SOH bytes of the STM-4 signals. Supports the transparent transmission and termination of the POH bytes. Supports the setting and query of the J0/J1/C2 bytes.

Alarms and performance events Protection schemes

Provides rich alarms and performance events for easy management and maintenance of the equipment. Supports multiple protection modes such as two-fiber MSP protection ring, four-fiber MSP protection ring, linear MSP protection, and SNCP..

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Function and Feature Maintenance features

CXL4
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Supports inloop and outloop for optical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services. The Q3CXL4 board hardware supports the CF card, and the Q3CXL1 software supports the package loading function. The CF card is hot pluggable. The capacity is 512 MB and can be expanded to 1 GB.

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SCC Unit
Table 9-15 lists the function and feature of the SCC unit of the CXL4 Table 9-15 Function and feature of the SCC unit of the CXL4 Function and Feature Basic function Specification of the optical interface CXL4 Configures and monitors services, monitors the service performance, and collencts performance events and alarm information.
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Provides 10M/100M compatible Ethernet NMS interface. Provides one 10M/100M Ethernet interface, which is used for inter-board communication. Provides one 10M Ethernet interface, which is used for communication between the active and standby SCC boards. Provides the RS232 OAM interface that is present on on the auxiliary interface board to connect to the PC or workstation. Supports the remote maintenance by using the RS232 DCE modem. The Q3CXL4 board supports receiving the BIP-8 check for the overhead of the SCC unit, and provides the interface to query the check result.

DCC processing capability Fan alarm management PIU management

Q2CXL4 processes 40-channel DCC, Q3CXL4 processes 80-channel DC. Manages fan alarms. Provides the in-service check function for the PIU board, and the failure check function for the lightning protection module of the PIU.
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Function and Feature Protection scheme

CXL4 Supports 1+1 hot backup for the SCC unit.

Cross-Connect Unit
Table 9-16 lists the function and feature of the cross-connect unit of the CXL4. Table 9-16 Function and feature of the cross-connect unit of the CXL4 Function and Feature Basic function CXL4 Completes 20 Gbit/s non-blocking full cross-connection at the VC-4 level, and 20 Gbit/s non-blocking full cross-connection at the VC-12 or VC-3 level. Provides two 4M HDLC fast emergency channels, which are used for the MSP and SNCP protection switching.
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Fast emergency channel Service processing

Dynamically grooms services. Adds or deletes services without interrupting services. Supports the SNCP protection at the VC-3 and VC-12 levels. Supports concatenation services at the VC4-4c level.

Protection scheme

Supports the 1+1 hot backup (non-revertive) for the cross-connect unit.

Clock Unit
Table 9-17 lists the function and feature of the clock unit of the CXL4. Table 9-17 Function and feature of the clock unit of the CXL4 Function and Feature Basic function Other function CXL4 Provides standard system synchronization clock. Supports the extraction, insertion and management of the SSM and clock ID. The Q3CXL4 board supports transmitting the DCC overhead information at a two-port external clock interface. Input and output
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Inputs two-channel 2048 kHz or 2048 kbit/s timing signals, and selects the external timing source. Outputs two-channel 2048 Hz or 2048 kbit/s timing signals.

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9.2.3 Working Principle and Signal Flow

The CXL4 consists of the SDH overhead processing module, RST, MST and so on. Figure 9-7 shows the block diagram for the functions of the Q2CXL4. Figure 9-7 Block diagram for the functions of the Q2CXL4
38MHz OSC
Time & synchronizaton (SETS) T1 T2 T3 T4(Clock external output) T0 Line units Tributary units SEI AUX

SETG

Frame header T0 (reference clock)

Service units Service units

155MHz PLL

155 MHz 16x155 Mbit/s data

SDH overhead processing module

Cross-connect unit A high speed bus

high speed bus

STM-1

Another CXL unit

O/E

DEMUX

RST
STM-1 16x155 Mbit/s data

MST

MSA

HPT

O/E

MUX

XC Cross Connect (HPC)

high speed bus SCC unit Another connect unit

K1/K2 insertion/ extration

Performance report

Laser shut down

K1/K2 bytes

DCC

XC Cross Connect (LPC)

high speed bus Cross-connect unit B

Laser control

K1/K2 bytes process

DCC process

DCC

Line unit

ETH channels comunication

Other unit Another CXL

Communication and control module

Master and slaver board comunication

ETH interface OAM interface

SAP SAP

F&f interface

Power monitor

Phone interface SEI S1-S4 interface

Boot ROM

FLASH

RAM

NVRAM

+3.3 V +5V +1.6V +1.8V +1.2V

DC/DC converter

Fuse

-48 V/-60V -48 V/-60V

DC/DC converter

Figure 9-8shows the block diagram for the functions of the Q3CXL4 board.

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Figure 9-8 Block diagram for the functions of the Q3CXL4 board
Time & synchronizaton (SETS) T1 T2 T3 T4(Clock external output) T0 Line units

38MHz OSC

Tributary units PIU AUX

SETG

Frame header T0 (reference clock)

Service units Service units

155MHz PLL

155 MHz 16x155 Mbit/s data

SDH overhead processing module

Cross-connect unit A high speed bus

high speed bus

STM-1

Another CXL unit

O/E

DEMUX

RST
STM-1 16x155 Mbit/s data

MST

MSA

HPT

O/E

MUX

XC Cross Connect (HPC)

high speed bus SCC unit Another connect unit

K1/K2 insertion/ extration

Performance report

Laser shut down

K1/K2 bytes

DCC

XC Cross Connect (LPC)

high speed bus

Cross-connec unit B

Laser control

K1/K2 bytes process

DCC process

DCC

Line unit

ETH channels comunication

Other unit

Communication and control module

Master and slaver board comunication

Another CXL

ETH interface OAM interface

AUX AUX

F&f interface

Power monitor

Phone interface S1-S4 interface

EOW

Boot ROM

FLASH

RAM

NVRAM

+3.3 V +5V +1.6V +1.8V +1.2V

DC/DC converter

Fuse

-48 V/-60V -48 V/-60V

DC/DC converter

The function modules are described as follows:

Synchronous Timing Unit

The synchronous timing unit provides system clock T0 to the service board, the control unit and the cross-connect unit in central timing distribution mode. This unit also selects one from 12 reference clock sources as the reference clock for synchronous timing. The 12 reference clock sources are from the line board (T1), the tributary board (T2), the external synchronous clock source (T3) and so on. The synchronous system clock source (T0) and 2 M external synchronous
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source (T4) are generated. The boards apply 1 + 1 hot backup. Therefore, both the active and the standby boards tracing the same reference source to ensure the identity between the system clocks of the active and the standby boards. The synchronous timing unit can extract timing from three types of timing signal:
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Timing signal (T1) from STM-N Timing signal (T2) from PDH Reference signal (T3) from external synchronous clock source (2MHz or 2Mbit/s)

The clock module outputs:

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T0, system clock (38 MHz) T4, external timing (2 Mbit/s or 2 MHz) output by line

O/E Conversion Module

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In receive direction, it converts the received optical signals into electrical signals. In transmit direction, it converts the electrical signals into SDH optical signals, and then send optical signals to fibers for transmission. The SPI detects the R_LOS alarm and provides the laser shut down function.

MUX/DEMUX Module
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In receive direction, the DEMUX part demultiplexes the high rate electrical signals into multiple parallel electrical signals, and recovery the clock signal at the same time. In transmit direction, the MUX part multiplexes the parallel electrical signals received from the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing Module

It includes RST, MST, MSA and HPT, provides inloop and outloop function.
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RST

In receiving direction, performs frame alignment detection (A1, A2), regenerator section trace recovery (J0) and mismatch detection, BIP-8 errored block count. In transmitting direction, it performs frame alignment insertion, regenerator section path trace insertion, BIP-8 calculation and insertion. In receiving direction, performs BIP-24 errored block count, MS_REI recovery, MS_RDI and MS_AIS detection. In transmitting direction, it performs BIP-24 calculation and insertion, MS_REI, MS_RDI and MS_AIS insertion. Provides extraction or insertion of K1 byte and K2 byte. In receiving direction, performs AU4's pointer interpretation, LOP and AIS detection, pointer justification. In transmitting direction, it performs AUG assembly, AU-4 pointer regeneration, AU_AIS generation.
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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

HPT

OH termination J1 path trace message recovery REI information recovering HP_RDI detection (path status monitoring UNEQ and AIS detection (signal label monitoring) VC-4 BIP-8 errored block count

Communication and Control Module

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Traces the clock signal from the active and the standby cross-connect unit. Implements laser controlling function. Selects the clock and frame header from the active or the standby cross-connect units. Controls the indicator on the board. CPU control unit, which controls and monitors other function modules. The unit also initializes other function modules after power on. ETH interface, which provides 10/ 100 Mbit/s Ethernet interface for network management. OAM interface, which provides serial port for network management. This port can be used as the MODEM port and thus can be configured as a serial port to connect to MODEM port in running state. COM interface for commissioning port Ethernet port for inter-board communication: 10 Mbit/s Ethernet port between the active and the standby CXL unit. The Q3CXL4 board supports receiving the BIP-8 check for the overhead of the SCC unit, and provides the interface to query the check result.

l l

l l

Cross-connect Module
The cross-connect module consists of two parts:
l

SNCP module, which tests relative alarms and reports the alarm to software to trigger SNCP switching Higher and lower order cross-connect module, which performs the functions of higher and lower order cross-connect units. This module consists of higher order cross-connect unit and lower order cross-connect unit.

Figure 9-9 illustrates the block diagram of higher and lower order cross-connect modules.

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Figure 9-9 Block diagram of higher and lower order cross-connect modules
Time & synchronizaton (SETS) T1 T2 T3 T4(Clock external output) T0 Line units

38MHz OSC

Tributary units SEI AUX

SETG

Frame header T0 (reference clock)

Service units Service units

155MHz PLL

155 MHz 16x155 Mbit/s data

SDH overhead processing module

Cross-connect unit A high speed bus

high speed bus

STM-1

Another CXL unit

O/E

DEMUX

RST
STM-1 16x155 Mbit/s data

MST

MSA

HPT

O/E

MUX

XC Cross Connect (HPC)

high speed bus SCC unit Another connect unit

K1/K2 insertion/ extration

Performance report

Laser shut down

K1/K2 bytes

DCC

XC Cross Connect (LPC)

high speed bus

Cross-connec unit B

Laser control

K1/K2 bytes process

DCC process

DCC

Line unit

ETH channels comunication

Other unit

Communication and control module

Master and slaver board comunication

Another CXL

ETH interface OAM interface

SAP SAP

F&f interface

Power monitor

Phone interface SEI S1-S4 interface

Boot ROM

FLASH

RAM

NVRAM

+3.3 V +5V +1.6V +1.8V +1.2V

DC/DC converter

Fuse

-48 V/-60V -48 V/-60V

DC/DC converter

The upper half part is the higher order cross-connect unit, which fully cross-connects 20 G higher order services with VC-4 as the minimum service grooming granularity. The lower half part is the lower order cross-connect unit, which cross-connects 20 G lower order services.

Other Functions
l

Responses to and processes k bytes

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l l l l l l

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Collects performance data of the optical module and shuts output of the optical module Collects and processes DCC of each board Inserts the DCC back into each line board after processing Monitors the power supply of the board Resets the unit Cuts alarms

DC/DC Converter Module

This module provides the board with required DC voltages. It converts the 48/60 V power supply to the following voltages: +5V, +1.6V, +1.8V +1.2V and+3.3V.

CF Card
The CF card serves as the storage area of the database, system parameters, NE software package, logs and black box. The CF card is hot pluggable. The capacity is 512 MB and can be expanded to 1 GB.

9.2.4 Jumper and DIP Switch

On the CXL4, there are a jumper and a DIP switch, which are used to set the input voltage and running state of the board.

CAUTION
Jumpers are used for test and maintenance. Do not change the setting of jumpers at random. Otherwise, the board may become faulty. Figure 9-10 shows the layout of the J3 jumper and DIP switch SW1 on the CXL4 board.

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Figure 9-10 Jumper and DIP switch of the CXL4 board

3 2 1

J3

CF card

SCC Unit
1 2 3 4

SW1

Table 9-18 lists the jumper on the CXL4 board. Table 9-18 Jumper on the CXL4 board Jumper J3 Function Enable the battery. Description 1-2: When jumpers 1 and 2 are capped, the battery is enabled.

Table 9-19 lists the DIP switch on the CXL board. Table 9-19 DIP switch on the CXL4 board DIP Switch SW1 Function Set the board running state. Description On: indicates the binary value 1. The DIP switch adopts four bits, which are queued according to the switch numbering. The number 4 indicates the highest bit. For details, refer to Table 9-20.

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Table 9-20 Description of DIP switch SW1 Value 0b0000 0b0001 0b0011 0b0100 0b1011 0b1100 0b1101 0b1110 0b1111 Description Indicates the running state when the watchdog is started. It is the default state. Changes to the self-test state of the SDRAM Burst. Indicates the commissioning state. Indicates the running state when the watchdog is stopped. Erases the database. Erases the NE software, including the patch. Erases the database and NE software (including the patch). Erases the database, NE software and NE.ini file. Erases the extended BIOS and system parameter zone in the file system and FLASH memory.

9.2.5 Front Panel

On the front panel of the Q2CXL4, there are indicators, interfaces, functional button switch, barcode and laser safety class label. On the front panel of the Q3CXL4 board, there are indicators, interfaces, barcode, functional button switch, laser safety class label, and CF card slot.

Appearance of the Front Panel

Figure 9-11 shows the front panel of the Q2CXL4.

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Figure 9-11 Front panel of the Q2CXL4

CXL4
STAT ACTX ACTC PROG SRVX SRVL SYNC ALMC
CLASS 1 LASER PRODUCT

OUT IN

RESET

ALM CUT

CXL4

Figure 9-12shows the front panel of the Q3CXL4 board.

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Figure 9-12 Front panel the Q3CXL4 board

CXL4
STAT ACTX ACTC PROG SRVX SRVL SYNC ALMC

CLASS 1 LASER PRODUCT

OUT IN
RESET ALM CUT CF R/W CF ON/OFF

CXL4

Indicators
The following indicators are present on the front panel of the board:
l l

Board hardware state indicator (STAT), which is green or red when lit. Activating state indicator for the services at the cross-connect unit (ACTX), which is green when lit. Active/standby state indicator for the SCC units (ACTC), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Alarm indicator (SRVX) for services at the cross-connect unit, which is red, green or yellow when lit. Alarm indicator (SRVL) for services at the line units , which is red, green or yellow when lit. Synchronization clock state indicator (SYNC), which is red or green when lit. Alarm cutting indicator (ALMC), which is yellow when lit.

l l l

l l

For indication of these indicators, see A Equipment and Board Alarm Indicators.

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CF Card Read-Write Indicator (CF R/W)

State On (green) Flash (green) On (red) Description The CF card is in the read/write state of the system. The system is reading data from or writing data to the CF card. The CF card is off-line or is in the read/write prohibited state. The CF card is in the pluggable state. Flash (red) The system is processing the data after receiving the instruction for pre-processing data from the CF card.

Interfaces
On the front panel of the CXL4, there are one optical interface and two switches. Table 9-21 lists the type and usage of the optical interface and switches on the CXL4. Table 9-21 Optical interface and switches on the CXL4 Interface IN OUT RESET ALM CUT Interface Type LC LC Warm reset switch Alarm cut switch Usage Receives optical signals. The pluggable optical module is used for easy maintenance. Transmits optical signals. The pluggable optical module is used for easy maintenance. Press the switch to reset the SCC unit. Press the switch to mute the alarm. Press the switch for three seconds to mute the alarm permanently. Press the switch again for three seconds to resume the alarm sound. Changes the state of the CF card.
l

CF ON/OFF

CF card insertion / removal switch

When the CF card is in the read/write state, or when it is reading or writing data, the indicator changes to red and then the CF card changes to the read/write prohibited state if the switch is pressed for five seconds. In this case, you can remove the CF card. When the CF card is in the read/write prohibited state, the indicator changes to green if the switch is pressed for five seconds. Then the CF card is restored to the read/write state.

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9.2.6 Valid Slots

The CXL4 can be housed in any of or slots 45 in the subrack.

9.2.7 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code of the CXL4 indicates the optical interface type. Table 9-22 lists the relation between the board feature code and optical interface type of the CXL4. Table 9-22 Relation between the board feature code and the optical interface type Board Barcode SSQ3CXL410, SSQ2CXL410, SSQ1CXL410 SSQ3CXL411, SSQ2CXL411, SSQ1CXL411 SSQ3CXL412, SSQ2CXL412, SSQ1CXL412 SSQ3CXL413, SSQ2CXL413, SSQ1CXL413 SSQ3CXL414, SSQ2CXL414, SSQ1CXL414 Feature Code 10 Optical Interface Type S-4.1 (LC)

11

L-4.1 (LC)

12

L-4.2 (LC)

13

Ve-4.2 (LC)

14

I-4 (LC)

9.2.8 Board Configuration Reference

The physical slot that houses the CXL4 is different from the logical slot displayed on the T2000. You can use the T2000 to set parameters for the CXL4.

Displayed Slot
The CXL4 is housed in one slot in the subrack. The logical boards for the CXL4 are the Q1SL4, EXCL and GSCC. Table 9-23 lists the logical slots displayed on the T2000.

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Table 9-23 Logical slots displayed on the T2000 for the CXL4 Board CXL4 Logical Board Q1SL4 ECXL GSCC Logical Slot Slots 45 Slots 8081 Slots 8283

Board Parameters
l l l

J1 byte C2 byte Clock parameters

For details on the parameters, refer to F Board Configuration Reference.

9.2.9 Technical Specifications

The technical specifications for the CXL4 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications

Table 9-24 lists the specifications for the optical interfaces of the CXL4. Table 9-24 Specifications for the optical interfaces of the CXL4 Item Nominal bit rate Line code Optical interface type Working wavelength (nm) Optical source type Mean launched optical power (dBm) Receiver sensitivity (dBm) Min. overload (dBm)
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Specification 622080 kbit/s NRZ I-4 1261 to 1360 MLM 15 to 8 S-4.1 1274 to 1356 MLM 15 to 8 L-4.1 1280 to 1335 SLM 3 to 2 L-4.2 1480 to 1580 SLM 3 to 2 Ve-4.2 1480 to 1580 SLM 3 to 2

23 8

28 8

28 8

28 8

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Item Min. extinction ratio (dB)

Specification 8.2 8.2 10 10 10.5

Cross-Connect Capacity
The cross-connect capacity of the CXL4 is described as follows:
l l l

Higher order cross-connect capacity: 20 Gbit/s Lower order cross-connect capacity: 20 Gbit/s Access capacity: 18.75 Gbit/s

Clock Access Capability

The clock access capability of the CXL4 is described as follows:
l l

External input clock: two channels, 2048 kbit/s or 2048 kHz External output clock: two channels, 2048 kbit/s or 2048 kHz

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications for the CXL4 are as follows:
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Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg):

Q2CXL4: 1.1kg Q3CXL4: 1.2kg

Power Consumption
At the normal temperature (25), the maximum power consumption of the CXL4 is:
l l

Q2CXL4: 40W Q3CXL4: 46W

9.3 CXL16
This section describes the CXL16, an integrated board of the SCC, cross-connect, clock and line units, in terms of the version, principle, function, principle, front panel and specifications. 9.3.1 Version Description The CXL1 board has two functional versions, Q2 and Q3. The main differences between the Q2 and Q3 versions are that the Q3 version supports transmitting the DCC overhead information at
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a two-port external clock interface, supports transparently transmitting DCC bytes in TPS group and supports the CF card and package loading function. 9.3.2 Function and Feature The CXL16 is used to process SDH signals, control communication, groom services, and to input and output the clock. 9.3.3 Working Principle and Signal Flow The CXL16 consists of the SDH overhead processing module, RST, MST and so on. 9.3.4 Jumper and DIP Switch On the CXL16, there are a jumper and a DIP switch, which are used to set the input voltage and running state of the board. 9.3.5 Front Panel On the front panel of the Q2CXL16, there are indicators, interfaces, functional button switch, barcode and laser safety class label. On the front panel of the Q3CXL16 board, there are indicators, interfaces, barcode, functional button switch, laser safety class label, and CF card slot. 9.3.6 Valid Slots The CXL16 can be housed in any of slots 45 in the subrack. 9.3.7 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the CXL16 indicates the optical interface type. 9.3.8 Board Configuration Reference The physical slot that houses the CXL16 is different from the logical slot displayed on the T2000. You can use the T2000 to set parameters for the CXL16. 9.3.9 Technical Specifications The technical specifications for the CXL16 cover the optical interface specifications, board dimensions, weight and power consumption.

9.3.1 Version Description

The CXL1 board has two functional versions, Q2 and Q3. The main differences between the Q2 and Q3 versions are that the Q3 version supports transmitting the DCC overhead information at a two-port external clock interface, supports transparently transmitting DCC bytes in TPS group and supports the CF card and package loading function. Table 9-25lists the version description of the CXL16 board. Table 9-25 Version description of the CXL16 board Item Functional Version Difference Description The CXL16 board has two functional versions, Q2 and Q3. The Q3CXL16 board supports transmitting the DCC information at a two-port external clock interface. The Q3CXL16 hardware supports the CF card, and the Q3CXL16 software supports package loading function. Q3CXL16 supports transparently transmitting DCC bytes in TPS group.
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Item Replaceability

Description The Q3CXL16 board can fully replace the Q2CXL16 board.

9.3.2 Function and Feature

The CXL16 is used to process SDH signals, control communication, groom services, and to input and output the clock.

SDH Processing Unit

Table 9-26 lists the function and feature of the SDH processing unit of the CXL16. Table 9-26 Function and feature of the SDH processing unit of the CXL16 Function and Feature Basic function Specification of the optical interface Specification of the optical module CXL16 Transmits and receives 1 x STM-16 optical signals. Supports the optical interfaces of the I-16, S-16.1, L-16.1, and L-16.2 types.
l

Supports detection and query of the information on the optical module. Supports the function of setting the on/off state of the laser and the ALS function.

Service processing Overhead processing

Supports VC-12, VC-3, and VC-4 services and VC4-4c, VC4-8c, and VC4-16c concatenation services.
l l

Supports the processing of the SOH bytes of the STM-16 signals. Supports the transparent transmission and termination of the POH bytes. Supports the setting and query of the J0/J1/C2 bytes.

Alarm and performance event Protection scheme

Provides rich alarms and performance events for easy management and maintenance of the equipment. Supports the two-fiber MSP protection ring, four-fiber MSP protection ring, linear MSP protection, and SNCP.

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Function and Feature Maintenance feature

CXL16
l l

Supports inloop and outloop for optical interfaces. Supports warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services. The Q3CXL16 board hardware supports the CF card, and the Q3CXL16 software supports the package loading function. The CF card is hot pluggable. The capacity is 512 MB and can be expanded to 1 GB.

l l

SCC Unit
Table 9-27 lists the function and feature of the SCC unit of the CXL16 Table 9-27 Function and feature of the SCC unit of the CXL16 Function and Feature Basic function Specification of the optical interface CXL16 Configures and monitors services, monitors the service performance, and collects performance events and alarm information.
l l

Provides 10M/100M compatible Ethernet NMS interface. Provides one 10M/100M Ethernet interface, which is used for inter-board communication. Provides one 10M Ethernet interface, which is used for communication between the active and standby SCC boards. Provides the RS232 OAM interface that is present on on the auxiliary interface board to connect to the PC or workstation. Supports the remote maintenance by using the RS232 DCE modem. The Q3CXL16 board supports receiving the BIP-8 check for the overhead of the SCC unit, and provides the interface to query the check result.

DCC processing capability Fan alarm management PIU management

Q2CXL16 processes 40-channel DCC, Q3CXL16 processes 80channel DCC. Manages fan alarms. Provides the in-service check function for the PIU board, and the failure check function for the lightning protection module of the PIU.
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Function and Feature Protection scheme

CXL16 Supports 1+1 hot backup for the SCC unit.

Cross-Connect Unit
Table 9-28 lists the function and feature of the cross-connect unit of the CXL16. Table 9-28 Function and feature of the cross-connect unit of the CXL16 Function and Feature Basic function CXL16 Completes 20 Gbit/s non-blocking full cross-connection at the VC-4 level, and 20 Gbit/s non-blocking full cross-connection at the VC-12 or VC-3 level. Provides two 4M HDLC fast emergency channels, which are used for the MSP and SNCP protection switching.
l

Fast emergency channel Service processing

Dynamically grooms services, such as the cross-connect and broadcast services. Adds or deletes services without interrupting services. Supports the SNCP protection at the VC-3 and VC-12 levels. Supports concatenation services at the VC4-4c, VC4-8c and VC4-16c levels.

l l l

Protection scheme

Supports the 1+1 hot backup (non-revertive) for the cross-connect unit.

Clock Unit
Table 9-29 lists the function and feature of the clock unit of the CXL16. Table 9-29 Function and feature of the clock unit of the CXL16 Function and Feature Basic function Other function CXL16 Provides standard system synchronization clock. Supports the extraction, insertion and management of the SSM and clock ID. The Q3CXL16 board supports transmitting the DCC overhead information at a two-port external clock interface.

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Function and Feature Input and output

CXL16
l

Inputs two-channel 2048 kHz or 2048 kbit/s timing signals, and selects the external timing source. Outputs two-channel 2048 Hz or 2048 kbit/s timing signals.

9.3.3 Working Principle and Signal Flow

The CXL16 consists of the SDH overhead processing module, RST, MST and so on. Figure 9-13 shows the block diagram for the functions of the Q2CXL16. Figure 9-13 Block diagram for the functions of the Q2CXL16
38MHz OSC
Time & synchronizaton (SETS) T1 T2 T3 T4(Clock external output) T0 Line units Tributary units SEI AUX

SETG

Frame header T0 (reference clock)

Service units Service units

155MHz PLL

155 MHz 16x155 Mbit/s data

SDH overhead processing module

Cross-connect unit A high speed bus

high speed bus

STM-1

Another CXL unit

O/E

DEMUX

RST
STM-1 16x155 Mbit/s data

MST

MSA

HPT

O/E

MUX

XC Cross Connect (HPC)

high speed bus SCC unit Another connect unit

K1/K2 insertion/ extration

Performance report

Laser shut down

K1/K2 bytes

DCC

XC Cross Connect (LPC)

high speed bus Cross-connect unit B

Laser control

K1/K2 bytes process

DCC process

DCC

Line unit

ETH channels comunication

Other unit Another CXL

Communication and control module

Master and slaver board comunication

ETH interface OAM interface

SAP SAP

F&f interface

Power monitor

Phone interface SEI S1-S4 interface

Boot ROM

FLASH

RAM

NVRAM

+3.3 V +5V +1.6V +1.8V +1.2V

DC/DC converter

Fuse

-48 V/-60V -48 V/-60V

DC/DC converter

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Figure 9-14shows the block diagram for the functions of the Q3CXL16 board. Figure 9-14 Block diagram for the functions of the Q3CXL16 board
Time & synchronizaton (SETS) T1 T2 T3 T4(Clock external output) T0 Line units

38MHz OSC

Tributary units PIU AUX

SETG

Frame header T0 (reference clock)

Service units Service units

155MHz PLL

155 MHz 16x155 Mbit/s data

SDH overhead processing module

Cross-connect unit A high speed bus

high speed bus

STM-1

Another CXL unit

O/E

DEMUX

RST
STM-1 16x155 Mbit/s data

MST

MSA

HPT

O/E

MUX

XC Cross Connect (HPC)

high speed bus SCC unit Another connect unit

K1/K2 insertion/ extration

Performance report

Laser shut down

K1/K2 bytes

DCC

XC Cross Connect (LPC)

high speed bus

Cross-connec unit B

Laser control

K1/K2 bytes process

DCC process

DCC

Line unit

ETH channels comunication

Other unit

Communication and control module

Master and slaver board comunication

Another CXL

ETH interface OAM interface

AUX AUX

F&f interface

Power monitor

Phone interface S1-S4 interface

EOW

Boot ROM

FLASH

RAM

NVRAM

+3.3 V +5V +1.6V +1.8V +1.2V

DC/DC converter

Fuse

-48 V/-60V -48 V/-60V

DC/DC converter

The function modules are described as follows:

Synchronous Timing Unit

The synchronous timing unit provides system clock T0 to the service board, the control unit and the cross-connect unit in central timing distribution mode. This unit also selects one from 12 reference clock sources as the reference clock for synchronous timing. The 12 reference clock
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sources are from the line board (T1), the tributary board (T2), the external synchronous clock source (T3) and so on. The synchronous system clock source (T0) and 2 M external synchronous source (T4) are generated. The boards apply 1 + 1 hot backup. Therefore, both the active and the standby boards tracing the same reference source to ensure the identity between the system clocks of the active and the standby boards. The synchronous timing unit can extract timing from three types of timing signal:
l l l

Timing signal (T1) from STM-N Timing signal (T2) from PDH Reference signal (T3) from external synchronous clock source (2MHz or 2Mbit/s)

The clock module outputs:

l l

T0, system clock (38 MHz) T4, external timing (2 Mbit/s or 2 MHz) output by line

O/E Conversion Module

l l

In receive direction, it converts the received optical signals into electrical signals. In transmit direction, it converts the electrical signals into SDH optical signals, and then send optical signals to fibers for transmission. The SPI detects the R_LOS alarm and provides the laser shut down function.

MUX/DEMUX Module
l

In receive direction, the DEMUX part demultiplexes the high rate electrical signals into multiple parallel electrical signals, and recovery the clock signal at the same time. In transmit direction, the MUX part multiplexes the parallel electrical signals received from the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing Module

It includes RST, MST, MSA and HPT, provides inloop and outloop function.
l

RST

In receiving direction, performs frame alignment detection (A1, A2), regenerator section trace recovery (J0) and mismatch detection, BIP-8 errored block count. In transmitting direction, it performs frame alignment insertion, regenerator section path trace insertion, BIP-8 calculation and insertion. In receiving direction, performs BIP-24 errored block count, MS_REI recovery, MS_RDI and MS_AIS detection. In transmitting direction, it performs BIP-24 calculation and insertion, MS_REI, MS_RDI and MS_AIS insertion. Provides extraction or insertion of K1 byte and K2 byte. In receiving direction, performs AU4's pointer interpretation, LOP and AIS detection, pointer justification.
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MST

MSA

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In transmitting direction, it performs AUG assembly, AU-4 pointer regeneration, AU_AIS generation. OH termination J1 path trace message recovery REI information recovering HP_RDI detection (path status monitoring UNEQ and AIS detection (signal label monitoring) VC-4 BIP-8 errored block count

HPT

Communication and Control Module

l l l l l

Traces the clock signal from the active and the standby cross-connect unit. Implements laser controlling function. Selects the clock and frame header from the active or the standby cross-connect units. Controls the indicator on the board. CPU control unit, which controls and monitors other function modules. The unit also initializes other function modules after power on. ETH interface, which provides 10/100 Mbit/s Ethernet interface for network management. OAM interface, which provides serial port for network management. This port can be used as the MODEM port and thus can be configured as a serial port to connect to MODEM port in running state. COM interface for commissioning port Ethernet port for inter-board communication: 10 Mbit/s Ethernet port between the active and the standby CXL unit. The Q3CXL16 board supports receiving the BIP-8 check for the overhead of the SCC unit, and provides the interface to query the check result.

l l

l l

Cross-connect Module
The cross-connect module consists of two parts:
l

SNCP module, which tests relative alarms and reports the alarm to software to trigger SNCP switching Higher and lower order cross-connect module, which performs the functions of higher and lower order cross-connect units. This module consists of higher order cross-connect unit and lower order cross-connect unit.

Figure 9-15 illustrates the block diagram of higher and lower order cross-connect modules.

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Figure 9-15 Block diagram of higher and lower order cross-connect modules
Time & synchronizaton (SETS) T1 T2 T3 T4(Clock external output) T0 Line units

38MHz OSC

Tributary units SEI AUX

SETG

Frame header T0 (reference clock)

Service units Service units

155MHz PLL

155 MHz 16x155 Mbit/s data

SDH overhead processing module

Cross-connect unit A high speed bus

high speed bus

STM-1

Another CXL unit

O/E

DEMUX

RST
STM-1 16x155 Mbit/s data

MST

MSA

HPT

O/E

MUX

XC Cross Connect (HPC)

high speed bus SCC unit Another connect unit

K1/K2 insertion/ extration

Performance report

Laser shut down

K1/K2 bytes

DCC

XC Cross Connect (LPC)

high speed bus

Cross-connec unit B

Laser control

K1/K2 bytes process

DCC process

DCC

Line unit

ETH channels comunication

Other unit

Communication and control module

Master and slaver board comunication

Another CXL

ETH interface OAM interface

SAP SAP

F&f interface

Power monitor

Phone interface SEI S1-S4 interface

Boot ROM

FLASH

RAM

NVRAM

+3.3 V +5V +1.6V +1.8V +1.2V

DC/DC converter

Fuse

-48 V/-60V -48 V/-60V

DC/DC converter

The upper half part is the higher order cross-connect unit, which fully cross-connects 20 G higher order services with VC-4 as the minimum service grooming granularity. The lower half part is the lower order cross-connect unit, which cross-connects 20 G lower order services.

Other Functions
l

Responses to and processes K bytes

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Collects performance data of the optical module and shuts output of the optical module Collects and processes DCC of each board Inserts the DCC back into each line board after processing Monitors the power supply of the board Resets the unit Cuts alarms

DC Converter Module
This module provides the board with required DC voltages. It converts the 48/60 V power supply to the following voltages: +5V, +1.6V, +1.8V +1.2V and+3.3V.

CF Card
The CF card serves as the storage area of the database, system parameters, NE software package, logs and black box. The CF card is hot pluggable. The capacity is 512 MB and can be expanded to 1 GB.

9.3.4 Jumper and DIP Switch

On the CXL16, there are a jumper and a DIP switch, which are used to set the input voltage and running state of the board.

CAUTION
Jumpers are used for test and maintenance. Do not change the setting of jumpers at random. Otherwise, the board may become faulty. Figure 9-16 shows the layout of the J3 jumper and DIP switch SW1 on the CXL16 board.

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Figure 9-16 Jumper and DIP switch of the CXL16 board

3 2 1

J3

CF card

SCC Unit
1 2 3 4

SW1

Table 9-30 lists the jumper on the CXL16 board. Table 9-30 Jumper on the CXL16 board Jumper J3 Function Enable the battery. Description 1-2: When jumpers 2 and 3 are capped, the battery is enabled.

Table 9-31 lists the DIP switch on the CXL board. Table 9-31 DIP switch on the CXL16 board DIP Switch SW2 Function Set the board running state. Description On: indicates the binary value 1. The DIP switch adopts four bits, which are queued according to the switch numbering. The number 4 indicates the highest bit. For details, refer toTable 9-32.

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Table 9-32 Description of the DIP switch SW1 Value 0b0000 0b0001 0b0011 0b0100 0b1011 0b1100 0b1101 0b1110 0b1111 Description Indicates the running state when the watchdog is started. It is the default state. Changes to the self-test state of the SDRAM Burst. Indicates the commissioning state. Indicates the running state when the watchdog is stopped. Erases the database. Erases the NE software, including the patch. Erases the database and NE software (including the patch). Erases the database, NE software and NE.ini file. Erases the extended BIOS and system parameter zone in the file system and FLASH memory.

9.3.5 Front Panel

On the front panel of the Q2CXL16, there are indicators, interfaces, functional button switch, barcode and laser safety class label. On the front panel of the Q3CXL16 board, there are indicators, interfaces, barcode, functional button switch, laser safety class label, and CF card slot.

Appearance of the Front Panel

Figure 9-17 shows the front panel of the Q2CXL16.

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Figure 9-17 Front panel of the Q2CXL16

CXL16
STAT ACTX ACTC PROG SRVX SRVL SYNC ALMC
CLASS 1 LASER PRODUCT

OUT IN

RESET ALM CUT

CXL16

Figure 9-18 shows the front panel of the Q3CXL16 board.

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Figure 9-18 Front panel the Q3CXL16 board

CXL16
STAT ACTX ACTC PROG SRVX SRVL SYNC ALMC

CLASS 1 LASER PRODUCT

OUT IN
RESET ALM CUT CF R/W CF ON/OFF

CXL16

Indicators
The following indicators are present on the front panel of the board:
l l

Board hardware state indicator (STAT), which is green or red when lit. Activating state indicator for the services at the cross-connect unit (ACTX), which is green when lit. Active/standby state indicator for the SCC units (ACTC), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Alarm indicator (SRVX) for services at the cross-connect unit, which is red, green or yellow when lit. Alarm indicator (SRVL) for services at the line units , which is red, green or yellow when lit. Synchronization clock state indicator (SYNC), which is red or green when lit. Alarm cutting indicator (ALMC), which is yellow when lit.

l l l

l l

For indication of these indicators, see A Equipment and Board Alarm Indicators.

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CF Card Read-Write Indicator (CF R/W)

State On (green) Flash (green) On (red) Description The CF card is in the read/write state of the system. The system is reading data from or writing data to the CF card. The CF card is off-line or is in the read/write prohibited state. The CF card is in the pluggable state. Flash (red) The system is processing the data after receiving the instruction for pre-processing data from the CF card.

Interfaces
On the front panel of the CXL16, there are one optical interface and two switches. Table 9-33 lists the type and usage of the optical interface and switches on the CXL16. Table 9-33 Optical interface and switches on the CXL16 Interface IN OUT RESET ALM CUT Interface Type LC LC Warm reset switch Alarm cut switch CF card insertion / removal switch Usage Receives optical signals. The pluggable optical module is used for easy maintenance. Transmits optical signals. The pluggable optical module is used for easy maintenance. Press the switch to reset the SCC unit. Press the switch to mute the alarm. Press the switch for three seconds to mute the alarm permanently. Press the switch again for three seconds to resume the alarm sound. Changes the state of the CF card.
l

CF ON/OFF

When the CF card is in the read/write state, or when it is reading or writing data, the indicator changes to red and then the CF card changes to the read/write prohibited state if the switch is pressed for five seconds. In this case, you can remove the CF card. When the CF card is in the read/write prohibited state, the indicator changes to green if the switch is pressed for five seconds. Then the CF card is restored to the read/write state.

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9.3.6 Valid Slots

The CXL16 can be housed in any of slots 45 in the subrack.

9.3.7 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code of the CXL16 indicates the optical interface type. Table 9-34 lists the relation between the board feature code and optical interface type of the CXL16. Table 9-34 Relation between the board feature code and the optical interface type Board Barcode SSQ3CXL1610, SSQ2CXL1610, SSQ1CXL1610 SSQ3CXL1611, SSQ2CXL1611, SSQ1CXL1611 SSQ3CXL1612, SSQ2CXL1612, SSQ1CXL1612 SSQ3CXL1614, SSQ2CXL1614, SSQ1CXL1614 Feature Code 10 Optical Interface Type S-16.1

11

L-16.1

12

L-16.2

14

I-16

9.3.8 Board Configuration Reference

The physical slot that houses the CXL16 is different from the logical slot displayed on the T2000. You can use the T2000 to set parameters for the CXL16.

Displayed Slot
The CXL16 is housed in one slot in the subrack. The logical boards for the CXL16 are the Q1SL16, EXCL and GSCC. Table 9-35 lists the logical slots displayed on the T2000. Table 9-35 Logical slots displayed on the T2000 for the CXL16 Board CXL16 Logical Board Q1SL16 ECXL
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Board

Logical Board GSCC

Logical Slot Slots 8283

Board Parameters
l l l

J1 byte C2 byte Clock parameters

For details on the parameters, refer to F Board Configuration Reference.

9.3.9 Technical Specifications

The technical specifications for the CXL16 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications

Table 9-36 lists the specifications for the optical interfaces of the CXL16. Table 9-36 Specifications for the optical interfaces of the CXL16 Item Nominal bit rate Line code Optical interface type Working wavelength (nm) Optical source type Mean launched optical power (dBm) Receiver sensitivity (dBm) Min. overload (dBm) Min. extinction ratio (dB) Specification 2488320 kbit/s NRZ I-16 1266 to 1360 MLM 10 to 3 S-16.1 1260 to 1360 SLM 5 to 0 L-16.1 1280 to 1335 SLM 2 to 3 L-16.2 1500 to 1580 SLM 2 to 3

18 3 8.2

18 0 8.2

27 9 8.2

28 9 8.2

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Cross-Connect Capacity
The cross-connect capacity of the CXL16 described as follows:
l l l

Higher order cross-connect capacity: 20 Gbit/s Lower order cross-connect capacity: 20 Gbit/s Access capacity: 18.75 Gbit/s

Clock Access Capability

The clock access capability of the CXL16 is described as follows:
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External input clock: two channels, 2048 kbit/s or 2048 kHz External output clock: two channels, 2048 kbit/s or 2048 kHz

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications for the CXL16 are as follows:
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Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg):

Q2CXL16: 1.1kg Q3CXL16: 1.2kg

Power Consumption
At the normal temperature (25), the maximum power consumption of the CXL16 is as follows:
l l

Q2CXL16: 40W Q3CXL16: 46W

9.4 CXLL1
This section describes the CXLL1, an integrated board of the SCC, cross-connect, clock and line units, in terms of the version, principle, function, principle, front panel and specifications. 9.4.1 Version Description The functional version of CXLL1 board is R1. 9.4.2 Function and Feature The CXLL1 is used to process SDH signals, control communication, groom services, and to input and output the clock. 9.4.3 Working Principle and Signal Flow The CXLL1 consists of the SDH overhead processing module, RST, MST and so on. 9.4.4 Jumper and DIP Switch
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On the CXL, there are a jumper and a DIP switch, which are used to set the input voltage and running state of the board. 9.4.5 Front Panel On the front panel of the CXLL1 board, there are indicators, interfaces, barcode, functional button switch, laser safety class label, and CF card slot. 9.4.6 Valid Slots The CXLL1 can be housed in any of slots 45 in the subrack. 9.4.7 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the CXLL1 indicates the optical interface type. 9.4.8 Board Configuration Reference The physical slot that houses the CXLL1 is different from the logical slot displayed on the T2000. You can use the T2000 to set parameters for the CXLL1. 9.4.9 Technical Specifications The technical specifications for the CXLL1 cover the optical interface specifications, board dimensions, weight and power consumption.

9.4.1 Version Description

The functional version of CXLL1 board is R1.

9.4.2 Function and Feature

The CXLL1 is used to process SDH signals, control communication, groom services, and to input and output the clock.

SDH Processing Unit

Table 9-37 lists the function and feature of the SDH processing unit of the CXLL1. Table 9-37 Function and feature of the SDH processing unit of the CXLL1 Function and Feature Basic function Specification of the optical interface Specification of the optical module CXLL1 Transmits and receives 1 x STM-1 optical signals. Supports the optical interfaces of the I-1, S-1.1, L-1.1, L-1.2, and Ve-1.2 types.
l

Supports detection and query of the information on the optical module. Supports the function of setting the on/off state of the laser and the ALS function.

Service processing Overhead processing

Supports the processing of the VC-12, VC-3 and VC-4 services.

l l

Supports the processing of the SOH bytes of the STM-1 signals. Supports the transparent transmission and termination of the POH bytes. Supports the setting and query of the J0/J1/C2 bytes.
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Function and Feature Alarm and performance event Protection scheme

CXLL1 Provides rich alarms and performance events for easy management and maintenance of the equipment. Supports multiple protection modes such as two-fiber MSP protection ring, four-fiber MSP protection ring, linear MSP protection, and SNCP..
l l

Maintenance feature

Supports inloop and outloop for optical interfaces. Supports the warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services.

l l

SCC Unit
Table 9-38 lists the function and feature of the SCC unit of the CXLL1. Table 9-38 Function and feature of the SCC unit of the CXLL1 Function and Feature Basic function Specification of the optical interface CXLL1 Configures and monitors services, monitors the service performance, and collects performance events and alarm information.
l

Provides 10M/100M compatible Ethernet NMS interface, which is present on the AUC board. Provides one 10M/100M Ethernet interface, which is used for inter-board communication and is present on the AUX board. Provides one 10M Ethernet interface, which is used for communication between the active and standby SCC boards and is present on the AUX board. Provides the RS232 OAM interface that is present on the AUX board to connect to the PC or workstation. Supports the remote maintenance by using the RS232 DCE modem. Supports receiving the BIP-8 check for the overhead of the SCC unit, and provides the interface to query the check result.

Maintenance feature DCC processing capability

Supports the CF card, and supports the package loading function. The capacity is 512 MB and can be expanded to 1 GB. Processes 40-channel DCC.

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Function and Feature Fan alarm management PIU management Protection scheme

CXLL1 Manages fan alarms. Provides the in-service check function for the PIU board, and the failure check function for the lightning protection module of the PIU. Supports 1+1 hot backup for the SCC unit.

Cross-Connect Unit
Table 9-39 lists the function and feature of the cross-connect unit of the CXLL1. Table 9-39 Function and feature of the cross-connect unit of the CXLL1 Function and Feature Basic function CXLL1 Completes 15 Gbit/s non-blocking full cross-connection at the VC-4 level, and 5 Gbit/s non-blocking full cross-connection at the VC-12 or VC-3 level. Provides two 4M HDLC fast emergency channels, which are used for the MSP and SNCP protection switching.
l l l l

Fast emergency channel Service processing

Dynamically grooms services. Adds or deletes services without interrupting services. Supports the SNCP protection at the VC-3 and VC-12 levels. Supports VC--4-4c, VC-4-8c and VC-4-16c concatenation services.

Protection scheme

Supports the 1+1 hot backup (non-revertive) for the cross-connect unit.

Clock Unit
Table 9-40 lists the function and feature of the clock unit of the CXLL1. Table 9-40 Function and feature of the clock unit of the CXLL1 Function and Feature Basic function CXLL1 Provides standard system synchronization clock.

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Function and Feature Other function

CXLL1 Supports the extraction, insertion and management of the SSM and clock ID. Supports transmitting the DCC overhead information at a twochannel external clock interface.

Input and output

Inputs two-channel 2048 kHz or 2048 kbit/s timing signals, and selects the external timing source. Outputs two-channel 2048 Hz or 2048 kbit/s timing signals.

9.4.3 Working Principle and Signal Flow

The CXLL1 consists of the SDH overhead processing module, RST, MST and so on. Figure 9-19 shows the block diagram for the functions of the CXLL1.

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Figure 9-19 Block diagram for the functions of the CXLL1

38MHz OSC
Time & synchronizaton (SETS) T1 T2 T3 T4(Clock external output) T0 Line units Tributary units PIU AUX

SETG

Frame header T0 (reference clock)

Service units Service units

155MHz PLL

155 MHz 16x155 Mbit/s data

SDH overhead processing module

Cross-connect unit A high speed bus

high speed bus

STM-1

Another CXL unit

O/E

DEMUX

RST
STM-1 16x155 Mbit/s data

MST

MSA

HPT

O/E

MUX

XC Cross Connect (HPC)

high speed bus SCC unit Another connect unit

K1/K2 insertion/ extration

Performance report

Laser shut down

K1/K2 bytes

DCC

XC Cross Connect (LPC)

high speed bus Cross-connect unit B

Laser control

K1/K2 bytes process

DCC process

DCC

Line unit

ETH channels comunication

Other unit Another CXL

Communication and control module

Master and slaver board comunication

ETH interface OAM interface

AUX AUX

F&f interface

Power monitor

Phone interface S1-S4 interface

EOW

Boot ROM

FLASH

RAM

NVRAM

+3.3 V +5V +1.6V +1.8V +1.2V

DC/DC converter

Fuse

-48 V/-60V -48 V/-60V

DC/DC converter

The function modules are described as follows:

Synchronous Timing Unit

The synchronous timing unit provides system clock T0 to the service board, the control unit and the cross-connect unit in central timing distribution mode. This unit also selects one from 12 reference clock sources as the reference clock for synchronous timing. The 12 reference clock sources are from the line board (T1), the tributary board (T2), the external synchronous clock source (T3) and so on. The synchronous system clock source (T0) and 2 M external synchronous source (T4) are generated. The boards apply 1 + 1 hot backup. Therefore, both the active and the standby boards tracing the same reference source to ensure the identity between the system clocks of the active and the standby boards. The synchronous timing unit can extract timing from three types of timing signal:
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l l l

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Timing signal (T1) from STM-N Timing signal (T2) from PDH Reference signal (T3) from external synchronous clock source (2MHz or 2Mbit/s)

The clock module outputs:

l l

T0, system clock (38 MHz) T4, external timing (2 Mbit/s or 2 MHz) output by line

O/E Conversion Module

l l

In receive direction, it converts the received optical signals into electrical signals. In transmit direction, it converts the electrical signals into SDH optical signals, and then send optical signals to fibers for transmission. The SPI detects the R_LOS alarm and provides the laser shut down function.

MUX/DEMUX Module
l

In receive direction, the DEMUX part demultiplexes the high rate electrical signals into multiple parallel electrical signals, and recovery the clock signal at the same time. In transmit direction, the MUX part multiplexes the parallel electrical signals received from the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing Module

It includes RST, MST, MSA and HPT, provides inloop and outloop function.
l

RST

In receiving direction, performs frame alignment detection (A1, A2), regenerator section trace recovery (J0) and mismatch detection, BIP-8 errored block count. In transmitting direction, it performs frame alignment insertion, regenerator section path trace insertion, BIP-8 calculation and insertion. In receiving direction, performs BIP-24 errored block count, MS_REI recovery, MS_RDI and MS_AIS detection. In transmitting direction, it performs BIP-24 calculation and insertion, MS_REI, MS_RDI and MS_AIS insertion. Provides extraction or insertion of K1 byte and K2 byte. In receiving direction, performs AU4's pointer interpretation, LOP and AIS detection, pointer justification. In transmitting direction, it performs AUG assembly, AU-4 pointer regeneration, AU_AIS generation. OH termination J1 path trace message recovery REI information recovering
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MST

MSA

HPT

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HP_RDI detection (path status monitoring UNEQ and AIS detection (signal label monitoring) VC-4 BIP-8 errored block count

Communication and Control Module

l l l l l

Traces the clock signal from the active and the standby cross-connect unit. Implements laser controlling function. Selects the clock and frame header from the active or the standby cross-connect units. Controls the indicator on the board. CPU control unit, which controls and monitors other function modules. The unit also initializes other function modules after power on. ETH interface, which provides 10/ 100 Mbit/s Ethernet interface for network management. OAM interface, which provides serial port for network management. This port can be used as the MODEM port and thus can be configured as a serial port to connect to MODEM port in running state. COM interface for commissioning port Ethernet port for inter-board communication: 10 Mbit/s Ethernet port between the active and the standby CXLL unit. Supports receiving the BIP-8 check for the overhead of the SCC unit, and provides the interface to query the check result.

l l

l l

Cross-connect Module
The cross-connect module consists of two parts:
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SNCP module, which tests relative alarms and reports the alarm to software to trigger SNCP switching Higher and lower order cross-connect module, which performs the functions of higher and lower order cross-connect units. This module consists of higher order cross-connect unit and lower order cross-connect unit.

Figure 9-20 illustrates the block diagram of higher and lower order cross-connect modules.

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Figure 9-20 Block diagram of higher and lower order cross-connect modules
Time & synchronizaton (SETS) T1 T2 T3 T4(Clock external output) T0 Line units

38MHz OSC

Tributary units PIU AUX

SETG

Frame header T0 (reference clock)

Service units Service units

155MHz PLL

155 MHz 16x155 Mbit/s data

SDH overhead processing module

Cross-connect unit A high speed bus

high speed bus

STM-16

Another CXL unit

O/E

DEMUX

RST
16x155 Mbit/s data

MST

MSA

HPT

STM-16

O/E

MUX

XC Cross Connect (HPC)

high speed bus SCC unit Another connect unit

K1/K2 insertion/ extration

Performance report

Laser shut down

K1/K2 bytes

DCC

XC Cross Connect (LPC)

high speed bus

Cross-connec unit B

Laser control

K1/K2 bytes process

DCC process

DCC

Line unit

ETH channels comunication

Other unit

Communication and control module

Master and slaver board comunication

Another CXL

ETH interface OAM interface

AUX AUX

F&f interface

Power monitor

Phone interface S1-S4 interface

EOW

Boot ROM

FLASH

RAM

NVRAM

+3.3 V +5V +1.6V +1.8V +1.2V

DC/DC converter

Fuse

-48 V/-60V -48 V/-60V

DC/DC converter

The upper half part is the higher order cross-connect unit, which fully cross-connects 15 G higher order services with VC-4 as the minimum service grooming granularity. The lower half part is the lower order cross-connect unit, which cross-connects 5 G lower order services.

Other Functions
l

Responses to and processes k bytes

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9 Cross-Connect and System Control Boards

Collects performance data of the optical module and shuts output of the optical module Collects and processes DCC of each board Inserts the DCC back into each line board after processing Monitors the power supply of the board Resets the unit Cuts alarms

DC/DC Converter Module

This module provides the board with required DC voltages. It converts the 48/60 V power supply to the following voltages: +5V, +1.6V, +1.8V +1.2V and+3.3V.

CF Card
The CF card serves as the storage area of the database, system parameters, NE software package, logs and black box. The capacity is 512 MB and can be expanded to 1 GB.

9.4.4 Jumper and DIP Switch

On the CXL, there are a jumper and a DIP switch, which are used to set the input voltage and running state of the board.

CAUTION
Jumpers are used for test and maintenance. Do not change the setting of jumpers at random. Otherwise, the board may become faulty. Figure 9-21 shows the layout of the J7 jumper and DIP switch SW2 on the CXL board. Figure 9-21 Jumper and DIP switch of the CXL board
Power module

CPU

1 2 3 4

SW2

1 2 3

J7
CF card

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Table 9-41 lists the jumper on the CXL board. Table 9-41 Jumper on the CXL board Jumper J7 Function Enable the battery. Description 1-2: When jumpers 2 and 3 are capped, the battery is enabled.

Table 9-42 lists the DIP switch on the CXL board. Table 9-42 DIP switch on the CXL board DIP Switch SW2 Function Set the board running state Description On: indicates the binary value 1. The DIP switch adopts four bits, which are queued according to the switch numbering. The number 4 indicates the highest bit. For details, refer to Table 9-43.

Table 9-43 Description of the DIP switch SW2 Value 0b0000 0b0001 0b0011 0b0100 0b1011 0b1100 0b1101 0b1110 0b1111 Description Indicates the running state when the watchdog is started. It is the default state. Changes to the self-test state of the SDRAM Burst. Indicates the commissioning state. Indicates the running state when the watchdog is stopped. Erases the database. Erases the NE software, including the patch. Erases the database and NE software (including the patch). Erases the database, NE software and NE.ini file. Erases the extended BIOS and system parameter zone in the file system and FLASH memory.

9.4.5 Front Panel

On the front panel of the CXLL1 board, there are indicators, interfaces, barcode, functional button switch, laser safety class label, and CF card slot.
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Appearance of the Front Panel

Figure 9-22 shows the front panel of the CXLL1 board. Figure 9-22 Front panel the CXLL1 board
CXLL1
STAT ACTX ACTC PROG SRVX SRVL SYNC ALMC
CLASS 1 LASER PRODUCT

OUT IN
CF R/W RESET ALM CUT

CXLL1

Indicators
The following indicators are present on the front panel of the board:
l l

Board hardware state indicator (STAT), which is green or red when lit. Activating state indicator for the services at the cross-connect unit (ACTX), which is green when lit. Active/standby state indicator for the SCC units (ACTC), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Alarm indicator (SRVX) for services at the cross-connect unit, which is red, green or yellow when lit. Alarm indicator (SRVL) for services at the line units , which is red, green or yellow when lit. Synchronization clock state indicator (SYNC), which is red or green when lit. Alarm cutting indicator (ALMC), which is yellow when lit.

l l l

l l

For indication of these indicators, see A Equipment and Board Alarm Indicators.

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CF Card Read-Write Indicator (CF R/W)

State On (green) Flash (green) On (red) Description The CF card is in the read/write state of the system. The system is reading data from or writing data to the CF card. The CF card is off-line or is in the read/write prohibited state. The CF card is in the pluggable state. Flash (red) The system is processing the data after receiving the instruction for pre-processing data from the CF card.

Interfaces
On the front panel of the CXLL1, there are one optical interface and two switches. Table 9-44 lists the type and usage of the optical interface and switches on the CXLL1. Table 9-44 Optical interface and switches on the CXLL1 Interface IN OUT RESET ALM CUT Interface Type LC LC Warm reset switch Alarm cut switch Usage Receives optical signals. The pluggable optical module is used for easy maintenance. Transmits optical signals. The pluggable optical module is used for easy maintenance. Press the switch to reset the SCC unit. Press the switch to mute the alarm. Press the switch for three seconds to mute the alarm permanently. Press the switch again for three seconds to resume the alarm sound.

9.4.6 Valid Slots

The CXLL1 can be housed in any of slots 45 in the subrack.

9.4.7 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code of the CXLL1 indicates the optical interface type. Table 9-45 lists the relation between the board feature code and optical interface type of the CXLL1.

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Table 9-45 Relation between the board feature code and the optical interface type Board Barcode SSR1CXLL110 SSR1CXLL111 SSR1CXLL112 SSR1CXLL113 SSR1CXLL114 Feature Code 10 11 12 13 14 Optical Interface Type S-1.1 (LC) L-1.1 (LC) L-1.2 (LC) Ve-1.2 (LC) I-1 (LC)

9.4.8 Board Configuration Reference

The physical slot that houses the CXLL1 is different from the logical slot displayed on the T2000. You can use the T2000 to set parameters for the CXLL1.

Displayed Slot
The CXLL1 is housed in one slot in the subrack. The logical boards for the CXLL1 are the R1SLN, RCXL and GSCC. Table 9-46 lists the logical slots displayed on the T2000. Table 9-46 Logical slots displayed on the T2000 for the CXLL1 Board CXLL1 Logical Board R1SLN RCXL GSCC Logical Slot Slots 45 Slots 8081 Slots 8283

Board Parameters
l l l

J1 byte C2 byte Clock parameters

For details on the parameters, refer to F Board Configuration Reference.

9.4.9 Technical Specifications

The technical specifications for the CXLL1 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications

Table 9-47 lists the specifications for the optical interfaces of the CXLL1.
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Table 9-47 Specifications for the optical interfaces of the CXLL1 Item Nominal bit rate Line code Optical interface type Working wavelength (nm) Optical source type Mean launched optical power (dBm) Receiver sensitivity (dBm) Min. overload (dBm) Min. extinction ratio (dB) Specification 155520 kbit/s NRZ I-1 1260 to 1360 MLM, LED 15 to 8 S-1.1 1261 to 1360 MLM 15 to 8 L-1.1 1263 to 1360 MLM, SLM 5 to 0 L-1.2 1480 to 1580 SLM 5 to 0 Ve-1.2 1480 to 1580 SLM 3 to 0

23 8 8.2

28 8 8.2

34 10 10

34 10 10

34 10 10

Cross-Connect Capacity
The cross-connect capacity of the CXLL1 is as follows:
l l l

Higher order cross-connect capacity: 15 Gbit/s Lower order cross-connect capacity: 5 Gbit/s Access capacity: 10 Gbit/s

Clock Access Capability

The clock access capability of the CXLL1 is described as follows:
l l

External input clock: two channels, 2048 kbit/s or 2048 kHz External output clock: two channels, 2048 kbit/s or 2048 kHz

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications for the CXLL1 are as follows:
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l l

9 Cross-Connect and System Control Boards

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg):1.0kg

Power Consumption
At the normal temperature (25), the maximum power consumption for the CXLL1 is 50W.

9.5 CXLL4
This section describes the CXLL4, an integrated board of the SCC, cross-connect, clock and line units, in terms of the version, principle, function, principle, front panel and specifications. 9.5.1 Version Description The functional version of CXLL4 board is R1. 9.5.2 Function and Feature The CXLL4 is used to process SDH signals, control communication, groom services, and to input and output the clock. 9.5.3 Working Principle and Signal Flow The CXLL4 consists of the SDH overhead processing module, RST, MST and so on. 9.5.4 Jumper and DIP Switch On the CXL, there are a jumper and a DIP switch, which are used to set the input voltage and running state of the board. 9.5.5 Front Panel On the front panel of the CXLL4 board, there are indicators, interfaces, barcode, functional button switch, laser safety class label, and CF card slot. 9.5.6 Valid Slots The CXLL4 can be housed in any of slots 45 in the subrack. 9.5.7 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the CXLL4 indicates the optical interface type. 9.5.8 Board Configuration Reference The physical slot that houses the CXLL4 is different from the logical slot displayed on the T2000. You can use the T2000 to set parameters for the CXLL4. 9.5.9 Technical Specifications The technical specifications for the CXLL4 cover the optical interface specifications, board dimensions, weight and power consumption.

9.5.1 Version Description

The functional version of CXLL4 board is R1.

9.5.2 Function and Feature

The CXLL4 is used to process SDH signals, control communication, groom services, and to input and output the clock.
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SDH Processing Unit

Table 9-48 lists the function and feature of the SDH processing unit of the CXLL4. Table 9-48 Function and feature of the SDH processing unit of the CXLL4 Function and Feature Basic function Specification of the optical interface Specification of the optical module CXLL4 Transmits and receives 1 x STM-4 optical signals. Supports the optical interfaces of the I-4, S-4.1, L-4.1, L-4.2, and Ve-4.2 types.
l

Supports detection and query of the information on the optical module. Supports the function of setting the on/off state of the laser and the ALS function.

Service processing Overhead processing

Supports the processing of the VC-12, VC-3, VC-4 services and VC4-4c concatenation services..
l l

Supports the processing of the SOH bytes of the STM-4 signals. Supports the transparent transmission and termination of the POH bytes. Supports the setting and query of the J0/J1/C2 bytes.

Alarm and performance event Protection scheme

Provides rich alarms and performance events for easy management and maintenance of the equipment. Supports multiple protection modes such as two-fiber MSP protection ring, four-fiber MSP protection ring, linear MSP protection, and SNCP..
l l

Maintenance feature

Supports inloop and outloop for optical interfaces. Supports the warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services.

l l

SCC Unit
Table 9-49 lists the function and feature of the SCC unit of the CXLL4.

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Table 9-49 Function and feature of the SCC unit of the CXLL4 Function and Feature Basic function Specification of the optical interface CXLL4 Configures and monitors services, monitors the service performance, and collects performance events and alarm information.
l

Provides 10M/100M compatible Ethernet NMS interface, which is present on AUX. Provides one 10M/100M Ethernet interface, which is used for inter-board communication and present on AUX board. Provides one 10M Ethernet interface, which is used for communication between the active and standby SCC boards and present on AUX board. Provides the RS232 OAM interface that is present on the AUX board to connect to the PC or workstation. Supports the remote maintenance by using the RS232 DCE modem. Supports receiving the BIP-8 check for the overhead of the SCC unit, and provides the interface to query the check result.

Maintenance feature DCC processing capability Fan alarm management PIU management Protection scheme

Supports the CF card, and supports the package loading function. The capacity is 512 MB and can be expanded to 1 GB. Processes 40-channel DCC. Manages fan alarms. Provides the in-service check function for the PIU board, and the failure check function for the lightning protection module of the PIU. Supports 1+1 hot backup for the SCC unit.

Cross-Connect Unit
Table 9-50 lists the function and feature of the cross-connect unit of the CXLL4. Table 9-50 Function and feature of the cross-connect unit of the CXLL4 Function and Feature Basic function CXLL4 Completes 15 Gbit/s non-blocking full cross-connection at the VC-4 level, and 5 Gbit/s non-blocking full cross-connection at the VC-12 or VC-3 level. Provides two 4M HDLC fast emergency channels, which are used for the MSP and SNCP protection switching.

Fast emergency channel

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Function and Feature Service processing

CXLL4
l l l l l

Dynamically grooms services. Adds or deletes services without interrupting services. Supports the SNCP protection at the VC-3 and VC-12 levels. Supports a maximum of 1024 SNCP protection pairs. Supports VC-4-4c concatenation services.

Protection scheme

Supports the 1+1 hot backup (non-revertive) for the cross-connect unit.

Clock Unit
Table 9-51 lists the function and feature of the clock unit of the CXLL4. Table 9-51 Function and feature of the clock unit of the CXLL4 Function and Feature Basic function Other function CXLL4 Provides standard system synchronization clock. Supports the extraction, insertion and management of the SSM and clock ID. Supports transmitting the DCC overhead information at a twochannel external clock interface. Input and output
l

Inputs two-channel 2048 kHz or 2048 kbit/s timing signals, and selects the external timing source. Outputs two-channel 2048 Hz or 2048 kbit/s timing signals.

9.5.3 Working Principle and Signal Flow

The CXLL4 consists of the SDH overhead processing module, RST, MST and so on. Figure 9-23 shows the block diagram for the functions of the CXLL4.

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Figure 9-23 Block diagram for the functions of the CXLL4

38MHz OSC
Time & synchronizaton (SETS) T1 T2 T3 T4(Clock external output) T0 Line units Tributary units PIU AUX

SETG

Frame header T0 (reference clock)

Service units Service units

155MHz PLL

155 MHz 16x155 Mbit/s data

SDH overhead processing module

Cross-connect unit A high speed bus

high speed bus

STM-1

Another CXL unit

O/E

DEMUX

RST
STM-1 16x155 Mbit/s data

MST

MSA

HPT

O/E

MUX

XC Cross Connect (HPC)

high speed bus SCC unit Another connect unit

K1/K2 insertion/ extration

Performance report

Laser shut down

K1/K2 bytes

DCC

XC Cross Connect (LPC)

high speed bus Cross-connect unit B

Laser control

K1/K2 bytes process

DCC process

DCC

Line unit

ETH channels comunication

Other unit Another CXL

Communication and control module

Master and slaver board comunication

ETH interface OAM interface

AUX AUX

F&f interface

Power monitor

Phone interface S1-S4 interface

EOW

Boot ROM

FLASH

RAM

NVRAM

+3.3 V +5V +1.6V +1.8V +1.2V

DC/DC converter

Fuse

-48 V/-60V -48 V/-60V

DC/DC converter

The function modules are described as follows:

Synchronous Timing Unit

The synchronous timing unit provides system clock T0 to the service board, the control unit and the cross-connect unit in central timing distribution mode. This unit also selects one from 12 reference clock sources as the reference clock for synchronous timing. The 12 reference clock sources are from the line board (T1), the tributary board (T2), the external synchronous clock source (T3) and so on. The synchronous system clock source (T0) and 2 M external synchronous source (T4) are generated. The boards apply 1 + 1 hot backup. Therefore, both the active and the standby boards tracing the same reference source to ensure the identity between the system clocks of the active and the standby boards. The synchronous timing unit can extract timing from three types of timing signal:
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l l l

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Timing signal (T1) from STM-N Timing signal (T2) from PDH Reference signal (T3) from external synchronous clock source (2MHz or 2Mbit/s)

The clock module outputs:

l l

T0, system clock (38 MHz) T4, external timing (2 Mbit/s or 2 MHz) output by line

O/E Conversion Module

l l

In receive direction, it converts the received optical signals into electrical signals. In transmit direction, it converts the electrical signals into SDH optical signals, and then send optical signals to fibers for transmission. The SPI detects the R_LOS alarm and provides the laser shut down function.

MUX/DEMUX Module
l

In receive direction, the DEMUX part demultiplexes the high rate electrical signals into multiple parallel electrical signals, and recovery the clock signal at the same time. In transmit direction, the MUX part multiplexes the parallel electrical signals received from the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing Module

It includes RST, MST, MSA and HPT, provides inloop and outloop function.
l

RST

In receiving direction, performs frame alignment detection (A1, A2), regenerator section trace recovery (J0) and mismatch detection, BIP-8 errored block count. In transmitting direction, it performs frame alignment insertion, regenerator section path trace insertion, BIP-8 calculation and insertion. In receiving direction, performs BIP-24 errored block count, MS_REI recovery, MS_RDI and MS_AIS detection. In transmitting direction, it performs BIP-24 calculation and insertion, MS_REI, MS_RDI and MS_AIS insertion. Provides extraction or insertion of K1 byte and K2 byte. In receiving direction, performs AU4's pointer interpretation, LOP and AIS detection, pointer justification. In transmitting direction, it performs AUG assembly, AU-4 pointer regeneration, AU_AIS generation. OH termination J1 path trace message recovery REI information recovering
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MST

MSA

HPT

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HP_RDI detection (path status monitoring UNEQ and AIS detection (signal label monitoring) VC-4 BIP-8 errored block count

Communication and Control Module

l l l l l

Traces the clock signal from the active and the standby cross-connect unit. Implements laser controlling function. Selects the clock and frame header from the active or the standby cross-connect units. Controls the indicator on the board. CPU control unit, which controls and monitors other function modules. The unit also initializes other function modules after power on. ETH interface, which provides 10/ 100 Mbit/s Ethernet interface for network management. OAM interface, which provides serial port for network management. This port can be used as the MODEM port and thus can be configured as a serial port to connect to MODEM port in running state. COM interface for commissioning port Ethernet port for inter-board communication: 10 Mbit/s Ethernet port between the active and the standby CXLL unit. Supports receiving the BIP-8 check for the overhead of the SCC unit, and provides the interface to query the check result.

l l

l l

Cross-connect Module
The cross-connect module consists of two parts:
l

SNCP module, which tests relative alarms and reports the alarm to software to trigger SNCP switching Higher and lower order cross-connect module, which performs the functions of higher and lower order cross-connect units. This module consists of higher order cross-connect unit and lower order cross-connect unit.

Figure 9-24 illustrates the block diagram of higher and lower order cross-connect modules.

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Figure 9-24 Block diagram of higher and lower order cross-connect modules
Time & synchronizaton (SETS) T1 T2 T3 T4(Clock external output) T0 Line units

38MHz OSC

Tributary units PIU AUX

SETG

Frame header T0 (reference clock)

Service units Service units

155MHz PLL

155 MHz 16x155 Mbit/s data

SDH overhead processing module

Cross-connect unit A high speed bus

high speed bus

STM-16

Another CXL unit

O/E

DEMUX

RST
16x155 Mbit/s data

MST

MSA

HPT

STM-16

O/E

MUX

XC Cross Connect (HPC)

high speed bus SCC unit Another connect unit

K1/K2 insertion/ extration

Performance report

Laser shut down

K1/K2 bytes

DCC

XC Cross Connect (LPC)

high speed bus

Cross-connec unit B

Laser control

K1/K2 bytes process

DCC process

DCC

Line unit

ETH channels comunication

Other unit

Communication and control module

Master and slaver board comunication

Another CXL

ETH interface OAM interface

AUX AUX

F&f interface

Power monitor

Phone interface S1-S4 interface

EOW

Boot ROM

FLASH

RAM

NVRAM

+3.3 V +5V +1.6V +1.8V +1.2V

DC/DC converter

Fuse

-48 V/-60V -48 V/-60V

DC/DC converter

The upper half part is the higher order cross-connect unit, which fully cross-connects 15 G higher order services with VC-4 as the minimum service grooming granularity. The lower half part is the lower order cross-connect unit, which cross-connects 5 G lower order services.

Other Functions
l

Responses to and processes k bytes

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9 Cross-Connect and System Control Boards

Collects performance data of the optical module and shuts output of the optical module Collects and processes DCC of each board Inserts the DCC back into each line board after processing Monitors the power supply of the board Resets the unit Cuts alarms

DC/DC Converter Module

This module provides the board with required DC voltages. It converts the 48/60 V power supply to the following voltages: +5V, +1.6V, +1.8V +1.2V and+3.3V.

CF Card
The CF card serves as the storage area of the database, system parameters, NE software package, logs and black box. The capacity is 512 MB and can be expanded to 1 GB.

9.5.4 Jumper and DIP Switch

On the CXL, there are a jumper and a DIP switch, which are used to set the input voltage and running state of the board.

CAUTION
Jumpers are used for test and maintenance. Do not change the setting of jumpers at random. Otherwise, the board may become faulty. Figure 9-25 shows the layout of the J7 jumper and DIP switch SW2 on the CXL board. Figure 9-25 Jumper and DIP switch of the CXL board
Power module

CPU

1 2 3 4

SW2

1 2 3

J7
CF card

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Table 9-52 lists the jumper on the CXL board. Table 9-52 Jumper on the CXL board Jumper J7 Function Enable the battery. Description 1-2: When jumpers 2 and 3 are capped, the battery is enabled.

Table 9-53 lists the DIP switch on the CXL board. Table 9-53 DIP switch on the CXL board DIP Switch SW2 Function Set the board running state. Description On: indicates the binary value 1. The DIP switch adopts four bits, which are queued according to the switch numbering. The number 4 indicates the highest bit. For details, refer to Table 9-54.

Table 9-54 Description of DIP switch SW2 Value 0b0000 0b0001 0b0011 0b0100 0b1011 0b1100 0b1101 0b1110 0b1111 Description Indicates the running state when the watchdog is started. It is the default state. Changes to the self-test state of the SDRAM Burst. Indicates the commissioning state. Indicates the running state when the watchdog is stopped. Erases the database. Erases the NE software, including the patch. Erases the database and NE software (including the patch). Erases the database, NE software and NE.ini file. Erases the extended BIOS and system parameter zone in the file system and FLASH memory.

9.5.5 Front Panel

On the front panel of the CXLL4 board, there are indicators, interfaces, barcode, functional button switch, laser safety class label, and CF card slot.
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Appearance of the Front Panel

Figure 9-26 shows the front panel of the CXLL4 board. Figure 9-26 Front panel the CXLL4 board
CXLL4
STAT ACTX ACTC PROG SRVX SRVL SYNC ALMC
CLASS 1 LASER PRODUCT

OUT IN
CF R/W RESET ALM CUT

CXLL4

Indicators
The following indicators are present on the front panel of the board:
l l

Board hardware state indicator (STAT), which is green or red when lit. Activating state indicator for the services at the cross-connect unit (ACTX), which is green when lit. Active/standby state indicator for the SCC units (ACTC), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Alarm indicator (SRVX) for services at the cross-connect unit, which is red, green or yellow when lit. Alarm indicator (SRVL) for services at the line units , which is red, green or yellow when lit. Synchronization clock state indicator (SYNC), which is red or green when lit. Alarm cutting indicator (ALMC), which is yellow when lit.

l l l

l l

For indication of these indicators, see A Equipment and Board Alarm Indicators.

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CF Card Read-Write Indicator (CF R/W)

State On (green) Flash (green) On (red) Description The CF card is in the read/write state of the system. The system is reading data from or writing data to the CF card. The CF card is off-line or is in the read/write prohibited state. The CF card is in the pluggable state. Flash (red) The system is processing the data after receiving the instruction for pre-processing data from the CF card.

Interfaces
On the front panel of the CXLL4, there are one optical interface and two switches. Table 9-55 lists the type and usage of the optical interface and switches on the CXLL4. Table 9-55 Optical interface and switches on the CXLL4 Interface IN OUT RESET ALM CUT Interface Type LC LC Warm reset switch Alarm cut switch Usage Receives optical signals. The pluggable optical module is used for easy maintenance. Transmits optical signals. The pluggable optical module is used for easy maintenance. Press the switch to reset the SCC unit. Press the switch to mute the alarm. Press the switch for three seconds to mute the alarm permanently. Press the switch again for three seconds to resume the alarm sound.

9.5.6 Valid Slots

The CXLL4 can be housed in any of slots 45 in the subrack.

9.5.7 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code of the CXLL4 indicates the optical interface type. Table 9-56 lists the relation between the board feature code and optical interface type of the CXLL4.

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Table 9-56 Relation between the board feature code and the optical interface type Board Barcode SSR1CXLL410 SSR1CXLL411 SSR1CXLL412 SSR1CXLL413 SSR1CXLL414 Feature Code 10 11 12 13 14 Optical Interface Type S-4.1 (LC) L-4.1 (LC) L-4.2 (LC) Ve-4.2 (LC) I-4 (LC)

9.5.8 Board Configuration Reference

The physical slot that houses the CXLL4 is different from the logical slot displayed on the T2000. You can use the T2000 to set parameters for the CXLL4.

Displayed Slot
The CXLL4 is housed in one slot in the subrack. The logical boards for the CXLL4 are the R1SLN, RCXL and GSCC. Table 9-57 lists the logical slots displayed on the T2000. Table 9-57 Logical slots displayed on the T2000 for the CXLL4 Board CXLL4 Logical Board R1SLN RCXL GSCC Logical Slot Slots 45 Slots 8081 Slots 8283

Board Parameters
l l l

J1 byte C2 byte Clock parameters

For details on the parameters, refer to F Board Configuration Reference.

9.5.9 Technical Specifications

The technical specifications for the CXLL4 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications

Table 9-58 lists the specifications for the optical interfaces of the CXLL4.
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Table 9-58 Specifications for the optical interfaces of the CXLL4 Item Nominal bit rate Line code Optical interface type Working wavelength (nm) Optical source type Mean launched optical power (dBm) Receiver sensitivity (dBm) Min. overload (dBm) Min. extinction ratio (dB) Specification 622080 kbit/s NRZ I-4 1260 to 1360 MLM 15 to 8 S-4.1 1274 to 1356 MLM 15 to 8 L-4.1 1280 to 1335 SLM 3 to 2 L-4.2 1480 to 1580 SLM 3 to 2 Ve-4.2 1480 to 1580 SLM 3 to 2

23 8 8.2

28 8 8.2

28 18 10

28 8 10

34 13 10.5

Cross-Connect Capacity
The cross-connect capacity of the CXLL4 is as follows:
l l l

Higher order cross-connect capacity: 15 Gbit/s Lower order cross-connect capacity: 5 Gbit/s Access capacity: 10 Gbit/s

Clock Access Capability

The clock access capability of the CXLL4 is described as follows:
l l

External input clock: two channels, 2048 kbit/s or 2048 kHz External output clock: two channels, 2048 kbit/s or 2048 kHz

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications for the CXLL4 are as follows:
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9 Cross-Connect and System Control Boards

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg):1.0kg

Power Consumption
At the normal temperature (25), the maximum power consumption for the CXLL4 is 50W.

9.6 CXLL16
This section describes the CXLL16, an integrated board of the SCC, cross-connect, clock and line units, in terms of the version, principle, function, principle, front panel and specifications. 9.6.1 Version Description The functional version of CXLL16 board is R1. 9.6.2 Function and Feature The CXLL16 is used to process SDH signals, control communication, groom services, and to input and output the clock. 9.6.3 Working Principle and Signal Flow The CXLL16 consists of the SDH overhead processing module, RST, MST and so on. 9.6.4 Jumper and DIP Switch On the CXL, there are a jumper and a DIP switch, which are used to set the input voltage and running state of the board. 9.6.5 Front Panel On the front panel of the CXLL16 board, there are indicators, interfaces, barcode, functional button switch, laser safety class label, and CF card slot. 9.6.6 Valid Slots The CXLL16 can be housed in any of slots 45 in the subrack. 9.6.7 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the CXLL16 indicates the optical interface type. 9.6.8 Board Configuration Reference The physical slot that houses the CXLL16 is different from the logical slot displayed on the T2000. You can use the T2000 to set parameters for the CXLL16. 9.6.9 Technical Specifications The technical specifications for the CXLL16 cover the optical interface specifications, board dimensions, weight and power consumption.

9.6.1 Version Description

The functional version of CXLL16 board is R1.

9.6.2 Function and Feature

The CXLL16 is used to process SDH signals, control communication, groom services, and to input and output the clock.
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SDH Processing Unit

Table 9-59 lists the function and feature of the SDH processing unit of the CXLL16. Table 9-59 Function and feature of the SDH processing unit of the CXLL16 Function and Feature Basic function Specification of the optical interface Specification of the optical module CXLL16 Transmits and receives 1 x STM-16 optical signals. Supports the optical interfaces of the I-16, S-16.1, L-16.1 and L-16.2 types.
l

Supports detection and query of the information on the optical module. Supports the function of setting the on/off state of the laser and the ALS function.

Service processing Overhead processing

Supports the processing of the VC-12, VC-3, VC-4 services, and VC-4-4c, VC-4-8c, VC-4-16c concatenation services.
l l

Supports the processing of the SOH bytes of the STM-16 signals. Supports the transparent transmission and termination of the POH bytes. Supports the setting and query of the J0/J1/C2 bytes.

Alarm and performance event Protection scheme

Provides rich alarms and performance events for easy management and maintenance of the equipment. Supports multiple protection modes such as two-fiber MSP protection ring, four-fiber MSP protection ring, linear MSP protection, and SNCP..
l l

Maintenance feature

Supports inloop and outloop for optical interfaces. Supports the warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services.

l l

SCC Unit
Table 9-60 lists the function and feature of the SCC unit of the CXLL16.

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Table 9-60 Function and feature of the SCC unit of the CXLL16 Function and Feature Basic function Specification of the optical interface CXLL16 Configures and monitors services, monitors the service performance, and collects performance events and alarm information.
l

Provides 10M/100M compatible Ethernet NMS interface, which is present on the AUX board. Provides one 10M/100M Ethernet interface, which is used for inter-board communication and is present on the AUX board. Provides one 10M Ethernet interface, which is used for communication between the active and standby SCC boards and is present on the AUX board. Provides the RS232 OAM interface that is present on the auxiliary interface board to connect to the PC or workstation. Supports the remote maintenance by using the RS232 DCE modem. Supports receiving the BIP-8 check for the overhead of the SCC unit, and provides the interface to query the check result.

Maintenance feature DCC processing capability Fan alarm management PIU management Protection scheme

Supports the CF card, and supports the package loading function. The capacity is 512 MB and can be expanded to 1 GB. Processes 40-channel DCC. Manages fan alarms. Provides the in-service check function for the PIU board, and the failure check function for the lightning protection module of the PIU. Supports 1+1 hot backup for the SCC unit.

Cross-Connect Unit
Table 9-61 lists the function and feature of the cross-connect unit of the CXLL16. Table 9-61 Function and feature of the cross-connect unit of the CXLL16 Function and Feature Basic function CXLL16 Completes 15 Gbit/s non-blocking full cross-connection at the VC-4 level, and 5 Gbit/s non-blocking full cross-connection at the VC-12 or VC-3 level. Provides two 4M HDLC fast emergency channels, which are used for the MSP and SNCP protection switching.

Fast emergency channel

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Function and Feature Service processing

CXLL16
l l l l l

Dynamically grooms services. Adds or deletes services without interrupting services. Supports the SNCP protection at the VC-3 and VC-12 levels. Supports a maximum of 1024 SNCP protection pairs. Supports VC-4-4c, VC-4-8c and VC-4-16c services.

Protection scheme

Supports the 1+1 hot backup (non-revertive) for the cross-connect unit.

Clock Unit
Table 9-62 lists the function and feature of the clock unit of the CXLL16. Table 9-62 Function and feature of the clock unit of the CXLL16 Function and Feature Basic function Other function CXLL16 Provides standard system synchronization clock. Supports the extraction, insertion and management of the SSM and clock ID. Supports transmitting the DCC overhead information at a twochannel external clock interface. Input and output
l

Inputs two-channel 2048 kHz or 2048 kbit/s timing signals, and selects the external timing source. Outputs two-channel 2048 Hz or 2048 kbit/s timing signals.

9.6.3 Working Principle and Signal Flow

The CXLL16 consists of the SDH overhead processing module, RST, MST and so on. Figure 9-27 shows the block diagram for the functions of the CXLL16.

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Figure 9-27 Block diagram for the functions of the CXLL16

38MHz OSC
Time & synchronizaton (SETS) T1 T2 T3 T4(Clock external output) T0 Line units Tributary units PIU AUX

SETG

Frame header T0 (reference clock)

Service units Service units

155MHz PLL

155 MHz 16x155 Mbit/s data

SDH overhead processing module

Cross-connect unit A high speed bus

high speed bus

STM-1

Another CXL unit

O/E

DEMUX

RST
STM-1 16x155 Mbit/s data

MST

MSA

HPT

O/E

MUX

XC Cross Connect (HPC)

high speed bus SCC unit Another connect unit

K1/K2 insertion/ extration

Performance report

Laser shut down

K1/K2 bytes

DCC

XC Cross Connect (LPC)

high speed bus Cross-connect unit B

Laser control

K1/K2 bytes process

DCC process

DCC

Line unit

ETH channels comunication

Other unit Another CXL

Communication and control module

Master and slaver board comunication

ETH interface OAM interface

AUX AUX

F&f interface

Power monitor

Phone interface S1-S4 interface

EOW

Boot ROM

FLASH

RAM

NVRAM

+3.3 V +5V +1.6V +1.8V +1.2V

DC/DC converter

Fuse

-48 V/-60V -48 V/-60V

DC/DC converter

The function modules are described as follows:

Synchronous Timing Unit

The synchronous timing unit provides system clock T0 to the service board, the control unit and the cross-connect unit in central timing distribution mode. This unit also selects one from 12 reference clock sources as the reference clock for synchronous timing. The 12 reference clock sources are from the line board (T1), the tributary board (T2), the external synchronous clock source (T3) and so on. The synchronous system clock source (T0) and 2 M external synchronous source (T4) are generated. The boards apply 1 + 1 hot backup. Therefore, both the active and the standby boards tracing the same reference source to ensure the identity between the system clocks of the active and the standby boards. The synchronous timing unit can extract timing from three types of timing signal:
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Timing signal (T1) from STM-N Timing signal (T2) from PDH Reference signal (T3) from external synchronous clock source (2MHz or 2Mbit/s)

The clock module outputs:

l l

T0, system clock (38 MHz) T4, external timing (2 Mbit/s or 2 MHz) output by line

O/E Conversion Module

l l

In receive direction, it converts the received optical signals into electrical signals. In transmit direction, it converts the electrical signals into SDH optical signals, and then send optical signals to fibers for transmission. The SPI detects the R_LOS alarm and provides the laser shut down function.

MUX/DEMUX Module
l

In receive direction, the DEMUX part demultiplexes the high rate electrical signals into multiple parallel electrical signals, and recovery the clock signal at the same time. In transmit direction, the MUX part multiplexes the parallel electrical signals received from the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing Module

It includes RST, MST, MSA and HPT, provides inloop and outloop function.
l

RST

In receiving direction, performs frame alignment detection (A1, A2), regenerator section trace recovery (J0) and mismatch detection, BIP-8 errored block count. In transmitting direction, it performs frame alignment insertion, regenerator section path trace insertion, BIP-8 calculation and insertion. In receiving direction, performs BIP-24 errored block count, MS_REI recovery, MS_RDI and MS_AIS detection. In transmitting direction, it performs BIP-24 calculation and insertion, MS_REI, MS_RDI and MS_AIS insertion. Provides extraction or insertion of K1 byte and K2 byte. In receiving direction, performs AU4's pointer interpretation, LOP and AIS detection, pointer justification. In transmitting direction, it performs AUG assembly, AU-4 pointer regeneration, AU_AIS generation. OH termination J1 path trace message recovery REI information recovering
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MST

MSA

HPT

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HP_RDI detection (path status monitoring UNEQ and AIS detection (signal label monitoring) VC-4 BIP-8 errored block count

Communication and Control Module

l l l l l

Traces the clock signal from the active and the standby cross-connect unit. Implements laser controlling function. Selects the clock and frame header from the active or the standby cross-connect units. Controls the indicator on the board. CPU control unit, which controls and monitors other function modules. The unit also initializes other function modules after power on. ETH interface, which provides 10/ 100 Mbit/s Ethernet interface for network management. OAM interface, which provides serial port for network management. This port can be used as the MODEM port and thus can be configured as a serial port to connect to MODEM port in running state. COM interface for commissioning port Ethernet port for inter-board communication: 10 Mbit/s Ethernet port between the active and the standby CXLL unit. Supports receiving the BIP-8 check for the overhead of the SCC unit, and provides the interface to query the check result.

l l

l l

Cross-connect Module
The cross-connect module consists of two parts:
l

SNCP module, which tests relative alarms and reports the alarm to software to trigger SNCP switching Higher and lower order cross-connect module, which performs the functions of higher and lower order cross-connect units. This module consists of higher order cross-connect unit and lower order cross-connect unit.

Figure 9-28 illustrates the block diagram of higher and lower order cross-connect modules.

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Figure 9-28 Block diagram of higher and lower order cross-connect modules
Time & synchronizaton (SETS) T1 T2 T3 T4(Clock external output) T0 Line units

38MHz OSC

Tributary units PIU AUX

SETG

Frame header T0 (reference clock)

Service units Service units

155MHz PLL

155 MHz 16x155 Mbit/s data

SDH overhead processing module

Cross-connect unit A high speed bus

high speed bus

STM-16

Another CXL unit

O/E

DEMUX

RST
16x155 Mbit/s data

MST

MSA

HPT

STM-16

O/E

MUX

XC Cross Connect (HPC)

high speed bus SCC unit Another connect unit

K1/K2 insertion/ extration

Performance report

Laser shut down

K1/K2 bytes

DCC

XC Cross Connect (LPC)

high speed bus

Cross-connec unit B

Laser control

K1/K2 bytes process

DCC process

DCC

Line unit

ETH channels comunication

Other unit

Communication and control module

Master and slaver board comunication

Another CXL

ETH interface OAM interface

AUX AUX

F&f interface

Power monitor

Phone interface S1-S4 interface

EOW

Boot ROM

FLASH

RAM

NVRAM

+3.3 V +5V +1.6V +1.8V +1.2V

DC/DC converter

Fuse

-48 V/-60V -48 V/-60V

DC/DC converter

The upper half part is the higher order cross-connect unit, which fully cross-connects 15 G higher order services with VC-4 as the minimum service grooming granularity. The lower half part is the lower order cross-connect unit, which cross-connects 5 G lower order services.

Other Functions
l

Responses to and processes k bytes

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Collects performance data of the optical module and shuts output of the optical module Collects and processes DCC of each board Inserts the DCC back into each line board after processing Monitors the power supply of the board Resets the unit Cuts alarms

DC/DC Converter Module

This module provides the board with required DC voltages. It converts the 48/60 V power supply to the following voltages: +5V, +1.6V, +1.8V +1.2V and+3.3V.

CF Card
The CF card serves as the storage area of the database, system parameters, NE software package, logs and black box. The capacity is 512 MB and can be expanded to 1 GB.

9.6.4 Jumper and DIP Switch

On the CXL, there are a jumper and a DIP switch, which are used to set the input voltage and running state of the board.

CAUTION
Jumpers are used for test and maintenance. Do not change the setting of jumpers at random. Otherwise, the board may become faulty. Figure 9-29 shows the layout of the J7 jumper and DIP switch SW2 on the CXL board. Figure 9-29 Jumper and DIP switch of the CXL board
Power module

CPU

1 2 3 4

SW2

1 2 3

J7
CF card

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Table 9-63 lists the jumper on the CXL board. Table 9-63 Jumper on the CXL board Jumper J7 Function Enable the battery. Description 1-2: When jumpers 2 and 3 are capped, the battery is enabled.

Table 9-64 lists the DIP switch on the CXL board. Table 9-64 DIP switch on the CXL board DIP Switch SW2 Function Set the board running state. Description On: indicates the binary value 1. The DIP switch adopts four bits, which are queued according to the switch numbering. The number 4 indicates the highest bit. For details, refer toTable 9-65.

Table 9-65 Description of the DIP switch SW2 Value 0b0000 0b0001 0b0011 0b0100 0b1011 0b1100 0b1101 0b1110 0b1111 Description Indicates the running state when the watchdog is started. It is the default state. Changes to the self-test state of the SDRAM Burst. Indicates the commissioning state. Indicates the running state when the watchdog is stopped. Erases the database. Erases the NE software, including the patch. Erases the database and NE software (including the patch). Erases the database, NE software and NE.ini file. Erases the extended BIOS and system parameter zone in the file system and FLASH memory.

9.6.5 Front Panel

On the front panel of the CXLL16 board, there are indicators, interfaces, barcode, functional button switch, laser safety class label, and CF card slot.
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Appearance of the Front Panel

Figure 9-30 shows the front panel of the CXLL16 board. Figure 9-30 Front panel the CXLL16 board
CXLL16
STAT ACTX ACTC PROG SRVX SRVL SYNC ALMC
CLASS 1 LASER PRODUCT

OUT IN
CF R/W RESET ALM CUT

CXLL16

Indicators
The following indicators are present on the front panel of the board:
l l

Board hardware state indicator (STAT), which is green or red when lit. Activating state indicator for the services at the cross-connect unit (ACTX), which is green when lit. Active/standby state indicator for the SCC units (ACTC), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Alarm indicator (SRVX) for services at the cross-connect unit, which is red, green or yellow when lit. Alarm indicator (SRVL) for services at the line units , which is red, green or yellow when lit. Synchronization clock state indicator (SYNC), which is red or green when lit. Alarm cutting indicator (ALMC), which is yellow when lit.

l l l

l l

For indication of these indicators, see A Equipment and Board Alarm Indicators.

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CF Card Read-Write Indicator (CF R/W)

State On (green) Flash (green) On (red) Description The CF card is in the read/write state of the system. The system is reading data from or writing data to the CF card. The CF card is off-line or is in the read/write prohibited state. The CF card is in the pluggable state. Flash (red) The system is processing the data after receiving the instruction for pre-processing data from the CF card.

Interfaces
On the front panel of the CXLL16, there are one optical interface and two switches. Table 9-66 lists the type and usage of the optical interface and switches on the CXLL16. Table 9-66 Optical interface and switches on the CXLL16 Interface IN OUT RESET ALM CUT Interface Type LC LC Warm reset switch Alarm cut switch Usage Receives optical signals. The pluggable optical module is used for easy maintenance. Transmits optical signals. The pluggable optical module is used for easy maintenance. Press the switch to reset the SCC unit. Press the switch to mute the alarm. Press the switch for three seconds to mute the alarm permanently. Press the switch again for three seconds to resume the alarm sound.

9.6.6 Valid Slots

The CXLL16 can be housed in any of slots 45 in the subrack.

9.6.7 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code of the CXLL16 indicates the optical interface type. Table 9-67 lists the relation between the board feature code and optical interface type of the CXLL16.

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Table 9-67 Relation between the board feature code and the optical interface type Board Barcode SSR1CXLL1601 SSR1CXLL1602 SSR1CXLL1603 SSR1CXLL1604 Feature Code 01 02 03 04 Optical Interface Type I-16 (LC) S-16.1 (LC) S-16.2(LC) L-16.2 (LC)

9.6.8 Board Configuration Reference

The physical slot that houses the CXLL16 is different from the logical slot displayed on the T2000. You can use the T2000 to set parameters for the CXLL16.

Displayed Slot
The CXLL16 is housed in one slot in the subrack. The logical boards for the CXLL16 are the R1SLN, RCXL and GSCC. Table 9-68 lists the logical slots displayed on the T2000. Table 9-68 Logical slots displayed on the T2000 for the CXLL16 Board CXLL16 Logical Board R1SLN RCXL GSCC Logical Slot Slots 45 Slots 8081 Slots 8283

Board Parameters
l l l

J1 byte C2 byte Clock parameters

For details on the parameters, refer to F Board Configuration Reference.

9.6.9 Technical Specifications

The technical specifications for the CXLL16 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications

Table 9-69 lists the specifications for the optical interfaces of the CXLL16.
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Table 9-69 Specifications for the optical interfaces of the CXLL16 Item Nominal bit rate Line code Optical interface type Working wavelength (nm) Optical source type Mean launched optical power (dBm) Receiver sensitivity (dBm) Min. overload (dBm) Min. extinction ratio (dB) Specification 2488320 kbit/s NRZ I-16 1266 to 1360 MLM 10 to 3 18 3 8.2 S-16.1 1260 to 1360 SLM 5 to 0 18 0 8.2 L-16.1 1280 to 1335 SLM 2 to 3 27 9 8.2 L-16.2 1500 to 1580 SLM 2 to 3 28 9 8.2

Cross-Connect Capacity
The cross-connect capacity of the CXLL16 is as follows:
l l l

Higher order cross-connect capacity: 15 Gbit/s Lower order cross-connect capacity: 5 Gbit/s Access capacity: 10 Gbit/s

Clock Access Capability

The clock access capability of the CXLL16 is described as follows:
l l

External input clock: two channels, 2048 kbit/s or 2048 kHz External output clock: two channels, 2048 kbit/s or 2048 kHz

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specification for the CXLL16 is as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 1.0
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Power Consumption
At the normal temperature (25), the maximum power consumption for the CXLL4 is 50W.

9.7 CXLD1
This section describes the CXLD1, an integrated board of the SCC, cross-connect, clock and line units, in terms of the version, principle, function, principle, front panel and specifications. 9.7.1 Version Description The functional version of CXLD1 board is R1. 9.7.2 Function and Feature The CXLD1 is used to process SDH signals, control communication, groom services, and to input and output the clock. 9.7.3 Working Principle and Signal Flow The CXLD1 consists of the SDH overhead processing module, RST, MST and so on. 9.7.4 Jumper and DIP Switch On the CXL, there are a jumper and a DIP switch, which are used to set the input voltage and running state of the board. 9.7.5 Front Panel On the front panel of the CXLD1 board, there are indicators, interfaces, barcode, functional button switch, laser safety class label, and CF card slot. 9.7.6 Valid Slots The CXLD1 can be housed in any of slots 45 in the subrack. 9.7.7 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the CXLD1 indicates the optical interface type. 9.7.8 Board Configuration Reference The physical slot that houses the CXLD1 is different from the logical slot displayed on the T2000. You can use the T2000 to set parameters for the CXLD1. 9.7.9 Technical Specifications The technical specifications for the CXLD1 cover the optical interface specifications, board dimensions, weight and power consumption.

9.7.1 Version Description

The functional version of CXLD1 board is R1.

9.7.2 Function and Feature

The CXLD1 is used to process SDH signals, control communication, groom services, and to input and output the clock.

SDH Processing Unit

Table 9-70 lists the function and feature of the SDH processing unit of the CXLD1.
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Table 9-70 Function and feature of the SDH processing unit of the CXLD1 Function and Feature Basic function Specification of the optical interface Specification of the optical module CXLD1 Transmits and receives 2 x STM-1 optical signals. Supports the optical interfaces of the I-1, S-1.1, L-1.1, L-1.2, and Ve-1.2 types.
l

Supports detection and query of the information on the optical module. Supports the function of setting the on/off state of the laser and the ALS function.

Service processing Overhead processing

Supports the processing of the VC-12, VC-3 and VC-4 services.

l l

Supports the processing of the SOH bytes of the STM-1 signals. Supports the transparent transmission and termination of the POH bytes. Supports the setting and query of the J0/J1/C2 bytes.

Alarm and performance event Protection scheme

Provides rich alarms and performance events for easy management and maintenance of the equipment. Supports multiple protection modes such as two-fiber MSP protection ring, four-fiber MSP protection ring, linear MSP protection, and SNCP..
l l

Maintenance feature

Supports inloop and outloop for optical interfaces. Supports the warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services.

l l

SCC Unit
Table 9-71 lists the function and feature of the SCC unit of the CXLD1. Table 9-71 Function and feature of the SCC unit of the CXLD1 Function and Feature Basic function CXLD1 Configures and monitors services, monitors the service performance, and collects performance events and alarm information.

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Function and Feature Specification of the optical interface

CXLD1
l

Provides 10M/100M compatible Ethernet NMS interface, which is present on the AUX board. Provides one 10M/100M Ethernet interface, which is used for inter-board communication and is present on the AUX board. Provides one 10M Ethernet interface, which is used for communication between the active and standby SCC boards and is present on the AUX board. Provides the RS232 OAM interface that is present on the auxiliary interface board to connect to the PC or workstation. Supports the remote maintenance by using the RS232 DCE modem. Supports receiving the BIP-8 check for the overhead of the SCC unit, and provides the interface to query the check result.

Maintenance feature DCC processing capability Fan alarm management PIU management Protection scheme

Supports the CF card, and supports the package loading function. The capacity is 512 MB and can be expanded to 1 GB. Processes 40-channel DCC. Manages fan alarms. Provides the in-service check function for the PIU board, and the failure check function for the lightning protection module of the PIU. Supports 1+1 hot backup for the SCC unit.

Cross-Connect Unit
Table 9-72 lists the function and feature of the cross-connect unit of the CXLD1. Table 9-72 Function and feature of the cross-connect unit of the CXLD1 Function and Feature Basic function CXLD1 Completes 15 Gbit/s non-blocking full cross-connection at the VC-4 level, and 5 Gbit/s non-blocking full cross-connection at the VC-12 or VC-3 level. Provides two 4M HDLC fast emergency channels, which are used for the MSP and SNCP protection switching.
l l l l

Fast emergency channel Service processing

Dynamically grooms services. Adds or deletes services without interrupting services. Supports the SNCP protection at the VC-3 and VC-12 levels. Supports VC-4-4c, VC-4-8c and VC-4-16c concatenation services.

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Function and Feature Protection scheme

CXLD1 Supports the 1+1 hot backup (non-revertive) for the cross-connect unit.

Clock Unit
Table 9-73 lists the function and feature of the clock unit of the CXLD1. Table 9-73 Function and feature of the clock unit of the CXLD1 Function and Feature Basic function Other function CXLD1 Provides standard system synchronization clock. Supports the extraction, insertion and management of the SSM and clock ID. Supports transmitting the DCC overhead information at a twochannel external clock interface. Input and output
l

Inputs two-channel 2048 kHz or 2048 kbit/s timing signals, and selects the external timing source. Outputs two-channel 2048 Hz or 2048 kbit/s timing signals.

9.7.3 Working Principle and Signal Flow

The CXLD1 consists of the SDH overhead processing module, RST, MST and so on. Figure 9-31 shows the block diagram for the functions of the CXLD1.

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Figure 9-31 Block diagram for the functions of the CXLD1

38MHz OSC
Time & synchronizaton (SETS) T1 T2 T3 T4(Clock external output) T0 Line units Tributary units PIU AUX

SETG

Frame header T0 (reference clock)

Service units Service units

155MHz PLL

155 MHz 16x155 Mbit/s data

SDH overhead processing module

Cross-connect unit A high speed bus

high speed bus

STM-1

Another CXL unit

O/E

DEMUX

RST
STM-1 16x155 Mbit/s data

MST

MSA

HPT

O/E

MUX

XC Cross Connect (HPC)

high speed bus SCC unit Another connect unit

K1/K2 insertion/ extration

Performance report

Laser shut down

K1/K2 bytes

DCC

XC Cross Connect (LPC)

high speed bus Cross-connect unit B

Laser control

K1/K2 bytes process

DCC process

DCC

Line unit

ETH channels comunication

Other unit Another CXL

Communication and control module

Master and slaver board comunication

ETH interface OAM interface

AUX AUX

F&f interface

Power monitor

Phone interface S1-S4 interface

EOW

Boot ROM

FLASH

RAM

NVRAM

+3.3 V +5V +1.6V +1.8V +1.2V

DC/DC converter

Fuse

-48 V/-60V -48 V/-60V

DC/DC converter

The function modules are described as follows:

Synchronous Timing Unit

The synchronous timing unit provides system clock T0 to the service board, the control unit and the cross-connect unit in central timing distribution mode. This unit also selects one from 12 reference clock sources as the reference clock for synchronous timing. The 12 reference clock sources are from the line board (T1), the tributary board (T2), the external synchronous clock source (T3) and so on. The synchronous system clock source (T0) and 2 M external synchronous source (T4) are generated. The boards apply 1 + 1 hot backup. Therefore, both the active and the standby boards tracing the same reference source to ensure the identity between the system clocks of the active and the standby boards. The synchronous timing unit can extract timing from three types of timing signal:
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l l l

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Timing signal (T1) from STM-N Timing signal (T2) from PDH Reference signal (T3) from external synchronous clock source (2MHz or 2Mbit/s)

The clock module outputs:

l l

T0, system clock (38 MHz) T4, external timing (2 Mbit/s or 2 MHz) output by line

O/E Conversion Module

l l

In receive direction, it converts the received optical signals into electrical signals. In transmit direction, it converts the electrical signals into SDH optical signals, and then send optical signals to fibers for transmission. The SPI detects the R_LOS alarm and provides the laser shut down function.

MUX/DEMUX Module
l

In receive direction, the DEMUX part demultiplexes the high rate electrical signals into multiple parallel electrical signals, and recovery the clock signal at the same time. In transmit direction, the MUX part multiplexes the parallel electrical signals received from the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing Module

It includes RST, MST, MSA and HPT, provides inloop and outloop function.
l

RST

In receiving direction, performs frame alignment detection (A1, A2), regenerator section trace recovery (J0) and mismatch detection, BIP-8 errored block count. In transmitting direction, it performs frame alignment insertion, regenerator section path trace insertion, BIP-8 calculation and insertion. In receiving direction, performs BIP-24 errored block count, MS_REI recovery, MS_RDI and MS_AIS detection. In transmitting direction, it performs BIP-24 calculation and insertion, MS_REI, MS_RDI and MS_AIS insertion. Provides extraction or insertion of K1 byte and K2 byte. In receiving direction, performs AU4's pointer interpretation, LOP and AIS detection, pointer justification. In transmitting direction, it performs AUG assembly, AU-4 pointer regeneration, AU_AIS generation. OH termination J1 path trace message recovery REI information recovering
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MST

MSA

HPT

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HP_RDI detection (path status monitoring UNEQ and AIS detection (signal label monitoring) VC-4 BIP-8 errored block count

Communication and Control Module

l l l l l

Traces the clock signal from the active and the standby cross-connect unit. Implements laser controlling function. Selects the clock and frame header from the active or the standby cross-connect units. Controls the indicator on the board. CPU control unit, which controls and monitors other function modules. The unit also initializes other function modules after power on. ETH interface, which provides 10/ 100 Mbit/s Ethernet interface for network management. OAM interface, which provides serial port for network management. This port can be used as the MODEM port and thus can be configured as a serial port to connect to MODEM port in running state. COM interface for commissioning port Ethernet port for inter-board communication: 10 Mbit/s Ethernet port between the active and the standby CXLL unit. Supports receiving the BIP-8 check for the overhead of the SCC unit, and provides the interface to query the check result.

l l

l l

Cross-connect Module
The cross-connect module consists of two parts:
l

SNCP module, which tests relative alarms and reports the alarm to software to trigger SNCP switching Higher and lower order cross-connect module, which performs the functions of higher and lower order cross-connect units. This module consists of higher order cross-connect unit and lower order cross-connect unit.

Figure 9-32 illustrates the block diagram of higher and lower order cross-connect modules.

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Figure 9-32 Block diagram of higher and lower order cross-connect modules
Time & synchronizaton (SETS) T1 T2 T3 T4(Clock external output) T0 Line units

38MHz OSC

Tributary units PIU AUX

SETG

Frame header T0 (reference clock)

Service units Service units

155MHz PLL

155 MHz 16x155 Mbit/s data

SDH overhead processing module

Cross-connect unit A high speed bus

high speed bus

STM-16

Another CXL unit

O/E

DEMUX

RST
16x155 Mbit/s data

MST

MSA

HPT

STM-16

O/E

MUX

XC Cross Connect (HPC)

high speed bus SCC unit Another connect unit

K1/K2 insertion/ extration

Performance report

Laser shut down

K1/K2 bytes

DCC

XC Cross Connect (LPC)

high speed bus

Cross-connec unit B

Laser control

K1/K2 bytes process

DCC process

DCC

Line unit

ETH channels comunication

Other unit

Communication and control module

Master and slaver board comunication

Another CXL

ETH interface OAM interface

AUX AUX

F&f interface

Power monitor

Phone interface S1-S4 interface

EOW

Boot ROM

FLASH

RAM

NVRAM

+3.3 V +5V +1.6V +1.8V +1.2V

DC/DC converter

Fuse

-48 V/-60V -48 V/-60V

DC/DC converter

The upper half part is the higher order cross-connect unit, which fully cross-connects 15 G higher order services with VC-4 as the minimum service grooming granularity. The lower half part is the lower order cross-connect unit, which cross-connects 5 G lower order services.

Other Functions
l

Responses to and processes k bytes

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9 Cross-Connect and System Control Boards

Collects performance data of the optical module and shuts output of the optical module Collects and processes DCC of each board Inserts the DCC back into each line board after processing Monitors the power supply of the board Resets the unit Cuts alarms

DC/DC Converter Module

This module provides the board with required DC voltages. It converts the 48/60 V power supply to the following voltages: +5V, +1.6V, +1.8V +1.2V and+3.3V.

CF Card
The CF card serves as the storage area of the database, system parameters, NE software package, logs and black box. The capacity is 512 MB and can be expanded to 1 GB.

9.7.4 Jumper and DIP Switch

On the CXL, there are a jumper and a DIP switch, which are used to set the input voltage and running state of the board.

CAUTION
Jumpers are used for test and maintenance. Do not change the setting of jumpers at random. Otherwise, the board may become faulty. Figure 9-33 shows the layout of the J7 jumper and DIP switch SW2 on the CXL board. Figure 9-33 Jumper and DIP switch of the CXL board
Power module

CPU

1 2 3 4

SW2

1 2 3

J7
CF card

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Table 9-74 lists the jumper on the CXL board. Table 9-74 Jumper on the CXL board Jumper J7 Function Enable the battery. Description 1-2: When jumpers 2 and 3 are capped, the battery is enabled.

Table 9-75 lists the DIP switch on the CXL board. Table 9-75 DIP switch on the CXL board DIP Switch SW2 Function Set the board running state. Description On: indicates the binary value 1. The DIP switch adopts four bits, which are queued according to the switch numbering. The number 4 indicates the highest bit. For details, refer to Table 9-76.

Table 9-76 Description of DIP switch SW2 Value 0b0000 0b0001 0b0011 0b0100 0b1011 0b1100 0b1101 0b1110 0b1111 Description Indicates the running state when the watchdog is started. It is the default state. Changes to the self-test state of the SDRAM Burst. Indicates the commissioning state. Indicates the running state when the watchdog is stopped. Erases the database. Erases the NE software, including the patch. Erases the database and NE software (including the patch). Erases the database, NE software and NE.ini file. Erases the extended BIOS and system parameter zone in the file system and FLASH memory.

9.7.5 Front Panel

On the front panel of the CXLD1 board, there are indicators, interfaces, barcode, functional button switch, laser safety class label, and CF card slot.
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Appearance of the Front Panel

Figure 9-34 shows the front panel of the CXLD1 board. Figure 9-34 Front panel the CXLD1 board
CXLD1
STAT ACTX ACTC PROG SRVX SRVL SYNC ALMC
CLASS 1 LASER PRODUCT

OUT1 IN1 OUT2 IN2

CF R/W RESET ALM CUT

CXLD1

Indicators
The following indicators are present on the front panel of the board:
l l

Board hardware state indicator (STAT), which is green or red when lit. Activating state indicator for the services at the cross-connect unit (ACTX), which is green when lit. Active/standby state indicator for the SCC units (ACTC), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Alarm indicator (SRVX) for services at the cross-connect unit, which is red, green or yellow when lit. Alarm indicator (SRVL) for services at the line units , which is red, green or yellow when lit. Synchronization clock state indicator (SYNC), which is red or green when lit. Alarm cutting indicator (ALMC), which is yellow when lit.

l l l

l l

For indication of these indicators, see A Equipment and Board Alarm Indicators.

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CF Card Read-Write Indicator (CF R/W)

State On (green) Flash (green) On (red) Description The CF card is in the read/write state of the system. The system is reading data from or writing data to the CF card. The CF card is off-line or is in the read/write prohibited state. The CF card is in the pluggable state. Flash (red) The system is processing the data after receiving the instruction for pre-processing data from the CF card.

Interfaces
On the front panel of the CXLD1, there are one optical interface and two switches. Table 9-77 lists the type and usage of the optical interface and switches on the CXLD1. Table 9-77 Optical interface and switches on the CXLD1 Interface IN OUT RESET ALM CUT Interface Type LC LC Warm reset switch Alarm cut switch Usage Receives optical signals. The pluggable optical module is used for easy maintenance. Transmits optical signals. The pluggable optical module is used for easy maintenance. Press the switch to reset the SCC unit. Press the switch to mute the alarm. Press the switch for three seconds to mute the alarm permanently. Press the switch again for three seconds to resume the alarm sound.

9.7.6 Valid Slots

The CXLD1 can be housed in any of slots 45 in the subrack.

9.7.7 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code of the CXLD1 indicates the optical interface type. Table 9-78 lists the relation between the board feature code and optical interface type of the CXLD1.

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Table 9-78 Relation between the board feature code and the optical interface type Board Barcode SSR1CXLD110 SSR1CXLD111 SSR1CXLD112 SSR1CXLD113 SSR1CXLD114 Feature Code 10 11 12 13 14 Optical Interface Type S-1.1 (LC) L-1.1 (LC) L-1.2 (LC) Ve-1.2 (LC) I-1 (LC)

9.7.8 Board Configuration Reference

The physical slot that houses the CXLD1 is different from the logical slot displayed on the T2000. You can use the T2000 to set parameters for the CXLD1.

Displayed Slot
The CXLD1 is housed in one slot in the subrack. The logical boards for the CXLD1 are the R1SLD41, RCXL and GSCC. Table 9-79 lists the logical slots displayed on the T2000. Table 9-79 Logical slots displayed on the T2000 for the CXLD1 Board CXLL1 Logical Board R1SLD41 RCXL GSCC Logical Slot Slots 45 Slots 8081 Slots 8283

Board Parameters
l l l

J1 byte C2 byte Clock parameters

For details on the parameters, refer to F Board Configuration Reference.

9.7.9 Technical Specifications

The technical specifications for the CXLD1 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications

Table 9-80 lists the specifications for the optical interfaces of the CXLD1.
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Table 9-80 Specifications for the optical interfaces of the CXLD1 Item Nominal bit rate Line code Optical interface type Working wavelength (nm) Optical source type Mean launched optical power (dBm) Receiver sensitivity (dBm) Min. overload (dBm) Min. extinction ratio (dB) Specification 155520 kbit/s NRZ I-1 1260 to 1360 MLM, LED 15 to 8 S-1.1 1261 to 1360 MLM 15 to 8 L-1.1 1263 to 1360 MLM, SLM 5 to 0 L-1.2 1480 to 1580 SLM 5 to 0 Ve-1.2 1480 to 1580 SLM 3 to 0

23 8 8.2

28 8 8.2

34 10 10

34 10 10

34 10 10

Cross-Connect Capacity
The cross-connect capacity of the CXLD1 is as follows:
l l l

Higher order cross-connect capacity: 15 Gbit/s Lower order cross-connect capacity: 5 Gbit/s Access capacity: 10 Gbit/s

Clock Access Capability

The clock access capability of the CXLD1 is described as follows:
l l

External input clock: two channels, 2048 kbit/s or 2048 kHz External output clock: two channels, 2048 kbit/s or 2048 kHz

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specification for the CXLD1 is as follows:
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l l

9 Cross-Connect and System Control Boards

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 1.0

Power Consumption
At the normal temperature (25), the maximum power consumption for the CXLD1 is 50W.

9.8 CXLD4
This section describes the CXLD4, an integrated board of the SCC, cross-connect, clock and line units, in terms of the version, principle, function, principle, front panel and specifications. 9.8.1 Version Description The functional version of CXLD4 board is R1. 9.8.2 Function and Feature The CXLD4 is used to process SDH signals, control communication, groom services, and to input and output the clock. 9.8.3 Working Principle and Signal Flow The CXLD4 consists of the SDH overhead processing module, RST, MST and so on. 9.8.4 Jumper and DIP Switch On the CXLD4, there are a jumper and a DIP switch, which are used to set the input voltage and running state of the board. 9.8.5 Front Panel On the front panel of the CXLD4 board, there are indicators, interfaces, barcode, functional button switch, laser safety class label, and CF card slot. 9.8.6 Valid Slots The CXLD4 can be housed in any of slots 45 in the subrack. 9.8.7 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the CXLD4 indicates the optical interface type. 9.8.8 Board Configuration Reference The physical slot that houses the CXLD4 is different from the logical slot displayed on the T2000. You can use the T2000 to set parameters for the CXLD4. 9.8.9 Technical Specifications The technical specifications for the CXLD4 cover the optical interface specifications, board dimensions, weight and power consumption.

9.8.1 Version Description

The functional version of CXLD4 board is R1.

9.8.2 Function and Feature

The CXLD4 is used to process SDH signals, control communication, groom services, and to input and output the clock.
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SDH Processing Unit

Table 9-81 lists the function and feature of the SDH processing unit of the CXLD4. Table 9-81 Function and feature of the SDH processing unit of the CXLD4 Function and Feature Basic function Specification of the optical interface Specification of the optical module CXLD4 Transmits and receives 2 x STM-4 optical signals. Supports the optical interfaces of the I-4, S-4.1, L-4.1, L-4.2, and Ve-4.2 types.
l

Supports detection and query of the information on the optical module. Supports the function of setting the on/off state of the laser and the ALS function.

Service processing Overhead processing

Supports the processing of the VC-12, VC-3, VC-4 services and VC4-4c concatenation services..
l l

Supports the processing of the SOH bytes of the STM-4 signals. Supports the transparent transmission and termination of the POH bytes. Supports the setting and query of the J0/J1/C2 bytes.

Alarm and performance event Protection scheme

Provides rich alarms and performance events for easy management and maintenance of the equipment. Supports multiple protection modes such as two-fiber MSP protection ring, four-fiber MSP protection ring, linear MSP protection, and SNCP..
l l

Maintenance feature

Supports inloop and outloop for optical interfaces. Supports the warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services.

l l

SCC Unit
Table 9-82 lists the function and feature of the SCC unit of the CXLD4.

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Table 9-82 Function and feature of the SCC unit of the CXLD4 Function and Feature Basic function Specification of the optical interface CXLD4 Configures and monitors services, monitors the service performance, and collects performance events and alarm information.
l

Provides 10M/100M compatible Ethernet NMS interface, which is present on AUX. Provides one 10M/100M Ethernet interface, which is used for inter-board communication and present on AUX board. Provides one 10M Ethernet interface, which is used for communication between the active and standby SCC boards and present on AUX board. Provides the RS232 OAM interface that is present on the AUX board to connect to the PC or workstation. Supports the remote maintenance by using the RS232 DCE modem. Supports receiving the BIP-8 check for the overhead of the SCC unit, and provides the interface to query the check result.

Maintenance feature DCC processing capability Fan alarm management PIU management Protection scheme

Supports the CF card, and supports the package loading function. The capacity is 512 MB and can be expanded to 1 GB. Processes 40-channel DCC. Manages fan alarms. Provides the in-service check function for the PIU board, and the failure check function for the lightning protection module of the PIU. Supports 1+1 hot backup for the SCC unit.

Cross-Connect Unit
Table 9-83 lists the function and feature of the cross-connect unit of the CXLD4. Table 9-83 Function and feature of the cross-connect unit of the CXLD4 Function and Feature Basic function CXLD4 Completes 15 Gbit/s non-blocking full cross-connection at the VC-4 level, and 5 Gbit/s non-blocking full cross-connection at the VC-12 or VC-3 level. Provides two 4M HDLC fast emergency channels, which are used for the MSP and SNCP protection switching.

Fast emergency channel

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Function and Feature Service processing

CXLD4
l l l l l

Dynamically grooms services. Adds or deletes services without interrupting services. Supports the SNCP protection at the VC-3 and VC-12 levels. Supports a maximum of 1024 SNCP protection pairs. Supports VC-4-4c concatenation services.

Protection scheme

Supports the 1+1 hot backup (non-revertive) for the cross-connect unit.

Clock Unit
Table 9-84 lists the function and feature of the clock unit of the CXLD4. Table 9-84 Function and feature of the clock unit of the CXLD4 Function and Feature Basic function Other function CXLD4 Provides standard system synchronization clock. Supports the extraction, insertion and management of the SSM and clock ID. Supports transmitting the DCC overhead information at a twochannel external clock interface. Input and output
l

Inputs two-channel 2048 kHz or 2048 kbit/s timing signals, and selects the external timing source. Outputs two-channel 2048 Hz or 2048 kbit/s timing signals.

9.8.3 Working Principle and Signal Flow

The CXLD4 consists of the SDH overhead processing module, RST, MST and so on. Figure 9-35 shows the block diagram for the functions of the CXLD4.

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Figure 9-35 Block diagram for the functions of the CXLD4

38MHz OSC
Time & synchronizaton (SETS) T1 T2 T3 T4(Clock external output) T0 Line units Tributary units PIU AUX

SETG

Frame header T0 (reference clock)

Service units Service units

155MHz PLL

155 MHz 16x155 Mbit/s data

SDH overhead processing module

Cross-connect unit A high speed bus

high speed bus

STM-1

Another CXL unit

O/E

DEMUX

RST
STM-1 16x155 Mbit/s data

MST

MSA

HPT

O/E

MUX

XC Cross Connect (HPC)

high speed bus SCC unit Another connect unit

K1/K2 insertion/ extration

Performance report

Laser shut down

K1/K2 bytes

DCC

XC Cross Connect (LPC)

high speed bus Cross-connect unit B

Laser control

K1/K2 bytes process

DCC process

DCC

Line unit

ETH channels comunication

Other unit Another CXL

Communication and control module

Master and slaver board comunication

ETH interface OAM interface

AUX AUX

F&f interface

Power monitor

Phone interface S1-S4 interface

EOW

Boot ROM

FLASH

RAM

NVRAM

+3.3 V +5V +1.6V +1.8V +1.2V

DC/DC converter

Fuse

-48 V/-60V -48 V/-60V

DC/DC converter

The function modules are described as follows:

Synchronous Timing Unit

The synchronous timing unit provides system clock T0 to the service board, the control unit and the cross-connect unit in central timing distribution mode. This unit also selects one from 12 reference clock sources as the reference clock for synchronous timing. The 12 reference clock sources are from the line board (T1), the tributary board (T2), the external synchronous clock source (T3) and so on. The synchronous system clock source (T0) and 2 M external synchronous source (T4) are generated. The boards apply 1 + 1 hot backup. Therefore, both the active and the standby boards tracing the same reference source to ensure the identity between the system clocks of the active and the standby boards. The synchronous timing unit can extract timing from three types of timing signal:
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l l l

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Timing signal (T1) from STM-N Timing signal (T2) from PDH Reference signal (T3) from external synchronous clock source (2MHz or 2Mbit/s)

The clock module outputs:

l l

T0, system clock (38 MHz) T4, external timing (2 Mbit/s or 2 MHz) output by line

O/E Conversion Module

l l

In receive direction, it converts the received optical signals into electrical signals. In transmit direction, it converts the electrical signals into SDH optical signals, and then send optical signals to fibers for transmission. The SPI detects the R_LOS alarm and provides the laser shut down function.

MUX/DEMUX Module
l

In receive direction, the DEMUX part demultiplexes the high rate electrical signals into multiple parallel electrical signals, and recovery the clock signal at the same time. In transmit direction, the MUX part multiplexes the parallel electrical signals received from the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing Module

It includes RST, MST, MSA and HPT, provides inloop and outloop function.
l

RST

In receiving direction, performs frame alignment detection (A1, A2), regenerator section trace recovery (J0) and mismatch detection, BIP-8 errored block count. In transmitting direction, it performs frame alignment insertion, regenerator section path trace insertion, BIP-8 calculation and insertion. In receiving direction, performs BIP-24 errored block count, MS_REI recovery, MS_RDI and MS_AIS detection. In transmitting direction, it performs BIP-24 calculation and insertion, MS_REI, MS_RDI and MS_AIS insertion. Provides extraction or insertion of K1 byte and K2 byte. In receiving direction, performs AU4's pointer interpretation, LOP and AIS detection, pointer justification. In transmitting direction, it performs AUG assembly, AU-4 pointer regeneration, AU_AIS generation. OH termination J1 path trace message recovery REI information recovering
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MST

MSA

HPT

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HP_RDI detection (path status monitoring UNEQ and AIS detection (signal label monitoring) VC-4 BIP-8 errored block count

Communication and Control Module

l l l l l

Traces the clock signal from the active and the standby cross-connect unit. Implements laser controlling function. Selects the clock and frame header from the active or the standby cross-connect units. Controls the indicator on the board. CPU control unit, which controls and monitors other function modules. The unit also initializes other function modules after power on. ETH interface, which provides 10/ 100 Mbit/s Ethernet interface for network management. OAM interface, which provides serial port for network management. This port can be used as the MODEM port and thus can be configured as a serial port to connect to MODEM port in running state. COM interface for commissioning port Ethernet port for inter-board communication: 10 Mbit/s Ethernet port between the active and the standby CXLL unit. Supports receiving the BIP-8 check for the overhead of the SCC unit, and provides the interface to query the check result.

l l

l l

Cross-connect Module
The cross-connect module consists of two parts:
l

SNCP module, which tests relative alarms and reports the alarm to software to trigger SNCP switching Higher and lower order cross-connect module, which performs the functions of higher and lower order cross-connect units. This module consists of higher order cross-connect unit and lower order cross-connect unit.

Figure 9-36 illustrates the block diagram of higher and lower order cross-connect modules.

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Figure 9-36 Block diagram of higher and lower order cross-connect modules
Time & synchronizaton (SETS) T1 T2 T3 T4(Clock external output) T0 Line units

38MHz OSC

Tributary units PIU AUX

SETG

Frame header T0 (reference clock)

Service units Service units

155MHz PLL

155 MHz 16x155 Mbit/s data

SDH overhead processing module

Cross-connect unit A high speed bus

high speed bus

STM-16

Another CXL unit

O/E

DEMUX

RST
16x155 Mbit/s data

MST

MSA

HPT

STM-16

O/E

MUX

XC Cross Connect (HPC)

high speed bus SCC unit Another connect unit

K1/K2 insertion/ extration

Performance report

Laser shut down

K1/K2 bytes

DCC

XC Cross Connect (LPC)

high speed bus

Cross-connec unit B

Laser control

K1/K2 bytes process

DCC process

DCC

Line unit

ETH channels comunication

Other unit

Communication and control module

Master and slaver board comunication

Another CXL

ETH interface OAM interface

AUX AUX

F&f interface

Power monitor

Phone interface S1-S4 interface

EOW

Boot ROM

FLASH

RAM

NVRAM

+3.3 V +5V +1.6V +1.8V +1.2V

DC/DC converter

Fuse

-48 V/-60V -48 V/-60V

DC/DC converter

The upper half part is the higher order cross-connect unit, which fully cross-connects 15 G higher order services with VC-4 as the minimum service grooming granularity. The lower half part is the lower order cross-connect unit, which cross-connects 5 G lower order services.

Other Functions
l

Responses to and processes k bytes

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l l l l l l

9 Cross-Connect and System Control Boards

Collects performance data of the optical module and shuts output of the optical module Collects and processes DCC of each board Inserts the DCC back into each line board after processing Monitors the power supply of the board Resets the unit Cuts alarms

DC/DC Converter Module

This module provides the board with required DC voltages. It converts the 48/60 V power supply to the following voltages: +5V, +1.6V, +1.8V +1.2V and+3.3V.

CF Card
The CF card serves as the storage area of the database, system parameters, NE software package, logs and black box. The capacity is 512 MB and can be expanded to 1 GB.

9.8.4 Jumper and DIP Switch

On the CXLD4, there are a jumper and a DIP switch, which are used to set the input voltage and running state of the board.

CAUTION
Jumpers are used for test and maintenance. Do not change the setting of jumpers at random. Otherwise, the board may become faulty. Figure 9-37 shows the layout of the J7 jumper and DIP switch SW2 on the CXLD4 board. Figure 9-37 Jumper and DIP switch of the CXLD4 board
Power module

CPU

1 2 3 4

SW2

1 2 3

J7
CF card

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Table 9-85 lists the jumper on the CXLD4 board. Table 9-85 Jumper on the CXLD4 board Jumper J7 Function Enable the battery. Description 1-2: When jumpers 2 and 3 are capped, the battery is enabled.

Table 9-86 lists the DIP switch on the CXLD4 board. Table 9-86 DIP switch on the CXLD4 board DIP Switch SW2 Function Set the board running state. Description On: indicates the binary value 1. The DIP switch adopts four bits, which are queued according to the switch numbering. The number 4 indicates the highest bit. For details, refer to Table 9-87.

Table 9-87 Description of DIP switch SW2 Value 0b0000 0b0001 0b0011 0b0100 0b1011 0b1100 0b1101 0b1110 0b1111 Description Indicates the running state when the watchdog is started. It is the default state. Changes to the self-test state of the SDRAM Burst. Indicates the commissioning state. Indicates the running state when the watchdog is stopped. Erases the database. Erases the NE software, including the patch. Erases the database and NE software (including the patch). Erases the database, NE software and NE.ini file. Erases the extended BIOS and system parameter zone in the file system and FLASH memory.

9.8.5 Front Panel

On the front panel of the CXLD4 board, there are indicators, interfaces, barcode, functional button switch, laser safety class label, and CF card slot.
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Appearance of the Front Panel

Figure 9-38 shows the front panel of the CXLD4 board. Figure 9-38 Front panel the CXLD4 board
CXLD4
STAT ACTX ACTC PROG SRVX SRVL SYNC ALMC
CLASS 1 LASER PRODUCT

OUT1 IN1 OUT2 IN2

CF R/W RESET ALM CUT

CXLD4

Indicators
The following indicators are present on the front panel of the board:
l l

Board hardware state indicator (STAT), which is green or red when lit. Activating state indicator for the services at the cross-connect unit (ACTX), which is green when lit. Active/standby state indicator for the SCC units (ACTC), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Alarm indicator (SRVX) for services at the cross-connect unit, which is red, green or yellow when lit. Alarm indicator (SRVL) for services at the line units , which is red, green or yellow when lit. Synchronization clock state indicator (SYNC), which is red or green when lit. Alarm cutting indicator (ALMC), which is yellow when lit.

l l l

l l

For indication of these indicators, see A Equipment and Board Alarm Indicators.

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CF Card Read-Write Indicator (CF R/W)

State On (green) Flash (green) On (red) Description The CF card is in the read/write state of the system. The system is reading data from or writing data to the CF card. The CF card is off-line or is in the read/write prohibited state. The CF card is in the pluggable state. Flash (red) The system is processing the data after receiving the instruction for pre-processing data from the CF card.

Interfaces
On the front panel of the CXLD4, there are one optical interface and two switches. Table 9-88 lists the type and usage of the optical interface and switches on the CXLD4. Table 9-88 Optical interface and switches on the CXLD4 Interface IN OUT RESET ALM CUT Interface Type LC LC Warm reset switch Alarm cut switch Usage Receives optical signals. The pluggable optical module is used for easy maintenance. Transmits optical signals. The pluggable optical module is used for easy maintenance. Press the switch to reset the SCC unit. Press the switch to mute the alarm. Press the switch for three seconds to mute the alarm permanently. Press the switch again for three seconds to resume the alarm sound.

9.8.6 Valid Slots

The CXLD4 can be housed in any of slots 45 in the subrack.

9.8.7 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code of the CXLD4 indicates the optical interface type. Table 9-89 lists the relation between the board feature code and optical interface type of the CXLD4.

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Table 9-89 Relation between the board feature code and the optical interface type Board Barcode SSR1CXLD410 SSR1CXLD411 SSR1CXLD412 SSR1CXLD413 SSR1CXLD414 Feature Code 10 11 12 13 14 Optical Interface Type S-4.1 (LC) L-4.1 (LC) L-4.2 (LC) Ve-4.2 (LC) I-4 (LC)

9.8.8 Board Configuration Reference

The physical slot that houses the CXLD4 is different from the logical slot displayed on the T2000. You can use the T2000 to set parameters for the CXLD4.

Displayed Slot
The CXLD4 is housed in one slot in the subrack. The logical boards for the CXLD4 are the R1SLD41, RCXL and GSCC. Table 9-90 lists the logical slots displayed on the T2000. Table 9-90 Logical slots displayed on the T2000 for the CXLD1 Board CXLD4 Logical Board R1SLD41 RCXL GSCC Logical Slot Slots 45 Slots 8081 Slots 8283

Board Parameters
l l l

J1 byte C2 byte Clock parameters

For details on the parameters, refer to F Board Configuration Reference.

9.8.9 Technical Specifications

The technical specifications for the CXLD4 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications

Table 9-91 lists the specifications for the optical interfaces of the CXLD4.
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Table 9-91 Specifications for the optical interfaces of the CXLD4 Item Nominal bit rate Line code Optical interface type Working wavelength (nm) Optical source type Mean launched optical power (dBm) Receiver sensitivity (dBm) Min. overload (dBm) Min. extinction ratio (dB) Specification 622080 kbit/s NRZ I-4 1260 to 1360 MLM 15 to 8 S-4.1 1274 to 1356 MLM 15 to 8 L-4.1 1280 to 1335 SLM 3 to 2 L-4.2 1480 to 1580 SLM 3 to 2 Ve-4.2 1480 to 1580 SLM 3 to 2

23 8 8.2

28 8 8.2

28 18 10

28 8 10

34 13 10.5

Cross-Connect Capacity
The cross-connect capacity of the CXLD4 is as follows:
l l l

Higher order cross-connect capacity: 15 Gbit/s Lower order cross-connect capacity: 5 Gbit/s Access capacity: 10 Gbit/s

Clock Access Capability

The clock access capability of the CXLD4 is described as follows:
l l

External input clock: two channels, 2048 kbit/s or 2048 kHz External output clock: two channels, 2048 kbit/s or 2048 kHz

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications for the CXLD4 are as follows:
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l l

9 Cross-Connect and System Control Boards

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg):1.0kg

Power Consumption
At the normal temperature (25), the maximum power consumption for the CXLD4 is 50W.

9.9 CXLQ1
This section describes the CXLQ1, an integrated board of the SCC, cross-connect, clock and line units, in terms of the version, principle, function, principle, front panel and specifications. 9.9.1 Version Description The functional version of CXLQ1 board is R1. 9.9.2 Function and Feature The CXLQ1 is used to process SDH signals, control communication, groom services, and to input and output the clock. 9.9.3 Working Principle and Signal Flow The CXLQ1 consists of the SDH overhead processing module, RST, MST and so on. 9.9.4 Jumper and DIP Switch On the CXLQ1, there are a jumper and a DIP switch, which are used to set the input voltage and running state of the board. 9.9.5 Front Panel On the front panel of the CXLQ1 board, there are indicators, interfaces, barcode, functional button switch, laser safety class label, and CF card slot. 9.9.6 Valid Slots The CXLQ1 can be housed in any of slots 45 in the subrack. 9.9.7 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the CXLQ1 indicates the optical interface type. 9.9.8 Board Configuration Reference The physical slot that houses the CXLQ1 is different from the logical slot displayed on the T2000. You can use the T2000 to set parameters for the CXLQ1. 9.9.9 Technical Specifications The technical specifications for the CXLQ1 cover the optical interface specifications, board dimensions, weight and power consumption.

9.9.1 Version Description

The functional version of CXLQ1 board is R1.

9.9.2 Function and Feature

The CXLQ1 is used to process SDH signals, control communication, groom services, and to input and output the clock.
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SDH Processing Unit

Table 9-92 lists the function and feature of the SDH processing unit of the CXLQ1. Table 9-92 Function and feature of the SDH processing unit of the CXLQ1 Function and Feature Basic function Specification of the optical interface Specification of the optical module CXLQ1 Transmits and receives 4 x STM-1 optical signals. Supports the optical interfaces of the I-1, S-1.1, L-1.1, L-1.2, and Ve-1.2 types.
l

Supports detection and query of the information on the optical module. Supports the function of setting the on/off state of the laser and the ALS function.

Service processing Overhead processing

Supports the processing of the VC-12, VC-3 and VC-4 services.

l l

Supports the processing of the SOH bytes of the STM-1 signals. Supports the transparent transmission and termination of the POH bytes. Supports the setting and query of the J0/J1/C2 bytes.

Alarm and performance event Protection scheme

Provides rich alarms and performance events for easy management and maintenance of the equipment. Supports multiple protection modes such as two-fiber MSP protection ring, four-fiber MSP protection ring, linear MSP protection, and SNCP..
l l

Maintenance feature

Supports inloop and outloop for optical interfaces. Supports the warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services.

l l

SCC Unit
Table 9-93 lists the function and feature of the SCC unit of the CXLQ1.

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Table 9-93 Function and feature of the SCC unit of the CXLQ1 Function and Feature Basic function Specification of the optical interface CXLQ1 Configures and monitors services, monitors the service performance, and collects performance events and alarm information.
l

Provides 10M/100M compatible Ethernet NMS interface, which is present on the AUX board. Provides one 10M/100M Ethernet interface, which is used for inter-board communication and is present on the AUX board. Provides one 10M Ethernet interface, which is used for communication between the active and standby SCC boards and is present on the AUX board. Provides the RS232 OAM interface that is present on the auxiliary interface board to connect to the PC or workstation. Supports the remote maintenance by using the RS232 DCE modem. Supports receiving the BIP-8 check for the overhead of the SCC unit, and provides the interface to query the check result.

Maintenance feature DCC processing capability Fan alarm management PIU management Protection scheme

Supports the CF card, and supports the package loading function. The capacity is 512 MB and can be expanded to 1 GB. Processes 40-channel DCC. Manages fan alarms. Provides the in-service check function for the PIU board, and the failure check function for the lightning protection module of the PIU. Supports 1+1 hot backup for the SCC unit.

Cross-Connect Unit
Table 9-94 lists the function and feature of the cross-connect unit of the CXLQ1. Table 9-94 Function and feature of the cross-connect unit of the CXLQ1 Function and Feature Basic function CXLQ1 Completes 15 Gbit/s non-blocking full cross-connection at the VC-4 level, and 5 Gbit/s non-blocking full cross-connection at the VC-12 or VC-3 level. Provides two 4M HDLC fast emergency channels, which are used for the MSP and SNCP protection switching.

Fast emergency channel

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Function and Feature Service processing

CXLQ1
l l l l

Dynamically grooms services. Adds or deletes services without interrupting services. Supports the SNCP protection at the VC-3 and VC-12 levels. Supports VC-4-4c, VC-4-8c and VC-4-16c concatenation services.

Protection scheme

Supports the 1+1 hot backup (non-revertive) for the cross-connect unit.

Clock Unit
Table 9-95 lists the function and feature of the clock unit of the CXLQ1. Table 9-95 Function and feature of the clock unit of the CXLQ1 Function and Feature Basic function Other function CXLQ1 Provides standard system synchronization clock. Supports the extraction, insertion and management of the SSM and clock ID. Supports transmitting the DCC overhead information at a twochannel external clock interface. Input and output
l

Inputs two-channel 2048 kHz or 2048 kbit/s timing signals, and selects the external timing source. Outputs two-channel 2048 Hz or 2048 kbit/s timing signals.

9.9.3 Working Principle and Signal Flow

The CXLQ1 consists of the SDH overhead processing module, RST, MST and so on. Figure 9-39 shows the block diagram for the functions of the CXLQ1.

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Figure 9-39 Block diagram for the functions of the CXLQ1

38MHz OSC
Time & synchronizaton (SETS) T1 T2 T3 T4(Clock external output) T0 Line units Tributary units PIU AUX

SETG

Frame header T0 (reference clock)

Service units Service units

155MHz PLL

155 MHz 16x155 Mbit/s data

SDH overhead processing module

Cross-connect unit A high speed bus

high speed bus

STM-1

Another CXL unit

O/E

DEMUX

RST
STM-1 16x155 Mbit/s data

MST

MSA

HPT

O/E

MUX

XC Cross Connect (HPC)

high speed bus SCC unit Another connect unit

K1/K2 insertion/ extration

Performance report

Laser shut down

K1/K2 bytes

DCC

XC Cross Connect (LPC)

high speed bus Cross-connect unit B

Laser control

K1/K2 bytes process

DCC process

DCC

Line unit

ETH channels comunication

Other unit Another CXL

Communication and control module

Master and slaver board comunication

ETH interface OAM interface

AUX AUX

F&f interface

Power monitor

Phone interface S1-S4 interface

EOW

Boot ROM

FLASH

RAM

NVRAM

+3.3 V +5V +1.6V +1.8V +1.2V

DC/DC converter

Fuse

-48 V/-60V -48 V/-60V

DC/DC converter

The function modules are described as follows:

Synchronous Timing Unit

The synchronous timing unit provides system clock T0 to the service board, the control unit and the cross-connect unit in central timing distribution mode. This unit also selects one from 12 reference clock sources as the reference clock for synchronous timing. The 12 reference clock sources are from the line board (T1), the tributary board (T2), the external synchronous clock source (T3) and so on. The synchronous system clock source (T0) and 2 M external synchronous source (T4) are generated. The boards apply 1 + 1 hot backup. Therefore, both the active and the standby boards tracing the same reference source to ensure the identity between the system clocks of the active and the standby boards. The synchronous timing unit can extract timing from three types of timing signal:
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l l l

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Timing signal (T1) from STM-N Timing signal (T2) from PDH Reference signal (T3) from external synchronous clock source (2MHz or 2Mbit/s)

The clock module outputs:

l l

T0, system clock (38 MHz) T4, external timing (2 Mbit/s or 2 MHz) output by line

O/E Conversion Module

l l

In receive direction, it converts the received optical signals into electrical signals. In transmit direction, it converts the electrical signals into SDH optical signals, and then send optical signals to fibers for transmission. The SPI detects the R_LOS alarm and provides the laser shut down function.

MUX/DEMUX Module
l

In receive direction, the DEMUX part demultiplexes the high rate electrical signals into multiple parallel electrical signals, and recovery the clock signal at the same time. In transmit direction, the MUX part multiplexes the parallel electrical signals received from the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing Module

It includes RST, MST, MSA and HPT, provides inloop and outloop function.
l

RST

In receiving direction, performs frame alignment detection (A1, A2), regenerator section trace recovery (J0) and mismatch detection, BIP-8 errored block count. In transmitting direction, it performs frame alignment insertion, regenerator section path trace insertion, BIP-8 calculation and insertion. In receiving direction, performs BIP-24 errored block count, MS_REI recovery, MS_RDI and MS_AIS detection. In transmitting direction, it performs BIP-24 calculation and insertion, MS_REI, MS_RDI and MS_AIS insertion. Provides extraction or insertion of K1 byte and K2 byte. In receiving direction, performs AU4's pointer interpretation, LOP and AIS detection, pointer justification. In transmitting direction, it performs AUG assembly, AU-4 pointer regeneration, AU_AIS generation. OH termination J1 path trace message recovery REI information recovering
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MST

MSA

HPT

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HP_RDI detection (path status monitoring UNEQ and AIS detection (signal label monitoring) VC-4 BIP-8 errored block count

Communication and Control Module

l l l l l

Traces the clock signal from the active and the standby cross-connect unit. Implements laser controlling function. Selects the clock and frame header from the active or the standby cross-connect units. Controls the indicator on the board. CPU control unit, which controls and monitors other function modules. The unit also initializes other function modules after power on. ETH interface, which provides 10/ 100 Mbit/s Ethernet interface for network management. OAM interface, which provides serial port for network management. This port can be used as the MODEM port and thus can be configured as a serial port to connect to MODEM port in running state. COM interface for commissioning port Ethernet port for inter-board communication: 10 Mbit/s Ethernet port between the active and the standby CXLL unit. Supports receiving the BIP-8 check for the overhead of the SCC unit, and provides the interface to query the check result.

l l

l l

Cross-connect Module
The cross-connect module consists of two parts:
l

SNCP module, which tests relative alarms and reports the alarm to software to trigger SNCP switching Higher and lower order cross-connect module, which performs the functions of higher and lower order cross-connect units. This module consists of higher order cross-connect unit and lower order cross-connect unit.

Figure 9-40 illustrates the block diagram of higher and lower order cross-connect modules.

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Figure 9-40 Block diagram of higher and lower order cross-connect modules
Time & synchronizaton (SETS) T1 T2 T3 T4(Clock external output) T0 Line units

38MHz OSC

Tributary units PIU AUX

SETG

Frame header T0 (reference clock)

Service units Service units

155MHz PLL

155 MHz 16x155 Mbit/s data

SDH overhead processing module

Cross-connect unit A high speed bus

high speed bus

STM-16

Another CXL unit

O/E

DEMUX

RST
16x155 Mbit/s data

MST

MSA

HPT

STM-16

O/E

MUX

XC Cross Connect (HPC)

high speed bus SCC unit Another connect unit

K1/K2 insertion/ extration

Performance report

Laser shut down

K1/K2 bytes

DCC

XC Cross Connect (LPC)

high speed bus

Cross-connec unit B

Laser control

K1/K2 bytes process

DCC process

DCC

Line unit

ETH channels comunication

Other unit

Communication and control module

Master and slaver board comunication

Another CXL

ETH interface OAM interface

AUX AUX

F&f interface

Power monitor

Phone interface S1-S4 interface

EOW

Boot ROM

FLASH

RAM

NVRAM

+3.3 V +5V +1.6V +1.8V +1.2V

DC/DC converter

Fuse

-48 V/-60V -48 V/-60V

DC/DC converter

The upper half part is the higher order cross-connect unit, which fully cross-connects 15 G higher order services with VC-4 as the minimum service grooming granularity. The lower half part is the lower order cross-connect unit, which cross-connects 5 G lower order services.

Other Functions
l

Responses to and processes k bytes

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Collects performance data of the optical module and shuts output of the optical module Collects and processes DCC of each board Inserts the DCC back into each line board after processing Monitors the power supply of the board Resets the unit Cuts alarms

DC/DC Converter Module

This module provides the board with required DC voltages. It converts the 48/60 V power supply to the following voltages: +5V, +1.6V, +1.8V +1.2V and+3.3V.

CF Card
The CF card serves as the storage area of the database, system parameters, NE software package, logs and black box. The capacity is 512 MB and can be expanded to 1 GB.

9.9.4 Jumper and DIP Switch

On the CXLQ1, there are a jumper and a DIP switch, which are used to set the input voltage and running state of the board.

CAUTION
Jumpers are used for test and maintenance. Do not change the setting of jumpers at random. Otherwise, the board may become faulty. Figure 9-41 shows the layout of the J7 jumper and DIP switch SW2 on the CXLQ1 board. Figure 9-41 Jumper and DIP switch of the CXLQ1 board
Power module

CPU

1 2 3 4

SW2

1 2 3

J7
CF card

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Table 9-96 lists the jumper on the CXL board. Table 9-96 Jumper on the CXLQ1 board Jumper J7 Function Enable the battery. Description 1-2: When jumpers 2 and 3 are capped, the battery is enabled.

Table 9-97 lists the DIP switch on the CXLQ1 board. Table 9-97 DIP switch on the CXLQ1 board DIP Switch SW2 Function Set the board running state. Description On: indicates the binary value 1. The DIP switch adopts four bits, which are queued according to the switch numbering. The number 4 indicates the highest bit. For details, refer to Table 9-98.

Table 9-98 Description of DIP switch SW2 Value 0b0000 0b0001 0b0011 0b0100 0b1011 0b1100 0b1101 0b1110 0b1111 Description Indicates the running state when the watchdog is started. It is the default state. Changes to the self-test state of the SDRAM Burst. Indicates the commissioning state. Indicates the running state when the watchdog is stopped. Erases the database. Erases the NE software, including the patch. Erases the database and NE software (including the patch). Erases the database, NE software and NE.ini file. Erases the extended BIOS and system parameter zone in the file system and FLASH memory.

9.9.5 Front Panel

On the front panel of the CXLQ1 board, there are indicators, interfaces, barcode, functional button switch, laser safety class label, and CF card slot.
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Appearance of the Front Panel

Figure 9-42 shows the front panel of the CXLQ1 board. Figure 9-42 Front panel the CXLQ1 board
CXLQ1
STAT ACTX ACTC PROG SRVX SRVL SYNC ALMC
CLASS 1 LASER PRODUCT

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4

CF R/W RESET ALM CUT

CXLQ1

Indicators
The following indicators are present on the front panel of the board:
l l

Board hardware state indicator (STAT), which is green or red when lit. Activating state indicator for the services at the cross-connect unit (ACTX), which is green when lit. Active/standby state indicator for the SCC units (ACTC), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Alarm indicator (SRVX) for services at the cross-connect unit, which is red, green or yellow when lit. Alarm indicator (SRVL) for services at the line units , which is red, green or yellow when lit. Synchronization clock state indicator (SYNC), which is red or green when lit. Alarm cutting indicator (ALMC), which is yellow when lit.

l l l

l l

For indication of these indicators, see A Equipment and Board Alarm Indicators.

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CF Card Read-Write Indicator (CF R/W)

State On (green) Flash (green) On (red) Description The CF card is in the read/write state of the system. The system is reading data from or writing data to the CF card. The CF card is off-line or is in the read/write prohibited state. The CF card is in the pluggable state. Flash (red) The system is processing the data after receiving the instruction for pre-processing data from the CF card.

Interfaces
On the front panel of the CXLQ1, there are one optical interface and two switches. Table 9-99 lists the type and usage of the optical interface and switches on the CXLQ1. Table 9-99 Optical interface and switches on the CXLQ1 Interface IN OUT RESET ALM CUT Interface Type LC LC Warm reset switch Alarm cut switch Usage Receives optical signals. The pluggable optical module is used for easy maintenance. Transmits optical signals. The pluggable optical module is used for easy maintenance. Press the switch to reset the SCC unit. Press the switch to mute the alarm. Press the switch for three seconds to mute the alarm permanently. Press the switch again for three seconds to resume the alarm sound.

9.9.6 Valid Slots

The CXLQ1 can be housed in any of slots 45 in the subrack.

9.9.7 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code of the CXLQ1 indicates the optical interface type. Table 9-100 lists the relation between the board feature code and optical interface type of the CXLQ1.

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Table 9-100 Relation between the board feature code and the optical interface type Board Barcode SSR1CXLQ110 SSR1CXLQ111 SSR1CXLQ112 SSR1CXLQ113 SSR1CXLQ114 Feature Code 10 11 12 13 14 Optical Interface Type S-1.1 (LC) L-1.1 (LC) L-1.2 (LC) Ve-1.2 (LC) I-1 (LC)

9.9.8 Board Configuration Reference

The physical slot that houses the CXLQ1 is different from the logical slot displayed on the T2000. You can use the T2000 to set parameters for the CXLQ1.

Displayed Slot
The CXLQ1 is housed in one slot in the subrack. The logical boards for the CXLQ1 are the R1SLQ41, RCXL and GSCC. Table 9-101 lists the logical slots displayed on the T2000. Table 9-101 Logical slots displayed on the T2000 for the CXLQ1 Board CXLQ1 Logical Board R1SLQ41 RCXL GSCC Logical Slot Slots 45 Slots 8081 Slots 8283

Board Parameters
l l l

J1 byte C2 byte Clock parameters

For details on the parameters, refer to F Board Configuration Reference.

9.9.9 Technical Specifications

The technical specifications for the CXLQ1 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications

Table 9-102 lists the specifications for the optical interfaces of the CXLQ1.
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Table 9-102 Specifications for the optical interfaces of the CXLQ1 Item Nominal bit rate Line code Optical interface type Working wavelength (nm) Optical source type Mean launched optical power (dBm) Receiver sensitivity (dBm) Min. overload (dBm) Min. extinction ratio (dB) Specification 155520 kbit/s NRZ I-1 1260 to 1360 MLM, LED 15 to 8 S-1.1 1261 to 1360 MLM 15 to 8 L-1.1 1263 to 1360 MLM, SLM 5 to 0 L-1.2 1480 to 1580 SLM 5 to 0 Ve-1.2 1480 to 1580 SLM 3 to 0

23 8 8.2

28 8 8.2

34 10 10

34 10 10

34 10 10

Cross-Connect Capacity
The cross-connect capacity of the CXLQ1 is as follows:
l l l

Higher order cross-connect capacity: 15 Gbit/s Lower order cross-connect capacity: 5 Gbit/s Access capacity: 10 Gbit/s

Clock Access Capability

The clock access capability of the CXLQ1 is described as follows:
l l

External input clock: two channels, 2048 kbit/s or 2048 kHz External output clock: two channels, 2048 kbit/s or 2048 kHz

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specification for the CXLQ1 is as follows:
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l l

9 Cross-Connect and System Control Boards

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 1.0

Power Consumption
At the normal temperature (25), the maximum power consumption for the CXLQ1 is 50W.

9.10 CXLQ4
This section describes the CXLQ4, an integrated board of the SCC, cross-connect, clock and line units, in terms of the version, principle, function, principle, front panel and specifications. 9.10.1 Version Description The functional version of CXLQ4 board is R1. 9.10.2 Function and Feature The CXLQ4 is used to process SDH signals, control communication, groom services, and to input and output the clock. 9.10.3 Working Principle and Signal Flow The CXLQ4 consists of the SDH overhead processing module, RST, MST and so on. 9.10.4 Jumper and DIP Switch On the CXLQ4, there are a jumper and a DIP switch, which are used to set the input voltage and running state of the board. 9.10.5 Front Panel On the front panel of the CXLQ4 board, there are indicators, interfaces, barcode, functional button switch, laser safety class label, and CF card slot. 9.10.6 Valid Slots The CXLQ4 can be housed in any of slots 45 in the subrack. 9.10.7 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the CXLQ4 indicates the optical interface type. 9.10.8 Board Configuration Reference The physical slot that houses the CXLD4 is different from the logical slot displayed on the T2000. You can use the T2000 to set parameters for the CXLQ4. 9.10.9 Technical Specifications The technical specifications for the CXLQ4 cover the optical interface specifications, board dimensions, weight and power consumption.

9.10.1 Version Description

The functional version of CXLQ4 board is R1.

9.10.2 Function and Feature

The CXLQ4 is used to process SDH signals, control communication, groom services, and to input and output the clock.
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SDH Processing Unit

Table 9-103 lists the function and feature of the SDH processing unit of the CXLQ4. Table 9-103 Function and feature of the SDH processing unit of the CXLQ4 Function and Feature Basic function Specification of the optical interface Specification of the optical module CXLQ4 Transmits and receives 4 x STM-4 optical signals. Supports the optical interfaces of the I-4, S-4.1, L-4.1, L-4.2, and Ve-4.2 types.
l

Supports detection and query of the information on the optical module. Supports the function of setting the on/off state of the laser and the ALS function.

Service processing Overhead processing

Supports the processing of the VC-12, VC-3, VC-4 services and VC4-4c concatenation services..
l l

Supports the processing of the SOH bytes of the STM-4 signals. Supports the transparent transmission and termination of the POH bytes. Supports the setting and query of the J0/J1/C2 bytes.

Alarm and performance event Protection scheme

Provides rich alarms and performance events for easy management and maintenance of the equipment. Supports multiple protection modes such as two-fiber MSP protection ring, four-fiber MSP protection ring, linear MSP protection, and SNCP..
l l

Maintenance feature

Supports inloop and outloop for optical interfaces. Supports the warm reset and cold reset. The warm reset does not affect services. Supports the function of querying the manufacturing information of the board. Supports the in-service loading of the FPGA. Supports the upgrade of the board software without affecting services.

l l

SCC Unit
Table 9-104 lists the function and feature of the SCC unit of the CXLQ4.

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Table 9-104 Function and feature of the SCC unit of the CXLQ4 Function and Feature Basic function Specification of the optical interface CXLQ4 Configures and monitors services, monitors the service performance, and collects performance events and alarm information.
l

Provides 10M/100M compatible Ethernet NMS interface, which is present on AUX. Provides one 10M/100M Ethernet interface, which is used for inter-board communication and present on AUX board. Provides one 10M Ethernet interface, which is used for communication between the active and standby SCC boards and present on AUX board. Provides the RS232 OAM interface that is present on the AUX board to connect to the PC or workstation. Supports the remote maintenance by using the RS232 DCE modem. Supports receiving the BIP-8 check for the overhead of the SCC unit, and provides the interface to query the check result.

Maintenance feature DCC processing capability Fan alarm management PIU management Protection scheme

Supports the CF card, and supports the package loading function. The capacity is 512 MB and can be expanded to 1 GB. Processes 40-channel DCC. Manages fan alarms. Provides the in-service check function for the PIU board, and the failure check function for the lightning protection module of the PIU. Supports 1+1 hot backup for the SCC unit.

Cross-Connect Unit
Table 9-105 lists the function and feature of the cross-connect unit of the CXLQ4. Table 9-105 Function and feature of the cross-connect unit of the CXLQ4 Function and Feature Basic function CXLQ4 Completes 15 Gbit/s non-blocking full cross-connection at the VC-4 level, and 5 Gbit/s non-blocking full cross-connection at the VC-12 or VC-3 level. Provides two 4M HDLC fast emergency channels, which are used for the MSP and SNCP protection switching.

Fast emergency channel

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Function and Feature Service processing

CXLQ4
l l l l l

Dynamically grooms services. Adds or deletes services without interrupting services. Supports the SNCP protection at the VC-3 and VC-12 levels. Supports a maximum of 1024 SNCP protection pairs. Supports VC-4-4c concatenation services.

Protection scheme

Supports the 1+1 hot backup (non-revertive) for the cross-connect unit.

Clock Unit
Table 9-106 lists the function and feature of the clock unit of the CXLQ4. Table 9-106 Function and feature of the clock unit of the CXLQ4 Function and Feature Basic function Other function CXLQ4 Provides standard system synchronization clock. Supports the extraction, insertion and management of the SSM and clock ID. Supports transmitting the DCC overhead information at a twochannel external clock interface. Input and output
l

Inputs two-channel 2048 kHz or 2048 kbit/s timing signals, and selects the external timing source. Outputs two-channel 2048 Hz or 2048 kbit/s timing signals.

9.10.3 Working Principle and Signal Flow

The CXLQ4 consists of the SDH overhead processing module, RST, MST and so on. Figure 9-43 shows the block diagram for the functions of the CXLQ4.

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Figure 9-43 Block diagram for the functions of the CXLQ4

38MHz OSC
Time & synchronizaton (SETS) T1 T2 T3 T4(Clock external output) T0 Line units Tributary units PIU AUX

SETG

Frame header T0 (reference clock)

Service units Service units

155MHz PLL

155 MHz 16x155 Mbit/s data

SDH overhead processing module

Cross-connect unit A high speed bus

high speed bus

STM-1

Another CXL unit

O/E

DEMUX

RST
STM-1 16x155 Mbit/s data

MST

MSA

HPT

O/E

MUX

XC Cross Connect (HPC)

high speed bus SCC unit Another connect unit

K1/K2 insertion/ extration

Performance report

Laser shut down

K1/K2 bytes

DCC

XC Cross Connect (LPC)

high speed bus Cross-connect unit B

Laser control

K1/K2 bytes process

DCC process

DCC

Line unit

ETH channels comunication

Other unit Another CXL

Communication and control module

Master and slaver board comunication

ETH interface OAM interface

AUX AUX

F&f interface

Power monitor

Phone interface S1-S4 interface

EOW

Boot ROM

FLASH

RAM

NVRAM

+3.3 V +5V +1.6V +1.8V +1.2V

DC/DC converter

Fuse

-48 V/-60V -48 V/-60V

DC/DC converter

The function modules are described as follows:

Synchronous Timing Unit

The synchronous timing unit provides system clock T0 to the service board, the control unit and the cross-connect unit in central timing distribution mode. This unit also selects one from 12 reference clock sources as the reference clock for synchronous timing. The 12 reference clock sources are from the line board (T1), the tributary board (T2), the external synchronous clock source (T3) and so on. The synchronous system clock source (T0) and 2 M external synchronous source (T4) are generated. The boards apply 1 + 1 hot backup. Therefore, both the active and the standby boards tracing the same reference source to ensure the identity between the system clocks of the active and the standby boards. The synchronous timing unit can extract timing from three types of timing signal:
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l l l

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Timing signal (T1) from STM-N Timing signal (T2) from PDH Reference signal (T3) from external synchronous clock source (2MHz or 2Mbit/s)

The clock module outputs:

l l

T0, system clock (38 MHz) T4, external timing (2 Mbit/s or 2 MHz) output by line

O/E Conversion Module

l l

In receive direction, it converts the received optical signals into electrical signals. In transmit direction, it converts the electrical signals into SDH optical signals, and then send optical signals to fibers for transmission. The SPI detects the R_LOS alarm and provides the laser shut down function.

MUX/DEMUX Module
l

In receive direction, the DEMUX part demultiplexes the high rate electrical signals into multiple parallel electrical signals, and recovery the clock signal at the same time. In transmit direction, the MUX part multiplexes the parallel electrical signals received from the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing Module

It includes RST, MST, MSA and HPT, provides inloop and outloop function.
l

RST

In receiving direction, performs frame alignment detection (A1, A2), regenerator section trace recovery (J0) and mismatch detection, BIP-8 errored block count. In transmitting direction, it performs frame alignment insertion, regenerator section path trace insertion, BIP-8 calculation and insertion. In receiving direction, performs BIP-24 errored block count, MS_REI recovery, MS_RDI and MS_AIS detection. In transmitting direction, it performs BIP-24 calculation and insertion, MS_REI, MS_RDI and MS_AIS insertion. Provides extraction or insertion of K1 byte and K2 byte. In receiving direction, performs AU4's pointer interpretation, LOP and AIS detection, pointer justification. In transmitting direction, it performs AUG assembly, AU-4 pointer regeneration, AU_AIS generation. OH termination J1 path trace message recovery REI information recovering
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MST

MSA

HPT

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HP_RDI detection (path status monitoring UNEQ and AIS detection (signal label monitoring) VC-4 BIP-8 errored block count

Communication and Control Module

l l l l l

Traces the clock signal from the active and the standby cross-connect unit. Implements laser controlling function. Selects the clock and frame header from the active or the standby cross-connect units. Controls the indicator on the board. CPU control unit, which controls and monitors other function modules. The unit also initializes other function modules after power on. ETH interface, which provides 10/ 100 Mbit/s Ethernet interface for network management. OAM interface, which provides serial port for network management. This port can be used as the MODEM port and thus can be configured as a serial port to connect to MODEM port in running state. COM interface for commissioning port Ethernet port for inter-board communication: 10 Mbit/s Ethernet port between the active and the standby CXLL unit. Supports receiving the BIP-8 check for the overhead of the SCC unit, and provides the interface to query the check result.

l l

l l

Cross-connect Module
The cross-connect module consists of two parts:
l

SNCP module, which tests relative alarms and reports the alarm to software to trigger SNCP switching Higher and lower order cross-connect module, which performs the functions of higher and lower order cross-connect units. This module consists of higher order cross-connect unit and lower order cross-connect unit.

Figure 9-44 illustrates the block diagram of higher and lower order cross-connect modules.

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Figure 9-44 Block diagram of higher and lower order cross-connect modules
Time & synchronizaton (SETS) T1 T2 T3 T4(Clock external output) T0 Line units

38MHz OSC

Tributary units PIU AUX

SETG

Frame header T0 (reference clock)

Service units Service units

155MHz PLL

155 MHz 16x155 Mbit/s data

SDH overhead processing module

Cross-connect unit A high speed bus

high speed bus

STM-16

Another CXL unit

O/E

DEMUX

RST
16x155 Mbit/s data

MST

MSA

HPT

STM-16

O/E

MUX

XC Cross Connect (HPC)

high speed bus SCC unit Another connect unit

K1/K2 insertion/ extration

Performance report

Laser shut down

K1/K2 bytes

DCC

XC Cross Connect (LPC)

high speed bus

Cross-connec unit B

Laser control

K1/K2 bytes process

DCC process

DCC

Line unit

ETH channels comunication

Other unit

Communication and control module

Master and slaver board comunication

Another CXL

ETH interface OAM interface

AUX AUX

F&f interface

Power monitor

Phone interface S1-S4 interface

EOW

Boot ROM

FLASH

RAM

NVRAM

+3.3 V +5V +1.6V +1.8V +1.2V

DC/DC converter

Fuse

-48 V/-60V -48 V/-60V

DC/DC converter

The upper half part is the higher order cross-connect unit, which fully cross-connects 15 G higher order services with VC-4 as the minimum service grooming granularity. The lower half part is the lower order cross-connect unit, which cross-connects 5 G lower order services.

Other Functions
l

Responses to and processes k bytes

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9 Cross-Connect and System Control Boards

Collects performance data of the optical module and shuts output of the optical module Collects and processes DCC of each board Inserts the DCC back into each line board after processing Monitors the power supply of the board Resets the unit Cuts alarms

DC/DC Converter Module

This module provides the board with required DC voltages. It converts the 48/60 V power supply to the following voltages: +5V, +1.6V, +1.8V +1.2V and+3.3V.

CF Card
The CF card serves as the storage area of the database, system parameters, NE software package, logs and black box. The capacity is 512 MB and can be expanded to 1 GB.

9.10.4 Jumper and DIP Switch

On the CXLQ4, there are a jumper and a DIP switch, which are used to set the input voltage and running state of the board.

CAUTION
Jumpers are used for test and maintenance. Do not change the setting of jumpers at random. Otherwise, the board may become faulty. Figure 9-45 shows the layout of the J7 jumper and DIP switch SW2 on the CXLQ4 board. Figure 9-45 Jumper and DIP switch of the CXLQ4 board
Power module

CPU

1 2 3 4

SW2

1 2 3

J7
CF card

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Table 9-107 lists the jumper on the CXLQ4 board. Table 9-107 Jumper on the CXLQ4 board Jumper J7 Function Enable the battery. Description 1-2: When jumpers 2 and 3 are capped, the battery is enabled.

Table 9-108 lists the DIP switch on the CXLQ4 board. Table 9-108 DIP switch on the CXLQ4 board DIP Switch SW2 Function Set the board running state. Description On: indicates the binary value 1. The DIP switch adopts four bits, which are queued according to the switch numbering. The number 4 indicates the highest bit. For details, refer to Table 9-109.

Table 9-109 Description of DIP switch SW2 Value 0b0000 0b0001 0b0011 0b0100 0b1011 0b1100 0b1101 0b1110 0b1111 Description Indicates the running state when the watchdog is started. It is the default state. Changes to the self-test state of the SDRAM Burst. Indicates the commissioning state. Indicates the running state when the watchdog is stopped. Erases the database. Erases the NE software, including the patch. Erases the database and NE software (including the patch). Erases the database, NE software and NE.ini file. Erases the extended BIOS and system parameter zone in the file system and FLASH memory.

9.10.5 Front Panel

On the front panel of the CXLQ4 board, there are indicators, interfaces, barcode, functional button switch, laser safety class label, and CF card slot.
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Appearance of the Front Panel

Figure 9-46 shows the front panel of the CXLQ4 board. Figure 9-46 Front panel the CXLQ4 board
CXLQ4
STAT ACTX ACTC PROG SRVX SRVL SYNC ALMC
CLASS 1 LASER PRODUCT

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4

CF R/W RESET ALM CUT

CXLQ4

Indicators
The following indicators are present on the front panel of the board:
l l

Board hardware state indicator (STAT), which is green or red when lit. Activating state indicator for the services at the cross-connect unit (ACTX), which is green when lit. Active/standby state indicator for the SCC units (ACTC), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Alarm indicator (SRVX) for services at the cross-connect unit, which is red, green or yellow when lit. Alarm indicator (SRVL) for services at the line units , which is red, green or yellow when lit. Synchronization clock state indicator (SYNC), which is red or green when lit. Alarm cutting indicator (ALMC), which is yellow when lit.

l l l

l l

For indication of these indicators, see A Equipment and Board Alarm Indicators.

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CF Card Read-Write Indicator (CF R/W)

State On (green) Flash (green) On (red) Description The CF card is in the read/write state of the system. The system is reading data from or writing data to the CF card. The CF card is off-line or is in the read/write prohibited state. The CF card is in the pluggable state. Flash (red) The system is processing the data after receiving the instruction for pre-processing data from the CF card.

Interfaces
On the front panel of the CXLQ4, there are one optical interface and two switches. Table 9-110 lists the type and usage of the optical interface and switches on the CXLQ4. Table 9-110 Optical interface and switches on the CXLQ4 Interface IN OUT RESET ALM CUT Interface Type LC LC Warm reset switch Alarm cut switch Usage Receives optical signals. The pluggable optical module is used for easy maintenance. Transmits optical signals. The pluggable optical module is used for easy maintenance. Press the switch to reset the SCC unit. Press the switch to mute the alarm. Press the switch for three seconds to mute the alarm permanently. Press the switch again for three seconds to resume the alarm sound.

9.10.6 Valid Slots

The CXLQ4 can be housed in any of slots 45 in the subrack.

9.10.7 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code of the CXLQ4 indicates the optical interface type. Table 9-111 lists the relation between the board feature code and optical interface type of the CXLQ4.

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Table 9-111 Relation between the board feature code and the optical interface type Board Barcode SSR1CXLQ410 SSR1CXLQ411 SSR1CXLQ412 SSR1CXLQ413 SSR1CXLQ414 Feature Code 10 11 12 13 14 Optical Interface Type S-4.1 (LC) L-4.1 (LC) L-4.2 (LC) Ve-4.2 (LC) I-4 (LC)

9.10.8 Board Configuration Reference

The physical slot that houses the CXLD4 is different from the logical slot displayed on the T2000. You can use the T2000 to set parameters for the CXLQ4.

Displayed Slot
The CXLQ4 is housed in one slot in the subrack. The logical boards for the CXLQ4 are the R1SLQ41, RCXL and GSCC. Table 9-112 lists the logical slots displayed on the T2000. Table 9-112 Logical slots displayed on the T2000 for the CXLQ1 Board CXLQ4 Logical Board R1SLQ41 RCXL GSCC Logical Slot Slots 45 Slots 8081 Slots 8283

Board Parameters
l l l

J1 byte C2 byte Clock parameters

For details on the parameters, refer to F Board Configuration Reference.

9.10.9 Technical Specifications

The technical specifications for the CXLQ4 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications

Table 9-113 lists the specifications for the optical interfaces of the CXLQ4.
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Table 9-113 Specifications for the optical interfaces of the CXLQ4 Item Nominal bit rate Line code Optical interface type Working wavelength (nm) Optical source type Mean launched optical power (dBm) Receiver sensitivity (dBm) Min. overload (dBm) Min. extinction ratio (dB) Specification 622080 kbit/s NRZ I-4 1260 to 1360 MLM 15 to 8 S-4.1 1274 to 1356 MLM 15 to 8 L-4.1 1280 to 1335 SLM 3 to 2 L-4.2 1480 to 1580 SLM 3 to 2 Ve-4.2 1480 to 1580 SLM 3 to 2

23 8 8.2

28 8 8.2

28 18 10

28 8 10

34 13 10.5

Cross-Connect Capacity
The cross-connect capacity of the CXLQ4 is as follows:
l l l

Higher order cross-connect capacity: 15 Gbit/s Lower order cross-connect capacity: 5 Gbit/s Access capacity: 10 Gbit/s

Clock Access Capability

The clock access capability of the CXLQ4 is described as follows:
l l

External input clock: two channels, 2048 kbit/s or 2048 kHz External output clock: two channels, 2048 kbit/s or 2048 kHz

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications for the CXLQ4 are as follows:
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Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg):1.0kg

Power Consumption
At the normal temperature (25), the maximum power consumption for the CXLQ4 is 50W.

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10
About This Chapter

Auxiliary Boards

This chapter describes the auxiliary boards, such as the EOW, AUX, AMU, and FANA. 10.1 EOW This section describes the EOW, an orderwire processing board, in terms of the version, function, principle, front panel and specifications. 10.2 AUX This section describes the AUX, a system auxiliary interface board, in terms of the version, function, working principle, front panel and specifications. 10.3 AMU This section describes the AMU, an orderwire processing and alarm concatenation board, in terms of the version, function, principle, front panel and specifications. 10.4 FAN This section describes the FAN, a fan control board, in terms of the version, function, principle, front panel, configuration and specifications.

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10.1 EOW
This section describes the EOW, an orderwire processing board, in terms of the version, function, principle, front panel and specifications. 10.1.1 Version Description The functional version of the EOW is R1. 10.1.2 Function and Feature The EOW is used to extract, insert, and process the overhead bytes E1 and E2, and other data bytes. 10.1.3 Working Principle and Signal Flow The EOW consists of the clock module, switch module, OHP module, and DC/DC converter module. 10.1.4 Front Panel On the front panel of the EOW, there are indicators and interfaces. 10.1.5 Valid Slots The EOW can be housed in slot 9 in the subrack. 10.1.6 Technical Specifications The technical specifications of the EOW cover the board dimensions, weight and power consumption.

10.1.1 Version Description

The functional version of the EOW is R1.

10.1.2 Function and Feature

The EOW is used to extract, insert, and process the overhead bytes E1 and E2, and other data bytes. Table 10-1 lists the functions and features of the EOW. Table 10-1 Functions and features of the EOW Function and Feature Auxiliary interface Orderwire interface Overhead processing EOW Provides four broadcast data interfaces (Serial 14). Provides one orderwire interface. Processes the E1, E2, and Serial 14 bytes.

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10.1.3 Working Principle and Signal Flow

The EOW consists of the clock module, switch module, OHP module, and DC/DC converter module. Figure 10-1 shows the block diagram for the functions of the EOW. Figure 10-1 Block diagram for the functions of the EOW
Clock module
Reference clock and frame header CXL unit A/B

S1~S4 interface

S1~S4

Phone interface

OHP module
E1/E2

Switch module

CXL unit A/B

SLIC

+3.3 V +5 V +1.8 V

+3.3 V

DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V

DC/DC converter

Fuse

+3.3 V backup power from AUX

Clock Module
The clock module first divides frequencies of the system clock and header sent from the crossconnect board. The system clock and header are then transmitted to other modules as OHP Process module and the switch module.

Switch Module
The switch module performs non-blocking switching of 4096 x 4096 or 1024 x 1024 timeslots under control of micro processor. The switch module can switch any timeslot of overhead signal sent from the SCC to any timeslot of output overhead signals.

OHP Module
l l l l l

Processes E1 and E2 bytes sent by the CXL board. Realizes interconnection between orderwire audio interface. Interconnects with orderwire phone port through SLIC unit. Processes serial1serial4 sent from the CXL board. Provides S1S4 as RS232/RS422 serial transparent data interfaces, the level of which can be set by software.

DC/DC Converter
Through the DC/DC converter module, the power converting module generates required DC voltages for each chip. The following DC voltages are provided: +1.8 V, +3.3 V, +5 V. In addition, protection is provided to board +3.3 V power supply.
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10.1.4 Front Panel

On the front panel of the EOW, there are indicators and interfaces.

Appearance of the Front Panel

Figure 10-2 shows the appearance of the front panel of the EOW. Figure 10-2 Front panel of the EOW

EOW
STAT PROG

PHONE S1 S2 S3 S4
EOW

Indicators
The following indicators are present on the front panel of the board:
l l l l

Board hardware state indicator (STAT), which is green or red when lit. Board software state indicator (PROG), which is green or red when lit. Connection status indicator (LINK), which is green when lit. Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are five interfaces on the front panel of the EOW. Table 10-2 lists the type and usage of these interfaces.

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Table 10-2 Interfaces on the front panel of the EOW Interface PHONE S1 S2 S3 S4 Interface Type RJ-11 RJ-45 RJ-45 RJ-45 RJ-45 Usage Orderwire phone interface Broadcast data interface S1 Broadcast data interface S2 Broadcast data interface S3 Broadcast data interface S4

Table 10-3 lists the pins of the PHONE interface. Table 10-3 Pins of the PHONE interface of the EOW Front View Pin 4 5 13 and 68 Usage Signal 1 Signal 2 Not defined

Table 10-4 lists the pins of the S1, S2, S3 and S4 interfaces. Table 10-4 Pins of the S1, S2, S3 and S4 interfaces of the EOW Front View Pin 1 2 3 4
8 7 6 5 4 3 2 1

Usage RS-422 data transmitting positive RS-422 data transmitting negative RS-422 data receiving positive RS232 data receive end Grounding RS-422 data receiving negative Not defined RS232 data transmit end

5 6 7 8

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10.1.5 Valid Slots

The EOW can be housed in slot 9 in the subrack.

10.1.6 Technical Specifications

The technical specifications of the EOW cover the board dimensions, weight and power consumption.

Mechanical Specifications
The mechanical specifications of the EOW are as follows:
l l

Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W) Weight (kg): 0.4

Power Consumption
In the normal temperature (25), the maximum power consumption of the EOW is 10 W.

10.2 AUX
This section describes the AUX, a system auxiliary interface board, in terms of the version, function, working principle, front panel and specifications. 10.2.1 Version Description The AUX has two versions, R1 and R2. 10.2.2 Function and Feature The AUX is used to provide various management and auxiliary interfaces, and to provide the central backup of the +3.3 V power supply for the boards in the subrack. 10.2.3 Working Principle and Signal Flow The AUX consists of the control module, communication module, DC/DC converter module and so on. 10.2.4 Front Panel On the front panel of the AUX, there are many types of interfaces. 10.2.5 Valid Slots The AUX can be housed in slot 10 in the subrack. 10.2.6 Technical Specifications The technical specifications of the AUX cover the board dimensions, weight and power consumption.

10.2.1 Version Description

The AUX has two versions, R1 and R2. The R1AUX and R2AUX are two versions developed in different periods. The two versions can be replaced by each other.
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10.2.2 Function and Feature

The AUX is used to provide various management and auxiliary interfaces, and to provide the central backup of the +3.3 V power supply for the boards in the subrack. Table 10-5 lists the functions and features of the AUX. Table 10-5 Functions and features of the AUX Item Management interface Clock interface Alarm interface Commissioning interface Internal communication Backup and check of the power supply AUX Provides the OAM/F&f interface, which supports the X.25 protocol. Provides the ETH NMS interface. Provides two BITS clock input interfaces and two BITS clock output interfaces (impedance: 120 ohms). Provides three alarm input and one alarm output interfaces. Provides one commissioning COM interface. Realizes the inter-board communication among boards in the subrack. Monitors the two independent 48 power supplies in the subrack, and performs the overvoltage (72 V) check and undervoltage (38.4 V) check. Provides the central backup of the +3.3 V power supply for the boards in the subrack, which is the 1:N protection for the secondary power supply of each board. The power of the +3.3 V power supply is 80 W. Performs the overvoltage (3.8 V) check and undervoltage (3.1 V) check on the output of the +3.3 V backup power supply. Audible alarm Supports the audible alarm and the clearing of the audible alarm.

10.2.3 Working Principle and Signal Flow

The AUX consists of the control module, communication module, DC/DC converter module and so on. Figure 10-3 shows the block diagram for the functions of the R1AUX.

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Figure 10-3 Block diagram for the functions of the R1AUX

F&f/OAM interface CLK interface 3 x input and 1 x output CXL CXL

Housekeeping input/output

-48 V/BAK 3.3 V power test & thunder-proof test

-48 V/ -60 V

Control module

COM interface ETH interface

100/10 Mbit/s

2 X 100/10 Mbit/s

CXL

Communication module
100/10 Mbit/s 100/10 Mbit/s Ehernet bus Other unit +3.3 V

+1.8 V

DC/DC converter

DC/DC converter

Fuse

-48 V/ -60 V -48 V/ -60 V +3.3 V backup power

Figure 10-4 shows the block diagram for the functions of the R2AUX.

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Figure 10-4 Block diagram for the functions of the R2AUX

F&f/OAM interface CLK interface 3 x input and 1 x output CXL CXL

Housekeeping input/output

-48 V/BAK 3.3 V power test & thunder-proof test

-48 V/ -60 V

Control module

CXL

COM interface ETH interface

100/10 Mbit/s

2 x 100/10 Mbit/s

CXL

Communication module
100/10 Mbit/s 100/10 Mbit/s Ehernet bus Other unit -48 V/ -60 V -48 V/ -60 V +3.3 V backup power

+3.3 V +1.8 V

DC/DC converter

DC/DC converter

Fuse

The function modules of the R1AUX board are described below:

Communication Module
This module applies LAN Switch principle to construct inter-board communication for the OptiX OSN 1500. This module provides:
l

13 x 10/100 Mbit/s FE interfaces (12 for other boards and 1 for the local board) to connect the SCC, the cross-connect, the line and the tributary boards for inter-board communication of the OptiX OSN 1500. 2 x 10/100 Mbit/s FE interfaces on the front panel. One interface is the commissioning network interface for service slots, which forms a VLAN with the 13 inter-board communication network interfaces. The other interface is the interface for network management. 2 x 10/100 Mbit/s FE interfaces to connect network interfaces of the CXLA and the CXLB boards. These two interfaces and one network interface on the front panel are of the same VLAN.

Control Module
The control module mainly consists of CPUs and monitors the running state of the board.

Alarm Input and Output Module

This module reads and sets 3 x input and 1 x output alarms.
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Detection of 48 V and Backup +3.3 V Powers and Lightening Protection Module

This module detects:
l l

Over-voltage and under-voltage of 48 V and backup +3.3 V powers System lightening protection fault

Other Function
l l l l

F&f interface OAM serial interface for network management Two-in and two-out BITS clock interface (120 ohms) COM, ETH, F&f and OAM interfaces

DC/DC Converter Module

Through the DC/DC converter module, the power converting module provides required DC voltages for each chip on the board. +1.8 V and +3.3 V DC voltages are provided. It also provides 40 W/+3.3 V backup power supply for the system. The function modules of the R2AUX board are described below:

Communication Module
This module applies LAN Switch principle to construct inter-board communication for the OptiX OSN 1500. This module provides:
l

13 x 10/100 Mbit/s FE interfaces (12 for other boards and 1 for the local board) to connect the SCC, the cross-connect, the line and the tributary boards for inter-board communication of the OptiX OSN 1500. 2 x 10/100 Mbit/s FE interfaces on the front panel. One interface is the commissioning network interface for service slots, which forms a VLAN with the 13 inter-board communication network interfaces. The other interface is the interface for network management. 2 x 10/100 Mbit/s FE interfaces to connect network interfaces of the CXLA and the CXLB boards. These two interfaces and one network interface on the front panel are of the same VLAN.

Control Module
The control module mainly consists of CPLDs and reports the local board state to the CXL board through the control bus with the CXL board. This module also obtains the control information of the local board.

Alarm Input and Output Module

This module reads and sets 3 x input and 1 x output alarms.

Detection of 48 V and Backup +3.3 V Powers and Lightening Protection Module

This module detects:
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l l

10 Auxiliary Boards

Over-voltage and under-voltage of 48 V and backup +3.3 V powers System lightening protection fault

Other Function
l l l l

F&f interface OAM serial interface for network management Two-in and two-out BITS clock interface (120 ohms) COM, ETH, F&f and OAM interfaces

DC/DC Converter Module

Through the DC/DC converter module, the power converting module provides required DC voltages for each chip on the board. +1.8 V and +3.3 V DC voltages are provided. It also provides 40 W/+3.3 V backup power supply for the system.

10.2.4 Front Panel

On the front panel of the AUX, there are many types of interfaces.

Appearance of the Front Panel

Figure 10-5 shows the appearance of the front panel of the AUX. Figure 10-5 Front panel of the AUX

AUX

ETH COM CLK ALM OAM/F&f

AUX

Interfaces
There are five interfaces on the front panel of the AUX. Table 10-6 lists the type and usage of these interfaces.
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Table 10-6 Interfaces on the front panel of the AUX Interface ETH COM CLK ALM OAM/F&f Interface Type RJ-45 RJ-45 RJ-45 RJ-45 RJ-45 Usage NM interface Commissioning interface 120-ohm external clock input/output interface 3 x input and 1 x output alarm interface Serial NM and management interface

Table 10-7 lists the pins of the CLK interface. Table 10-7 Pins of the CLK interface of the AUX Front View Pin 1 2 3 4
8 7 6 5 4 3 2 1

Usage Receiving negative for 120-ohm clock 1 Receiving positive for 120-ohm clock 1 Receiving negative for 120-ohm clock 2 Transmitting negative for 120-ohm clock 1 Transmitting positive for 120-ohm clock 1 Receiving positive for 120-ohm clock 2 Transmitting negative for 120-ohm clock 2 Transmitting positive for 120-ohm clock 2

5 6 7 8

Table 10-8 lists the pins of the ETH and COM interfaces. Table 10-8 Pins of the ETH and COM interfaces of the AUX Front View Pin 1 2 3 4
8 7 6 5 4 3 2 1

Usage Transmitting positive Transmitting negative Receiving positive Not defined Not defined Receiving negative
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Front View

Pin 78

Usage Not defined

Table 10-9 lists the pins of the ALM interface. Table 10-9 Pins of the ALM interface of the AUX Front View Pin 1 2 3
8 7 6 5 4 3 2 1

Usage Positive for critical and major alarm signal output Negative for critical and major alarm signal output Positive for minor and warning alarm signal output Positive for alarm signal output 1 Negative for alarm signal output 1 Negative for minor and warning alarm signal output Positive for alarm signal output 2 Negative for alarm signal output 2

4 5 6 7 8

Controlled by the software, a specific interface can be used as the OAM or F&f interface. Table 10-10 lists pins of the interface used as the OAM interface. Table 10-10 Pins of the OAM interface of the AUX Front View Pin 1 2 3 4
8 7 6 5 4 3 2 1

Usage Requests for transmission. Prepares the DTE. Transmits data. Grounds. Grounds. Receives data. Prepare the DCE. Prepares for the receiving of signals.

5 6 7 8

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Table 10-11 lists the pins of the interface used as the F&f interface. Table 10-11 Pins of the F&f interface of the AUX Front View Pin 4 5 8 13 and 67
8 7 6 5 4 3 2 1

Usage RS232 receive end Grounding end RS232 transmit end Not defined

10.2.5 Valid Slots

The AUX can be housed in slot 10 in the subrack.

10.2.6 Technical Specifications

The technical specifications of the AUX cover the board dimensions, weight and power consumption.

Mechanical Specifications
The mechanical specifications of the AUX are as follows:
l l

Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W) Weight (kg): 1.0

Power Consumption
In the normal temperature (25), the maximum power consumption of the AUX is 19 W.

10.3 AMU
This section describes the AMU, an orderwire processing and alarm concatenation board, in terms of the version, function, principle, front panel and specifications. 10.3.1 Version Description The functional version of the AMU board is R1. 10.3.2 Function and Feature The AMU is used to provide various auxiliary, orderwire and broadcast data interfaces for the equipment. 10.3.3 Working Principle and Signal Flow The AMU consists of the clock module, overhead processing module and power supply module. 10.3.4 Front Panel
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On the front panel of AMU, there are board indicators and interfaces of many types. 10.3.5 Valid Slots The AMU can be housed in slot 9 in the subrack. 10.3.6 Technical Specifications The technical specifications of the AMU cover the board dimensions, weight and power consumption.

10.3.1 Version Description

The functional version of the AMU board is R1.

10.3.2 Function and Feature

The AMU is used to provide various auxiliary, orderwire and broadcast data interfaces for the equipment. Table 10-12 lists the functions and features of the AMU. Table 10-12 Functions and features of the AMU Item Auxiliary interface Cabinet alarm indicator Orderwire interface Commissioning interface Overhead processing Backup and check of the power supply AMU Provides two broadcast data interfaces (Serial 12). Drives and concatenates the four cabinet indicators. Provides one orderwire interface. Supports the commissioning serial port and 100M commissioning network port, when connected to the AUX. Processes the E1, E2, and Serial 12 bytes. Performs the overvoltage/undervoltage check on the output of the power supply modules.

10.3.3 Working Principle and Signal Flow

The AMU consists of the clock module, overhead processing module and power supply module. Figure 10-6 shows the block diagram for the functions of the AMU.

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Figure 10-6 Block diagram for the functions of the AMU

Backplane Clock module

Reference clock

CXL unit

S1~S4 E1/E2

Overhead process module Power supply module

3.3 V

CXL unit

-48 V

+3.3 V power backup from AUX

Clock Module
The clock module extracts and processes the reference clock signals from the CXL.

Overhead Processing Module

The overhead processing module processes the E1 and E2 bytes transmitted by the CXL, and uses the orderwire bytes for the connection of the orderwire phones. This module also processes Serial1 and Serial2 bytes, provides transparent data interfaces RS232 and RS422, drives and concatenates the cabinet indicators. Figure 10-7 shows the positions of the orderwire bytes in the SDH frame. Figure 10-7 Positions of orderwire bytes in the SDH frame
A1 B1 D1 A1 A1 A2 E1 D2 AU_PTR B2 D4 D7 D10 S1 B2 B2 K1 D5 D8 D11 M1 K2 D6 D9 D12 E2 D3 Serial 1 Serial 2 A2 A2 J0

Power Supply Module

The power supply module provides supplies power to the AMU board and provides centralized +3.3 V power backup for other boards.
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10.3.4 Front Panel

On the front panel of AMU, there are board indicators and interfaces of many types.

Appearance of the Front Panel

Figure 10-8 shows the appearance of the front panel of the AMU. Figure 10-8 Front panel of the AMU

AMU
STAT PROG

PHONE S1 S2 LAMP1 LAMP2

AMU

Indicators
The following indicators are present on the front panel of the board:
l l l l

Board hardware state indicator (STAT), which is green or red when lit. Board software state indicator (PROG), which is green or red when lit. Connection status indicator (LINK), which is green when lit. Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are five interfaces on the front panel of the AMU. Table 10-13 lists the type and usage of these interfaces. Table 10-13 Interfaces on the front panel of the AMU Interface PHONE
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Interface Type RJ-11

Usage Orderwire phone interface

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Interface S1 S2 LAMP1 LAMP2

Interface Type RJ-45 RJ-45 RJ-45 RJ-45

Usage Broadcast data interface S1 Broadcast data interface S2 Cabinet alarm indicator output interface Cabinet concatenated alarm indicator input interface

Table 10-14 lists the pins of the PHONE interface. Table 10-14 Pins of the PHONE interface of the AMU Front View Pin 4 5 13 and 68 Usage Signal 1 Signal 2 Not defined

Table 10-15 lists the pins of the S1 and S2 interfaces. Table 10-15 Pins of the S1 and S2 interfaces of the AMU Front View Pin 1 2 3
8 7 6 5 4 3 2 1

Usage RS-422 data transmitting positive RS-422 data transmitting negative RS-422 data receiving positive RS232 data receive end Grounding RS-422 data receiving negative Not defined RS232 data transmit end

4 5 6 7 8

Table 10-16 lists the pins of the LAMP1 and LAMP2 interfaces.
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Table 10-16 Pins of the LAMP1 and LAMP2 interfaces of the AMU Front View Pin 1 2 3
8 7 6 5 4 3 2 1

Usage Positive for critical alarm signals Negative for critical alarm signals Positive for major alarm signals Positive for power indicator signals Negative for power indicator signals Negative for major alarm signals Positive for minor alarm signals Negative for minor alarm signals

4 5 6 7 8

Connection for Alarm Concatenation

The AMU provides the concatenation interface for the cabinet alarm indicators. Connect the LAMP1 of the subrack 2 to the LAMP2 of the subrack 1. Finally, connect the LAMP1 of the subrack 1 to the indicator interface on the top of the cabinet. Figure 10-9 shows how to connect the cabinet alarm indicators. Figure 10-9 Connection of the cabinet alarm indicators
Cabinet indicators
LAMP1 LAMP2

Subrack 2
LAMP1 LAMP2

Subrack 1 Cabinet

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10.3.5 Valid Slots

The AMU can be housed in slot 9 in the subrack.

10.3.6 Technical Specifications

The technical specifications of the AMU cover the board dimensions, weight and power consumption.

Mechanical Specifications
The mechanical specifications of the AMU are as follows:
l l

Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W) Weight (kg): 0.5

Power Consumption
In the normal temperature (25), the maximum power consumption of the AMU is 8 W.

10.4 FAN
This section describes the FAN, a fan control board, in terms of the version, function, principle, front panel, configuration and specifications. 10.4.1 Version Description The functional version of the FAN board is R1. 10.4.2 Function and Feature The FAN is used to adjust the fan speed, check the fan status, report the fault of the fan control board, and to report the off-service alarm of the fan. 10.4.3 Working Principle and Signal Flow The FAN consists of the power interface unit, soft start unit, state detecting unit and fans. 10.4.4 Front Panel There are no indicators on the front panel of the FAN. 10.4.5 Valid Slots The FAN can be housed in slot 20 in the subrack. 10.4.6 Technical Specifications The technical specifications of the FAN cover the board dimensions, weight, power consumption and working voltage.

10.4.1 Version Description

The functional version of the FAN board is R1.

10.4.2 Function and Feature

The FAN is used to adjust the fan speed, check the fan status, report the fault of the fan control board, and to report the off-service alarm of the fan. Table 10-17 lists the functions and features of the FAN.
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Table 10-17 Functions and features of the FAN Function and Feature Hot swap function Status check function Alarm check function FAN Provides the hot swap function for the fan frame. Provides the function of fan status check. Reports the fan alarm and in-service information.

10.4.3 Working Principle and Signal Flow

The FAN consists of the power interface unit, soft start unit, state detecting unit and fans. Figure 10-10 shows the block diagram for the functions of the FAN. Figure 10-10 Block diagram for the functions of the FAN
- 48 V 1 - 48 V 2 GND1 GND2 Power access unit GND Delay start unit GND Fan - 48 V

- 48 V

48 V

GND

Fan alarm signals Voltage drop unit Status detection unit

- 48 V

GND

Power Interface Unit

The power interface unit accesses the 48 V power supply for the FAN.

State Detecting Unit

This unit detects the on/off state of the fans. If any of the six fans stops, the unit reports the alarm to the CXL to indicate the off state of the fan and drives the alarm indicator.

10.4.4 Front Panel

There are no indicators on the front panel of the FAN.

Appearance of the Front Panel

The OptiX OSN equipment applies a modular fan platform.
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One OptiX OSN 1500 subrack uses one fan tray assembly. Figure 10-11 shows the appearance of the front panel of the FAN. Figure 10-11 Front panel of the FAN

FAN
RUN ALM

Indicators
The following indicators are present on the front panel of the board:
l l

Board running state (RUN), which is green when lit. Fan alarm indicator (ALM), which is red when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

10.4.5 Valid Slots

The FAN can be housed in slot 20 in the subrack.

10.4.6 Technical Specifications

The technical specifications of the FAN cover the board dimensions, weight, power consumption and working voltage.

Mechanical Specifications
The mechanical specifications of the FAN are as follows:
l l

Board dimensions (mm): 120 (H) x 220 (D) x 25.4 (W) Weight (kg): 1.0

Power Consumption
In the normal temperature (25) and with 48 V input voltage, the maximum power consumption of the FAN is 20 W.
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Working Voltage
The working voltage for the FAN can be 48 V20% DC.

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11 WDM Processing Boards

11
About This Chapter

WDM Processing Boards

This chapter describes the WDM processing boards, such as the CMR2, CMR4, MR2, MR2A, MR2B, MR2C, MR4, LWX, OBU1, and FIB. 11.1 CMR2 This section describes the TN11CMR2, a dual-channel optical add/drop multiplexing board, in terms of the version, function, principle, front panel, configuration and specifications. 11.2 CMR4 This section describes the TN11CMR4, a four-channel optical add/drop multiplexing board, in terms of the version, function, principle, front panel, configuration and specifications. 11.3 MR2 This section describes the TN11MR2, a dual-channel optical add/drop multiplexing board, in terms of the version, function, principle, front panel, configuration and specifications. 11.4 MR2A This section describes the MR2A, a dual-channel optical add/drop multiplexing board, in terms of the version, function, principle, front panel, configuration and specifications. 11.5 MR2B This section describes the MR2B, a dual-channel optical add/drop multiplexing board, in terms of the version, function, principle, front panel, configuration and specifications. 11.6 MR2C This section describes the MR2C, a dual-channel optical add/drop multiplexing board, in terms of the version, function, principle, front panel, configuration and specifications. 11.7 MR4 This section describes the TN11MR4, a four-channel optical add/drop multiplexing board, in terms of the version, function, principle, front panel, configuration and specifications. 11.8 LWX This section describes the LWX, an arbitrary rate wavelength converting board, in terms of the version, function, principle, front panel, configuration and specifications. 11.9 OBU1
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This section describes the TN11OBU1, an optical booster amplifier board, in terms of the version, function, principle, front panel, configuration and specifications. 11.10 FIB This section describes the FIB, a wavelength filter and isolation board, in terms of the version, function, principle, front panel, configuration and specifications.

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11.1 CMR2
This section describes the TN11CMR2, a dual-channel optical add/drop multiplexing board, in terms of the version, function, principle, front panel, configuration and specifications. 11.1.1 Version Description The functional version of the CMR2 board is TN11. 11.1.2 Function and Feature The CMR2 is used to the dense wavelength division multiplexing (DWDM) system. The spacing wavelength is 20 nm. The CMR2 supports functions and features such as add/drop multiplexing and channel expansion. 11.1.3 Working Principle and Signal Flow The CMR2 consists of the OADM optical module, control and communication module, and DC/ DC converter module. 11.1.4 Front Panel On the front panel of the CMR2, there are board indicators, interfaces and laser safety class label. 11.1.5 Valid Slots The CMR2 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, or any of slots 1113 in the OptiX OSN 1500B subrack. 11.1.6 Board Feature Code The board feature code of the CMR2 contains eight characters, which indicate the wavelengths for the 2-channel optical signals processed by the board. 11.1.7 Technical Specifications The technical specifications of the CMR2 cover the optical interface specifications, board dimensions, weight, power consumption and laser safety class.

11.1.1 Version Description

The functional version of the CMR2 board is TN11.

11.1.2 Function and Feature

The CMR2 is used to the dense wavelength division multiplexing (DWDM) system. The spacing wavelength is 20 nm. The CMR2 supports functions and features such as add/drop multiplexing and channel expansion. Table 11-1 lists the functions and features of the CMR2. Table 11-1 Functions and features of the CMR2 Function and Feature Basic function CMR2 Adds/Drops two wavelengths to/from the multiplexed signals.

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Function and Feature Channel expansion

CMR2 Provides the intermediate port used for expansion. Under certain conditions, the capacity of upstream and downstream channels can be expanded when the intermediate port is connected to other optical add/drop multiplexing boards.

11.1.3 Working Principle and Signal Flow

The CMR2 consists of the OADM optical module, control and communication module, and DC/ DC converter module. Figure 11-1 shows the block diagram for the functions of the CMR2. Figure 11-1 Block diagram for the functions of the CMR2
D01 D02 MO MI A01 A02

IN

Drop OADM module

Add

OUT

Control and communication module

Power supply module +5 V DC/DC converter Delayed startup Fuse SCC

Back plane

-48 V/-60 V

-48 V/-60 V

SCC

The CMR2 mainly includes the optical add/drop multiplexer (OADM) module adding/dropping two channels of signals. The OADM adds/drops and multiplexes two channels of signals. It also provides concatenation interfaces to connect other add/drop multiplexing boards for more powerful add/drop capability. The CMR2 is a passive board that has no interface with the backplane.

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OADM module
The board receives through IN one multiplexed optical signal that travels from the upstream station. The Drop optical module drops through optical interfaces D01 and D02 two wavelengths from the signal. These two dropped wavelengths are output from the MO optical interface. The MI optical interface receives one multiplexed signal that travels over the main optical path. The Add optical module adds two wavelengths through optical interfaces A01 and A02 and multiplexes them with the signal in the main optical path into one signal. This multiplexed signal is output through OUT.

Control and communication module

l l

Controls the entire board operation. Collects the information, such as the alarms and performance events, working status, and voltage detection, of each functional module of the board. Communicates data with the SCC.

DC/DC converter module

Converts 48 V DC or 60 V DC to a voltage required by each module of the board.

11.1.4 Front Panel

On the front panel of the CMR2, there are board indicators, interfaces and laser safety class label.

Appearance of the Front Panel

Figure 11-2 shows the appearance of the front panel of the CMR2.

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Figure 11-2 Front panel of the CMR2

CMR2
STAT

LASER RADIATION
DO NOT VIEW DIRECTLY WITH OPTICAL INSTRUMENTS

CLASS 1M LASER PRODUCT

OUT IN MO MI D1 A1 D2 A2

CMR2

Indicator
On the front panel of the CMR2, there is one board hardware state indicator (STAT), which is red or green when lit. For indication of the indicator, see A Equipment and Board Alarm Indicators.

Interfaces
There are eight optical interfaces on the front panel of the CMR2. Table 11-2 lists the type and usage of the optical interfaces.

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Table 11-2 Optical interfaces of the CMR2 Interface A1A2 D1D2 IN OUT MO MI Interface Type LC LC LC LC LC LC Usage Receive the signals output from the optical wavelength converting board or centralized client-side equipment. Transmit signals to the optical wavelength converting board or centralized client-side equipment. Receives multiplexed signals. Transmits multiplexed signals. Acts as a concatenation output optical interface and connects to the input optical interfaces of other OADM boards. Acts as a concatenation input optical interface and connects to the output optical interfaces of other OADM boards.

11.1.5 Valid Slots

The CMR2 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, or any of slots 1113 in the OptiX OSN 1500B subrack.

11.1.6 Board Feature Code

The board feature code of the CMR2 contains eight characters, which indicate the wavelengths for the 2-channel optical signals processed by the board. Table 11-3 lists the details on the board feature code. Table 11-3 Feature code of the CMR2 Barcode First four characters Indication Wavelength for the optical signals Description The wavelength is for the first channel of optical signals processed by the board. The wavelength is for the second channel of optical signals processed by the board.

Last four characters

Wavelength for the optical signals

For example, the feature code of the TN11CMR2 is 14711571.

l l

"1471" indicates that the wavelength for the first channel of optical signals is 1471 nm. "1571" indicates that the wavelength for the second channel of optical signals is 1571 nm.
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11.1.7 Technical Specifications

The technical specifications of the CMR2 cover the optical interface specifications, board dimensions, weight, power consumption and laser safety class.

Optical Interface Specifications

Table 11-4 lists the specifications of optical interfaces of the CMR2. Table 11-4 Specifications of the optical interfaces of the CMR2 Optical Interface IN-D1 IN-D2 Item Working wavelength range (nm) Channel spacing (GHz) 0.5 dB passband bandwidth (nm) Insertion loss (dB) in the channel for dropping wavelengths Adjacent channel isolation (dB) Non-adjacent channel isolation (dB) A1-OUT A2-OUT 0.5 dB passband bandwidth (nm) Insertion loss (dB) in the channel for adding wavelengths IN-MO MI-OUT Insertion loss (dB) Isolation (dB) Return loss (dB) Specification 12711611 20 6.5 1.5

> 25 > 35 6.5 1.5

1.0 > 13 > 40

Laser Safety Class

The safety class of the laser on the board is CLASS 1M. The maximum launched optical power of the optical interfaces ranges from 10 dBm (10 mW) to 22.15 dBm (164 mW).

Mechanical Specifications
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 0.8
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Power Consumption
l

In the normal temperature (25), the maximum power consumption of the CMR2 is 0.2 W. In the high temperature (55), the maximum power consumption of the CMR2 is 0.3 W.

11.2 CMR4
This section describes the TN11CMR4, a four-channel optical add/drop multiplexing board, in terms of the version, function, principle, front panel, configuration and specifications. 11.2.1 Version Description The functional version of the CMR4 board is TN11. 11.2.2 Function and Feature The CMR4 is used to dense wavelength division multiplexing (DWDM) system. The spacing wavelength is 20 nm. The CMR4 supports functions and features such as add/drop multiplexing and channel expansion. 11.2.3 Working Principle and Signal Flow The CMR4 consists of the OADM optical module, control and communication module, and DC/ DC converter module. 11.2.4 Front Panel On the front panel of the CMR4, there are board indicators, interfaces and laser safety class label. 11.2.5 Valid Slots The CMR4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, or any of slots 1113 in the OptiX OSN 1500B subrack. 11.2.6 Board Feature Code The board feature code of the CMR4 contains eight characters, which indicate the wavelengths for the 4-channel optical signals processed by the board. 11.2.7 Technical Specifications The technical specifications of the CMR4 cover the optical interface specifications, board dimensions, weight, power consumption and laser safety class.

11.2.1 Version Description

The functional version of the CMR4 board is TN11.

11.2.2 Function and Feature

The CMR4 is used to dense wavelength division multiplexing (DWDM) system. The spacing wavelength is 20 nm. The CMR4 supports functions and features such as add/drop multiplexing and channel expansion. Table 11-5 lists the functions and features of the CMR4.

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Table 11-5 Functions and features of the CMR4 Function and Feature Basic function Channel expansion CMR4 Adds/Drops four wavelengths to/from the multiplexed signals. Provides the intermediate port used for expansion. Under certain conditions, the capacity of upstream and downstream channels can be expanded when the intermediate port is connected to other optical add/drop multiplexing boards.

11.2.3 Working Principle and Signal Flow

The CMR4 consists of the OADM optical module, control and communication module, and DC/ DC converter module. Figure 11-3 shows the block diagram for the functions of the CMR4. Figure 11-3 Block diagram for the functions of the CMR4
D01 D02 D03 D04 MO MI A01 A02 A03 A04

IN

Drop OADM module

Add

OUT

Control and communication module

Power supply module +5 V DC/DC converter Delayed startup Fuse SCC

Back plane

-48 V/-60 V

-48 V/-60 V

SCC

OADM module
The board receives through IN one multiplexed optical signal that travels from the upstream station. The Drop optical module drops through optical interfaces D01D04 four wavelengths from the signal. These four dropped wavelengths are output from the MO optical interface. The MI optical interface receives one multiplexed signal that travels over the main optical path. The Add optical module adds four wavelengths through optical interfaces A01A04 and
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multiplexes them with the signal in the main optical path into one signal. This multiplexed signal is output through OUT.

Control and communication module

l l

Controls the entire board operation. Collects the information, such as the alarms and performance events, working status, and voltage detection, of each functional module of the board. Communicates data with the SCC.

DC/DC converter module

Converts 48 V DC or 60 V DC to a voltage required by each module of the board.

11.2.4 Front Panel

On the front panel of the CMR4, there are board indicators, interfaces and laser safety class label.

Appearance of the Front Panel

Figure 11-4 shows the appearance of the front panel of the CMR4.

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Figure 11-4 Front panel of the CMR4

CMR4
STAT

LASER RADIATION
DO NOT VIEW DIRECTLY WITH OPTICAL INSTRUMENTS

CLASS 1M LASER PRODUCT

OUT IN MO MI D1 A1 D2 A2 D3 A3 D4 A4

CMR4

Indicator
One the front panel of the CMR4, there is one board hardware state indicator (STAT), which is red or green when lit. For indication of the indicator, see A Equipment and Board Alarm Indicators.

Interfaces
There are twelve optical interfaces on the front panel of the CMR4. Table 11-6 lists the type and usage of these optical interfaces.

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Table 11-6 Optical interfaces of the CMR4 Interface A1A4 D1D4 IN OUT MI Interface Type LC LC LC LC LC Usage Receive the signals output from the optical wavelength converting board or centralized client-side equipment. Transmit signals to the optical wavelength converting board or centralized client-side equipment. Receives multiplexed signals. Transmits multiplexed signals. Acts as a concatenation input optical interface and connects to the output optical interfaces of other OADM boards. Acts as a concatenation output optical interface and connects to the input optical interfaces of other OADM boards.

MO

LC

11.2.5 Valid Slots

The CMR4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, or any of slots 1113 in the OptiX OSN 1500B subrack.

11.2.6 Board Feature Code

The board feature code of the CMR4 contains eight characters, which indicate the wavelengths for the 4-channel optical signals processed by the board. Table 11-7 lists the details on the board feature code. Table 11-7 Feature code of the CMR4 Barcode Characters 12 Indication Wavelength for the optical signals Description The characters are two middle characters of the four that indicate the wavelength for the first channel of optical signals. The characters are two middle characters of the four that indicate the wavelength for the second channel of optical signals.

Characters 34

Wavelength for the optical signals

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Barcode Characters 56

Indication Wavelength for the optical signals

Description The characters are two middle characters of the four that indicate the wavelength for the third channel of optical signals. The characters are two middle characters of the four that indicate the wavelength for the fourth channel of optical signals.

Characters 78

Wavelength for the optical signals

For example, the feature code of the TN11CMR4 is 47495961.

l l l l

"47" indicates that the wavelength for the first channel of optical signals is 1471 nm. "49" indicates that the wavelength for the second channel of optical signals is 1491 nm. "59" indicates that the wavelength for the third channel of optical signals is 1591 nm. "61" indicates that the wavelength for the fourth channel of optical signals is 1611 nm.

11.2.7 Technical Specifications

The technical specifications of the CMR4 cover the optical interface specifications, board dimensions, weight, power consumption and laser safety class.

Optical Interface Specifications

Table 11-8 lists the specifications of the optical interfaces of the CMR4. Table 11-8 Specifications of the optical interfaces of the CMR4 Optical Interface IN-D1 IN-D2 IN-D3 IN-D4 Item Working wavelength range (nm) Channel spacing (GHz) 0.5 dB passband bandwidth (nm) Insertion loss (dB) in the channel for dropping wavelengths Adjacent channel isolation (dB) Specification 1291 to 1611 (1371 nm excluded) 20 6.5 2

> 25

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Optical Interface

Item Non-adjacent channel isolation (dB)

Specification > 35 6.5 2

A1-OUT A2-OUT A3-OUT A4-OUT IN-MO MI-OUT

0.5 dB passband bandwidth (nm) Insertion loss (dB) in the channel for adding wavelengths Insertion loss (dB) Isolation (dB) Return loss (dB)

1.5 > 13 > 40

Laser Safety Class

The safety class of the laser on the board is CLASS 1M. The maximum launched optical power of the optical interfaces ranges from 10 dBm (10 mW) to 22.15 dBm (164 mW).

Mechanical Specifications
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 0.9

Power Consumption
l

In the normal temperature (25), the maximum power consumption of the CMR4 is 0.2 W. In the high temperature (55), the maximum power consumption of the CMR4 is 0.3 W.

11.3 MR2
This section describes the TN11MR2, a dual-channel optical add/drop multiplexing board, in terms of the version, function, principle, front panel, configuration and specifications. 11.3.1 Version Description The functional version of the MR2 board is TN11. 11.3.2 Function and Feature The MR2 is used to the dense wavelength division multiplexing (DWDM) system. The spacing wavelength is 0.8 nm. The MR2 supports functions and features such as add/drop multiplexing and channel expansion. 11.3.3 Working Principle and Signal Flow The MR2 consists of the OADM optical module, control and communication module, and DC/ DC converter module. 11.3.4 Front Panel
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On the front panel of the MR2, there are board indicators, interfaces and laser safety class label. 11.3.5 Valid Slots The MR2 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, or any of slots 1113 in the OptiX OSN 1500B subrack. 11.3.6 Board Feature Code The board feature code of the MR2 contains eight characters, which indicate the frequency for the 2-channel optical signals processed by the board. 11.3.7 Technical Specifications The technical specifications of the MR2 cover the optical interface specifications, board dimensions, weight, power consumption and laser safety class.

11.3.1 Version Description

The functional version of the MR2 board is TN11.

11.3.2 Function and Feature

The MR2 is used to the dense wavelength division multiplexing (DWDM) system. The spacing wavelength is 0.8 nm. The MR2 supports functions and features such as add/drop multiplexing and channel expansion. Table 11-9 lists the functions and features of the MR2. Table 11-9 Functions and features of the MR2 Function and Feature Basic function Channel expansion MR2 Adds/Drops two wavelengths to/from the multiplexed signals. Provides the intermediate port used for expansion. Under certain conditions, the capacity of upstream and downstream channels can be expanded when the intermediate port is connected to other optical add/drop multiplexing boards.

11.3.3 Working Principle and Signal Flow

The MR2 consists of the OADM optical module, control and communication module, and DC/ DC converter module. Figure 11-5 shows the block diagram for the functions of the MR2.

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Figure 11-5 Block diagram for the functions of the MR2

D01 D02 MO MI A01 A02

IN

Drop OADM module

Add

OUT

Control and communication module

Power supply module +5 V DC/DC converter Delayed startup Fuse SCC

Back plane

-48 V/-60 V

-48 V/-60 V

SCC

OADM module
The board receives through IN one multiplexed optical signal that travels from the upstream station. The Drop optical module drops through optical interfaces D01 and D02 two wavelengths from the signal. These two dropped wavelengths are output from the MO optical interface. The MI optical interface receives one multiplexed signal that travels over the main optical path. The Add optical module adds two wavelengths through optical interfaces A01 and A02 and multiplexes them with the signal in the main optical path into one signal. This multiplexed signal is output through OUT.

Control and communication module

l l

Controls the entire board operation. Collects the information, such as the alarms and performance events, working status, and voltage detection, of each functional module of the board. Communicates data with the SCC.

DC/DC converter module

Converts 48 V DC or 60 V DC to a voltage required by each module of the board.

11.3.4 Front Panel

On the front panel of the MR2, there are board indicators, interfaces and laser safety class label.
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Appearance of the Front Panel

Figure 11-6 shows the appearance of the front panel of the MR2. Figure 11-6 Front panel of the MR2

MR2
STAT

LASER RADIATION
DO NOT VIEW DIRECTLY WITH OPTICAL INSTRUMENTS

CLASS 1M LASER PRODUCT

OUT IN MO MI D1 A1 D2 A2

MR2

Indicator
On the front panel of the MR2, there is one board hardware state indicator (STAT), which is red or green when lit. For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are eight optical interfaces on the front panel of the MR2. Table 11-10 lists the type and usage of the optical interfaces.

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Table 11-10 Optical interfaces of the MR2 Interface A1A2 D1D2 IN OUT MO Interface Type LC LC LC LC LC Usage Receive the signals output from the optical wavelength converting board or centralized client-side equipment. Transmit signals to the optical wavelength converting board or centralized client-side equipment. Receives multiplexed signals. Transmits multiplexed signals. Acts as a concatenation output optical interface and connects to the input optical interfaces of other OADM boards. Acts as a concatenation input optical interface and connects to the output optical interfaces of other OADM boards.

MI

LC

11.3.5 Valid Slots

The MR2 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, or any of slots 1113 in the OptiX OSN 1500B subrack.

11.3.6 Board Feature Code

The board feature code of the MR2 contains eight characters, which indicate the frequency for the 2-channel optical signals processed by the board. Table 11-11 lists the details on the board feature code. Table 11-11 Feature code of the MR2 Barcode First four (14) characters Indication Frequency of optical signals Description The four characters are the last four characters of the figure that marks the frequency of the first channel of optical signals. The four characters are the last four characters of the figure that marks the frequency of the second channel of optical signals.

Last four (58) characters

Frequency of optical signals

For example, the feature code of the TN11MR2 is 93609370.

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l l

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

"9360" indicates that the frequency of the first channel of optical signals is 193.60 THz. "9370" indicates that the frequency of the second channel of optical signals is 193.70 THz.

11.3.7 Technical Specifications

The technical specifications of the MR2 cover the optical interface specifications, board dimensions, weight, power consumption and laser safety class.

Optical Interface Specifications

Table 11-12 lists the specifications of the optical interfaces of the MR2. Table 11-12 Specifications of the optical interfaces of the MR2 Optical Interface IN-D1 IN-D2 Item Working wavelength range (nm) Channel spacing (GHz) 0.5 dB passband bandwidth (nm) Insertion loss (dB) in the channel for dropping wavelengths Adjacent channel isolation (dB) Non-adjacent channel isolation (dB) A1-OUT A2-OUT 0.5 dB passband bandwidth (nm) Insertion loss (dB) in the channel for adding wavelengths IN-MO MI-OUT Insertion loss (dB) Isolation (dB) Return loss (dB) Specification 1529 to 1561 100 0.11 1.5

> 25 > 35 0.11 1.5

1.0 > 13 > 40

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

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Mechanical Specifications
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 0.9

Power Consumption
l l

In the normal temperature (25), the maximum power consumption of the MR2 is 0.2 W. In the high temperature (55), the maximum power consumption of the MR2 is 0.3 W.

11.4 MR2A
This section describes the MR2A, a dual-channel optical add/drop multiplexing board, in terms of the version, function, principle, front panel, configuration and specifications. 11.4.1 Version Description The functional version of the MR2A board is N1. 11.4.2 Function and Feature The MR2A is used to the dense wavelength division multiplexing (DWDM) system. The spacing wavelength is 0.8 nm. The MR2A supports functions and features such as add/drop multiplexing, channel expansion and query of wavelengths. 11.4.3 Working Principle and Signal Flow The MR2A consists of the OADM module, control and communication module, and DC/DC converter module. 11.4.4 Front Panel On the front panel of the MR2A, there are interfaces and laser safety class label. 11.4.5 Valid Slots The MR2A can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, or any of slots 1113 in the OptiX OSN 1500B subrack. 11.4.6 Technical Specifications The technical specifications of the MR2A cover the optical interface specifications, board dimensions, weight, power consumption and laser safety class.

11.4.1 Version Description

The functional version of the MR2A board is N1.

11.4.2 Function and Feature

The MR2A is used to the dense wavelength division multiplexing (DWDM) system. The spacing wavelength is 0.8 nm. The MR2A supports functions and features such as add/drop multiplexing, channel expansion and query of wavelengths. Table 11-13 lists the functions and features of the MR2A.

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Table 11-13 Functions and features of the MR2A Function and Feature Basic function MR2A Adds/Drops two arbitrary adjacent wavelengths, which are compliant with ITU-T G.692 (DWDM). The signals are transparently transmitted, and the working wavelength ranges from 1535.82 nm to 1560.61 nm. The MR2A can be used as the two-channel wavelength adding/ dropping OTM station. Two MR2C boards can be concatenated and upgraded to the four-channel wavelength adding/dropping OTM station. See Figure 11-7. Realizes the two-channel wavelength adding/dropping OADM station, when used with the LWX. See Figure 11-8. Supports the ITU-T-compliant standard wavelength with a channel spacing of 100 GHz.

OTM function

OADM function Central wavelength

Figure 11-7 MR2A used as the OTM station

D1 D2 D1 D2 D1 D2

IN OUT

Drop Add MR2A A1 A2

(1)

MO IN MI OUT

Drop Add MR2A A1 A2

MO IN MI OUT MR2A

Drop Add

MO

MI

A1
(2)

A2

(1) (2)

MR2A can serve as an OTM station adding/dropping two channels. Two MR2A boards connected in serial can serve as an OTM station adding/dropping four channels.

Figure 11-8 MR2A and LWX used as the two-channel wavelength adding/dropping OADM station

LWX A2 Out In D1 LWX MR2A A1 D2 MO MI

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11.4.3 Working Principle and Signal Flow

The MR2A consists of the OADM module, control and communication module, and DC/DC converter module. Figure 11-9 shows the block diagram for the functions of the MR2A. Figure 11-9 Block diagram for the functions of the MR2A
D01 D02 MO MI A01 A02

IN

Drop OADM module

Add

OUT

Control and communication module

Power supply module +5 V DC/DC converter Delayed startup Fuse SCC

Back plane

-48 V/-60 V

-48 V/-60 V

SCC

The MR2A mainly includes the optical add/drop multiplexer (OADM) module adding/dropping two channels of signals. The OADM adds/drops and multiplexes two channels of signals. It also provides concatenation interfaces to connect other add/drop multiplexing boards for more powerful add/drop capability. The MR2A is a passive board that has no interface with the backplane.

OADM module
The board receives through IN one multiplexed optical signal that travels from the upstream station. The Drop optical module drops through optical interfaces D01 and D02 two wavelengths from the signal. These two dropped wavelengths are output from the MO optical interface. The MI optical interface receives one multiplexed signal that travels over the main optical path. The Add optical module adds two wavelengths through optical interfaces A01 and A02 and multiplexes them with the signal in the main optical path into one signal. This multiplexed signal is output through OUT.

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Control and communication module

l l

Controls the entire board operation. Collects the information, such as the alarms and performance events, working status, and voltage detection, of each functional module of the board. Communicates data with the SCC.

DC/DC converter module

Converts 48 V DC or 60 V DC to a voltage required by each module of the board.

11.4.4 Front Panel

On the front panel of the MR2A, there are interfaces and laser safety class label.

Appearance of the Front Panel

Figure 11-10 shows the appearance of the front panel of the MR2A. Figure 11-10 Front panel of the MR2A
MR2A

CLASS 1 LASER PRODUCT

OUT AO1 AO2 M I M O DO2 DO1 IN

MR2A

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Interfaces
There are four pairs of LC optical interfaces on the front panel of the MR2A. Table 11-14 lists the type and usage of the optical interfaces. Table 11-14 Optical interfaces of the MR2A Interface A01A02 D01D02 IN OUT MO/MI Interface Type LC LC LC LC LC Usage Adds two wavelengths of signals from the local. Drops two wavelengths of signals to the local. Receives multiplexed signals of two wavelengths. Transmits multiplexed signals of two wavelengths. Acts as a concatenation optical interface and concatenates several MR2A boards.

11.4.5 Valid Slots

The MR2A can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, or any of slots 1113 in the OptiX OSN 1500B subrack.

11.4.6 Technical Specifications

The technical specifications of the MR2A cover the optical interface specifications, board dimensions, weight, power consumption and laser safety class.

Optical Interface Specifications

Table 11-15 lists the specifications of the optical interfaces of the MR2A. Table 11-15 Specifications of the optical interfaces of the MR2A Item Working wavelength Description 1535.82 nm to 1560.61 nm. The working wavelengths can be any two adjacent standard wavelengths defined in ITU-T G.692 (DWDM). NRZ 100 <2

Line code Channel spacing (GHz) Insertion loss (dB) in the channel for adding or dropping wavelengths Adjacent channel isolation (dB)
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Item Non-adjacent channel isolation (dB) 0.5 dB channel bandwidth (nm)

Description > 35 < 0.11

Laser Safety Class

The safety class of the laser on the board is CLASS 1M. The maximum launched optical power of the optical interfaces ranges from 10 dBm (10 mW) to 22.15 dBm (164 mW).

Mechanical Specifications
The mechanical specifications of the MR2A are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 1.0

Power Consumption
In the normal temperature (25), the MR2A does not consume power.

11.5 MR2B
This section describes the MR2B, a dual-channel optical add/drop multiplexing board, in terms of the version, function, principle, front panel, configuration and specifications. 11.5.1 Version Description The functional version of the MR2B board is N1. 11.5.2 Function and Feature The MR2B is used to the dense wavelength division multiplexing (DWDM) system. The spacing wavelength is 0.8 nm. The MR2B supports functions and features such as add/drop multiplexing, channel expansion and query of wavelengths. 11.5.3 Working Principle and Signal Flow The MR2B consists of the OADM module, control and communication module, and DC/DC converter module. 11.5.4 Front Panel On the front panel of the MR2B, there are interfaces and laser safety class label. 11.5.5 Valid Slots The MR2B can be housed in any of slots 23, 69, and 1213 in the OptiX OSN 1500A subrack, or any of slots 13, 69, and 1113 in the OptiX OSN 1500B subrack. 11.5.6 Technical Specifications The technical specifications of the MR2B cover the optical interface specifications, board dimensions, weight, power consumption and laser safety class.
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11.5.1 Version Description

The functional version of the MR2B board is N1.

11.5.2 Function and Feature

The MR2B is used to the dense wavelength division multiplexing (DWDM) system. The spacing wavelength is 0.8 nm. The MR2B supports functions and features such as add/drop multiplexing, channel expansion and query of wavelengths. Table 11-16 lists the functions and features of the MR2B. Table 11-16 Functions and features of the MR2B Function and Feature Basic function MR2B Adds/Drops two arbitrary adjacent wavelengths, which are compliant with ITU-T G.692 (DWDM). The signals are transparently transmitted, and the working wavelength ranges from 1535.82 nm to 1560.61 nm. The MR2B can be used as the two-channel wavelength adding/ dropping OTM station. Two MR2B boards can be concatenated and upgraded to the four-channel wavelength adding/dropping OTM station. See Figure 11-11. Realizes the two-channel wavelength adding/dropping OADM station, when used with the LWX. See Figure 11-12. Supports the ITU-T-compliant standard central wavelength with a channel spacing of 100 GHz.

OTM function

OADM function Central wavelength

Figure 11-11 MR2B used as the OTM station

D1 D2 D1 D2 D1 D2

IN OUT

Drop Add MR2B A1 A2

(1)

MO IN MI OUT

Drop Add MR2B A1 A2

MO IN MI OUT MR2B

Drop Add

MO

MI

A1
(2)

A2

(1) MR2B can serve as an OTM station adding/dropping two channels. (2) Two MR2B boards connected in serial can serve as an OTM station adding/dropping four channels.

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Figure 11-12 MR2B and LWX used as the two-channel wavelength adding/dropping OADM station

LWX A2 Out In D1 LWX MR2B A1 D2 MO MI

11.5.3 Working Principle and Signal Flow

The MR2B consists of the OADM module, control and communication module, and DC/DC converter module. Figure 11-13 shows the block diagram for the functions of the MR2B. Figure 11-13 Block diagram for the functions of the MR2B
D01 D02 MO MI A01 A02

IN

Drop OADM module

Add

OUT

Control and communication module

Power supply module +5 V DC/DC converter Delayed startup Fuse SCC

Back plane

-48 V/-60 V

-48 V/-60 V

SCC

The MR2B mainly includes the optical add/drop multiplexer (OADM) module adding/dropping two channels of signals. The OADM adds/drops and multiplexes two channels of signals. It also
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provides concatenation interfaces to connect other add/drop multiplexing boards for more powerful add/drop capability. The MR2B is a passive board that has no interface with the backplane.

OADM module
The board receives through IN one multiplexed optical signal that travels from the upstream station. The Drop optical module drops through optical interfaces D01 and D02 two wavelengths from the signal. These two dropped wavelengths are output from the MO optical interface. The MI optical interface receives one multiplexed signal that travels over the main optical path. The Add optical module adds two wavelengths through optical interfaces A01 and A02 and multiplexes them with the signal in the main optical path into one signal. This multiplexed signal is output through OUT.

Control and communication module

l l

Controls the entire board operation. Collects the information, such as the alarms and performance events, working status, and voltage detection, of each functional module of the board. Communicates data with the SCC.

DC/DC converter module

Converts 48 V DC or 60 V DC to a voltage required by each module of the board.

11.5.4 Front Panel

On the front panel of the MR2B, there are interfaces and laser safety class label.

Appearance of the Front Panel

Figure 11-14 shows the appearance of the front panel of the MR2B. Figure 11-14 Front panel of the MR2B
MR 2B

MR2B
CLASS 1 LASER PRODUCT

MR2B

OUT AO1 AO2 M I MO DO2 DO1 IN

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Interfaces
There are four pairs of optical interfaces on the front panel of the MR2B. Table 11-17 lists the type and usage of the optical interfaces. Table 11-17 Optical interfaces of the MR2B Interface A01A02 D01D02 IN OUT MO/MI Interface Type LC LC LC LC LC Usage Adds two wavelengths of signals from the local. Drops two wavelengths of signals to the local. Receives multiplexed signals of two wavelengths. Transmits multiplexed signals of two wavelengths. Acts as a concatenation optical interface and concatenates several MR2B boards.

11.5.5 Valid Slots

The MR2B can be housed in any of slots 23, 69, and 1213 in the OptiX OSN 1500A subrack, or any of slots 13, 69, and 1113 in the OptiX OSN 1500B subrack.

11.5.6 Technical Specifications

The technical specifications of the MR2B cover the optical interface specifications, board dimensions, weight, power consumption and laser safety class.

Optical Interface Specifications

Table 11-18 lists the specifications of the optical interfaces of the MR2B. Table 11-18 Specifications of the optical interfaces of the MR2B Item Working wavelength Description 1535.82 nm to 1560.61 nm. The working wavelengths can be any two adjacent standard wavelengths defined in ITU-T G. 692. NRZ 100 <2

Line code Channel spacing (GHz) Insertion loss in the wavelength-adding channel (dB) Adjacent channel isolation (dB)
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Item Non-adjacent channel isolation (dB) 0.5 dB channel bandwidth (nm)

Description > 35 < 0.11

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the MR2B are as follows:
l l

Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W) Weight (kg): 1.0

Power Consumption
In the normal temperature (25), the MR2B does not consume power.

11.6 MR2C
This section describes the MR2C, a dual-channel optical add/drop multiplexing board, in terms of the version, function, principle, front panel, configuration and specifications. 11.6.1 Version Description The functional version of the MR2C board is N1. 11.6.2 Function and Feature The MR2C is used to the dense wavelength division multiplexing (DWDM) system. The spacing wavelength is 0.8 nm. The MR2C supports functions and features such as add/drop multiplexing, channel expansion and query of wavelengths. 11.6.3 Working Principle and Signal Flow The MR2C consists of the OADM module, control and communication module, and DC/DC converter module. 11.6.4 Front Panel On the front panel of the MR2C, there are interfaces and laser safety class label. 11.6.5 Valid Slots The MR2C can be housed in any of slots 1417 in the OptiX OSN 1500B subrack.The MR2C can be housed in any of slots 1926 and 2936 in the subrack. If an extended subrack is used, the MR2C can also be housed in any of slots 6976 and 7986. 11.6.6 Technical Specifications The technical specifications of the MR2C cover the optical interface specifications, board dimensions, weight, power consumption and laser safety class.
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11.6.1 Version Description

The functional version of the MR2C board is N1.

11.6.2 Function and Feature

The MR2C is used to the dense wavelength division multiplexing (DWDM) system. The spacing wavelength is 0.8 nm. The MR2C supports functions and features such as add/drop multiplexing, channel expansion and query of wavelengths. Table 11-19 lists the functions and features of the MR2C. Table 11-19 Functions and features of the MR2C Function and Feature Basic function MR2C Adds/Drops two arbitrary adjacent wavelengths, which are compliant with ITU-T G.692 (DWDM). The signals are transparently transmitted, and the working wavelength ranges from 1535.82 nm to 1560.61 nm. The MR2C can be used as the two-channel wavelength adding/ dropping OTM station. Two MR2C boards can be concatenated and upgraded to the four-channel wavelength adding/dropping OTM station. See Figure 11-15. Realizes the two-channel wavelength adding/dropping OADM station, when used with the LWX. See Figure 11-16. Supports the ITU-T-compliant standard wavelength with a channel spacing of 100 GHz.

OTM function

OADM function Central wavelength

Figure 11-15 MR2C used as the OTM station

D1 D2 D1 D2 D1 D2

IN OUT

Drop Add MR2C A1 A2

(1)

MO IN MI OUT

Drop Add MR2C A1 A2

MO IN MI OUT MR2C

Drop Add

MO

MI

A1
(2)

A2

(1) MR2C can serve as an OTM station adding/dropping two channels. (2) Two MR2C boards connected in serial can serve as an OTM station adding/dropping four channels.

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Figure 11-16 Two-channel wavelength adding/dropping OADM station realized by the MR2C and LWX

LWX A2 Out In D1 LWX MR2C A1 D2 MO MI

11.6.3 Working Principle and Signal Flow

The MR2C consists of the OADM module, control and communication module, and DC/DC converter module. Figure 11-17 shows the block diagram for the functions of the MR2C. Figure 11-17 Block diagram for the functions of the MR2C
D01 D02 MO MI A01 A02

IN

Drop OADM module

Add

OUT

Control and communication module

Power supply module +5 V DC/DC converter Delayed startup Fuse SCC

Back plane

-48 V/-60 V

-48 V/-60 V

SCC

The MR2C mainly includes the optical add/drop multiplexer (OADM) module adding/dropping two channels of signals. The OADM adds/drops and multiplexes two channels of signals. It also
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provides concatenation interfaces to connect other add/drop multiplexing boards for more powerful add/drop capability. The MR2C is a passive board that has no interface with the backplane.

OADM module
The board receives through IN one multiplexed optical signal that travels from the upstream station. The Drop optical module drops through optical interfaces D01 and D02 two wavelengths from the signal. These two dropped wavelengths are output from the MO optical interface. The MI optical interface receives one multiplexed signal that travels over the main optical path. The Add optical module adds two wavelengths through optical interfaces A01 and A02 and multiplexes them with the signal in the main optical path into one signal. This multiplexed signal is output through OUT.

Control and communication module

l l

Controls the entire board operation. Collects the information, such as the alarms and performance events, working status, and voltage detection, of each functional module of the board. Communicates data with the SCC.

DC/DC converter module

Converts 48 V DC or 60 V DC to a voltage required by each module of the board.

11.6.4 Front Panel

On the front panel of the MR2C, there are interfaces and laser safety class label.

Appearance of the Front Panel

Figure 11-18 shows the appearance of the front panel of the MR2C.

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Figure 11-18 Front panel of the MR2C

MR2C

CLASS 1 LASER PRODUCT

OUT AO1 AO2 M I M O DO2 DO1 IN

MR2C

Interfaces
There is four pairs of optical interfaces on the front panel of the MR2C. Table 11-20 lists the type and usage of the optical interfaces. Table 11-20 Optical interfaces of the MR2C Interface A01A02 D01D02 IN OUT MO/MI Interface Type LC LC LC LC LC Usage Adds two wavelengths of signals from the local. Drops two wavelengths of signals to the local. Receives multiplexed signals of two wavelengths. Transmits multiplexed signals of two wavelengths. Acts as a concatenation optical interface and concatenates several MR2C boards.

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11.6.5 Valid Slots

The MR2C can be housed in any of slots 1417 in the OptiX OSN 1500B subrack.The MR2C can be housed in any of slots 1926 and 2936 in the subrack. If an extended subrack is used, the MR2C can also be housed in any of slots 6976 and 7986.

11.6.6 Technical Specifications

The technical specifications of the MR2C cover the optical interface specifications, board dimensions, weight, power consumption and laser safety class.

Optical Interface Specifications

Table 11-21 lists the specifications of the optical interfaces of the MR2C. Table 11-21 Specifications of the optical interfaces of the MR2C Item Working wavelength Description 1535.82 nm to 1560.61 nm. The working wavelengths can be any two adjacent standard wavelengths defined in ITU-T G. 692. NRZ 100 <2 > 25 > 35 < 0.11

Line code Channel spacing (GHz) Insertion loss in the add/ drop channel (dB) Adjacent channel isolation (dB) Non-adjacent channel isolation (dB) 0.5 dB channel bandwidth (nm)

Laser Safety Class

The safety class of the laser on the board is CLASS 1. The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the MR2C are as follows:
l l

Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W) Weight (kg): 1.0

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Power Consumption
In the normal temperature (25), the MR2C does not consume power.

11.7 MR4
This section describes the TN11MR4, a four-channel optical add/drop multiplexing board, in terms of the version, function, principle, front panel, configuration and specifications. 11.7.1 Version Description The functional version of the MR4 board is TN11. 11.7.2 Function and Feature The MR4 is used to the dense wavelength division multiplexing (DWDM) system. The spacing wavelength is 0.8 nm. The MR4 supports functions and features such as add/drop multiplexing and channel expansion. 11.7.3 Working Principle and Signal Flow The MR4 consists of the OADM optical module, control and communication module, and DC/ DC converter module. 11.7.4 Front Panel On the front panel of the MR4, there are board indicators, interfaces and laser safety class label. 11.7.5 Valid Slots The MR4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, or any of slots 1113 in the OptiX OSN 1500B subrack. 11.7.6 Board Feature Code The feature code of the MR4 has eight numbers, which identify the frequency of the first and fourth channels of optical signals the board process. 11.7.7 Technical Specifications The technical specifications of the MR4 cover the optical interface specifications, board dimensions, weight, power consumption and laser safety class.

11.7.1 Version Description

The functional version of the MR4 board is TN11.

11.7.2 Function and Feature

The MR4 is used to the dense wavelength division multiplexing (DWDM) system. The spacing wavelength is 0.8 nm. The MR4 supports functions and features such as add/drop multiplexing and channel expansion. Table 11-22 lists the functions and features of the MR4. Table 11-22 Functions and features of the MR4 Function and Feature Basic function
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Function and Feature Channel expansion

MR4 Provides the intermediate port used for expansion. Under certain conditions, the capacity of upstream and downstream channels can be expanded when the intermediate port is connected to other optical add/drop multiplexing boards.

11.7.3 Working Principle and Signal Flow

The MR4 consists of the OADM optical module, control and communication module, and DC/ DC converter module. Figure 11-19 shows the block diagram for the functions of the MR4. Figure 11-19 Block diagram for the functions of the MR4
D01 D02 D03 D04 MO MI A01 A02 A03 A04

IN

Drop OADM module

Add

OUT

Control and communication module

Power supply module +5 V DC/DC converter Delayed startup Fuse SCC

Back plane

-48 V/-60 V

-48 V/-60 V

SCC

OADM module
The board receives through IN one multiplexed optical signal that travels from the upstream station. The Drop optical module drops through optical interfaces D01D04 four wavelengths from the signal. These four dropped wavelengths are output from the MO optical interface. The MI optical interface receives one multiplexed signal that travels over the main optical path. The Add optical module adds four wavelengths through optical interfaces A01A04 and multiplexes them with the signal in the main optical path into one signal. This multiplexed signal is output through OUT.
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Control and communication module

l l

Controls the entire board operation. Collects the information, such as the alarms and performance events, working status, and voltage detection, of each functional module of the board. Communicates data with the SCC.

DC/DC converter module

Converts 48 V DC or 60 V DC to a voltage required by each module of the board.

11.7.4 Front Panel

On the front panel of the MR4, there are board indicators, interfaces and laser safety class label.

Appearance of the Front Panel

Figure 11-20 shows the appearance of the front panel of the MR4. Figure 11-20 Front panel of the MR4

MR4
STAT

LASER RADIATION
DO NOT VIEW DIRECTLY WITH OPTICAL INSTRUMENTS

CLASS 1M LASER PRODUCT

OUT IN MO MI D1 A1 D2 A2 D3 A3 D4 A4

MR4

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Indicator
On the front panel of the MR4, there is one board hardware state indicator (STAT), which is red or green when lit. For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are twelve optical interfaces on the front panel of the MR4. Table 11-23 lists the type and usage of the optical interfaces. Table 11-23 Optical interfaces of the MR4 Interface A1A4 D1D4 IN OUT MI Interface Type LC LC LC LC LC Usage Receive the signals output from the optical wavelength converting board or centralized client-side equipment. Transmit signals to the optical wavelength converting board or centralized client-side equipment. Receives multiplexed signals. Transmits multiplexed signals. Acts as a concatenation input optical interface and connects to the output optical interfaces of other OADM boards. Acts as a concatenation output optical interface and connects to the input optical interfaces of other OADM boards.

MO

LC

11.7.5 Valid Slots

The MR4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, or any of slots 1113 in the OptiX OSN 1500B subrack.

11.7.6 Board Feature Code

The feature code of the MR4 has eight numbers, which identify the frequency of the first and fourth channels of optical signals the board process. Table 11-24 lists the details on the board feature code.

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Table 11-24 Board feature code Barcode First four characters Indication Frequency of optical signals Description The four characters are the last four characters of the figure that marks the frequency of the first channel of optical signals. The four characters are the last four characters of the figure that marks the frequency of the fourth channel of optical signals.

Last four characters

Frequency of optical signals

For example, the feature code of the TN11MR4 is 92109240.

l l

"9210" indicates that the frequency of the first channel of optical signals is 192.10 THz. "9240" indicates that the frequency of the fourth channel of optical signals is 192.40 THz.

The four channels of optical signals the MR4 processes are successive:
l l

The frequency of the second channel of optical signals is 192.20 THz. The frequency of the third channel of optical signals is 192.30 THz.

11.7.7 Technical Specifications

The technical specifications of the MR4 cover the optical interface specifications, board dimensions, weight, power consumption and laser safety class.

Optical Interface Specifications

Table 11-25 lists the specifications of the optical interfaces of the MR4. Table 11-25 Specifications of the optical interfaces of the MR4 Optical Interface IN-D1 IN-D2 IN-D3 IN-D4 Item Working wavelength range (nm) Channel spacing (GHz) 0.5 dB passband bandwidth (nm) Insertion loss in the wavelength-dropping channel (dB) Specification 1529 to 1561 100 0.11 2.2

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Optical Interface

Item Adjacent channel isolation (dB) Non-adjacent channel isolation (dB)

Specification > 25 > 35 0.11 2.2

A1-OUT A2-OUT A3-OUT A4-OUT IN-MO MI-OUT -

0.5 dB passband bandwidth (nm) Insertion loss in the wavelength-adding channel (dB) Insertion loss (dB) Isolation (dB) Return loss (dB)

1.5 > 13 > 40

Laser Safety Class

The safety class of the laser on the board is CLASS 1M. The maximum launched optical power of the optical interfaces ranges from 10 dBm (10 mW) to 22.15 dBm (164 mW).

Mechanical Specifications
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 0.9

Power Consumption
l l

In the normal temperature (25), the maximum power consumption of the MR4 is 0.2 W. In the high temperature (55), the maximum power consumption of the MR4 is 0.3 W.

11.8 LWX
This section describes the LWX, an arbitrary rate wavelength converting board, in terms of the version, function, principle, front panel, configuration and specifications. 11.8.1 Version Description The functional version of the LWX board is N1. 11.8.2 Function and Feature The LWX is used to realize the convertion between the wavelength at an arbitrary rate (10 Mbit/ s to 2.7 Gbit/s, NRZ code) at the client side and the G.692 wavelength. 11.8.3 Working Principle and Signal Flow The LWX consists of the O/E conversion module, cross-connect module, CDR module and so on.
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11.8.4 Front Panel On the front panel of the LWX, there are indicators and interfaces. 11.8.5 Valid Slots The LWX can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, or any of slots 1113 in the OptiX OSN 1500B subrack. 11.8.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The feature code of the LWX indicates the schemes the optical interfaces use to receive and transmit signals. 11.8.7 Technical Specifications The technical specifications of the LWX cover the optical interface specifications, board dimensions, weight and power consumption.

11.8.1 Version Description

The functional version of the LWX board is N1.

11.8.2 Function and Feature

The LWX is used to realize the convertion between the wavelength at an arbitrary rate (10 Mbit/ s to 2.7 Gbit/s, NRZ code) at the client side and the G.692 wavelength. The LWX supports the optical wavelength convertion, 3R, protection, and loopback. Table 11-26 lists the functions and features of the LWX. Table 11-26 Functions and features of the LWX Function and Feature Basic function LWX Realizes the convertion between the wavelength at an arbitrary rate at the client side and the wavelength compliant with ITU-T G.692 (DWDM). Transparently transmits signals. 3R function Protection scheme Provides the 3R function for the signals at the client side ranging from 10 Mbit/s to 2.7 Gbit/s. Recovers the clock, and monitors the rate. Single fed and single receiving Dual fed and selective receiving ALS function Loopback function Supports the inter-board protection and 1+1 interboard hot backup. The switching time is less than 50 ms. Supports the intra-board protection. The optical channel protection can be realized by one board. The switching time is less than 50 ms.

Supports the ALS function. When no signals are received, the corresponding optical transmit module is automatically turned off. Provides the inloop and outloop at the optical interface level, which are used for locating faults.

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Function and Feature Performance and alarm monitoring Central wavelength

LWX Provides rich alarms and performance events for easy maintenance.

Supports the ITU-T-compliant standard wavelength with a channel spacing of 100 GHz.

11.8.3 Working Principle and Signal Flow

The LWX consists of the O/E conversion module, cross-connect module, CDR module and so on. Figure 11-21 shows the block diagram for the functions of the LWX.

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Figure 11-21 Block diagram for the functions of the LWX

Loopback control Reference clock

10 Mbit/s~2.7 Gbit/s Optical module at client side 10 Mbit/s~2.7 Gbit/s

O/ E

WDM side loopback

22 Crossconnection

Multi-rate CDR

O/ E

Data LOS Laser shut down

LOS

communication and control module

10 Mbit/s~2.7 Gbit/s

O/ E

Client side loopback

Optical module 2 at WDM side

2 2 Crossconnection

Multi-rate CDR

Loopback control

Reference clock

10 Mbit/s~2.7 Gbit/s Optical module 1 at WDM side 10 Mbit/s~2.7 Gbit/s

O/ E
Clock

Optical splitter

O/ E

Data

LOS Laser shut down

communication and control module

Communication

SCC Unit

+3.3 V +1.5 V +5V +1.8 V

DC/DC converter module

DC/DC converter module

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse

+3.3 V backup power

O/E Conversion Module

l

The optical module at client side applies SFP encapsulation and can be configured as different types of optical module. This module supports accessing optical signals at the rate of 10 Mbit/s-2.7 Gbit/s. At WDM side, the module can be configured as an optical tranceiver module or an optical tranceiver module and an optical receiver module. When two modules are configured at WDM side, an optical splitter is used to realize dual feeding. In the receive direction, the module converts the received optical signals into electrical signals.

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l

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

In the transmit direction, the module converts the electrical signals into SDH optical signals, and then send optical signals to fibers for transmission. Detect the R_LOS alarm and provide the function to shut down the laser.

Cross-connect Module
l l l l

Supports data selection from client side to WDM side and from WDM side to client side Supports WDM side optical module selection Supports loopback of client side signals Supports loopback of WDM side signals

CDR Module
l l

Supports recovering data and clock signals from 10 Mbit/s to 2.7 Gbit/s Supports reading rates of accessed services

Communication and Control Module

l l l l l l

Supports Ethernet communication Supports reference clock of the CDR module Selects and configures services of other modules Implements laser controlling function Selects the clock from the active or the standby cross-connect board Control the indicator on the board

DC/DC Converter Module

Through the DC/DC converter module, the power converting module provides required DC voltages for each chip on the board. The 48 V/60 V voltage is converted to the following voltages: +1.5 V, +3.3 V, +1.8 V and 5 V. In addition, this module provides protection for the board +3.3 V power supply.

11.8.4 Front Panel

On the front panel of the LWX, there are indicators and interfaces.

Appearance of the Front Panel

Figure 11-22 shows the appearance of the front panel of the LWX.

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Figure 11-22 Front panel of the LWX

LWX
STAT ACT PROG SRV
CLASS 1 LASER PRODUCT

TX RX OUT1 IN1 OUT2 IN2

LWX

Indicators
The following indicators are present on the front panel of the board:
l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are six optical interfaces on the front panel of the LWX. Table 11-27 lists the type and usage of the optical interfaces.

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Table 11-27 Optical interfaces on the front panel of the LWX Interface IN1/IN2 OUT1/OUT2 TX RX Interface Type LC LC LC LC Usage Receives signals from the optical add/drop multiplexing board, MR2A. Transmits signals to the optical add/drip multiplexing board, MR2A. Transmits signals to the client-side equipment. Receives signals from the client-side equipment.

Note: IN1/OUT1 and IN2/OUT2 are two pairs of optical interfaces.

11.8.5 Valid Slots

The LWX can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, or any of slots 1113 in the OptiX OSN 1500B subrack.

11.8.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The feature code of the LWX indicates the schemes the optical interfaces use to receive and transmit signals. Table 11-28 lists the relation between the board feature code and the receive/transmit scheme. Table 11-28 Relation between the board feature code and the receive/transmit scheme Board Barcode SSN1LWX01 SSN1LWX02 Feature Code 01 02 Receive/Transmit Scheme Single-fed single selective Dual-fed single selective

11.8.7 Technical Specifications

The technical specifications of the LWX cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications

Table 11-29 and Table 11-30 list the specifications of the client-side and WDM-side optical interfaces of the LWX.

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Table 11-29 Specifications of the client-side optical interfaces of the LWX Item Nominal bit rate Line code Optical source type Transmission distance (km) Specification 10 Mbit/s to 2.7 Gbit/s NRZ SLM 15 SLM 40 SLM 80

Feature of the transmitter at S point Working wavelength range (nm) Max. mean launched optical power (dBm) Min. mean launched optical power (dBm) Min. extinction ratio (dB) Side mode suppression ratio (dB) Eye pattern 1260 to 1360 0 5 +8.2 30 1260 to 1360 +3 2 +8.2 30 1500 to 1580 +3 2 +8.2 30

Compliant with the template defined in ITU-T G.957 Recommendations

Compliant with the template defined in ITU-T G.957 Recommendations

Compliant with the template defined in ITU-T G.957 Recommendations

Feature of the receiver at S point Receiver type Wavelength range (nm) of the received signals Receiver sensitivity (dBm) Min. overload (dBm) Max. reflection coefficient (dB) PIN 1200 to 1600 PIN 1200 to 1600 APD 1200 to 1600

18 0 27

18 9 27

28 9 27

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Table 11-30 Specifications of the WDM-side optical interfaces of the LWX Item Channel spacing (GHz) Line code Specification 100 NRZ

Feature of the transmitter at Sn point Target transmission distance (km) of optical interfaces Max. mean launched optical power (dBm) Min. mean launched optical power (dBm) Min. extinction ratio (dB) Nominal central frequency (THz) Central frequency deviation (GHz) Max. 20 dB spectral width (nm) Min. side mode suppression ratio (dB) Dispersion compensation (ps/nm) Eye pattern 640 170 (2 mW) 170 (10 mW) 360

+7

+3

+3

+5

+3

+10 192.10 to 196.00 12.5

+10 192.10 to 196.00 12.5

+10 192.10 to 196.00 12.5

+10 192.10 to 196.00 12.5

0.2

0.4

0.4

0.4

35

35

35

35

12800

2400

3200

1600

Compliant with the template defined in ITUT G.957 Recommendati ons

Compliant with the template defined in ITUT G.957 Recommendati ons

Compliant with the template defined in ITUT G.957 Recommendati ons

Compliant with the template defined in ITUT G.957 Recommendati ons

Feature of the receiver at Rn point

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Item Receiver type Receiving wavelength range (nm) Receiver sensitivity (dBm) Min. overload (dBm) Max. reflection coefficient (dB)

Specification APD 1200 to 1600 PIN 1200 to 1600

28

18

9 27

0 27

Mechanical Specifications
The mechanical specifications of the LWX are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 1.1

Power Consumption
In the normal temperature (25), the maximum power consumption of the LWX is 30 W.

11.9 OBU1
This section describes the TN11OBU1, an optical booster amplifier board, in terms of the version, function, principle, front panel, configuration and specifications. 11.9.1 Version Description The functional version of the OBU1 is TN11. 11.9.2 Function and Feature The OBU1 supports the in-service optical performance monitoring, gain-locking technology, and transient control technology. 11.9.3 Working Principle and Signal Flow The OBU1 consists of the EDFA optical module, optical splitter, and the control and communication module. 11.9.4 Front Panel On the front panel of the OBU1, there are indicators, interfaces, and laser safety class label. 11.9.5 Valid Slots The OBU1 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, or any of slots 1113 in the OptiX OSN 1500B subrack. 11.9.6 Board Feature Code
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The feature code of the OBU1 contains six characters and indicates the gain and maximum nominal input optical power of the optical signals. 11.9.7 Technical Specifications The technical specifications of the OBU1 cover the optical interface specifications, board dimensions, weight, power consumption and laser safety class.

11.9.1 Version Description

The functional version of the OBU1 is TN11.

11.9.2 Function and Feature

The OBU1 supports the in-service optical performance monitoring, gain-locking technology, and transient control technology. Table 11-31 lists the functions and features of the OBU1. Table 11-31 Functions and features of the OBU1 Function and Feature Basic function OBU1 Amplifies a maximum of 40-channel optical signals (channel spacing: 100 GHz) at the same time. Supports the transmission without electrical trunks for different spans. Typical gain In-service optical performance monitoring The typical gain of the OBU101 is 20 dB. The typical gain of the OBU102 is 23 dB. Provides in-service performance monitoring optical interface. A small volume of optical signals are output at the optical interface to the optical spectrum analyzer or optical spectrum analyzing board. The optical spectrum analyzer or optical spectrum analyzing board monitors the multiplexed optical signals and optical performance without interrupting services. The EDFA of the board has the gain-locking function. When one or more channels are added or dropped, or optical signals of certain channels fluctuate, the signal gains of other channels are not affected. The EDFA of the board has the transient control function. When channels are added or dropped, the system can be upgraded or expanded without interrupting services if the optical power fluctuation is suppressed. Checks and reports the optical power. Controls the temperature of the pumping laser. Checks the pumping drive current, back facet current, cooling current, temperature of the pumping laser, and the ambient temperature of the board.

Gain-locking technology Transient control technology

Performance and alarm monitoring

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The OBU1 is of two types: OBU101 and OBU102. The OBU101 is used at the receive end. The OBU102 is used at the transmit end.

11.9.3 Working Principle and Signal Flow

The OBU1 consists of the EDFA optical module, optical splitter, and the control and communication module. Figure 11-23 shows the block diagram for the functions of the OBU1. Figure 11-23 Block diagram for the functions of the OBU1
EDFA optical module
IN

Splitter

Pumping current

PIN

Detecting for temperature and pumping current

Pumping and detection module

Control and communication module

Power supply module +5 V +5 V +5 V DC/DC converter DC/DC converter Delayed startup Fuse

Backplane -48 V/-60 V -48 V/-60 V SCC

Signal Flow
The OBU1 accesses the multiplexed optical signals, which are amplified by the EDFA optical module. The OBU1 then outputs the amplified optical signals through the OUT port. The OBU1 also outputs few monitoring signals to the test instrument for performance analysis.

EDFA Optical Module

The EDFA module is used to amplify the input optical signals. The EDFA optical module applies the gain auto-adjustment technology. With this technology, the EDFA can change the gain of working wavelength signals in the allowed range.

Optical Splitter
The splitter is used to split the optical signals received from the EDFA optical module into two channels of signals with different power. One channel of signlas are output from OUT optical
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interface and then transmitted in the main optical channel. The other channel of signals are output to the MON port for sepctrum detection and monitoring. The power of signals at the MON is one ninety-nineth of that at the OUT interface. In other words, the power of signals at MON is 20 dB lower than that at the OUT interface.

Control and Communication Module

The control and communication module is used to control and monitor the functional modules of the board, and to manage the communication. This module collects the information on alarms and performance events, and data of working status and voltage detection of each functional module. This module then reports the information and data to the SCC. The control and communication module receives commands from the SCC to control and coordinate the working of each functional module.

11.9.4 Front Panel

On the front panel of the OBU1, there are indicators, interfaces, and laser safety class label.

Appearance of the Front Panel

Figure 11-24 shows the appearance of the front panel of the OBU1.

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Figure 11-24 Front panel of the OBU1

OBU1
STAT ACT PROG SRV
LASER RADIATION
DO NOT VIEW DIRECTLY WITH OPTICAL INSTRUMENTS

CLASS 1M LASER PRODUCT

MON OUT IN

OBU1

Indicators
The following indicators are present on the front panel of the board:
l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are three pairs of optical interfaces on the front panel of the OBU1. Table 11-32 lists the type and usage of the optical interfaces.

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Table 11-32 Optical interfaces of the OBU1 Interface IN OUT MON Interface Type LC LC LC Usage Inputs multiplexed signals to be amplified. Outputs the amplified multiplexed signals. Connects to the test instrument to monitor the inservice performance.

11.9.5 Valid Slots

The OBU1 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, or any of slots 1113 in the OptiX OSN 1500B subrack.

11.9.6 Board Feature Code

The feature code of the OBU1 contains six characters and indicates the gain and maximum nominal input optical power of the optical signals. Table 11-33 lists the details on the board feature code. Table 11-33 Feature code of the OBU1 Barcode First character Next two (23) characters Fourth character Last two (56) characters Indication Gain Maximum nominal input optical power Description Fixed as G Gain Fixed as I Maximum nominal input optical power

For example, the feature code of the TN11OBU1 is G23I-3. The feature code indicates that the gain is 23 dB and the maximum nominal input optical power is 3 dBm.

11.9.7 Technical Specifications

The technical specifications of the OBU1 cover the optical interface specifications, board dimensions, weight, power consumption and laser safety class.

Optical Interface Specifications

Table 11-34 lists the specifications of the optical interfaces of the OBU1.

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Table 11-34 Specifications of optical interfaces of the OBU1 Item Specification OBU1C01 Working wavelength range (nm) Range of input optical power (dBm) Range of output optical power (dBm) Input power (dBm) of a typical single wavelength Maximum nominal output optical power (dBm) of a single wavelength Path gain (dB) Noise figure (dB) Gain flatness (dB) Pre-incline of the gain spectral form 1529 to 1561 32 to 4 12 to 16 20 0 OBU1C02 1529 to 1561 32 to 3 9 to 20 19 4

201.5 5.5 2.0 00.2

231.5 6.0 2.0 1.00.2

Laser Safety Class

The safety class of the laser on the board is CLASS 1M. The maximum launched optical power of the optical interfaces ranges from 10 dBm (10 mW) to 22.15 dBm (164 mW).

Mechanical Specifications
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 1.3

Power Consumption
l

The power consumption of OBU101:

In the normal temperature (25), the maximum power consumption of the OBU1 is 16 W. In the high temperature (55), the maximum power consumption of the OBU1 is 17.6 W. In the normal temperature (25), the maximum power consumption of the OBU1 is 18 W. In the high temperature (55), the maximum power consumption of the OBU1 is 19.8 W.
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The power consumption of OBU102:

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11.10 FIB
This section describes the FIB, a wavelength filter and isolation board, in terms of the version, function, principle, front panel, configuration and specifications. 11.10.1 Version Description The functional version of the FIB board is N1. 11.10.2 Function and Feature The FIB, a filter and isolation board, is used to filter and isolate 1 x STM-16 optical signals. 11.10.3 Working Principle and Signal Flow The FIB consists of an isolator and a filter. 11.10.4 Front Panel On the front panel of the FIB, there are two pairs of optical interfaces. 11.10.5 Valid Slots The FIB can be housed in any of slots 1213 in the subrack. 11.10.6 Technical Specifications The technical specifications of the FIB cover the optical interface specifications, board dimensions, weight and power consumption.

11.10.1 Version Description

The functional version of the FIB board is N1.

11.10.2 Function and Feature

The FIB, a filter and isolation board, is used to filter and isolate 1 x STM-16 optical signals. The FIB is used in the remote optical pump amplifier (ROPA) system. Used with the ROP, a single-wavelength long distance board, the FIB can realize long-distance optical regeneration transmission. Figure 11-25 shows the position of the FIB in an optical transmission system. Figure 11-25 Location of the FIB in the optical transmission system.
C (single span) a(54dB) b(18dB) FIB

Single span

BA17

G.652

Erbium doped

G.652

ROP

ISO

Filter
1550.12

Optical receiver

Table 11-35 lists the functions and features of the FIB.

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Table 11-35 Functions and features of the FIB Function and Feature Optical isolator Optical filter FIB The isolator lets optical signals pass in a unidirectional manner. The working wavelength ranges from 1529 nm to 1561 nm. The filter filters all signals carried in wavelengths except those in the 1550.12 nm wavelength.

11.10.3 Working Principle and Signal Flow

The FIB consists of an isolator and a filter. Figure 11-26 shows the block diagram for the functions of the FIB. Figure 11-26 Block diagram for the working principle of the FIB
Isolator Filter

After travelling for a long distance in fibers, optical signals are heavily attenuated and then degraded. The degraded signals cannot be normally received by optical receiver. In this case, the ROP should be used to amplify the gain of the optical signals. The ROP has high optical power. To prevent other factors from affecting the ROP, use the FIB to filter wavelengths. The filter of the FIB lets optical signals pass in a unidirectional manner. The filter filters all signals carried in other wavelengths except those in the 1550.12 nm wavelength. In this way, the optical receiver can normally receive optical signals.

11.10.4 Front Panel

On the front panel of the FIB, there are two pairs of optical interfaces.

Appearance of the Front Panel

Figure 11-27 shows the appearance of the front panel of the FIB.

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Figure 11-27 Front panel of the FIB

FIB

CLASS1 LASER PRODUCT

OUT IN
FIB

Interfaces
On the front panel of the FIB, there are a LC optical interface and a LSH optical interface, which are used to receive and transmit 1-channel 2.5 Gbit/s optical signals. The optical interfaces use pluggable optical modules for easy maintenance. Table 11-36 Optical interfaces of the FIB Interface IN OUT Interface Type LSH LC Usage Receive 1-channel 2.5 Gbit/s optical signals. Transmit 1-channel 2.5 Gbit/s optical signals.

11.10.5 Valid Slots

The FIB can be housed in any of slots 1213 in the subrack.

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11.10.6 Technical Specifications

The technical specifications of the FIB cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications

Table 11-37 lists the specifications of the optical interfaces of the FIB. Table 11-37 Specifications of the optical interfaces of the FIB Item Nominal bit rate Line code Central wavelength (nm) 0.5 dB bandwidth (nm) Specification 2488320 kbit/s NRZ 1550.120.05 > 0.4

Mechanical Specifications
The mechanical specifications of the FIB are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg): 0.4

Power Consumption
The FIB does not consume power.

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12 Optical Amplifier Boards and Dispersion Compensation Boards

12
About This Chapter

Optical Amplifier Boards and

Dispersion Compensation Boards

This chapter describes the optical amplifier boards, such as the BA2, BPA, and COA, and the dispersion compensation boards, such as the DCU. 12.1 BA2 This section describes the BA2, 2-channel optical booster amplifier board, in terms of the version, function, working principle, front panel and specifications. 12.2 BPA This section describes the BPA, one-channel amplifier and one-channel pre-amplifier board, in terms of the version, function, principle, front panel and specifications. 12.3 COA This section describes the COA, a case-shaped optical amplifier, in terms of the version, function, principle, front panel, installation position and specifications.

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12.1 BA2
This section describes the BA2, 2-channel optical booster amplifier board, in terms of the version, function, working principle, front panel and specifications. 12.1.1 Version Description The functional version of the BA2 board is N1. 12.1.2 Function and Feature During the long-haul transmission of optical signals, the attenuation of signals is high. The BA should be used, and thus the optical receiver can normally receive optical signals. 12.1.3 Working Principle and Signal Flow The BA2 consists of the EDFA module, control module, communication module, and DC/DC converter module. 12.1.4 Front Panel On the front panel of the BA2, there are indicators and interfaces. 12.1.5 Valid Slots The BA2 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, or any of slots 1113 in the OptiX OSN 1500B subrack. 12.1.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the BA2 indicates the output optical power of the optical interfaces. 12.1.7 Technical Specifications The technical specifications of the BA2 cover the optical interface specifications, board dimensions, weight and power consumption.

12.1.1 Version Description

The functional version of the BA2 board is N1.

12.1.2 Function and Feature

During the long-haul transmission of optical signals, the attenuation of signals is high. The BA should be used, and thus the optical receiver can normally receive optical signals. Figure 12-1 shows the location of the BA in the optical transmission system. Figure 12-1 Location of the BA in the optical transmission system
Transmit
BA

Receive

The BA2 amplifies the power of two-channel optical signals. Table 12-1 lists the functions and features of the BA2.

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Table 12-1 Functions and features of the BA2 Function and Feature Basic function BA2 Increases the launched optical power of the line board to 1315 dBm or 1518 dBm. Thus, when the G.652 optical fiber with a loss of 0.275 dB/km is used, the transmission distance can be 120 km, 130 km, or above. Automatically controls the optical power and laser temperature of the EDFA module. Automatically monitors the input and output optical power of the EDFA module and queries the optical power. Protects the EDFA module. When no optical signals are input, the laser is automatically turned off. When optical signals are input, the laser is automatically turned on. Performance and alarm monitoring Software upgrade Reports the performance parameters of the laser. Provides rich alarms and performance events for easy management and maintenance of the equipment. Supports the software upgrade and expansion without interrupting services.

EDFA

NOTE

The BA2 provides the IPA function. When the IPA function is enabled, the pumping laser is turned off if no input signals are detected on the receive end of the line board. Thus, this function is used to prevent the high laser power from damaging eyes.

12.1.3 Working Principle and Signal Flow

The BA2 consists of the EDFA module, control module, communication module, and DC/DC converter module. Figure 12-2 shows the block diagram for the functions of the BA2.

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Figure 12-2 Block diagram for the functions of the BA2

Optical input EDFA module Doped erbium fiber

Fiber distributor

Input isolate

WDM coupler

Output isolate

Filter

Optical splitter

Optical output

Input power monitor (Pin1)

Input power Pump current

Laser pump

Output power monitor (Pin2)

Output power

Pump current Temperature detect

Manual control

Laser shutdown
LOS in

Pump temperature control AD/DA

Control&Generation alarms
Control module

Communication module

Communication SCC unit

+3.3 V 5V

DC/DC converter module

DC/DC converter module

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse

+3.3 V backup power

EDFA Module
The optical amplifier unit consists of two EDFA modules. One is BA and the other PA. When the board is used as a pre-amplifier (PA), an optical filter with 1550.12 nm as the central wavelength is added to the optical output end of the module. A booster amplifier (BA) does not have the filter. A semi-conductor laser bump with 980 nm as the central wavelength is in the erbium fiber inside the EDFA module. Bump light and input signal light are coupled into the erbium fiber through an optical coupler. The input and output optical signals of the module are led out by two fiber splitters as per a specific coupling ratio. The optical signals are then converted to optical current by two PIN photoelectrical diodes. The input and output powers of the EDFA module are determined as per the optical signals. The module also applies optical isolating measures at the input and the output ends to improve the performance of the module.

Control Module
The control module:
l l l l

Detects and drives bump electricity Controls the pump temperature of laser Detects input and output power Reports alarms

The control module consists of A/D converting unit, D/A converting unit and CPU. The A/D converting unit converts the temperature value of the cooling electricity and the input/output
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optical power from analog values to digital values. The converted values are then sent to CPU, which generates performance reporting event or alarm. The A/D converting unit also converts bump electricity from analog values to digital values. The converted values are then sent to CPU. After the CPU processes the converted values, the D/A converting unit controls precisely the driving analog circuit of the bump laser of the EDFA optical module. The internal temperature of the bump laser module is kept at 25. The temperature sensor inside the bump laser outputs temperature change to drive cooler to keep the internal temperature of the bump laser module at 25.

Communication Module
The communication module supports ethernet communication.

DC/DC Converter Module

Through the DC/DC converter module, the power converting module provides required DC voltages for each chip on the board. The following voltages are provided: 5 V and +3.3 V. In addition, this module provides protection to the board +3.3 V power supply.

12.1.4 Front Panel

On the front panel of the BA2, there are indicators and interfaces.

Appearance of the Front Panel

Figure 12-3 shows the appearance of the front panel of the single-interface BA2.

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Figure 12-3 Front panel of the single-interface BA2

BA2
STAT ACT PROG SRV

OUT IN
BA2

Figure 12-4 shows the appearance of the front panel of the double-interface BA2.

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Figure 12-4 Front panel of the double-interface BA2

BA2
STAT ACT PROG SRV

OUT1 IN1 OUT2 IN2

BA2

Indicators
The following indicators are present on the front panel of the board:
l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
On the front panel of the single-interface BA2, there are a pair of optical interfaces, which transmit and receive one channel of optical signals. A pluggable optical module is used for easy maintenance. On the front panel of the double-interface BA2, there are two pairs of optical interfaces, which transmit and receive two channels of optical signals. Two pluggable optical modules are used for easy maintenance.

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WARNING
In practical engineering, if two LC optical interfaces are available on the front panel of the singleinterface BA2, only one optical interface (IN1/OUT1) is available. In the case of the BA2 with two LC optical interfaces on the front panel, determine whether the BA2 is a single-interface BA2 or a double-interface BA2 according to 12.1.6 Board Feature Code. Table 12-2 lists the type and usage of the single-interface BA2. Table 12-2 Optical interfaces of the single-interface BA2 Interface IN OUT Interface Type LC LC Usage Receives the first channel of optical signals. Transmits the first channel of optical signals.

Table 12-3 lists the type and usage of the double-interface BA2. Table 12-3 Optical interfaces of the double-interface BA2 Interface IN1 OUT1 IN2 OUT2 Interface Type LC LC LC LC Usage Receives the first channel of optical signals. Transmits the first channel of optical signals. Receives the second channel of optical signals. Transmits the second channel of optical signals.

12.1.5 Valid Slots

The BA2 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, or any of slots 1113 in the OptiX OSN 1500B subrack.

12.1.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code of the BA2 indicates the output optical power of the optical interfaces. Table 12-4 lists the relation between the board feature code and the output optical power.

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Table 12-4 Relation between the board feature code and output optical power for the BA2 Board Barcode SSN1BA201 SSN1BA202 SSN1BA203 SSN1BA204 SSN1BA205 Feature Code 01 02 03 04 05 Output Optical Power 14 dBm for dual-channel optical power amplification 17 dBm for dual-channel optical power amplification 14 dBm for optical power amplification 17 dBm for optical power amplification 14 or 17 dBm for dual-channel optical power amplification

12.1.7 Technical Specifications

The technical specifications of the BA2 cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications

Table 12-5 lists the specifications of the optical interfaces of the BA2. Table 12-5 Specifications of the optical interfaces of the BA2 Item Nominal bit rate Optical interface type Line code Input wavelength (nm) Range of input optical power (dBm) Output optical power (dBm) Noise figure (dB) Specification 2488320 kbit/s and 9953280 kbit/s V-16.2, U-16.2, L-64.2, V-64.2, U-64.2 NRZ BA: 1530 to 1565 BA: 6 to +3 BA: 13 to 15 or 15 to 17 BA: < 6.5

Mechanical Specifications
The mechanical specifications of the BA2 are as follows:
l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

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l

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Weight (kg): 1.0

Power Consumption
In the normal temperature (25), the maximum power consumption of the BA2 is 20 W.

12.2 BPA
This section describes the BPA, one-channel amplifier and one-channel pre-amplifier board, in terms of the version, function, principle, front panel and specifications. 12.2.1 Version Description The BPA board has two versions, N1 and N2. The difference between the two versions lies in the components of the EDFA optical module. 12.2.2 Function and Feature During the long-haul transmission of optical signals, the attenuation of signals is high. The BA and PA should be used, and thus the optical receiver can normally receive optical signals. 12.2.3 Working Principle and Signal Flow The BPA consists of the EDFA module, control module, communication module, and DC/DC converter module. 12.2.4 Front Panel On the front panel of the BPA, there are indicators and interfaces. 12.2.5 Valid Slots The BPA can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, or any of slots 1113 in the OptiX OSN 1500B subrack. 12.2.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the BPA indicates the output optical power of the optical interfaces. 12.2.7 Technical Specifications The technical specifications for the BPA cover the optical interface specifications, board dimensions, weight and power consumption.

12.2.1 Version Description

The BPA board has two versions, N1 and N2. The difference between the two versions lies in the components of the EDFA optical module. Table 12-6 lists the version description of the BPA board. Table 12-6 Version description of the BPA board Item Functional Version Difference Description The BPA board has two functional versions, N1 and N2. The N1BPA board consists of two EDFA optical modules, but the N2BPA board consists of one EDFA optical module only.

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Item Replaceability

Description The two versions can fully replace each other. If the ALS function is used, the N2BPA board is used to replace the N1BPA board. In this case, the ALS function needs to be enabled on the BPA board. If the N1BPA board is used to replace the N2BPA board, the ALS function needs to be enabled on the line board. If the ALS function is disabled, this restriction is not required.

12.2.2 Function and Feature

During the long-haul transmission of optical signals, the attenuation of signals is high. The BA and PA should be used, and thus the optical receiver can normally receive optical signals. Figure 12-5 shows the location of the BA and PA in the optical transmission system. Figure 12-5 Location of the BA and PA in the optical transmission system
Transmit
BA

Receive

Transmit

PA

Receive

Table 12-7 lists the functions and features of the BPA. Table 12-7 Functions and features of the BPA Function and Feature Basic function BPA Increases the launched optical power of the line board to 1315 dBm or 1518 dBm. Thus, when the G.652 optical fiber with a loss of 0.275 dB/km is used, the transmission distance can be 120 km, 130 km, or above. Provides the PA module to preamplify the received optical signals. Increases the power of the small volume of optical signals by 2225 dB(N1BPA), 22dB33dB(N2BPA), and thus enhances the sensitivity of the receiver to 37 dBm.

Function of the PA

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Function and Feature EDFA

BPA
l

Automatically controls the optical power and laser temperature of the EDFA module. Automatically monitors the input and output optical power of the EDFA module and queries the optical power. Protects the EDFA module. When no optical signals are input, the laser is automatically turned off. When optical signals are input, the laser is automatically turned on.

Performance and alarm monitoringa Software upgrade

Reports the performance parameters of the laser. Provides rich alarms and performance events for easy management and maintenance of the equipment. Supports the software upgrade and expansion without interrupting services.

a: The BPA does not support the alarm in the test state and the query of the power supply voltage.

12.2.3 Working Principle and Signal Flow

The BPA consists of the EDFA module, control module, communication module, and DC/DC converter module. Figure 12-6 shows the block diagram for the functions of the N1BPA. Figure 12-6 Block diagram for the working principle of the N1BPA
Optical input Optical output Optical input Optical output

EDFA optical module

Optical part

Pump current check

Drive module

Module temperature control

Input/output power check

Pump Drive current module check

Module temperature control

Input/output power check

Driving and detecting part

A/D or D/A conversion Data processing and communication part

SCC

Communication module

Control module

Figure 12-7 shows the block diagram for the functions of the N2BPA board.

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Figure 12-7 Block diagram for the working principle of the N2BPA
Optical input Optical output Optical input Optical output

EDFA optical module 1

EDFA optical module 2 Output power check

Optical part

Pump current check

Drive module

Module temperature control

Input/output power check

Pump Drive current module check

Module temperature control

Input power check

Driving and detecting Fixed filter part

A/D or D/A conversion Data processing and communication part

SCC

Communication module

Control module

Optical Part
The N1BPA board consists of two EDFA optical modules, but the N2BPA board consists of one EDFA optical module only. The EDFA optical module magnifies the optical power.

Driving and Detecting Part

The driving and detecting part provides the driving current for the EDFA optical module. It also checks the working state of each part in the EDFA optical module. Moreover, it predicts and handles the possible faults. In addition, it implements these functions such as checking the pumping current, driving the optical module, controlling the temperature of the optical module, and checking the input and output optical power.

Data Processing and Communication Part

The data processing and communication part consists of central processing unit (CPU) and peripheral chip. It analyzes the test result of the tested circuit. Then it adjusts the driving circuit based on the analysis result so that the gain or output optical power of the EDFA module keeps in the range of the rated value. It also sorts the abnormal states represented by the measured values and reports these abnormal states to the T2000.

12.2.4 Front Panel

On the front panel of the BPA, there are indicators and interfaces.

Appearance of the Front Panel

Figure 12-8 shows the appearance of the front panel of the BPA.

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Figure 12-8 Front panel of the BPA

BPA
STAT ACT PROG SRV

BOUT BIN POUT PIN

BPA

Indicators
The following indicators are present on the front panel of the board:
l l l l

Board hardware state indicator (STAT), which is green or red when lit. Service activating state indicator (ACT), which is green when lit. Board software state indicator (PROG), which is green or red when lit. Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
On the front panel of the BPA, there are two pairs of LC optical interfaces.Table 12-8 lists the type and usage of these optical interfaces. Table 12-8 Optical interfaces of the BPA Interface BIN Interface Type LC Usage Receives one channel of optical signals for amplification.
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Interface BOUT PIN POUT

Interface Type LC LC LC

Usage Transmits one channel of amplified optical signals. Receives one channel of optical signals for preamplification. Transmits one channel of pre-amplified optical signals.

12.2.5 Valid Slots

The BPA can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, or any of slots 1113 in the OptiX OSN 1500B subrack.

12.2.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code of the BPA indicates the output optical power of the optical interfaces. Table 12-9 lists the relation between the board feature code and the output optical power. Table 12-9 Relation between the board feature code and output optical power of the BPA Board Barcode SSN1BPA01, SSN2BPA01 Feature Code 01 Description Receiver sensitivity of the PA module: 37 dBm Output optical power of the BA module: 14 dBm SSN1BPA02 02 Receiver sensitivity of the PA module: 37 dBm Output optical power of the BA module: 17 dBm

12.2.7 Technical Specifications

The technical specifications for the BPA cover the optical interface specifications, board dimensions, weight and power consumption.

Optical Interface Specifications

Table 12-10 lists the specifications for the optical interfaces of the BPA.

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Table 12-10 Specifications for the optical interfaces of the BPA Item Nominal bit rate Optical interface type Line code Input wavelength (nm) Specification 2488320 kbit/s and 9953280 kbit/s V-16.2, U-16.2, L-64.2, V-64.2, U-64.2 NRZ BA: 1530 to 1565 PA: 1550.12 Range of input optical power (dBm) BA: 6 to +3 PA28 to 10 (working with the 10G line board) PA38 to10 (woking with the line board of less than 10G) Output optical power (dBm) Sensitivity (dBm) Noise figure (dB) N1BPA+13 to +15 or +15 to +17 (BA) N2BPA+13 to +15 (BA) PA: 37 BA: < 6.5 PA: < 6

NOTE

When performing loopback to the PA module of the BPA, prevent the damage caused by high input optical power to the optical module.

Mechanical Specifications
The mechanical specifications for the BPA are as follows:
l l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W) Weight (kg):

N1BPA: 1.0kg N2BPA: 1.2kg

Power Consumption
At the normal temperature (25), the maximum power consumption of the BPA is as follows:
l l

N1BPA: 20W N2BPA: 11W

12.3 COA
This section describes the COA, a case-shaped optical amplifier, in terms of the version, function, principle, front panel, installation position and specifications.

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12.3.1 Version Description The COA has three versions, 61, 62 and N1. 12.3.2 Function and Feature The COA is used to integrate the EDFA module, drive circuit, and communication circuit in an aluminium case. 12.3.3 Working Principle and Signal Flow The 61COA and N1COA consist of the EDFA module, control module, communication module, and DC/DC converter module. 12.3.4 Front Panel On the front panel of the COA, there are indicators and interfaces. 12.3.5 Installation Position The COA is case-shaped, and thus it is does not occupy a slot in the subrack. 12.3.6 Board Feature Code The code behind the board name in the barcode is the board feature code. The board feature code of the 61COA indicates the output optical power of the optical interfaces. 12.3.7 Technical Specifications The technical specifications of the COA cover the dimensions, weight and power consumption.

12.3.1 Version Description

The COA has three versions, 61, 62 and N1. The 62COA, 61COA and N1COA share the working principle. The difference among them lies in the optical amplifier modules they use. The 62COA uses the Raman optical amplifier module. The 61COA and N1COA use the EDFA optical amplifier module. Table 12-11 lists the details on the versions of the COA. Table 12-11 Version Description of the COA Item Functional version Difference Description The COA has three versions, 61, 62, and N1. The 61COA is the EDFA optical amplifier in the 1550-nm fiber communication window. The N1COA is the EDFA optical amplifier in the 1530 nm to 1560 nm fiber communication window. The N1COA does not have the filter and is a multi-wavelength amplifier. The 62COA uses the Raman optical amplifier module. Replaceability The versions cannot be replaced by each other.

12.3.2 Function and Feature

The COA is used to integrate the EDFA module, drive circuit, and communication circuit in an aluminium case.
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The COA is an external and independent amplifier, which does not occupy a slot and can work independently. The maximum numbers of the 61COA, N1COA, and 62COA that can be configured in a system are two, two, and one respectively.

61COA and N1COA

The 61COA and N1COA, erbium doped amplifiers, can be configured with only one EDFA optical module and be used as the BA, PA, or LA. Figure 12-9 shows the appearance of the 61COA and N1COA. The optical features of the 61COA are the same as those of the BPA and BA2. The main difference is that the 61COA and N1COA are external optical amplifier units, which are directly installed in the ETSI cabinetwithout occupying slots in the subrack and are independently powered. Figure 12-9 Appearance of the case-shaped 61COA and N1COA (PA)

The application of the 61COA and N1COA in the optical transmission system is the same as that of the BA2 and BPA. Table 12-12 lists the functions and features of the 61COA and N1COA. Table 12-12 Functions and features of the 61COA and N1COA Function and Feature Function of the BA 61COA and N1COA The 61COA enhances the launched optical power to 1315 dBm or 1517 dBm, and thus the valid transmission distance of optical signals can be extended. The N1COA is a PA, with a receiver sensitivity of 38 dBm. Supports the ALS function. Communicates with the CXL through the RS232 serial port, reports the alarms and performance events from the COA to the T2000, and receives the configuration commands issued by the T2000.

Function of the PA Automatic laser shutdown Function of the serial communication

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62COA
The 62COA, a case-shaped Raman optical amplifier, is used at the receive end of the SDH equipment. The 62COA inputs counter-propagated pumping optical signals to fibers for distributed Raman amplification. Different from that of the 61COA, the gain medium of Raman amplification is the line fiber that can realize better noise performance. Thus, the 62COA can extend the transmission distance, lower the signal-to-noise ratio and realize ultra long hop transmission for a single span. Figure 12-10 lists the appearance of the 62COA. Figure 12-10 Appearance of the case-shaped 62COA
4

2 3

1. Captive screw 4. ESD jack

2. Ejector lever 5. Power access board

3. COA board

The 62COA, a case-shaped Raman optical amplifier, is used at the receive end of the transmission system. During the transmission, the 62COA amplifies optical signals based on the stimulated Raman scattering of the fiber. The 62COA provides optical transmission for more than 170 km, when used with the EDFA. See Figure 12-11. Figure 12-11 Application of the optical Raman amplifier (62COA)
Raman Amplifier Signal light EDFA Fiber Transmitting end Pump light Coupler Pump light Laser Receiving end Optical receiver

During the optical transmission, the Raman amplifier amplifies optical signals by inputing counter-propagated pumping optical signals to fibers for distributed Raman amplification. Thus, the phase of optical signals is significantly different from that of pumping signals. The power
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fluctuation of the Raman pumping is offset in the counter-propagation, and thus the noise caused by the pumping can be effectively suppressed. Table 12-13 lists the functions and features of the 62COA. Table 12-13 Functions and features of the 62COA Function and Feature Basic function 62COA Configured at the receive end of the SDH system, and provides extra long-haul transmission (more than 170 km), when used with an EDFA at the transmit end with an output power of 17 dBm. The 62COA is a PA, with a receiver sensitivity of -39 dBm. Supports the ALS function. Communicates with the CXL through the RS232 serial port, reports the alarms and performance events from the COA to the T2000, and receives the configuration commands issued by the T2000.

Function of the PA Automatic laser shutdown Function of the serial communication

12.3.3 Working Principle and Signal Flow

The 61COA and N1COA consist of the EDFA module, control module, communication module, and DC/DC converter module. The working principle of the N1COA is similar to that of the 61COA. The 61COA has the filter unit but the N1COA does not. Figure 12-12 shows the block diagram for the functions of the 61COA and N1COA.

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Figure 12-12 Block diagram for the functions of the 61COA and N1COA
Optical input EDFA module Doped erbium fiber

Fiber distributor

Input isolate

WDM coupler

Output isolate

Filter

Optical splitter

Optical output

Input power monitor (Pin1)

Input power Pump current

Laser pump

Output power monitor (Pin2)

Output power

Pump current Temperature detect

Manual control

Laser shutdown
LOS in

Pump temperature control AD/DA

Control&Generation alarms
Control module

Communication module

Communication SCC unit

+3.3 V 5V

DC/DC converter module

DC/DC converter module

Fuse

-48 V/ -60 V -48 V/ -60 V

Fuse

+3.3 V backup power

EDFA Module
The optical amplifier unit consists of two EDFA modules. One is BA and the other PA. When the board is used as a pre-amplifier (PA), an optical filter with 1550.12 nm as the central wavelength is added to the optical output end of the module. A booster amplifier (BA) does not have the filter. A semi-conductor laser bump with 980 nm as the central wavelength is in the erbium fiber inside the EDFA module. Bump light and input signal light are coupled into the erbium fiber through an optical coupler. The input and output optical signals of the module are led out by two fiber splitters as per a specific coupling ratio. The optical signals are then converted to optical current by two PIN photoelectrical diodes. The input and output powers of the EDFA module are determined as per the optical signals. The module also applies optical isolating measures at the input and the output ends to improve the performance of the module.

Control Module
The control module:
l l l l

Detects and drives bump electricity Controls the pump temperature of laser Detects input and output power Reports alarms

The control module consists of A/D converting unit, D/A converting unit and CPU. The A/D converting unit converts the temperature value of the cooling electricity and the input/output
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optical power from analog values to digital values. The converted values are then sent to CPU, which generates performance reporting event or alarm. The A/D converting unit also converts bump electricity from analog values to digital values. The converted values are then sent to CPU. After the CPU processes the converted values, the D/A converting unit controls precisely the driving analog circuit of the bump laser of the EDFA optical module. The internal temperature of the bump laser module is kept at 25. The temperature sensor inside the bump laser outputs temperature change to drive cooler to keep the internal temperature of the bump laser module at 25.

Communication Module
The communication module supports ethernet communication.

DC/DC Converter Module

Through the DC/DC converter module, the power converting module provides required DC voltages for each chip on the board. The following voltages are provided: 5 V and +3.3 V. In addition, this module provides protection to the board +3.3 V power supply.

12.3.4 Front Panel

On the front panel of the COA, there are indicators and interfaces.

Appearance of the Front Panel

Figure 12-13 shows the appearance of the front panels of the 61COA and N1COA. Figure 12-13 Front panel of the 61COA and N1COA
8 9 10

11

1. ID DIP switch 5. RS232-2 9. OUT optical port

2. Running indicator 6. MONITOR-1 10. Power switch

3. Alarm indicator 4. RS232-1 7. MONITOR-2 8. IN optical port 11. 48 V power interface

Figure 12-14 shows the appearance of the front panel of the 62COA.

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Figure 12-14 Front panel of the 62COA

1. SC/PC optical interface 4. Fan board 7. RS232 -2 10. Power input interface

2. LSH optical interface 5. RJ-45 8. DIP switch (85 bits) 11. Power switch

3. Air filter 6. RS232-1 9. DIP switch (41 bits)

Indicators
The following indicators are present on the front panel of the board:
l l

Board running state (RUN), which is green when lit. Fan alarm indicator (ALM), which is red when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
On the front panel of the 61COA and N1COA, there are one pair of SC/PC optical interfaces, which are used to input or output one channel of optical signals. The input optical interface of the 62COA is connected to the LSH flange and the output optical interface is connected to the SC flange. Figure 12-15 shows the SC/PC optical interfaces of the 61COA and N1COA.

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Figure 12-15 SC/PC fiber connector

Figure 12-16 shows the flange and fiber connector used at the input optical interface of the 62COA. Figure 12-16 LSH flange and fiber connector

NOTE

The dust cap is specially designed for the LSH fiber jumper. Do not remove the cap during fiber connection. For normal fiber connection, directly insert the fiber jumper into the LSH flange.

The COA has two RS232 serial interfaces, which are connected to the SCC unit for reporting of alarms and performance events. Table 12-14 lists the pins of the RS232 interface.

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Table 12-14 Pins of the RS232 interface Front View RS232-1 2 3

1

RS232-2 2 3 5

Definition Pin for receiving data Pin for transmitting data Pin for common grounding

The RS232-2 interface is used in the case of several COA on one NE. Use the serial interface cable to connect the RS232-2 interface of the COA numbered 1 to the RS232-1 interface of the COA numbered 2. Then connect the RS232-2 interface of the COA numbered 2 to the RS232-1 of the COA numbered 1. Connect the RS232-1 and RS232-2 interfaces in this way. All the COA use the RS232-1 interface of the COA numbered 1 to communicate with the SCC unit in the subrack. The COA has two MONITOR interfaces. The MONITOR-1 and MONITOR-2 interfaces are the alarm output interfaces when the 61COA is used separately. The two interfaces are the same. Table 12-15 lists the pins of the MONITOR-1 and MONITOR-2 interfaces. Table 12-15 Pins of the MONITOR-1 and MONITOR-2 interfaces Front View MONITOR1 1, 6 2, 7
1

The 62COA has one RJ-45 connector, through which the 62COA is connected to the computer for software loading. Table 12-16 lists the pins of the RJ-45 connector of the 62COA.
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9
TIP

For the communication with the CXL, the RS232-1 interface of the COA is connected to the F&f interface through the serial control cable.

MONITOR-2 1, 6 2, 7

Definition The input optical power of the EDFA module is too low. The working current of the pump laser of the EDFA module crosses the threshold. The cooling current of the pump laser of the EDFA module crosses the threshold. The ambient temperature of the EDFA crosses the threshold. Digital ground.

3, 8

3, 8

4, 9 5

4, 9 5

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Table 12-16 Pins of the RJ-45 connector of the 62COA Front View Pin 1 2 3 4
8 7 6 5 4 3 2 1

Description Transmitting positive Transmitting negative Receiving positive Not defined Not defined Receiving negative Not defined

5 6 78

The COA has a DIP switch.

l

The DIP switch of the 61COA or N1COA is on the lower left panel and is used to set the ID for 61COA or N1COA. When you turn it upside, it is OFF. When you turn it downside, it is ON. The SCC uses the IDs to identify and communicate with the 61COA or N1COA. The DIP switch of the 62COA is used to set the ID of 62COA and the type of fibers. The DIP switch has eight bits, from the left to right. The most left one is 8 and the most right one is 1. For each bit, when you turn it upside, it means 0; when you turn it downside, it means 1. The first four bits (14) are used to set the board ID, which ranges from 20 to 35 and from 20 to 27 in actual using. The fifth bit is used to set the fiber type. If it is turned as 0, it indicates the fiber is of the G.652 type. If it is turned as 1, it indicates the fiber is of the G.655 type.

12.3.5 Installation Position

The COA is case-shaped, and thus it is does not occupy a slot in the subrack. In an ETSI cabinet, the 61COA or N1COA is intalled in a special bracket, and the 62COA is installed directly in the cabinet with the mounting ears. On the T2000, the logical slots of the 61COA, N1COA, and 62COA are slots 101102.

Installation of the 61COA or N1COA

The installation of the 61COA is taken as an example. The bracket with guide rails is fixed on the crossbars on both sides the cabinet. The 61COA is pushed into the brackets along the guide rails and then fixed. One bracket can house two 61COA horizontally. The front panel of the 61COA is at the front side of the cabinet. Figure 12-17 shows the installation of the 61COA.

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Figure 12-17 Position of the 61COA in the ETSI cabinet

Installation of the 62COA

The case-shaped 62COA can be installed in the 300 mm or 600 mm ETSI cabinet with mounting ears and screws. If the upward-wiring scheme is applied, the 62COA is installed at the bottom of the ETSI cabinet (first and third floating nuts). If the downward-wiring scheme is applied, the 62COA is installed in any idle place of the 2.6 m high cabinet or in the ETSI cabinet which is not fully configured.

12.3.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code of the 61COA indicates the output optical power of the optical interfaces. Table 12-17 lists the relation between the board feature code and the output optical power. Table 12-17 Relation between the board feature code and output optical power for the 61COA Board Barcode SS61COA01 SS61COA02 Feature Code 01 02 Output Optical Power 14 dBm 17 dBm

12.3.7 Technical Specifications

The technical specifications of the COA cover the dimensions, weight and power consumption.

Optical Interface Specifications

Table 12-18 lists the specifications of the optical interfaces of the COA.

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Table 12-18 Specifications of the optical interfaces of the COA Item Specification 61COA Line code Working wavelength (nm) Range of input optical power (dBm) Output optical power (dBm) Pump wavelength (nm) Max. on/off gain (dB) Noise figure (dB) NRZ 1550 BA: -6 to +3 PA: -10 to -37 +13 to +15 NA NA NA +15 to +17 -10 to -37 1550.12 39 to 20 (2.5 Gbit/s signals without FEC) NA 1451.2 > 15 (for the G.652 fiber) < 1.5 N1COA 62COA

Mechanical Specifications
The mechanical specifications of the 61COA and N1COA are as follows:
l l

Board dimensions (mm): 50 (H) x 190 (D) x 240 (W) Weight (kg): 3.5

The mechanical specifications of the 62COA are as follows:

l l

Board dimensions (mm): 86 (H) x 436 (D) x 294 (W) Weight (kg): 8.0

Power Consumption
In the normal temperature (25), the maximum power consumption of the 61COA and N1COA is 10 W. In the normal temperature (25), the maximum power consumption of the 62COA is 75 W.

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13
About This Chapter

Power Interface Boards

This chapter describes the power interface boards, such as the UPM (CAU), PIU, and PIUA. 13.1 UPM This section describes the UPM, an uninterruptable power module, in terms of the version, function, principle, front panel and specifications. 13.2 PIU This section describes the PIU, a power interface unit, in terms of the version, function, principle, front panel, configuration and specifications. 13.3 PIUA This section describes the PIUA, a power interface unit, in terms of the version, function, principle, front panel, configuration and specifications.

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13.1 UPM
This section describes the UPM, an uninterruptable power module, in terms of the version, function, principle, front panel and specifications. 13.1.1 Version Description None 13.1.2 Function and Feature The UPM, a special power supply system, is coded GIE4805S. 13.1.3 Working Principle and Signal Flow The UPM receives power from one channel of 220 V AC mains supply, which is rectified to 48 V DC power supply by the rectifier module. Finally, the UPM provides two channels of DC power supplies and one channel of battery power supply. 13.1.4 Rear Panel On the rear panel of UPM, there are indicators and interfaces of many types. 13.1.5 Valid Slots The UPM is in case shape, and thus it does not occupy a slot in the subrack. On the T2000, the logical slot of the UPM is slot 50. 13.1.6 Technical Specifications The technical specifications of the UPM cover dimensions and weight.

13.1.1 Version Description

None

13.1.2 Function and Feature

The UPM, a special power supply system, is coded GIE4805S. The UPM directly converts the 110 V or 220 V AC mains to the 48 DC communication voltage. As a result, the requirements of telecommunication carriers who cannot provide the 48 DC power to communication equipment or who require the usage of the storage battery can be met. The UPM consists of the power supply case (110 V or 220 V to 48 V) and storage battery. The output power of one UPM is 2 x 270 W. Figure 13-1 shows the appearance of the power supply case with a height of 1U. The power supply case of the UPM can be directly installed in a 19inch or ETSI cabinet. Figure 13-1 Appearance of the power supply case

80 E4 GI

5S

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One the T2000, the UPM is displayed as a CAU board. Thus, add a CAU on the T2000 to manage and maintain the UPM.

The storage battery of the UPM is used with the power supply case. If the external AC current normally charges the storage battery, the storage battery can provide power for four hours when the external 110 V or 220 V AC current is interrupted. When the UPM provides power supply for the OptiX OSN equipment, only one power supply case should be connected to the storage battery group. The OptiX OSN equipment requires two power supply cases and one storage battery group composed of four 12 V 40 Ah storage batteries. If the equipment does not require the storage battery, only configure one power supply case. The standard full configuration for each power supply case requires two rectifier modules and one monitoring module. Table 13-1 lists the functions and features of the UPM. Table 13-1 Functions and features of the UPM Item Two-channel hot backup UPM The converting portion of the UPM has the hot backup function of two-channel AC/DC rectifier modules. In addition, the two rectifier modules with the function of load balance can work at the same. If one rectifier module fails, the other one immediately takes over the entire load. As a result, the working equipment is not affected, and the system stability is enhanced. In the UPM power supply system, the AC/DC rectifier modules have the hot swap function. When the faulty rectifier module is removed, the other rectifier module is not affected. Thus, the system maintainability is enhanced. The UPM can protect the storage battery. When the mains supply is interrupted, the power supply system can automatically switch to the storage battery. Thus, the normal running of equipment is not affected. The capacity of the storage battery module is 40 Ah. The UPM integrates the monitoring module and T2000 monitoring module. The monitoring module monitors and controls the parameters and states of the rectifier module, AC/DC power distribution, and storage battery group in real time, and then reports the parameters and states to the T2000. The storage battery automaticallly realizes the floating charging and current limiting management. The band loading capacity of each rectifier module is 270 W.

Hot swap function

Protection function for the storage battery Function of monitoring

Band loading capacity

13.1.3 Working Principle and Signal Flow

The UPM receives power from one channel of 220 V AC mains supply, which is rectified to 48 V DC power supply by the rectifier module. Finally, the UPM provides two channels of DC power supplies and one channel of battery power supply.
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When the UPM works normally, the monitoring module controls the rectifier module, battery loop circuit and loading loop circuit, which then work according to the preset parameters and user settings. The monitoring module also monitors their status and data. When the mains power supply goes faulty, the battery power supply system supplies power to the equipment. Before the mains power supply goes faulty, the battery power supply system must be present. When the mains power supply fails and the battery starts discharging, the monitoring module reports the alarms indicating the fault of the mains power supply. As the battery discharges, the battery voltage decreases. When the battery voltage decreases to 45 V, the monitoring module reports the alarm indicating the undervoltage. When the battery voltage decreases to 43 V, the battery cuts off the connection to the equipment and protects itself. When the mains power supply recovers, the UPM works normally.

13.1.4 Rear Panel

On the rear panel of UPM, there are indicators and interfaces of many types.

Appearance of the Front Panel

Figure 13-2 shows the rear view of the UPM (subject to the UPM on site ). Figure 13-2 Rear view of the UPM
4
BAT BATBAT+ 48V+ 48VLOAD1 LOAD2

! CAUTION
DO NOT INVERT POLARITY

5
AC100~240 ALM Vout ALM Vout RUN

6
ALM

RS232

1 1. AC input 5. Load

2 2. Rectifier module/air outlet 6. Load 3. Communication interface

3 4. Battery interface

Indicators
The following indicators are for the rectifier module on the left of the UPM.
l l

Rectifier module fault indicator (ALM), which is red when lit. Rectifier module output state indicator (Vout), which is green when lit.

The following indicators are for the monitoring module on the top panel of the UPM.
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l l

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Power supply system fault indicator (ALM), which is red when lit. Power supply system indicator (RUN), which is green when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are four interfaces on the rear panel of the UPM. Table 13-2 lists the type and usage of these interfaces. Table 13-2 Interfaces on the rear panel of the UPM Interface AC100240 Red switch button Interface Type Power interface Button Usage Acts as a socket for the AC mains supply and accesses 110 V or 220 V AC power supply. Locates on the right of the panel of the rectifier module. Press the switch button to enable or disable the functioning of the rectifier module. The power supply system can connect to the SCC of the OptiX OSN equipment through this interface to realize the functions such as the alarm reporting and remote control. Connect the RS232 serial interface of one power box to the F&f interface of the OptiX OSN equipment. The T2000 then can monitor the battery and the power box. Connect the RS232 interface of the other power box to the ALM1 interface of the OptiX OSN equipment. The T2000 then can monitor the other power box. Three power output interfaces are on the most right of the power box. The top interface is a battery interface, which can be connected to the socket on the battery by using battery cables. The bottom two are loading interfaces, which can be connected to the OptiX OSN equipment and supply power to the equipment.

RS232 communication interface

RS232

Power output interface

Power interface

Table 13-3 lists the pins of the RS232 interface. Table 13-3 Pins of the RS232 interface of the UPM Item Pin for receiving data Pin for transmitting data Pin for common grounding
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Pin 2 3 5

Usage or on/off State Receives data. Transmits data. Grounds.

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Item Pins for alarms indicating faults of the rectifier module Pins for normal state of the rectifier module Pins for alarms indicating the off state of the AC power supply Pins for the normal state of the AC power supply Pins for the alarm indicating undervoltage discharged from the battery Pins for the alarm indicating no discharge from the battery

Pin 89

Usage or on/off State On

89 87

Off On

87 86

Off On

86

Off

13.1.5 Valid Slots

The UPM is in case shape, and thus it does not occupy a slot in the subrack. On the T2000, the logical slot of the UPM is slot 50.

13.1.6 Technical Specifications

The technical specifications of the UPM cover dimensions and weight.

Specifications of the power supply

Table 13-4 lists the specifications of the power supply of the UPM. Table 13-4 Specifications of the power supply of the UPM Item Input AC voltage range AC input Rated input current Nominal output voltage Rated output current Specification 90264 V AC One channel of monophase three-wire AC power: 47 Hz 63 Hz 3.5 A 54.00.5 V 8 A (Two loading outputs, each of which has the loading voltage not more than 5 A)

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Item Number of backup battery groups Charging current of the backup battery Fuse of the backup battery Undervoltage DC point of the battery Termination voltage point of the battery Floating charge voltage of the battery Regulated voltage precision Non-balance of load sharing

Specification 1 (40 Ah) 3A 10 A 460.5 V 43.50.5V -54.00.5 V 1% 5% (50%100% loading)

Rated efficiency of the integrated 80% device Peak stray noise voltage Voltage drop in the power panel (20) Electrical network adjustment rate 200 mV 500 mV 0.1%

Mechanical Specifications
The mechanical specifications of the UPM are as follows:
l l

Dimensions of the UPM (mm): 438 (H) x 240 (D) x 44 (W) Dimensions of a battery (mm): 197 (H) x 165 (D) x 170 (W)

13.2 PIU
This section describes the PIU, a power interface unit, in terms of the version, function, principle, front panel, configuration and specifications. The OptiX OSN 1500B supports the PIU and the OptiX OSN 1500A does not. 13.2.1 Version Description The functional version of the PIU is R1. 13.2.2 Function and Feature The PIU is used to access the power supply, and to provide the lightning protection and filtering. 13.2.3 Working Principle and Signal Flow
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The PIU consists of the protecting unit, filter unit, power detecting unit and clock protecting unit. 13.2.4 Front Panel On the front panel of the PIU, there are indicators and power interfaces. 13.2.5 Valid Slots The PIU can be housed in any of slots 1819 in the OptiX OSN 1500B subrack. 13.2.6 Technical Specifications The technical specifications of the PIU cover the dimensions, weight, power consumption, input voltage and fuse tube.

13.2.1 Version Description

The functional version of the PIU is R1.

13.2.2 Function and Feature

The PIU is used to access the power supply, and to provide the lightning protection and filtering. Table 13-5 lists the functions and features of the PIU. Table 13-5 Functions and features of the PIU Function and Feature Function of lightning protection Function of filtering Power supply interface Power supply of the FAN Clock interface Alarm monitoring Power supply backup PIU Provides the lightning protection, and reports the alarm indicating the failure of the lightning protection module. Enhances the electromagnetic compatibility of the system by filtering the power supply port and shielding the board. Provides one 50 W power interface for external devices, such as the COA. Provides 48 V 20% voltage for the FAN. Provides 75-ohm clock input and output interfaces, and protects clock signals. Reports the board in-service alarm. Supports the 1+1 hot backup. Any one PIU can provide power for the entire subrack by itself.

13.2.3 Working Principle and Signal Flow

The PIU consists of the protecting unit, filter unit, power detecting unit and clock protecting unit. Figure 13-3 shows the block diagram for the functions of the PIU.
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Figure 13-3 Block diagram for the functions of the PIU

NEG(-)
Protecting unit Filter unit

NEG(-)

RTN(+)

RTN(+)

Power detecting unit

Clock input
LED indication

Clock protecting unit

Clock output

Filter Unit
The filter unit uses the electromagnetic interference (EMI) filter to filter the electromagnetic interference signals and thus to keep the equipment running in a stable manner.

Protecting Unit
This unit is used to prevent the equipment from overcurrent and lightning.

Power Detecting Unit

The power detecting unit checks whether the input power supply is valid and uses indicators to indicate the status of the input power supply.

Clock Protecting Unit

This unit is used to protect the input clock signals.

13.2.4 Front Panel

On the front panel of the PIU, there are indicators and power interfaces.

Appearance of the Front Panel

Figure 13-4 shows the appearance of the front panel of the PIU.

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Figure 13-4 Front panel of the PIU

PIU

O I
POWER

NEG(-) RTN(+) CLK OUT

PIU

PWR CLK IN

PWS

Indicators
A power supply indicator (POWER) is present on the front panel of the board and is green when lit.. For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are three power interfaces on the front panel of the PIU. Table 13-6 lists the type and usage of the interfaces. Table 13-6 Interfaces on the front panel of the PIU Interface PWR ClK IN ClK OUT Interface Type Power input interface SMB SMB Usage Inputs the 48 V power supply. 75-ohm clock input interface (SMB) 75-ohm clock output interface (SMB)

13.2.5 Valid Slots

The PIU can be housed in any of slots 1819 in the OptiX OSN 1500B subrack.

13.2.6 Technical Specifications

The technical specifications of the PIU cover the dimensions, weight, power consumption, input voltage and fuse tube.
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Mechanical Specifications
The mechanical specifications of the PIU are as follows:
l l

Board dimensions (mm): 108 (H) x 110 (D) x 41.5 (W) Weight (kg): 1.3

Power Consumption
In the normal temperature (25), the maximum power consumption of the PIU is 1.5 W.

Input Voltage
The input voltage of the PIU ranges from 38.4 V to 72 V.

Fuse Tube
The main loop fuse of the PIU is 250 V-10 A-0.006 ohm.

13.3 PIUA
This section describes the PIUA, a power interface unit, in terms of the version, function, principle, front panel, configuration and specifications. The OptiX OSN 1500A supports the PIUA and the OptiX OSN 1500B does not. 13.3.1 Version Description The functional version of the PIUA is R1. 13.3.2 Function and Feature The PIUA is used to access the power supply, and to provide the lightning protection and filtering. 13.3.3 Working Principle and Signal Flow The PIUA consists of the power interface unit, protecting unit, filter unit, power supply detecting unit, fan power supply unit and external power supply interface unit. 13.3.4 Front Panel On the front panel of the PIUA, there are indicators and power interfaces. 13.3.5 Valid Slots The PIUA can be housed in any of slots 111 in the subrack. 13.3.6 Technical Specifications The technical specifications of the PIUA cover the dimensions, weight, power consumption, input voltage and fuse tube.

13.3.1 Version Description

The functional version of the PIUA is R1.

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13.3.2 Function and Feature

The PIUA is used to access the power supply, and to provide the lightning protection and filtering. Table 13-7 lists the functions and features of the PIUA. Table 13-7 Functions and features of the PIUA Function and Feature Function of lightning protection Function of filtering Power supply interface Power supply of the FAN Alarm monitoring Power supply backup PIUA Provides the lightning protection, and reports the alarm indicating the failure of the lightning protection module. Enhances the electromagnetic compatibility of the system by filtering the power supply port and shielding the board. Provides one 50 W power interface for external devices, such as the COA. Provides 48 V 20% voltage for the FAN. Reports the board in-service alarm. Supports the 1+1 hot backup. Any one PIU can provide power for the entire subrack by itself.

13.3.3 Working Principle and Signal Flow

The PIUA consists of the power interface unit, protecting unit, filter unit, power supply detecting unit, fan power supply unit and external power supply interface unit. Figure 13-5 shows the block diagram for the functions of the PIUA. Figure 13-5 Block diagram for the functions of the PIUA
External power supply interface NEG(-) RTN(+) Lightning protection module Filter module NEG(-) RTN(+)

Power detection

Fan power module

LED indication

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Power Interface Unit

This unit accesses the 48 V or 60 V power supply for the system.

Protection Unit
This unit is used to prevent the equipment from overcurrent and lightning.

Filter Unit
The filter unit uses the electromagnetic interference (EMI) filter to filter the electromagnetic interference signals and thus to keep the equipment running in a stable manner.

Power Detecting Unit

The power detecting unit checks whether the input power supply is valid and uses indicators to indicate the status of the input power supply.

Fan Power Supply Unit

This unit is used to supply stable power to the fans.

External Power Supply Interface Unit

This unit supplies 48 V power to the external equipment, such as the COA. The interfaces are present on the panel.

13.3.4 Front Panel

On the front panel of the PIUA, there are indicators and power interfaces.

Appearance of the Front Panel

Figure 13-6 shows the appearance of the front panel of the PIUA. Figure 13-6 Front panel of the PIUA

PIUA
POWER

PWS I O NEG(-) RTN(+)

ON OFF

PIUA

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Indicators
A power supply indicator (POWER) is present on the front panel of the board and is green when lit.. For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
On the front panel of the PIUA, there are two interfaces and one switch. Table 13-8 lists the type and usage of the interfaces and switch. Table 13-8 Interfaces and switch on the front panel of the PIUA Interface PWR PWS Interface Type Inputs the 48 V power supply. Output interface for the 50 W power supply Switch Usage Inputs the 48 V power supply. Outputs the 50 W power supply for the COA or HUB.

Power switch

Turn the switch to position 1 or ON to supply power to the equipment. Turn the switch to position 0 or OFF to shut the power supply to the equipment.

13.3.5 Valid Slots

The PIUA can be housed in any of slots 111 in the subrack.

13.3.6 Technical Specifications

The technical specifications of the PIUA cover the dimensions, weight, power consumption, input voltage and fuse tube.

Mechanical Specifications
The mechanical specifications of the PIUA are as follows:
l l

Board dimensions (mm): 111.8 (H) x 220 (D) x 25.4 (W) Weight (kg): 1.5

Power Consumption
In the normal temperature (25), the maximum power consumption of the PIUA is 3 W.

Input Voltage
The input voltage of the PIUA ranges from 38.4 V to 72 V.
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Fuse tube
The main loop fuse of the PIU is 250 V-10 A-0.006 ohm.

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14 Cables

14
About This Chapter
14.1 Fiber Jumper The following section describes the types of fiber jumpers and connectors.

Cables

This chapter describes the cables used for the equipment. The cables include the fiber jumpers, power cables, alarm cables, management cables, signal cables and clock cables.

14.2 Power Cables and Grounding Cables The power cables and grounding cables include the cabinet power cable, equipment supply cable, and UPM power cable. 14.3 Alarm Cable The alarm cables for the equipment include the alarm input/output cable, cabinet indicator cable, alarm concatenation cable and alarm input/output cable. 14.4 Management Cable The management cable includes the serial port cable, ordinary phone wire, COA concatenating cable and network cable. 14.5 Signal Cable The signal cable includes the E1/E3 signal cable, framed E1 signal cable and N x 64 kbit/s signal cable. The OptiX OSN 1500A supports only the E1/E3 signal cable. 14.6 Clock Cable The clock cable includes the clock cable and clock transfer cable.

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14.1 Fiber Jumper

The following section describes the types of fiber jumpers and connectors. 14.1.1 Types of Fiber Jumpers The OptiX OSN equipment can use various types of fiber jumpers. 14.1.2 Connector The OptiX OSN equipment can use various types of connectors.

14.1.1 Types of Fiber Jumpers

The OptiX OSN equipment can use various types of fiber jumpers. Table 14-1 lists the types of fiber jumpers used by the OptiX OSN equipment. Table 14-1 Types of fiber jumpers Usage Optical fiber that connects the OptiX OSN equipment to the ODF or connects the interface board of the OptiX OSN equipment to the optical fiber of other equipment Connector 1 LC/PC Connector 2 FC/PC Cable 2 mm SLM optical fiber 2 mm MLM optical fiber LC/PC SC/PC 2 mm SLM optical fiber 2 mm MLM optical fiber SC/PC LC/PC SC/PC LC/PC 2 mm SLM optical fiber 2 mm SLM optical fiber 2 mm MLM optical fiber LC/PC LC/PC FC/PC SC/PC 2 mm SLM optical fiber 2 mm SLM optical fiber Length 6 m, 10 m, 20 m, 30 m, 50 m 3 m, 5 m, 10 m, 20 m, 30 m, 50 m 5m, 10 m, 20 m, 30 m, 50 m 10 m, 20 m, 30 m, 50 m 2m, 5 m, 10 m, 20 m, 30 m, 50 m, 80 m 1.5 m, 3 m, 5 m, 10 m, 20 m, 30 m 3 m, 5 m, 10 m, 20 m, 30 m 6 m, 10 m, 20 m, 30 m, 50 m 5m, 10 m, 20 m, 30 m, 50 m

Optical fiber that interconnects the OptiX OSN equipment

Select the fiber connector and the fiber length according to the on-site survey.

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CAUTION
When selecting the fiber connector, make sure that the single-longitudinal mode or multilongitudinal mode optical transmitting module is connected to the single-mode fiber.

14.1.2 Connector
The OptiX OSN equipment can use various types of connectors. The four types of fiber connectors are listed as follows:
l

Interfaces on the front panel of boards are mostly the LC/PC optical interfaces. See Figure 14-1. The N2OU08 and 61COA provide the SC/PC optical interfaces. The "IN" interface on the externally-installed case-shaped 62COA uses the LSH/APC connector. See Figure 14-4. The ODF at the client side uses the FC/PC or SC/PC optical interface. Figure 14-3 and Figure 14-2 show the corresponding FC/PC and SC/PC optical connectors.

l l

Table 14-2 lists the description of the four optical connectors. Table 14-2 Types of connectors Internal Fiber Connector LC/PC LSH/APC FC/PC SC/PC Description Plug-in square fiber connector/protruding polished Connector with dust-proof cover/protruding polished (8 degrees) Round fiber connector/protruding polished Square fiber connector/protruding polished

LC/PC Optical Connector

Figure 14-1 shows the appearance of the LC/PC optical connector. Figure 14-1 LC/PC optical connector

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The axial operation instead of rotation is required to insert or remove the LC/PC optical interface. Align the head of the fiber jumper with the optical interface with proper strength to insert the fiber jumper into the LC/PC connector. To remove the LC/PC fiber jumper, first press the clip, and then push fiber connector inward slightly, and pull out the connector.

SC/PC Optical Connector

Figure 14-2 shows the appearance of the SC/PC optical connector. Figure 14-2 SC/PC optical connector

FC/PC Optical Connector

Figure 14-3 shows the appearance of the FC/PC optical connector. Figure 14-3 FC/PC optical connector

LSH/APC Optical Interface

Figure 14-4 shows the appearance of the LSH/APC optical interface.

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Figure 14-4 LSH/APC optical connector

14.2 Power Cables and Grounding Cables

The power cables and grounding cables include the cabinet power cable, equipment supply cable, and UPM power cable. 14.2.1 Cabinet 48 V/BGND/PGND Power Cable The 48 V, BGND and PGND power cables are used to supply power to the equipment in the cabinet. One end of the power cable connects to the power distribution cabinet and grounding bar in the equipment room, and the other end connects to the power distribution unit at the cabinet top. 14.2.2 Equipment 48 V/60 V Power Cable/PGND Grounding Cable The equipment 48 V/60 V power cable/PGND grounding cable directly connects to the external 48 V/60 Vpower supply and the PIU of the OptiX OSN 1500, and unit at the cabinet top and the PIU board on the subrack. The external 48 V/60 V power supply is led out to the OptiX OSN 1500 equipment. 14.2.3 UPM Power Cable This section describes the UPM power cable in terms of the structure, connection and technical specifications.

14.2.1 Cabinet 48 V/BGND/PGND Power Cable

The 48 V, BGND and PGND power cables are used to supply power to the equipment in the cabinet. One end of the power cable connects to the power distribution cabinet and grounding bar in the equipment room, and the other end connects to the power distribution unit at the cabinet top.

Structure
Figure 14-5 shows the structure of the 48 V cabinet power cable/BGND power grounding cable. Figure 14-6 and Figure 14-7 show the structure of the PGND protection grounding cable.

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Figure 14-5 Cabinet 48 V power cable and BGND power grounding cable
1 2

3
1. Cord end terminal 2. Bare connector-OT type 3. Cable tie

Figure 14-6 Cabinet PGND protection grounding cable (JG2)

1. Bare connector-OT type 4. Heat-shrink tube 7. Heat-shrink tube

2. Cable tie 5. Main tag

3. Bare connector (JG2) 6. Wire

Figure 14-7 Cabinet PGND protection grounding cable (OT)

1. Bare connector-OT type 4. Heat-shrink tube 7. Heat-shrink tube

2. Cable tie 5. Main tag

3. Bare connector (OT) 6. Wire

Pin Assignment
None
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Technical Specifications
Item 48 V cabinet power cable Connector 2 Connector 1 Cable type Cabinet BGND power grounding cable Connector 2 Connector 1 Cable type Cabinet PGND protection grounding cable Connector 1 Connector 3 Description Bare crimping terminal-OT type-16 mm2-M8-tin platingbare ring terminal Single cord end terminal-16 mm2-length 24 mm-inserted 12 mm deep-80A-green Power cable-450 V/750 V-16 mm2-round and bllue-85A Bare crimping terminal-OT type-16 mm2-M8-tin platingbare ring terminal Single cord end terminal-16 mm2-length 24 mm-inserted 12 mm deep-80A-green Power cable-450 V/750 V-16 mm2-round and black-85A Bare crimping terminal-OT type-25mm2-M8-tin platingbare ring terminal Bare crimping connector-JG2-25 mm2-M6-95A-tin plating, or bare crimping connector-JG2-25 mm2-M8-95Atin plating, or bare crimping terminal-OT type-25 mm2-M8tin plating-bare ring terminal Power cable-450 V/750 V-25 mm2-yellow and green-85 A CM 10 m, 20 m, 30 m

Cable type Fireproof level Length

14.2.2 Equipment 48 V/60 V Power Cable/PGND Grounding Cable

The equipment 48 V/60 V power cable/PGND grounding cable directly connects to the external 48 V/60 Vpower supply and the PIU of the OptiX OSN 1500, and unit at the cabinet top and the PIU board on the subrack. The external 48 V/60 V power supply is led out to the OptiX OSN 1500 equipment.

Structure
Figure 14-8 shows the structure of the equipment 48 V/60 V power cable. Figure 14-9 shows the structure of the PGND grounding cable.

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Figure 14-8 Structure of the equipment 48 V/60 V Power Cable

A3 A2 A1

Figure 14-9 PGND power cable

1. Bare connector-OT type 5. Main tag

2. Cable tie 6. Wire

3. Bare connector 7. Heat-shrink tube

4. Heat-shrink tube

Pin Assignment
For details on the pin assignment, refer to Table 14-3. Table 14-3 Equipment 48 V/60 V power cable Cable connector A1 A3 Corresponding cable W1 W2 Core color Blue (48 V/60 V power) Black (power ground)

Technical Specifications
Item Cable connector Equipment 48 V/60 V power cable Cable connector-D type-3PIN-female PGND grounding cable Bare crimping connector-OT-6 mm2M4-tin plating-pre-insulated ring terminal-1210AWG bare crimping connector-OT-6 mm2-M8-tin platinginsulated ring terminal-1210AWG

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Item Cable Type

Equipment 48 V/60 V power cable Wire-300 V-16AWGblack (the core is blue and black)-13A 2 CM Blue or black 15 m, 30 m

PGND grounding cable Wire-600 V-10AWG-yellow/green-50A

Number of cores Fireproof level Color Length

1 CM Yellow and green 15 m, 30 m

14.2.3 UPM Power Cable

This section describes the UPM power cable in terms of the structure, connection and technical specifications.

Structure
Figure 14-10 shows the power cable that is used to connect the UPM to the OptiX OSN 1500. Figure 14-10 Structure of the UPM power cable
A A1 A2 A3 B 1 2

X1

X2

Connection of the UPM Power Cable

Table 14-4 lists the connections of the UPM power cables. Table 14-4 Connection of the UPM power cable Cable Connector X1 A1 A3 Correspondi ng Cable W1 W2 Cable Connector X2 1 2 Core Color Blue (48 V/60 V power supply) Black (ground for the power supply)

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Specifications of the UPM Power Cable

Table 14-5 Specifications of the UPM power cable Item Cable connector X1 Cable connector X2 Cable Type Number of cores Fireproof class Color Length UPM Power Cable Cable connector-D type-3PIN-female (two female and one male) Common plug-2PIN-single row Cable-300 V-1.31 mm2-16 AWG-black (core: blue or black)-13 A 2 CM Core: blue or black 2.5 m

14.3 Alarm Cable

The alarm cables for the equipment include the alarm input/output cable, cabinet indicator cable, alarm concatenation cable and alarm input/output cable. 14.3.1 Alarm Input/Output Cable The alarm input cable is used to input the alarm signals of the external equipment to the OptiX OSN equipment. The alarm output cable is used to output the alarm signals to the central alarm monitoring equipment.

14.3.1 Alarm Input/Output Cable

The alarm input cable is used to input the alarm signals of the external equipment to the OptiX OSN equipment. The alarm output cable is used to output the alarm signals to the central alarm monitoring equipment. One end of the alarm input/output cable uses an RJ-45 connector to connect to the alarm input/ output interface of the equipment. The other end uses a connector to connect to the external equipment or central alarm monitoring equipment. The connector should be made according to the on-site equipment. Each alarm input/output alarm cable can transmits four channels of alarm signals.

Structure
Figure 14-11 shows the structure of the alarm input/output cable.

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Figure 14-11 Structure of the alarm input/output cable

1. Network interface connectorRJ-45

2. Main tag

A-A. Sectional view in direction A

Pin Assignment
Table 14-6 lists the pin assignment of the alarm input/output cable. Table 14-6 Pin assignment of the alarm input/output cable Connect or X1 X1.1 X1.2 X1.3 X1.6 X1.4 X1.5 X1.7 X1.8 Color Blue White Orange White Green White Brown White Twisted pair Twisted pair Twisted pair Relation Twisted pair Alarm Output Positive for critical and major alarms Negative for critical and major alarms Positive for minor and warning alarms Negative for minor and warning alarms Positive for alarm signal output 1 Negative for alarm signal output 1 Positive for alarm signal output 2 Negative for alarm signal output 2 Alarm Input SW_INPUT 1+ SW_INPUT 1 SW_INPUT 2+ SW_INPUT 2 SW_INPUT 3+ SW_INPUT 3 SW_INPUT 4+ SW_INPUT 4

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Technical Specifications
Item Connector X1 Cable type Description Network interface connector-8PIN-8 bit-shielded-crystal plug Twisted pair cable-120 ohms-SEYPVPV-0.5 mm-24AWG-8 coresPANTONE 430U Twisted pair cable-10015 ohms-shielded enhanced type 5 CAT5E SFTP-24AWG-8 core-PANTONE445U Number of cores Fireproof class Core diameter Length 8 CM 0.5 mm 10 m, 20 m, 30 m

14.4 Management Cable

The management cable includes the serial port cable, ordinary phone wire, COA concatenating cable and network cable. 14.4.1 OAM Serial Port Cable The OAM serial port cable is used for management and remote maintenance of the OptiX OSN equipment. 14.4.2 Serial 14/F1/F&f Serial Port Cable Use the RJ-45 connector to connect one end of the serial port cable to the Serial 14 interface, F1 or F&f serial port. Use the DB9 connector to connect the other end to the external detecting device or managed external device. 14.4.3 RS232/RS422 Serial Port Cable The RS232/RS422 serial port cable is used to transmit the management signaling between different subnets. 14.4.4 Ordinary Telephone Wire The telephone wire is used for orderwire communication. Use the RJ-11 connectors at both ends. Connect one end to PHONE interface of the equipment and connect the other end to the interface of the orderwire phone. 14.4.5 COA Concatenating Cable When several COA are installed in one cabinet, use the RS232 or RS422 serial port cables to connect these COA. 14.4.6 Straight Through Cable The straight through cable is used for the communication between the OptiX OSN equipment, the T2000 equipment and the Ethernet. Use the RJ-45 connectors at both ends. 14.4.7 Crossover Cable The crossover cable is used to directly connect the T2000 computer to the OptiX OSN equipment.

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14.4.1 OAM Serial Port Cable

The OAM serial port cable is used for management and remote maintenance of the OptiX OSN equipment. Use the RJ-45 connector to connect one end of the cable to the OAM interface of the equipment. Use the DB25 connector to connect the other end to a laptop, T2000 computer or modem.

Structure
Figure 14-12 shows the structure of the OAM serial port cable (DB25 connector). Figure 14-12 Structure of the OAM serial port cable

1. Network interface connectorRJ-45

2. Main tag 3. Cable connectorDB25 male

A-A. Sectional view in B-B. Sectional view in direction A direction B

Pin Assignment
Table 14-7 lists the pin assignment of the alarm input/output cable. Table 14-7 Pin assignment of the OAM serial port cable Connector X1 X1.2 X1.3 X1.6 X1.4 X1.5 Connector X2 X2.20 X2.2 X2.3 X2.7 Relation Single Single Single Twisted pair Description Data terminal ready (DTR) Transmit data (TD) Receive data (RD) Signaling ground (SG)

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Technical Specifications
Item Connector X1 Connector X2 Type Number of cores Fireproof class Length Description Network interface connector-8PIN-8 bit-shielded-crystal plug Cable connector-D type-25PIN-male or cable connector-D type-9PINmale Twisted pair cable-120 ohms-SEYPVPV-0.5 mm-24AWG-8 corePANTONE 430U 8 CM 5000 mm

14.4.2 Serial 14/F1/F&f Serial Port Cable

Use the RJ-45 connector to connect one end of the serial port cable to the Serial 14 interface, F1 or F&f serial port. Use the DB9 connector to connect the other end to the external detecting device or managed external device. The Serial 14/F1/F&f serial port cable is used for the following functions:
l l

Transparently transmits the environment detecting data signals. Manages the external device such as the COA.

Structure
Figure 14-13 shows the structure of the Serial 14/F1/F&f serial port cable. Figure 14-13 Structure of the Serial 14/F1/F&f serial port cable

1. Network interface connectorRJ-45

2. Main tag 3. Cable connectorDB25 male

A-A. Sectional view in B-B. Sectional view in direction A direction B

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Pin Assignment
Table 14-8 lists the pin assignment of the Serial 14/F1/F&f cable. Table 14-8 Pin assignment of the Serial 14/F1/F&f serial port cable Connector X1 X1.1 X1.2 X1.3 X1.6 X1.4 X1.8 X1.5 Connector X2 X2.8 X2.9 X2.6 X2.7 X2.3 X2.2 X2.5 Single Twisted pair Twisted pair Relation Twisted pair Description RS422RX+ RS422RX RS422TX+ RS422TX RS232RX RS232TX SG

Technical Specifications
Item Connector X1 Connector X2 Cable type Number of cores Fireproof class Length Description Network interface connector-8PIN-8 bit-shielded-crystal plug Cable connector-D type-9 PIN-male 1. Twisted pair-120 ohms-SEYPVPV-0.5 mm-24AWG-8 core-PANTONE 430U 2. Twisted pair-100 ohms-SEYVP-0.48 mm-26AWG-8 core-black 8 CM 15 m for cable type 1 and 3 m for cable type 2

14.4.3 RS232/RS422 Serial Port Cable

The RS232/RS422 serial port cable is used to transmit the management signaling between different subnets. Use the RJ-45 connectors at both ends. Connect one end to the RS232 or RS-422 serial port of the equipment. Connect the other end to the RS232 or RS-422 serial port of the equipment that requires the orderwire phone communication.

Structure
Figure 14-14 shows the structure of the RS232/RS422 serial port cable.
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Figure 14-14 Structure of the RS232/RS422 serial port cable

1. Network interface connectorRJ-45

2. Main tag

A-A. Sectional view in direction A

Pin Assignment
Table 14-9 lists the pin assignment of the RS232/RS422 serial port cable. Table 14-9 Pin assignment of the RS232/RS422 serial port cable Connector X1 X1.3 X1.6 X1.1 X1.2 X1.5 X1.4 X1.8 Connector X2 X2.1 X2.2 X2.3 X2.6 X2.5 X2.8 X2.4 Single Twisted pair Twisted pair Relation Twisted pair Description RX+ RX TX+ TX SG 232RX 232TX

Technical Specifications
Item Connector X1/X2 Cable type Number of cores Fireproof class Length Description Network interface connector-8PIN-8 bit-shielded-crystal plug Twisted pair cable-120 ohms-SEYPVPV-0.5 mm-24AWG-8 corePANTONE 430U 8 CM 15 m

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14.4.4 Ordinary Telephone Wire

The telephone wire is used for orderwire communication. Use the RJ-11 connectors at both ends. Connect one end to PHONE interface of the equipment and connect the other end to the interface of the orderwire phone.

Structure
Figure 14-15 shows the structure of the ordinary telephone wire. Figure 14-15 Structure of the ordinary telephone wire

1. Phone connector-RJ-11crystal plug

2. Main tag

Pin Assignment
Table 14-10 lists the pin assignment of the ordinary telephone wire. Table 14-10 Pin assignment of the ordinary telephone wire Connector X1 X1.1 X1.2 X1.3 X1.4 X1.5 X1.6 Connector X2 X2.1 X2.2 X2.3 X2.4 X2.5 X2.6 Description No connected No connected TIP RING No connected No connected

Technical Specifications
Item Connector X1/X2 Cable type Number of cores Fireproof class
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Description Network interface connector-6PIN-26 to 28AWG Power cable-150 V-UL20251-0.08 mm2-28AWG-black-1A-2-core telephone wire 2 CM
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Item Length

Description 15 m

14.4.5 COA Concatenating Cable

When several COA are installed in one cabinet, use the RS232 or RS422 serial port cables to connect these COA. Use the DB9 connectors at both ends. Connect one end to the RS232-1 of one COA and connect the other end to the RS232-2 of another COA.

Structure
Figure 14-16 shows the structure of the COA concatenating cable. Figure 14-16 Structure of the COA concatenating cable

1. Cable connector-DB25 male

2. Tag

A-A. Sectional view in direction A

Pin Assignment
Table 14-11 lists the pin assignment of the COA concatenating cable. Table 14-11 Pin assignment of the COA concatenating cable Connector X1 3 2 5 Connector X2 2 3 5 Grounding Remarks One pair

Technical Specifications
Item Connector X1/X2
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Description Cable connector-D type-9 PIN-male

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Item Cable type Number of cores Fireproof class Length

Description Twisted pair-100 ohms-UL2464-0.32 mm-28AWG-2P-Huawei gray Two pairs CM 0.6 m, 2.5 m

14.4.6 Straight Through Cable

The straight through cable is used for the communication between the OptiX OSN equipment, the T2000 equipment and the Ethernet. Use the RJ-45 connectors at both ends.

Structure
Figure 14-17 shows the structure of the straight through cable. Figure 14-17 Structure of the straight through cable

1. Network interface connectorRJ-45

2. Tag 1

3. Main tag

4. Tag 2

Pin Assignment
Table 14-12 lists the pin assignment of the straight through cable. Table 14-12 Pin assignment of the straight through cable Connector X1 X1.1 X1.2 X1.3 X1.6
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Connector X2 X2.1 X2.2 X2.3 X2.6

Color White or orange Orange White or orange Green

Relation Twisted pair

Twisted pair

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Connector X1 X1.4 X1.5 X1.7 X1.8

Connector X2 X2.4 X2.5 X2.7 X2.8

Color Blue White or orange White or brown Brown

Relation Twisted pair

Twisted pair

Technical Specifications
Item Connector X1/X2 Cable type Number of cores Fireproof class Length Description Network interface connector-crystal plug-8PIN-8bit-shielded-24 to 26AWG-CAT 6/used with SFTP network cable Communication cable-10015 ohms-shielded enhance type 5CAT5E-SFTP 24AWG-8 cores-PANTONE 445U 8 CM 5 m, 10 m, 20 m, 30 m

14.4.7 Crossover Cable

The crossover cable is used to directly connect the T2000 computer to the OptiX OSN equipment. Uses the RJ-45 connectors at both ends. Connect one end to the ETH interface of the equipment and connect the other end to the network interface of the computer.

Structure
Figure 14-18 shows the structure of the crossover cable. Figure 14-18 Structure of the crossover cable

1. Network interface connectorRJ-45

2. Tag 1

3. Main tag

4. Network cable

5. Tag 2

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Pin Assignment
Table 14-13 lists the pin assignment of the crossover cable. Table 14-13 Pin assignment of the crossover cable Connector X1 X1.6 X1.3 X1.1 X1.2 X1.4 X1.5 X1.7 X1.8 Connector X2 X2.2 X2.1 X2.3 X2.6 X2.4 X2.5 X2.7 X2.8 Color Orange White or orange White or green Green Blue White or blue White or brown Brown Twisted pair Twisted pair Twisted pair Relation Twisted pair

Technical Specifications
Item Connector X1/X2 Cable type Number of cores Fireproof class Length Description Network interface connector-crystal plug-8PIN-8bit-shielded-24 to 26AWG-CAT 6/used with SFTP network cable Communication cable-1005 ohms-CAT5E-SFTP 24AWG-8 coresPANTONE 445U 8 CM 5 m, 30 m

14.5 Signal Cable

The signal cable includes the E1/E3 signal cable, framed E1 signal cable and N x 64 kbit/s signal cable. The OptiX OSN 1500A supports only the E1/E3 signal cable. 14.5.1 75-ohm 8 x E1 Cable The 75-ohm 8 x E1 cable is used to input and output E1 signals. 14.5.2 75-ohm 16 x E1 Cable The 75-ohm 16 x E1 cable is used to input and output E1 signals, and is usually connected to the interface of the L75S interface board. 14.5.3 120-ohm 8 x E1 Cable
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The 120-ohm 8 x E1 cable is used to input and output E1 signals. 14.5.4 120-ohm 16 x E1 Cable The 120-ohm 8 x E1 cable is used to input and output E1 signals. 14.5.5 E3/T3/STM-1 Cable The E3/T3/STM-1 cable is used to input and output E3/T3/STM-1 signals. Use the SMB connector at one end to connect the cable to the E3/T3/STM-1 interface board. Use a connector to connect the other end to the DDF. The connector should be made according to the on-site requirements. 14.5.6 Framed E1 Cable The framed E1 cable is connected to the DB44 connector of the DM12 to access 8 x framed E1 signals. 14.5.7 N x 64 kbit/s Cables The N x 64 kbit/s cable is connected to the DB28 connector of the DM12 to access one channel of N x 64 kbit/s services.

14.5.1 75-ohm 8 x E1 Cable

The 75-ohm 8 x E1 cable is used to input and output E1 signals. Use the DB44 connector at one end to connect the cable to the 75-ohm 8 x E1 electrical interface board. Use a connector to connect the other end to the digital distribution frame (DDF). The connector should be made according to the on-site requirements. Each cable can transmit eight channels of E1 signals.

Structure
Figure 14-19 shows the structure of the 75-ohm 8 x E1 cable. Figure 14-19 Structure of the 75-ohm 8 x E1 cable

1. Cable connector-D type-44 PIN-male 3. Tag 3, marked: "W2 (E1:5 to 8)"

2. Tag 1, marked: "W1 (E1:1 to 4)" 4. Main tag

Pin Assignment
Table 14-14 lists the pin assignment of the 75-ohm 8 x E1 cable.
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Table 14-14 Pin assignment of the 75-ohm 8 x E1 cable Conne ctor 38 23 37 22 36 21 35 20 15 30 14 29 13 28 12 27 Shell Cable W1 Core Ring Tip Ring Tip Ring Tip Ring Tip Ring Tip Ring Tip Ring Tip Ring Tip External braid shield layer 8 T4 6 T3 4 T2 2 T1 7 R4 5 R3 3 R2 No. 1 R1 34 19 33 18 32 17 31 16 11 26 10 25 9 24 8 7 Shell Remarks Connector Cable W2 Core Ring Tip Ring Tip Ring Tip Ring Tip Ring Tip Ring Tip Ring Tip Ring Tip External braid shield layer 8 T8 6 T7 4 T6 2 T5 7 R8 5 R7 3 R6 No. 1 Remark s R5

Technical Specifications
Item Connector X Cable type Fireproof class Number of cores Cover diameterinsulation diameterconductor diameter Length Description Cable connector-D type-44 PIN-male Coaxial cable-SYFVZP-75-1-1x8(A)-75 ohm-9.65 mm-1.2 mm-0.252 mm-Huawei white CM 8 x E1 9.65 mm-1.2 mm-0.252 mm

3 m, 10 m, 15 m, 20 m, 25 m, 30 m, 40 m

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CAUTION
The pin assignment table for the E1 cable is placed in the same packing case with the cable. Do not discard it before installation.

14.5.2 75-ohm 16 x E1 Cable

The 75-ohm 16 x E1 cable is used to input and output E1 signals, and is usually connected to the interface of the L75S interface board. Use the 2mmHM connector at one end to connect the cable to the 75-ohm E1 electrical interface board. Use a connector to connect the other end to the DDF. The connector should be made according to the on-site requirements. Each cable can transmit 16 channels of E1 signals.

Structure
Figure 14-20 shows the structure of the 75-ohm 16 x E1 cable. Figure 14-20 Structure of the 75-ohm 16 x E1 cable
Main tag

1. Cable connector

2. Terminal

Pin Assignment
Table 14-15 lists the pin assignment of the 75-ohm 16 x E1 cable. Table 14-15 Pin assignment of the 75-ohm 16 x E1 cable Connec tor X a1 a2 a3 a4 a6
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Cable W Core Tip Ring Tip Ring Tip 3 2 No. 1

Remar ks R1

Connec tor X a10 a11

Cable W Core Tip Ring Tip Ring Tip 19 18 No. 17

Remark s R9

T1

a12 a13

T9

R2

a15

R10

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Connec tor X a7 a8 a9 b1 b2 b3 b4 b6 b7 b8 b9 c1 c2 c3 c4 c6 c7 c8 a9 d1 d2 d3 d4 d6 d7 d8 d9

Cable W Core Ring Tip Ring Tip Ring Tip Ring Tip Ring Tip Ring Tip Ring Tip Ring Tip Ring Tip Ring Tip Ring Tip Ring Tip Ring Tip Ring 16 15 14 13 12 11 10 9 8 7 6 5 4 No.

Remar ks

Connec tor X a16

Cable W Core Ring Tip Ring Tip Ring Tip Ring Tip Ring Tip Ring Tip Ring Tip Ring Tip Ring Tip Ring Tip Ring Tip Ring Tip Ring Tip Ring 32 31 30 29 28 27 26 25 24 23 22 21 20 No.

Remark s

T2

a17 a18

T10

R3

b10 b11

R11

T3

b12 b13

T11

R4

b15 b16

R12

T4

b17 b18

T12

R5

c10 c11

R13

T5

c12 c13

T13

R6

c15 c16

R14

T6

c17 c18

T14

R7

d10 d11

R15

T7

d12 d13

T15

R8

d15 d16

R16

T8

d17 d18

T16

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Technical Specifications
Item Connector X Cable type W Fireproof class Number of cores Cover diameterinsulation diameterconductor diameter Length Description 2mmHM conductor connector-4 x 18PIN-28 to 30AWG-crimp Coaxial cable-SYFVZP-75-1-1x32(A)-75 ohms-18 mm-1.2 mm-0.254 mm-Huawei gray CM 16 x E1 18mm-1.2 mm-0.254mm

10 m, 15 m, 20 m, 25 m, 30 m

CAUTION
The pin assignment table for the E1 cable is placed in the same packing case with the cable. Do not discard it before installation.

14.5.3 120-ohm 8 x E1 Cable

The 120-ohm 8 x E1 cable is used to input and output E1 signals. Use the DB44 connector at one end to connect the cable to the 120-ohm E1 electrical interface board. Use a connector to connect the other end to the DDF. The connector should be made according to the on-site requirements. Each cable can transmit 8 channels of E1 signals.

Structure
Figure 14-21 shows the structure of the 120-ohm 8 x E1 cable.

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Figure 14-21 Structure of the 120-ohm 8 x E1 cable

1. Cable connector-D type-44PIN-male 3. Tag 3, marked:" W2 (RX1~8) "

2. Tag 1, marked:" W1 (TX1~8) " 4. Main tag

Pin Assignment
Table 14-16 lists the pin assignment of the 120-ohm 8 x E1 cable. Table 14-16 Pin assignment of the 120-ohm E1 cable Connecto r 15 30 14 29 13 28 12 27 11 26 10 25 9 Cable W1 Core Blue White Orang e White Green White Brow n White Grey White Blue Red Orang e Twisted pair Twisted pair Twisted pair T5 Twisted pair Twisted pair T3 No. Twisted pair Twisted pair Remar ks Tx1 Connecto r 38 23 T2 37 22 36 21 T4 35 20 34 19 T6 33 18 T7 32 Cable W2 Core Blue White Orang e White Green White Brown White Grey White Blue Red Orang e Twisted pair Twisted pair Twisted pair R5 Twisted pair Twisted pair R3 No. Twisted pair Twisted pair Remar ks Rx1

R2

R4

R6

R7

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Connecto r 24 8 7 Shell

Cable W1 Core Red Green Red Twisted pair No.

Remar ks

Connecto r 17

Cable W2 Core Red Green Red Twisted pair No.

Remar ks

T8

31 16 Shell

R8

External braid shield layer

External braid shield layer

Technical Specifications
Item Connector X Cable type Number of cores Inner conductor diameter Fireproof class Length Description Cable connector-D type-44PIN-male Communication cable-120 ohms-SEYPVPV-0.5 mm-24AWG-16 core-PANTONE 430U 16 0.5 mm CM 10 m, 15 m, 20 m, 30 m, 40 m

14.5.4 120-ohm 16 x E1 Cable

The 120-ohm 8 x E1 cable is used to input and output E1 signals. Use the 2mmHM connector at one end to connect the cable to the 120-ohm E1 electrical interface board, L12S or PL1B. Use a connector to connect the other end to the DDF. The connector should be made according to the on-site requirements. Each cable can transmit 16 channels of E1 signals.

Structure
Figure 14-22 shows the structure of the 120-ohm 16 x E1 cable.

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Figure 14-22 Structure of the 120-ohm 16 x E1 cable

3 W2

X 2

W1

1. Cable connector

2. Terminal

3. Main tag

Pin Assignment
Table 14-17 lists the pin assignment of the 120-ohm 16 x E1 cable. Table 14-17 Pin assignment of the 120-ohm 16 x E1 cable Conne ctor X a1 a2 a6 a7 b1 b2 b6 b7 c1 c2 c6 c7 d1 d2 d6 d7 a10 a11
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Cable W1 Core Blue White Orange White Green White Brown White Grey White Blue Red Orange Red Green Red Brown Red No. Twiste d pair Twiste d pair Twiste d pair Twiste d pair Twiste d pair Twiste d pair Twiste d pair Twiste d pair Twiste d pair

Remark s Rx1

Connect or X a3 a4

Cable W2 Core Blue White Orange White Green White Brown White Grey White Blue Red Orange Red Green Red Brown Red No. Twiste d pair Twiste d pair Twiste d pair Twiste d pair Twiste d pair Twiste d pair Twiste d pair Twiste d pair Twiste d pair

Remarks

Tx1

Rx2

a8 a9

Tx2

Rx3

b3 b4

Tx3

Rx4

b8 b9

Tx4

Rx5

c3 c4

Tx5

Rx6

c8 c9

Tx6

Rx7

d3 d4

Tx7

Rx8

d8 d9

Tx8

Rx9

a12 a13

Tx9

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Conne ctor X a15 a16 b10 b11 b15 b16 c10 c11 c15 c16 d10 d11 d15 d16 a5

Cable W1 Core Grey Red Blue Black Orange Black Green Black Brown Black Grey Black Blue Yellow Shell No. Twiste d pair Twiste d pair Twiste d pair Twiste d pair Twiste d pair Twiste d pair Twiste d pair

Remark s Rx10

Connect or X a17 a18

Cable W2 Core Grey Red Blue Black Orange Black Green Black Brown Black Grey Black Blue Yellow Shell No. Twiste d pair Twiste d pair Twiste d pair Twiste d pair Twiste d pair Twiste d pair Twiste d pair

Remarks

Tx10

Rx11

b12 b13

Tx11

Rx12

b17 b18

Tx12

Rx13

c12 c13

Tx13

Rx14

c17 c18

Tx14

Rx15

d12 d13

Tx15

Rx16

d17 d18 a14

Tx16

External braid shield layer

External braid shield layer

Technical Specifications
Item Connector X Cable type W1/W2 Number of cores Inner conductor diameter Fireproof class Length Description 2mmHM conductor connector-4 x 18PIN-24 to 26AWG-crimp Nominal twisted pair cable-120 ohms-SEYPVPV-0.5 mm-24AWG-32 core-PANTONE 430U 32 0.5 mm

CM 10 m, 15 m, 20 m, 25 m, 30 m

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14.5.5 E3/T3/STM-1 Cable

The E3/T3/STM-1 cable is used to input and output E3/T3/STM-1 signals. Use the SMB connector at one end to connect the cable to the E3/T3/STM-1 interface board. Use a connector to connect the other end to the DDF. The connector should be made according to the on-site requirements.

Structure
Figure 14-23 shows the structure of the E3/T3/STM-1 cable. Figure 14-23 Structure of the E3/T3/STM-1 cable

1. Coaxial connector-SMB

2. Main tag

3. Coaxial cable

Pin Assignment
None

Technical Specifications
Item Connector Cable I Description Coaxial connector-SMB-75 ohms-straight and female Coaxial cable-75 ohms-3.9 mm-2.1 mm-0.34 mm-shielded Cover diameter 3.9 mm-insulation diameter 2.1 mm-conductor diameter 0.34 mm Length: 10 m, 15 m, 20 m, 30 m Cable II Coaxial cable-75 ohms-4.4 mm-2.4 mm-0.4 mm-shielded-gray Cover diameter 4.4 mm-insulation diameter 2.4 mm-conductor diameter 0.4 mm Length: 15 m, 20 m, 25 m, 30 m, 40 m Cable III Coaxial cable-75 ohms-6.7 mm-3.8 mm-0.61 mm-shielded-gray Cover diameter 6.7 mm-insulation diameter 3.8 mm-conductor diameter 0.61 mm Length: 15 m, 20 m, 25 m, 30 m, 130 m Cable IV Coaxial cable-75 ohms-5.80 mm-3.71 mm-0.643 mm-black Cover diameter 5.80 mm-insulation diameter 3.71 mm-conductor diameter 0.643 mm
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Item

Description Length: 30 cm

Fireproof class

CM

14.5.6 Framed E1 Cable

The framed E1 cable is connected to the DB44 connector of the DM12 to access 8 x framed E1 signals. The framed E1 cables of 75 ohms and 120 ohms are available.
l

See the section that describes the 75-ohm 8 x E1 cable for details on the structure, pin assignment and technical specifications of the 75-ohm framed E1 cable. See the section that describes the 120-ohm 8 x E1 cable for details on the structure, pin assignment and technical specifications of the 120-ohm framed E1 cable.

14.5.7 N x 64 kbit/s Cables

The N x 64 kbit/s cable is connected to the DB28 connector of the DM12 to access one channel of N x 64 kbit/s services. Table 14-18 lists the pin assignment of the DB28 connector. Table 14-18 Pin assignment of the DB28 connector of the DM12 Pin 1 2 3 4 5 6 7 8 9 10 11
14-32

Signal TXD+ TXD TXC+ TXC NC GND MODE0 MODE1 MODE2 MODE_DCE DCD+

Directi on ---> ---> <--> <--> ----<--<--<--<--<-->

Description Transmits data. Transmits data. The DCE provides the transmitting clock to the DTE. The DCE provides the transmitting clock to the DTE. Circuit_GND Identifies the cable type. Identifies the cable type. Identifies the cable type. Identifies the DCE/DTE cable type. Detects the carrier.
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Pin 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28

Signal DCD RTS+ RTS TXCE+ TXCE RXC+ RXC RXD+ RXD GND LL CTS+ CTS DSR+ DSR DTR+ DTR

Directi on <--> ---> ---> ---> ---> <--<--<--<------<--> <--<--<--<-----> --->

Description Detects the carrier. Requests for transmission. Requests for transmission. Transmitting data clock for DCE and loopback clock for DTE. Transmitting data clock for DCE and loopback clock for DTE. Receives clock. Receives clock. Receives data. Receives data. Shield_GND Loopback control signals. Prepares for transmission. Prepares for transmission. Prepares the DCE. Prepares the DCE. Prepares the DTE. Prepares the DTE.

According to the protocols for the N x 64 kbit/s signals, the N x 64 kbit/s cables are classified into the following ten types.
l l l l l l l l l l

V.35 DCE cable V.35 DTE cable V.24 DCE cable V.24 DTE cable X.21 DCE cable X.21 DTE cable RS449 DCE cable RS449 DTE cable RS530 DCE cable RS530 DTE cable
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V.35 DCE Cable

Figure 14-24 shows the structure of the V.35 DCE cable. Figure 14-24 Structure of the V.35 DCE cable
A-A 1 2 3 B-B

Pos.28 A W B

Pos.1
C A E K P U Y CC HH MM D J N T X BB FF LL B F L R V Z DD JJ NN

X1

X2

M S W AA EE KK

1. Cable connector-D28 male 3. Cable connector-D34 female + D34 plastic shell

2. Main tag

Table 14-19 lists the pin assignment of the V.35 DCE cable. Table 14-19 Pin assignment of the V.35 DCE cable Connector X1 19 20 1 2 15 16 3 4 17 18 11 22 23 13 25
14-34

Connector X2 P S R T V X Y AA U W F J C D H

Relation Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

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Connector X1 27 21 6+7+8

Connector X2 E B A

Relation Short circuiting for 68

The technical specifications of the V.35 DCE cable are as follows. Item Connector X1 Connector X2 Description Cable connector-D type dual-edge tube-28PIN-straight male-cable solder-spacing 0.8 mm-28 to 30AWG, exclusively used for OEM Cable connector-V35 plug-34PIN-injection molding shell-tube, exclusively used for OEM Cable connector-V35 DCE plug-34PIN-female-cable crimping-core, exclusively used for OEM Cable type Number of cores Core diameter Length Twisted pair cable-100 ohms-0.38 mm-28AWG-5 pairs and 8 corePANTONE 296U-exclusively used by OEM 5 pairs and 8 cores 0.32 mm 3m

V.35 DTE Cable

Figure 14-25 shows the structure of the V.35 DTE cable. Figure 14-25 Structure of the V.35 DTE cable
A-A B-B

1
Pos.28 A

Pos.1

X1

X2

A B C D E F H J L N K M R T P S V X U W Z BB Y AA DD FF CC EE JJ LL HH KK NN MM

1. Cable connector-D28 male 4. Ordinary terminal

2. Main tag 5. Cable connector-D34 male

3. Cable connector-D34 plastic shell

Table 14-20 lists the pin assignment of the V.35 DTE cable.
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Table 14-20 Pin assignment of the V.35 DTE cable Connector X1 1 2 19 20 17 18 3 4 15 16 11 22 13 23 27 25 21 6+10+7+8 Connector X2 P S R T V X Y AA U W F J C D H E B A Short circuiting 6, 7, 8 and 10 Twisted pair Twisted pair Twisted pair Twisted pair Relation Twisted pair

The technical specifications of the V.35 DTE cable are as follows. Item Connector X1 Connector X2 Description Cable connector-D type dual-edge tube-28PIN-straight male-cable solderspacing 0.8 mm-28 to 30AWG, exlusively used for OEM Cable connector-V35 plug-34PIN-injection molding shell-tube, exclusively used for OEM Cable connector-V35 DTE plug-34PIN-male-cable crimping-core, exclusively used for OEM Cable type Number of cores
14-36

Twisted pair cable-100 ohms-0.38 mm-28AWG-5 pairs and 8 corePANTONE 296U-exclusively used by OEM 5 pairs and 8 cores

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Item Core diameter Length

Description 0.32 mm 3m

V.24 DCE Cable

Figure 14-26 shows the structure of the V.24 DCE cable. Figure 14-26 Structure of the V.24 DCE cable
A-A B-B

1
Pos.25

3
Pos.1

Pos.28 Pos.1

X2

X1

1. Cable connector-D25 female

2. Main tag

3. Cable connector-D28 male

Table 14-21 lists the pin assignment of the V.24 DCE cable. Table 14-21 Pin assignment of the V.24 DCE cable Connector X1 19 1 23 13 25 27 11 22 3 17 15 21
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Connector X2 2 3 4 5 20 6 8 18 15 24 17 1

Relation Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Single
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Connector X1 6+7

Connector X2 7

Relation Short circuiting 6 and 7

The technical specifications of the V.24 DCE cable are as follows. Table 14-22 Technical specifications of the V.24 DCE cable Item Connector X1 Connector X2 Cable type Number of cores Core diameter Length Description Cable connector-D type dual-edge tube-28PIN-straight male-cable solderspacing 0.8 mm-28 to 30AWG, exlusively used for OEM Cable connector-D type-25PIN-female-cable solder Twisted pair cable-100 ohms-0.38 mm-28AWG-5 pairs and 8 corePANTONE 296U-exclusively used by OEM 5 pairs and 8 cores 0.32 mm 3m

V.24 DTE Cable

Figure 14-27 shows the structure of the V.24 DTE cable. Figure 14-27 Structure of the V.24 DTE cable
A-A
1
Pos.1 Pos.1 A

B-B
2 3

Pos.28 Pos.25

X2

X1

1. Cable connector-D25 male

2. Main tag

3. Cable connector-D28 male

Table 14-23 lists the pin assignment of the V.24 DTE cable. Table 14-23 Pin assignment of the V.24 DTE cable Connector X1 1
14-38

Connector X2 2

Relation Twisted pair

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Connector X1 19 13 23 27 25 11 22 3 15 17 21 6+10+7

Connector X2 3 4 5 20 6 8 18 15 24 17 1 7

Relation

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Single Short circuiting 6, 10 and 7

The technical specifications of the V.24 DTE cable are as follows. Table 14-24 Technical specifications of the V.24 DTE cable Item Connector X1 Connector X2 Cable type Number of cores Core diameter Length Description Cable connector-D type dual-edge tube-28PIN-straight male-cable solderspacing 0.8 mm-28 to 30AWG, exlusively used for OEM Cable connector-D type-25PIN-male-cable solder Twisted pair cable-100 ohms-0.38 mm-28AWG-5 pairs and 8 corePANTONE 296U-exclusively used by OEM 5 pairs and 8 cores 0.32 mm 3m

X.21 DCE Cable

Figure 14-28 shows the structure of the X.21 DCE cable.

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Figure 14-28 Structure of the X.21 DCE cable

A-A
1
Pos.15

B-B
2 3
Pos.1

W
A

Pos.1

Pos.28

X2

X1

1. Cable connector-D15 female

2. Main tag

3. Cable connector-D28 male

Table 14-25 lists the pin assignment of the X.21 DCE cable. Table 14-25 Pin assignment of the X.21 DCE cable Connector X1 13 14 23 24 19 20 1 2 15 16 21 6+9 Connector X2 5 12 3 10 2 9 4 11 6 13 1 8 Short circuiting 6 and 9 Twisted pair Twisted pair Twisted pair Twisted pair Relation Twisted pair

The technical specifications of the X.21 DCE cable are as follows. Table 14-26 Technical specifications of the X.21 DCE cable Item Connector X1 Connector X2
14-40

Description Cable connector-D type dual-edge tube-28PIN-straight male-cable solderspacing 0.8 mm-28 to 30AWG, exlusively used for OEM Cable connector-D type-15PIN-female-cable solder

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Item Cable type Number of cores Core diameter Length

Description Twisted pair cable-100 ohms-0.38 mm-28AWG-5 pairs and 8 corePANTONE 296U-exclusively used by OEM 5 pairs and 8 cores 0.32 mm 3m

X.21 DTE Cable

Figure 14-29 shows the structure of the X.21 DTE cable. Figure 14-29 Structure of the X.21 DTE cable
A-A
1
Pos.1

B-B
2 3
Pos.1

W
A

Pos.15

Pos.28

X2

X1

1. Cable connector-D15 male

2. Main tag

3. Cable connector-D28 male

Table 14-27 lists the pin assignment of the X.21 DTE cable. Table 14-27 Pin assignment of the X.21 DTE cable Connector X1 13 14 23 24 19 20 1 2 15
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Connector X2 3 10 5 12 4 11 2 9 6

Relation Twisted pair

Twisted pair

Twisted pair

Pair

Twisted pair
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Connector X1 16 17 18 21 6+10+9

Connector X2 13 6 13 1 8

Relation

Twisted pair

Short circuiting 6, 10 and 9

The technical specifications of the X.21 DTE cable are as follows. Table 14-28 Technical specifications of the X.12 DTE cable Item Connector X1 Connector X2 Cable type Number of cores Core diameter Length Description Cable connector-D type dual-edge tube-28PIN-straight male-cable solderspacing 0.8 mm-28 to 30AWG, exlusively used for OEM Cable connector-D type-15PIN-male-cable solder Twisted pair cable-100 ohms-0.38 mm-28AWG-5 pairs and 8 corePANTONE 296U-exclusively used by OEM 5 pairs and 8 cores 0.32 mm 3m

RS449 DCE Cable

Figure 14-30 shows the structure of the RS449 DCE cable. Figure 14-30 Structure of the RS449 DCE cable
A-A
1
Pos.1

B-B
2 3
Pos.1

W
A

Pos.15

Pos.28

X2

X1

1. Cable connector-D28 male

2. Main tag

3. Cable connector-D37 female-I

Table 14-29 lists the pin assignment of the RS449 DCE cable.
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Table 14-29 Pin assignment of the RS449 DCE cable Connector X1 27 28 25 26 13 14 23 24 11 12 19 20 1 2 15 16 17 18 3 4 22 21 6+8 Connector X2 11 29 12 30 9 27 7 25 13 31 4 22 6 24 8 26 17 35 5 23 10 1 19 Short circuiting 6 and 8 Twisted pair Twisted pair Twisted pair Twisted pair Twisted pair Twisted pair Twisted pair Twisted pair Twisted pair Relation Twisted pair

The technical specifications of the RS449 DCE cable are as follows. Table 14-30 Specifications of the RS449 DCE cable Item Connector X1 Description Cable connector-D type dual-edge tube-28PIN-straight male-cable solder-spacing 0.8 mm-28 to 30AWG, exlusively used for OEM
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Item Connector X2 Cable type Number of cores Core diameter Length

Description Cable connector-D type-37PIN-female-cable solder-exclusively used for OEM Twisted pair-100 ohms-communication cable-0.32 mm-28AWG-26 core-PANTONE 296U-exclusively used for OEM 26 0.32 mm 3m

RS449 DTE Cable

Figure 14-31 shows the structure of the RS449 DTE cable. Figure 14-31 Structure of the RS449 DTE cable
A-A
1
Pos.28 A

B-B
2 W 3
Pos.37

Pos.1

X1 X2
Pos.1

1. Cable connector-D28 male

2. Main tag

3. Cable connector-D37 male-I

Table 14-31 lists the pin assignment of the RS449 DTE cable. Table 14-31 Pin assignment of the RS449 DTE cable Connector X1 27 28 25 26 13 14 23 24
14-44

Connector X2 12 30 11 29 7 25 9 27

Relation Twisted pair

Twisted pair

Twisted pair

Twisted pair

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Connector X1 11 12 19 20 1 2 15 16 17 18 3 4 22 21 6+8+10

Connector X2 13 31 6 24 4 22 17 35 8 26 5 23 10 1 19

Relation Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Short circuiting 6, 8 and 10

The technical specifications of the RS449 DTE cable are as follows. Table 14-32 Specifications of the RS449 DTE cable Item Connector X1 Connector X2 Cable type Number of cores Core diameter Description Cable connector-D type dual-edge tube-28PIN-straight male-cable solderspacing 0.8 mm-28 to 30AWG, exlusively used for OEM Cable connector-D type-SUB plug-37PIN-straight male-cable solder-2 row, standard installation hole, exclusively used for OEM Twisted pair-100 ohms-communication cable-0.32 mm-28AWG-26 corePANTONE 296U-exclusively used for OEM 26 0.32 mm

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RS530 DCE Cable

Figure 14-32 shows the structure of the RS530 DCE cable. Figure 14-32 Structure of the RS530 DCE cable
A-A
Pos.25

B-B
1 2 3
Pos.1 A

X1
Pos.1

Pos.28

X2

1. Cable connector-D25 female

2. Main tag

3. Cable connector-D28 male

Table 14-33 lists the pin assignment of the RS530 DCE cable. Table 14-33 Pin assignment of the RS530 DCE cable Connector X1 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12
14-46

Connector X2 22 6 23 20 19 4 18 1 14 2 11 24 9 17 13 5 10

Relation Twisted pair

Twisted pair

Twisted pair

Single Single Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair
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Connector X1 11 4 3 2 1 6+7+9

Connector X2 8 12 15 16 3 7

Relation

Twisted pair

Twisted pair

Short circuiting 6, 7 and 9

The technical specifications of the RS530 DCE cable are as follows. Table 14-34 Specifications of the RS530 DCE cable Item Connector X1 Connector X2 Cable type Number of cores Core diameter Length Description Cable connector-D type dual-edge tube-28PIN-straight male-cable solderspacing 0.8 mm-28 to 30AWG, exlusively used for OEM Cable connector-D type-25PIN-female-cable solder Twisted pair-100 ohms-communication cable-0.32 mm-28AWG-26 corePANTONE 296U-exclusively used for OEM 26 0.32 mm 3m

RS530 DTE Cable

Figure 14-33 shows the structure of the RS530 DTE cable.

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Figure 14-33 Structure of the RS530 DTE cable

A-A
1
Pos.1 Pos.1 A

B-B
2 3

X1
Pos.25

Pos.28

X2

1. Cable connector-D25 male

2. Main tag

3. Cable connector-D28 male

Table 14-35 lists the pin assignment of the RS530 DTE cable. Table 14-35 Pin assignment of the RS530 DTE cable Connector X1 27 28 25 26 13 14 23 24 11 12 19 20 1 2 15 16 17 18 3 4
14-48

Connector X2 20 23 6 22 4 19 5 13 8 10 3 16 2 14 24 11 17 9 15 12

Relation Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

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14 Cables

Connector X1 22 21 6+7+9+10

Connector X2 18 1 7

Relation Short circuiting 6, 7, 9 and 10

The technical specifications of the RS530 DTE cable are as follows. Table 14-36 Specifications of the RS530 DTE cable Item Connector X1 Connector X2 Cable type Number of cores Core diameter Length Description Cable connector-D type dual-edge tube-28PIN-straight male-cable solderspacing 0.8 mm-28 to 30AWG, exlusively used for OEM Cable connector-D type-25PIN-male-cable solder Twisted pair-100 ohms-communication cable-0.32 mm-28AWG-26 corePANTONE 296U-exclusively used for OEM 26 0.32 mm 3m

14.6 Clock Cable

The clock cable includes the clock cable and clock transfer cable. 14.6.1 Clock Cable The clock cable includes 75-ohm clock cable and 120-ohm clock cable, which are used to input and output external clock signals. 14.6.2 One-Channel and Two-Channel Clock Transfer Cables The clock transfer cable includes one-channel clock transfer cable (75 ohms to 120 ohms) and two-channel clock transfer cable (75 ohms to 120 ohms).

14.6.1 Clock Cable

The clock cable includes 75-ohm clock cable and 120-ohm clock cable, which are used to input and output external clock signals. For the 75-ohm clock cable, use the SMB connector at one end to connect the cable to the external clock interface of the OptiX OSN equipment. Use a connector to connect the other end to the external clock equipment. The connector should be made according to the on-site requirements. For the 120-ohm clock cable, use the RJ-45 connector at one end to connect the cable to the
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external clock interface of the OptiX OSN equipment. Use a connector to connect the other end to the external clock equipment. The connector should be made according to the on-site requirements.

Structure
Figure 14-34 and Figure 14-35 show the structure of the 75-ohm clock cable and the 120-ohm clock cable respectively. Figure 14-34 Structure of the 75-ohm clock cable

1. Coaxial connector-SMB

2. Tag

Figure 14-35 Structure of the 120-ohm clock cable

A-A 8 1

X1

A 2. Main tag 3. Communication cable

1. Network port connector-RJ-45

Pin Assignment
Table 14-37 lists the pin assignment of the 120-ohm clock cable. Table 14-37 Pin assignment of the 120-ohm clock cable X1 X1.1 X1.2 X1.3 X1.6 X1.4 X1.5
14-50

W Blue White Orange White Green White

Remark R1

R2

T1

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X1 X1.7 X1.8

W Brown White

Remark T2

Technical Specifications
Item 75 ohms clock cable Connector Cable Model Diameter Length 120 ohms clock cable Connector X1 Cable Model Conductor diameter Length Description Coaxial connector-SMB-75 ohms-straight and female Coaxial cable-75 ohms-3.9 mm-2.1mm-0.34 mm-shielded cover diameter 3.9 mm-insulation diameter 2.1 mm-conductor diameter 0.34 mm 10 m, 15 m, 20 m, 30 m Network interface cable-8PIN-8bit-shieldedcrystal model connector Twisted pair-120ohms-SEYVP-24AWG-4 pairs- Pantone 430U 0.5 mm/24AWG 10 m, 20 m, 30 m

14.6.2 One-Channel and Two-Channel Clock Transfer Cables

The clock transfer cable includes one-channel clock transfer cable (75 ohms to 120 ohms) and two-channel clock transfer cable (75 ohms to 120 ohms).

Structure
Figure 14-36 and Figure 14-37 show the structure of the one-channel clock transfer cable and two-channel clock transfer cable respectively. Figure 14-36 Structure of the one-channel clock transfer cable (75 ohms to 120 ohms)

1. Coaxial connector-SMB-75 ohms-straight/plug-female

2. Main tag 3. 75 ohms/120 ohms transfer PCB

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Figure 14-37 Structure of the two-channel clock transfer cable (75 ohms to 120 ohms)

1. Coaxial connector-SMB-75 ohms-straight/plug-female 5. 75 ohms/120 ohms transfer PCB

2. Tag 1:"1#" 3. Tag 2:"2#" 4. Main tag 6. Tag 3:"1#" 7. Tag 4:"2#"

Pin Assignment
Table 14-38 lists the pin assignment of the two-channel clock transfer cable (75 ohms to 120 ohms). Table 14-38 Pin assignment of the two-channel clock transfer cable (75 ohms to 120 ohms) Connector X1 75-ohm Cable Core Shielding layer X2 Core Shielding layer Color Blue White Blue White W4 120-ohm Cable W3

Technical Specifications
Item One channel Description Connector: coaxial connector-SMB-75 ohms-straight and female 75 ohms cable type: coaxial cable-75 ohms-3.9 mm-2.1 mm-0.34 mm-shielded 75 ohms Cover diameter 3.9 mm-insulation diameter 2.1 mm-conductor diameter 0.34 mm 120 ohms cable type: twisted pair-120 ohms-SEYPVPV-0.4 mm-26AWG-2 pairs-Pantone 430U Inner conductor diameter: 0.4 mm/26AWG Length: 30 m Two channels Connector X1/X2: coaxial connector-SMB-75 ohms-straight and female 75 ohms cable type: coaxial cable-75 ohms-3.9 mm-2.1 mm-0.34 mm-shielded
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Item

Description 75 ohms cable: cover diameter 3.9 mm-insulation diameter 2.1 mm-conductor diameter 0.34 mm 120 ohms cable type: twisted pair-120 ohms-SEYPVPV-0.4 mm-26AWG-2 pairs-Pantone 430U Inner conductor diameter of the 120-ohm cable: 0.4 mm/26AWG Length: 30 m

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A Equipment and Board Alarm Indicators

Equipment and Board Alarm Indicators

This chapter describes the equipment and board alarm indicators for the OptiX OSN equipment. A.1 Indicators on the Cabinet This section describes the indicators on the cabinet for the OptiX OSN equipment. A.2 Board Alarm Indicator This section describes the board alarm indicators and their indications.

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

A.1 Indicators on the Cabinet

This section describes the indicators on the cabinet for the OptiX OSN equipment. Indicator Normal power supply indicator: Power (green) Indication When it is lit, it indicates that the power is supplied to the equipment. When it is unlit, it indicates that no power is supplied to the equipment. Critical alarm indicator: Critical (red) When it is lit, it indicates that critical alarms are generated in the equipment. When it is unlit, it indicates that no critical alarms are generated in the equipment. Major alarm indicator: Major (orange) When it is lit, it indicates that major alarms are generated in the equipment. When it is unlit, it indicates that no major alarms are generated in the equipment. Minor alarm indicator: Minor (yellow) When it is lit, it indicates that minor alarms are generated in the equipment. When it is unlit, it indicates that no minor alarms are generated in the equipment.

A.2 Board Alarm Indicator

This section describes the board alarm indicators and their indications.

Board Hardware State Indicator (STAT)

Status Description Lit (green) Lit (red) Unlit Indication The board is working normally. The board hardware is faulty. No power is supplied to the board.

Service Activating State Indicator (ACT)

Status Description Lit (green) Indication The service is in the activating state and the board is working.
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A Equipment and Board Alarm Indicators

Status Description Unlit

Indication The service is in the non-activating state.

Board Software State Indicator (PROG)

Status Description Lit (green) Indication The board software or software for FPGA is loaded successfully, or the board software is initialized normally. The board software or FPGA is being loaded to the FLASH. The board software is being initialized and is in the BIOS boot state. The board software or FPGA in the FLASH is lost. The loading and initialization of the board software fails. No power is input.

Circularly lit for 100 ms and unlit for 100 ms (green) Circularly lit for 300 ms and unlit for 300 ms (green) Lit (red)

Unlit

Service Alarm Indicator (SRV)

Status Description Lit (green) Lit (red) Lit (yellow) Unlit Indication The service is running normally and no service alarms are generated. Critical or major alarms occur to the service. Minor or remote alarms occur to the service. The board is not configured with services and no alarms is generated, or no power is supplied to the board.

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Synchronization Clock State Indicator

Status Description Lit (green) Indication
l

The clock is working in the free-run mode and the system clock priority list is not set. By default, the system clock priority list contains only the internal source. The clock is working in the tracing mode and tracing the clock source rather than the internal source in the priority list.

Lit (red)

The system clock priority list is set. Except the internal clock source, all clock sources are lost. The clock is working in the hold-over or free-run mode.

Alarm Cutting Indicator (ALMC)

Status Description Lit (yellow) Unlit Indication The board is in the alarm cutting state. Sound is generated to indicate the alarm.

Ethernet Indicator
Indicator Connection status indicator (LINK), which is green when lit. Status Description Lit Unlit Flashing Unlit Indication The network cable is successfully connected to the equipment. The network cable is not connected to the equipment. The data is being transmitted or received. No data is being transmitted or received.

Data receiving and transmitting indicator (ACT), which is orange when lit.

Service activating state indicator of the cross-connect unit (ACTX)

Status Description Lit (green) Unlit Indication The cross-connect unit is in the active state. The cross-connect unit is in the standby state.

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A Equipment and Board Alarm Indicators

Active/standby state indicator (ACTC) of the SCC unit

Status Description Lit (green) Unlit Indication The cross-connect unit is in the active state. The cross-connect unit is in the standby state.

Service alarm indicator of the line unit (SRVL)

Status Description Lit (green) Lit (red) Lit (yellow) Unlit Indication The line service is normal and no alarms are generated. Critical alarms or major alarms occur to the line service. Minor or remote alarms occur to the line service. The unit is not configured with services and no alarms is generated, or no power is supplied to the unit.

Fan tray assembly indicator

Indicator Board running state indicator (RUN) Fan alarm indicator (ALM) Status Description Lit (green) Unlit Lit (red) Unlit Indication The board is working normally. The board is not powered on. The fan stops. The fan is running normally.

Indicator on the panel of the COA

Indicator Green running indicator (RUN) Status Description Flash once every two seconds (green) Flash once every four seconds (green) Flash five times every second (green) Indication The COA is running normally. The COA in in the database protection mode. The communication between the COA and the SCC fails. The program is starting or being loaded.

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Indicator Alarm indicator (ALM)

Status Description Lit (red) Flash thrice every other second (red) Flash twice every other second (red) Flash once every other second (red)

Indication The self-check of the memory fails. Critical alarms are generated. Major alarms are generated. Minor alarms are generated.

Power indicator (POWER)

Status Description Lit (green) Unlit Indication The input of the power supply is normal. No power supply is input or the power supply fails.

Indicator on the UPM

Module Rectifier module Monitorin g module Indicator ALM Vout RUN ALM Status Description Lit (red) Lit (green) Flashes (green) Lit (red) Indication The rectifier module fails. Normally, it is unlit. The output of the rectifier module is normal. The entire power supply system is normal. The entire power supply system becomes faulty. Normally, it is unlit.

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B Labels

Labels

This chapter describes various labels for the OptiX OSN equipment, including the safety labels, optical module labels, and cable labels. B.1 Safety Label Many safety labels are stuck on the equipment. This section describes the suggestions and locations of these safety labels. B.2 Optical Module Labels Optical module labels are used to recognize different types of optical modules. Optical module label is stuck to the optical module. B.3 Engineering Labels The engineering labels should be made according to the the local engineering specifications or Huawei engineering specifications.

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B Labels

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

B.1 Safety Label

Many safety labels are stuck on the equipment. This section describes the suggestions and locations of these safety labels. B.1.1 Label Description On the subrack, there are labels such as the ESD protection label, subrack grounding label and fan warning label. B.1.2 Label Position The ESD protection label and the subrack grounding label are stuck on the subrack. The laser class label and the APD warning label are stuck on the front panel of each board.

B.1.1 Label Description

On the subrack, there are labels such as the ESD protection label, subrack grounding label and fan warning label. Table B-1 Labels on the equipment Label Type ESD protection label Suggestion The equipment is electrostatic sensitive.

LASER RADIATION

Laser safety class

The label suggests the class of the laser source.

CLASS 1 LASER PRODUCT

DO NOT VIEW DIRECTLY WITH OPTICAL INSTRUMENTS

CLASS 1M LASER PRODUCT

Subrack grounding label

This label suggests the grounding position.

! ATTENTION
CLEAN PERIODICALLY

Regular cleaning label

Regularly clean the air filter.

DON'T TOUCH THE FANLEAVESBEFORE THEYSLOW DOWN !

Fan warning label

Do not the fan leaves before the fan stops.

APD

APD warning label

The overload point of the indicator is 9 dBm.

Receiver MAX:-9dBm

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B Labels

Label

Type RoHS label

Suggestion The equipment is in line with the RoHS-related environment-friendly requirements.

OptiX OSN 1500A

POWER RATING: -48 -60V ; 4.5A

Product nameplate label

N14036

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

The label suggests the product name and certification.

HUAWEI TECHNOLOGIES CO.,LTD.

MADE IN CHINA

OptiX OSN 1500

POWER RATING: -48 -60V ; 6A

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
N14036

HUAWEI TECHNOLOGIES CO.,LTD.

MADE IN CHINA

For the enhanced subrack:

OptiX OSN 1500A
POWER RATING: -48 -60V ; 8.2A

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
N14036

HUAWEI TECHNOLOGIES CO.,LTD.

MADE IN CHINA

OptiX OSN 1500

POWER RATING: -48 -60V ; 10.4A

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
N14036

HUAWEI TECHNOLOGIES CO.,LTD.

MADE IN CHINA

/QUALIFICATION CARD

Qualification card label

The equipment is qualified.

HUAWEI

HUAWEI TECHNOLOGIES CO.,LTD.

MADE IN CHINA

B.1.2 Label Position

The ESD protection label and the subrack grounding label are stuck on the subrack. The laser class label and the APD warning label are stuck on the front panel of each board.

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Figure B-1 Labels on the OptiX OSN 1500B subrack

/QUALIFICATION CARD

HUAWEI

HUAWEI TECHNOLOGIES CO.,LTD.

MADE IN CHINA

OptiX OSN 1500

POWER RATING: -48 -60V ; 6A

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
N14036

HUAWEI TECHNOLOGIES CO.,LTD.

MADE IN CHINA

DON'T TOUCH THE FAN LEAVES BEFORE THEY SLOW DOWN !

ATTENTION
CLEAN PERIODICALLY

Figure B-2 Labels on the OptiX OSN 1500A subrack

/QUALIFICATION CARD

HUAWEI

HUAWEI TECHNOLOGIES CO.,LTD.

MADE IN CHINA

OptiX OSN 1500A

POWER RATING: -48 -60V ; 4.5A

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.
N14036

HUAWEI TECHNOLOGIES CO.,LTD.

MADE IN CHINA

DON'T TOUCH THE FAN LEAVES BEFORE THEY SLOW DOWN !

ATTENTION
CLEAN PERIODICALLY

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B Labels

Figure B-3 Labels on a board

SL16

APD

CLASS 1 LASER PRODUCT

Receiver MAX:-9dBm

BA2

LASER RADIATION
DO NOT VIEW DIRECTLY WITH OPTICAL INSTRUMENTS CLASS 1M LASER PRODUCT

B.2 Optical Module Labels

Optical module labels are used to recognize different types of optical modules. Optical module label is stuck to the optical module. Figure B-4 shows the optical module labels. Figure B-4 Optical module labels

As shown in Table B-2, different types of optical module have different codes. Table B-2 Optical module code and type mapping table Optical Module Code 34060288 Optical Type Optical transceiver-ESFP (internal and external alignment)-1310 nmSTM-16-3 dBm-10 dBm-21 dBm-LC-2 km

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B Labels

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Optical Module Code 34060278 34060289 34060279 34060277 34060280 34060284 34060285 34060276 34060281 34060282 34060299 34060286 34060219 34060298 34060274 34060325

Optical Type Optical transceiver-ESFP (internal and external alignment)-1310STM-16-0 dBm-5 dBm-21 dBm-LC-15 km Optical transceiver-ESFP (internal and external alignment)-1310 nmSTM-16-3 dBm-2 dBm-30 dBm-LC-40 km Optical transceiver-ESFP (internal and external alignment)-1550STM-16-3 dBm-2 dBm-30 dBm-LC-80 km Optical transceiver-ESFP (internal and external alignment)-1310 nmSTM-4-8 dBm-15 dBm-31 dBm-LC-15 km Optical transceiver-ESFP (internal and external alignment)-1310 nmSTM-4-2 dBm-3 dBm-30 dBm-LC-40 km Optical transceiver-ESFP (internal and external alignment)-1550 nmSTM-4-2 dBm-3 dBm-30 dBm-LC-80km Optical transceiver-ESFP (internal and external alignment)-1550 nmSTM-4-2 dBm-3 dBm--36 dBm-LC-100km Optical transceiver-ESFP (internal and external alignment)-1310 nmSTM-1-8 dBm-15 dBm-31 dBm-LC-15 km Optical transceiver-ESFP (internal and external alignment)-1310 nmSTM1-0 dBm-5 dBm-37 dBm-LC-40 km Optical transceiver-ESFP (internal and external alignment)-1550STM-1-0 dBm-5 dBm-37 dBm-LC-80 km Optical transceiver-ESFP (internal and external alignment)-1310 nmSTM-1-8 dBm-15 dBm-31 dBm-LC (private)-15 km Optical transceiver-ESFP (internal and external alignment)-850 nm-2.125G multirate-2.5 dBm-9.5 dBm-17 dBm-LC-0.5 km Optical transceiver-ESFP (internal and external alignment)-1310 nm-1.25 Gbit/s-3 dBm-9.5 dBm-20 dBm-LC-10 km Optical transceiver-ESFP (internal and external alignment)-1310 nm-1.25 Gbit/s-3 dBm-4.5 dBm-22.5 dBm-LC-40 km Optical transceiver-ESFP (internal and external alignment)-1550 nm-1.25 Gbit/s-5 dBm-2 dBm-23 dBm-LC-80 km Optical transceiver-ESFP (internal and external alignment)-850 nm-2.125 G multirate-2.5 dBm-9.5dBm-17 dBm-LC (private)multimode-0.5 km Optical transceiver-SFP-850 nm-1.25 Gbit/s-0 dBm-9.5 dBm-17 dBm-LC-0.55 km Optical transceiver-SFP-1310 nm-1.25 Gbit/s-3 dBm-9 dBm-20 dBm-LC-10 km

34060049 34060050

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B Labels

Optical Module Code 34060207 34060051 34060287 34060053 34060209

Optical Type Optical transceiver-SFP-1310 nm-1.25 Gbit/s-5 dBm-2 dBm-23 dBmLC-40 km Optical transceiver-SFP-1550 nm-1.25 Gbit/s-2 dBm-4 dBm-22 dBmLC-70 km Optical transceiver-SFP-1310 nm-STM-1-14 dBm-19 dBm-30 dBmLC (TX disable)-2 km Optical transceiver-SFP-1310 nm-STM-1-8 dBm-15 dBm-28 dBmLC-15 km Optical transceiver-SFP-1310 nm-STM-1-0 dBm-5 dBm-34 dBmLC-40 km

B.3 Engineering Labels

The engineering labels should be made according to the the local engineering specifications or Huawei engineering specifications. The engineering labels should be made according to the the local engineering specifications or Huawei engineering specifications. Table B-3 lists the Huawei engineering specifications for engineering labels. For details on how to make and stick cable labels, see the OptiX OSN 1500 Intelligent Optical Transmission System Installation Guide. Table B-3 Huawei specifications for engineering labels Label Engineer ing labels for power cables Illustration
TO: A01 B08 TO: B03

Suggestion (1) On the loaded cabinet side, the label marked "A01/B08-48V2" on the cable indicates that the cable is 48V2 DC power supply, which is from the eighth connecter on the second row of the 48V bus bar in the cabinet on Row A, and Column 1 in the equipment room. (2) On the distribution unit side, the label marked "B03--48V2" indicates that the cable is 48V2 DC power supply, which is from the loaded cabinet on Row B, Column 03 in the equipment room. For PGND and BGND, it is only necessary to give the row and column of the power distribution unit, instead of the specific serial number of the terminal block on the copper bar.

-48V2

-48V2

(1)

(2)

(1) Indicates the label on the loaded cabinet side, which carries the information about the position of the cable on the power distribution unit. (2) Indicates the label on the distribution unit side, which carries the information about the position of the cable on the loaded cabinet side.

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Label Engineer ing labels for alarm external cables

Illustration

Suggestion The external alarm cables are connected to the first subscriber cabinet of each row (used for power distribution). Engineering labels posted on the first cabinet of each row should indicate which equipment is using the access terminal. Engineering labels are not needed on the equipment side unless there are special requirements. The label marked "A01" indicates that the alarm cable connects the first cabinet and the cabinet on Row A, Column 01 in the equipment room.

Engineer ing labels for Ethernet cables

"A01-03-06-05" indicates that on the local end of the Ethernet cable is connected to Ethernet Port 05, Slot 6, Frame 03 of the cabinet on Row A, Column 01 in the equipment room. "B02-03-12" indicates that the other end of the Ethernet cable is connected to Ethernet Port 12, Frame 03 of the cabinet on Row B, Column 02 in the equipment room. No slot number is specified.

Engineer ing labels for fibers that connect equipme nt

"A01-01-05-05-R" indicates that the local end of the fiber jumper is connected with Optical Receiving Interface 05 on Slot 5, Frame 01 in the cabinet on Row A, Column 01 in the equipment room. "G01-01-01-01-T" indicates that the opposite end of the fiber jumper is connected with optical transmitting interface 01 on Slot 01, Frame 01 in the cabinet on Row G, Column 01 in the equipment room. "ODF-G01-01-01-R" indicates that the local end of the fiber jumper is connected to the optical receiving terminal on Row 01, Column 01 of the ODF in Row G Column 01 in the equipment room. "A01-01-05-05-R" indicates that the other end of the fiber jumper is connected to optical receiving interface 5 on Slot 05, frame 01 in the cabinet on Row A, Column 01 in the equipment room.

Labels for fibers that connect the equipme nt to the ODF

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B Labels

Label Labels for trunk cables that connect the equipme nt to the ODF

Illustration

Suggestion "A01-03-01-01-R" indicates that local end of the trunk cable connects with the receiving terminal of Trunk Cable 01 in Slot 01, Frame 03 of the cabinet on Row A, Column 01 in the equipment room. "DDF-G01-01-01-AR" indicates that the opposite end of the trunk cable connects the receiving terminal of Direction A (connected to optical network equipment) on Row 01, Column 01 of the DDF on Row G and Column 01 in the equipment room. "A01-03-01-01" indicates that the local end of the subscriber cable connects with Terminal 01 on Slot 1, Frame 03 of the cabinet on Row A, Column 01 in the equipment room. "MDF-G01-01-01" indicates that the opposite end of the cable connects with the terminal on Row 01, Column 01 of the MDF on Row G, Column 01 in the equipment room.

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Engineer ing labels for subscrib er cables

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C Power Consumption and Weight of Boards

Power Consumption and Weight of Boards

Different boards have different power consumption and weight. Table C-1 lists the power consumption and weight of the boards. Table C-1 Power consumption and weight of the boards Board Power Consumption (W) Weight (kg) Board Power Consumption (W) Weig ht (kg)

SDH Processing Boards N1SLT1 N1SLQ1 N1SLQ1A N2SLQ1 R1SLQ1 N1SL1, N2SL1 N1SL1A R1SL1 N1SF16 N1SL16, N2SL16 N3SL16 N1SEP1 15 15 17 15 12 14 17 10 26 20 22 17 1.2 1.0 1.0 1.0 0.54 1.0 1.0 0.5 1.1 1.1 1.1 1.0 N1SLQ4 N1SLQ4A N2SLQ4 N1SLD4 N1SLD4A N2SLD4 R1SLD4 N1SL4, N2SL4 N1SL4A R1SL4 N1SL16A, N2SL16A N3SL16A 16 17 16 15 17 15 11 15 17 10 20 17 1.0 1.0 1.0 1.0 1.0 1.0 0.5 1.0 1.0 0.5 1.1 0.9

Interface Boards and Protection Switching Boards

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C Power Consumption and Weight of Boards

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Board

Power Consumption (W) 11

Weight (kg) 0.4

Board

Power Consumption (W) 0 (before the TPS switching); 3 (after the TPS switching) 3 0 (before the TPS switching); 5 (after the TPS switching) 0 (before the TPS switching); 2 (after the TPS switching) 0 (before the TPS switching); 9 (after the TPS switching) 0 (before the TPS switching); 2 (after the TPS switching) 0 (before the TPS switching); 6 (after the TPS switching) 0

Weig ht (kg) 0.4

N1EU08

N1ETS8

N1MU04 N1OU08

2 6

0.4 0.4

N1TSB4 N1TSB8

0.3 0.3

N2OU08

0.4

N1C34S

0.3

N1EU04

0.4

N1D12S

0.4

R1L75S

0.3

N1D34S

0.4

R1L12S

0.2

N1D75S

0.4

N1DM12

0 (before the TPS switching); 8 (after the TPS switching) 2

0.5

N1D12B

0.3

N1ETF8

0.4

Data Processing Boards N1EGS4 N3EGS4 N2EGS4A N2EGR2 N2EGS2 N1EGT2 N2EMR0 N1EMS4 70 70 53 40 43 29 50 65 (without an interface board); 75 (with an interface board) 14 1.1 1.1 1.1 1.1 1.0 0.9 1.2 1.1 N1EFF8 N1EFS0 N2EFS0 N4EFS0 N1EFS4 N2EFS4 N1ADQ1 N1ADL4 6 35 35 35 30 30 41 41 0.4 1.0 1.0 1.0 1.0 1.0 1.0 0.9

R1EFT4

0.5

N1MST4

26

0.9

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C Power Consumption and Weight of Boards

Board

Power Consumption (W) 26 26

Weight (kg) 1.0 1.0

Board

Power Consumption (W) 41 41

Weig ht (kg) 1.0 1.0

N1EFT8 N1EFT8A

N1IDL4 N1IDQ1

Cross-connect and System Control Boards Q2CXL16 , Q2CXL4, Q2CXL1 40 1.1 R1CXLQ 4, R1CXLQ 1, R1CXLD 4, R1CXLD 1, R1CXLL1 6, R1CXLL4 , R1CXLL1 50 1.0

Q3CXL16 , Q3CXL4, Q3CXL1

46

1.2

Other Boards N1LWX N1MR2B N1MR2C TN11MR 2 TN11MR 4 N1BA2 N1BPA N2BPA PIU, PIUA 30 0 0 0.2 0.2 20 20 11 2 1.1 1.0 1.0 0.9 0.9 1.0 1.0 1.2 1.3 TN11CM R2 TN11CM R4 N1FIB TN11OB U1 R1FAN AUX R1AMU EOW 0.2 0.2 0 16 20 19 8 10 0.8 0.9 0.4 1.3 1.0 1.0 0.5 0.4 -

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

D Board Version Configuration

D
Product OptiX OSN 7500 Y N Y Y Y Y Y Y Y Y Y Y N Y Y Y N1SL64 N2SL64 T2SL64 T2SL64A N1SF64 N1SLD64 N1SL16 N2SL16 N3SL16 N1SL16A N2SL16A N3SL16A N1SLD16 N1SLQ16 N2SLQ16 N1SF16
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Board Version Configuration

This chapter describes the version compatibility for each board. Table D-1 lists the board versions that are compatible with the OptiX OSN products. Table D-1 Board versions that are compatible with the OptiX OSN products OptiX OSN 3500 Y Y N N Y Y Y Y Y Y Y Y Y Y Y Y OptiX OSN 3500T Y Y N N Y Y Y Y Y Y Y Y Y Y Y Y OptiX OSN 2500 N N N N N N Y Y Y Y Y Y N N N Y OptiX OSN 2500 REG Y Y N N Y N N Y Y N N Y N N N Y OptiX OSN 1500A N N N N N N Y Y Y Y Y Y N N N Y OptiX OSN 1500B N N N N N N Y Y Y Y Y Y N N N Y
D-1

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D Board Version Configuration

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Product

OptiX OSN 7500 Y Y Y N Y Y Y Y Y Y N Y Y Y Y N Y Y Y N Y Y Y N N N Y Y

OptiX OSN 3500 Y Y Y N Y Y Y Y Y Y N Y Y Y Y N Y Y Y N Y Y Y N N N Y Y

OptiX OSN 3500T Y Y Y N Y Y Y Y Y Y N Y Y Y Y N Y Y Y N Y Y Y N N N Y Y

OptiX OSN 2500 Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y N Y Y N Y Y Y Y

OptiX OSN 2500 REG N N N N N N N N N N N N N N N N N N N N N N N N N N N N

OptiX OSN 1500A Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y N Y Y Y Y Y N N

OptiX OSN 1500B Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y N Y Y Y Y Y Y Y

N1SL4 N2SL4 N1SL4A R1SL4 N1SLQ4 N2SLQ4 N1SLQ4A N1SLD4 N2SLD4 N1SLD4A R1SLD4 N1SLT1 N1SLQ1 N2SLQ1 N1SLQ1A R1SLQ1 N1SL1 N2SL1 N1SL1A R1SL1 N1SLH1 N1SEP1 N2SLO1 R1PL1 R1PD1 R2PD1 N1PQ1 N2PQ1

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D Board Version Configuration

Product

OptiX OSN 7500 Y Y Y Y Y Y Y Y Y Y N Y N Y Y Y N Y Y Y Y Y Y Y Y Y Y Y

OptiX OSN 3500 Y Y Y Y Y Y Y Y Y Y Y Y N Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y

OptiX OSN 3500T Y Y Y Y Y Y Y Y Y Y Y Y N Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y

OptiX OSN 2500 Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y N Y

OptiX OSN 2500 REG N N N N N N N N N N N N N N N N N N N N N N N N N N N N

OptiX OSN 1500A N N N Y Y N N N N Y N N Y Y Y Y N N N Y Y Y Y Y Y Y N Y

OptiX OSN 1500B Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y N Y

N1PQM N1PL3 N2PL3 N1PL3A N2PL3A N1PD3 N2PD3 N2PQ3 N1DX1 N1DXA N1SPQ4 N2SPQ4 R1EFT4 N1EFT8 N1EFT8A N1EGT2 N1EFS0 N2EFS0 N4EFS0 N1EFS4 N2EFS4 N2EGS2 N1EMS4 N1EGS4 N2EGR2 N2EMR0 N1EAS2 N1ADL4

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D Board Version Configuration

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Product

OptiX OSN 7500 Y Y Y Y Y Y Y Y Y Y Y N Y Y N N Y Y Y Y N Y N N N N N N

OptiX OSN 3500 Y Y Y Y Y Y Y Y Y Y Y Y Y Y N N Y Y Y Y Y Y N N N N N N

OptiX OSN 3500T Y Y Y Y Y Y Y Y Y Y Y Y Y Y N N Y Y Y Y Y Y N N N N N N

OptiX OSN 2500 Y Y Y Y Y Y Y Y Y Y Y Y Y Y N N Y Y Y Y Y Y Y Y Y Y Y Y

OptiX OSN 2500 REG N N N N N N N N N N N N N N N N N N N N N N N N N N N N

OptiX OSN 1500A Y Y Y Y N N N N N N N N N N Y Y N N N N N N Y Y Y Y Y Y

OptiX OSN 1500B Y Y Y Y Y Y Y Y Y Y Y Y Y Y N N Y Y Y Y Y Y Y Y Y Y Y Y

N1ADQ1 N1IDL4 N1IDQ1 N1MST4 N1EU08 N1OU08 N2OU08 N1D75S N1MU04 N1D34S N1C34S N1EU04 N1D12S N1D12B R1L12S R1L75S N1EFF8 N1ETF8 N1ETS8 N1DM12 N1TSB4 N1TSB8 Q2CXL1 Q3CXL1 Q2CXL4 Q3CXL4 Q2CXL16 Q3CXL16

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

D Board Version Configuration

Product

OptiX OSN 7500 Y N Y N Y N N Y Y N N Y N N N N Y Y Y N Y N Y N N N N N

OptiX OSN 3500 N Y N Y N Y Y N N Y Y N Y Y Y Y N Y Y N N N N Y N N N N

OptiX OSN 3500T N Y N Y N Y Y N N Y Y N Y Y Y N N Y Y N N N N Y N N N N

OptiX OSN 2500 N N N N N N N N N N N N N N N N N N N N N N N N N N N Y

OptiX OSN 2500 REG N N N N N N N N N N N N N N N N N N N Y N N N N N N N Y

OptiX OSN 1500A N N N N N N N N N N N N N N N N N N N N N Y N N Y Y Y N

OptiX OSN 1500B N N N N N N N N N N N N N N N N N N N N N Y N N Y Y Y N

T1GXCSA N1GXCSA T1EXCSA N1EXCSA T2UXCSA N1UXCSA N1UXCSB T1SXCSA T2SXCSA N1SXCSA N1SXCSB T1IXCSA N1IXCSA N1IXCSB N1XCE N1GSCC N2GSCC N3GSCC N4GSCC CRG T1EOW R1EOW T1AUX N1AUX R1AUX R2AUX R1AMU Q1SAP

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D Board Version Configuration

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Product

OptiX OSN 7500 N N N N Y Y Y Y Y Y N Y Y Y Y Y Y Y Y Y Y Y Y N Y N N

OptiX OSN 3500 N N Y N Y Y Y Y Y Y N Y Y Y Y Y Y Y Y Y Y Y Y N N Y N

OptiX OSN 3500T N N Y N Y Y Y Y Y Y N Y Y Y Y Y Y Y Y Y Y Y Y N N Y N

OptiX OSN 2500 Y Y Y N N Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y N N Y N N Y

OptiX OSN 2500 REG Y Y Y N N N N N N N N N N Y Y Y Y Y Y Y Y Y Y Y N N Y

OptiX OSN 1500A N N N Y N Y Y Y Y Y Y N Y Y Y Y Y Y Y Y Y N N Y N N N

OptiX OSN 1500B N N N Y N Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y Y N N Y N N N

Q2SAP Q1SEI N1FAN R1FAN N1FANA TN11CMR 2 TN11CMR 4 TN11MR2 TN11MR4 N1MR2A N1MR2B N1MR2C N1LWX TN11OBU1 N1FIB N1BA2 N1BPA N2BPA 61COA 62COA N1COA N1DCU N2DCU UPM T1PIU N1PIU Q1PIU

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

D Board Version Configuration

Product

OptiX OSN 7500 N N

OptiX OSN 3500 N N

OptiX OSN 3500T N N

OptiX OSN 2500 N N

OptiX OSN 2500 REG N N

OptiX OSN 1500A Y Y

OptiX OSN 1500B Y N

R1PIU R1PIUA

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

E Board Loopbacks

E
Board Q2SL1 Q2SL4 Q2SL16 N1SL64 N2SL64 T2SL64 T2SL64A N1SF64 N1SLD64 N1SL16 N2SL16 N3SL16 N1SL16A N2SL16A N3SL16A N1SLD16 Port Inloop Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported.

Board Loopbacks

The SDH, PDH, data processing board for the OptiX OSN equipment support various types of loopbacks. In the case of the SDH boards for the OptiX OSN equipment, Table E-1 lists the capability of supporting the loopbacks. Table E-1 Loopbacks of the SDH boards for the OptiX OSN equipment Port Outloop VC-4 Inloop Supported. Supported. Supported. Supported. Not supported. Not supported. Not supported. Supported. Supported. Supported. Not supported. Supported. Supported. Not supported. Supported. Supported. VC-4 Outloop Not supported. Not supported. Not supported. Supported. Not supported. Not supported. Not supported. Supported. Supported. Not supported. Not supported. Supported. Not supported. Not supported. Supported. Supported.

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E Board Loopbacks

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Board N1SLQ16 N2SLQ16 N1SF16 N1SL4 N1SL4A N2SL4 R1SL4 N1SLQ4 N1SLQ4A N2SLQ4 N1SLD4 N1SL4DA N2SLD4 R1SLD4 N1SLT1 N1SLQ1 N1SLQ1A N2SLQ1 R1SLQ1 N1SL1 N1SL1A N2SL1 R1SL1 N1SLH1 N1SEP1 N2SLO1

Port Inloop Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported.

Port Outloop Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported.

VC-4 Inloop Supported. Not supported. Supported. Supported. Supported. Not supported. Supported. Supported. Supported. Not supported. Supported. Supported. Not supported. Supported. Supported. Supported. Supported. Not supported. Supported. Supported. Supported. Not supported. Supported. Supported. Supported. Not supported.

VC-4 Outloop Supported. Not supported. Not supported. Not supported. Supported. Not supported. Not supported. Not supported. Supported. Not supported. Not supported. Supported. Not supported. Not supported. Not supported. Not supported. Supported. Not supported. Not supported. Not supported. Supported. Not supported. Not supported. Not supported. Not supported. Not supported.

In the case of the SDH boards for the OptiX OSN equipment, Table E-1 lists the capability of inserting the AUAIS to port.

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E Board Loopbacks

Table E-2 the capability of inserting the AUAIS to port Board insert the AUAIS to port (Port Inloop) Not supported. Not supported. Not supported. Supported. Not supported. Not supported. Not supported. Supported. Supported. Not supported. Not supported. Supported. Not supported. Not supported. Supported. Supported. Supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. insert the AUAIS to port (Port Outloop) Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. insert the AUAIS to port (VC-4 Inloop) Not supported. Not supported. Not supported. Supported. Not supported. Not supported. Not supported. Supported. Supported. Not supported. Not supported. Supported. Not supported. Not supported. Supported. Supported. Supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. insert the AUAIS to port(VC-4 Outloop) Not supported. Not supported. Not supported. Supported. Not supported. Not supported. Not supported. Supported. Supported. Not supported. Not supported. Supported. Not supported. Not supported. Supported. Supported. Supported. Not supported. Not supported. Not supported. Supported. Not supported. Not supported. Not supported. Supported. Not supported. Not supported.

Q2SL1 Q2SL4 Q2SL16 N1SL64 N2SL64 T2SL64 T2SL64A N1SF64 N1SLD64 N1SL16 N2SL16 N3SL16 N1SL16A N2SL16A N3SL16A N1SLD16 N1SLQ16 N2SLQ16 N1SF16 N1SL4 N1SL4A N2SL4 R1SL4 N1SLQ4 N1SLQ4A N2SLQ4 N1SLD4

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E Board Loopbacks

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Board

insert the AUAIS to port (Port Inloop) Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported.

insert the AUAIS to port (Port Outloop) Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported.

insert the AUAIS to port (VC-4 Inloop) Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported.

insert the AUAIS to port(VC-4 Outloop) Supported. Not supported. Not supported. Not supported. Not supported. Supported. Not supported. Not supported. Not supported. Supported. Not supported. Not supported. Not supported. Not supported. Not supported.

N1SL4DA N2SLD4 R1SLD4 N1SLT1 N1SLQ1 N1SLQ1A N2SLQ1 R1SLQ1 N1SL1 N1SL1A N2SL1 R1SL1 N1SLH1 N1SEP1 N2SLO1

In the case of the PDH boards for the OptiX OSN equipment, Table E-3 lists the capability of supporting the loopbacks. Table E-3 Loopbacks of the PDH boards for the OptiX OSN equipment Board R1PL1 R1PD1 N1PQ1 N1PQM N1PD3 N1PL3 N2PQ3 N2SPQ4 Port Inloop Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Port Outloop Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported.

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

E Board Loopbacks

In the case of the Ethernet boards for the OptiX OSN equipment, Table E-4 lists the capability of supporting the loopbacks. Table E-4 Loopbacks of the Ethernet boards for the OptiX OSN equipment Board MAC Layer Outloop Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. MAC Layer Inloop Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Not supported. Not supported. Not supported. Supported. Supported. Supported. Not supported. PHY Layer Outloop Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. PHY Layer Inloop Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. Supported. VC-4 Inloop, VC-4 Outloop Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. VC-3 Inloop, VC-3 Outloop Supported. Supported. Supported. Supported. Supported. Not supported. Supported. Supported. Supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported. Not supported.

N1EFS 4 N2EFS 4 N1EFS 0 N2EFS 0 N4EFS 0 N1EGT 2 N1EFT 8 N1EFT 8A R1EFT 4 N1EMS 4 N1EGS 4 N3EGS 4 N2EGR 2 N1EAS 2 N2EMR 0 N1MST 4

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E Board Loopbacks

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

In the case of the ATM/IMA boards for the OptiX OSN equipment, Table E-5 lists the capability of supporting the loopbacks. Table E-5 Loopbacks of the ATM/IMA boards for the OptiX OSN equipment Board N1ADL4 N1ADQ1 N1IDL4 N1IDQ1 External Port Outloop Not supported. Not supported. Not supported. Not supported. External Port Inloop Supported. Supported. Supported. Supported. Internal Port Outloop Supported. Supported. Supported. Supported. Internal Port Inloop Supported. Supported. Supported. Supported.

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

F Board Configuration Reference

Board Configuration Reference

The T2000 can be used to configure various parameters for SDH boards, PDH boards, data processing boards, and cross-connect and timing boards. F.1 SDH Processing Boards The parameters that can be configured for the SDH processing boards include the J0 byte, J1 byte and C2 byte. F.2 PDH Processing Board The parameters that can be set to the PDH processing boards include the J1 byte, C2 byte, J2 byte , V5 byte and tributary loopback. F.3 Data Processing Board The parameters that should be set for data processing boards include SDH parameters, Ethernet parameters and ATM parameters. F.4 Cross-Connect and Timing Unit The clock parameters should be set on the cross-connect and timing unit.

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F-1

F Board Configuration Reference

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

F.1 SDH Processing Boards

The parameters that can be configured for the SDH processing boards include the J0 byte, J1 byte and C2 byte.

J0 Byte
J0 is the section trace byte, the J0 are transmitted in a successive manner. Hence, the receive end learns that it is in the continuous connection with the specified transmit end. The value of J1 is "" by default.

J1 Byte
The J1 byte is the path tracing byte. The transmit end uses the J1 byte to transmit the higher order access point identifiers in a successive manner. Hence, the receive end learns that it is in the continuous connection with the specified transmit end in this channel. When the receive end detects the J1 mismatch, the corresponding VC-4 channel generates an HP_TIM alarm. Set the J1 byte as " HuaWei SBS
NOTE

" for the SL01 and as "" for all other boards.

By default, the J1 byte is " HuaWei SBS

". One space is present before "HuaWei SBS" and five behind.

C2 Byte
The C2 byte is the signal label byte, which is used to indicate the multiplexing structure of the VC frames and the payload property. The received C2 should be the same as the transmitted C2. If C2 mismatch occurs, the corresponding VC-4 channel generates the HP_SLM alarm. Table F-1 lists the mapping relation between the service type and setting of the C2. Table F-1 Mapping relation between the service type and setting of the C2 Input Service Type TUG structure 34M/45M asynchronously mapped into a C-3 140M asynchronously mapped into a C-4 Unequipped C2 Byte (in Hex) 02 04 12 00

F.2 PDH Processing Board

The parameters that can be set to the PDH processing boards include the J1 byte, C2 byte, J2 byte , V5 byte and tributary loopback.
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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

F Board Configuration Reference

J1 Byte
The J1 byte is the path tracing byte. The transmit end transmits the higher order access point identifiers in a successive manner. Hence, the receive end learns that it is in the continuous connection with the specified transmit end. When the receive end detects the J1 mismatch, the corresponding VC-4 channel generates an HP_TIM alarm. By default, the J1 byte is set to "".
NOTE

By default, the J1 byte is "HuaWei SBS ".

C2 Byte
The C2 byte is the signal label byte, which is used to indicate the multiplexing structure of the VC frames and the payload property. The received C2 should be the same as the transmitted C2. If C2 mismatch occurs, the corresponding VC-4 channel generates the HP_SLM alarm. Table F-2 lists the mapping relation between the service type and setting of the C2. Table F-2 Mapping relation between the service type and setting of the C2 Input Service Type TUG structure 34M/45M asynchronously mapped into a C-3 140M asynchronously mapped into a C-4 Unequipped C2 Byte (in Hex) 02 04 12 00

J2 Byte
The J2 is a VC-12 channel tracing byte. The transmit end uses the J2 byte to transmit the lower order access point identifiers in a successive manner. Hence, the receive end learns that it is in the continuous connection to the specified transmit end in this channel.

V5 Byte
The V5 is a channel status and signal identification byte. This byte is used to detect bit error and indicate remote faults or defect in lower order channel. The LP_REI and LP_RFI alarms are generated accordingly. Table F-3 lists the mapping relation between the service type and setting of the V5. Table F-3 Mapping relation between the service type and setting of the V5 Input Service Type Asynchronization
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V5 Byte (in Hex) 02

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F Board Configuration Reference

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Input Service Type Byte synchronization HDLC/PPP mapping Unequipped or Supervisory-Unequipped

V5 Byte (in Hex) 04 0A 00

Equipping Indication
When a service channel just carries the service and does not process the service, select Unequipped or Supervisory-Unequipped. When a service channel carries the service and also processes the service, select EquippedUnspecific Payload.

Tributary Loopback
The tributary loopback function is used to locate faults in the service channels. The tributary loopback is also a diagnosis function. When the tributary loopback is performed, related services are interrupted.

Path Service Type

This parameter is set to specify service type for the channel.
l

Select E1 or T1 for E1/T1 processing boards according to the actual service type in the channel. Select E3 or T3 for E3/T3 processing boards according to the actual service type in the channel.

Serial Port Protocol Mode

For the DX1, select the protocol mode of the N x 64 kbit/s signals. The protocol mode includes V.35, V.24, X.21, RS449, RS530 and RS530A.

DDN Clock Source Management

The timing scheme and working clock source can be set for the DX1.
l

Set the timing scheme of the DDN channels 1012 and 1416 to the DCE internal scheme, DCE slave scheme or DTE external scheme. Set the timing scheme of the DDN channels 9 and 13 to the DCE internal scheme, DCE slave scheme, DTE external scheme, DTE internal scheme, DTE slave scheme or DCE external scheme. By default, the timing scheme is the DCE internal scheme for channels 9 and 13 is the DCE internal scheme.

F.3 Data Processing Board

The parameters that should be set for data processing boards include SDH parameters, Ethernet parameters and ATM parameters.
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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

F Board Configuration Reference

F.3.1 SDH Parameters The SDH parameters that should be set for data processing boards include the J1 byte, C2 byte, J2 byte and V5 byte. F.3.2 Ethernet Parameters The Ethernet parameters that should be set for the Ethernet boards include the working mode and LCAS state. F.3.3 ATM Parameter The ATM parameters that the ATM boards should be set include port type and flow type.

F.3.1 SDH Parameters

The SDH parameters that should be set for data processing boards include the J1 byte, C2 byte, J2 byte and V5 byte.

J1 Byte
The J1 byte is the path tracing byte. The transmit end transmits the J1 byte in a successive manner. Hence, the receive end learns that it is in the continuous connection to the specified transmit end in this path. When detecting the J1 mismatch, the receive end generates the LP_TIM_VC3 alarm in the VC-3 path and the HP_TIM in the VC-4 path. If the J1 byte is of the default value, "", these alarms are not reported.
NOTE

l l

For the N1EFS4 and MST4, the J1 byte is " HuaWei SBS " by default. For other boards, the J1 byte is "". For the EMS4 and EGS4, set the J1 byte as " HuaWei SBS ".

C2 Byte
The C2 byte is the signal label byte, which is used to indicate the multiplexing structure of the VC frames and the payload property. The received C2 should be the same as the transmitted C2. In case of the C2 mismatch, the LP_SLM alarm is generated in the VC-3 path and the HP_SLM alarm is generated in the VC-4 path.

J2 Byte
The J2 is a VC-12 path tracing byte. The transmit end uses the J2 byte to transmit the lower order access point identifiers in a successive manner. Hence, the receive end learns that it is in the continuous connection to the specified transmit end in this path. In case of the J2 mismatch, the LP_TIM_VC12 alarm is generated in the VC-12 path. If the J1 byte is of the default value, "", these alarms are not reported.

V5 Byte
The V5 is a path status and signal identification byte. This byte is used to detect bit error and indicate remote faults or defect in lower order path. The LP_REI and LP_RFI alarms are generated accordingly.
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When detecting the V5 mismatch, the receive end generates the LP_SLM_VC12 in the VC-12 path. Table F-4 lists the mapping relation between the service type and setting of the V5. Table F-4 Mapping relation between the service type and setting of the V5 Input Service Type Asynchronization Byte synchronization HDLC/PPP mapping Unequipped or Supervisory-Unequipped V5 Byte (in Hex) 02 04 0A 00

F.3.2 Ethernet Parameters

The Ethernet parameters that should be set for the Ethernet boards include the working mode and LCAS state.

Working Mode
Generally, the interconnected equipment should work in the same fixed working mode. If the working modes at both ends mismatch, packets may be lost or the rate becomes less. In case of large volume of data, services may be even interrupted. For EAS2, set the working mode 10G full-duplex. For EGT2, EGS2 and EGS4, set the working mode to auto-negotiation or 1000M full-duplex. For the EFT8 and EFT8A, set the working mode to auto-negotiation or 10/100M full-duplex. For the EFS4 and EFS0, set the working mode to auto-negotiation, 10M half-duplex, 10M fullduplex, 100M half full-duplex or 100M full-duplex. For the GE ports of the EMS4, EMR0 and EGR2, set the working mode to auto-negotiation or 1000M full-duplex. For the FE ports, set the working mode to auto-negotiation, 10M half-duplex, 10M full-duplex, 100M half full-duplex or 100M full-duplex.

LCAS State
Enable or disable the LCAS.

Maximum Packet Length

For external ports, set the maximum packet length, which is 1522-byte by default.

Mapping Protocol
The mapping protocols of the interconnected equipment should be the same. For the EGT2, EFT8, EFT8A, EFF8 and ETF8, set the mapping protocol to HDLC, LAPS and GFP-F. By default, the mapping protocol is GFP-F.
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F Board Configuration Reference

Choose the GFP-F mapping protocol for the EGS2, EFS4, EFS0 and EAS2. For the EMR0 and EGR2, set the mapping protocol to LAPS and GFP. By default, the mapping protocol is GFP-F. Choose the GFP-T mapping protocol for the MST4.

TAG Flag
The TAG flag is used to identify the type of packets. The TAG flag can be set to TAG Aware, Access and Hybrid. 1. 2. When the TAG flag is set as the TAG Aware for a port, the port transparently transmits the packets with a TAG and discards the packets without a TAG. When the TAG flag is set as Access for a port, the port adds a TAG to the received packets that does not contain any TAG according to the VLAN ID of the port, and discards the packets that contain a TAG. When the TAG flag is set as Hybrid for a port, the port can process the packets with a TAG or without any TAG. In this case, the port adds a TAG to the received packets that does not contain any TAG according to the VLAN ID of the port.

3.

VLAN ID
Set the default VLAN ID of the local port.

Port Type
For the boards that support the MPLS function, set the port type to P or PE. Provider edge (PE) indicates the edge port of the service provider and provider (P) indicates the core network port of the service provider. When configuring the EVPL and EVPLAN services, set this parameter. Set the external port to PE and the internal port to P.

Port Encapsulation Format

The encapsulation format can be set to MartinioE or stack VLAN. When the port is of the P type, this attribute is valid. For EVPL services, set the encapsulation format to MartinioE. For EVPLAN services, set the encapsulation format to stack VLAN.

Port Attribute
For boards that support the QinQ function, set the port attribute to UNI, NNI, U-NNI, S-Aware or C-Aware.

F.3.3 ATM Parameter

The ATM parameters that the ATM boards should be set include port type and flow type.

Port Type
The port types include NNI and UNI (default).

Flow Type
The flow type should meet the requirements of the port.
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Service Type
There are four service types, CBR, rt-VBR, nrt-VBR, and UBR.

Peak Cell Rate

Set the peak cell rate (PCR) on ATM services. The PCR should be set on all service types.

Sustainable Cell Rate

Set the sustainable cell rate (SCR) on ATM services. The SCR should be set on rt-VBR and nrtVBR services.

Maximum Cell Burst Size

Set the maximum cell burst size (MCBS) on ATM serivces. The MCBS should be set on rt-VBR and nrt-VBR services.

Cell Delay Variation Tolerance

Set the cell delay variation tolerance (CDVT) on ATM serivces. The CDVT should be set on CBR, rt-VBR and UBR services.

F.4 Cross-Connect and Timing Unit

The clock parameters should be set on the cross-connect and timing unit. Set the following parameters when synchronization status message (SSM) is not enabled and the external clock is unavailable.
l l

Reference clock source Reference clock source level

Set the following parameters when the external clock is configured and the SSM is enabled.
l l l l l

Reference clock source Reference clock source level Building integrated timing supply (BITS) type S1 byte Threshold for selecting the clock in case of the switching protection

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G
This document defines the following terms: 1 1:N protection 1+1 protection 100Base-TX

Glossary

A 1:N protection architecture has N normal traffic signals, N working SNCs/trails and one protection SNC/trail. It may have one extra traffic signal. A 1+1 protection architecture has one normal traffic signal, one working SNC/trail, one protection SNC/trail and a permanent bridge. Physical Layer specification for a 100 Mbit/s CSMA/CD local area network over two pairs of Category 5 unshielded twisted-pair (UTP) or shielded twisted-pair (STP) wire. Physical Layer specification for a 10 Mb/s CSMA/CD local area network over two pairs of twisted-pair telephone wire. A cabinet which is 19 inches in width and 600mm in depth, compliant with the standards of the IEC297.

10BASE-T 19-inch cabinet

A Add/Drop Multiplexer ADM Administrator A multiplexer capable of extracting and inserting lower-rate signals from a higher-rate multiplexed signal without completely demultiplexing the signal. add/drop multiplexer. see add/drop multiplexer. A user who has authority to access all the Management Domains of the EML Core product. He has access to the whole network and to all the management functionalities. Alarm Indication Signal. A signal sent downstream in a digital network if an upstream failure has been detected and persists for a certain time. The cable which is used to transmit alarm signals.

AIS Alarm cable

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Alarm AMI

A visible or an audible indication to notify the person concerned that a failure or an emergency has occurred. See also Event. Alternate Mark Inversion. The line-coding format in transmission systems where successive ones (marks) are alternatively inverted (sent with polarity opposite that of the preceding mark). Avalanche Photodiode. A semiconductor photodetector with integral detection and amplification stages. Electrons generated at a p/n junction are accelerated in a region where they free an avalanche of other electrons. APDs can detect faint signals but require higher voltages than other semiconductor electronics. A network where transmission system payloads are not synchronized and each network terminal runs on its own clock. Asynchronous Transfer Mode. A transfer mode in which the information is organized into cells. It is asynchronous in the sense that the recurrence of cells containing information from an individual user is not necessarily periodic. It is a protocol within the OSI layer 1. An ATM cell consists of a 5 octet header followed by 48 octets of data. Reduction of signal magnitude or signal loss, usually expressed in decibels. A passive component that attenuates an electrical or optical signal. Property of an object. administrative unit. see administrative unit The rate/work mode of the communication party set as self-negotiation is specified through negotiation according to the transmission rate of the opposite party.

APD

Asynchronous ATM

Attenuation Attenuator Attribute AU Auto-negotiation

B Back up Backplane Bandwidth A method to copy the important data into a backing storage in case that the original is damaged or corrupted. A PCB circuit board in the subrack, which is connected with all the boards in position. Information-carrying capacity of a communication channel. Analog bandwidth is the range of signal frequencies that can be transmitted by a communication channel or network. Building Integrated Timing Supply. A building timing supply that minimises the number of synchronization links entering an office. Sometimes referred to as a synchronization supply unit.

BITS

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Board Version Replacement Function

A function that enables a board supporting several board IDs. Generally, a board of an old version is used to the NE also of an old version, which does not support the board of a new version. When a board of a new version is used to replace a board of an old version, the former should work with the ID of the board of the old version. The board of a new version works on the NE of a new version with the ID of the board of new version. In this way, the board of the new version has several board IDs. The action of transmitting identical traffic (SPE contents) on both the working and protection channels. The act of sending a frame addressed to all stations on the network

Bridge Broadcast

C Cable tie CBR The tape used to bind the cables. Constant Bit Rate. The Constant Bit Rate service category is used by connections that request a static amount of bandwidth that is continuously available during the connection lifetime. This amount of bandwidth is characterized by a peak cell Rate (PCR) value. Cell Delay Variation Tolerance. Information sent in the forward and backward direction to determine the upper bound of the tolerance admitted for the time interval between cells pertaining to a given cell flow. The backward CDVT values included in the IAM and MOD shall be interpreted as maximum acceptable values for the cell flow in the backward direction. The center to center difference in frequency or wavelength between adjacent channels in a WDM device. The smallest subdivision of a circuit that provides a type of communication service; usually a path with only one direction. A communications path or network; usually a pair of channels providing bi-directional communication. A kind of terminal (PC or workstation) connected to a network that can send instructions to a server and get results through a user interface. See also server. This is the STS-3 line code. This is a two level non-return to zero code. A binary 1 is coded by either of the amplitude levels, +A or -A, for one full unit time interval (T) in such a way that the level alternates for successive binary ones. For a binary zero there is always a positive transition (-A to +A) at the mid point of the binary unit interval (T/2).

CDVT

Channel spacing Channel Circuit Client

Coded Mark Inversion

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Configuration data

The data that configures the NE hardware for coordination between this NE and other NEs in the entire network, and for operation of specified services. Configuration data is the instruction file of NEs, and it is a key element to ensure that the network runs efficiently. The typical configuration data includes board configuration, clock configuration and protection relationship. To set the basic parameters of an operation object. A "transport entity" which consists of an associated pair of "unidirectional connections" capable of simultaneously transferring information in opposite directions between their respective inputs and outputs. The process of developing a model of the echo path which will be used in the echo estimator to produce the estimate of the circuit echo. In the context of message handling, a transmittal event in which an MTA transforms parts of a message content from one encoded information type to another, or alters a probe so it appears that the described messages were so modified. A technique for using overhead bits to detect transmission errors.

Configure Connection

Convergence Conversion

Cyclic Redundancy Check

D DDF Dense Wavelength Division Multiplexing Drop Digital Distribution Frame. A frame which is used to transfer cables. The higher capacity version of WDM, which is a means of increasing the capacity of fiber-optic data transmission systems through the multiplexing of multiple wavelengths of light. Commercially available DWDM systems support the multiplexing of from 8 to 40 wavelengths of light. The port on a network element where the service to an end customer may be connected, e.g., a tributary card on a SONET ADM. For example, a drop for a DS1 customer service may be provided by a VT1.5 card terminating a VT1.5 trail. A description of a ring that has entry nodes that add traffic to the ring via the bridging function. Dense Wavelength Division Multiplexing. The technology utilizes the characteristics of broad bandwidth and low attenuation of single mode optical fiber, employs multiple wavelengths with specific frequency spacing as carriers, and allows multiple channels to transmit simultaneously in the same fiber.

Dual-Fed DWDM

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E13 ECC

A funciton used to multiplex E1 signals into E3 signals or to demultipex E3 signals into E1 signals. Embedded Control Channel. An ECC provides a logical operations channel between SDH NEs, utilizing a data communications channel (DCC) as its physical layer. Erbium-Doped Fiber Amplifier. The optical amplifier that its fiber doped with the rare earth element erbium, which can amplify at 1530 to 1610 nm when the optical amplifier is pumped by an external light source. A component at the two ends of the front panel of a board, which is used for inserting or removing the board. In 1000BASE-X, the process by which a MAC packet is enclosed within a PCS code-group stream Ethernet Private Line. An EPL service is a point-to-point interconnection between two UNIs without SDH bandwidth sharing.Transport bandwidth is never shared between different customers. Enterprise System Connection. A path protocol which connects the host with various control units in an storage system. It is a serial bit stream transmission protocol. The transmission rate is 200 Mbit/s. Electrostatic discharge jack. A hole in the cabinet or subrack, which connect the subrack or cabinet to the insertion of ESD wrist strap. Electrostatic Discharge. The phenomena the energy being produced by electrostatic resource discharge instantly. A data link level protocol comprising the OSI model's bottom two layers. It is a broadcast networking technology that can use several different physical media, including twisted pair cable and coaxial cable. Ethernet usually uses CSMA/CD. TCP/IP is commonly used with Ethernet networks. European Telecommunications Standards Institute Ethernet Virtual Private Line. An EVPL service is a service that is both a line service and a virtual private service. A graphic presentation formed by the superimposition of the waveforms of all possible pulse sequences.

EDFA

Ejector lever Encapsulation EPL

ESCON

ESD jack ESD Ethernet

ETSI EVPL Eye pattern

F Fan tray assembly Fault A module which contains fans used for heat dissipation. A fault is the inability of a function to perform a required action. This does not include an inability due to preventive maintenance, lack of external resources, or planned actions.

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FC Fiber connector

Fiber Channel. A standard of data storage network for transmitting signals at 100 Mbit/s to 4.25Gbit/s over fiber or (at slow speeds) copper. A device mounted on the end of a fiber-optic cable, light source, receiver, or housing that mates to a similar device to couple light into and out of optical fibers. A connector joins two fiber ends, or one fiber end and a light source or detector. The fiber which is used to connect the subrack with the ODF. Fibre Connect. A new generation connection protocol which connects the host with various control units. It carries single byte command protocol through the physical path of fiber channel, and provides higher rate and better performance than ESCON. An aggregation of packets that have the same characteristics. On the T2000 or NE software, flow is a group of classification rules. On boards, it is a group of packets that have the same quality of service (QoS) operation. At present, two flows are supported: port flow and port + VLAN flow. Port flow is based on port ID and port + VLAN flow is based on port ID and VLAN ID. The two flows cannot coexist in the same port. A cyclic set of consecutive time slots in which the relative position of each time slot can be identified. An operating condition of a clock, the output signal of which is strongly influenced by the oscillating element and not controlled by servo phaselocking techniques. In this mode the clock has never had a network reference input, or the clock has lost external reference and has no access to stored data, that could be acquired from a previously connected external reference. Free-run begins when the clock output no longer reflects the influence of a connected external reference, or transition from it. Free-run terminates when the clock output has achieved lock to an external reference. Pertaining to both parties that can send and receive data at the same time on the communication link.

Fiber jumper FICON

Flow

Frame Free-run mode

Full duplex

G Gain The ratio between the optical power from the input optical interface of the optical amplifier and the optical power from the output optical interface of the jumper fiber, which expressed in dB. Consolidating or segregating traffic for efficiency. A groove in the subrack, which ensures the correct connection of a board to the backplane.

Grooming Guide rail

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Half duplex

Pertaining to, both parties that only one party can send data, while the other party can only receive data on the communication link.

I IMA frame The IMA frame is used as the unit of control in the IMA protocol. It is a logical frame defined as M consecutive cells, numbered 0 to M-l, transmitted on each of the N links in an IMA group. Inverse Multiplexing for ATM. The ATM inverse multiplexing technique involves inverse multiplexing and de-multiplexing of ATM cells in a cyclical fashion among links grouped to form a higher bandwidth logical link whose rate is approximately the sum of the link rates. This is referred to as an IMA group. The area for the interface boards on the subrack. A nonreciprocal optical device intended to suppress backward reflections along an optical fiber transmission line while having minimum insertion loss in the forward direction.

IMA

Interface board area Isolation

J Jitter Short waveform variations caused by vibration, voltage fluctuations, control system instability, etc.

L Label Laser A mark on a cable, a subrack, or a cabinet for identification. The device that generates the directional light covering a narrow range of wavelengths. Laser light is more coherent than ordinary light. Semiconductor diode lasers are the used light source in fiber-optic system. A concept used to allow the transport network functionality to be described hierarchically as successive levels; each layer being solely concerned with the generation and transfer of its characteristic information. Link Capacity Adjustment Scheme. A solution features flexible bandwidth and dynamic adjustment. In addition, it provides a failure tolerance mechanism, which enhances the viability of virtual concatenations and enables the dynamic adjustment to bandwidth (nonservice affecting).

Layer

LCAS

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Link

A "topological component" that provides transport capacity between two endpoints in different subnetworks via a fixed (i.e., inflexible routing) relationship. The endpoints are "subnetwork termination point pools" for SONET, and link termination points for ATM. Multiple links may exist between a pair of subnetworks. A link also represents a set of "link connections". The fault of each path on the optical fiber can be located by setting loopback for each path of the line. There are three kinds of loopback modes: No loopback, Outloop, Inloop. The subrack close to the bottom of the cabinet when a cabinet contains several subracks.

Loopback

Lower subrack

M M13 MAC Mapping Mean launched power Mounting ear MPLS A function used to multiplex T1 signals into T3 signals or to demultiplex T3 signals into T1 signals. Media Access Control. The data link sublayer that is responsible for transferring data to and from the Physical Layer. A procedure by which tributaries are adapted into virtual containers at the boundary of an SDH network. The average power of a pseudo-random data sequence coupled into the fiber by the transmitter. A component on the side of a subrack, which is used to install the subrack in a cabinet. Multiprotocol Label Switching. Multi-protocol label switching. It is a standard routing and switching technology platform, capable of supporting various high level protocols and services. The data transmission over an MPLS network is independent of route calculating. MPLS, as a connection-oriented transmission technology, guarantees QoS effectively, supports various network level technologies, and is independent of the link layer. The MSP function provides capability for switching a signal between and including two MST functions, from a working to a protection channel. Transmission of a frame to stations specified by a group address. A function provides capability for switching a signal between and including two MST functions, from a working to a protection channel. To transmit two or more signals over a single channel. An equipment which combines a number of tributary channels onto a fewer number of aggregate bearer channels, the relationship between the tributary and aggregate channels being fixed.

MSP

Multicast Multiplex section protection Multiplex Multiplexer

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Multiplexing

A procedure by which multiple lower order path layer signals are adapted into a higher order path or the multiple higher order path layer signals are adapted into a multiplex section.

N NNI Noise figure Non-revertive Network Node Interface. NNI identifies the interface between the ATM network nodes. Compare SDH NNI. The specification to scale the random signal in the system presenting in addition to any wanted signal. In non-revertive mode, when a protection switch occurs, the working service will be switched to the protection service and the status will remain after it returns normal. Non Return to Zero. A digital code in which the signal level is low for a 0 bit and high for a 1 bit and dose not return to 0 between successive 1 bits.

NRZ

O OADM Optical Add/Drop Multiplexer. A device that can be used to add the optical signals of various wavelengths to one channel and drop the optical signals of various wavelengths from one channel. Optical Distribution Frame. A frame which is used to transfer and spool fibers. Optical Network Element. A stand-alone physical entity in an optical transmission network that supports at least network element functions. A process that add the optical signals of various wavelengths to one channel and drop the optical signals of various wavelengths from one channel. A device or subsystem in which optical signals can be amplified by means of stimulated emission taking place in an suitable active medium. It is used to amplify the optical signal of the optical transmission system. A component normally attached to an optical cable or piece of apparatus for the purpose of providing frequent optical interconnection/ disconnection of optical fibers or cables. A device to allow two or more corresponding optical transmitting units to be connected. Optical Terminal Multiplexer. A device that multiplex or demultiplex optical signals into a transmission link or into the client side. Optical Transponder Unit. A device that access service signals compliant with standards at the client side and convert them into standard DWDM or CWDM wavelengths.

ODF ONE Optical add/drop multiplexing Optical Amplifier

Optical connector

Optical interface OTM OTU

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Output optical power Overhead

The ranger of optical energy level of output signals. Extra bits in a digital stream used to carry information besides traffic signals. Orderwire, for example, would be considered overhead information.

P Packing case Paired Slots A case which is used for packing the board or subrack. Two slots of which the overheads can be passed through by using the bus on the backplane. When the SCC unit is faulty or offline, the overheads can be passed through between the paired slots by using the directly connected overhead bus. When two SDH boards form an MSP ring, the boards need to be inserted in paired slots so that the K bytes can be passed through. The action of transmitting by a node exactly what is received by that node for any given direction of transmission. A pass-through can be unidirectional or bidirectional. For BLSRs, a pass-through refers to the K1 and the K2 bytes and the protection channels. Three types of passthrough are used in BLSRs: K byte pass through, unidirectional full pass-through, and bidirectional full pass-through. The working principle of path protection: When the system works in path protection mode, the PDH path uses the dual-fed and signal selection mode. Through the tributary unit and cross-connect unit, the tributary signal is sent simultaneously to the east and west lines. Meanwhile, the cross-connect matrix sends the signal dually sent from the opposite end to the tributary board through the active and standby buses, and the hardware of the tributary board automatically and selectively receive the signal from the two groups of buses automatically according to the AIS number of the lower order path. A logical connection between the point at which a standard frame format for the signal at the given rate is assembled, and the point at which the standard frame format for the signal is disassembled. Peak Cell Rate. An upper limit on the rate at which cells can be submitted on an ATM connection. Plesiochronous Digital Hierarchy. PDH is the digital networking hierarchy that was used before the advent of Sonet/SDH. Photodiode. A semiconductor detector with an intrinsic (i) region separating the p- and n-doped regions. It has fast linear response and is used in fiber-optic receivers. A network with nodes timed by separate clock sources with almost the same timing.

Pass-Through

Path protection

Path

PCR PDH PIN

Plesiochronous

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Pointer

An indicator whose value defines the frame offset of a virtual container with respect to the frame reference of the transport entity on which it is supported. A direct current power distribution unit at the upper part of a cabinet, which supplies power for the subracks in the cabinet. When there are cross-connections between a line board and a tributary/ data board, many alarms are raised on the tributary/data board if alarms are raised on the line board. These alarms are all reported to the T2000. Such a large number of alarms can disturb the troubleshooting and affect the problem solution efficiency. Therefore, the inter-board alarm suppression function is used to solve this problem. Both communication parties are connected permanently. A generic term for an action. A generic term for a collection of actions. An area for the processing boards on the subrack. The process of making available various telecommunications resources (such as switching systems and transport facilities) for telecommunication services. Provisioning includes forecasting the demand for services, determining the additions or changes to the network that will be needed, determining where and when they will be needed, and installing all the necessary network elements to provide such services.

Power unit PRBS

Private line Procedure Process Processing board area Provisioning

R Receiver overload Receiver sensitivity Reference clock Receiver overload is the maximum acceptable value of the received average power at point R to achieve a 1 x 10-10 BER. Receiver sensitivity is defined as the minimum acceptable value of average received power at point R to achieve a 1 x 10-10 BER. A clock of very high stability and accuracy that may be completely autonomous and whose frequency serves as a basis of comparison for the frequency of other clocks. A device that performs regeneration. The process of receiving and reconstructing a digital signal so that the amplitudes, waveforms and timing of its signal elements are constrained within specified limits. In revertive switching, there is a working and protection line, board and so on. Services always revert back to the original working line or board if the switch requests are terminated; that is, when the working line or board has recovered from the fault or the external request is cleared.

REG Regeneration

Revertive switching

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RPR

Resilient Packet Ring. A metropolitan area network (MAN) technology supporting data transfer among stations interconnected in a dual-ring configuration. In the asynchronous transfer mode and there is no hand-shaking signal. It can communicate with RS232 and RS422 of other stations in pointto-point mode and the transmission is transparent. Its highest speed is 19.2 kbit/s.

RS232

S S1 byte SAN The byte defined in ITU-T to transmit the network synchronization status information. Storage Area Network. A dedicated high-speed data storage network which interconnects multiple independent storage systems with multiple servers through fiber path switch or other switch equipment. Synchronous Digital Hierarchy. A hierarchical set of digital transport structures, standardized for the transport of suitably adapted payloads over physical transmission networks. The portion of a SONET transmission facility, including terminating points, between (i) a terminal network element and a regenerator or (ii) two regenerators. A terminating point is the point after signal regeneration at which performance monitoring is (or may be) done. Parameters of an operation that can be selected by the user. signal fail.See signal fail. small form-factor pluggable.see small form-factor pluggable. The ratio of the largest peak of the total source spectrum to the second largest peak. The panel on the side of the cabinet. The cable which is used to transmit electrical signals, different from the power cable or fiber. A signal indicating the associated data has failed in the sense that a nearend defect condition (not being the degraded defect) is active. SubNetwork Connection Protection. A working subnetwork connection is replaced by a protection subnetwork connection if the working subnetwork connection fails, or if its performance falls below a required level. Subnetwork Connection Multi-protection. The source broadcasts services to multiple paths, and the sink determines which service to receive according to the service priority and then the service quality.

SDH

Section

Settings SF SFP Side mode suppression ratio Side panel Signal cable Signal fail SNCP

SNCMP

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G Glossary

SNCTP

Subnetwork Connection Tunnel Protection. It provides protection paths at the VC-4 level. When the working path is faulty, all services in the working path are switched to the protection path. The set of SONET lines between two adjacent nodes on a ring. Synchronization Status Message. ITU-T defines S1 byte to transmit the network synchronization status information. It uses the lower four bits of the multiplex section overhead S1 byte to indicate 16 types of synchronization quality grades. A network where transmission system payloads are synchronized to a master (network) clock and traced to a reference clock.

Span SSM

Synchronous

T T2000 The T2000 is a subnet management system (SNMS). In the telecommunication management network architecture, the T2000 is located between the NE level and network level, which can supports all NE level functions and part of the network level management functions. See also NM. Tandem Connection Monitor. In the SDH transport hierarchy, the TCM is located between the AU/TU management layer and HP/LP layer. It uses the N1/N2 byte of POH overhead to monitor the quality of the transport channels on a transmission section (TCM section). Tributary Protection Switching. A function provided by the equipment, is intended to protect N tributary processing boards through a standby tributary processing board. A discal component in the cabinet, which is used to place the chassis or other equipment. A fault location method. A fault can be located for each service path by performing loopback on each path of the tributary board. There are three types of loopback modes: Non-loopback, Outloop and Inloop. tributary unit group.see tributary unit group.

TCM

TPS

Tray Tributary loopback TUG

U Upload Upper subrack To report all or part of the configuration data of the NE to the T2000 and overwrite the configuration data saved in the NE layer on the T2000. The subrack close to the top of the cabinet when a cabinet contains several subracks.

V VC virtual container. see virtual container.

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G Glossary

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Virtual concatenation

The payload whose transmission bandwidth is bigger than VC4. Virtual concatenation combines multiple VC4 payloads (successive or nonsuccessive) to form a virtual large structure VC4-Xv in cascade mode for transmission. The transmission of the broadband cascaded payload is implemented via the virtual cascade, thus improving the SDH transmission payload bandwidth capability from VC4 to VC4-4C. Virtual local area network. A subset of the active topology of a Bridged Local Area Network. Associated with each VLAN is a VLAN Identifier (VID). Virtual Private Network. Enables IP service to be transmitted securely over a public TCP/IP network by encrypting all service from one network to another.

VLAN

VPN

W Wavelength Division Multiplexing A means of increasing the capacity of fiber-optic data transmission systems through the multiplexing of multiple wavelengths of light. WDM systems support the multiplexing of as many as four wavelengths.

G-14

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

H Acronyms and Abbreviations

H
A ADM AMI APS ATM B BITS C CAR CBR CC CMI COA CPU CRC D DC DCC DCE DCU DDF DTR

Acronyms and Abbreviations

Add/Drop Multiplexer Alternate Mark Inversion Automatic Protection Switching Asynchronous Transfer Mode

Building Integrated Timing Supply

Committed Access Rate Constant Bit Rate Continuity Check Coded Mark Inversion Case-shaped Optical Amplifier Central Processing Unit Cyclic Redundancy Check

Direct Current Data Communication Channel Data Circuit-terminal Equipment Dispersion Compensation Unit Digital Distribution Frame Data Terminal Ready

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H-1

H Acronyms and Abbreviations

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

DVB-ASI DWDM E ECC EDFA EMC EMI EPL EPLAN ESCON ETS ETSI EVPL EVPLAN F FC FE FEC FICON FPGA G GE GFP H HDB3 HDLC I IEEE IS-IS ITU-T

Digital Video Broadcast-Asynchronous Serial Interface Dense Wavelength Division Multiplexing

Embedded Control Channel Erbium-Doped Fiber Amplifier Electromagnetic Compatibility Electro Magnetic Interference Ethernet Private Line Ethernet Private LAN Enterprise Systems Connection European Telecommunication Standards European Telecommunications Standards Institute Ethernet Virtual Private Line Ethernet Virtual Private LAN

Fiber Channel Fast Ethernet Forward Error Correction Fiber Connection Field Programmable Gate Array

Gigabit Ethernet Generic Framing Procedure

High Density Bipolar of order 3 code High level Data Link Control

Institute of Electrical and Electronics Engineers Intermedia System-Intermedia System International Telecommunication Union - Telecommunication Standardization Sector

H-2

Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

H Acronyms and Abbreviations

L LAPS LB LCAS LCT M MPLS MSP MLM N NA NRZ O OAM OSPF P PA PDH PRBS R RAM RD RIP RSTP S SDH SG SLM SNCP SNCMP SNCTP Synchronous Digital Hierarchy Signaling Ground Single- Longitudinal Mode Sub-Network Connection Protection Subnetwork Connection Multi-protection Subnetwork Connection Tunnel Protection Random-access Memory Receive Data Routing Information Protocol Rapid Spanning Tree Protocol Power Amplifier Plesiochronous Digital Hierarchy Pseudo-Random Binary Sequence Operation Administration and Maintenance Open Shortest Path First Not available Non Return to Zero Multi-protocol Label Switch Multiplex Section Protection Multi-Longitudinal Mode Link Access Procedure-SDH LoopBack Link Capacity Adjustment Scheme Local Craft Terminal

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H-3

H Acronyms and Abbreviations

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

SSM T TD TPS U UBR UPM V VBR VLAN VPN W WDM

Synchronization Status Message

Transmit Data Tributary Protection Switching

Unspecified Bit Rate Uninterruptible Power Modules

Variable Bit Rate Virtual Local Area Network Virtual Private Network

Wavelength Division Multiplexing

H-4

Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd

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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Index

Index
A
ADL4 configuration reference, 7-119 feature code, 7-119 front panel, 7-117 function and feature, 7-114 principle and signal flow, 7-115 technical specifications, 7-120 valid slots, 7-119 version, 7-114 ADQ1 configuration reference, 7-126 feature code, 7-126 front panel, 7-124 function and feature, 7-121 principle and signal flow, 7-122 technical specifications, 7-127 valid slots, 7-126 version, 7-121 AMU front panel, 10-17 function and feature, 10-15 principle and signal flow, 10-15 technical specification, 10-20 valid slot, 10-20 version, 10-15 AUX front panel, 10-11 function and feature, 10-7 principle and signal flow, 10-7 technical specification, 10-14 valid slot, 10-14 version, 10-6 version, 12-2 board barcode, 4-3 classification Amplifier, 4-12 Auxiliary, 4-10 Compensation, 4-12 Control, 4-10 Data, 4-7 Interface, 4-9 PDH, 4-6 Power, 4-12 SDH, 4-4 Switching, 4-9 WDM, 4-11 loopbacks, E-1 version configuration, D-1 BPA board feature code, 12-15 Front Panel, 12-13 function and feature, 12-11 principle and signal flow, 12-12 technical specification, 12-15 valid slot, 12-15 version, 12-10

C
C34S front panel, 8-25 function and feature, 8-24 principle and signal flow, 8-24 technical specification, 8-26 valid slot, 8-26 version, 8-24 cabinet configuration, 2-2 DC PDU, 2-3 indicator, 2-3 technical specifications, 2-5 type, 2-2 Cabinet Configuration Other, 2-4 CMR2
Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd i-1

B
BA2 board feature code, 12-8 front panel, 12-5 function and feature, 12-2 principle and signal flow, 12-3 technical specification, 12-9 valid slot, 12-8
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Index

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

feature code, 11-7 front panel, 11-5 function and feature, 11-3 principle and signal flow, 11-4 technical specification, 11-8 valid slot, 11-7 version, 11-3 CMR4 board feature code, 11-13 front panel, 11-11 function and feature, 11-9 principle and signal flow, 11-10 technical specification, 11-14 valid slot, 11-13 version, 11-9 COA board feature code, 12-27 front panel, 12-22 function and feature, 12-18 installation position, 12-26 principle and signal flow, 12-20 technical specification, 12-27 version, 12-17 CXL jumper, 9-65, 9-79, 9-93, 9-107 CXL1 board configuration reference, 9-18 board feature code, 9-18 front panel, 9-14 function and feature, 9-4 jumper, 9-12 principle and signal flow, 9-7 technical specification, 9-19 valid slot, 9-18 version, 9-3 CXL16 board configuration reference, 9-54 board feature code, 9-54 front panel, 9-50 function and feature, 9-40 principle and signal flow, 9-43 technical specification, 9-55 valid slot, 9-54 version, 9-39 CXL4 board configuration reference, 9-36 board feature code, 9-36 front panel, 9-32 function and feature, 9-22 jumper, 9-30 principle and signal flow, 9-25 technical specification, 9-37 valid slot, 9-36 version, 9-21 CXLD1 board configuration reference, 9-111 board feature code, 9-110 front panel, 9-108
i-2

function and feature, 9-99 principle and signal flow, 9-102 technical specification, 9-111 valid slot, 9-110 version, 9-99 CXLD4 board configuration reference, 9-125 board feature code, 9-124 front panel, 9-122 function and feature, 9-113 jumper, 9-121 principle and signal flow, 9-116 technical specification, 9-125 valid slot, 9-124 version, 9-113 CXLL1 board configuration reference, 9-69 board feature code, 9-68 front panel, 9-66 function and feature, 9-57 principle and signal flow, 9-60 technical specification, 9-69 valid slot, 9-68 version, 9-57 CXLL16 board configuration reference, 9-97 board feature code, 9-96 front panel, 9-94 function and feature, 9-85 jumper, 9-48 principle and signal flow, 9-88 technical specification, 9-97 valid slot, 9-96 version, 9-85 CXLL4 board configuration reference, 9-83 board feature code, 9-82 front panel, 9-80 function and feature, 9-71 principle and signal flow, 9-74 technical specification, 9-83 valid slot, 9-82 version, 9-71 CXLQ1 board configuration reference, 9-139 board feature code, 9-138 front panel, 9-136 function and feature, 9-127 jumper, 9-135 principle and signal flow, 9-130 technical specification, 9-139 valid slot, 9-138 version, 9-127 CXLQ4 board configuration reference, 9-153 board feature code, 9-152 front panel, 9-150 function and feature, 9-141
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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Index

jumper, 9-149 principle and signal flow, 9-144 technical specification, 9-153 valid slot, 9-152 version, 9-141

technical specification, 6-76 valid slot, 6-75 version, 6-72

E
EFF8 front panel, 8-52 function and feature, 8-51 principle and signal flow, 8-51 technical specification, 8-54 valid slot, 8-53 version, 8-51 EFS0 configuration reference, 7-38 front panel, 7-36 function and feature, 7-31 principle and signal flow, 7-33 technical specifications, 7-38 TPS protection, 7-37 valid slots, 7-37 version, 7-30 EFS4 configuration reference, 7-46 front panel, 7-44 function and feature, 7-39 principle and signal flow, 7-41 technical specifications, 7-46 valid slots, 7-46 version, 7-39 EFT4 configuration reference, 7-8 front panel, 7-6 function and feature, 7-3 principle and signal flow, 7-4 technical specifications, 7-8 valid slots, 7-8 version, 7-3 EFT8 configuration reference, 7-15 front panel, 7-12 function and feature, 7-9 principle and signal flow, 7-11 technical specifications, 7-15 valid slots, 7-14 version, 7-9 EFT8A configuration reference, 7-22 front panel, 7-19 function and feature, 7-16 principle and signal flow, 7-17 technical specifications, 7-22 valid slots, 7-22 version, 7-16 EGR2 configuration reference, 7-100 feature code, 7-100 front panel, 7-99
i-3

D
D12B front panel, 8-6 function and feature, 8-6 principle and signal flow, 8-6 technical specification, 8-9 valid slot, 8-8 version, 8-6 D12S front panel, 8-10 function and feature, 8-9 principle and signal flow, 8-10 technical specification, 8-13 valid slot, 8-12 version, 8-9 D34S front panel, 8-21 function and feature, 8-20 principle and signal flow, 8-21 technical specification, 8-22 valid slot, 8-22 version, 8-20 D75S front panel, 8-17 function and feature, 8-16 principle and signal flow, 8-16 technical specification, 8-20 valid slot, 8-19 version, 8-16 DM12 front panel, 8-65 function and feature, 8-64 principle and signal flow, 8-65 technical specification, 8-68 valid slot, 8-68 version, 8-64 DX1 board configuration reference, 6-71 board feature code, 6-69 front panel, 6-68 function and feature, 6-66 principle and signal flow, 6-66 technical specification, 6-71 TPS Protection, 6-70 valid slot, 6-69 version, 6-66 DXA board configuration reference, 6-76 front panel, 6-74 function and feature, 6-73 principle and signal flow, 6-73
Issue 02 (2007-03-29)

Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd

Index

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

function and feature, 7-93 principle and signal Flow, 7-96 technical specifications, 7-101 valid slots, 7-100 version, 7-93 EGS2 configuration reference, 7-54 feature code, 7-54 front panel, 7-52 function and feature, 7-48 principle and signal flow, 7-50 technical specifications, 7-55 valid slots, 7-54 version, 7-47 EGS4 configuration reference, 7-80 feature code, 7-77 front panel, 7-75 function and feature, 7-70 principle and signal flow, 7-72 protection, 7-77, 7-89 technical specifications, 7-81 valid slots, 7-77 version, 7-69 EGS4A configuration reference, 7-91 feature code, 7-89 front panel, 7-87 function and feature, 7-82 principle and signal flow, 7-84 technical specifications, 7-92 valid slots, 7-89 version, 7-82 EGT2 configuration reference, 7-28 feature code, 7-28 front panel, 7-26 function and feature, 7-23 principle and signal flow, 7-24 technical specifications, 7-29 valid slots, 7-28 version, 7-23 EMR0 configuration reference, 7-112 feature code, 7-112 front panel, 7-108 function and feature, 7-103 principle and pignal Flow, 7-106 technical Specifications, 7-112 valid slots, 7-111 version, 7-102 EMS4 configuration reference, 7-67 feature code, 7-64 front panel, 7-62 function and feature, 7-56 principle and signal flow, 7-59 protection, 7-64
i-4

technical specifications, 7-68 valid slots, 7-63 version, 7-56 EOW front panel, 10-4 function and feature, 10-2 principle and signal flow, 10-3 technical specification, 10-6 valid slot, 10-6 version, 10-2 ETF8 front panel, 8-56 function and feature, 8-55 principle and signal flow, 8-56 technical specification, 8-59 valid slot, 8-58 version, 8-55 ETS8 front panel, 8-61 function and feature, 8-60 principle and signal flow, 8-60 technical specification, 8-63 valid slot, 8-63 version, 8-60 EU04 front panel, 8-28 function and feature, 8-27 principle and signal flow, 8-27 technical specification, 8-30 valid slot, 8-29 version, 8-27 EU08 front panel, 8-32 function and feature, 8-31 principle and signal flow, 8-31 technical specification, 8-33 valid slot, 8-33 version, 8-31

F
FAN front panel, 10-21 function and feature, 10-20 principle and signal flow, 10-21 technical specification, 10-22 valid slot, 10-22 version, 10-20 FIB front panel, 11-59 function and feature, 11-58 principle and signal flow, 11-59 technical specification, 11-61 valid slot, 11-60 version, 11-58

Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd

Issue 02 (2007-03-29)

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Index

I
IDL4 board protection, 7-134 configuration reference, 7-134 feature code, 7-134 front panel, 7-132 function and feature, 7-128 principle and signal flow, 7-130 technical specifications, 7-135 valid slots, 7-134 version, 7-128 IDQ1 configuration reference, 7-142 feature code, 7-142 front panel, 7-140 function and feature, 7-136 principle, 7-138 protection, 7-142 signal flow, 7-138 technical specifications, 7-143 valid slots, 7-142 version, 7-136 indicators alarm, A-2 cabinet, A-2

M
MR2 board feature code, 11-19 front panel, 11-17 function and feature, 11-16 principle and signal flow, 11-16 technical specification, 11-20 valid slot, 11-19 version, 11-16 MR2A front panel, 11-24 function and feature, 11-21 principle and signal flow, 11-23 technical specification, 11-25 valid slot, 11-25 version, 11-21 MR2B front panel, 11-29 function and feature, 11-27 principle and signal flow, 11-28 technical specification, 11-30 valid slot, 11-30 version, 11-27 MR2C front panel, 11-34 function and feature, 11-32 principle and signal flow, 11-33 technical specification, 11-36 valid slot, 11-36 version, 11-32 MR4 board feature code, 11-40 front panel, 11-39 function and feature, 11-37 principle and signal flow, 11-38 technical specification, 11-41 valid slot, 11-40 version, 11-37 MST4 configuration reference, 7-150 feature code, 7-149 front panel, 7-148 function and feature, 7-144 principle and pignal Flow, 7-146 technical specifications, 7-150 valid slots, 7-149 version, 7-144 MU04 front panel, 8-40 function and feature, 8-39 principle and signal flow, 8-40 technical specification, 8-42 valid slot, 8-41 version, 8-39

L
L12S front panel, 8-4 function and feature, 8-3 principle and signal flow, 8-3 technical specification, 8-5 valid slot, 8-5 version, 8-3 L75S front panel, 8-14 function and feature, 8-13 principle and signal flow, 8-14 technical specification, 8-15 valid slot, 8-15 version, 8-13 Label description, B-2 Position, B-3 Safety Label, B-2 LWX board feature code, 11-48 front panel, 11-46 function and feature, 11-43 principle and signal flow, 11-44 technical specification, 11-48 valid slot, 11-48 version, 11-43

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i-5

Index

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

O
OBU1 feature code, 11-56 front panel, 11-54 function and feature, 11-52 principle and signal flow, 11-53 technical specification, 11-56 valid slot, 11-56 version, 11-52 OU08 front panel, 8-36 function and feature, 8-35 principle and signal flow, 8-35 technical specification, 8-38 valid slot, 8-38 version, 8-34

P
PD1 board configuration reference, 6-17 board feature code, 6-14 front panel, 6-13 function and feature, 6-9 principle and signal flow, 6-10 technical specification, 6-17 TPS protection, 6-15 valid slot, 6-13 version, 6-9 PD3 board configuration reference, 6-57 front panel, 6-54 function and feature, 6-51 principle and signal flow, 6-51 technical specification, 6-57 TPS protection, 6-55 valid slot, 6-55 version, 6-50 PIU front panel, 13-9 function and feature, 13-8 principle and signal flow, 13-8 technical specifications, 13-11 valid slot, 13-10 version, 13-8 PIUA front panel, 13-13 function and feature, 13-12 principle and signal flow, 13-12 technical specifications, 13-14 valid slot, 13-14 version, 13-11 PL1 board configuration reference, 6-7 board feature code, 6-7 front panel, 6-6
i-6

function and feature, 6-3 principle and signal flow, 6-4 technical specification, 6-8 valid slot, 6-7 version, 6-3 PL3 board configuration reference, 6-42 front panel, 6-39 function and feature, 6-36 principle and signal flow, 6-36 technical specification, 6-42 TPS protection, 6-40 valid slot, 6-40 version, 6-35 PL3A board configuration reference, 6-49 front panel, 6-47 function and feature, 6-44 principle and signal flow, 6-45 technical specification, 6-49 valid slot, 6-48 version, 6-43 power consumption and weight, C-1 PQ1 board configuration reference, 6-26 board feature code, 6-24 front panel, 6-22 function and feature, 6-19 principle and signal flow, 6-20 technical specification, 6-26 TPS protection, 6-24 valid slot, 6-23 version, 6-18 PQ3 board configuration reference, 6-64 front panel, 6-61 function and feature, 6-58 principle and signal flow, 6-59 technical specification, 6-65 TPS protection, 6-63 valid slot, 6-62 version, 6-58 PQM board configuration reference, 6-34 front panel, 6-31 function and feature, 6-27 principle and signal flow, 6-28 technical specification, 6-34 TPS protection, 6-32 valid slot, 6-32 version, 6-27

S
SEP1 configuration reference, 5-53 front panel, 5-50 function and feature, 5-46
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OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

Index

principle and signal flow, 5-47 technical specifications, 5-54 TPS Protection, 5-52 valid slot, 5-52 version, 5-46 SF16 configuration reference, 5-118 front panel, 5-116 function and feature, 5-113 principle and signal flow, 5-114 technical specifications, 5-118 valid slots, 5-118 version, 5-113 SL1 board configuration reference, 5-9 board feature code, 5-9 front panel, 5-7 function and feature, 5-4 principle and signal flow, 5-5 technical specification, 5-9 valid slot, 5-8 version, 5-3 SL16 board feature code, 5-102 configuration reference, 5-102 front panel, 5-100 function and feature, 5-97 principle and signal flow, 5-98 technical specifications, 5-102 valid slot, 5-102 version, 5-96 SL16A board feature code, 5-110 configuration reference, 5-111 front panel, 5-109 function and feature, 5-105 principle and signal flow, 5-106 technical specifications, 5-111 valid slot, 5-110 version, 5-105 SL1A Board Configuration Reference, 5-15 Board Feature Code, 5-15 Front Panel, 5-14 Function and Feature, 5-11 Principle and Signal Flow, 5-12 Technical Specifications, 5-15 Valid Slots, 5-15 version, 5-11 SL4 board feature code, 5-60 configuration reference, 5-61 front panel, 5-58 function and feature, 5-55 principle and signal flow, 5-56 technical specifications, 5-61 valid slot, 5-60 version, 5-55
Issue 02 (2007-03-29)

SL4A Board Configuration Reference, 5-67 Board Feature Code, 5-67 Front Panel, 5-65 Function and Feature, 5-63 Principle and Signal Flow, 5-64 Technical Specifications, 5-67 Valid Slots, 5-67 Version Description, 5-63 SLD4 board feature code, 5-75 configuration reference, 5-75 front panel, 5-73 function and feature, 5-70 principle and signal flow, 5-71 technical specifications, 5-76 valid slots, 5-74 version, 5-69 SLD4A Board Configuration Reference, 5-81 Board Feature Code, 5-81 Front Panel, 5-79 Function and Feature, 5-78 Principle and Signal Flow, 5-78 Technical Specifications, 5-81 Valid Slots, 5-81 Version Description, 5-77 SLO1 board feature code, 5-37 configuration reference, 5-37 front panel, 5-35 function and feature, 5-32 principle and signal flow, 5-34 technical specifications, 5-38 valid slot, 5-37 version, 5-32 slot allocation, 3-4, 3-13 SLQ1 board configuration reference, 5-23 feature Code, 5-23 front panel, 5-21 function and feature, 5-18 principle and signal flow, 5-19 technical specification, 5-24 valid slot, 5-22 version, 5-17 SLQ1A Board Configuration Reference, 5-30 Board Feature Code, 5-30 Front Panel, 5-28 Function and Feature, 5-26 Principle and Signal Flow, 5-27 Technical Specifications, 5-30 Valid Slots, 5-30 Version Description, 5-26 SLQ4 board feature code, 5-88
i-7

Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd

Index

OptiX OSN 1500 Intelligent Optical Transmission System Hardware Description

configuration reference, 5-89 front panel, 5-87 function and feature, 5-84 principle and signal flow, 5-85 technical specifications, 5-89 valid slot, 5-88 version, 5-83 SLQ4A Board Configuration Reference, 5-94 Board Feature Code, 5-94 Front Panel, 5-93 Function and Feature, 5-91 Principle and Signal Flow, 5-92 Technical Specifications, 5-95 Valid Slots, 5-94 Version Description, 5-90 SLT1 configuration reference, 5-44 front panel, 5-42 function and feature, 5-39 principle and signal flow, 5-40 technical specifications, 5-44 valid slot, 5-44 version, 5-39 SPQ4 board configuration reference, 6-85 front panel, 6-82 function and feature, 6-77 principle and signal flow, 6-78 technical specification, 6-85 TPS protection, 6-84 valid slot, 6-83 version, 6-77 Subrack Structure, 3-2 subrack capacity, 3-3 technical specifications, 3-24

U
UPM function and feature, 13-2 principle and signal flow, 13-4 rear panel, 13-4 technical specifications, 13-6 valid slot, 13-6

T
TSB4 Front Panel, 8-44 Function and Feature, 8-43 Principle, 8-43 Signal Flow, 8-43 Technical Specifications, 8-45 Valid Slots, 8-45 Version, 8-43 TSB8 front panel, 8-47 function and feature, 8-46 principle and signal flow, 8-46 technical specification, 8-50 valid slot, 8-48 version, 8-46

i-8

Huawei Proprietary and Confidential Copyright Huawei Technologies Co., Ltd

Issue 02 (2007-03-29)