Professional Documents
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SERVICE Manual
1. Precaution
2. Product Specification
4. Troubleshooting
6. PCB Diagram
7. Schematic Diagram
MAX-G55
Refer to the service manual in the GSPN (see the rear cover) for the more information.
GSPN (Global Service Partner Network)
Area Web Site
North America service.samsungportal.com
Latin America latin.samsungportal.com
CIS cis.samsungportal.com
Europe europe.samsungportal.com
China china.samsungportal.com
Asia asia.samsungportal.com
Mideast & Africa mea.samsungportal.com
1. Precaution
1-1 Safety Precautions............................................................................................ 1-1
1-2 Servicing Precautions.......................................................................................1-3
1-3 Precautions for Electrostatically Sensitive Devices (ESDs)..............................1-4
2. Product Specification
2-1 Product Feature................................................................................................ 2-1
2-2 Specifications....................................................................................................2-4
2-3 Specifications Analysis......................................................................................2-7
2-4 Accessories.......................................................................................................2-9
4. Troubleshooting
4-1 Checkpoints by Error Mode..............................................................................4-2
4-2 MICOM, MPEG Initialization & Update.............................................................4-11
6. PCB Diagram
6-1 Wiring Diagram................................................................................................. 6-2
6-2 FRONT PCB Top............................................................................................... 6-3
6-3 FRONT PCB Bottom.........................................................................................6-5
6-4 MAIN PCB Top.................................................................................................. 6-6
6-5 MAIN PCB Bottom............................................................................................ 6-8
6-6 MPEG PCB Top................................................................................................ 6-10
6-7 MPEG PCB Bottom........................................................................................... 6-13
Contents
7. Schematic Diagram
7-1 Overall Block Diagram......................................................................................7-2
7-2 FRONT..............................................................................................................7-3
7-3 MAIN.................................................................................................................7-4
7-4 AMP..................................................................................................................7-5
7-5 USB/MIC, MPEG Power...................................................................................7-6
7-6 MPEG...............................................................................................................7-7
Precaution
1. Precaution
Follow these safety, servicing and ESD precautions to prevent damage and protect against potential hazards such
as electrical shock and X-rays.
2. When reinstalling the chassis and its assemblies, be sure to restore all protective devices, including control
knobs and compartment covers.
3. Make sure that there are no cabinet openings through which people--particularly children--might insert fingers
and contact dangerous voltages. Such openings include the spacing between the picture tube and the cabinet
mask, excessively wide cabinet ventilation slots, and improperly fitted back covers.
7. Components, parts and wiring that appear to have overheated or that are otherwise damaged should be
replaced with parts that meet the original specifications. Always determine the cause of damage or overheating,
and correct any potential hazards.
8. Observe the original lead dress, especially near the following areas: Antenna wiring, sharp edges, and
especially the AC and high voltage power supplies. Always inspect for pinched, out-of-place, or frayed wiring.
Do not change the spacing between components and the printed circuit board. Check the AC power cord for
damage. Make sure that no wires or components touch thermally hot parts.
10. Components that are critical for safety are indicated in the circuit diagram by shading, or . Use
replacement components that have the same ratings, especially for flame resistance and dielectric strength
specifications. A replacement part that does not have the same safety characteristics as the original might
create shock, fire or other hazards.
2. Always unplug the unit’s AC power cord from the AC power source before attempting to: (a) Remove or reinstall
any component or assembly, (b) Disconnect an electrical plug or connector, (c) Connect a test component in
parallel with an electrolytic capacitor.
3. Some components are raised above the printed circuit board for safety. An insulation tube or tape is sometimes
used. The internal wiring may be clamped to prevent contact with thermally hot components. Reinstall all such
elements to their original position.
4. After servicing, always check that the screws, components and wiring have been correctly reinstalled.
Make sure that the portion around the serviced part has not been damaged.
5. Check the insulation between the blades of the AC plug and accessible conductive parts (examples: metal
panels, input terminals and earphone jacks).
6. Insulation Checking Procedure: Disconnect the power cord from the AC source and turn the power switch ON.
Connect an insulation resistance meter (500V) to the blades of the AC plug.
The insulation resistance between each blade of the AC plug and accessible conductive parts (see above)
should be greater than 1 megohm.
7. Never defeat any of the B+ voltage interlocks. Do not apply AC power to the unit (or any of its assemblies)
unless all solid-state heat sinks are correctly installed.
8. Always connect a test instrument’s ground lead to the instrument chassis ground before connecting the positive
lead; always remove the instrument’s ground lead last.
First read the “Safety Precautions” section of this manual. If some unforeseen circumstance
creates a conflict between the servicing and safety precautions, always follow the safety
precautions.
1. Some semiconductor (“solid state”) devices are easily damaged by static electricity.
Such components are called Electrostatically Sensitive Devices (ESDs). Examples include integrated circuits
and some field-effect transistors. The following techniques will reduce the occurrence of component damage
caused by static electricity.
2. Immediately before handling any semiconductor components or assemblies, drain the electrostatic charge from
your body by touching a known earth ground. Alternatively, wear a discharging wrist-strap device. (Be sure to
remove it prior to applying power--this is an electric shock precaution.)
3. After removing an ESD-equipped assembly, place it on a conductive surface such as aluminum foil to prevent
accumulation of electrostatic charge.
4. Do not use freon-propelled chemicals. These can generate electrical charges that damage ESDs.
6. Use only an anti-static solder removal device. Many solder removal devices are not rated as “anti-static” (these
can accumulate sufficient electrical charge to damage ESDs).
7. Do not remove a replacement ESD from its protective package until you are ready to install it.
Most replacement ESDs are packaged with leads that are electrically shorted together by conductive foam,
aluminum foil or other conductive materials.
8. Immediately before removing the protective material from the leads of a replacement ESD, touch the protective
material to the chassis or circuit assembly into which the device will be installed.
9. Minimize body motions when handing unpackaged replacement ESDs. Motions such as brushing clothes
together, or lifting a foot from a carpeted floor can generate enough static electricity to damage an ESD.
2. Product Specification
2-1 Product Feature
Power
• 2.1ch: 280W Total RMS / 3,100W PMPO (Front: 90W/ch, S/W: 100W)
• EQ: 6 Mode
Special Functions
• CD Ripping (1x, 192 Kbps)
• Party Mode: Superb Sound + Flash LED Light
Connectivity
• USB Host (Divx, MP3, JPEG)
• Portable Audio In (3.5 phi Stereo Jack)
Disc
• Type: 3 Roulette
• Compatible: DVD, Divx, MP3, CD/CD-R/CD-RW, WMA, VCD (Regional Option)
Power
• 2.1ch: 280W Total RMS / 3,100W PMPO (Front: 90W/ch, S/W: 100W)
• EQ: 6 Mode
Special Functions
• CD Ripping (1x, 192 Kbps)
• Party Mode: Superb Sound + Flash LED Light
Connectivity
• USB Host (MP3)
• Portable Audio In (3.5 phi Stereo Jack)
Disc
• Type: 3 Roulette
• Compatible: MP3, CD-R/CD-RW, WMA
Power
• 2ch: 180W Total RMS / 2,000W PMPO (Front: 90W/ch)
• EQ: 6 Mode
Special Functions
• CD Ripping (1x, 192 Kbps)
• Party Mode: Superb Sound + Flash LED Light
Connectivity
• USB Host (MP3)
• Portable Audio In (3.5 phi Stereo Jack)
Disc
• Type: 3 Roulette
• Compatible: CD-R/CD-RW, WMA
Power
• 2.1ch: 280W Total RMS / 3,100W PMPO (Front: 90W/ch, S/W: 100W)
• EQ: 6 Mode
Special Functions
• CD Ripping (1x, 192 Kbps)
• Party Mode: Superb Sound + Flash LED Light
Connectivity
• USB Host (Divx, MP3, JPEG)
• Portable Audio In (3.5 phi Stereo Jack)
Disc
• Type: 3 Roulette
• Compatible: DVD, Divx, MP3, CD/CD-R/CD-RW, WMA, VCD (Regional Option)
2 Tape Deck
Power
• 2ch: 180W Total RMS / 2,000W PMPO (Front: 90W/ch)
• EQ: 6 Mode
Special Functions
• CD Ripping (1x, 192 Kbps)
• Party Mode: Superb Sound + Flash LED Light
Connectivity
• USB Host (Divx, MP3, JPEG)
• Portable Audio In (3.5 phi Stereo Jack)
Disc
• Type: 3 Roulette
• Compatible: CD-R/CD-RW, WMA
Disc
• Type: 3 Roulette
• Compatible: DVD, Divx, MP3, CD/CD-R/CD-RW, WMA, VCD (Regional Option)
2 Tape Deck
2-2 Specifications
Basic Specification
Signal/noise ratio 62 dB
Usable sensitivity 10 dB
RADIO FM
Total harmonic
0.3 %
distortion
Capacity 3 discs
Frequency range 20 Hz - 20 KHz (± 3 dB)
COMPACT
Signal/noise ratio 90 dB (at 1 KHz) with filter
DISC
Distortion 0.05 % (at 1 KHz)
PLAYER
Channel separation 75 dB
Disc sizes Diameter: 120 or 80 mm. Thickness: 1.2 mm
Front Speaker (6Ω) 90 Watts/CH RMS, IEC (total harmonic distortion: 10 %)
AMPLIFIER Subwoofer Speaker (6Ω) 100 Watts/CH RMS, IEC (total harmonic distortion: 10 %)
Output Power Channel separation 40 dB
Signal/noise ratio 75 dB
Power Consumption 40W
GENERAL
Dimensions 377 (W) x 227 (H) x 270 (D) mm
Basic Specification
Signal/noise ratio 62 dB
Usable sensitivity 10 dB
RADIO FM
Total harmonic
0.3 %
distortion
Capacity 3 discs
Frequency range 20 Hz - 20 KHz (± 1 dB)
COMPACT
Signal/noise ratio 90 dB (at 1 KHz) with filter
DISC
Distortion 0.05 % (at 1 KHz)
PLAYER
Channel separation 75 dB
Disc sizes Diameter: 120 or 80 mm. Thickness: 1.2 mm
Front Speaker (6Ω) 90 Watts/CH RMS, IEC (total harmonic distortion: 10 %)
AMPLIFIER Subwoofer Speaker (6Ω) 100 Watts/CH RMS, IEC (total harmonic distortion: 10 %)
Output Power Channel separation 45 dB
Signal/noise ratio 75 dB
Power Consumption 50W
GENERAL
Dimensions 270 (W) x 227 (H) x 377 (D) mm
Basic Specification
Signal/noise ratio 62 dB
Usable sensitivity 10 dB
RADIO FM
Total harmonic
0.4 %
distortion
Capacity 3 discs
Frequency range 20 Hz - 20 KHz (± 3 dB)
COMPACT
Signal/noise ratio 90 dB (at 1 KHz) with filter
DISC
Distortion 0.1 % (at 1 KHz)
PLAYER
Channel separation 75 dB
Disc sizes Diameter: 120 or 80 mm. Thickness: 1.2 mm
90 Watts/CH RMS, IEC (total harmonic distortion: 10 %)
Front Speaker (6Ω)
(MAX-DG54/DG53)
Photo
Party Mode X
DIMMER
TAPE X X X
CD RIPPING
EQ/DSP 8 8 8 8
Audio In
HEADPHONE/MIC
Karaoke X X X
FM
Tuner Memory 20 20 20 20
Dual Voltage
SPK Impedance 4Ω 4Ω 4Ω 4Ω
: application, X: non-application
Photo
90W x 2 +
Output Power 90W x 2 90W x 2 90W x 2 90W x 2
100W
Front Display VFD VFD VFD VFD VFD
Party Mode X
DIMMER
TAPE X X
CD RIPPING
EQ/DSP 8 8 8 8 8
Audio In
HEADPHONE/MIC
Karaoke X X X X X
FM
Tuner Memory 20 20 20 20 20
Dual Voltage
SPK Impedance 4Ω 4Ω 4Ω 4Ω 4Ω
: application, X: non-application
2-4 Accessories
Samsung Service
FM Antenna AH42-00021A
Center
AH68-02162F
User's Manual AH68-02162G
AH68-02162H
- Be careful to follow the disassembly sequence described in the manual. Otherwise, the product
may be damaged.
- Be sure to carefully read and understand the safety instructions before performing any work as
the IC chips on the PCB are vulnerable to static electricity.
- Assemble in the reverse order of disassembly.
<MAX-DG56 CABINET-REAR>
1 COVER-
SIDE-L
/
COVER-
SIDE-R
/
CABINET-
REAR
<MAX-G55 CABINET-REAR>
<MAX-G56/DG55 CABINET-REAR>
<MAX-DG54/DG53 CABINET-REAR>
<MAX-DG56 CABINET-REAR>
<MAX-G55 CABINET-REAR>
<MAX--G56/DG55 CABINET-REAR>
<MAX-DG54/DG53 CABINET-REAR>
2) (MAX-DG54/DG53 Only)
4 screws to disasemble tape deck.
: BH 3*10 BLACK
<MAX-DG54/DG53 TAPE-DECK>
3) Unfasten 11 screws.
: BH 3*10 BLACK
4. Troubleshooting
4-1-1 No Power
No Power
1
Check MAIN PCB UIC1 No Check MAIN PCB No
Pin 14, 40, 55 and IC1P102 Pin 3: 5.6V
89: 5V
Yes Yes
Replace IC1P101
(1203-004520)
Yes
Check POWER_ON
Signal Line
Yes
2
Check reset circuit in No
Replace X-TAL1, UQ1 parts
MAIN PCB X-TAL1, UQ1
part ok?
Replace MICOM IC
1
1
1 UIC1
1
1
<Fig. 4-1>
FIC1
UIC1
2 DCN1
<Fig. 4-2>
4-1-2 No Output
No Output
Yes
All function fail
Yes
Input fine but output fail
1/2
Check MAIN PCB No Check MICOM IC "UIC1"
AAIC1 Pin 23: Low Mute; High Normal Pin 44: Low Normal, High Mute
FIC1 Pin 24: 9V
Yes
DCN1
1
AAIC1 AAIC2
1
<Fig. 4-3-1>
FIC1
No 1 No No No
Check 27MHz TV display LOGO ok? Check reset voltage
crystal of MX1 at Pin 52 of MIC1
Yes
Yes
MIC3C
MIC3D
OPIC1
1
IOCON
BIC1 1
MIC1
M
DIC2
MACON1
DIC1
RFCON1
<Fig. 4-4>
DCN1
<Fig. 4-5>
MICOM Initial
In STANDBY condition, press “STOP” button of Main Unit 5 seconds more, time display as ‘--:--’.
Then Initialization complete.
MICOM Update
MICOM update is enabled via USB and CD/DVD.
3. DVD Model: Osd shows update screen. You have to make sure your update file is most recently version.
Then press “ENTER” to proceed.
CD Model: VFD shows “reading”. And “update” shows up and blinking. Wait until MAIN set automatically power
off.
MPEG Update
3. DVD Model: Osd shows update screen. You have to make sure your update file is most recently version.
Then press “ENTER” to proceed.
CD Model: VFD shows “reading”. And “update” shows up and blinking. Wait until MAIN set automatically power
off.
Samsung Electronics This Document can not be used without Samsung’s authorization. 5-1
5-2
Exploded View & Part List
AC502
W391
C001
W391
5-1 Exploded View
C015 C942
WA003
AL501
W391
W391
T0023 M0014
LD61A AC510 AC503
AK111
AD501
W004 P005 W391
M0007 AC510
APDC1
T0003
W384
W391
W391 T0268
AD150 AC510
T0002
C982 AA302
W384
W391
T0245
AA304
Part List
Samsung Electronics This Document can not be used without Samsung’s authorization. 5-3
Exploded View & Part List
Front
Speaker (L)
L SPEAKERS OUT
IMPEDANCE 4Ω
FRONT
FRONT
Front
Speaker (R)
Part List
5-4 This Document can not be used without Samsung’s authorization. Samsung Electronics
Exploded View & Part List
Loc. No. Part No. Description;Specification Q’ty SNA Remark Loc. No. Part No. Description;Specification Q’ty SNA Remark
APDC1 AH92-02965B ASSY PCB DECK-CD;AH,G55,CD,MPEG PCB 1 SNA UR16 2007-000552 R-CHIP;20ohm,5%,1/10W,TP,1608 2 SNA
AAC14 2203-000888 C-CER,CHIP;4.7nF,10%,50V,X7R,TP,160 2 SNA ZC14 2203-000626 C-CER,CHIP;0.022nF,5%,50V,C0G,1608 1 SNA
AC109 2203-000783 C-CER,CHIP;0.33nF,5%,50V,C0G,1608 2 SNA ZC165 2203-000815 C-CER,CHIP;0.033nF,5%,50V,C0G,1608 1 SNA
AC14 2402-000136 C-AL,SMD;22uF,20%,16V,GP,TP,5.3x5.3 2 SNA ZC35 2203-000681 C-CER,CHIP;0.027nF,5%,50V,C0G,1608 2 SNA
AC510 3708-000411 CONNECTOR-FPC/FFC/PIC;12P,1.25mm,ST 1 SA
ZC4 2203-000332 C-CER,CHIP;0.012nF,5%,50V,C0G,1608 2 SNA
AC510 3708-001761 CONNECTOR-FPC/FFC/PIC;28P,1mm,STRAI 1 SNA ZC52 2203-000669 C-CER,CHIP;27nF,10%,25V,X7R,1608 2 SA
AC510 3708-002272 CONNECTOR-FPC/FFC/PIC;4P,1mm,ANGLE, 1 SNA ZR10 2007-001164 R-CHIP;75ohm,1%,1/10W,TP,1608 1 SA
AC6 2402-001049 C-AL,SMD;10uF,20%,16V,GP,TP,3.3x3.3 4 SA ZR24 2007-000109 R-CHIP;1Mohm,5%,1/10W,TP,1608 1 SNA
AD1 0407-000116 DIODE-SWITCHING;KDS181,DAP202K,SDS2 1 SNA ZR37 2007-008567 R-CHIP;15.4Kohm,1%,1/10W,TP,1608 1 SA
AIC1 1002-001294 IC-D/A CONVERTER;PCM1742KE,24BIT,TS 1 SNA
ZR45 2007-000329 R-CHIP;11Kohm,5%,1/10W,TP,1608 2 SA
AL1 2703-000275 INDUCTOR-SMD;33UH,10%,2012 1 SA ZR47 2007-007277 R-CHIP;392ohm,1%,1/10W,TP,1608 1 SA
AR02 2007-000125 R-CHIP;3.9Kohm,5%,1/10W,TP,1608 2 SNA ZRN10 2011-001261 R-NETWORK;33ohm,5%,1/16W,L,CHIP,8P, 1 SA
AR108 2007-000097 R-CHIP;47Kohm,5%,1/10W,TP,1608 4 SNA ZVL3 3301-001495 BEAD-SMD;120ohm,2012,2500mA,TP,115o 10 SA
AR150 2007-000078 R-CHIP;1Kohm,5%,1/10W,TP,1608 8 SNA 1204-002955 IC-DECODER;ZR36966PQCG-XE2,TR,128P, 1 SA
AR30 2007-000074 R-CHIP;100ohm,5%,1/10W,TP,1608 22 SNA
2011-001397 R-NETWORK;47Kohm,5%,1/16W,L,CHIP,8P 1 SA
C0104 3809-000169 CABLE-FLAT;30V,80C,150mm,12P,1.25mm 1 SA AH41-01184A PCB-DECK;MAX-DG55/G55,FR-4,2.0,0,T1 1 SNA
C0104 3809-002254 CABLE-FLAT;30V,80C,190mm,28P,1.0mm, 1 SNA AH62-00062J HEAT SINK-MPEG;AL,T2.0 1 SNA
C125 2203-006361 C-CER,CHIP;10000nF,10%,10V,X5R,TP,2 20 SNA AH99-00150A ASSY AUTO INSERT-CD;G55,G55,mpeg,cd 1 SNA
C134 2203-000257 C-CER,CHIP;10nF,10%,50V,X7R,TP,1608 2 SNA
C212 2203-000440 C-CER,CHIP;1nF,10%,50V,X7R,1608 4 SNA
AH97-03070A ASSY-EMPTY MECHA;MAX-DG50,SDM-R32,T 1 SNA
CER04 2007-000084 R-CHIP;4.7Kohm,5%,1/10W,TP,1608 11 SNA AP090 AH66-00239A PULLEY-BELT;SDM-R31,CR 1.5,75,78,mm 1 SA
CN1 3708-000491 CONNECTOR-FPC/FFC/PIC;23P,1mm,STRAI 1 SNA AT200 AJ64-00006A LOCKER-TRAY;SDM-R32,POM,WHITE 1 SNA
CON-FF 3708-001955 CONNECTOR-FPC/FFC/PIC;8P,1mm,ANGLE, 1 SA C539 AH39-00735A WIRE HARNESS;SDM-R31,3P,51MM,3,whit 1 SA
DR1 2007-000023 R-CHIP;120ohm,5%,1/8W,TP,2012 1 SNA C777 AH63-00360C COVER-BOTTOM;SDM-R31,PS,NTR,CMS-S71 1 SA
DR1 2007-000043 R-CHIP;1Kohm,1%,1/10W,TP,1608 2 SNA
CD000 AH61-01509B BASE-MAIN;SDM-R31,ABS,1.5,262,304,N 1 SA
DR10 2007-000113 R-CHIP;33ohm,5%,1/10W,TP,1608 5 SNA CD220 AH66-00232A GEAR CAM;SDM-R31,POM (20-03),0.8,82 1 SA
FMR4 2007-000080 R-CHIP;2Kohm,5%,1/10W,TP,1608 2 SNA CD340 AJ66-00058A LEVER-LIFT;SDM-R32,ABS,BLACK,DVD 1 SNA
IC104 0801-002683 IC-CMOS LOGIC;74HCT245,TRANSCEIVER, 1 SA CD420 AH73-00025B RUBBER-CD;CMS-D100,BUTYL 5 2 SA
J914 2007-000029 R-CHIP;0ohm,5%,1/8W,TP,2012 3 SNA CD520 3409-001171 SWITCH-DETECTOR;5.0,0.1mA ~ 100mA,5 1 SA
KAR13 2007-000060 R-CHIP;100Kohm,1%,1/10W,TP,1608 5 SNA
CD520 3409-001173 SWITCH-DETECTOR;5.0,0.1~100mA,20gf, 1 SA
KAR21 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 1 SNA FL008 3809-001829 CABLE-FLAT;5.1V,70C,373mm,8P,1mm,UL 1 SNA
KOP1 1201-000163 IC-OP AMP;4560,SOP,8P,173MIL,DUAL,1 1 SA H103 AH66-00235A GEAR-PULLEY;SDM-R31,POM (F20-03),0. 1 SA
KQ1 0501-000279 TR-SMALL SIGNAL;KSA1182-Y,PNP,150mW 2 SA H108 AH63-00668B TRAY-DISC;SDM-R31,ABS HEAT,1.5,246, 1 SA
MIC1 1003-001978 IC-MOTOR DRIVER;AM5766,HSOP28H,28P, 1 SA H212 AH61-01512B HOLDER-CHUCK;SDM-R31,PC+ABS,1.5,NO 1 SNA
MIC3 1107-001600 IC-NOR FLASH;MX25L1605A,16Mbit,2Mx8 1 SNA
H505 AH63-00669A TRAY-ROULETTE;SDM-R31,ABS 1 SA
MR1 2007-000805 R-CHIP;36Kohm,5%,1/10W,TP,1608 2 SNA MOTOR- 3101-001377 MOTOR-DC;2540RPM,12.6G.CM,5V,120MA 1 SA
MR13 2007-000092 R-CHIP;15Kohm,5%,1/10W,TP,1608 2 SNA SW100 3409-001172 SWITCH-LEVER;5.0,0.1MA ~ 100MA,36de 1 SA
MR2 2007-000130 R-CHIP;39Kohm,5%,1/10W,TP,1608 1 SNA W004 6003-000283 SCREW-TAPTYPE;BH,+,-,B,M3,L8,ZPC(WH 10 SA
MR8 2007-000503 R-CHIP;2.2ohm,5%,1/10W,TP,1608 2 SA W387 6003-001210 SCREW-TAPTYPE;PWH,+,B,M2.6,L6,ZPC(B 8 SA
MROP1 2007-000090 R-CHIP;10Kohm,5%,1/10W,TP,1608 2 SNA
AH41-00675A PCB-SWITCH;SDM-R31,FR-1,1.6,32.5x37 1 SNA
MX1 2801-004284 CRYSTAL-SMD;27MHZ,10PPM,28-AAN,20PF 1 SA AH41-00676A PCB-MOTOR;SDM-R31,FR-1,1.6 1 SNA
MZD1 0403-001411 DIODE-ZENER;5.49-5.73V,200mW,SOD-32 1 SA AH41-01229A FFC-SERVO;SDM-R32,Type=A,PET,4,T0.1 1 SNA
ND53F1 1105-001261 IC-DRAM;12L1616A,16,TSOP,50P,400MIL 1 SNA AH41-01230A FFC-P/U;SDM-R32,Type=A,PET,23,T0.12 1 SNA
PIC2 1203-002779 IC-POSI.FIXED REG.;G952T63U,SOT-223 1 SA AH61-02174A HOLDER SPRING-CHUCK;SDM-D1F,SUS 1 SNA
PPC2 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160 58 SNA
AH61-02179A BODY CLAMPER;SDM-D1F,POM,WHITE 1 SA
R1 2007-002425 R-CHIP;1ohm,5%,1/10W,TP,1608 2 SNA AH61-02649A POST-GEAR;SDM-R31,SWRCH18A,9.7,L22. 1 SNA
R15 2007-000134 R-CHIP;33Kohm,5%,1/10W,TP,1608 1 SNA AH63-01735A SHEET-WASHER;SDM-R31,LUMIPROR,T0.5, 1 SNA
R227 2007-000086 R-CHIP;5.6Kohm,5%,1/10W,TP,1608 2 SNA AH66-00230A CAM-SIDE-L;SDM-R31,ABS(HF 380),NTR 1 SA
R329 2007-000081 R-CHIP;2.7Kohm,5%,1/10W,TP,1608 3 SNA AH66-00231A CAM-SIDE-R;SDM-R31,ABS (HF-0660I),N 1 SA
RC34 2203-000280 C-CER,CHIP;0.01nF,0.5pF,50V,C0G,160 2 SNA
AH66-00233A GEAR CAM-MIDDLE;SDM-R31,POM (F20-03 1 SA
RE6 2402-001042 C-AL,SMD;100uF,20%,16V,GP,TP,6.6x6. 3 SNA AH66-00234A GEAR-PLANET;SDM-R31,POM (F20-03),14 2 SA
REG1 1203-001255 IC-POSI.FIXED REG.;7805,D-PAK,3P,PL 1 SA AH66-00236A GEAR-SIDE;SDM-R31,POM (F20-03) 2 SA
RIC3 1003-001508 IC-MOTOR DRIVER;FAN8082DTF,SOP,8P,2 1 SA AH66-00237A LEVER-SIDE;SDM-R31,POM (F20-03) 1 SA
RR17 2007-001146 R-CHIP;7.5ohm,5%,1/8W,TP,2012 2 SNA AH66-00238A CAM-SLIDER;SDM-R31,POM (F20-03) 1 SA
RR2 2007-000075 R-CHIP;220ohm,5%,1/10W,TP,1608 2 SNA
AH66-10008A PULLEY-MOTOR;POM,BLK,CMS-CR3 1 SA
SD3 0407-000114 DIODE-SWITCHING;KDS184,80V,100mA,SO 1 SA AH97-02666A ASSY-TRAVERSE;CMS-S78RB,DVD DECK,FI 1 SNA
Samsung Electronics This Document can not be used without Samsung’s authorization. 5-5
Exploded View & Part List
Loc. No. Part No. Description;Specification Q’ty SNA Remark Loc. No. Part No. Description;Specification Q’ty SNA Remark
C 2401-001067 C-AL;3300uF,20%,42V,GP,18x35.5mm,7. 2 SA
C 2401-000480 C-AL;10uF,20%,50V,GP,TP,5x11,5 12 SNA
M0238 AH59-02134D SPEAKER SYSTEM;PS-G55,XAH 1 SNA
T0082 AH81-04702A SPEAKER;PS-G55,SPEAKER SYSTEM _R,-, 1 SNA C 2401-000598 C-AL;1uF,20%,50V,GP,TP,4x7,5 1 SA
T0082 AH81-04705A SPEAKER;PS-G55,CUSHION,-,-,-,-,- 1 SNA C 2401-000970 C-AL;22uF,20%,50V,WT,TP,5x11,5 1 SNA
T0082 AH81-04706A SPEAKER;PS-G55,T/W UNIT,-,-,-,-,- 1 SNA C 2401-002300 C-AL;47#F,20%,50V,GP,TP,6.3x11,5mm 1 SA
T0082 AH81-04707A SPEAKER;PS-G55,DUCT PAPER,-,-,-,-,- 1 SNA C 2401-003069 C-AL;470uF,20%,50V,WT,TP,10x20mm,5 3 SA
C 2401-003030 C-AL;220uF,20%,450V,GP,BK,30x35,10 1 SA
T0082 AH81-04708A SPEAKER;PS-G55,CABINET,-,-,-,-,- 1 SNA
T0082 AH81-04710A SPEAKER;PS-G55,WOOFER UINT,-,-,-,-, 1 SNA C004 AH61-10513A BRACKET-PCB;DAT7000,SUN,T2.0,W85,L1 1 SNA
T0082 AH81-04711A SPEAKER;PS-G55,GRILL WOOFER,-,-,-,- 1 SNA C100 2203-005065 C-CER,CHIP;1000nF,+80-20%,10V,Y5V,1 1 SNA
T0082 AH81-04712A SPEAKER;PS-G55,FRONT PANEL _R,-,-,- 1 SNA C125 2203-006361 C-CER,CHIP;10000nF,10%,10V,X5R,TP,2 1 SNA
T0082 AH81-04703A SPEAKER;PS-G55,SPEAKER SYSTEM _L,-, 1 SNA C134 2203-000257 C-CER,CHIP;10nF,10%,50V,X7R,TP,1608 2 SNA
C178 2203-002793 C-CER,CHIP;1000nF,+80-20%,25V,Y5V,2 3 SNA
T0082 AH81-04704A SPEAKER;PS-G55,FRONT_PANEL-L,-,-,-, 1 SNA
T0082 AH81-04705A SPEAKER;PS-G55,CUSHION,-,-,-,-,- 1 SNA C212 2203-000440 C-CER,CHIP;1nF,10%,50V,X7R,1608 13 SNA
T0082 AH81-04706A SPEAKER;PS-G55,T/W UNIT,-,-,-,-,- 1 SNA C23 2203-006890 C-CER,CHIP;10000nF,20%,6.3V,X5R,160 1 SNA
T0082 AH81-04707A SPEAKER;PS-G55,DUCT PAPER,-,-,-,-,- 1 SNA C231 2203-005221 C-CER,CHIP;15nF,10%,50V,X7R,1608 4 SNA
T0082 AH81-04708A SPEAKER;PS-G55,CABINET,-,-,-,-,- 1 SNA C258 2203-000236 C-CER,CHIP;0.1nF,5%,50V,C0G,1608 1 SNA
C338 2203-000609 C-CER,CHIP;22nF,10%,50V,X7R,TP,2012 1 SNA
T0082 AH81-04710A SPEAKER;PS-G55,WOOFER UINT,-,-,-,-, 1 SNA
T0082 AH81-04711A SPEAKER;PS-G55,GRILL WOOFER,-,-,-,- 1 SNA C3507 2203-000206 C-CER,CHIP;100nF,10%,50V,X7R,TP,201 5 SNA
T0082 AH81-04709A SPEAKER;PS-G55,BOX,-,-,-,-,- 1 SNA C395 2203-000260 C-CER,CHIP;10nF,10%,50V,X7R,2012 1 SNA
C3S09 2401-001324 C-AL;0.47UF,20%,50V,GP,BK,3X5,2.5 1 SA
C5 2201-000146 C-CERAMIC,DISC;0.1NF,5%,50V,SL,TP,5 1 SA
M0014 AH92-03023G ASSY PCB MAIN;MAIN PCB ASSY,MAX-G55 1 SA C608 2401-000118 C-AL;1000uF,20%,10V,GP,TP,10x12.5,5 2 SA
AAC1 2203-005249 C-CER,CHIP;100nF,10%,50V,X7R,TP,160 9 SNA
AAC14 2203-000888 C-CER,CHIP;4.7nF,10%,50V,X7R,TP,160 2 SNA C610 2202-002037 C-CERAMIC,MLC-AXIAL;100nF,+80-20%,5 1 SNA
AAC17 2203-000595 C-CER,CHIP;0.22nF,5%,50V,C0G,2012 1 SA CER04 2007-000084 R-CHIP;4.7Kohm,5%,1/10W,TP,1608 11 SNA
AAC22A 2203-002392 C-CER,CHIP;220nF,+80-20%,50V,Y5V,20 7 SA CIS3 AH40-00159A TUNER;TAF-7F05,MAX-DG35,FM, RDS,75 1 SNA
CQ3 0501-002184 TR-SMALL SIGNAL;KTD1304,NPN,200mW,S 2 SA
AAC26A 2203-005218 C-CER,CHIP;470nF,10%,50V,X7R,3216 1 SA CX2 2301-001511 C-FILM,LEAD-PEF;330NF,10%,275V,BK,1 2 SNA
AAC3 2401-001415 C-AL;470uF,20%,35V,GP,TP,10x20,5 2 SA
AAC49 2301-000216 C-FILM,LEAD-PEF;220nF,5%,50V,TP,8.0 2 SA CY5 2305-001016 C-FILM,LEAD-PEF;10nF,10%,630V,TP,12 2 SNA
AAQ3 0504-000117 TR-DIGITAL;FJN3302RTA,NPN,300MW,10K 4 SNA D1 0401-001099 DIODE-SWITCHING;1N4148WS,75V,150mA, 1 SA
AAR11 2007-000312 R-CHIP;10ohm,5%,1/4W,TP,3216 5 SNA D3503 0402-000268 DIODE-RECTIFIER;SB360,60V,3A,DO-201 1 SA
DL3 2701-000298 INDUCTOR-AXIAL;470uH,10%,4298 1 SA
AAR35 2001-000241 R-CARBON;1.5Kohm,5%,1/8W,AA,TP,1.8x 1 SNA DL3 2701-000298 INDUCTOR-AXIAL;470uH,10%,4298 1 SA
AC14 2203-000189 C-CER,CHIP;100nF,+80-20%,25V,Y5V,16 1 SNA
AC28 2203-001607 C-CER,CHIP;0.22nF,5%,50V,NP0,1608 9 SNA DQ9 0501-000010 TR-SMALL SIGNAL;2SC1008,NPN,800mW,T 2 SNA
AC510 3708-000411 CONNECTOR-FPC/FFC/PIC;12P,1.25mm,ST 1 SA DR17 2001-000027 R-CARBON;100ohm,5%,1/4W,AA,TP,2.4x6 1 SA
AC510 3708-001577 CONNECTOR-FPC/FFC/PIC;30P,1.25mm,ST 1 SA DX55PD 0402-000151 DIODE-RECTIFIER;1N5392,100V,1.5A,DO 3 SA
FAC11 2401-000651 C-AL;2.2uF,20%,50V,GP,TP,4x7,5 15 SA
AC510 3708-001761 CONNECTOR-FPC/FFC/PIC;28P,1mm,STRAI 1 SNA FAQ2 0501-000422 TR-SMALL SIGNAL;KTA1273,PNP,-30V,-3 2 SA
AC611 2203-005194 C-CER,CHIP;0.22nF,10%,50V,X7R,1608 2 SNA
AD480 2203-000979 C-CER,CHIP;47nF,10%,50V,X7R,TP,2012 8 SA FAR22 2007-000082 R-CHIP;3.3Kohm,5%,1/10W,TP,1608 1 SNA
AD480 2203-001063 C-CER,CHIP;56nF,10%,16V,X7R,TP,1608 3 SNA FC10 2301-000407 C-FILM,LEAD-PEF;2.7nF,10%,50V,TP,6x 2 SA
AD480 2203-001128 C-CER,CHIP;0.68nF,10%,50V,X7R,TP,20 2 SNA FC12 2301-000449 C-FILM,LEAD-PEF;47nF,10%,50V,TP,9.5 1 SA
FC15 2301-000469 C-FILM,LEAD-PEF;68nF,10%,50V,TP,10x 4 SA
AD480 2203-001386 C-CER,CHIP;100nF,10%,100V,X7R,TP,32 4 SNA FIC1 1204-002518 IC-VOLUME/TONE CONT.;R2S15904SP,SOP 1 SA
AD480 2203-001537 C-CER,CHIP;1nF,10%,50V,X7R,TP,2012 4 SA
AD480 2203-002494 C-CER,CHIP;470nF,10%,16V,X7R,2012 5 SNA FR7 2001-000117 R-CARBON(S);68ohm,5%,1/2W,AA,TP,2.4 1 SNA
AH020 AH62-00194B HEAT SINK;MAX-G55,AL,3,35,15,EXP,10 4 SNA HC1 2401-000048 C-AL;47uF,20%,25V,GP,TP,5x11,5 7 SA
AH020 AH62-30122F HEAT SINK;MAX-G55,AL,3,35,24,EXP,14 1 SNA HIC1 1201-001285 IC-OP AMP;4556,SOP,8P,150MIL,+/-18V 1 SA
HQ1 0501-002375 TR-SMALL SIGNAL;KTC8050,NPN,625MW,T 2 SA
AH060 AH62-00197A HEAT SINK-MAIN;AL,MAX-G55,26,51 1 SNA IC_SHI AH73-00131A RUBBER-SILICON;MAX-DA55,GAP PAD 150 1 SNA
AP1 1203-001697 IC-POSI.FIXED REG.;78R08,TO-220,4P, 1 SNA
AR02 2007-000125 R-CHIP;3.9Kohm,5%,1/10W,TP,1608 1 SNA IC1 1203-004788 IC-PWM CONTROLLER;ICE2QS01,DIP,8P,9 1 SA
AR108 2007-000097 R-CHIP;47Kohm,5%,1/10W,TP,1608 12 SNA IC501 1203-001589 IC-POSI.FIXED REG.;278R05,TO-220F,4 1 SA
AR150 2007-000078 R-CHIP;1Kohm,5%,1/10W,TP,1608 7 SNA IC520 0903-001565 IC-MICROCONTROLLER;LC87F5NC8AVU,QFP 1 SNA
IC-HOL AH61-02547A BRACKET-IC;MAX-DA50,SECC,T0.6,W12.6 1 SNA
AR161 2007-001167 R-CHIP;75ohm,5%,1/10W,TP,1608 1 SNA J914 2007-000029 R-CHIP;0ohm,5%,1/8W,TP,2012 7 SNA
AR164 2007-000076 R-CHIP;330ohm,5%,1/10W,TP,1608 2 SNA
AR174 2007-000129 R-CHIP;27Kohm,5%,1/10W,TP,1608 3 SNA JA333 3722-002622 JACK-PIN;2P,NI,WHT/RED,ANGLE 1 SNA
AR28 2007-000683 R-CHIP;3.3Kohm,1%,1/10W,TP,1608 2 SA JP19 2007-000033 R-CHIP;0ohm,5%,1/4W,TP,3216 5 SNA
AR30 2007-000074 R-CHIP;100ohm,5%,1/10W,TP,1608 13 SNA JP21 3811-001868 WIRE-NO SHEATH CU;SnCuFe,52mm,GRY 189 SNA
KAC5 2203-001126 C-CER,CHIP;0.68nF,10%,50V,X7R,1608 4 SNA
AR61 2007-000869 R-CHIP;4.7Kohm,1%,1/10W,TP,1608 2 SA KAR11 2007-000124 R-CHIP;2.2Kohm,5%,1/10W,TP,1608 14 SNA
ARR2 2007-000102 R-CHIP;100Kohm,5%,1/10W,TP,1608 12 SNA
BD707 3301-000297 BEAD-AXIAL;25ohm,3.6x1.2x5.7mm,-,TP 11 SNA KAR21 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608 7 SNA
5-6 This Document can not be used without Samsung’s authorization. Samsung Electronics
Exploded View & Part List
Loc. No. Part No. Description;Specification Q’ty SNA Remark Loc. No. Part No. Description;Specification Q’ty SNA Remark
Samsung Electronics This Document can not be used without Samsung’s authorization. 5-7
Exploded View & Part List
Loc. No. Part No. Description;Specification Q’ty SNA Remark Loc. No. Part No. Description;Specification Q’ty SNA Remark
P005 AH94-02245C ASSY PCB FRONT;FRONT PCB ASSY,MAX-G 1 SNA T0268 AC39-10019A CBF-POWER CORD;KKP-419C,H03VVH2-F,V 1 SA
A0701 AH07-00249A VF DISPLAY;HNV-10MS31T,MAX-DG55,80. 1 SA AH69-02454B MASTER CARTON;MAX-G55,PAPER,7,W683, 2 SNA
AAC1 2203-005249 C-CER,CHIP;100nF,10%,50V,X7R,TP,160 2 SNA A001 AH59-02147A REMOCON-ASSY;MAX-G55-EUR,SAMSUNG,17 1 SNA
AAR35 2001-000241 R-CARBON;1.5Kohm,5%,1/8W,AA,TP,1.8x 2 SNA
AC510 3708-001577 CONNECTOR-FPC/FFC/PIC;30P,1.25mm,ST 1 SA
C 2401-000042 C-AL;100uF,20%,16V,GP,TP,6.3x7,5 2 SA
C 2401-000970 C-AL;22uF,20%,50V,WT,TP,5x11,5 1 SNA
C212 2203-000440 C-CER,CHIP;1nF,10%,50V,X7R,1608 4 SNA
C610 2202-002037 C-CERAMIC,MLC-AXIAL;100nF,+80-20%,5 4 SNA
C661 2202-002055 C-CERAMIC,MLC-AXIAL;47nF,+80-20%,50 1 SNA
5-8 This Document can not be used without Samsung’s authorization. Samsung Electronics
PCB Diagram
6. PCB Diagram
23P
MPEG PCB (PICK UP)
COMPONENT/VIDEO/AUDIO JACK
TAPE DECK DVD DECODER DVD DECK
USB DECODER
TAPE DECK 8P DVD PICK UP
H/P JACK (DISC Change MOTOR
TAPE EQ AUX JACK op/cl)
MIC JACK/PRE-AMP/ECHO
USB JACK
4P
(sled)
MAIN PCB
SMPS BLOCK
AMPLIFIER
FUNCTION/EQ
SPK JACK
TUNER PACK
MICOM
FRONT PCB
VFD DISPLAY
KEY
LED
REMOTE EYE
VFD DRIVER
UCW5
UCW4
1
UCW1
1 UCW1
Front PCB (Control VFD, KEY)
UCW5
UCW4
IC1
UCW1
TCN1
1
DCN1 3
TP5
FCN1
2
AAIC1 AAIC2
TP3
1SIC01
DCN2
TP3
FIC1
EIC1
TP1
HIC1
TP2
UIC1
TCN1
DCN1 BIC1
FCN1
IC1P103
DCN2
TP1
TP2
TP3
MIC3C
MIC3D PCON1 5
OPIC1
1
PIC1
DAIC1
IOCON
BIC1
MIC1
MIC2
TP4
DIC2
MACON1
2
DIC1
4
3 RFCON1 ACCON1
Pin No. Signal Pin No. Signal Pin No. Signal Pin No. Signal
1 12V/CTL 1 +MTR 1 CD-VR 1 SLED+
2 AGND 2 -MTR 2 MPD 2 SLED-
3 A_L 3 TRAY_SEN 3 CD-LD 3 DCMO+
4 AGND 4 OP_SEN 4 LD-GND 4 DCMO-
5 A_R 5 CL_SEN 5 SW
6 VGND 6 MODE_SEN 6 F-
5 PCON1
7 Y 7 8V 7 T+
MPEG Power
8 PB 8 MGND 8 T-
Pin No. Signal
9 PR 9 F+
1 M8V
10 VGND 10 B
2 M8V
11 CVBS 11 C
3 MGND
12 DGND 12 D
4 MGND
13 P_CHECK 13 A
5 D5V
14 MIC_SCORE 14 E
6 DGND
15 I2CDATA 15 F
7 3.3V
16 I2CCLK 16 Vcc
8 3.3V
17 DAC CS 17 Vref
9 DGND
18 MRST 18 GND
10 D+
19 DVD_TXD 19 DVD-VR
11 D-
20 DVD_ACK 20 PD
12 DGND
21 DVD_RXD 21 DVD-LD
22 DVD_STB 22 RFCON1
23 MODE_SW 23 H-Vcc
24 IN SW
25 OUT SW
26 T-SENS
27 OPEN_MOTOR
28 CLOSE_MOTOR
TP4
PCON1
IOCON
MIC4
MACON1
ACCON1
RFCON1
7. Schematic Diagram
Samsung Electronics This Document can not be used without Samsung’s authorization. 7-1
Schematic Diagram
Main System MICOM control Function IC (R2S15904), Turner pack, Tape deck IC (DIC1HA12237F), CD/DVD deck.
SMPS It gets all information from R2S15904. They have a communication among the with HOST ↔ SLAVE interface.
BLOCK And Main System MICOM gets the information from User’s remote control. So whenever it gets the information, it
displays it on the VFD.
DVD/CD POWER AMP POWER MAIN POWER
SERVER
MEMORY
DVD/CD PACK RIC1 AM5766 MIC3C 12L1616A
PICK UP DIC3 TL3472CD MIC2 AT26DF161A
The DVD/CD Deck and Tape Deck transfer the audio data to R2S15904.
MIC3D K4S641632F
5V (DVD)
3.3V (DVD)
-30V_AMP
+30V_AMP
12V (ALL)
5V (DC-DC)
5.6V (MICOM)
+VFD/--VFD
VFD-VP
VIDEO OUT
AUX Jack and Tuner pack are each connected to R2S15904. Data from AUX and tuner transfer to R2S15904.
MIC4 BIC1
DISPLAY 24C02 74VHCT245
VFD1 USB JACK
P-MAST
Then, after processing, the data will send the date to AMP IC.
U-ACK
U-TXD
MICOM U-RXD MPEG IC 4560
VFD DRIVER U-STB
MIC1
UIC1 HIC2 H/P OUT
IC1
LC87F5NXXX ZR36966PQCG H/P OUT
PT6315A
LED
DISPLAY MCLK
DO1
CLK1
MIC_DATA
MIC_CLK
BCLK
TSDO
LRCK
TUNER BUFFER
TUNER SINGNAL
PACK DAIC2
4560
TAPE SINGNAL
TAPE HA12237F
DECK TAPE EQ REC-IN PWM POWER
STAGE
11 MIC_MIX
CL FUNCTION FIC1 AIC1
OPTION 9 FIC1 LC75106
TDA8920
DI
10 R2S15904S
7-2 This Document can not be used without Samsung’s authorization. Samsung Electronics
Schematic Diagram
7-2 FRONT
POWER
AUDIO
Samsung Electronics This Document can not be used without Samsung’s authorization. 7-3
Schematic Diagram
7-3 MAIN
POWER
AUDIO
TP3
VIDEO
TP1
TP2
TP5
TP3
TP1
TP5
TP2
7-4 This Document can not be used without Samsung’s authorization. Samsung Electronics
Schematic Diagram
7-4 AMP
TP3
POWER
AUDIO
TP3
Samsung Electronics This Document can not be used without Samsung’s authorization. 7-5
Schematic Diagram
POWER
AUDIO
7-6 This Document can not be used without Samsung’s authorization. Samsung Electronics
Schematic Diagram
7-6 MPEG
TP4
POWER
AUDIO
TP4
Samsung Electronics This Document can not be used without Samsung’s authorization. 7-7
MEMO