You are on page 1of 9

BTA/BTB24, BTA25, BTA26 and T25 Series

25A TRIACS

SNUBBERLESS & STANDARD

MAIN FEATURES:
Symbol IT(RMS) VDRM/VRRM IGT (Q1) Value 25 600 and 800 35 to 50 Unit A V mA
A1 A2 G
G

A2

A2

A1

A1 A2 G

DESCRIPTION Available either in through-hole of surface and T25 mount packages, the BTA/BTB24-25-26 triac series is suitable for general purpose AC power switching. They can be used as an ON/OFF function in applications such as static relays, heating regulation, water heaters, induction motor starting circuits...or for phase control operation in high power motor speed controllers, soft start circuits...The snubberless versions (BTA/BTB...W and T25 series) are specially recommended for use on inductive loads, thanks to their high commutation performances. By using an internal ceramic pad, the BTA series provides voltage insulated tab (rated at 2500V RMS) complying with UL standards (File ref.: E81734). ABSOLUTE MAXIMUM RATINGS
Symbol IT(RMS) Parameter RMS on-state current (full sine wave)

TO-220AB Insulated (BTA24)


A1 A2 G

A2

TO-220AB (BTB24)

A1 G A2

D2PAK (T25G)

A1 A2

RD91 (BTA25)

TOP3 Insulated (BTA26)

Value Tc = 100C Tc = 90C Tc = 75C t = 16.7 ms t = 20 ms 25

Unit A

ITSM I t dI/dt

Non repetitive surge peak on-state current (full cycle, Tj initial = 25C) It Value for fusing Critical rate of rise of on-state current IG = 2 x IGT , tr 100 ns

DPAK TO-220AB RD91 TOP3 Ins. TO-220AB Ins. F = 60 Hz F = 50 Hz

260 250 340

A A s A/s V A W C 1/9

tp = 10 ms F = 120 Hz tp = 10 ms tp = 20 s Tj = 125C Tj = 25C Tj = 125C Tj = 125C

50 VDRM/VRRM
+ 100

VDSM/VRSM Non repetitive surge peak off-state voltage IGM PG(AV) Tstg Tj Peak gate current Average gate power dissipation Storage junction temperature range Operating junction temperature range

4 1 - 40 to + 150 - 40 to + 125

September 2002 - Ed: 6A

BTA/BTB24, BTA25, BTA26 and T25 Series


ELECTRICAL CHARACTERISTICS (Tj = 25C, unless otherwise specified)
s

SNUBBERLESS (3 Quadrants) T25-G, BTA/BTB24...W, BTA25...W, BTA26...W


Symbol Test Conditions Quadrant T25 T2535 IGT (1) VGT VGD IH (2) IL dV/dt (2) VD = 12 V VD = VDRM IT = 500 mA IG = 1.2 IGT VD = 67 % VDRM gate open Tj = 125C Tj = 125C I - III II MIN. MIN. (dI/dt)c (2) Without snubber RL = 33 RL = 3.3 k Tj = 125C I - II - III I - II - III I - II - III MAX. MAX. MIN. MAX. MAX. 50 70 80 500 13 35 BTA/BTB CW 35 1.3 0.2 50 70 80 500 13 75 80 100 1000 22 V/s A/ms BW 50 mA V V mA mA Unit

STANDARD (4 Quadrants): BTB24...B, BTA25...B, BTA26...B


Symbol IGT (1) VD = 12 V VGT VGD IH (2) IL dV/dt (2) VD = VDRM IT = 500 mA IG = 1.2 IGT VD = 67 % VDRM gate open Tj = 125C Tj = 125C I - III - IV II MIN. MIN. RL = 3.3 k Tj = 125C Test Conditions RL = 33 Quadrant I - II - III IV ALL ALL MAX. MAX. MIN. MAX. MAX. Value 50 100 1.3 0.2 80 70 160 500 10 V/s V/s Unit mA V V mA mA

(dV/dt)c (2) (dI/dt)c = 13.3 A/ms

STATIC CHARACTERISTICS
Symbol VTM (2) Vto (2) Rd (2) IDRM IRRM
Note 1: minimum IGT is guaranted at 5% of IGT max. Note 2: for both polarities of A2 referenced to A1

Test Conditions ITM = 35 A tp = 380 s Tj = 25C Tj = 125C Tj = 125C Tj = 25C Tj = 125C MAX. MAX. MAX. MAX.

Value 1.55 0.85 16 5 3

Unit V V m A mA

Threshold voltage Dynamic resistance VDRM = VRRM

2/9

BTA/BTB24, BTA25, BTA26 and T25 Series


THERMAL RESISTANCES
Symbol Rth(j-c) Junction to case (AC) Parameter DPAK TO-220AB RD91 (Insulated) TOP3 Insulated TO-220AB Insulated Rth(j-a) Junction to ambient S = 1 cm DPAK TOP3 Insulated TO-220AB TO-220AB Insulated
S: Copper surface under tab

Value 0.8 1.1 1.7 45 50 60

Unit C/W

C/W

PRODUCT SELECTOR
Voltage (xxx) Part Number 600 V BTB24-xxxB BTA/BTB24-xxxBW BTA/BTB24-xxxCW BTA25-xxxB BTA25-xxxBW BTA25-xxxCW BTA26-xxxB BTA26-xxxBW BTA26-xxxCW T2535-xxxG
BTB: Non insulated TO-220AB package

Sensitivity 800 V X X X X X X X X X X 50 mA 50 mA 35 mA 50 mA 50 mA 35 mA 50 mA 50 mA 35 mA 35 mA X X X X X X X X X X

Type Standard Snubberless Snubberless Standard Snubberless Snubberless Standard Snubberless Snubberless Snubberless

Package TO-220AB TO-220AB TO-220AB RD-91 RD-91 RD-91 TOP3 Ins. TOP3 Ins. TOP3 Ins. DPAK

ORDERING INFORMATION

BT A 24 TRIAC SERIES INSULATION: A: insulated B: non insulated CURRENT: 24: 25A in TO-220AB 25: 25A in Rd91 26: 25A in TOP3

600

BW

(RG)
PACKING MODE Blank: Bulk RG: Tube

VOLTAGE: 600: 600V 800: 800V

SENSITIVITY & TYPE B: 50mA STANDARD BW: 50mA SNUBBERLESS CW: 35mA SNUBBERLESS

3/9

BTA/BTB24, BTA25, BTA26 and T25 Series

T 25 35
TRIAC SERIES CURRENT: 25A

600 G
PACKAGE: G: D2PAK

(-TR)

VOLTAGE: 600: 600V 800: 800V SENSITIVITY: 35: 35mA

PACKING MODE: Blank: Tube -TR: Tape & Reel

OTHER INFORMATION
Part Number BTA/BTB24-xxxyz BTA/BTB24-xxxyzRG BTA25-xxxyz BTA26-xxxyz T2535-xxxG T2535-xxxG-TR Marking BTA/BTB24xxxyz BTA/BTB24-xxxyz BTA25xxxyz BTA26xxxyz T2535xxxG T2535xxxG Weight 2.3 g 2.3 g 20 g 4.5 g 1.5 g 1.5 g Base quantity 250 50 25 120 50 1000 Packing mode Bulk Tube Bulk Bulk Tube Tape & reel

Note: xxx= voltage, y = sensitivity, z = type

4/9

BTA/BTB24, BTA25, BTA26 and T25 Series

Fig. 1: Maximum power dissipation versus RMS on-state current (full cycle).
P (W) 30 25 20 15 10 5 0 0 5 IT(RMS) (A) 10 15 20 25

Fig. 2-1: RMS on-state current versus case temperature (full cycle).
IT(RMS) (A) 30
BTB/T25

25
BTA24

20 15 10 5 0 0 25 50 Tc(C) 75 100 125


BTA25/26

Fig. 2-2: DPAK RMS on-state current versus ambient temperature (printed circuit board FR4, copper thickness: 35 m), full cycle.
IT(RMS) (A) 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 25 Tamb(C) 50 75 100 125
D PAK (S=1cm2)
2

Fig. 3: Relative variation of thermal impedance versus pulse duration.

K=[Zth/Rth] 1E+0
Zth(j-c)

1E-1

Zth(j-a) BTA/BTB24/T25

1E-2
Zth(j-a) BTA26

tp (s) 1E-3 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2

Fig. 4: values).
ITM (A) 300 100

On-state characteristics (maximum

Fig. 5: Surge peak on-state current versus number of cycles.


ITSM (A) 300 250 200 150
Non repetitive Tj initial=25C

t=20ms

Tj max

One cycle

10

Tj=25C

100

Repetitive Tc=75C

VTM (V) 1 0.5 1.0 1.5 2.0 2.5 3.0 3.5

Tj max. Vto = 0.85 V Rd = 16 m

50 Number of cycles

4.0

4.5

10

100

1000

5/9

BTA/BTB24, BTA25, BTA26 and T25 Series

Fig. 6: Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp < 10ms, and corresponding value of It.
ITSM (A), It (As) 3000
Tj initial=25C dI/dt limitation: 50A/s

Fig. 7: Relative variation of gate trigger current, holding current and latching current versus junction temperature (typical values).
IGT,IH,IL[Tj] / IGT,IH,IL [Tj=25C] 2.5 2.0
IGT

1000

1.5
IH & IL
ITSM

1.0 0.5 Tj(C)


10.00

It

tp (ms) 100 0.01 0.10 1.00

0.0 -40

-20

20

40

60

80

100

120

140

Fig. 8: Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values).
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c 2.4 2.2 2.0 1.8 1.6 BW/CW/T2535 1.4 B 1.2 1.0 0.8 0.6 (dV/dt)c (V/s) 0.4 0.1 1.0 10.0

Fig. 9: Relative variation of critical rate of decrease of main current versus junction temperature.
(dI/dt)c [Tj] / (dI/dt)c [Tj specified] 6 5 4 3 2 1 Tj (C) 0 25 50 75 100 125

100.0

Fig. 10: DPAK Thermal resistance junction to ambient versus copper surface under tab (printed circuit board FR4, copper thickness: 35 m).
Rth(j-a) (C/W) 80 70 60 50 40 30 20 10 0 0 4 8 12 16 S(cm) 20 24 28 32 36 40
DPAK

6/9

BTA/BTB24, BTA25, BTA26 and T25 Series


PACKAGE MECHANICAL DATA DPAK (Plastic)
DIMENSIONS
A E L2 C2

REF.

Millimeters Min. Typ. Max. 4.60 2.69 0.23 0.93 Min.

Inches Typ. Max.

D L L3 A1 B2 B G A2 2.0 MIN. FLAT ZONE V2 C R

A A1 A2 B B2 C C2 D E G L L2 L3 R V2

4.30 2.49 0.03 0.70 1.25 0.45 1.21 8.95 10.00 4.88 15.00 1.27 1.40 0

1.40

0.40

0.169 0.181 0.098 0.106 0.001 0.009 0.027 0.037 0.048 0.055 0.60 0.017 0.024 1.36 0.047 0.054 9.35 0.352 0.368 10.28 0.393 0.405 5.28 0.192 0.208 15.85 0.590 0.624 1.40 0.050 0.055 1.75 0.055 0.069 0.016 8 0 8

FOOTPRINT DIMENSIONS (in millimeters) DPAK (Plastic)


16.90

10.30 1.30

5.08

3.70 8.90

7/9

BTA/BTB24, BTA25, BTA26 and T25 Series


PACKAGE MECHANICAL DATA RD91 (Plastic)
DIMENSIONS
L2 A2 L1

REF.

Millimeters Min. Max. 40.00 30.30 22.00 27.00 16.50 24.00 14.00 3.50 3.00 0.90 4.50 13.60 3.50 1.90 43 38 Min.

Inches Max. 1.575 1.193 0.867 1.063 0.650 0.945 0.551 0.138 0.118 0.035 0.177 0.535 0.138 0.075 43 38

B2 C B1

C2 A1

C1

N2

N1 B F

E3 I A

A A1 A2 B B1 B2 C C1 C2 E3 F I L1 L2 N1 N2

29.90

1.177

13.50

0.531

1.95 0.70 4.00 11.20 3.10 1.70 33 28

0.077 0.027 0.157 0.441 0.122 0.067 33 28

PACKAGE MECHANICAL DATA TOP3 (Plastic)


DIMENSIONS REF. Millimeters Min. A B C D E F G H J K L P R 4.4 1.45 14.35 0.5 2.7 15.8 20.4 15.1 5.4 3.4 4.08 1.20 4.60 Typ. Max. 4.6 1.55 15.60 0.7 2.9 16.5 21.1 15.5 5.65 3.65 4.17 1.40 Min. 0.173 0.057 0.565 0.020 0.106 0.622 0.815 0.594 0.213 0.134 0.161 0.047 0.181 Inches Typ. Max. 0.181 0.061 0.614 0.028 0.114 0.650 0.831 0.610 0.222 0.144 0.164 0.055

8/9

BTA/BTB24, BTA25, BTA26 and T25 Series


PACKAGE MECHANICAL DATA TO-220AB (Plastic)
DIMENSIONS
B C

REF.

Millimeters Min. Typ. 3.75 Max. Min.

Inches Typ. 0.147 Max. 0.625

b2

L F I A

l4

a1

c2

l3
l2 a2

b1 e

M c1

A a1 a2 B b1 b2 C c1 c2 e F I I4 L l2 l3 M

15.20

15.90 0.598

13.00 14.00 0.511 0.551 10.00 10.40 0.393 0.409 0.61 0.88 0.024 0.034 1.23 1.32 0.048 0.051 4.40 4.60 0.173 0.181 0.49 0.70 0.019 0.027 2.40 2.72 0.094 0.107 2.40 2.70 0.094 0.106 6.20 6.60 0.244 0.259 3.75 3.85 0.147 0.151 15.80 16.40 16.80 0.622 0.646 0.661 2.65 2.95 0.104 0.116 1.14 1.70 0.044 0.066 1.14 1.70 0.044 0.066 2.60 0.102

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics 2002 STMicroelectronics - Printed in Italy - All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hong Kong - India - Isreal - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com

9/9

You might also like