HP ProBook 6570b Disassembly Instructions

Product End-of-Life Disassembly Instructions
Product Category: Notebooks and Tablet PCs Marketing Name / Model [List multiple models if applicable.] HP ProBook 6570b Notebook PC Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE). 1.0 Items Requiring Selective Treatment 1.1 Items listed below are classified as requiring selective treatment. 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable. Quantity of items Item Description Notes included in product Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA) Batteries With a surface greater than 10 sq cm Mother Board,Function Board,USB Small Board All types including standard alkaline and lithium coin or button style batteries Coin cell battery,battery pack For example, mercury in lamps, display backlights, scanner lamps, switches, batteries Includes background illuminated displays with gas discharge lamps LCD panel 3 2
Mercury-containing components Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm Cathode Ray Tubes (CRT) Capacitors / condensers (Containing PCB/PCT) Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height External electrical cables and cords Gas Discharge Lamps Plastics containing Brominated Flame Retardants weighing > 25 grams (not including PCBs or PCAs already listed as a separate item above) Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner
0 1 0 0 0 0 0 0
Include the cartridges, print heads, tubes, vent chambers, and service stations.
EL-MF877-00 Template Revision B PSG instructions for this template are available at EL-MF877-01
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Components and waste containing asbestos Components, parts and materials containing refractory ceramic fibers Components, parts and materials containing radioactive substances
2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Tool Size (if applicable) Automatic screw driver Automatic screw driver Description #3 Description #4 Description #5 3.0 Product Disassembly Process 3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment: 1. 2. 3. 4. 5. 6. 7. 8. 9. Remove the Battery,and loosen screws on logic lower. Get HDD, ODD and memory. Remove KB,Pull out connecter. Remove C cover Pull out the DC IN cable, HDD connecter,ODD connecter,and USB Board cable,Remove Speaker cable from MB. Loosen screw on WLAN and remove antenna. Remove the MB,take down the thermal module and the CPU. Remove LCD module, tear down LCD Cover. Remove panel and camera Philip #1 T8
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).
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WEEE Disassembly Work Instructs
Tabulator: Nathan Ho
Work Instructs
Document Name :Disassembly WI Subject : Get Battery & Big Door Step : 1 Date : 2012-02-14
Step: Take off the batter and the system door.

Tool Description Automatic screw driver Tool Size Tool Description Automatic screw driver Tool Size T8
Philip #1
Point for attention: If finding some defects, notice the gaffer and assess.
Page
Work Instructs
Document No. :Disassembly WI Subject : Get WLAN card and memory Step : 2 Date : 2012-02-14
Step: 1. Loosen screws on WLAN card, WWAN card and modem. 2. Pull out the Memory card and RTC battery.
Tool Description Automatic screw driver
Tool Size Philip #1
Tool Size T8
Page
Work Instructs
Document No. :Disassembly WI Subject : Remove thermal module and HDD Step : 3 Date : 2012-02-14
Step: 1. Loosen screws in the back of system, and the thermal fan. 2. Remove HDD, ODD and thermal fan.
Tool Size Philip #1
Tool Size T8
Page
Work Instructs
Document No. :Disassembly WI Subject : Disassemble hinges Step : 4 Date : 2012-02-14
Step: Loosen screws on back of system.
Tool Size Philip #1
Tool Size T8
Page
Work Instructs
Document No. :Disassembly WI Subject : Disassemble keyboard Step : 5 Date : 2012-02-14
Step: Remove the keyboard, and then loosen all the screws under the keyboard.
Tool Size Philip #1
Tool Size T8
Page
Work Instructs
Document No. :Disassembly WI Subject : Disassemble LOWER_CASE Step : 6 Date : 2012-02-14
Step: Disassemble LOWER CASE.
Tool Size Philip #1
Tool Size T8
Page
Work Instructs
Document No. :Disassembly WI Subject : Disassemble MB Step : 7 Date : 2012-02-14
Step: 1. Loosen screws on M/B. 2. Take off thermal module.
Tool Size Philip #1
Tool Size T8
Page
Work Instructs
Document No. :Disassembly WI Subject : Disassemble MB Step : 8 Date : 2012-02-14
Step: 1. Remove CPU.
Tool Size Philip #1
Tool Size T8
Page
10
Work Instructs
Document No. :Disassembly WI Subject : Disassemble function board Step : 9 Date : 2012-02-14
Step: 1. Loosen five screws on hinges. 2. Divided LCD module and LOWER_CASE into two parts.
Tool Size Philip #1
Tool Size T8
Page
11
Work Instructs
Document No. :Disassembly WI Subject : Disassemble KB_DECK Step : 10 Date : 2012-02-14
Step: 1. Loosen four screws on the hinges cover. 2. Disassemble KB_DECK.
Tool Size Philip #1
Tool Size T8
Page
12
Work Instructs
Document No. :Disassembly WI Subject : Disassemble LCD module Step : 11 Date : 2012-02-14
Step: 1. Loosen two screws on LCD lower corner. 2. Take away the hinge covers. 3. Disassemble LCD Bezel.
Tool Description Automatic screw driver Tool Size Philip #1 Tool Description Automatic screw driver Tool Size T8
Page
13
Work Instructs
Step: 1. Loosen four screws on hinges. 2. Disassemble LCD and Display A cover.
Tool Description Automatic screw driver Tool Size Philip #1 Tool Description Automatic screw driver Tool Size T8
Page
14
Work Instructs
Step: 1. Loosen six screws on LCD and disassemble Hinges.
Tool Size Philip #1
Tool Size T8
Page
15
Work Instructs
Step: Take down LVDS Cable and camera module.
Tool Size Philip #1
Tool Size T8
Page
16

HP ProBook 6570b Disassembly Instructions

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Product End-of-Life Disassembly Instructions

WEEE Disassembly Work Instructs

Step: Take off the batter and the system door.

WEEE Disassembly Work Instructs

Tool Description Automatic screw driver

Tool Size Philip #1

Tool Description Automatic screw driver

WEEE Disassembly Work Instructs

Tool Description Automatic screw driver

Tool Size Philip #1

Tool Description Automatic screw driver

WEEE Disassembly Work Instructs

Step: Loosen screws on back of system.

Tool Description Automatic screw driver

Tool Size Philip #1

Tool Description Automatic screw driver

WEEE Disassembly Work Instructs

Tool Description Automatic screw driver

Tool Size Philip #1

Tool Description Automatic screw driver

WEEE Disassembly Work Instructs

Step: Disassemble LOWER CASE.

Tool Description Automatic screw driver

Tool Size Philip #1

Tool Description Automatic screw driver

WEEE Disassembly Work Instructs

Step: 1. Loosen screws on M/B. 2. Take off thermal module.

Tool Description Automatic screw driver

Tool Size Philip #1

Tool Description Automatic screw driver

WEEE Disassembly Work Instructs

Step: 1. Remove CPU.

Tool Description Automatic screw driver

Tool Size Philip #1

Tool Description Automatic screw driver

WEEE Disassembly Work Instructs

Tool Description Automatic screw driver

Tool Size Philip #1

Tool Description Automatic screw driver

WEEE Disassembly Work Instructs

Step: 1. Loosen four screws on the hinges cover. 2. Disassemble KB_DECK.

Tool Description Automatic screw driver

Tool Size Philip #1

Tool Description Automatic screw driver

WEEE Disassembly Work Instructs

WEEE Disassembly Work Instructs

WEEE Disassembly Work Instructs

Step: 1. Loosen six screws on LCD and disassemble Hinges.

Tool Description Automatic screw driver

Tool Size Philip #1

Tool Description Automatic screw driver

WEEE Disassembly Work Instructs

Step: Take down LVDS Cable and camera module.

Tool Description Automatic screw driver

Tool Size Philip #1

Tool Description Automatic screw driver

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