Professional Documents
Culture Documents
Passive Components
Active Components
Social Events
WSJ: MEMs in Our World: RF and Analog/Mixed-signal Circuits and Architectures WSK: Tutorial on Doherty Power Amplifier Circuits and Design Methodologies (Cont. in PM) WSL: RFIC VCO Design WSN: Signal Generation, Amplification, Detection and System Implementation at THz Frequencies (Cont. in PM) WSO: Holistic Approach to Transceiver Architectures and Technologies to Femto/Pico Cell based Communication Systems (Cont. in PM) SC-2: Demystifying Device Characterization An Interactive Course for Transistor Characterization through Behavioral and Compact Modeling and Load Pull (Cont. in PM) SC-4: Co-Design of On-Chip Antennas and RF circuits for System-on-Chip Applications
Monday
RFIC Panel Session: Cellular vs. WiFi: Future Convergence or an Utter Divergence?
Registration: 0700-1900 RFIC AM Technical Sessions: 0800-0940: RMO1A, RMO1C, RMO1D; 1010-1150: RMO2A, RMO2B, RMO2C, RMO2D; RFIC PM Technical Sessions: 1330-1510: RMO3A, RMO3B, RMO3C; 1540-1720: RMO4A, RMO4C, RMO4D IMS Plenary: 1730-1900
1600 - 1720
Women in Microwaves Reception: 1800-1930 This would be a great time to: Visit the IMS2013 Exhibition Attend a MicroApps Session Visit the Student Paper Competition Interactive Forum Ham Radio: 1830-2130
Special Presentation: How to Write a Paper for IEEE MTT-S Journals and Navigate the Review Process
TU3B: Frequency Domain Sensors TU3C: Advances in Carbon Nanostructures for RF Applications TU3D: Methodologies for Advanced Industrial Microwave Heating TU3E: Advanced Power Amplifier Linearization Techniques TU3F: Nonlinear Device Modeling TU3G: Novel 3D Tunable Filters TU3H: HF, VHF and UHF Power Amplifiers and Applications
MTT-S Graduates of the Last Decade (GOLD) and Student Reception): 1900-2130
RFIC Interactive Forum: 1330-1700 Registration: 0700-1800 AM RFIC Technical Sessions: 0800-0940: RTU1B, RTU1C; 1010-1150: RTU2A, RTU2B, RTU2C, RTU2D Exhibition: 0900-1700 MicroApps: 0900-1700 IMS Student Paper Competition and IMS Student Design Competition: 1330-1600
WE1A: mm-Wave MMIC Power Amplifiers WE1B: Planar Multi-Band Filters and Multiplexers WE1C: SPECIAL SESSION: Advances in RF/Microwave Technologies for Reconfigurable 4G Front-Ends WE1D: Advances in Frequency Domain Methods for Microwave Engineering WE1E: Recent Developments in Medical Imaging WE1F: Recent Advances in Integrated Millimeter-Wave Technology WE1G: FOCUS SESSION: Silicon Broadband Millimeter-Wave Integrated Circuits for High-Speed Communication Systems WE1H: Silicon Based Integrated Oscillators
WE2A: GaN High Efficiency Power Amplifiers WE2B: Advanced Planar Tunable Filters WE2C: E-band and Broadband Amplifiers WE2D: Advances in CAD Algorithms and Techniques WE2E: Advanced Concepts in Biomedical Radars WE2F: Advances in Semiconductor Components at Sub THz WE2G: mmWave and THz Interconnects and Transitions WE2H: Advances in Low Phase Noise Signal Generation Techniques
IMS Panel Session: Dominant PA Architectures for Tomorrows High Speed Cellular Networks
WE3A: High Efficiency Power Amplifiers for Wireless Applications WE3B: Wideband and Ultra-Wideband Planar Filters WE3C: Advances in Millimeter Wave and Microwave Components WE3D: Nonlinear Circuit Analysis and System Simulation WE3E: Microwave Spectroscopy and Sensing at the Cellular Level WE3F: Silicon Based Millimeter-Wave Devices and Circuits WE3G: Architectures for Energy Harvesting and Wireless Powering Transmission WE3H: RF MEMS Switches and Switched Circuits
WE4A: FOCUS SESSION: GaN Devices for Commercial Space: Trends and Developments WE4B: Ferrite Technology and Devices WE4C: Innovative Developments in Reconfigurable Systems WE4D: Advanced Finite-Difference Time-Domain Techniques WE4E: RF and Microwave Biomedical Devices and Systems WE4F: Novel Packaging Interconnects WE4G: Advances in RF Energy Scavenging WE4H: Microwave Photonic Devices and Systems
Wednesday
IMS Interactive Forum: 1330-1600 Registration: 0700-1800 Wireless Industry Day: 0800-1700 Exhibition: 0900-1800 MicroApps: 0900-1700
TH1A: Power Amplifier Devices and Circuit Techniques TH1B: FOCUS SESSION: Advances in Graphene RF and THz Nanoelectronics TH1C: Advanced Concepts in Communication Receivers and Millimeterwave Radars TH1D: Novel Circuits and Techniques for Signal Processing up to GHz Frequencies TH1E: Terahertz System Characterization and Measurement TH1F: Advances in Passive Circuit Elements TH1G: Novel RF Circuit and Component Technologies TH1H: New Applications for Periodic Structures
TH2A: Advances in Low Noise Amplifiers and Receivers TH2B: Novel Planar Filter Techniques and Technologies TH2C: Advances in RFID Technologies TH2D: Measurements Supporting Active Device Modeling TH2E: Advanced MMICs for THz Applications TH2F: Advances In Transmission-Line Elements and Structures TH2G: Advances in Linear Component Modeling TH2H: FOCUS SESSION: Realizing Stable Non-Foster Circuits and their Application
TH3A: Efficiency Enhancement Techniques for Single and Multi-Mode Power Amplifiers TH3B: Non-Planar Filters TH3C: Active and Passive Integrated Apertures for Phased-Array Antennas and Power Combiners TH3D: Innovative Measurements Across the Spectrum (RF to THz) TH3E: Emerging Integrated Circuit Technologies for Millimeter-wave and THz Applications TH3F: Transmission-Line Metamaterial Elements and Applications TH3G: Advances in RF and Inkjet Printed Circuit Technologies TH3H: Frequency Conversion Techniques
IMS Interactive Forum: 1330-1600 Registration: 0700-1600 Exhibition: 0900-1500 MicroApps: 0900-1500 IMS Closing Ceremony: 1600-1730 ARFTG NVNA Users Forum: 1600-1730 WFA: Multi-Octave High Efficiency, High Linearity High Power (Cont. in PM) WFB: SSPAs vs. Vacuum Tube Amplifiers: An Update (Cont. in PM) WFC: Microwave Sensors and Biochips for Biomolecules and Cells Characterization (Cont. in PM) WFE: RFICs/MMICs and Their Professional Wireless Sensing Applications (Cont. in PM) WFF: Recent Advances on RF/Microwave Multi-Function Filtering Devices (Cont. in PM) WFH: Designing High-Efficiency Microwave Switch-Mode Amplifiers beyond 2 GHz (Cont. in PM) WFI: RF-on-Demand for the Internet of Things (Cont. in PM) WFJ: Microwave Systems for Security Applications (Cont. in PM) WFK: Satcom and Aerospace Beyond Ka-Band: Progress and Challenges (Cont. in PM)
SC-9: The Dynamics, Bifurcation, and Practical Stability Analysis/Design of Nonlinear Microwave Circuits and Networks (Cont. in PM) SC-10: Procedures and Techniques for Characterizing High-Power Devices using Vector Network Analyzers SC-11: Sub-picosecond Jitter Fractional Frequency Synthesizer Design (Cont. in PM) SC-12: Graphene RF Electronics: Modeling and Applications
WFA: Multi-Octave High Efficiency, High Linearity High Power (Cont. from AM) WFB: SSPAs vs. Vacuum Tube Amplifiers: An Update (Cont. from AM) WFC: Microwave Sensors and Biochips for Biomolecules and Cells Characterization (Cont. from AM) WFE: RFICs/MMICs and Their Professional Wireless Sensing Applications (Cont. from AM) WFF: Recent Advances on RF/Microwave Multi-Function Filtering Devices (Cont. from AM) WFH: Designing High-Efficiency Microwave Switch-Mode Amplifiers beyond 2 GHz (Cont. from AM) WFI: RF-on-Demand for the Internet of Things (Cont. from AM) WFJ: Microwave Systems for Security Applications (Cont. from AM) WFK: Satcom and Aerospace Beyond Ka-Band: Progress and Challenges (Cont. from AM) WFL: Magnetoelectrics: An Emerging Technology for a New Class of RF and Microwave Control Components SC-9: The Dynamics, Bifurcation, and Practical Stability Analysis/Design of Nonlinear Microwave Circuits and Networks (Cont. from AM)
SC-11: Sub-picosecond Jitter Fractional Frequency Synthesizer Design (Cont. from AM) ARFTG Exhibition and Interactive Forum: 0700-1700 Registration: 0700-0900 ARFTG AM Sessions: 0800-1200 ARFTG PM Sessions: 1330-1700
7 June 2013
Friday
6 June 2013
Thursday
5 June 2013
4 June 2013
Tuesday
3 June 2013
2 June 2013
Sunday
WSG: Radio Frequency Systems for Indoor Localization (Cont. in PM) WSH: Self-Healing Mixed-Signal Circuitry: Built-in Calibration and Compensation Techniques (Cont. in PM)
Table of Contents
Core Materials:
General Chair Welcome. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3 About Seattle & Transportation. . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5 Microwave Week Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-7 Mobile Apps & Social Media. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 First Time Exhibitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Sponsors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 MicroApps. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 On-Site Registration. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-13 Guest Lounge & Social Program. . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Companion Tour Program. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-20 IEEE & MTT-S Membership. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21-22 IMS Steering Committee . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 IMS2013 TPRC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 2013 IEEE Fellows . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 2013 IEEE MTT-S Awards. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 2013 IEEE MTT-S ADCOM & TCCs. . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Tuesday:
At a Glance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Getting Around. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 IMS AM Technical Sessions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55-66 IMS/RIC Panel Session. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 Special Session on Paper Writing. . . . . . . . . . . . . . . . . . . . . . . . . . 67 Student Activities. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68-69 IMS PM Technical Sessions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70-75 RFIC AM Technical Sessions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 RFIC Interactive Forum. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 Mobile Apps & Social Media Reminder. . . . . . . . . . . . . . . . . . . . . 78 Tuesday Night Events . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
Wednesday:
At a Glance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 Getting Around. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82 IMS AM Technical Sessions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83-94 IMS Panel Session. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95 IMS Interactive Forum. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96-99 IMS PM Technical Sessions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100-110 Wireless Industry Day. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111 Wednesday Night Events. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
Sunday:
At a Glance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Getting Around. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Workshops . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31-35 Short Courses. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36-37 RFIC Plenary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38-39 Sunday Night Events. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Thursday:
At a Glance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113 Getting Around. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 114 IMS AM Technical Sessions . . . . . . . . . . . . . . . . . . . . . . . . . . . 115-126 IMS Panel Session. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127 IMS Interactive Forum. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128-131 IMS PM Technical Sessions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132-137 IMS Closing Ceremony. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138-139 Thursday Night Events. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140
Monday:
At a Glance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Getting Around. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Workshops . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43-45 Short Courses. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45-47 RFIC AM Technical Sessions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 RFIC Panel Session. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49 RFIC PM Technical Sessions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 IMS Plenary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 Monday Night Events . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Friday:
At a Glance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141 Getting Around. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142 Workshops . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143-147 Short Courses. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 148-149 ARFTG. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150 IMS2014 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
IMS2 013 hosts the wor lds lar g est exhibition dedicated to R F and Micr owave technolog y.
Howard Frisk
Welcome to Seattle
General Chair Welcome
On behalf of the IMS2013 Steering Committee, it is my privilege to welcome you to Seattle! Thank you for joining us for Microwave Week. It has been eleven years since IMS was held in Seattle, and so much has changed. The city of Seattle has grown and its character continues to evolve. You will find it even more active, more vibrant and fun than it was in 2002. The Northwest Microwave community has evolved as well, with major industry contributors in RFID, Avionics, Semiconductors, and Test and Measurement. In addition, our local companies have had a great part in expanding the scope and capability of our global wireless imprint. We can now create and communicate almost anywhere in the world as a result of the collective work of IMS attendees, presenters and exhibitors. The Pacific Northwest has participated in the most recent wireless revolution in a very significant way. Local companies based in Seattle, Portland and Vancouver, BC, have been at the forefront of key advancements such as the implementation of LTE, and the development of semiconductors that have enabled new technology. You will witness significant participation by the Northwest community in the Plenary and Closing Sessions, in the Historical Exhibit and on the Exhibition floor.
Exhibition
IMS2013 hosts the worlds largest exhibition dedicated to RF and Microwave technology. Visiting the exhibition is a great opportunity to get to know your suppliers and their products. Even better, spend some time in a more relaxed setting at the Industry Hosted Cocktail Reception held on the exhibition floor at 1700 on Wednesday night. Centrally located on the exhibit floor you will find the MicroApps Theater (Booth 1443). These commercial presentations will focus on product and service advances with relevance to the exhibitors in attendance. We encourage you to stop by and enjoy presentations on groundbreaking products that may suit your current or future needs.
haeuser, Costco, Starbucks, Jones Soda, Eddie Bauer, Car Toys, R.E.I., and Alaska Airlines. Visitors enjoy the Seattle area for its natural beauty and outdoor activities, diverse dining (try the seafood!) and shopping and world-class arts, such as the Pacific Northwest Ballet, Seattle Opera, numerous theatres, and music performances at Benaroya Hall. Seattle is also known for a vigorous live music scene. Some of the famous acts from the area are Alice in Chains, Foo Fighters, Heart, Kenny G, Jimi Hendrix, Mudhoney, Nirvana, Pearl Jam, Queensryche, Sir Mix-A-Lot, and Soundgarden. The Experience Music Project, designed by architect Frank Geary and disguised as a colorful, smashed guitar, thrills locals and visitors sharing the excitement that is Seattles music.
Howard Frisk
Location
With 620,778 residents estimated in 2011, Seattle is the largest city in the Pacific Northwest region of North America. The entire Seattle metropolitan area has over 3.5 million inhabitants, making it the 15th largest metropolitan area in the United States. In June, average temperatures range from 70 F to the low 50s F. Although famous for its rain, Seattle in June receives less than 1-1/2 of precipitation so some light sprinkles could be in the forecast. The Seattle International Airport, called Sea-Tac (SEA) is Washington States international airport and closest to the convention center. All major U.S. and international carriers fly into Sea-Tac. The airport is 13 miles from downtown Seattle. The drive to downtown will take 20-30 minutes, depending on traffic. A trip to downtown Seattle from the airport on public transportation takes 30-40 minutes. The Downtown Airporter provides service from Sea-Tac to many of Seattles finer hotels. Other options including shared-van rides on Shuttle Express, taxis and limousine service are also available. Average cab fare from the airport downtown is $40US, not including tips. An elevated train service, Link Light Rail can whisk you to downtown Seattle in about 35 minutes, 7 days a week. At about $2.50 a ride, it is the best deal to travel between Seattle and Sea-Tac. For visitors who decide to rent a car, hotels will charge about $20/day for parking.
Getting around
When visiting an environmentally sound city, public transportation is often the easiest and most rewarding way to get around. King County Metro can get visitors from Sea-Tac Airport to downtown in a short train ride; city buses, many of which are electric, move people around all points in the city; and theres even a monorail that ferries folks to and from Seattle Center. Metro buses travel to nearly every corner of Seattle. They are easy to ride and offer an affordable and greener way to get around. For bus schedules and information, visit metro.kingcounty.gov, which provides bus schedules and regional trip planning. Or call (206) 553-3000, 24 hours a day. King County Water Taxi Water taxi service across Seattles Elliott Bay between Pier 50 at the foot of Yesler Way on the downtown Seattle waterfront and Seacrest dock in West Seattle. The crossing time between Pier 50 and Seacrest is approximately 10 minutes. One-way passage is $3.50. Operation is seasonal. Sound Transit Regional service is available through Sound Transits programs: ST Express Bus, Sounder Commuter Rail and Tacoma Link. Visit www.soundtransit.org for more information. Central Link Light Rail New Link light rail trains now offer service from downtown Seattle to the Seattle-Tacoma International Airport, with eleven stops in between. Round-trip tickets from Sea-Tac International Airport to downtowns Westlake station cost $5. Visit www.soundtransit.org for updates. Seattle Center Monorail The Seattle Center Monorail zips passengers between downtown Seattle and Seattle Center in about two minutes. Departures are every 10 minutes from two stations: Seattle Center station (across from the Space Needle) and Westlake Center Mall station (Fifth and Pine sts.). Tickets are $2 each way. Hours: SundayThursday, 0830 - 2030; FridaySaturday, 0830 2300. Streetcar The South Lake Union Streetcar is the first in a planned streetcar network. It travels from downtowns Westlake Center to Fairview and Campus Dr. in the South Lake Union neighborhood, with 11 stops along the way. It runs seven days a week at 15-minute intervals during the following hours: Monday Thursday, 0600 1700; FridaySaturday, 0600 2300; Sunday, 1000 1900 Fares are $2.50. For more information, go to www. seattlestreetcar.org.
Cyber Caf:
Sponsored by: The Cyber Caf located in the North Lobby is provided for internet related activities.
RFIC Symposium
RFIC Symposium Highlights: 2 Plenary Presentations Neville Ray T-Mobile Barrie Gilbert ADI Plenary Reception 89 Oral presentations in four sessions 14 Interactive forum posters 13 RFIC sponsored workshops 2 Joint IMS-RFIC sponsored workshops Breakfast, lunch, and AM/PM coffee breaks
Abstracts: http://www.rfic-ieee.org/docs/RFIC_2013_PROGRAM_BOOK.pdf
General Chair Jacques C. Rudell Univ of Washington Technical Program Co-Chairs Lawrence Kushner BAE Systems Bertan Bakkaloglu ASU
Conference Co-Chairs Leonard Hayden Teledyne LeCroy Brett Grossman Intel Technical Program Co-Chairs Dave Blackham Agilent Tech. Joe Gering RFMD NVNA Users Forum Organizers Patrick Roblin Ohio State Univ. Dominique Schreurs KU Leuven
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Exhibition Hours:
Tuesday 4 June Wednesday 5 June Thursday 6 June 0900 to 1700 0900 to 1800 0900 to 1500
3D Glass Solutions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2808 Accel-RF Instruments Corp.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2703 AIM Specialty Materials. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1510 AIR-VAC Engineering Co. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2723 AMTI Microwave Circuits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2725 Anteral . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1743 Atlanta Micro, Inc.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1723 Bell Electronics NW, Inc.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1737 BJG Electronics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .141 Chengdu Filter Technology Co., Ltd.. . . . . . . . . . . . . . . . . . . . . 1516 Chengdu Kelai Microwave Sci & Tech Co.. . . . . . . . . . . . . . . . . 1843 Chengdu Yaguang Microwave Technologies . . . . . . . . . . . . . 1525 Compugraphics-Photomasks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 1943 Custom Systems Integration-CSI. . . . . . . . . . . . . . . . . . . . . . . . . 1336 CyberRadio Solutions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1514 Delcross Technologies. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113 Delta-Sigma Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2246 DFINE Technology Co., Ltd.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1838 Diamond Microwave Devices Limited. . . . . . . . . . . . . . . . . . . . 1836 Digital Signal Technology, Inc.. . . . . . . . . . . . . . . . . . . . . . . . . . . . 123 Dynatronix, Inc.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1534 ECHO Microwave Co., Ltd.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2705 Edge Consulting and Sales . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1508 Erzia Technologies, S.L.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2057 General Metal Finishing, a unit of PEP. . . . . . . . . . . . . . . . . . . . . 134 Grinding and Dicing Services Inc.. . . . . . . . . . . . . . . . . . . . . . . . 1736 GS Instrument Co., Ltd.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2729 HYPERLABS, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1506 Indiana Integrated Circuits, Inc.. . . . . . . . . . . . . . . . . . . . . . . . . . 2049 JITAI Technology Co., Ltd.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1512 KMW Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132 MAST Technologies. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2324 METALLIFE, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1515 Metamagnetics, Inc.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1540 Namiki Precision Singapore PTE. Ltd.. . . . . . . . . . . . . . . . . . . . . 1608 Nanjing Guangshun Network Comm. Equipment . . . . . . . . 1543 Nano Materials International Corp.. . . . . . . . . . . . . . . . . . . . . . 2822 Northwest EMC Inc.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1607 Ohmega Technologies Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2804 Orbel Corp.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1604
Pico Technology North America Inc. . . . . . . . . . . . . . . . . . . . . . 1502 PILKOR CND Co., Ltd.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1507 Premix Oy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1635 Printech Circuit Laboratories Ltd.. . . . . . . . . . . . . . . . . . . . . . . . 1511 Putnam RF Components, Inc.. . . . . . . . . . . . . . . . . . . . . . . . . . . . 2248 Qioptiq. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1734 Quonset Microwave. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2249 Red Rapids. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2707 Reldan Metals Co. Div. of AR Metals, LLC . . . . . . . . . . . . . . . . . 2154 RF Micropower. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1744 RF Techniques . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130 Rflight Communication Electronic Co.,Ltd. . . . . . . . . . . . . . . . . 138 RK Technologies LLC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1539 Schleuniger, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1837 Shenzhen Superlink Connector Co.,Ltd.. . . . . . . . . . . . . . . . . . 1620 SHF Communication Technologies AG. . . . . . . . . . . . . . . . . . . 1509 Sichuan Keenlion Microwave Tech. Co., Ltd. . . . . . . . . . . . . . . 2806 SignalCore Inc.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 244 Silex Microsystems. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1528 Spectratime . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2802 Spectrum Magnetics, LLC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2610 Test Equipment Plus, Inc.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2826 Ticer Technologies. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 246 Uyemura-USA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145 Varioprint AG. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2827 VIMA Co., Ltd.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1834 Waka Manufacturing Co.,Ltd.. . . . . . . . . . . . . . . . . . . . . . . . . . . . 2150 Wave-Tech Inc.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1523 Western Rubber & Supply, Inc.. . . . . . . . . . . . . . . . . . . . . . . . . . . 2251 Woven Electronics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125 Xpeedic Technology, Inc.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1536 Zik, Inc.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2706 ZTEC Instruments. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2250
IMS2013
PLATINUM/GOLD/SILVER - SPONSORS
Platinum
Gold
Silver
mEDIA
MEDIA PARTNERs:
MEDIA SPONSORS:
MEDIA AFFILIATES:
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MICROAPPS
Sponsored BY:
TUESDAY
0910 0930 Importance of Probe Geometry Control at THz Frequencies Anthony Lord, Cascade Microtech Enhanced Ruggedness LDMOS devices now available for Land Mobile Applications, with a Compact 75W Design Dayong Wang and Paul Scsavnicki, Freescale Semiconductor Simulating Envelope Tracking Andy Howard, Agilent Technologies Breaking the RF Carrier Barrier: 0 to 200 in Under a Second Rulon VanDyke, Agilent Technologies AMCAD MHV The Next Generation of Behavioral Modeling Tony Gasseling, AMCAD Engineering HFSS: Hybrid IE Solvers for Efficient Simulation of Complex Systems David Edgar, ANSYS, Inc. EM Simulation Tools in Evolution within Circuit Design Dr. John Dunn, AWR Corporation Design Methodology for GaAs MMIC PA Dustin Hoekstra and Jim Carroll, AWR Corporation Frequency Planning Synthesis for Wireless Systems Design Joel Kirshman, AWR Corporation Efficient Full-wave Simulation of PCB Devices Using Predefined Building Blocks Models M. Jemai, A. B. Kouki, and A. Khebir, ElectromagneticWorks, Inc Planar Lowpass Filter Design Flow Brian Avenell, National Instruments Antenna Design for Varying Environmental Conditions Using Remcoms XF7 James F. Stack, Remcom, Inc. RF Detector Drift vs. Temperature, Time and Frequency Eamon Nash, Analog Devices Rapid Simulation of Large Phased Array T/R Module Networks David Leiss and Rulon VanDyke, Agilent Technologies How to Make Your Designs More Robust Jack D. Sifri, Agilent Technologies Nuances in Creation of Pulsed Waveforms Richard Overdorf, Agilent Technologies Low Noise Amplifier Design, a Multidimensional Balancing Act Tim Das, Freescale Semiconductor Understanding the Relationship Between Noise Figure, IP3, and Error Vector Magnitude Justin Magers, National Instruments Analysis of On-Body Antenna Optimized for Hearing Instrument Applications Joseph J. Rokita, Remcom, Inc. Determining Circuit Material Dielectric Constant from Phase Measurements John Coonrod, Rogers Corporation Advances in Load Pull Simulation Andy Howard, Agilent Technologies Creating and Analyzing Multi-Emitter Environment Test Signals with COTS Equipment Greg Jue, Agilent Technologies Making Precision RF/MW Cable and Antenna Test in the Field Rolland Zhang, Agilent Technologies
WEDNESDAY
Real-Time, Triggering, & Signal Capture for Agile and Elusive Signals Benjamin Zarlingo, Agilent Technologies Power Added Efficiency (PAE) Analysis with 8990B Peak Power Analyzer Hock Eng Lim, Agilent Technologies THz Frequency System for Material Characterization at High Magnetic Field and Cryogenic Temperatures Scott Yano, Lake Shore Cryotonics High Speed Active Load Pull for Production Testing Mauro Marchetti, Anteverta Microwave Measuring AM-AM and AM-PM with Modulated Signals David Hall, National Instruments A Simplified Amplifier Design Flow From Modeling to Load Pull Validation and Stability Analysis Steve Dudkiewicz, Maury Microwave KEYNOTE: Modern RF Measurements and How They Drive Spectrum Analyzer Digital IF Processor Design Dr. Gordon Strachan , Agilent Technologies
THURSDAY
Multi-Chip RF Module Assembly Jack D. Sifri, Agilent Technologies STAN TOOL, From Stability Analysis to the Stabilization of Multi-Transistor Circuits Stphane Dellier , AMCAD Engineering Bi-directional Coupled Full-Wave EM to Thermal Stress Simulation Arien Sligar, ANSYS, Inc. A New Software Tool for the Analysis and Synthesis of Slot-Array Waveguide Antennas Carlos Gahete Arias, Aurora Software and Testing SL MwTs High Linearity and High Power MMIC Family for Commercial Wireless Applications Kohei Fujii, Microwave Technology, Inc. NXP Introduces an Innovative MMIC Family Xavier Moronval, NXP Semiconductors Alternative Methods and Optimization Techniques for Vector Modulation John Hansen, Agilent Technologies Best Practices for Increasing Frontend Converter Input Bandwidth: Modeling, Layout and Measurement Jarrett Liner, Analog Devices 76.5GHz Imaging Radar for Detecting Strong Reflection from the Rear of an Automobile Traveling Ahead Hirosuke Suzuki, KEYCOM Corporation Optimizing Chip-Module-Board Transitions Using Integrated EM and Circuit Design Simulation Software Dr. John Dunn, AWR Corporation
0950
1010
1030
1050
1110 1130
1150
1210
Environment Simulation for Counter-IED Jammer Test Walter Schulte, Agilent Technologies The Importance of Pulsing for ISO Thermal Modeling Tony Gasseling, AMCAD Engineering Performing PA Servo on an FPGA, Benefits and Limitations Haydn Nelson, National Instruments Maximizing 3rd Order Intermodulation Measurements Nikhil Ayer, National Instruments USB Based Modules Displace Traditional Bench Instrumentation for Fundamental RF Measurements Paul Clark, Telemakus LLC Interfacing PLL/VCOs to IQ Modulators, IQ Demodulators and Mixers Ian Collins, Analog Devices High-Efficiency GaAs pHEMT Balanced Amplifier for WLAN Jeffrey Ho, Freescale Semiconductor HFSS with HPC for Large Finite Antenna Array Design David Edgar, ANSYS, Inc. Parallel Processing Options for EM Simulation Dr. John Dunn, AWR Corporation Designing an ETSI E-Band Circuit for a MM Wave Wireless System Dr. Michael Heimlich and Dustin Hoekstra, AWR Corporation Class F Power Amplifier Design, Including System-to-Circuit-to-EM Simulation Mark Saffian, AWR Corporation Mixed RF-Digital Framework for Power Amplifier Digital Predistortion Takao Inoue, National Instruments Optimization as a Design Tool in Remcoms XF7 James F. Stack, Remcom, Inc. KEYNOTE: thereal Waves Make History The four scientists who saved James Clerk Maxwells theories Dr. James C. Rautio, Sonnet Software
Design and Simulation of Phased Arrays in VSS Gent Paparisto, AWR Corporation Integrated Electro-Thermal Design of a SiGe PA Dr. Michael Heimlich and Mark Saffian, AWR Corporation Optimizing Mixed Signal Systems Stephen Dark, National Instruments Optimizing On-Wafer Noise Figure Measurements to 67 GHz David Ballo, Agilent Technologies Understanding Probability of Intercept for Intermittent Signals Richard Overdorf, Agilent Technologies Wideband Modulated Impedance Control for LTE Amplifier Characterization Mauro Marchetti, Anteverta Microwave Interconnects Are Now Color-Coded Rusty Myers, Maury Microwave
1610
1630 1700
Category Legend
Active Devices
CAD / Simulation
Design
Keynotes
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Symposia
Microwave Week includes the IMS technical program, and exhibit, as well as the RFIC Symposium (www.rfic2012.org), and ARFTG Conference (www. arftg.org). Select the conference(s) you wish to attend. RFIC Technical Sessions are held on Monday and Tuesday. Registration includes admission to the RFIC Reception, the exhibition, and the electronic proceedings. IMS Technical Sessions are held on Tuesdays, Wednesday, and Thursday. Registration includes admission to the exhibition and the electronic proceedings. **Note: Single Day registration does NOT include the electronic proceedings. These can be added for an additional fee. ARFTG Technical Sessions are held on Friday. Registration includes breakfast, lunch, electron proceedings, joint IMS/ ARFTG sessions on Thursday, and admission to the ARFTG Exhibition. ARFTG Conference member rates are available to both ARFTG and IEEE Members.
Microwave Week hosts the largest exhibition of its kind with over 400 companies. Exhibit only registration is available.
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ON-SITE REGISTRATION
Sponsored By: On-Site registration for all Microwave Week events will be available at the Washington State Convention Center, South Lobby. Registration hours are: Day Saturday, 1 June Sunday, 2 June Monday, 3 June Tuesday, 4 June Wednesday, 5 June Thursday, 6 June Friday, 7 June Time 1400 1800 0700 1900 0700 1900 0700 1800 0700 1800 0700 1600 0700 0900
IMS IMS Sessions IMS Sessions - Student, Retiree, Life Member IMS Single Day Registration RFIC Symposium RFIC Sessions RFIC Sessions - Student, Retiree, Life Member ARFTG Conference ARFTG Sessions ARFTG Sessions - Student, Retiree, Life Member Colocated Event Wireless Industry Day Wednesday Only Wireless Industry Day Wednesday Only for Student, Retiree, Life Member ARFTG Sessions Exhibition Only Exhibition Only Pass Guest Registration Guest Badge (requires technical conference registration) Extra Proceedings and Digests IMS Electronic Proceedings RFIC Digest RFIC Electronic Proceedings ARFTG Electronic Proceedings Evening Events RFIC Reception Only (Sun. Night) Awards Banquet (Wed. Night) Thursday Night Event Workshops Full Day Full Day Student/Retiree Half Day Half Day Student/Retiree Full Day Short Courses Full Day Short Courses Student/Retiree Half Day Short Course Half Day Short Course Student/Retiree Two Full Day Workshops includes All Workshop DVD Two Full Day Workshops includes All Workshop DVD Student/Retiree Printed Workshop Notes (while supplies last) Printed Workshop Notes Student/Retiree (while supplies last) $50 $75 $55 $225 $155 $115 $80 $390 $270 $270 $190 $595 $405 $30 $30 $70 $75 $55 $335 N/A $170 N/A $585 N/A $405 N/A $880 N/A $45 N/A $40 $70 $70 $70 $70 $40 $105 $105 $105 $105 $30 $30 $225 $155 $295 N/A $280 $200 $290 $195 $415 N/A $435 N/A $575 $100 $290 $850 $165 $435
Registration Fees
On-site registration fees are as follows:
Member SuperPass IMS, RFIC, and ARFTG Sessions and Electronic Proceedings, Awards Banquet, Full Day (or 2 Half Day) Workshop Attendance and All Workshop USBs SuperPass - Student, Retiree, Life Member $1345 $2000 Non-Member
$840
N/A
Exhibit-Only Registration
Exhibit-only registration is available.
Press Registration
Credentialed press representatives are welcome to register without cost, receiving access to IMS technical sessions and exhibits. Digests are not included. The Press Lounge will be available from Tuesday thru Thursday of Microwave Week and it located on Level Four, North Lobby of the Washington State Convention Center.
ARFTG Registration
Late on-site registration will be available at the Washington State Convention Center, South Lobby on Friday from 0700 0900. If at all possible, please pre-register earlier in the week.
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The Guest Lounge is located at the Sheraton Hotel on the Lobby Level in the Diamond Room. It is a place to relax and meet. The Guest Lounge also has suggestions and discount coupons for various activities to enjoy while in Seattle, as well as, fun games and crafts for the families. Guest registration is required and fees do apply. Open: Sunday, 2 June - Thursday, 6 June, 0700-1630 and Friday, 7 June, 0700-1200.
Guest Lounge
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Monday, 3 June
remier 3-Hour City Tour ($49)0945- 1300 P Includes: Tours Northwest coach and guided tour
This Premier 3-hour City Tour is designed to give you a fantastic overview of Seattle. Sit back and relax in the spacious Tours Northwest coach as our knowledgeable and friendly guide acquaints us with some of Seattles most interesting neighborhoods and attractions. Sights are numerous and include Pike Place Market, the Seattle waterfront, CenturyLink Field and Safeco Field stadiums, Mercer Island via the floating bridge, the International District, the Fremont neighborhood with its famous Troll, and Seattles not-to-be-missed landmark Space Needle. Along this 50-mile tour well make a stop at historic Pioneer Square, which marks Seattles original downtown, and also at the Ballard Locks, which provide a passage for boats going between the salt water of the Puget Sound and the fresh water of the Ship Canal. Near the end of our tour well have a great city skyline photo opportunity.
Visitor s enjoy the Seattle ar ea for its natur al beauty and out door activities, diver se dining and shopping... and wor ld-class ar ts.
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Tuesday, 4 June
Pike Place Market Tasting Tour ($45) First tour: 0845 - 1130 | Second tour: 0915 - 1200 Includes: Guided tour and tasting tour
Become a Pike Place Market insider on our 2-hour, behind-the-scenes adventure. Experience the sights, sounds, and flavors of this 105-year-old landmark while seeing fish fly, cheese being made, and visiting the original Starbucks. Bring your appetite because well be treated to at least sixteen tasty samples including crab cakes, chowder, and cheese. Well be given an insiders look at ten of the Market vendors and hear entertaining stories of the Markets rich history and culture. After our guided tour, you might want to extend your visit and shop among the many craft vendors selling locally-made jewelry, clothing, and gifts.
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Wednesday, 5 June
Space Needle and Chihuly Garden and Glass ($40)1000 1500 Includes: Monorail, Space Needle, and Chihuly Garden and Glass tickets On todays outing well be whisked through downtown Seattle via monorail to Seattle Center, home of the iconic Space Needle built for the 1962 Worlds Fair. Well ride the elevator up to the observation deck and take in 360 degrees of awesome views of the city and Puget Sound. Lunch will be on our own at a choice of onsite restaurants. Then well tour the beautiful Chihuly Glass and Garden, opened just last year, and learn why Seattle is so renowned for its art glass. And, well have ample time for the gift shops before our return trip by monorail to downtown Seattle.
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Thursday, 6 June
The Future of Flight Aviation Center and Boeing Tour ($59)0745 - 1200 Includes: Tours Northwest coach, guided tour The Future of Flight Aviation Center and Boeing Tour offers the only opportunity to tour a commercial jet assembly plant in North America. Well travel by Tours Northwest coach to the Future of Flight Aviation Center located in Mukilteo, Washington, 25 miles north of Seattle. Youll be able to explore the interactive exhibits and displays and will even have the opportunity to design and virtually test your own jet. Then, after a short video presentation, well go behind the scenes at nearby Boeings Everett, Washington facility for a fascinating 90-minute tour of the worlds largest building by volume (472,000,000 cubic feet). Home to the 747, 767, 777, and 787 Dreamliner production lines, you will see airplanes in various stages of construction being built for their worldwide base of airline customers. And, who knows? You might be flying on one of these very planes some day! Please note restrictions on Boeing website (http://www.boeing.com/commercial/tours/index.html) before signing up.
SNOQUALMIE FALLS AND WINE TASTING TOUR ($92)0915- 1530Includes: Tours Northwest coach, lunch, and wine tastings Todays tour begins with a drive to one of Washingtons most popular scenic attractions, Snoqualmie Falls. From the observation deck well be able to view the spectacular falls cascading through a rocky gorge to a pool 270 feet below. While there, well also enjoy a peek in at the Salish Lodge & Spa, a quintessential Pacific Northwest retreat. Then its on to lunch at Purple Caf in Woodinville, a restaurant that combines classic American styles with seasonal Northwest ingredients. After lunch well tour Chateau Ste. Michelle, Washingtons oldest and most acclaimed winery, gracefully situated in beautiful park-like grounds. Your wine knowledge will be enhanced as you learn about their heritage, get an exclusive glimpse at winemaking, and pause to sample their wines. And, youll love perusing their lovely gift shop. Well end our day with a contrasting experience by making a visit to the contemporary Novelty Hill + Januik Winery. Here, two independent wineries share a tasting room and the talents of Mike Januik, their acclaimed winemaker. Note: This tour is for those aged 21 and older.
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Social Events and Program (THursday, 6 June cont.) Thursday Night Event
YOUR TILLICUM VILLAGE ADVENTURE ($55) 1800 - 2230 (departs from Pier 55)
The IMS2013 will also be offeringSeattles Premier Native Cultural Experience and Home of the Famous Salmon Bake at Tillicum Village! Begin your 4-hour escape with a narrated cruise from downtown Seattle, Pier 55 to Blake Island State Park. Upon arrival to Tillicum Village, you are greeted with steamed clams in nectar. Make your way into the longhouse and watch as whole salmon are cooked in a traditional Northwest Coast Indian style. Enjoy a fabulous salmon buffet meal followed by a show that highlights the Coast Salish tribes through storytelling and symbolism. Afterward, youll have free time to explore the grounds and gift shop before returning to Seattle. About Blake IslandBlake Island is located 8 miles from Seattles Central Waterfront and accessible only by private or charter boat, via Argosy Cruises. The island was named after Captain George Blake, commander of the US Coast Survey vessel in 1837. Blake Island State Park was an ancestral campground of the Suquamish and Duwamish Indian Tribes and is believed to be the birthplace of Chief Seattle. The island is densely wooded with many forested walking and hiking trails and 5 miles of beaches. Vegetation on the island includes native Northwest trees and shrubs. Wildlife on the island includes deer, chipmunks, otters, squirrels, mink and many types of birds.
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Friday, 7 June
Mount Rainier Tour ($98)0700 - 1800 Includes: Tours Northwest coach, park admission
Be sure to bring your camera on this full-day tour of beautiful Mount Rainier National Park. You will delight in its vast expanses of pristine old-growth evergreen forests, magnificent rivers, mountain lakes, thundering waterfalls, and wildlife. Mount Rainier, which ascends to 14,411 feet above sea level, stands as an icon in the Washington landscape. Youll appreciate the beauty of this stunning mountain up close, and youll be able to see the glaciers radiating from its summit. There is an informative Visitor Center with panoramic views and a movie presentation on the park and its history. Snack and gift shops can be found at the Visitor Center and the beautiful Paradise Inn. Comfortable walking shoes and layered clothing are advised. Lunch is on your own.
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IEEE has:
more than 400,000 members in more than 160 countries; more than 50 percent of whom are from outside the United States; more than 107,000 student members; 333 sections in 10 geographic regions worldwide; 2 ,110 chapters that unite local members with similar technical interests; 2 ,173 student branches at colleges and universities in 80 countries; 5 85 student branch chapters of IEEE technical societies; and 4 04 affinity groups - IEEE Affinity Groups are nontechnical sub-units of one or more Sections or a Council. The Affinity Group patent entities are the IEEE-USA Consultants Network, Graduates of the Last Decade (GOLD), Women in Engineering (WIE) and Life Members (LM).
IEEE:
h as 38 societies and 7 technical councils representing the wide range of IEEE technical interests; h as more than three million documents in the IEEE Xplore Digital Library with more than eight million downloads each month; h as more than 1,500 standards and projects under development; p ublishes more than 148 transactions, journals and magazines; s ponsors more than 1,300 conferences in 81 countries while: p artnering with more than 1,100 non-IEEE entities globally; attracting more than 387,000 conference attendees; and publishing more than 1,300 conference proceedings via IEEE Xplore.
MTT-S:
The IEEE Microwave Theory and Techniques Society (MTT-S) provides its 11,000+ members with access to leading technical information in radiofrequency, microwave, guided wave and wireless technologies, for wireless, sensing, digital, medical, and integrated smart and phased array antenna systems. Members receive access to the award-winning Microwave Magazine, discounts on registration for society conferences, including the International Microwave Symposium, networking opportunities, career development tools, and many other exclusive benefits. Field of Interest (abridged): RF, microwave, guided wave and wireless technologies, for wireless, sensing, digital, medical, and integrated smart and phased array antenna systems.
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*Half year rates apply to new members only. 1This amount represents base dues plus IEEE-USA assessment. In the United States, depending on region, an additional regional assessment is added that ranges from US$1 to US$5.2 Except in Japan, where full year dues are US$169 and US$84.50 half year.
All dues pricing is listed in US Dollars. IEEE membership runs from 1 January through 31 December. N EW applications received between 16 August 2012 and 28 February 2013 will automatically be processed at the full year dues rates. Services begin immediately. N EW applications received between 1 March and 15 August 2013 will automatically be processed for half-year membership ending 31 December 2013 at the half-year dues rates. Exception is when the applicant specifically requests their application be processed for the full year. However, we cannot guarantee availability of back issues of all publications for the first half of the calendar year. The e-Membership option is only available to higher grade members in developing nations. M embership in IEEE Technical Societies involves additional dues. See the table above for information on Society membership dues. A ll IEEE members are given online access to Potentials magazine as part of their basic IEEE membership. Student members in the U.S. and Canada receive Potentials in print as part of their dues. For Student members from all other countries and for IEEE Higher grade members who wish to receive a print subscription to Potentials, see rates provided below.
MTT-S dues include a subscription to IEEE Microwave Magazine. MTT-S members can also purchase subscriptions to the IEEE Transactions on Microwave Theory and Technology, IEEE Microwave and Wireless Components Letter, IEEE Transactions on Terahertz Science and Technology, IEEE/OSA Journal of Lightwave Technology, and IEEE MTT CD-Rom Collection. See IEEE Membership website for pricing.
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EXECUTIVE COMMITTEE
Tom Raschko General Chair Paul Ferguson Operations Chair Leonard Hayden Technical Program Chair, ARFTG Liaison Dennis Lewis Local Arrangements Chair Janet ONeil Publicity & Publications Chair Donn Harvey Advisor Amanda Scacchitti Administration, Publication Management Bob Alongi Finance Eric Downs Finance Advisor Eric Shoshea Finance Chair Susie Horn Exhibit Management Lee Wood Exhibit Management Elsie Cabrera Conference Management
OPERATIONS COMMITTEE
Paul Ferguson Zaher Bardai Sander Lam Zhimin Li Tim Mintzer Julio Navarro Ryan Pang Marc Pos Chris Rudell Operations Chair International Liaison (Visa Letters) University Booths University Booths Historical Exhibit Student Volunteers Registration RFIC Liaison
George Heiter
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IEEE Fellows
The member grade of fellow is conferred in recognition of unusual and outstanding professional distinction. It is awarded at the initiative of the IEEE Board of Directors following a rigorous nomination and evaluation process. Individuals receiving this distinction have demonstrated extraordinary contributions to one or more fields of electrical engineering, or related sciences. The total number of Fellows selected in any one year does not exceed one tenth of one percent of the total voting Institute membership. Ten MTT-S members who were evaluated by our Society were elevated to the grade of Fellow, effective 1 January 2013. The new IEEE Fellows are: Charles Campbell Robert Caverly Kevin Kobayashi Sanjay Raman Mauro Mongiardo Wolfgang Boesch Kate Remley Mark Russell Guglielmi Marco Arthur Morris for contributions to microwave and millimeter-wave integrated circuits for contributions to modeling and design of radio frequency switching devices for contributions to monolithic microwave integrated circuits (MMIC) for leadership in adaptive microwave and millimeter-wave integrated circuits for contributions to the modal analysis of complex electromagnetic structures for technical leadership in microwave active devices and circuits for contributions to calibration and measurement of wireless communication systems for leadership in the development and fielding of RF/microwave systems for national security and defense for contributions to multimode equivalent network representations and microwave filter design for development and commercialization of CMOS radio frequency micro electro mechanical systems
MTT-S members who were evaluated by another IEEE Society are shown below; the other society is shown in parentheses.
Dennis Sullivan (AP) Naiping Nie (AP) Kwok Chan (AP) John Schneider (AP) Ulrich Jakobus (AP) Hiroyuki Arai (AP) Ramachandra Achar (CAS) Takatomo Enoki (EDS) Tzong-Lin Wu (EMC) for contributions to time-domain electromagnetic simulation for leadership in engineering and education in electromagnetics for development of planar lens beamforming networks and broadband antennas for contributions to the finite-difference time-domain method in computational electromagnetics for leadership in hybrid computational tool development and commercialization for contributions to the design and analysis of low profile antennas for mobile communications for contributions to interconnect and signal integrity analysis in high-speed designs or contributions to compound semiconductor high speed integrated circuits for optical and f wireless communication systems or contributions to noise mitigation technologies and electromagnetic compatibility design on f printed circuit boards
Wen-Yan Yin (EMC) for contributions to multi-physics solutions for intentional electromagnetic interference and nanostructure electromagnetic compatibility Peter Pupalaikis (IM) David Perreault (PEL) Haruhiko Tsuchiya (PHO) Ali Niknejad (SSC) for contributions to high-speed waveform digitizing instruments for contributions to design and application of very high frequency power electronic converters for contributions to single-mode optical fiber transmission for contributions to millimeter-wave radio frequency systems
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Pioneer Award:
Recognizes a major, lasting contribution in the field of interest of MTT-S, published in an archival journal, at least 20 years prior to the year of the award, by an individual or team of up to three (3). This years recipient is Sander Weinreb.
In recognition of pioneering contributions and the publication of an efficient method for computer aided noise analysis of linear amplifier networks
Microwave Prize:
This award recognizes on an annual basis the most significant contribution by a published paper within the MTT-Ss field of interest. Papers under consideration are those published during the calendar year preceding the Fall meeting of the AdCom. This years recipients are Sherif Sayed Ahmed, Andreas Schiessl, and Lorenz-Peter Schmidt, for their paper A Novel Fully Electronic Active Real-Time Imager Based on a Planar Multistatic Sparse Array, IEEE Microwave Theory Tech., vol. 59, pp. 35673576, December 2011
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Daniel Pasquet
Gregory Lyons
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