Lead-Free Basics

January 2005

Content from this presentation is taken in part from Kesters full-day presentation (~250 slides) Lead-Free Seminar series presented at various sites across North America.

Lead-Free Solder Overview

Legislative Update Lead-Free Solder Alloys Kesters Position on Alloys Kesters Recommended Lead-Free Material Set

Why Do Solders Contain for Electronics Contain Lead?

Lead reduces the melting point of tin Tin 232 C Lead 327 C Sn63/Pb37 183 C Sn62/Pb36/Ag02 179-189 C Lead forms a solid solution with tin Lead increases the strength of tin Lead improves the ductility of tin Lead provides thermal cycling fatigue resistance

However

Lead has been targeted for elimination by many countries due to health threats associated with use and disposal Lead has already been eliminated in the US in products such as fuel, paint, etc. Lead is listed as a hazardous material by the US Environmental Protection Agency The electronics assembly industry is next on the lead elimination list.

European Legislation

In 1998, called for a ban on lead in all electronics by 1/1/2004. In 2001, the European Union released legislation called Waste from Electrical Equipment Directive (WEEE) the original legislation was dropped a new draft was issued with a recommendation to eliminate lead from electronics by July 1, 2006. Lead-free limit 0.1 % by weight. Individual (homogeneous) constituent of the final assembly and product. Agreed by Europe and Asia

RoHS Directives

A ban on hazardous materials effective July 1, 2006

Banned materials include Lead, Cadmium, Mercury, Hexavalent Chromium, PBB, PDBE

This directive makes lead-free a requirement for products on sale to European Consumers after this date.

Asian Legislation

Japan: JEIDA Roadmap for Commercialization of Lead-Free 2000: Pb-Free Components and Wave Soldering 2001: Expand Pb-Free components, Pb-Free in new products 2002: General use of lead-free in new products 2003: Lead-free in all new products 2006: Complete phase-put of leaded solder in all products

Asian Legislation

China Ministry of Industry is following European RoHS and WEEE guidelines in document called Management Methods, published March 2004 Also targeting elimination for July 1, 2006

North American Legislation

Lead is permitted in solder for electronics, however, American Industry was asked by the U.S. EPA to reduce the use of hazardous materials Lead is always on the target list Increasing pressures to be lead-fee occurring from offshore users. Will be greater in 2006

World Agreement

Industry adoption of 0.1wt% as maximum allowable Pb in lead-free products

Every individual homogeneous material must be <0.1% for the product to be considered lead-free

Agreement of EU WEEE (Waste Electrical and Electronic Equipment) Agreement of RoHS (Restriction of Hazardous Substances in Waste Electrical and Electronic Equipment) Directive.

Requirements for Lead Alternative Alloys

Low Cost Relatively non-hazardous Capable of forming reliable joints Relatively low temperature process compatible Corrosion resistant Compatible with copper substrates, gold over nickel, and a variety of non-lead substrates as well as some leaded substrates. Alloys must be available in Bar, Wire and Paste forms

Requirements for Lead Alternative Alloys

No Potential Environmental Problems

Bi<Zn<In<Sn<Cu<Sb<Ag<Pb

Available in sufficient quantities Low Melting Temperatures (Below 240 C) Good Electrical Conductivity Good Thermal Conductivity Easy Reparability Adequate Strength Properties Good Thermal Cycling Fatigue Resistance

Lead-Free Solder Alloys

Potential Alloys with High Percentage of Tin

Silver (Ag) Bismuth (Bi) Antimony (Sb) Copper (Cu) Zinc (Zn) Indium (In) Magnesium (Mg)

0.1 to 5.0% 1.0 to 5.0% 0.2 to 5.0% 0.2 to 2.0% 0.5 to 9.0% 0.5 to 20.0% 0.5 to 2.0%

Common Alloys Being Used & Evaluated

Sn96.5 Ag3.0 Cu0.5 (~217 C) IPC alloy Sn95.5 Ag3.8 Cu0.7 (~217 C) Sn99.3 Cu0.7 (227 C) Sn96.5 Ag3.5 (221 C) Sn95 Sb5 (232-240 C) Sn97 Cu2.0 Sb0.8 Ag0.2 (226-228C) Sn91.8 Ag3.4 Bi4.8 (202-215 C) Sn42 Bi58 (138 C)

Physical Properties of Lead-Free Alloys

High Tin Content Alloys like Sn90+:

Typically have much higher melting points traditional Sn63Pb37 Are stronger and less ductile than leadbearing alloys. Typically exhibit poorer wetting and surface condition when compared to Sn63Pb37

Sn/Ag/Cu System

Sn96.5 Ag3.0 Cu0.5 = IPC SPVC alloy

MP of 217-220 C, no patent issues

Sn95.5 Ag3.9 Cu0.6 = NEMI alloy

MP of 217-224 C, at least 1 patent Other Sn / Ag / Cu variations: Sn95.6 Ag3.5 Cu 0.9 Eutectic point (MP = 217 C, 2 patents) Sn95.5 Ag3.8 Cu 0.7 European alloy (MP = 217221 C, 1 patent)

MP of the SnAgCu system is ~217 C

Kesters Position on Lead-Free

Kester is ready to make just about any lead-free solder alloy, including licensed alloys that have been patented by other organizations. IPC Solder Product Value Council has named Sn96.5Ag3.0Cu0.5 as primary lead-free alloy for wave, SMT and rework. Kester supports this alloy as the industry standard.

Kesters Recommendations for Lead-Free Process

Surface Mount Soldering

Alloys:

Sn96.5 Ag3.0 Cu0.5 (preferred) Sn96.5 Ag3.5 No-Clean EM907 Water Soluble - R520A

Fluxes:

Kesters Recommendations for Lead-Free Process

Wave Soldering Operations (Nitrogen)

Alloys:

Sn96.5 Ag3.0 Cu0.5 Sn99.3 Cu0.7 No-Clean VOC Free 979 No-Clean 959T Water Soluble VOC Free 2220-VF Rosin Mild Activation- 186

Fluxes

Triangular for a Reason

Product differentiation

Solder Products Differentiation

Material control Easily identifiable Increases awareness Simplifies training Avoids costly errors Insures reliability

Kesters Recommendations for Lead-Free Processes

Hand Soldering Operations

Alloys:

Sn96.5 Ag3.0 Cu0.5 Sn96.5 Ag3.5 Sn99.3 Cu0.7 No-Clean: 275 Water Soluble: 331 Rosin: 48

Fluxes

Kesters Recommendations for Lead-Free Processes

Ball Attach Applications

Fluxes

No-Clean: TSF-6592 Water Soluble: TSF-6850

For a full description of Kesters lead-free offerings, please visit www.kester.com or call Technical Services at (800) 2-KESTER