AGC AG ELECTRONIC MATERIALS. CURE CeCe iry Boro-silicate Glass Wafers for MEMS Anodic Bonding Anodic bonding is a very popular tool for MEMS Devices. Many of MEMS devices use glass covers for protecting silicon structure, The glass wafer and silicon device are typically anodic bonded between 400°C to 600°C and 400V -1000V. Borosilicate glass, such as Pyrex, is commonly use in this process However, the coefficient thermal expansion (CTE) of Pyrex glass is not equivalent to silicon across the product temperature range, thus causing CTE mismatch issues that can damage or reduce the device functionality. Asahi Glass has one again developed the ideal material solution for the MEMS manufacturer. The SW Series glass wafers provide outstanding CTE matching and higher strain tempertures to expand the MEMS processing window. Additionally, our newest SW-YY glass wafers can be bonded at lower temperature or voltage condition, with the best match of CTE compared to silicon. Material Properties: Type HX unt sw sw sw Pyrex Thermal Properties Expansion Coeficent x 207/C 36 3 3 3 Strain Pont as 0 80 10 Annealing Point < 680 65 60 60 Softening Pine « 330 385 350 20 Thermal Conductivity W/mK 12 1 a 2 Mechanical Properties Density 26 ase 246 aa Youngs Modulus or 0 78 es “ Shear Modulus ra % 3 % a Poisons Ratio ons 018 o2 020 Vike’ Hardness cna 6a 6a 58 60 Foearal Strength MPa s70 s70 s70 950 optical Properties Refractive Index 1.520 1519 asi nar Electrical Properties Log Volume Resistivity @Q-em 106 107 103 ns Log Volume Resistivity Q-em 23 23 18 94 Dieter Constant 6a 60 63 46 Loss Tangent oo: aot 01 aot Chemical Properties Ac Durability sgjen? 0a 0.16 0.09 01 Alkali Durability mg/m? 0.09 O17 0.16 0.14 Water Durability sng/en? 0.5 0.07 0.05 0.06 [AG Electranie Materials + 4375 NW 235 Avenue + Hillsboro, OR 87324 USA AGE 503.844 2610 phone «503.844.7207 fax « wamuagerrasacom,AGC AG ELECTRONIC MATERIALS. CURE CeCe iry Thermal Expansion Properties ‘Asahi Glass SW Series wafers provide a significant improvement over Pyrex glass in the coefficient of thermal expansion (CTE) match to silicon across temperature ranges. This outstanding CTE match makes our SW Series wafers an ideal material sous n for MEMS manufacturers. ‘ecomalted txpansan Carve ‘once of Thermal Epaton ener) sue) Bonding Condition Asai Glass SW-YY grade bonds with silicon in low temperatures and low voltage. —————» Available Specifications: Wafers: ‘75mm to 150mm diameter Thickness: 0.3mm to 5.0mm Flatness(Warp): <1Oum (4"), <30ym (6") Roughness: Ra <10nm Tv: Total Thickness Variation <10nm Surface Finish: Both sides polished ‘Ag Fectronic Matera Flats or Notches: Available per SEMI Standards Act 4875 NW 25 Aer soe, OR 97326 503.864, 3610 phone» 503.846.7207 fax Machining: Holes and/or cavities can be provided Coatings: Pt, Cr, Au, Ni or Ti sputtered or Stl hats nna cad Ne tb a deposited are available Pp Se pti cea