You are on page 1of 33

IT Perfectly Basic Relations ,M Reflecting Wall Frequency en to at T h l Angular Frequency =2 Inside the Cavity C a Wavelength EM Wave In g Wavevector magnitude

de k=2/ nk=(k ,k ,k )rm Equilibrium at a he n Wavevector Temperature T k G /T io s c r = Dispersion + k (linear) t = lar e(k): ck = c k relation+ k gh t So nv ri c o py ire How much energy in the cavity? C o C D Ur=gy hf (,T ) = e 2 97 97 L = 92 ,..., n , 92 ,... l En dk dk dk 2.2 2 2r 2. ca 2 hf ( , T ) (2 / 2 L ) (2 / 2 L ) (2 / 2 L ) k =n o ri 2L F ct dk dk dk e =2 l polarization (2 / L ) (2 / L )hf ( , T ) (2 / L ) Two E
x y z

Thermal Radiaton: Plancks Law

2 x

2 y

2 z

n x =1 n y =1 n z =1 x

WARREN M. ROHSENOW HEAT AND MASS TRANSFER LABORATORY, MIT

2V U= 3 8
3

IT Energy density per interval hf ( , T )dk dk dk ,M u ( ) = hf ( , T )D( ) o en t 2V h l = h C 1 hf ( , T )4k dk 8 a Plancks law = c ng expekhrm1 2V a h T n = hf ( , T )4 c d c G Intensity: energy flux per unit 8 /T sio U ar er t olsolid angle = hf ( , T ) d V c gh t S dA v cu( ) h ri c on I ( ) = 4 = 4 c 1 y e = hf ( , T )D( )d p C h o ir exp y k T 1 C D rg = u ( )d97 97 Ene Solid Angle Per unit wavelength interval .9 2.9 al dA I ( )d 4ch 1 2 r d = I ( ) = = R d 2hc o tric D()-density of states per exp F perc k T 1
whole space unit volume unit Plancks law le 4 angular frequency interval E
x y z 2

Thermal Radiaton: Plancks Law

2 3

2 3

3 2

p 2

WARREN M. ROHSENOW HEAT AND MASS TRANSFER LABORATORY, MIT

IT & Q Wiens displacement law M n, o he l t T = 2898 Km C a ng erm a h G /T ion Emissive Power t olar ers gh t S nv & Q( ) = AI ( ) ri c o py ire C 1o h =A y 4 c C h D erg exp k T 1 7 97 .99 En .9 2 al 2 r Total o)d = AT ic tr & F & Q = Q( ec El
max

Thermal Radiaton: Plancks Law

10

EMISSIVE POWER (W/cm m)


2

10

10

5600 K

2 2

2800 K

10

1500 K

10

800 K

10

-1

4 6 WAVELENGTH (m)

10

WARREN M. ROHSENOW HEAT AND MASS TRANSFER LABORATORY, MIT

IT ,M Introduction to Thermoelectricity en to h l C a Gang Chen ng erm a h G /T ion Mechanical Engineering Department rs t olar Technology Massachusetts Institute of gh t S nve ri c o py ire C o y CURL: http://web.mit.edu/nanoengineering D erg 97 .997 En .9 2 al 2 r o tric F c le E
WARREN M. ROHSENOW HEAT AND MASS TRANSFER LABORATORY, MIT ROHSENOW MIT

IT Hot, M en to h l C a ng1 erm a Conductor h G /T ion Conductor 2 t olar ers gh t S nv ri c o py ire C o Cold C D rg y 97 .997 Ene Voltage .9 2 al 2 r Seebeck effect: Discovered in 1821 o tric Thomas Johann Seebeck F c Temperature difference generates voltage 1770-1831 e El
http://www.sil.si.edu/silpublications/dibner-library-lectures/scientific-discoveries/text-lecture.htm

Seebeck Effect

WARREN M. ROHSENOW HEAT AND MASS TRANSFER LABORATORY, MIT

IT ,M Heatingn Cooling or he l to C a ng erm a h G /T ion ar t Conductor 1 ers Conductor 2 h Sol v rig ct on y e C op ir C D rg y A 97 .997 Ene .9 Athanaseal Jean Charles 2 Peltier 2 r 1785-1845 Peltier Effect: Discovered in 1834 o tric An electrical current creates a cooling or F c heating effect at the junction depending le E
on the direction of current flow.
WARREN M. ROHSENOW HEAT AND MASS TRANSFER LABORATORY, MIT

Peltier Effect

IT ,M heat release/absorption q(x) en to h l C a T T ng rm a he current G /T ion t olar ers gh t Thomsonnv predicted, 1855 ri c S o effect py ire C o C D rg y William 7 Thomson 7 ne (Lord 9 Kelvin)99 .9 2 al E 1824 1907 . 2 r o tric F c le E
cold hot
http://www.sil.si.edu/silpublications/dibner-library-lectures/scientific-discoveries/text-lecture.htm

Thomson Effect

WARREN M. ROHSENOW HEAT AND MASS TRANSFER LABORATORY, MIT

An Intuitive Picture of Thermoelectric Effects

IT Current Flow in an Isothermal , M Conductor en to h l C a ng erm a h G /T ion Electrical Field [V/m] t olar ers gh t S nv ri= enc = eno= = / Electrical [m] Current Density J e Resistivity py ire v C o y CElectron g D erDrift Electron 7 Density [1/mn Velocity [m/s] Mobility Electrical [1/m] Charge [C] [m /s.V] Conductivity 9 .997 E ] 9 2 2. r al icJ q = qnv = q J e = J e Heat Flux tr Fo c eHeat Per Charge [J] e Peltier Coefficient [J/A] El

3 2

WARREN M. ROHSENOW HEAT AND MASS TRANSFER LABORATORY, MIT

IT ,M J,J n 1 he l to C aQ Q ng erm a h 2 G /T ion , t olar J eJrs gh t S nv ri c o py Qr(Peltier) = ( 12)J o ie yC C D rg 97 Heating and cooling at junctions 97 Ene .9 2.9 al 2 r o Reversible with current direction ric F ct le E
e q1 e q2
WARREN M. ROHSENOW HEAT AND MASS TRANSFER LABORATORY, MIT

Peltier Effect

IT Built-In Potential ,M en to h l aV g C V m n T a her n T G /T io ar t Gradient ers h Sol v g Temp. ri ct on y e op ir underC temperature gradient Charge diffusion ya C potential resisting diffusion g 7 Built-in 7 D er 99 2.99 l En 2. r S = ca = -(Vhot-Vcold)/(Thot-Tcold) i-V/T Fo ctr le S --- Seebeck Coefficient E
cold hot cold hot
WARREN M. ROHSENOW HEAT AND MASS TRANSFER LABORATORY, MIT

Seebeck Effect

IT ,M heat release/absorption q(x) en to h l C a ng erm T a T G h n /T io t olar ers h S current v rig ct on y e C 1 dq dT op ir C Coefficientrgy = Thomson 7 D e I dx dx 97 .99 En .9 2 al 2 r o Relations: = ST; = T dS/ dT ric F c Kelvin t le E
cold hot
WARREN M. ROHSENOW HEAT AND MASS TRANSFER LABORATORY, MIT

Thomson Effect

Properties are Temperature Dependent IT

,M en t o h l C a ng erm a h G /T ion t olar ers gh t S nv ri c o py ire C o C D rg y 7 97 ne 99 2.9 l E 2. r ca o tri F c le E

Images removed due to copyright restrictions. Please see Fig. 2a,b in Poudel, Bed, et al. "High-Thermoelectric Performance of Nanostructured Bismuth Antimony Telluride Bulk Alloys." Science 320 (May 2, 2008): 634-638.

WARREN M. ROHSENOW HEAT AND MASS TRANSFER LABORATORY, MIT ROHSENOW MIT

IT ,M en to h l C a ng NermP a I h G /T ion t olar ers gh t S nv ri c o py ire C o C D rg y 97 .997 Ene .9 2 al 2 r o tric F c le E


COLD SIDE
COLD SIDE

Thermoelectric Devices

HOT SIDE

HOT SIDE

WARREN M. ROHSENOW HEAT AND MASS TRANSFER LABORATORY, MIT

IT ,M en to h l C a ng erm a h G /T ion Devices Performance of Thermoelectric t olar ers gh t S nv ri c o py ire C o C D rg y 97 .997 Ene .9 2 al 2 r o tric F c le E
WARREN M. ROHSENOW HEAT AND MASS TRANSFER LABORATORY, MIT

IT Th Fourier Law for heat conduction ,M en to h l q =gC T a k m an her n G Thermal Conductivity [W/m.K] Heat Flux [W/m ] /T sio t olar er gh t S nv heat conduction L ri Area A y One-dimensional p irec Co o C D rgy Th Tc Q= 97 .997 Ene Ak L = KT .9 2 al 2 r o tric Thermal Conductance : K = kA F c Tc le L E
2

Other Basic Relations: Heat Conduction

WARREN M. ROHSENOW HEAT AND MASS TRANSFER LABORATORY, MIT

IT Ideal Devices ,M Q T en to No Joule Heating, h l C a No Heat Conduction g n-n)erm Qc = (p a h p G /T ion n Devices: s Real r ht Joulela ver Heat Conduction g t So Heating & ri c on y e C op ir Qc= (p-n) I2R/2 - K (Th-Tc)
y T QC D erg 97 .997 Electrical Resistance Thermal Conductance 9 2 En 2. r al R = L p p + Ln n K = k A + k A o tric F c Ap An L L le E
c c h h

Device Analysis: Cooling

WARREN M. ROHSENOW HEAT AND MASS TRANSFER LABORATORY, MIT ROHSENOW MIT

IT V = IR + ( S S )(TMT ) Voltage Drop: , en to Coefficient of Performance: h C al 1 2 K TH (Sp Sn)g C er(m TC ) 2 I R n IT QC a h = = G(Sp /Sn ) I ( THi TC ) + I2R W T Q T s on t olar er T gh t S 1nv T ri =c T o + ZT Optimize Current: y e ) op ir ( T yT C 1 + ZT + 1 C D rg T = 0.5(T +
T )
7 97 ne 99 2.9 l E 2 2 2. r Sp Sn ) S p Sn ) ( ( ca o trZi = KR = Lpp L k p Ap k A
F c + n n + n n
e Ap A n L p L

n
El
Tc Qc
p n h c

Refrigerator Performance

H C

max

WARREN M. ROHSENOW HEAT AND MASS TRANSFER LABORATORY, MIT ROHSENOW MIT

IT ,M L p p L k p A p k A n n n n n KR = + + Ap L p hne l to A n CL a ng erm p p k n 1/ 2 2 a h Ln A n=
( KR )min = ( k pp + k n n ) GwhenT o lar/ rLpiAn n k p

s t o gh t S nve rni )2 c o (Sp S e p y C a single material: Z = S2 =
S2
Zmax = o ir 2 yFor k k
k k ( Cpp7+ Dn n erg ) 97 .99 En 9 2 .In a device, pn al are used: pairs 2 r c o ofrieach type of legs need to be optimized (1) Areas t F c (2) Two types of legs should have comparable properties le E
(3) Current input to the device needs to be optimized
WARREN M. ROHSENOW HEAT AND MASS TRANSFER LABORATORY, MIT ROHSENOW MIT

Figure of Merit Z

IT ,M en t o Bi2Te3-based materials ~300 Ch K al g S =48 nFactor: rm W/cm-K Power S=220 V/K a of Merit: Z=3.2x10 1/K h e on Figure T G / =10 Sm i lar rsZT=1 k=1.5 W/mK ht So ve rigx 1 t x 2on Device Leg: py 1 mm cmm C mm o ire y C 2 103 rg D e L R17 9 = A9=975 106n= 0.02 .9 2. 10al E 2 r o are ielectrically in series rc F Legsct in parallel bute l thermally E
2 5 -1 -3

Typical Number

Image by michbich at Wikipedia. WARREN M. ROHSENOW HEAT AND MASS TRANSFER LABORATORY, MIT

120 Temperature Difference (oC) 100 80 60 40 20 0

IT ,M en to h l C a ng erm a h G /T ion t olar ers gh t S nv ri c o py ire C o C D rg y Match two leg size Minimize contact 97 .997 Ene 9 2 resistance 2. r al o tric Optimize current T = 100 C F c le E
An Example
Copper blocks (Th)

Two Tc thermocouples soldered into drilled holes One Th thermocouple soldered into drilled holes

Experimental data Theoretical prediction

Ceramics plate for electrical insulation

4 6 8 10 WARREN Current (A) M. ROHSENOW HEAT AND MASS TRANSFER LABORATORY, MIT

Temperature Dependence of Properties

IT ,M en t o h l C a ng erm a h G /T ion t olar ers gh t S nv ri c o py ire C o C D rg y 7 97 ne 99 2.9 l E 2. r ca o tri F c le E

Images removed due to copyright restrictions. Please see Fig. 2a,b,d,e in Poudel, Bed, et al. "High-Thermoelectric Performance of Nanostructured Bismuth Antimony Telluride Bulk Alloys." Science 320 (May 2, 2008): 634-638.

WARREN M. ROHSENOW HEAT AND MASS TRANSFER LABORATORY, MIT

IT ,M en to h l O d dT g C dTa 2 dS m JT e k dx n dT rdx + J = 0 a h 2 dx G /T ion t olar ers gh t S nv ri c Usually Neglected Joule Heating Thomson py ire Effect, Co o y C Boundary Conditions (Cooling): D erg 97 .997 En .9 2 x=0: T given or q = k dT + J = k dT + ST J
2 r L al c c dx dx ic Fo ctr e x El
c
WARREN M. ROHSENOW HEAT AND MASS TRANSFER LABORATORY, MIT

Differential Analysis

IT 0.6 0.6 0.6


,M Efficiency
en to h l 0.5 0.5 0.5
C a T 1 + ZT 1
=
1
ng erm T a h
1 + ZT
+
T 0.4 G /T ion T t olar ers T +T T
=
gh t0.3S nv ri c 2
py ire 0.2 Co TPV o Constant Properties C D rg y 97 .997 Ene 0.1 .9 2 al T E M E E T IC HR OLCR IC 2 r PO E GE E A O S W RG N R T R o tric 0 1 2 3 4 5 6 F c T M R T R R TIO(T /T ) E PE A U E A le E
POWER GENERATION EFFICIENCY
EFFICIENCY
Z T 10
m

Thermoelectric Power Generation


C R O C CE ANT YL

ave

ave

4T R A
4T E M L H PO E
WR PL N A T
T 2 2

D SE PLA T IESE IE LPLA


N

ave

A K L ME A L AI T L T E M LT HR A O E E T I CE L L C RCC L S R IC

STR IN IR IN IL G G
GNR T R E E AO 1 0.5 0.5

T E MO IC HR I N IO IC GNR T R E E AO S

A T M TV UO OI E IV EG E N IN S

10 7 8 9 10

hot

cold

WARREN M. ROHSENOW HEAT AND MASS TRANSFER LABORATORY, MIT ROHSENOW MIT

IT , M CYCLE Coefficient of Performance n o CARNOT eSTIRLING h lt 5 C REFRIGERATORS 1 + ZT T / T a T COP = ng erm T T 1 + ZT + 1 a h HOUSEHOLD & G4 /T REFRIGERATORS AIR-CONDITIONERS on lar rsi THERMOELECTRIC ht So3 ve REFRIGERATORS rig ct on ZT STIRLING y e C op ir y 2 2 4 7 10 CRYOCOOLERS C D rg 1 7 97 ne 0.5 1 99 2.9 l E . 2 r ca o tri F c 0 1 1.2 1.4 1.6 1.8 2.0 le TEMPERATURE RATIO (T /T ) E
6
c ave h c h c ave

Thermoelectric Refrigeration

COEFFICIENT OF PERFORMANCE

hot

cold

WARREN M. ROHSENOW HEAT AND MASS TRANSFER LABORATORY, MIT

IT ,M en to h l C a ng erm a h G /T ion Current and Potential Applications t olar ers gh t S nv ri c o py ire C o C D rg y 97 .997 Ene .9 2 al 2 r o tric F c le E
WARREN M. ROHSENOW HEAT AND MASS TRANSFER LABORATORY, MIT

,M en t o h l C a ng erm a h G /T ion t olar ers gh t S nv ri c o py ire C o C D rg y 7 97 ne 99Generators froml Hi-Z Power . 2.9 a E 2 r o tric F c le Coolers from Marlow Industries E
Images removed due to copyright restrictions. Please see http://www.hi-z.com/index.php http://www.marlow.com/thermoelectric-modules/ WARREN M. ROHSENOW HEAT AND MASS TRANSFER LABORATORY, MIT ROHSENOW MIT

Commercial Thermoelectric Devices IT

Current Applications in Refrigeration

IT ,M en t o h l C a ng erm a h G /T ion t olar ers gh t S nv ri c o py ire C o C D rg y 7 97 ne 99 2.9 l E 2. r ca o tri F c le E


.

Images removed due to copyright restrictions. Please see: http://www.roadtrucker.com/12-volt-coolers-accessories/ 12-volt-coolers-products/igloo-40-quart-kool-mate-40-12-volt-thermo-electric-cooler-6402.jpg http://image.made-in-china.com/2f0j00kvZEKWVPgtlu/Refrigerator-BC-65A-.jpg http://www.newdavincis.com/images/wc-1682%2016%20bottles.jpg http://www.rmtltd.ru/datasheets/TO812.4MD04116xx.pdf http://www.medsystechnology.com/images/gem4000_w32a.jpg http://amerigon.com/ccs_works.php

WARREN M. ROHSENOW HEAT AND MASS TRANSFER LABORATORY, MIT ROHSENOW MIT

IT ,M en t o h l C a ng erm a h G /T ion t olar ers gh t S nv ri c o py ire C o C D r 7 97 ne 99 2.9 l E 2. r ca o tri F c le E


Images removed due to copyright restrictions. Please see: http://thermoelectrics.caltech.edu/images/mhw-rtg.gif http://globalte.com/pdf/teg_5120_spec.pdf http://www.roachman.com/thermic/thermic1.jpg

Current Applications in Power Generation

http://www.research.philips.com/newscenter/pictures/downloads/misc-sustainability_05-0_h.jpg

WARREN M. ROHSENOW HEAT AND MASS TRANSFER LABORATORY, MIT ROHSENOW MIT

System Consideration
Object being cooled Ceramic substrate TE Element

IT M

Tcold

Tobject
N

Electrical interconnect Carriers moving heat

Thot
Heat sink

Tte T Tambient

C 97 . .9 2 2 r Fo c le E Sometimes, thermal systems more expansive


DC Power source _ +
Figure by MIT OpenCourseWare.

WARREN M. ROHSENOW HEAT AND MASS TRANSFER LABORATORY, MIT ROHSENOW MIT

n, o he l t Heat Transfer Surfaces C a Hot Gas ng erm Hot Gas a h G /T ion Th,o m, Th,i t olar ers Hot h TemperatureT Side Insulation ig S onv rCold Sidet TemperatureT py irec C o C D rg y Coolant 97 .997 Ene .9 thermoelectric devices, T higher is better 2 Forr 2 cal H o trimaximum heat intercepted from hot F However, ec mcp(Th,i-TH), decreases with TH gas lstream, E
H c WARREN M. ROHSENOW HEAT AND MASS TRANSFER LABORATORY, MIT

Heat to Electricity Recovery IT from Gas Stream M

IT uses In US, transportation ,ofM energy. ~26% total en to Radiator: TE h l C a ng erm a h G /T ion Catalytic converter: TE t olar ers gh tMechanical nv ri c S o losses py ir9kJ e yC o C D rg 10kJ Driving 7 97 ne Gasoline9 6kJ Auxiliary .9 al E 100 .9 kJ 2 r2 c 35kJ i o tr30kJ 10kJ F c le E
Main AC: TE Local cooling of seats: TE

Vehicle Systems

Parasitic M. ROHSENOW HEAT AND MASS TRANSFER LABORATORY, MIT heat losses Coolant WARREN Exhaust

IT ,M en to h l C a ng erm a h G /T ion t olar ers gh t S nv ri c o py ire C o C D rg y http://cache.gawker.com/ 7 97 ne 99 2.9 l E 2. r ca o tri F c le E


Images removed due to copyright restrictions. Please see http://cdn-www.greencar.com/images/waste-exhaust-heat-generates-electricity-cars-efficient.php/bmw-teg-1.jpg http://cache.gawkerassets.com/assets/images/12/2009/03/BMW_TEG.jpg WARREN M. ROHSENOW HEAT AND MASS TRANSFER LABORATORY, MIT

Prototypes

MIT OpenCourseWare http://ocw.mit.edu

2.997 Direct Solar/Thermal to Electrical Energy Conversion Technologies


Fall 2009

For information about citing these materials or our Terms of Use, visit: http://ocw.mit.edu/terms.

You might also like