TMS320 DSP Device Nomenclature

TMS 320
PREFIX
TMX = experimental
device TMP = prototype
device TMS = qualified
device
SMJ = MIL-STD-883C
SM = High Rel (non-883C)
DEVICE FAMILY
320 = TMS320 Family

TECHNOLOGY
C = CMOS
E = CMOS EPROM
F = CMOS Flash EEPROM
LC = Low-Voltage CMOS (3.3 V)
VC = Low-Voltage CMOS [3 V (2.5
V
or 1.8 V core)]
UC= Ultra Low-Voltage CMOS [1.8 V
(1.5 V core)]

C 542 PGE

PACKAGE TYPE
N
= plastic DIP
J
= ceramic DIP
JD = ceramic DIP side-brazed
GB = ceramic PGA
FZ = ceramic CC
FN = plastic leaded CC
FD = ceramic leadless CC
PJ = 100-pin plastic EIAJ QFP
PZ = 100-pin plastic LQFP
PBK = 128-pin plastic LQFP
PQ = 132-pin plastic bumpered QFP
PGE = 144-pin plastic LQFP
GGU = 144-pin MicroStar BGA
PGF = 176-pin plastic LQFP
GGW= 176-pin MicroStar BGA

DEVICE
1x DSP: 10
14
15

16
17

2x DSP: 25
26
2xx DSP: 203
204

206
209

240

3x DSP: 30
31
32
4x DSP: 40
44

DIP = Dual-In-Line Package

PGA = Pin Grid Array
CC = Chip Carrier
QFP = Quad Flat Package
LQFP = Low Profile Quad Flat Package
BGA = Ball Grid Array

5x DSP: 50
51
52

53
56
57

54x DSP: 541

542
543

545
546
548
549

6x DSP: 6201 6201

6701 6211

5402
5410
5420