LG T385 Service Manual

Internal Use Only
Service Manual
LG-T385
Date: March, 2012 / Issue 1.0
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LGE Internal Use Only Copyright 2012 LG Electronics. Inc. All right reserved.
Only for training and service purposes
Table Of Contents
1. INTRODUCTION ................................................................... 3
1.1 Purpose ..................................................................................................... 3
1.2 Regulatory Information ...................................................................... 3
1.3 Abbreviations.......................................................................................... 5
2. PERFORMANCE .................................................................... 7
2.1 H/W Features ........................................................................................... 7
2.2 Technical Specifcation ........................................................................ 9
3. TECHNICAL BRIEF ..............................................................14
3.1 Digital Main Processor ...................................................................... 14
3.2 Power Management ......................................................................... 19
3.3 FEM with integrated Power Amplifer Module (SKY77550-
21, U101) ....................................................................................................... 33
3.4 Crystal(26 MHz, X201) ...................................................................... 35
3.5 RF Subsystem of PMB8815 (U201) .............................................. 36
3.6 MEMORY(H9DA2GH1GHMMMR, U301 ) .................................. 41
3.7 BT module ............................................................................................. 44
3.8 SIM Card Interface .............................................................................. 46
3.9 LCD Interface ........................................................................................ 47
3.10 MiniABB (Battery Charger & MUIC) Interface ....................... 50
3.11 Audio Interface ................................................................................ 51
3.12 Camera Interface(2M Fixed Focus Camera) .......................... 57
3.13 Touch Interface ................................................................................. 60
4. TROUBLE SHOOTING ........................................................62
4.1 RF Component .................................................................................... 62
4.2 RX Trouble ............................................................................................. 63
4.3 Power On Trouble ............................................................................... 68
4.4 Charging Trouble ................................................................................ 70
4.5 Vibrator Trouble .................................................................................. 72
4.6 LCD Trouble .......................................................................................... 75
4.7 Camera Trouble ................................................................................... 79
4.8 Speaker / Receiver Trouble ............................................................. 83
4.9 Earphone Trouble ............................................................................... 85
4.10 Microphone Trouble ....................................................................... 88
4.11 SIM Card Interface Trouble ........................................................... 90
4.12 Micro SD (uSD) Trouble ................................................................. 92
4.13 Bluetooth Trouble ............................................................................ 94
4.14 WiFi Trouble ........................................................................................ 96
4.15 FM Radio Trouble ............................................................................. 99
4.16 Touch trouble ..................................................................................101
4.17 Memory trouble .............................................................................103
4.18 Proximity Sensor on/of Trouble Shooting ..........................107
5. DOWNLOAD .....................................................................109
6. BLOCK DIAGRAM .............................................................122
7. CIRCUIT DIAGRAM ..........................................................123
8. BGA PIN MAP ..................................................................131
9. PCB LAYOUT .....................................................................133
10. ENGINEERING MODE ....................................................135
11. STAND ALONE TEST ......................................................136
11.1 Introduction .....................................................................................136
11.2 Setting Method ..............................................................................136
11.3 Tx Test .................................................................................................138
11.4 Rx Test .................................................................................................139
12.AUTO CALIBRATION .......................................................141
12.1 Overview ...........................................................................................141
12.2 Tachyon Directory ..........................................................................142
12.3 Test Equipment Setup ..................................................................142
12.4 Procedure ..........................................................................................142
12.5 AGC ......................................................................................................149
12.6 APC ......................................................................................................149
12.7 ADC ......................................................................................................149
12.8 Target Power ....................................................................................149
13. EXPLODED VIEW & REPLACEMENT PART LIST ..........150
13.1 EXPLODED VIEW .............................................................................150
13.2 Replacement Parts ........................................................................151
13.3 Accessory ..........................................................................................171
1. INTRODUCTION
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1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the features of
1. INTRODUCTION
This manual provides the information necessary to repair, calibration, description and download the features of
this model.
1.2 Regulatory Information
A. Security
Toll fraud the unauthorized use of telecommunications systemby an unauthorized part (for example persons Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons
other than your companys employees, agents, subcontractors, or person working on your companys behalf)
can result in substantial additional charges for your telecommunications services. System users are responsible
for the security of own system. There are may be risks of toll fraud associated with your telecommunications
system. System users are responsible for programming and configuring the equipment to prevent unauthorized
use. The manufacturer does not warrant that this product is immune from the above case but will prevent
unauthorized use of common-carrier telecommunication service of facilities accessed through or connected to
it it.
The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing
harmor interruption in service to the telephone network, it should disconnect telephone service until repair can harm or interruption in service to the telephone network, it should disconnect telephone service until repair can
be done. A telephone company may temporarily disconnect service as long as repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these changes
could reasonably be expected to affect the use of the this phone or compatibility with the network, the
telephone company is required to give advanced written notice to the user, allowing the user to take
appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized agent.
The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note
LGE nlornal Uso Onl,
e use ay ot a e a y c a ges a d/o epa s e pect as spec ca y oted t s a ua . e e o e, ote
that unauthorized alternations or repair may affect the regulatory status of the system and may void any
remaining warranty.
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1. INTRODUCTION
E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory
2. INTRODUCTION
p g g q y y g y
agencies. In accordance with these agencies, you may be required to provide information such as the following to
the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.
G. Interference and Attenuation
Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from
unsuppressed engines or electric motors may cause problems unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated
by the sign. Following information is ESD handling:
Service personnel should ground themselves by using a wrist strap when exchange system
boards.
When repairs are made to a system board, they should spread the floor with anti-static mat
which is also grounded.
Use a suitable, grounded soldering iron.
Keep sensitive parts in these protective packages until these are used.
When returning system boards or parts like EEPROM to the factory, use the protective
package as described.
1. INTRODUCTION
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1.3 Abbreviations
F th f thi l f ll i bb i ti l
1. INTRODUCTION
For the purposes of this manual, following abbreviations apply:
Bit Error Ratio BER
Baseband BB
Automatic Power Control APC
Digital Signal Processing DSP
dB relative to 1 milli watt dBm
Digital Communication System DCS
Digital to Analog Converter DAC
Constant Current Constant Voltage CC-CV
Gaussian Minimum Shift Keying GMSK
Flexible Printed Circuit Board FPCB
Electrostatic Discharge ESD
Electrical Erasable Programmable Read-Only Memory EEPROM
Digital Signal Processing DSP
Intermediate Frequency IF
International Portable User Identity IPUI
Global System for Mobile Communications GSM
General Purpose Interface Bus GPIB
y g
Off t Ph L k d L OPLL
Light Emitting Diode LED
Low Drop Output LDO
Liquid Crystal Display LCD
q y
Offset Phase Locked Loop OPLL

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1. INTRODUCTION
Power Amplifier Module PAM
1. INTRODUCTION
Public Switched Telephone Network PSTN
Phase Locked Loop PLL
Programmable Gain Amplifier PGA
Printed Circuit Board PCB
Real Time Clock RTC
Root Mean Square RMS
Receiving Loudness Rating RLR
Radio Frequency RF
Sending Loudness Rating SLR
Subscriber Identity Module SIM
Surface Acoustic Wave SAW
Real Time Clock RTC
Travel Adapter TA
Side Tone Masking Rating STMR
Pseudo SRAM PSRAM
Static Random Access Memory SRAM
Voltage Controlled Oscillator VCO
Universal Asynchronous Receiver/Transmitter UART
Time Division Multiple Access TDMA
Time Division Duplex TDD
Wireless Application Protocol WAP

Voltage Control Temperature Compensated Crystal Oscillator VCTCXO
2. PERFORMANCE
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2. PERFORMANCE
2.1 H/W Features
2. SYSTEM SPECIFICATION
Item Feature Comment
Standard Battery Lithium-Ion, 3.7V 950mAh
Stand by TIME
Up to 500 hrs : Paging Period 5, RSSI 85dBm
Talk time Up to 5hrs : GSMTx Level 7 Talk time Up to 5hrs : GSM Tx Level 7
Stand by time Up to 500 hours (Paging Period: 5, RSSI: -85 dBm)
Charging time Approx 3hours
RX Sensitivity GSM, EGSM: -109dBm, DCS: -109dBm
GSM EGSM: 32 5dBm(Level 5)
TX output power
GSM, EGSM: 32.5dBm(Level 5),
DCS , PCS: 29.5dBm(Level 0)
SIM card type 3V / 1.8V
Display MAIN : 2.8 TFT 240 320 pixel 262K Color
GPRS compatibility Class 12
Status Indicator
Send Key, End Key, Cancel Key,
Volume Up/Down Key, PWR(Lock) Key,
ANT Internal
EAR Phone Jack Yes (3.5)
PC Synchronization Yes
Speech coding EFR/FR/HR
Data and Fax Yes
Vibrator Yes
Loud Speaker Yes
Voice Recoding Yes

Microphone Yes
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2. PERFORMANCE
S k /R i 18 12S k / R i
Item Feature Comment
Travel Adapter Yes
Speaker/Receiver 18x12 Speaker/ Receiver
MIDI SW MIDI (Mono SPK)
Camera 2.0M FF
Bluetooth / FM Radio Bluetooth version 2.1 / Wired FM radio (Earphone needed)
2. PERFORMANCE
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2.2 Technical Specification
Item Description Specification
1 Frequency Band
GSM850 EGSM
TX: 824 ~ 849 MHz TX: 880 ~ 915MHz
RX: 869 ~ 894 MHz RX: 925 ~ 960 MHz
DCS
TX: 1710 ~ 1785 MHz
RX: 1805 ~ 1880 MHz
PCS
TX: 1850 ~ 1910 MHz
RX: 1930 ~ 1990 MHz
2 Phase Error
RMS < 5 degrees
Peak < 20 degrees
3 Frequency Error < 0.1 ppm
Level Power Toler. Level Power Toler.
GSM850/EGSM
6 31dBm 3dB 14 15dBm 3dB
4 Power Level
12 19dBm 3dB
DCS/PCS

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2. PERFORMANCE
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
GSM850/ EGSM
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -63
3,000~ <6,000 -65
6 000 71
5
Output RF Spectrum
(due to modulation)
6,000 -71
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
DCS/PCS
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -65
3,000~ <6,000 -65 3,000 <6,000 65
6,000 -73
6
Output RF Spectrum
(due to switching
transient)
GSM850/ EGSM
Offset from Carrier (kHz). Max. dBm
400 -19
600 21
transient)
600 -21
1,200 -21
1,800 -24
2. PERFORMANCE
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6
Output RF Spectrum
(due to switching
transient)
Offset from Carrier (kHz). Max. dBm
400 -22
600 -24
1,200 -24
DCS/PCS
,
1,800 -27
7 Spurious Emissions Conduction, Emission Status
8 Bit Error Ratio
GSM850, EGSM
BER (Class II) < 2.439% @-102 dBm
DCS,PCS
BER (Cl II) 2 439% 100 dB BER (Class II) < 2.439% @-100 dBm
9 RX Level Report Accuracy 3 dB
10 SLR 123 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 - -12
11 Sending Response
300 -12
1,000 -6
2,000 -6
3,000 -6
200 -
0
0
4
4
0
4,000 -
3,400 -9
0
4
12 RLR 43 dB
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2. PERFORMANCE
Frequency (Hz) Max (dB) Min (dB)
13 Receiving Response
300 -7
500 -5
1,000 -5
100 -
200 -
2
*
0
-12
0
g p ,
3,000 -5
4,000
3,400 -10
2
2
2
* Mean that Adopt a straight line in between 300 Hz
and 1,000 Hz to be Max. level in the range.
14 STMR > 17 dB
15 Stability Margin > 6 dB
dB to ARL (dB) Level Ratio (dB)
-35
-30
17.5
22.5
-20
-10
0
7
10
30.7
33.3
33.7
31.7
25.5
16 Distortion
17 Side Tone Distortion Three stage distortion < 10%
18
System frequency
(13 MHz) tolerance
2.5 ppm
19 32.768KHz tolerance 30 ppm
20 Ringer Volume
At least 55 dBspl under below conditions:
1. Ringer set as ringer.
2. Test distance set as 1 m
dB to ARL (dB) Level Ratio (dB)
2. PERFORMANCE
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Fast Charge : Typ 400 mA
21 Charge Current
Fast Charge : Typ. 400 mA
Slow Charge : Typ. 95mA
Total Charging Time : < 3.5 hours
Bar Number Power
7
7 > 5
Over -92
93 2
2 -> 1
4 -> 2
-104 2
-98 2
-101 2
22 Antenna Display
7 -> 5
5 -> 4
-93 2
1 -> 0 -106 2
0 -> OFF
Under -106
Battery icon color : Green Red
Battery Bar Status Percent (%)
Full (16 level)
Decrease gradually
94~10%
23 Battery Indicator
94%
10%
Battery icon color : Green Red
Empty( 0 level )
24
Low Voltage Warning
( Blinking Bar)
10%, 5% 2times (standby) Speaker
10%at every 1min. (call) - Receiver
25
Forced shut down
0%( about 3 35V)
10%
2%
25
Voltage
0%( about 3.35V)
27 Battery Type
Lithium-Ion Battery
Standard Voltage = 3.7 V
Battery full charge voltage = 4.2 V
Capacity: 950mAh
Switching mode charger
26
Sustain RTC
without battery
Over 2 hours
28 Travel Charger
Switching-mode charger
Input: 100 ~ 240V, 50/60 Hz
Output: 4.8V, 400mA
80mA
93~10%
Battery Bar Status Percent (%)
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3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
FM- radio
Digit al -
Microphone
ARM1176
RAM ROM cache
Ext ernal
Memory-IF
USI F
Measurement
I F ( A/D)
SD/ MMC SI M
GSM
TEAKLite
RF
Control
GSM
Cipher
GPTU
I S / DAI
IR - Memory
Loud -
speaker
MicSupply
generation
HSR
HSL
EPP
EPN
LSP
LSN
MICP1
MICN1
MICP2
MICN2
Mic
MUX
VMIC
VUMIC
16 Ohm
100 mW
8 Ohm
700 mW
2x 16 Ohm
2x 30 mW
Stereo
Headset
Earpiece
Charge Pump
( negative volt age for
bipolar audio out )
VMMC
VANA LPMU
VUSB
LAUX
Charge
DC/ DC
Buck
Vi brator
64 - bit bus 32 - bit bus
I F
GMSK
DAC
SD
PLL
FEM
32 kHz
XO
DSP ADC
PA
c
s
i
M
Low-
Power
DCXO
RF PMU
USB 2. 0
FS
CIF
DCC
Keypad
4k 7
0. 15 5%
1.8V ~2.5V
VCHARGE 4. 5 V 20V
2
T
A
B
V
N
E
S
N
E
S
P
E
S
N
E
S
S
CC
S
B
G
H
C
D
D
V
T
N
H
S
V
BC 847S
1 2
6
4
5
3
for example
ZXTP 25020
min.
10 F
( 0V ) 3.05 V 5 .1 V (6 V)
0
02
>e
f
h
T 1
A
m
5 .1.
x
a
m
7.5A
135 mV 600mV
G
H
C
V
4k3
127k
470
1.0V
1,8V
Vcore
LRTC
LSIM
Back -
l ight
LDO blocking caps, 100nF
DC/ DC
Bat t ery Charger
3.1 Digital Main Processor
Figure. 3.1.1 X-Gold tm 215 Hardware Block Diagram
3. TECHNICAL BRIEF
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3. TECHNICAL BRIEF
3.1.1 General
Technology: Technology:
SoC, Monolithic, 65 nm CMOS
Package:
eWLB, 8x9 x0.8 mm
0.5 mm pitch
240 balls / 6-layer PCB
3 1 2 RF Transceiver 3.1.2 RF Transceiver
Dual-band direct conversion receiver
Tri/Quad-band possible with external circuitry
Fully integrated digital controlled X0
Additional buffer for 2 external system clocks
Fully digital RF-Synthesizer incl. -Transmitter
3.1.3 Baseband
DSP:
156 MHz TeakLite
MCU:
ARM1176 @208 MHz ARM1176 @ 208 MHz
MCU RAM:
3.00Mbit
Memory I/F:
1 Gbit NOR flash/OneNAND flash/SDR SDRAM
4 Gbit NAND flash/DDR SDRAM
Modem:
GPRS l 12 (RX/TX CS1 CS4) GPRS class 12, (RX/TX CS1-CS4)
EGPRS class 12, (RX MCS1-MCS9, TX MCS1-MCS4)
Cipher Units:
A51/2/3
GEA-1/2/3
Security:
OMTP TR0
Secure Boot
RSA(ROM)/SHA-1(HW accel.)
OCDS disabling
Certificate Management
DSP:
178 MHz TeakLite
MCU:
ARM1176 @ 208 MHz
MCU RAM:
3.00Mbit
Memory I/F:
1 Gbit NOR fash/OneNAND fash/SDR SDRAM
4 Gbit NAND fash/DDR SDRAM
Modem:
GPRS class 12, (RX/TX CS1-CS4)
EGPRS class 12, (RX MCS1-MCS9, TX MCS1-MCS4)
Cipher Units:
A51/2/3
GEA-1/2/3
Security:
OMTP TR0
Secure Boot
RSA(ROM)/SHA-1(HW accel.)
OCDS disabling
Certifcate Management
- 16 -
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
Speech Codec:
FR / HR / EFR / NB-AMR
Audio Codec (running on ARM1176): g
SP-MIDI
SB-ADPCM
MP3
WB-AMR
AAC/AAC+/eAAC+
Others:
DARP (SAIC) DARP (SAIC)
TTY
Customization:
E-Fuses
3.1.4 External Memory
External Bus Unit External Bus Unit
16-bit address bus
16-bit address/data muxed bus
1.8V support
Flash / RAM
NOR Type
NAND Type (1 bit ECC supported)
Parallel Flash / Cellular RAM(Page & Burst Mode) Parallel Flash / Cellular RAM(Page & Burst Mode)
- 16-bit AD-multiplexed
- 16-bit AAD-multiplexed
iNAND Type e.g. oneNAND
SDRAM
- DDR SDRAM : up to 4 Gbit
- SDR SDRAM : up to 1 Gbit
M d Memory card
SD/MMC card interface with 1 or 4 data lines
3.1.5 Connectivity
3xUSIF (configurable either as SPI or UART), I2C, I2S; Interfaces @ 1.8V
Direct (U)SIM 1.8/3V
f
USB2.0 up to 480 Mbit/s (High Speed) w/ external USB Phy over ULPI interface
Stereo Headset (Amplifier integrated)
3 external analog measurement PINs
Bluetooth
3. TECHNICAL BRIEF
- 17 -
3. TECHNICAL BRIEF
3.1.6 Mixed Signal
Improved audio performance Improved audio performance
Loudspeaker Audio Class D Amplifier, 700 mW@8 mono for hands-free and ringing
Stereo Headset 2x30 mW@16 w/o coupling C
Mono Earpiece 100 mW@16
Digital microphone supported
Differential microphone inputs
3.1.7 FM Radio
Integrated FM radio
FM Stereo RDS Receiver
Sensitivity 2 V EMF
Support for US & EU bands
Stereo recording
3.1.8 Power Management
Direct-to-Battery Connection
LDOs (incl. capless)
DC/DC step-down converter
DC/DC step-up for white LED supply
Battery Type
Li-Polymer
Charging control
Battery temperature
Watchdog protection
Start-up on flat battery
External Charger
Switch mode
USB battery charging
USB charging spec 1.0 compliant
Backlight
Up to 4 serial white LEDs (integrated LDO)
p ( g )
- 18 -
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.1.9 Main LCD Display
Type Type
240*320, QVGA, 262k color (parallel)
Interface
Parallel 8/9bit MIPI-DBI Type B
Serial MIPI-DBI Type C
Interf. voltage at 1.8V or 2.8V
gRacr - Display Controller (Hardware)
30 f Di l d i h DMA ( 60 f ) (f ll i l) 30 fps Display update without DMA (up to 60 fps) (full or partial)
Video post processing Scaling, Rotation (90 steps), Mirroring
Overlay with alpha blending
Color conversion YUV -> RGB
2D vector graphics (Lines, filled rectangles, Bit block transfer (e.g. sprites, scrolling, antialiased bitmap
fonts)
3 1 10 C 3.1.10 Camera
2 Mpx YUV parallel interface
HW JPEG encoder (39 Mpx/sec)
39 MHz Pixel Rate
15 fps@ 2 Mpx full resolution
3.1.11 Video Capabilities
Video Decoding MPEG-4/H.263
QCIF@30 fps
QVGA@15fps
Video Encoding MPEG-4/H.263
QCIF@15 fps
3.1.12 Audio Capabilities
Polyphonic ring tones
64 voices MIDI, SP-MIDI
FM synthesizer
AMR-WB
True ring tones (MP3)

MP3, eAAC+
G.722 SB-ADPCM encoding/decoding
3.1.10 Camera
39 MHz Pixel Rate
3. TECHNICAL BRIEF
3.1.9 Main LCD Display
Type Type
240*320, QVGA, 262k color (parallel)
Interface
Parallel 8/9bit MIPI-DBI Type B
Serial MIPI-DBI Type C
Interf. voltage at 1.8V or 2.8V
gRacr - Display Controller (Hardware)
30 f Di l d i h DMA ( 60 f ) (f ll i l) 30 fps Display update without DMA (up to 60 fps) (full or partial)
Video post processing Scaling, Rotation (90 steps), Mirroring
Overlay with alpha blending
Color conversion YUV -> RGB
2D vector graphics (Lines, filled rectangles, Bit block transfer (e.g. sprites, scrolling, antialiased bitmap
fonts)
3 1 10 C 3.1.10 Camera
39 MHz Pixel Rate
3.1.11 Video Capabilities
Video Decoding MPEG-4/H.263
QCIF@30 fps
QVGA@15fps
Video Encoding MPEG-4/H.263
QCIF@15 fps
3.1.12 Audio Capabilities
Polyphonic ring tones
64 voices MIDI, SP-MIDI
FM synthesizer
AMR-WB
True ring tones (MP3)

MP3, eAAC+
G.722 SB-ADPCM encoding/decoding
3. TECHNICAL BRIEF
- 19 -
3.2 Power Management
A mobile platform requires power supplies for different functions. These power supplies are generated in the
3. TECHNICAL BRIEF
integrated power management Unit (PMU). The PMU is designed to deliver the power for a typical standard
phone.
Figure. 3-2-1 Block Figure of the PMU Modules X-Gold tm 215
DC/DC Step Down Converter for 1.8V (SD1)
The DC/DC converter generates a 1.8V supply rail. This voltage rail is used to supply main parts of the system,
like the digital core of the chip (via LDO LCORE), some parts of the mixed signal macro, parts of the RF macro and
the external memory if a 1.8V memory is used. The efficiency of the DC/DC converter is optimized for an average
load current of 100mA. That is the load current estimated for the GSM talk mode.
3.2 Power Management

A mobile platform requires power supplies for different functions. These power supplies are generated in the
3. TECHNICAL BRIEF
integrated power management Unit (PMU). The PMU is designed to deliver the power for a typical standard
phone.
Figure. 3-2-1 Block Figure of the PMU Modules X-Gold tm 215
DC/DC Step Down Converter for 1.8V (SD1)
The DC/DC converter generates a 1.8V supply rail. This voltage rail is used to supply main parts of the system,
like the digital core of the chip (via LDO LCORE), some parts of the mixed signal macro, parts of the RF macro and
the external memory if a 1.8V memory is used. The efficiency of the DC/DC converter is optimized for an average
load current of 100mA. That is the load current estimated for the GSM talk mode.
- 20 -
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
Linear voltage Regulators (low dropout) LDOs
The LDOs are used to generate the supply for the different supply domains not directly supplied out of the
DC/DC converter.
The VSIM output current is high enough to drive USB SIM cards.
LCORE
Th LCORE LDO id th VCORE l d f t f th di it l t f th hi The LCORE LDO provides the VCORE supply used for most of the digital parts of the chip
LPMU
The LPMU provides VPMU sued for the PMU supply, e.g. for the startup state machine and analog parts like ADC,
sense amplifier etc.
LUSB
The LUSB LDO generates the supply for the USB transceiver (output driver and input). If no USB interface is
required, LUSB can be used as general purpose LDO.
LAUX
The LAUX generates VAUX. It is a general purpose LDO and can be used for different functions depending on the
phone application, e.g. for the display or Camera.
LMMC
The LMMC generates VMMC. It is a general purpose LDO and can be used e,g. for memory cards
LSIM
The LSIM LDO generates the VSIM supply for the SIM card and interface. It is designed to supply Standard SIM
cards.
Other LDOs
The RF module has implemented several LDOs for different RF Power domain.
The mixed signal module has some LDOs for the audio driver and microphone supply.
3. TECHNICAL BRIEF
- 21 -
3. TECHNICAL BRIEF
Table. 3-2-1 Power supply Domains (without RF)
- 22 -
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.2.1 Power on and startup
Analog startup Circuit
Because the POR circuit and the LPBG are directly connected to the battery, it is not possible to switch them
off. If the battery voltage exceed the power on reset threshold (2.5V), the power on reset is released, the LPMU
regulator and the LRTC voltage regulator are switched on. The LPMU regulator starts in its ultra-low power
d mode
The LPMU regulator generates a control signal (lpmu_OK) that enables the 50KHZ PMU oscillator. The output
clock of the oscillator is checked with a fully coded counter. A counter overflow releases the reset
(vpmu_rst_n) signal for the small PMU state-machine.
Small first digital State-Machine
The small PMU state-machine is always connected to VPMU After starting from reset the small startup state
machine enters the SYSTEM OFF state and only continuous the startup procedure if a switch on event like first
connect, on-key, wake up or charge detect occurs.
PMU-main State-Machine
The main PMU state-machine is always connected to VPMU also. The power up sequence driven by the PMU
state-machine can be seen in Figure18. After enabling the reference (HPGB) and waiting for the settling time,
the battery voltage is measured and compared with the power on threshold. If the battery voltage is high
enough, the SD1 DC/DC converter and the LCORE LDO are started. A timer ensures that the supply voltage enough, the SD1 DC/DC converter and the LCORE LDO are started. A timer ensures that the supply voltage
will be stable before the DCXO is enabled. The DCXO settling time is ensured using a fixed timer. After an
overflow of this timer, the reset is released for the rest of the system. The PMU state machine remains in this
System-ON state until the system is switched into the OFF state. For example the system sleep mode is
completely configured by software( for example switching off the LDOs, switching of the DCXO etc.) and
controlled by the VCXO_enable signal. The reason for the startup is stored in the ResetSourceRead register.
Battery Measurement
3. TECHNICAL BRIEF
- 23 -
The ADC and the oscillator for the ADC needs the VDD_ADC supply voltage from the LADC LDO. LADC uses
either the charger voltage VDD_CHARGE or VDDRTC as input voltage. The input voltage is selected
3. TECHNICAL BRIEF
automatically by a bulk switch circuit. LADC, the ADC and the oscillator are enabled on request for every battery
measurement if the charger unit is not running. This is handled by an ADC control block in one of the state-
machines. If the charger unit is running the ADC is controlled by the charger state-machine
Figure.3.2.1 First Part of the State Machine, Running in Different Power Domains than the Second Part
The ADC and the oscillator for the ADC needs the VDD_ADC supply voltage fromthe LADC LDO. LADC uses
either the charger voltage VDD_CHARGE or VDDRTC as input voltage. The input voltage is selected
automatically by a bulk switch circuit. LADC, the ADC and the oscillator are enabled on request for every battery
measurement if the charger unit is not running. This is handled by an ADC control block in one of the state-
machines. If the charger unit is running the ADC is controlled by the charger state-machine
Figure.3.3.2 First Part of the State Machine, Running in Diferent Power Domains than the Second Part
BAT low
all LDOs of
PMU lpmu_pd=0
LPBG on
BAT OK
LRTC on
oscillator on
LPMU-ULPM path on
50kHz OSC setting
wait for oscillator o.k.
PMU SM1 ON
start PMU SM1
release reset of PMU SM1
PMU SM1 SYSOFF
VBAT < 2.5V-e
SYSTEM_OFF
s
m
a
l
l

d
i
g
i
t
a
l

s
t
a
t
e

m
a
c
h
i
n
e

i
n
u
l
t
r
a

l
o
w

p
o
w
e
r

L
P
M
U

d
o
m
a
i
n
a
n
a
l
o
g

c
i
r
c
u
i
t

i
m
p
l
e
m
e
n
t
a
t
i
o
n
VBAT < SYSOFF
VBAT > 2.5V
VBAT > 2.5V
VPMU o.k.
VBAT > 2.5V
LPMU o.k.
Oscillator o.k.
VBAT > 2.5V
LPMU o.k.
Oscillator o.k.
ON key event
RTC alarm
charger delect
frst_connect
Figure.3.2.2 First Part of the State Machine, Running in Dierent Power Domains than the Second Part
- 24 -
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
Figure 3.2.2 Second (Main) Part of the Startup State Machine in the VPMU Domain
ON key event or
RTC alarm or
charger detect or
rst connect
VPMU prepare
release reset_pmufsm_n_o
power reagion setting
SM1 ready
release reset_pmufsm_n_o
wait for system o
wait
SM1 goto SYSOFF
set reset_pmufsm_n_o
switch o PMU power region
LPMU to ULPM
sm1_goto_syso
reset_pmufsm_n_o
go to state
PMU SM1 SYSOFF
HPBG on
start HPBG in fast settie mode
default trim value
LPMU low power mode
wait for HPBG timer (~2ms)
System SHUTDOWN
reset_pmu_n=0
all LDOs o (not LRTC, LPMU)
HPBG o DCXO o
Check Battery
enble battery periodic
supervision
switch HPBG to active mode > SYSONLEV or VBAT >
SYSONPRE if prechare
LCORE, SD1 startup
LDO, SD1 startup sequence
wait for timer (~400s)
bit ALL OFF
DCXO startup
rf_sysclk_en
System ON
reset_pmu_n=1
wait for DCXO timer (16ms)
m
a
i
n

d
i
g
i
t
a
l

s
t
a
t
e

m
a
c
h
i
n
e

o
f

P
M
U
s
m
a
l
l

d
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g
i
t
a
l

s
t
a
t
e

m
a
c
h
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i
n

u
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r
a

l
o
w
p
o
w
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L
P
M
U

d
o
m
a
i
n
3. TECHNICAL BRIEF
- 25 -
3. TECHNICAL BRIEF
3.2.2 Switching on due to first connect
If the battery voltage is connected the first time that means the systementers the first time the SYSOFF state If the battery voltage is connected the first time, that means the system enters the first time the SYSOFF state,
this is stored in a first connect flag. If the first connect flag is set, the system will start immediately and not wait
for any other system on event in the SYSOFF state.
3.2.3 Switching on due to on-Key event
The on key is connected to the ONKEY pad. The ESD protection and the input structure of this pad are
connected to VRTC. If the ONKEY pad is forced to VRTC by an external key or similar circuit, the system starts.
The ONKEY is sampled with the PMU clock. It has to be sampled four times high before a valid on event is
generated. The status of the ON key can be read in the PMU registers, so it can be used as a functional key
during phone operation also
3.2.4 Switching on due to RTC alarm
The real time clock can generate a wakeup signal called RTC alarm. This signal is sampled from the state-
machine and after successfully detecting a high, the system is switched on.
3.2.5 Switching on due to charging
When a battery with a voltage below the SSONLEV level is inserted, the state machine will not start the system.
As long as the battery voltage stays lover than SYSONLEV the system will stay off. The only possibility to start
up the system is due to an external charger.
If an external charger is connected and detected and the battery is charged above the SYSONPRE voltage level
the system will start up.
The PMU main state machine waits in the Check battery state until the battery voltage condition is fulfilled. The
charger state machine provides the necessary pre-charge indication signal. This pre-charge signal is
denounced in a small counter to have a stable signal. This is important, especially in half/full-wave charging
where the charger detection is switching between charger detected/not detected according the AC supply
frequency. reasons
- 26 -
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
For details on pre-charging see the charger chapter. The charger is controlled by an independent state
machine. The pre-charge signal is used to trigger the pre-charge signal is used to trigger the pre-charge
functionality. The charger state machine fully control the pre-charge, the PMU-state machine now changes to
state HPBG on state and the system starts. This state change is indicated to the charger state-machine to
enable the charger watchdog for safety
3.2.6 Power Supply Start-up sequence
In order to avoid an excessive drop on the battery voltage caused by in-rush current during system power-on,
possibly leading to system instability and hick-ups a staggered turn-on approach for the regulators is
implemented. The regulators are turned on in a well defined sequence, thus spreading the in-rush current
transients over time.
The IOs of X-GOLD TM 215 are isolated in OFF mode (core supply is off). The isolation signal is controlled by
the PMU state machine. This ensures that the PADs are in a well defined state during core supply settling. This
allows to power up the LCORE core regulator and wait for the core to reach reset state before powering up the
I/O supply regulators.
3. TECHNICAL BRIEF
- 27 -
3. TECHNICAL BRIEF
Figure 3.2.3 Start Up Sequence (triggered by First Connect Event)
rf_sysclk_en
reset_pmu_n
pad_isolation_n
System
OFF
System
ON
LCORE
SD1
check battery
continue if battery voitage is ok.:
HPBG
reset_pmufsm_n_o
PMU_CLK
LPMU
VRTC
lpmu_pd
LPBG
VBAT
LPM (ES1)
ULPM
LPM
Battery
in
start up
because of
frst connect
event
- 28 -
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.2.7 External Reset Handling
The chip reset can be controlled by an external RESET_N ball. If this ball is pulled low, the chip will be reset. All
PMU registers are reset during the external reset including LSIM control bits. The PMU statemachines are also
not reset from the external reset. An SW or watchdog reset will not reset the PMU registers. A SW and
Watchdog reset is seen on the reset n pad to allow the reset of external devices Basically there are three reset Watchdog reset is seen on the reset_n pad to allow the reset of external devices. Basically there are three reset
sources, first the reset signal controlled by the PMU (reset_pmu_n_o), second the reset signal controlled by the
SCU (resetout_o) and third the external reset (RESET_N). The SCU reset is triggered by SW (for example due to a
SW reset or watchdog reset). The PMU reset is controlled by the PMU state machine. The output of the reset
handling block is the reset_postscu_n_o signal. This signal controls for example the C subsystem and releases
reset for the controller. During normal start up, the PMU releases the reset_pmu_n_o signal after entering the
SYSTEM ON state. At this time the resetout_o signal is high, the RESET_N pad is not pulled low and therefore
the reset_postscu_n_o signal follows the reset_pmu_n_o signal. That means the C reset will be released and
the C starts operation. If the SW triggers an external reset via the SCU, signal resetout_o will be forced to low
for a certain time and RESET_N will be forced to low by the open drain driver. At the same time the feedback to
the SCU will be masked to not reset the baseband. The RESET_N pad is in the VDDRTC domain but the internal
pull up is connected to the VDD_VDIG1 (1.8V) domain. That allows the pad to be used as reset for external
devices running in the VDD1V8 domain. The RESET_N pad can also be used to monitor the chip internal reset
condition during startup.
The open drain driver is a weak driver, that means it can be forced to high during debug from external pushing
some current into the pad. In testmode signal reset_pmu_n_o is high, that means the chip reset is fully
controlled from external
3.2.7 External Reset Handling

3. TECHNICAL BRIEF
- 29 -
3. TECHNICAL BRIEF
3.2.8 Sysclock Switching
Figure 3.2.4 PMU, CGU and External Reset
The PMU controls the rf_sysclk_en signal of the DCXO in the RF macro. During startup the PMU enables the
DCXO. After the system is running the DCXO is controlled by the SCU of the baseband by using the
vcxo_enable signal. This is handled by a dedicated logic in the PMU, see Figure 21. As long as
rf_sysclk_en_pmu, the output of the PMU state-machine is high, vcxo_enable controls the rf_sysclk_en signal
to the RF. If rf_sysclk_en_pmu is low, the DXCO is switched off, independent from vcxo_enable.
resetout_o
reset_postscu_n_o
reset_pmu_n_o
reset_pmu_n_o
lsoation
&LS
reset for external
components
input to system
control unit
for example C
reset
open drain
pad driver
20k
ESD ESD
VDD_VRTC
VDD_VDIG1
VPMU voltage domain
- 30 -
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
Figure 3 4 2 Howsysclock Enable is Routed in the PMU
3.2.9 Undervoltage Shutdown
In active mode the PMU periodically measures the battery voltage using the ADC from the charger unit. If the
b i d b b l h bl h d l l ( ll d SYSOFF) h h
Figure 3.4.2 How sysclock Enable is Routed in the PMU
3.2.10 Software Reset
A f d ff PMU i Th PMU i i h h f
battery is measured to be below the programmable shut-down level (called SYSOFF), the system changes to
OFF mode. This is done via the SHUTDOWN state of the PMU state machine. (see chapter switch OFF)
A software reset does not affect any PMU register. The PMU register are reset with the reset_pmufsm_n_o
signal. That means all PMU register are reset in OFF state. For details about the SW reset see chapter External
Reset Handling
rf_sysclk_en_pmu
vcxo_enable
VPMU
VDDCORE
L
S
L
S
Isolation to 1
& LS
r
f
_
s
y
s
c
l
k
_
e
n
to the RF macro via the
core domain in reset
v
c
x
o
_
e
n
a
b
l
e
r
f
_
s
y
s
c
l
k
_
e
n
_
p
m
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r
f
_
s
y
s
c
l
k
_
e
n
3. TECHNICAL BRIEF
- 31 -
3. TECHNICAL BRIEF
3.2.11 PMU Clock
During the first startup (for example plugging in a battery) a PMU internal oscillator is used for generation of
the PMU clock (pmu_clock). The frequency is slightly above 32 kHz (typ. 50 kHz) to be out of the audio band
also for worst case devices. After first startup the software shall enable the 32 kHz crystal oscillator. It is not
possible to use the 32 kHz oscillator during first startup, because the settling time of the oscillator can be
quite long. After the 32 kHz oscillator is running and settled the software shall switch the PMU clock to the 32
kHz clock and disable the internal PMU oscillator for power saving reasons. The 32 kHz oscillator shall never kHz clock and disable the internal PMU oscillator for power saving reasons. The 32 kHz oscillator shall never
be disabled after the PMU clock has been switched. The ADC in the charger unit has its own oscillator
generating a frequency of about 10 MHz. This oscillator is running during charging and during battery
measurements triggered by the PMU. It is off otherwise.
3.2.12 System Sleep Mode y p
The sleep mode is controlled by using the VCXO_enable signal. This signal is used to switch the LDOs and the
DC/DC converter SD1 in a programmable way into its low power mode (PFM). In addition DC/DC converter
SD1 can be configured to change the output voltage to a lower value for additional power saving.
VCXO_enable is also used to deactivate the HPBG and setting LDO LPMU in the ultra-low-power mode. In
addition the DCXO is switched off by the VCXO enable signal The VCXO enable signal is also used to switch addition the DCXO is switched off by the VCXO_enable signal. The VCXO_enable signal is also used to switch
some LDOs (software configured) to sleep and/or off mode or to change the output voltages of said LDOs.
The state of the main PMU state machine is not changed due to VCXO_enable.
3.2.13 DC/DC Pre-Load Register Handling
The DC/DC converter works in different modes. If the mode is switched from PFM to PWM the pulse-width of
the DC/DC converter depends on the current battery voltage (and on the output voltage). The PMU state-
machine knows the battery voltage because of the battery supervision function. Depending on this value it
selects a startup pulse-width for the DC/DC converter out of a register table. (4-values)
- 32 -
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.2.14 Power Down Sequence
Setting bit OFF in the GeneralControl register switches the system into OFF mode. After the turn off event, the
state-machine switches to the SHUTDOWN state. The reset_pmu_n_o signal changes to low, the I/O pads are
isolated using the padisolation_n signal, the LCORE LDO and the SD1 DC/DC converter are switched off, the
LPMU LDO is switched to ultra-low power mode, the DCXO is turned off and the bandgap buffer is disabled.
Before switching OFF the software shall have enabled the 32 kHz oscillator and has switched the PMU clock to
the 32 kHz clock to archive the target OFF current the 32 kHz clock to archive the target OFF current
3. TECHNICAL BRIEF
- 33 -
3.3 FEM with integrated Power Amplifier Module (SKY77550-21, U101)
3. TECHNICAL BRIEF
3.3.1 Internal Block Diagram
Figure. 3-3-1 SKY77550-21 FUNCTIONAL BLOCK DIAGRAM
3.3.2 General Description
TX_HB_IN(10)
VBATT (3)
VBATT (4)
VRAMP (16)
TxEN (18)
BS (12)
VSW_EN (11)
Tx_LB_IN (9)
HBT POWER AMPLIFIER
CURRENT SENSE
POWER AMPLIFIER
CONTROL
LOGIC DECODER
Match
Match
SKY77550-21
(21) RX2
(26) ANT
(19) RX1
201643_001
- 34 -
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
Figure 3 3 2 Band SWLogic Table Figure 3.3.2 Band SW Logic Table
Figure 3.3.3 FEM CIRCUIT DIAGRAM
n
8.
1
9
3
1
C
L112
5.6n
R102
12
L106
1.8n
1.8n
L110
C109 2.2n
7
0
1
L
n
8.
6
U101
SKY77550-21
9
2
3
2
4
2
5
2
6
2
7
2
8
2
15
16
17
18
19
20
21
22
8
7
6
5
4
3
2
1
4
1
3
1
2
1
1
1
0
19
N
I
_
B
L
_
x
T
N
I
_
B
H
_
x
T
N
E
_
W
S
V
S
B
1
D
V
S
R
2
D
V
S
R
GND1
GND2
VBATT1
VBATT2
GND3
GND4
GND5
GND6
GND7
Rx2
RSVD3
Rx1
RSVD
TxEN
VRAMP
GND8
9
D
N
G
0
1
D
N
G
T
N
A
1
1
D
N
G
2
1
D
N
G
3
1
D
N
G
D
N
G
P
L105
0.5p
0
L101
FL101
10 5
8
3
7 2
6
4
9
1
U_P_1960/
B_P_1960/1842_5MHz_2
U_P_1842_5/
B_P_942_5/881_5MHz_1
GND1 B_P_942_5/881_5MHz_2
GND2
B_P_1960/1842_5MHz_1
GND3 GND4
942_5MHz
881_5MHz
C111
DNI
L111 10n
10n L114
L109
0.75p
0.5p
C114
4
0
1
L
n
8 .
1
SW101
4 3
2
1
ANT COMMON
G3 G4
DNI
L138
DNI
L139
C116
39p 39p
C115
39p
C117
C108
33u
DNI
L108
C107
15p
C102
33p
C104
DNI
C101
33p
C103
DNI
VBAT
1K R104
C106
10n
C105
39p
L103
DNI
L113
DNI
L102
DNI
RF_HB_TX
RF_LB_TX
RF_HB_RXN
RF_LB_RXP
RF_TX_EN
RF_ANT_SEL[0]
RF_ANT_SEL[1]
RF_TX_RAMP
ANT_FEED
RF_HB_RXP
RF_LB_RXN
(50V,J,NP0)
GSM850 / DCS
(10V,2012)
EGSM / PCS
(16V,K,X7R)
Figure 3.3.3 FEM CIRCUIT DIAGRAM
3. TECHNICAL BRIEF
- 35 -
3.4 Crystal(26 MHz, X201)
The X-GOLDTM215 RF-Subsystem contains a fully
3. TECHNICAL BRIEF
y y
integrated 26 MHz digitally controlled crystal
oscillator, designed for 8 pF crystals. The only
external part of the oscillator is the crystal itself.
Overall pulling range of the DCXO is
approximately 55 ppm, controllable by a 13-bit
tuning word
Figure. 3.4.1 Crystal Oscillator External Connection
tuning word.
This frequency serves as comparison frequency
within the RF-PLL and as clock frequency for the
digital circuitry.
The 26 MHz reference clock can also be applied
to external components like Bluetooth or GPS, via
the two buffered output signals FSYS1 and FSYS2
Figure. 3.4.2 Digital PREDISTORTION with LUXO
The DCXO tuning characteristic should be a first order linear function of the programming word AFC. The
variable capacitance array is a first order linear function of the digital word DIG, which leads to a nonlinear curve
ppm vs. DIG (and also a nonlinear ppm vs. AFC for DIG=AFC). In order to linearize the ppm vs. AFC curve the
implementation of a predistortion is necessary.
To get the wanted linear ppmvs. AFC tuning curve some digital predistortion of the AFC word is required. This
To get the wanted linear ppm vs. AFC tuning curve some digital predistortion of the AFC word is required. This
predistortion is performed by the linearization unit for crystal oscillator (LUXO). The LUXO calculates the
corresponding DIG value according to the given AFC value.
FSYS1
FSYS2
26 MHz XO
XOX
TDC
V
B
A
T
3
.
0
5
V
-
5
.
5
V
LUXO
DIG = Y
DIGFILT
Cap
Array
AFC = X
DCXO_LUXO_PREDISTORTION
- 36 -
3. TECHNICAL BRIEF
3.5 RF Subsystem of PMB8815 (U201)
3. TECHNICAL BRIEF
Figure. 3-5-1 Block DIAGRAM of RF Subsystem
3.5.1 GENERAL DESCRIPTION
The PMB8815 RF subsystem is designed for dual-band GSM voice and data applications (GPRS class 12). The
g y
system can be configured to support one low band, GSM850 or EGSM900, and one high band, DCS1800 or
PCS1900. A block diagram of the RF subsystem is given in Figure 3-4-1.
3.5 RF Subsystem of PMB8815 (U201)

3. TECHNICAL BRIEF
- 37 -
- 37 -
3.5.2 FUNCTIONAL DESCRIPTION
3. TECHNICAL BRIEF
3.5.2.1 Receiver
The X-GOLD215 dual-band receiver is based on a Direct Conversion Receiver (DCR) architecture. Input
impedance of the LNAs is optimized to achieve a matching without (external) high quality inductors. By use of
frequency dividers (by 2/4) the LO frequency is derived from the RF frequency synthesizer.
The receive path is fully differential to suppress the on-chip interferences and reduce DC-offsets. The analog p y pp p g
chain of the receiver contains two LNAs (low/high band), a quadrature mixer followed by an analog baseband
filter and 14-bit continuous-time delta-sigma analog-to-digital converter. The filtered and digitized signal is fed
into the digital signal processing chain, which provides decimation, DC offset removal and programmable gain
control.
Figure. 3.5.2 RECEIVER CHAIN BLOCK DIAGRAM
GSM
850/900
GSM
1800/1900
RX1
RX1X
RX2
RX2X
LNA_GAIN
DCO
RXBBFG[2:0] DGAIN[5:0]
RXTXDA
RXTXEN
DigRF
RX
- 38 -
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.5.2.2 Transmitter
The GMSK transmitter supports power class 4 for GSM850 or GSM900 as well as power class 1 for DCS1800 or
PCS1900. The digital transmitter architecture is based on a fractional-N sigma-delta synthesizer for constant
envelope GMSK modulation. This configuration allows a very low power design without any external
components.
Up- and down-ramping is performed via the ramping DAC connected to VRAMP.
Figure. 3.5.3 TRANSMITTER CHAIN BLOCK DIAGRAM
RF synthesizer RF synthesizer
The RF subsystem contains a fractional-N sigma-delta synthesizer for the frequency synthesis. Respective to
the chosen band of operation the phase locked loop (PLL) operates at twice or forth of the target signal
frequency. In receive operation mode the divided output signal of the digital controlled oscillator output (DCO)
serves as local oscillator signal for the balanced mixer. For transmit operation the fractional-N sigma-delta
h i i d d l i l h h /f i l Th MH f i l f
synthesizer is used as modulation loop to process the phase/frequency signal. The 26 MHz reference signal of
the phase detector incorporated in the PLL is provided by the reference oscillator.
3. TECHNICAL BRIEF
3.5.2.2 Transmitter
The GMSK transmitter supports power class 4 for GSM850 or GSM900 as well as power class 1 for DCS1800 or
PCS1900. The digital transmitter architecture is based on a fractional-N sigma-delta synthesizer for constant
envelope GMSK modulation. This configuration allows a very low power design without any external
components.
Up- and down-ramping is performed via the ramping DAC connected to VRAMP.
Figure. 3.5.3 TRANSMITTER CHAIN BLOCK DIAGRAM
RF synthesizer RF synthesizer
The RF subsystem contains a fractional-N sigma-delta synthesizer for the frequency synthesis. Respective to
the chosen band of operation the phase locked loop (PLL) operates at twice or forth of the target signal
frequency. In receive operation mode the divided output signal of the digital controlled oscillator output (DCO)
serves as local oscillator signal for the balanced mixer. For transmit operation the fractional-N sigma-delta
h i i d d l i l h h /f i l Th MH f i l f
synthesizer is used as modulation loop to process the phase/frequency signal. The 26 MHz reference signal of
the phase detector incorporated in the PLL is provided by the reference oscillator.
3. TECHNICAL BRIEF
- 39 -
- 39 -
3. TECHNICAL BRIEF
3.5.2.3 Front-end/PA Control Interface
Two outputs (FE1, FE2) for direct control of antenna switch modules enable to select RX- and TX-mode as well
as low- and high-band operation.
An extra band select signal PABS for the power amplifier is used, to support discrete PA and switching
modules. Time accurate power dissipation of the PA is achieved by the control signal PAEN.
A minor set of power amplifiers require a bias voltage to enhance power efficiency. Support of this power
amplifiers is achieved by the implemented bias DAC amplifiers is achieved by the implemented bias DAC.
Fi 3 5 4 PAANDFEMCONTROL BLOCK DIAGRAM Figure. 3.5.4 PA AND FEM CONTROL BLOCK DIAGRAM
biasdac_data
to
baseband
as rf_fe4_0
INIT_PAFEM_A
PABIASFE 3_SEL
BIAS
DAC
PAMP
DAC
CHANNEL_BSW[1]
INIT_PAFEM_A.PABS_INV
ramping signal
GSM 850/900
GSM 1800/1900
TX2
TX1
RFIN
HB
RFIN
LB
RFOUT
HB
RFOUT
LB
to ASM / FEM
to ASM / FEM
GMSK PA
V
B
I
A
S
B
S
T
X
_
E
N
V
P
A
M
P
VPAMP
PABS
PAEN
PABIAS/FE3
FE2
FE1
FE2
FE1
FE3
FE4
PAEN
- 40 -
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.5.2.4 Power Supply
To increase power efficiency most parts of the RF subsystem are supplied by the DCDC converter situated in
the PMU subsystem. Conversion of the 1.8 V output voltage of the DCDC to the 1.3 V/1,4 V circuit supply
voltages is achieved by several Low-DropOut regulators (LDO).
One embedded direct-to-battery LDO provides the 2.5 V supply voltage for the remaining circuits.
Figure. 3.5.5 POWER SUPPLY BLOCK DIAGRAM
Figure. 3.5.5 POWER SUPPLY BLOCK DIAGRAM

3. TECHNICAL BRIEF
- 41 -
3.6 MEMORY(H9DA2GH1GHMMMR, U301 )
3. TECHNICAL BRIEF
i O OC
Hynix NAND Flash is a 128Mx16bit with spare 4Mx16 bit capacity.
The device is offered in 1.8 Vcc Power Supply, and with x16 I/O interface.
Its NAND cell provides the most cost-effective solution for the solid state mass storage market.
The memory is divided into blocks that can be erased independently so it is possible to preserve valid data while
old data is erased
Figure. 3.6.1 MEMORY BLOCK DIAGRAM
old data is erased.
The device contains 2048 blocks, composed by 64 pages.
Memory array is split into 2 planes, each of them consisting of 1024 blocks.
Like all other 2KB - page NAND Flash devices, a program operation allows to write the 2112-byte page in typical
250us and an erase operation can be performed in typical 3.5ms on a 128K-byte block.
In addition to this, thanks to multi-plane architecture, it is possible to program 2 pages at a time (one per each
plane) or to erase 2 blocks at a time (again, one per each plane). As a consequence, multi-plane architecture allows
program time to be reduced by 40% and erase time to be reduction by 50%. In case of multi-plane operation, there
is small degradation at 1.8V application in terms of program/erase time..
3.6 MEMORY(H9DA2GH1GHMMMR, U301 )
- 42 -
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
[ NAND Flash ]
MULTIPLANE ARCHITECTURE
SUPPLY VOLTAGE SUPPLY VOLTAGE
- Vcc = 1.7 - 1.95 V
MEMORY CELL ARRAY
- (1K + 32) Words x 64 pages x 2048 blocks
PAGE SIZE
- (1K+ 32 spare) Words
BLOCK SIZE
- (64K + 2K spare) Words
PAGE READ / PROGRAM
- Random access : 25us (max.)
- Sequential access : 45ns (min.)
- Page program time : 250us (typ.)
- Multi-page program time (2 pages): 250us (Typ.)
BLOCK ERASE / MULTIPLE BLOCK ERASE
- Block erase time: 3.5 ms (Typ)
- Multi-block erase time (2 blocks): 3.5ms (Typ.)
SEQURITY
- OTP area
- Sreial number (unique ID)
- Hardware program/erase disabled during Hardware program/erase disabled during
- power transition
ADDITIONAL FEATURE
- Multiplane Architecture:
Array is split into two independent planes.
Parallel operations on both planes are available, having program and erase time.
- Single and multiplane copy back program with auto matic EDC (error detection code)
- Single and multiplane page re-program
- Single and multiplane cache program
- Cache read
- Multiplane block erase
RELIABILITY
- 100,000 Program / Erase cycles (with 1bit /528Byte ECC)
10 Year Data retention
- 10 Year Data retention

ONFI 1.0 COMFLIANT COMMAND SET ELECTRICAL SIGNATURE
- Munufacture ID: ADh
- Device ID
3. TECHNICAL BRIEF
- 43 -
3. TECHNICAL BRIEF
[ DDR SDRAM ]
Double Data Rate architecture
- two data transfer per clock cycle
x16 bus width
Supply Voltage
- VDD / VDDQ = 1.7 - 1.95 V
Memory Cell Array
- 16Mb x 4Bank x 16 I/O
Bidirectional data strobe (DQS)
Input data mask signal (DQM)
Input Clock
- Differential Clock Inputs (CK, /CK)
MRS, EMRS
- JEDEC Standard guaranteed
CAS Latency CAS Latency
- Programmable CAS latency 2 or 3 supported
Burst Length
- Programmable burst length 2 / 4 / 8 with both sequential and interleave mode
- 44 -
3. TECHNICAL BRIEF
3.7 BT module
3. TECHNICAL BRIEF
Figure 3_7_1. BT BLOCK DIAGRAM
This module has an integrated radio transceiver that has been optimized for use in 2.4GHz Bluetooth
Wireless systems. It has been designed to provide low-power, robust communications for applications
Operating in the globally available 2.4GHz unlicensed ISM band. It is fully compliant with the Bluetooth
Radio Specification and enhanced data rate specification and meets or exceed the requirement to
provide the highest communication link quality of service.
3.7 BT module
3. TECHNICAL BRIEF
- 45 -
3.7.1 Transmitter path
3. TECHNICAL BRIEF
This module features a fully integrated zero IF transmitter. The baseband transmitted data
Is digitally modulated in the modem block and up-converted the 2.4GHz ISM band in the
Transmitter path. The transmitter path consists of signal filtering, I/Q up-conversion, high
-output power amplifier(PA), and RF filtering. It also incorporates modulation schemes
P/4-DQPSK for 2 Mbps and 8-DPSK for 3 Mbps to support enhanced data rate.
Digital modulator
The digital modulator performs the data modulation and filtering required for the GFSK,
/4DQPSK, and 8-DPSK signal. The fully digital modulator minimizes any frequency drift
Or anomalies in the modulation characteristics of the transmitted signal and is much more
Stable than direct VCO modulation schemes.
Power Amplifier
The integrated PA for the BCM2070 is configurable for Class 2 operation, transmitting up to
+4 dBm as well as Class 1 operation and transmit power up to +12 dBm at the chip, gFSK,
>2.5V supply. Due to the linear nature of the PA, combined with some integrated filtering, no
External filters are requires for meeting Bluetooth and regulatory harmonic and spurious
requirements. For integrated mobile handset applications, where Bluetooth is integrated next q g pp , g
to the celluar radio, minimal external filtering can be applied to achieve near thermal noise
levels for spurious and radiated noise emissions.
Using a highly linearized, temperature compensated design the PA can transmit +12 dBm for
Basic rate and +10 dBm for enhanced data rates(2 to 3 Mbps). A flexible supply voltage range
Allows the PA to operate from 1.2V to 3.0V. The minimum supply voltage at VDDTF is 1.8V
to achieve +10dBm of transmit power.
3.7.2 Receiver path
The receiver path uses a low IF scheme to down-convert the received signal for demodulation
in the digital demodulator and bit synchronizer. The receiver path provides a high degree of
Linearity, an extended dynamic range, and high order on-chip channel filtering to ensure
reliable operation in the noisy 2.4GHz ISM bnad. The front-end topology, with built-in out
-of-bnad attenuation enables the device to be used in most applications with no off-chip
-of-bnad attenuation, enables the device to be used in most applications with no off-chip
Filtering. For integrated handset operation where the Bluetooth function is integrated close to
the celluar transmitter, minimal external filtering is required to eliminate the desensitization of
The receiver by the cellular transmit signal.
- 46 -
3. TECHNICAL BRIEF
C318
33p
C323
33p
C320
33p
33p
C317 C316
33p
33p
C315 2
0
3
D
Z
7
1
3
R
K
7
.
4
0.1u
C321
S301
5000-12P-2_95D-A1-R0
EAG63211701
C7
4
1
C1_1
5
1
C1
3
1
C3_1
C6
C2
C5
C5_1
C2_1
C3 C7_1
C6_1
6
1
6
D
N
G
VPP2
I/O2 CLK1
RST2
GND2
GND1
RST1
VPP1
CLK2
3
D
N
G
VCC1
5
D
N
G
VCC2
4
D
N
G
I/O1
VA308
VA309
VA312
VA311
VA310
8
1
3
R
K
7
.
4
2V85_VSIM 2V85_VSIM
2V85_VSIM
2V85_VSIM
0.1u
C319
SIM_CLK
SIM_CLK SIM_DATA_1
SIM_RST_N
SIM_DATA_2
SIM_RST_2
FSA2259UMX
U302
EUSY0186504 6
5
7
4
8
3
9
2
10
1
C
C
V
2B1
1
B
1
2A
1A
S2
S1
0
B
2
1B0
D
N
G
2V85_VSIM
R325
100K
100K
R324
C322 1u
10K
R323
2V85_VSIM
I
N
D
7
2
3
R
SIM_DATA
SIM_RST_SEL
SIM_SEL
SIM_DATA_1
SIM_DATA_2
SIM_RST_2
3.8 SIM Card Interface
Figure 3-8-1.Dual SIM CARD Interface
The Main Base Band Processor(XMM215) provides SIM Interface Module.
The XMM215 checks status Periodically During established call mode whether SIM card is inserted or not, but it doesnt
check during deep sleep mode. In order to communicate with SIM card, 5 signals SIM_DATA_1, SIM_DATA_2, SIM_CLK,
SIM_RST_N, SIM_RST_2
And This model supports 2.85V SIM Card.
Signal Description
SIM_RST_N This signal makes SIM card to HW default status.
SIM_CLK This signal is transferred to SIM card.
SIM_DATA_1 This signal is interface datum.
3. TECHNICAL BRIEF
- 47 -
3.9 LCD Interface
3. TECHNICAL BRIEF
Figure 3-9-1. LCD Interface (B to B Connector on Main PCB)
The LM320DN1A module is a Color Active Matrix Liquid Crystal Display with an Light Emission
Diode(LED) Back Light system. The matrix employs a-Si Thin Film Transistor as the active element.
It is a transmissive type display operating in the normally Black mode. This TFT-LCD has a 3.19 inch
diagonally measured active display area with 240 * RGB * 320 resolution. Each pixel is divided into
R,G,B dots which are arranged in vertical stripes. Gray scale or the brightness of the dots
Color is determined with a 6 bit gray scale signal for each dot, thus, presenting a palette of
More than 262,144 colors.
3.9 LCD Interface

VA601
1u
C607
18p
1u
C622
1
0
6
R
0
5
0
6
R
0
VBAT
C603
2.2u
TP603
100K
R604
R602
DNI
6
0
6
R
0
DNI
R603
TP602
VPA_2V85
VDD_IO_1V8
CN601
21 20
22 19
23 18
24 17
25 16
26 15
27 14
28 13
29 12
30 11
31 10
32 9
33 8
34 7
35 6
36 5
37 4
38 3
39 2
40 1
1u
C606
LCD_LED_CA5
LCD_LED_CA4
LCD_LED_CA3
LCD_LED_CA2
LCD_LED_CA1
LCD_PWM
LCD_VSYNC_OUT
LCD_F_DATA[2]
LCD_F_DATA[3]
LCD_F_DATA[1]
LCD_F_DATA[0]
LCD_F_DATA[7]
LCD_F_DATA[5]
LCD_F_DATA[4]
LCD_F_WR_N
LCD_F_CS_N
LCD_F_RS
LCD_F_DATA[6]
LCD_RST_N
LCD_ID
LCD_IFMODE
LCD_F_RD
ENBY0036001
GB042-40S-H10-E3000
- 48 -
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
Figure 3-9-2. RT9396 CIRCUIT DIAGRAM
The RT9396 is a power management IC (PMIC) for backlighting and phone camera
applications. The PMIC contains a 6-Channel charge pump white LED driver and
four low dropout linear regulators.
The charge pump drives up to 6 white LEDs with regulated constant current for uniform
intensity. Each channel (LED1 to LED6) supports up to 25mA of current. These 6-Channels
can be also programmed as 4 plus 2-Channels or 5 plus 1-Channels with different current
setting for auxiliary LED application. The RT9396 maintains highest efficiency by utilizing a
x1/ x1.5/ x2 fractional charge pump and low dropout current regulators. An internal 6-bit
DAC is used for backlight brightness control Users can easily configure up to 64 steps of DAC is used for backlight brightness control. Users can easily configure up to 64-steps of
LED current via the I2C interface control. The RT9396 also comprises low noise, low
dropout regulators, which provide up to 200mA of current for each of the four channels. The
four LDOs deliver 3% output accuracy and low dropout voltage of 200mV @ 200mA.
Users can easily configure LDO output voltage via the I2C interface control. The LDOs also
provide current limiting and over-temperature functions. The RT9396 is available in a

WQFN-24L 3x3 package.
U601
24
23
22
21
20
19
18
8
7
6
5
9
4
10
3
11
2
12
1
3
1
4
1
5
1
6
1
7
1
L
C
S
A
D
S
N
E
M
W
P
F
C
D
N
G
P
LDO1
N
2
C
LDO2
N
1
C
LDO3
P
1
C
LDO4
P
2
C
AGND
VIN
LDOIN
LED6
LED5
LED4
LED3
LED2
LED1
VOUT
VPROX_3V0
VTOUCH_3V0
VCAM_DIG_1V8
1
0
6
B
F
0
1
VCAM_IO_1V8
R620 0
C619
1u
0 R619
0 R608
0 R609
2.2u
C610
C604
1u
C605
2.2u
VCAM_ANA_2V8
1u
C608
1u
C609
C611
1u
1u
C601
C602
1u
VBAT
100K
R611
LCD_LED_CA5
LCD_LED_CA4
LCD_LED_CA3
LCD_LED_CA2
LCD_LED_CA1
LCD_PWM
I2C_SDA
I2C_SCL
BACKLIGHT_KEY
LCD_BL_CTRL
3. TECHNICAL BRIEF
- 49 -
3. TECHNICAL BRIEF
LED Backlight Current
RT9396 communicates with a host (master) Using the standard I2C 2-wire interface.
The two bus lines of SCL and SDA must be pulled high when the bus is not in use Internal The two bus lines of SCL and SDA must be pulled high when the bus is not in use. Internal
pull-up resistors are installed. After the START condition, the I2C master sends a chip
address. This address is eight bits long, consisting of seven address bits and a following data
direction bit (R/W). The RT9396 address is 10101000 (A8h) and is a receive-only (slave)
device. The second word selects the register to which the data will be written. The third word
contains data to write to the selected register. Figure 2 shows the writing information for the
four LDOs as well as for each LED current. In the second word, the sub-address of the four
LDOs is 001 and the sub-address of the LED Driver for different dimming modes are
respectively 010, 011 and 100. For the LDO output voltage setting, bits B1 to B4
represent each LDO channel respectively where a 1 indicates selected and a 0 means not
selected. The B0 bit controls on/off (1/0) mode for the selected LDO channel(s). Then, in the
third word, bite C0 to C3 control a 16-step setting of LDO1 to LDO4.The voltage values are
listed in Table 1. For LED dimming, there are three operating modes (Backlight I, Backlight
II and Backlight III) to select from by writing respectively 010, 011 and 100 into the
First three bits of the second word, It should be noticed that no matter which mode is
selected, LED1 to LED3 must be turned on, else LED4 to LED6 can not be Turned on. When
Backlight I is selected, all six LEDs have the same behavior. Their 64-step dimming
currents are set by bits C0 to C5, which are listed in Table 2. The bits C6 and C7 determine
Backlight Quiescent Current
currents are set by bits C0 to C5, which are listed in Table 2. The bits C6 and C7 determine
the fade in/out time of each step as shown in Figure 2. For Backlight II and Backlight III,
two sets of LEDs, called Main and Sub, can work separately.
The quiescent current required to operate all four backlights is reduced by 1.5mA when backlight current is
set to 4.0mA or less. This feature results in higher efficiency under light-load conditions. Further reduction in
quiescent current will result from using fewer than four LEDs.
- 50 -
3. TECHNICAL BRIEF
3.10 MiniABB (Battery Charger & MUIC) Interface
3. TECHNICAL BRIEF
Figure 3-10-1 Mini ABB BLOCK
The LP8727 is designed to provide automatic multiplexing switches between Micro/Min USB connector and USB,
UART, and Audio paths in cellular phone applications, and it also contains a single-input Li-ion battery charger
and over-voltage protected LDO. Programming is handled via ans I2C compatible Serial Interface allowing
control of charger, multiplexing switches, and reading status information of the device.
The multiplexing switches on USB and UART support High-Speed USB and Audio inputs can be driven to
negative voltage rail. The LP8727 is compatible with USB charging specification rev 1.1 form USB IF.
The Li-ion charger requires few external components and integrates the Power FET. Charging is thermally
regulated to obtain the most efficient charging rate for a given ambient temperature. It has Over-Voltage
Protection (OVP) circuit at the charger input protects the PMU from input voltage up to +28V, eliminating the
need for and external protection circuitry.
An Over-voltage protected LDO which can supply up to 50mA is designed for powering up low voltage USB
g p pp y p g p g p g
transceiver or waking up a PMU(Power Management Unit)when an external power source(either USB VBUS or
wall adapter) is connected to the USB connector.
3.10 MiniABB (Battery Charger & MUIC) Interface
U401
EAN62339701
LP8727-B
C5
D2
B5
D3
D1
E1
E2
E3
E5
E4
A1
C1
B1
A4
A5
A3
A2
D5
4
D
4
C
3
C
2
C
2
B
3
B
4
B
L
C
S
A
D
S
T
N
I
1
D
N
G
2
D
N
G
3
D
N
G
4
D
N
G
BATT2
DN
DP
U1
U2
AUD1
AUD2
MIC
VBUS1
VBUS2
D-
D+
ID
RES
DSS
EXPDET
CAP
BATT1
C418
DNI
R410
2.2K
10K
R402
4
1
4
C
u
1
1u
C412
FB401 1800
R405 10
R401
47K
R406
10
u
1
3
1
4
C
VDD_IO_1V8
VBAT
VDD_IO_1V8 VUSB_CHG_IN
C411
1u
USB_DP
USB_DM
UART_TX
MUIC_ACC_ID UART_RX
VUSB_LDO_4V9
I2C_SDA
I2C_SCL
MUIC_IO_P
MUIC_IO_M
MUIC_INT_N
3. TECHNICAL BRIEF
- 51 -
3.12 Audio Interface
F i l O i
1. TECHNICAL BRIEF
3.12.1 Functional Overview
The audio front-end of X-GOLD215 offers the digital and analog circuit blocks for both receive and transmit
audio operation, from a mobile phone perspective (called audio-in and audio-out subsequently). It features a
high-quality, stereo digital-to-analog path with amplifier stages for connecting acoustic transducers to X-
GOLD215. In audio-in path the supply voltage generation for electret microphones, a low-noise amplifier and p pp y g g p p
analog to digital conversion are integrated in X-GOLD215. A more detailed functional description will be given
in the following sections.
The audio front-end itself can be considered to be organized in three sub-blocks:
Interface to processor cores (TEAKLite and - indirectly - ARM)
Digital filters Digital filters
Analog part
The following figure shows an architecture overview of the Audio section.
Figure 3.12.1 Audio Section Overview

Figure 3.12.1 Audio Section Overview
3.11 Audio Interface
3.11.1 Functional Overview
- 52 -
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
The audio front-end of X-GOLD215 has the following major operation modes:
Figure 3.12.2 Overview of Clocking and Interfaces of Audio Front End
Power-down: All analog parts are in power down and all clocks of the digital part are switched off.
Audio mode: Digital decimation/interpolation filters are connected to the interface buffers and the analog
part is enabled.
These major modes can be modified by certain control register settings.
Due to the new gain settings in the TX path, the maximum input voltage is limited to 0.8 Vpp.
In both voiceband paths, the value range for voice samples is confined to 97.5%, i.e. to [-31948, 31947] or
[8334H, 7CCBH] in X-GOLD215.
On the TX path, 83% "1"s on the VTPDM line correspond to a 16-bit value of 7CCBH and 17% "1"s correspond
to a 16-bit value of 8334H at the digital filter output. Thus the usable range is 66%. This range can be scaled to
100% by Firmware.
y
The high-pass functions of the voiceband filters have to be implemented in firmware on TEAKLite.
DSP RX
Bufer
TX
Bufer
digital
flters
ASMD
DACr
ADC
DACI
comb
DSP interrupt
unit
Cintrd
and sidus
regsiars
FPI bus
DSP bus
DSP bus
S
h
a
r
e
d
m
e
m
o
r
y
R
X

b
u
f
e
r
s
T
X

L
N
A
o
u
t
p
u
t
s
a
l
e

c
t
i
o
n
g
a
i
n
c
o
n
t
r
o
l
3. TECHNICAL BRIEF
- 53 -
3.11.2 Digital Part
The digital part of the X-GOLD215 audio front-end comprises an interface to the TEAKLite bus, interfaces to the
interrupt units of TEAKLite, digital interpolation flters for oversampling digital-to-analog conversion, digital
decimation flters for analog-to-digital conversion and an interface to the analog part of the audio front-end. For
the digital microphone all the fltering is done in a dedicated hardware. The output sample stream is then fed in a
duplicated ring bufer structure like the data from the analog microphone path (after A/D conversion and
subsequent digital fltering).
* Interpolation Filter
The interpolation path of the X-GOLD215 audio front-end increases the sampling rate of the audio samples to
the rate of the digital-to-analog converter. Because the input sampling rates can vary between 8 kHz and 47.619
kHz the flter characteristic and oversampling ratio can be adjusted to the respective sampling rate. The
requirements for the interpolation flters depend on the sampling rate, because a sufcient out-of-band
discrimination in the audio frequency band (20 Hz,...,20 kHz) has to be ensured.
* Decimation Filter
The digital decimation flter on X-GOLD215 has two operating modes: 8 kHz output sampling rate and 16 kHz
output sampling rate (or 16 kHz output sample rate and 16kHz bandwidth in case of doubled ASMD clock).
3.11.3 Analog Part
The analog part of the X-GOLD215 audio front-end in audio-out direction consists of a stereo digital to analog
converter (multi-bit oversampling converter) which transforms the output of the digital interpolation flter into
analog signals. It is followed by the gain control/amplifer section. The DAC outputs can be switched to several
output bufers. In audio-in section there is an input multiplexer which selects either one of two diferential
microphone inputs to be connected to the low-noise amplifer and analog pre-flter. The signals from the analog
pre-flter are input to a second-order sigma-delta analog-to-digital converter. In addition there is a connection for
FM-radio playing.
* Audio-out Part
The analog audio-out part consists of two multi-bit digital-to-analogue converters (DAC) and an output stage. The
signal sources are switched to the output drivers in the output stage The output drivers consist of: a) one mono,
diferential class-D Loudspeaker driver, b) one mono, diferential Earpiece driver and c) one stereo, single-ended
(with uni- or bipolar signals), Headset driver.
- 54 -
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
Digital-to-analog converters
The multi-bit oversampling DACs of the X-GOLD215 audio front-end convert the 16-bit data words coming
Output Amplifier
The different output buffers in X-GOLD215 are driven by the outputs of the selection block. The differential
from the digital interpolation filters to analogue signals.
earpiece driver can be used to drive a 16 earpiece and works in differential. The two single ended headset
drivers can be used to drive a 16 headset. They can work unipolar mode, where an AC coupling of the headset
might be needed, or can work also in bipolor mode. The differential loudspeaker driver can be used to drive a 8
loudspeaker. As it is a class-D amplifier the needed suppression of the higher harmonics of the switching signals
has to be achieved by the external circuitry. The buffers are designed to be short circuit protected.
Figure 3.12.3 Switching for R/L DACs onto Buffers
Figure 3.12.3 Switching for R/L DACs onto Bufers

3. TECHNICAL BRIEF
- 55 -
3. TECHNICAL BRIEF
Figure 3.12.4 Different Application Scenarios
In order to achieve the single-speaker concept by parallel connection of Earpiece and Headset amplifier the
Earpiece amplifier have to sustain the up to 5 V voltage of the class-D amplifier.
Audio-in Path
The audio-in path of X-GOLD215 provides two differential microphone input sources, MIC1and MIC2.
The inputs for microphone MIC1 are MICP1 and MICN1.
The inputs for microphone MIC2 are MICP2 and MICN2.
The audio-in path consists of an input selector, a low noise amplifier and following pre-filter with gain control,
a second order -converter and a digital decimation filter. It supports both standard GSM (bandwidth 3.5
kH ) and ideband (band idth 7 kH ) speech bands kHz) and wideband (bandwidth 7 kHz) speech bands.
The differential input signal from the microphone first passes a low noise amplifier and following pre-filter
and an anti-aliasing pre-filtering stage achieving and overall variable gain ranging from 0 dB to +39 dB . The
signal is then modulated by a second order -converter which is clocked with the same clock rate as the
digital to analog converters. The -converter delivers a 1-bit pulse density modulated data stream at a rate
of 2 MHz to the digital decimation filter which reduces the rate to 8 kHz or 16 kHz, depending on the current
mode.
To improve SNR the sample frequency can be doubled in dedicated modes and the modulated data stream is
4MHz instead of 2 MHz.
- 56 -
3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
Microphone Supply
X GOLD2 h i l d d l f l i h X-GOLD215 has a single ended power-supply concept for electret microphones:
For both modes a minimal load capacitance of t.b.d. nF is necessary to guarantee stable operation of the buffer.
The maximal load capacitance must not exceed t.b.d. nF.
2 microphone supplies VMIC and VUMIC are available. The supply VUMIC has a ultra-low-power mode, where
the current consumption is minimum, whilst at the same time the noise performance is reduced.
For this purpose the VUMIC is directly supplied out of the VMIC regulator, the Mic-Buffer can be switched off and
only the quiescent current of the VMIC regulator is present. This mode can be used to supply a headset and
allow accessory detection with highly reduced current consumption For normal operation the supply can be
switched to normal operation mode with improved noise performance. In case of an digital microphone VMIC
can be used for supplying this microphone.
Figure 3.12.5 Typical Microphone Supply Generation (alternative)
VMIC
MICP
MICN
10k
1k5
TBV_Typical_Microphone_Supply_Generation_alternative
Figure 3.11.5 Typical Microphone Supply Generation (alternative)
3. TECHNICAL BRIEF
- 57 -
3.13 Camera Interface(2M Fixed Focus Camera)
3. TECHNICAL BRIEF
3.13.1 XMM215 Camera Interface
The Camera Interface (CIF) represents a complete video and still picture input interface (see Figure 26).
The CIF contains image processing, scaling, and compression functions. The integrated image processing unit
supports image sensors with integrated YC
b
C
r
processing.
Scaling is used for downsizing the sensor data for either displaying them on the LCD, or for generating data
streams for MPEG-4 compression. In general, YC
b
C
r
4:2:2 JPEG compressed images should use the full sensor
resolution, but they can also be downscaled to a lower resolution for smaller JPEG files. Scaling also can be used
for digital zoom effects, because the scalers are capable of up-scaling as well.
CIF
All data is transmitted via the memory interface to an AHB bus system using a bus master interface.
Programming is done by register read/write transactions using an AHB slave interface.
Figure 3.13.1 Block Diagram of Camera Interface

3.12 Camera Interface(2M Fixed Focus Camera)
3.12.1 XMM215 Camera Interface
Figure 3.12.1 Block Diagram of Camera Interface
- 58 -
3. TECHNICAL BRIEF
Functional Overview of CIF
3. TECHNICAL BRIEF
The following list gives an overview over the CIFs functionality:
78 MHz system clock
78 MHz sensor clock
78 MHz JPEG encoder clock
32-bit AHB slave programming interface
ITU-R BT 601 compliant video interface supporting YC
b
C
r
ITU-R BT 656 compliant video interface supporting YC
b
C
r
data
8-bit camera interface
12-bit resolution per color component internally
YC
b
C
r
4:2:2 processing
Hardware JPEG encoder incl JFIF1 02 streamgenerator and programmable quantization and Huffman Hardware JPEG encoder incl. JFIF1.02 stream generator and programmable quantization and Huffman
tables
Windowing and frame synchronization
Continuous resize support
Frame skip support for video (e.g. MPEG-4) encoding
Macro block line, frame end, capture error, data loss interrupts and sync. (h_start, v_start) interrupts
Programmable polarity for synchronization signals
Luminance/chrominance and chrominance blue/red swapping for YUV input signals
Maximum input resolution of 3 Mpixels (2048x1536 pixels)
Main scaler with pixel-accurate up- and down-scaling to any resolution between 3 MP (2048x1536) and
32x16
pixel in processing mode
Buffer in system memory organized as ring-buffer
Buffer overflow protection for raw data and JPEG files
Asynchronous reset input, software reset for the entire IP and separate software resets for all sub-modules
Interconnect test support
Semi planar storage format
Color processing (contrast, saturation, brightness, hue)
Color processing (contrast, saturation, brightness, hue)

Power management by software controlled clock disabling of currently not needed sub-modules
3. TECHNICAL BRIEF
- 59 -
I
N
D
6
0
6
A
V
2
1
6
C
u
1
.
0
u
1
.
0
3
1
6
C
4
1
6
C
u
1
.
0
C617
7.5p 7.5p
C620
7
0
6
A
V
8
0
6
A
V
VCAM_DIG_1V8
VCAM_IO_1V8
VCAM_ANA_2V8
5
0
6
A
V
4
0
6
A
V
R616
10
CN602
13 12
14 11
15 10
16 9
17 8
18 7
19 6
20 5
21 4
22 3
23 2
24 1
CAM_PCLK
CAM_MCLK
CAM_F_DATA[6]
CAM_F_DATA[5]
CAM_F_DATA[4]
CAM_F_DATA[3]
CAM_F_DATA[2]
CAM_F_DATA[1]
CAM_F_DATA[0]
CAM_F_DATA[7]
I2C_SDA
I2C_SCL
CAM_PWDN
CAM_RST_N
F_CAM_VSYNC
F_CAM_HSYNC
Figure 3-12 Camera Connector
- 60 -
3. TECHNICAL BRIEF
3.13 Touch Interface
Figure 3-13Touch Driver Block Diagram
The touch controller is an analog interface circuit for a human interface touch screen device.
All of touch functions are composed of a register-based architecture and are controlled through
the internal register sets by serial interface.
MMS-100 Series are composed of a 32-bit ARM processor, a wakeup interrupt controller (WIC), a 32-Kbytes fash
memory, an 8-Kbytes SRAM, a Receiver Controller with max 20 receiver channels(RX), a Transmitter Controller with max
32 transmitter channel(TX), an embedded I2C slave with four serial I/O lines, a timer, an internal oscillator, an internal
LDO, an internal C/P for HV, and a POR.
A transmitter controller and a receiver controller activate corresponding TX channels and RX channels sequentially.
A LDO generates a regulated power supply voltage from noisy voltage source. The generated voltage is used for the
power supply voltage of analog circuits. PSRR is highly improved by the internal LDO.
A charge pump generates a high voltage source for driving TX channels. The overdriven voltage increases the signal
strength, thereby improving SNR.
A POR generates a reset signal at power-up.
3.14 Touch Interface
3. TECHNICAL BRIEF
The touch controller is an analog interface circuit for a human interface touch screen device.
All of touch functions are composed of a register-based architecture and are controlled through
the internal register sets by serial interface.
Figure 3 14 Touch Driver Block Diagram Figure 3-14 Touch Driver Block Diagram
MMS-100 Series are composed of a 32-bit ARM processor, a wakeup interrupt controller (WIC),
a 32-Kbytes flash memory, an 8-Kbytes SRAM, a Receiver Controller with max 20 receiver
channels(RX), a Transmitter Controller with max 32 transmitter channel(TX), an embedded I2C
slave with four serial I/O lines, a timer, an internal oscillator, an internal LDO, an internal C/P
for HV, and a POR.
A i ll d i ll i di TX h l d RX A transmitter controller and a receiver controller activate corresponding TX channels and RX
channels sequentially.
A LDO generates a regulated power supply voltage from noisy voltage source. The generated
voltage is used for the power supply voltage of analog circuits. PSRR is highly improved by the
internal LDO.
A charge pump generates a high voltage source for driving TX channels. The overdriven voltage
i th i l t th th b i i SNR
increases the signal strength, thereby improving SNR.

A POR generates a reset signal at power-up.
OSC
LDO
C/P
POR
MMS-100 Core
WIC 32-bit ARM Core
AMBA bus
AMBA bus
32-bit KB Flash 8-KB SRAM
Timer
2 chip
interface
12C
Slave
ISP
Transmitter Controller
Receiver Controller
HV
Swutch
HV
Swutch
HV
Swutch
Analog
Front-
end
Analog
Front-
end
Analog
Front-
end
TX0 TX1 TX31 RX0 RX1 RX19 SCL SDA RSTB INTB MSD SMD MSC
Max 20 RX Max 32 TX
3. TECHNICAL BRIEF
- 61 -
Figure 3-13-2 Touch Driver Block
- 62 -
4. TROUBLE SHOOTING
4. TROUBLE SHOOTING
4.1 RF Component
4. TROUBLE SHOOTING
U201 U301
X201
i
U101
U301
Memory(2G NAND/1G SDRAM)
H9DA2GH1GHMMMR-46M
U201
Main Chip (A-GOLD RADIO NAND)
PMB8815
Figure 4.1
PMB8815
U101
GPRS QUAD TX DUAL RX MODULE
SKY77550-21
X201
Crystal, 26MHz Clock
TSX- 3225
RF Switch
SW101
RF Switch
MS-156C
4.1 RF Component
U201
U301
X201
U101
SW101
4. TROUBLE SHOOTING
- 63 -
4.2 RX Trouble
START
(1) Check
Crystal Circuit
Re-download or
Do calibration again
(2) Check
Mobile SW &TX module
(3) Check PLL Control
HP8960 : Test mode
62 CH, 7 level setting (TCH)
62CH, -60dBm setting (BCCH)
Spectrum analyzer setting
Oscilloscope setting
- 64 -
4. TROUBLE SHOOTING
(1) Checking Crystal Circuit
4. TROUBLE SHOOTING
26 MHzO.K?
No
Crystal is OK.
Yes
Replace X201
TP1_1 pin :
26MHz
Figure 4.2.1
y
See next page to check PLL
Circuit
X201
TP1
Figure 4.2.2 TP1
Figure 4.2.3
Figure 4.2.2
X201 TSX-3225
26MHz
2 1
3
4
GND2 HOT2
HOT1 GND1
R213
0
2V85_VSIM
0.1u
C225
G5
F2
F3
F1
D2
D1
E2
M10
A13
B13
K14
K13
B4
A5
B5
A4
J10
USIF2_CTS_N
USIF1_TXD_MTSR
USIF1_RXD_MRST
USIF1_RTS_N
USIF1_CTS_N
DPLUS
DMINUS
XOX
XO
VSIM
SIM_IO
SIM_CLK
SIM_RST
MMCI_CMD
MMCI_DAT_0
MMCI_CLK
USB_DP
USB_DM
UART_TX
SIM_DATA
SIM_CLK
MSD_CLK
MSD_D[0]
MSD_CMD
BT_UART_TX
BT_UART_RX
UART_RX
SPI_INT
SIM_RST_N
Connect GND plane directly
Close to the 26MHz XTAL
VDDP_SIM
VDDP_MMC
EINT2
CC1CC6IO
VDDP_ULPI
RF
TP1
(1) Checking Crystal Circuit
Yes
26 MHzO.K? Replace X201
No
Crystal is OK.
See next page to check PLL
ircuit
X201
TP1_1 pin:
26MHz
Figure 4.2.1
4. TROUBLE SHOOTING
- 65 -
(2) Checking Mobile SW &TX Module
4. TROUBLE SHOOTING
RF_TX_EN
RF_ANT_SEL[0]
RF_ANT_SEL[1]
RF_TX_RAMP
TP2 TP3
TP1
U101
TP4
SW101
Figure 4.2.4
EGSM Rx
ANT SEL!|
RF_ANT_SEL[1]
RF_TX_RAMP
RF_ANT_SEL[0]
RF_TX_EN
TP4 ANT_SEL!|
Tx_EN
ANT_SEL0|
TP2
TP3
TP1
TP4
69i!47
(2) Checking Mobile SW &TX Module
n
8.
1
9
3
1
C
L112
5.6n
R102
12
L106
1.8n
1.8n
L110
C109 2.2n
7
0
1
L
n
8.
6
U101
SKY77550-21
9
2
3
2
4
2
5
2
6
2
7
2
8
2
15
16
17
18
19
20
21
22
8
7
6
5
4
3
2
1
4
1
3
1
2
1
1
1
0
19
N
I
_
B
L
_
x
T
N
I
_
B
H
_
x
T
N
E
_
W
S
V
S
B
1
D
V
S
R
2
D
V
S
R
GND1
GND2
VBATT1
VBATT2
GND3
GND4
GND5
GND6
GND7
Rx2
RSVD3
Rx1
RSVD
TxEN
VRAMP
GND8
9
D
N
G
0
1
D
N
G
T
N
A
1
1
D
N
G
2
1
D
N
G
3
1
D
N
G
D
N
G
P
L105
0.5p
0
L101
FL101
10 5
8
3
7 2
6
4
9
1
U_P_1960/
B_P_1960/1842_5MHz_2
U_P_1842_5/
B_P_942_5/881_5MHz_1
GND1 B_P_942_5/881_5MHz_2
GND2
B_P_1960/1842_5MHz_1
GND3 GND4
942_5MHz
881_5MHz
C111
DNI
L111 10n
10n L114
L109
0.75p
0.5p
C114
4
0
1
L
n
8 .
1
SW101
4 3
2
1
ANT COMMON
G3 G4
DNI
L138
DNI
L139
C116
39p 39p
C115
39p
C117
C108
33u
DNI
L108
C107
15p
C102
33p
C104
DNI
C101
33p
C103
DNI
VBAT
1K R104
C106
10n
C105
39p
L103
DNI
L113
DNI
L102
DNI
RF_HB_TX
RF_LB_TX
RF_HB_RXN
RF_LB_RXP
RF_TX_EN
RF_ANT_SEL[0]
RF_ANT_SEL[1]
RF_TX_RAMP
ANT_FEED
RF_HB_RXP
RF_LB_RXN
(50V,J,NP0)
GSM850 / DCS
(10V,2012)
EGSM / PCS
(16V,K,X7R)
RF_ANT_SEL[0]
RF_ANT_SEL[1]
RF_TX_RAMP
RF_TX_EN
TP1
TP4
TP2
TP3
U101
TP4
RF_TX_RAMP
RF_ANT_SEL[1]
RF_ANT_SEL[0]
RF_TX_EN
TP2
TP3
Figure 4.2.4
SW101
TP1
- 66 -
4. TROUBLE SHOOTING
4. TROUBLE SHOOTING
Check TP1 of SW101
TP1 Signal is OK?
Replace Mobile SW (SW101)
No
Yes
Yes
Check PMB8815(U201)
Control Signal is
(GpCtrl1 GpCtrl0
No
Check TP4 of U101 ?
Check PMB8815(U201) (GpCtrl1,GpCtrl0,
Tx Enable)OK ?
Yes
Replace TX Module (U101)
TP2(High Band),
TP3(Low Band)
Signal is OK ?
No
Yes
Mobile SW & TX Module is OK.
Yes
EGSM Rx EGSM Rx
Check TP1 of SW101

TP1 Signal is OK? Replace Mobile SW (SW101)
No
Yes
Mobile SW & TX Module is OK.
Control Signal is (RF_ANT_SEL[0],
RF_ANT_SEL[1],RF_TX_EN)OK ?
Check PMB8815(U201)
No
Yes
TP2(High Band),
TP3(Low Band)
Signal is OK ?
Replace TX Module (U101)
No
Yes
Check TP4 of U101 ?
Yes
4. TROUBLE SHOOTING
- 67 -
Figure 4.1
4.3 Power On Trouble
U201
VMMC_2V85 ( TP01 : C205 )
VPMU ( TP02 : C203 )
VCORE ( TP03 : C207 )
VDDTDC (TP08 : C212)
VDDXO (TP09 : C211)
VDDMS (TP10 : C213)
VDDTRX ( TP07 : C208 )
VRF1 (TP06 : C214)
VDDRF2 (TP05 : C210)
VPA_2V85 (TP04 : C204)
- 68 -
4. TROUBLE SHOOTING
470n
C219
FB201
75
1
0
2
R
0
2.2u
C202
VDD_IO_1V8
VDD_IO_1V8
VUSB VBAT VCORE
VDDMS VDDTRX
VDD_IO_1V8
0.1u
C216
VDD_IO_1V8
VDDRF2 VDDTDC
VMMC_2V85
VDD_IO_1V8
VRF1
0.1u
C206
VPA_2V85
C203
0.1u
C214
1u
VDDXO
C211
4.7n
C205
470n
VBAT_RF2
1u
C218
C213
47n
C212
47n
VPMU
C217
0.1u
VBAT
1u
C208
0.1u
C201
C207
220n
C210
220n
470n
C204
C209
18p 1u
C215
VDD_EBU
PIN N10
PIN K9
DBB SUPPLIES
ABB SUPPLIES
PIN_G15 PIN_G16 PIN_E13 PIN_B14
PIN G11 PIN F6,P6
PIN P12
PIN P16
VBAT_PMU
(10V)
RF SUPPLIES (CLEAN GND)
PIN P10 PIN L9 PIN M11 PIN K10
PMU SUPPLIES
RF SUPPLIES (DIRTY GND)
PIN_B16 PIN_H15
VDD_IO1
VDD1V8CP
VBATSP
VDD_IO2
Speaker Supply
Seperate and shield
PIN_H12
(10V)
Q201
1
2
3
VBAT
VRF1 VDDRF2 VUSB VMMC_2V85
VPA_2V85 VBAT_RF2
VPMU
VDD_IO_1V8
VDD_IO_1V8
VDD_IO_1V8
VDD_IO_1V8
VBAT
10u C222
22u
C221
R205
5.6K
3.9K
R203
VDDXO
VBAT
L201
3.3u
R204
100K
VDDMS VCORE
470
R202
VDD_IO_1V8
C220
1u
VBACKUP_BAT
VDDTDC
VDD_IO_1V8
VDD_IO_1V8
VCORE
8
K
7
T
8
R
9
M
6
T
8
M
8
L
2
1
L
7
1
C
7
1
F
2
1
H
5
1
G
1
1
M
9
L
4
1
F
0
1
P
4
1
E
6
1
G
8
1
R
4
1
B
3
1
E
5
1
H
4
1
G
5
1
A
2
1
J
5
1
F
6
1
F
7
1
P
6
1
P
0
1
G
0
1
K
7
R
1
1
J
1
1
H
0
1
F
3
A
1
1
T
2
1
P
8
H
6
P
6
F
9
K
1
1
G
0
1
N
8
1
P
3
1
L
6
1
L
9
R
9
T
8
T
9
P
N3
N5
R5
A_D0
A_D1
A_D2
1
D
S
_
D
D
V
B
F
_
1
D
S
1
D
S
_
S
S
V
W
S
1
D
S
1
S
M
S
S
V
2
S
M
S
S
V
P
S
T
A
B
V
U
M
P
_
T
A
B
V
1
O
I
D
D
V
2
O
I
D
D
V
1
U
B
E
_
D
D
V
2
U
B
E
_
D
D
V
L
L
D
_
D
D
V
U
M
P
V
U
M
P
_
S
S
V
1
E
R
O
C
S
S
V
2
E
R
O
C
S
S
V
3
E
R
O
C
S
S
V
4
E
R
O
C
S
S
V
5
E
R
O
C
S
S
V
E
R
O
C
V
E
R
O
C
D
D
V
P
C
8
V
1
D
D
V
R
S
L
S
S
V
X
R
T
S
S
V
X
R
S
S
V
1
8
V
1
D
D
V
P
M
A
R
V
G
I
D
_
S
S
V
S
M
D
D
V
O
X
D
D
V
C
D
T
D
D
V
G
E
N
D
D
V
T
A
B
V
O
C
D
S
S
V
X
U
A
V
O
X
S
S
V
C
M
M
V
B
S
U
V
2
F
R
D
D
V
1
F
R
V
O
L
_
S
S
V
F
R
S
S
V
C
T
R
V
N
E
S
N
E
S
P
E
S
N
E
S
G
H
C
D
D
V
S
C
B
S
C
G
H
C
V
T
N
H
S
V
VUSB_LDO_4V9
RF_TX_RAMP
NANDD_DDRA[00]
NANDD_DDRA[01]
NANDD_DDRA[02]
(1%)
Figure 4.2 power block of T385
TP1 TP3
TP4
TP2
TP7 TP5
TP9
TP8 TP10 TP6
4. TROUBLE SHOOTING
- 69 -
START
Check Battery Voltage
> 3.35V
Charge or Change Battery
No
Yes
The phone will
Properly operating.
Does it work properly?
Replace the main board
No
Is the phone power on?
Replace U201 and
Re-download software
No
Yes
Yes
Push power-on key
And check the level change
into high of POWERKEY
Yes
Check the contact of power key
Or dome-switch
No
Check the voltage of
The LDO outputs at U201
Replace U201
No
VCORE(TP03)=1.2V,
VPMU(TP02)=1.2V,
VDDMS(TP10)=1.3V,
VPA(TP04)=2.85V,
VMMC_2V85(TP01)=2.85V,
VDDRF2(TP05)=2.5V
VDDXO(TP09)=1.3V,
VDDTDC(TP08)=1.3V,
VRF1(TP06)=1.8V
- 70 -
4. TROUBLE SHOOTING
U401
EAN62339701
LP8727-B
C5
D2
B5
D3
D1
E1
E2
E3
E5
E4
A1
C1
B1
A4
A5
A3
A2
D5
4
D
4
C
3
C
2
C
2
B
3
B
4
B
L
C
S
A
D
S
T
N
I
1
D
N
G
2
D
N
G
3
D
N
G
4
D
N
G
BATT2
DN
DP
U1
U2
AUD1
AUD2
MIC
VBUS1
VBUS2
D-
D+
ID
RES
DSS
EXPDET
CAP
BATT1
C418
DNI
R410
2.2K
10K
R402
4
1
4
C
u
1
1u
C412
FB401 1800
R405 10
R401
47K
R406
10
u
1
3
1
4
C
VDD_IO_1V8
VBAT
C411
1u
USB_DP
USB_DM
UART_TX
MUIC_ACC_ID UART_RX
VUSB_LDO_4V9
I2C_SDA
I2C_SCL
MUIC_IO_P
MUIC_IO_M
MUIC_INT_N
Connected to CN401 #1 pin (TP01)
TP1
Figure 4.5
4.4 Charging Trouble
U401 & E4,E5 Pin(TP1)
TP1
CN401 #1 pin(Connected
to TP1)
#1 Pin
4. TROUBLE SHOOTING
- 71 -
START
Battery is charged? Charging is properly operating
No
Yes
Charging is
properly operating
Battery is charged?
Replace the main board
No
Yes
Yes
Is I/O Connector(CN401)
well-soldered ?
Yes
Resolder the CN401
(Pin 1 : VBUS_USB)
No
Check the voltage at
TP1 (Charging IC(U401))=5.1V ?
The TA is out of order
Change the TA
No
Change the battery
- 72 -
4. TROUBLE SHOOTING
Figure 4.6
4.5 Vibrator Trouble
-
+
Vibrator PAD / VB401
R408 (TP1)
4. TROUBLE SHOOTING
- 73 -
C
2
3
7
2
2
p
C
2
3
8
2
7
p
1 1 R
7 A
7 B
0 1 C
0 1 B
0 1 A
0 1 D
6 B
5 1 L
7 1 L
8 1 L
6 A
0 1 R
0 1 T
2 1 F
1 1 E
1 1 C
1 T U O _ P K
2 T U O _ P K
3 T U O _ P K
5 T U O _ P K
B I V
B I V _ S S V
0 T U O K L C
K 2 3 F
K 2 3 C S O
N _ T E S E R
N I 2 T
0 K L C _ 1 S 2 I
X R _ 1 S 2 I
X T _ 1 S 2 I
0 A W _ 1 S 2 I
L C S _ C 2 I
A D S _ C 2 I
F F O N O
X
2
0
2
N
X
3
2
1
5
S
A
3
2
.
7
6
8
K
H
z
2
1
N _ T E D _ D S M
S T R _ T R A U _ T B
S T C _ T R A U _ T B
T U O _ M C P _ T B
N I _ M C P _ T B
K 2 3 _ C T R
N _ T S R _ M A C
S C _ I P S
D I _ D C L
] 2 [ T U O _ Y E K
N _ T E S E R
P _ B I V
V
D
D
P
_
D
I
G
1
1 T N I E
6 T N I E
0 T N I E
0 T N I E
C T R _ D D V
4 T N I E
O I 4 C C 1 C C
5 T N I E
1 G I D _ P D D V
Main
Chip
(U201)
1
0
4
L
n
6
5
56n
L402
VB401
2
1
10
R408
1u
C405
33p
C404
VIB_P
TP1
- 74 -
4. TROUBLE SHOOTING
SETTING : Enter the engineering mode, and set vibrator on at vibration of BB test menu
START
Check the soldering
of vibrator ?
Resolder the Pad.
No
Yes
Replace vibrator
Yes
Yes
Check the TP1
Is PWM Signal OK?
Yes
Replace U201
No
Is the voltage at VB401
(+) high?
Replace the Pad
No
Vibrator
Working well !
4. TROUBLE SHOOTING
- 75 -
Figure 4.7
4.6 LCD Trouble
LCD_F_DATA[7]
LCD_F_DATA[6]
LCD_F_DATA[5]
LCD_F_DATA[4]
LCD_F_DATA[3]
LCD_F_DATA[2]
LCD_F_DATA[1]
LCD_F_DATA[0]
TP7
TP6
LCD_VSYNC_OUT(4th PIN)
LCD_F_WR_N(5th PIN)
LCD_F_CS_N(8th PIN)
LCD_F_RS(9th PIN)
TP4
TP1
TP2
TP3
TP5
- 76 -
4. TROUBLE SHOOTING
FL603
15pF
0
1
5
6 4
7 3
8 2
9 1
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1
G
2
G
FL602
15pF
0
1
5
6 4
7 3
8 2
9 1
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1
G
2
G
15pF
FL601
0
1
5
6 4
7 3
8 2
9 1
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1
G
2
G
LCD_RS
LCD_CS_N
LCD_F_DATA[2]
LCD_F_DATA[3]
LCD_F_DATA[1]
LCD_F_DATA[0]
LCD_F_DATA[7]
LCD_F_DATA[5]
LCD_F_DATA[4]
LCD_F_WR_N
LCD_F_CS_N
LCD_F_RS
LCD_F_DATA[6]
LCD_WR_N
LCD_D[07]
LCD_D[06]
LCD_D[05]
LCD_D[04]
LCD_D[03]
LCD_D[02]
LCD_D[01]
LCD_D[00]
LCD_RD LCD_F_RD
VA601
1u
C607
18p
1u
C622
1
0
6
R
0
5
0
6
R
0
VBAT
C603
2.2u
TP603
100K
R604
R602
DNI
6
0
6
R
0
DNI
R603
TP602
VPA_2V85
VDD_IO_1V8
CN601
21 20
22 19
23 18
24 17
25 16
26 15
27 14
28 13
29 12
30 11
31 10
32 9
33 8
34 7
35 6
36 5
37 4
38 3
39 2
40 1
1u
C606
LCD_LED_CA5
LCD_LED_CA4
LCD_LED_CA3
LCD_LED_CA2
LCD_LED_CA1
LCD_PWM
LCD_VSYNC_OUT
LCD_F_DATA[2]
LCD_F_DATA[3]
LCD_F_DATA[1]
LCD_F_DATA[0]
LCD_F_DATA[7]
LCD_F_DATA[5]
LCD_F_DATA[4]
LCD_F_WR_N
LCD_F_CS_N
LCD_F_RS
LCD_F_DATA[6]
LCD_RST_N
LCD_ID
LCD_IFMODE
LCD_F_RD
ENBY0036001
GB042-40S-H10-E3000 TP6
TP1
TP2
TP3
TP4
TP5
U601
24
23
22
21
20
19
18
8
7
6
5
9
4
10
3
11
2
12
1
3
1
4
1
5
1
6
1
7
1
L
C
S
A
D
S
N
E
M
W
P
F
C
D
N
G
P
LDO1
N
2
C
LDO2
N
1
C
LDO3
P
1
C
LDO4
P
2
C
AGND
VIN
LDOIN
LED6
LED5
LED4
LED3
LED2
LED1
VOUT
VPROX_3V0
VTOUCH_3V0
VCAM_DIG_1V8
1
0
6
B
F
0
1
VCAM_IO_1V8
R620 0
C619
1u
0 R619
0 R608
0 R609
2.2u
C610
C604
1u
C605
2.2u
VCAM_ANA_2V8
1u
C608
1u
C609
C611
1u
1u
C601
C602
1u
VBAT
100K
R611
LCD_LED_CA5
LCD_LED_CA4
LCD_LED_CA3
LCD_LED_CA2
LCD_LED_CA1
LCD_PWM
I2C_SDA
I2C_SCL
BACKLIGHT_KEY
LCD_BL_CTRL
TP7
4. TROUBLE SHOOTING
- 77 -
4. TROUBLE SHOOTING
LCD_BL_CTRL
Graph 4.7.1. LCD Backlight Control Signal Waveform
LCD_RS
LCD_CS
LCD WR LCD_WR
Graph 4.7.2. LCD Data Waveform

- 78 -
4. TROUBLE SHOOTING
START
Is the connection of
CN601 with LCD connector ok ?
Reassemble LCD connector
No
LCD working well !
Does LCD work properly ?
Replace LCD module
No
Yes
Yes
Check the Voltage
Level of MLED1~%(TP1~5)are
about Battery voltage ? LCD BL Ctrl
(TP7)signal is high Level)
Yes
Resoldering or Replace U601
No
Check the Waveform of EMI flter ?
(FL601,FL602,FL603,TP606)
Resoldering EMI flter.
(FL601,FL602,FL603)
No
4. TROUBLE SHOOTING
- 79 -
4.7 Camera Trouble
CAM_F_DATA[7]
CAM_F_DATA[6]
CAM_F_DATA[5]
CAM_F_DATA[4]
CAM_F_DATA[3]
TP04 :C614
TP05 :C613
TP06 :C612
TP09 :VA606(DNI)
TP03 :C619
TP02 :C608
TP01 :C609
TP07 :R211
TP08 :R212
Figure 4.8
- 80 -
4. TROUBLE SHOOTING
U601
24
23
22
21
20
19
18
8
7
6
5
9
4
10
3
11
2
12
1
3
1
4
1
5
1
6
1
7
1
L
C
S
A
D
S
N
E
M
W
P
F
C
D
N
G
P
LDO1
N
2
C
LDO2
N
1
C
LDO3
P
1
C
LDO4
P
2
C
AGND
VIN
LDOIN
LED6
LED5
LED4
LED3
LED2
LED1
VOUT
VPROX_3V0
VTOUCH_3V0
VCAM_DIG_1V8
1
0
6
B
F
0
1
VCAM_IO_1V8
R620 0
C619
1u
0 R619
0 R608
0 R609
2.2u
C610
C604
1u
C605
2.2u
VCAM_ANA_2V8
1u
C608
1u
C609
C611
1u
1u
C601
C602
1u
VBAT
100K
R611
LCD_LED_CA5
LCD_LED_CA4
LCD_LED_CA3
LCD_LED_CA2
LCD_LED_CA1
LCD_PWM
I2C_SDA
I2C_SCL
BACKLIGHT_KEY
LCD_BL_CTRL
TP1
TP2
TP3
I
N
D
6
0
6
A
V
2
1
6
C
u
1
.
0
u
1
.
0
3
1
6
C
4
1
6
C
u
1
.
0
C617
7.5p 7.5p
C620
7
0
6
A
V
8
0
6
A
V
VCAM_DIG_1V8
VCAM_IO_1V8
VCAM_ANA_2V8
5
0
6
A
V
4
0
6
A
V
R616
10
CN602
13 12
14 11
15 10
16 9
17 8
18 7
19 6
20 5
21 4
22 3
23 2
24 1
CAM_PCLK
CAM_MCLK
CAM_F_DATA[6]
CAM_F_DATA[5]
CAM_F_DATA[4]
CAM_F_DATA[3]
CAM_F_DATA[2]
CAM_F_DATA[1]
CAM_F_DATA[0]
CAM_F_DATA[7]
I2C_SDA
I2C_SCL
CAM_PWDN
CAM_RST_N
F_CAM_VSYNC
F_CAM_HSYNC
TP6
TP5 TP4
1n
C230
47p
C233
47p
C235
47p
C234
47p
C232 C231
1n
220n
C236
VDD_IO_1V8
TP204
T12
P13
R12
P15
P14
T15
R15
T14
R14
1
1
F
1
T
8
1
T
8
1
A
1
A
1
1
R
7
A
7
B
0
1
C
0
1
B
0
1
A
0
1
D
0
K
L
C
_
1
S
2
I
X
R
_
1
S
2
I
X
T
_
1
S
2
I
0
A
W
_
1
S
2
I
L
C
S
_
C
2
I
A
D
S
_
C
2
I
F
F
O
N
O
1
C
N
2
C
N
3
C
N
4
C
N
S
F
D
D
V
MICN1
MICP1
MICN2
MICP2
VMIC
VUMIC
ACD
AGND
VREF
2.2K
R212
R211
2.2K
HS_MIC_N
PWRON
HS_MIC_P
MAIN_MIC_P
S
T
R
_
T
R
A
U
_
T
B
S
T
C
_
T
R
A
U
_
T
B
T
U
O
_
M
C
P
_
T
B
N
I
_
M
C
P
_
T
B
I2C_SDA
I2C_SCL
HS_JACK_DET
MAIN_MIC_N
VDDP_DIG1
1
T
N
I
E
6
T
N
I
E
0
T
N
I
E
1
G
I
D
_
P
D
D
V
TP7
TP8
4. TROUBLE SHOOTING
- 81 -
Graph 4.8.1. I2C Data Waveform
CAM_MCLK
CAM_RESET
I2C_DATA
CAM_MCLK(26MHz)
Graph 4.8.2. MCLK Waveform
CAM_VSYNC
CAM_HSYNC
CAM_HSYNC
CAM_PCLK_26MHz
Graph 4.8.4.CAM_HSYNC vs.
CAM_PCLK Waveform
Graph 4.8.3.CAM_VSYNC vs.
CAM_HSYNC Waveform
- 82 -
4. TROUBLE SHOOTING
START
Check the each voltage
Level of TP4(2.8V) and TP5,TP6
(1.8V) is right ?(LED_PWM signal
is high Level)
Resoldering or Replace U601
No
Yes
Camera working well !
Does Camera work
properly ?
Replace U201 or Change the board
No
Yes
Yes
Check the Waveform
of I2C_CLK(TP7), I2C_DATA(TP8),
CAM_MCLK(26MHz) ?
Yes
Replace U201 or Change the board
No
Check the Waveform of
Data pins on U602?
Resoldering or Replace Camera Module.
No
4. TROUBLE SHOOTING
- 83 -
C229
47p 47p
C228 C227
DNI
C226
DNI
VMIC_BIAS_P
VAUD_HS_BIAS
N17
N18
T16
R16
M18
M17
K17
P11
P4
J4
T2
J5
G1
L4
J3
L2
P5
P2
RAS_n
CAS_n
BC0_n
BC1_n
BC2_n
BC3_n
SDCLKO
BFCLKO_0
BFCLKO_1
CKE
ANAMON
FSYS_EN
EPN
EPP
HSL
HSR
LSN
LSP
DDR_CAS_N
DDR_RAS_N
DDR_DQS[1]
DDR_DQS[0]
DDR_DQM[0]
DDR_DQM[1]
BT_CLK_REQ
SPK_HS_L
SPK_HS_R
DDR_CLK_P
DDR_CKE
DDR_CLK_N
RCV_HS_N
RCV_HS_P
ABB
VDDP_DIG1
VDDP_EBU
BB
Chip
D501
L504
0
D502
39p
C537
CN501
EAB62429501
2
1
C528
39p
L505
0
DNI
C530
SPK_P
SPK_N
TP5
TP6
4.8 Speaker / Receiver Trouble
M501
TP01 :C507
TP02 :C508
TP03 :C510
TP04 :C515
U201 BB chip
CN501
Speaker
contact
TP05: L504
TP06 : L505
- 84 -
4. TROUBLE SHOOTING
C510 0.1u
0.1u C515
12 R508
R509 12
1u
C507
C508
1u
0
3
1
5
R
600
FB505
FB504
600
C517
2.2u
C514
39p
M501
3
D
1
C
2
E
2
A
C2
B2
B4
A4
B3
E1
A3
D1
A1
C3
B1
E4
E3 C4
4
D
2
D
D
D
V
P
H
D
D
V
P
S
IN3- OUT+
OUT-
HPL
IN3+
HPR
CP
IN1+
CN
IN1-
IN2+
IN2-
SDA
SCL
S
AI
B
D
D
V
P
C
S
S
V
P
C
D
N
G
C513
39p
2
0
5
R
0
C518
2.2u
C516
2.2u
C519
2.2u
C503
10u
2.2u C505
VBAT
0.1u
C504
VDD_IO_1V8
HS_OUT_R
HS_OUT_L
HS_GND
I2C_SDA
I2C_SCL
SPK_P
SPK_N
SPK_HS_L
SPK_HS_R
RCV_HS_N
RCV_HS_P
TP1
TP2
TP3
TP4
START
< Cal l >
Check the state of
contact of receiver
Replace/Change
Receiver Speaker
No
Receiver Working well!!
Yes
Yes
Check the Audio signal
C507,C508,C510,C515
(TP01~04)
Yes
Change the U201
No
L504,L505
(TP7,08)
Replace/Change the M501
No
START
< Mp3>
Check the state of
contact of speaker
Speaker Working well!!
Yes
C507,C508,C510,C515
(TP1~4)
Yes
L504,L505
(TP5,06)
No
No
No
Yes
4. TROUBLE SHOOTING
- 85 -
4.9 Earphone Trouble
M501
U201 BB chip
C229 : TP09
C228 : TP08
C525 : TP12
C521 : TP11
R512 : TP10
FB506 : TP5
FB502 : TP2
FB507 : TP3
FB501 : TP1
FB503 : TP4
C515 : TP7
C510 : TP6
- 86 -
4. TROUBLE SHOOTING
C510 0.1u
0.1u C515
12 R508
R509 12
1u
C507
C508
1u
600
FB505
FB504
600
C517
2.2u
C514
39p
M501
3
D
1
C
2
E
2
A
C2
B2
B4
A4
B3
E1
A3
D1
A1
C3
B1
E4
E3 C4
4
D
2
D
D
D
V
P
H
D
D
V
P
S
IN3- OUT+
OUT-
HPL
IN3+
HPR
CP
IN1+
CN
IN1-
IN2+
IN2-
SDA
SCL
S
A
I
B
D
D
V
P
C
S
S
V
P
C
D
N
G
C513
39p
C518
2.2u
C516
2.2u
C519
2.2u
HS_OUT_R
HS_OUT_L
I2C_SDA
I2C_SCL
SPK_P
SPK_N
SPK_HS_L
SPK_HS_R
RCV_HS_N
RCV_HS_P
TP6: C510
TP7:C515
C229
47p 47p
C228 C227
DNI
C226
DNI
VMIC_BIAS_P
VAUD_HS_BIAS
N17
N18
T16
R16
M18
M17
K17
P11
P4
J4
T2
J5
G1
L4
J3
L2
P5
P2
RAS_n
CAS_n
BC0_n
BC1_n
BC2_n
BC3_n
SDCLKO
BFCLKO_0
BFCLKO_1
CKE
ANAMON
FSYS_EN
EPN
EPP
HSL
HSR
LSN
LSP
DDR_CAS_N
DDR_RAS_N
DDR_DQS[1]
DDR_DQS[0]
DDR_DQM[0]
DDR_DQM[1]
BT_CLK_REQ
SPK_HS_L
SPK_HS_R
DDR_CLK_P
DDR_CKE
DDR_CLK_N
RCV_HS_N
RCV_HS_P
ABB
VDDP_DIG1
VDDP_EBU
U201
BB
Chip
TP8: C228
TP9: C229
Q501
KTJ6131V 1
3
2
G
D
S
4.7
R507
R506
4.7
C506
560p 560p
C509
U502
NCS2200SQ2T2G
2
3
1
4
5
VCC
VIN-
OUT VIN+ GND
5
2
5
R
M
1
6
2
5
R
K
0
2
2
47
R527
C541
120p
8
2
5
R
K
0
0
1
VDD_IO_1V8
C540
39pF
J501
EAG63234901
JAM3333-F36-7H
M5
M4D
M4
M1
M6
ZD503
C522 22n
VDD_IO_1V8
10
R504
ZD502
1800 FB507
ZD501
FB503 1800
FB502 1800
C502
27p
VA501
47K
R501
1n
C501
R523
DNI
L501
100n
ZD504
C525
47p
47p
C524
R505
DNI
R512
2.2K
1.5K
R511
C523
2.2u
C521
39pF
C520
22n
VAUD_HS_BIAS
R524
1K
10
FB501
1800
FB506
R503
220K
HS_MIC_N
HS_MIC_P
HS_OUT_R
HS_OUT_L
HS_GND
HS_GND
HS_GND
HS_JACK_DET
HS_MIC
HS_MIC
HS_HOOK_DET
FM_LNA_IN
TP1:FB501
TP2:FB502
TP3:FB507
TP4:FB503
TP5:FB506
TP10:R512
TP11:C521
TP12:C525
4. TROUBLE SHOOTING
- 87 -
START
Can you
hear the sound from
The earphone?
Resolder J501 (3.5 EAR-MIC con)
No
Earphone will work properly
Yes
Can you hear the
sound from
the earphone?
Yes
Set the audio part of
the test equipment to PRBS
or Continuous wave
mode
No
Resolder J501
Can you hear the sound from
the earphone?
Yes
No
Can you hear
your voice from the earphone?
Change the
earphone
and try again
Resolder
FB501(TP01), FB502(TP02),
FB507(TP03), FB503(TP04),
FB506(TP05) C510(TP06)
C515(TP07)
No
Change the
earphone
and try again
Can you hear your
voice from
the earphone?
No
Resolder
C228(TP08), C229(TP09),
R512(TP10) C521(TP11),
C525(TP12) Or change the
M501(amp),U201(BB IC)
Yes
Set the audio part of the test
Equipment to echo mode
- 88 -
4. TROUBLE SHOOTING
Figure 4.12
4.10 Microphone Trouble
1n
C230
47p
C233
47p
C235
47p
C234
47p
C232
C229
47p 47p
C228 C227
DNI
C226
DNI
C231
1n
VMIC_BIAS_P
220n
C236
VDD_IO_1V8
VAUD_HS_BIAS
TP204
T12
P13
R12
P15
P14
T15
R15
T14
R14
N17
N18
T16
R16
M18
M17
K17
P11
P4
J4
T2
J5
G1
L4
J3
L2
P5
P2
J8
T5
P1
T4
R6
R2
N2
B1
A2
1
1
F
1
T
8
1
T
8
1
A
1
A
1
1
R
7
A
7
B
L
C
S
_
C
2
I
A
D
S
_
C
2
I
F
F
O
N
O
1
C
N
2
C
N
3
C
N
4
C
N
S
F
D
D
V
FWP
FCDP_RBn
CS0_n
CS1_n
CS2_n
ADV_n
RD_n
WR_n
WAIT_n
RAS_n
CAS_n
BC0_n
BC1_n
BC2_n
BC3_n
SDCLKO
BFCLKO_0
BFCLKO_1
CKE
ANAMON
FSYS_EN
EPN
EPP
HSL
HSR
LSN
LSP
MICN1
MICP1
MICN2
MICP2
VMIC
VUMIC
ACD
AGND
VREF
2.2K
R212
R211
2.2K
HS_MIC_N
PWRON
HS_MIC_P
MAIN_MIC_P
DDR_CAS_N
DDR_RAS_N
DDR_DQS[1]
DDR_DQS[0]
DDR_DQM[0]
DDR_DQM[1]
NAND_BSY_N
NAND_CS_N
BT_CLK_REQ
HS_JACK_DET
SPK_HS_L
SPK_HS_R
NAND_DDR_WE_N
DDR_CLK_P
NAND_WP_N
DDR_CKE
NAND_ALE_N
NAND_RE_N
NAND_CLE_N
DDR_CLK_N
DDR_CS_N
MAIN_MIC_N
RCV_HS_N
RCV_HS_P
ABB
1
T
NI
E
6
T
NI
E
1
GI
D
_
P
D
D
V
VDDP_DIG1
VDDP_DIG1
VDDP_EBU
U201
TP1
TP3
TP4
10u
C526
VA503 VA502
K
2.
2
9
1
5
R
C532 33n
4
1
5
R
K
1
R517
100
33n C529
100
R518
39p
C536
VMIC_BIAS_P
C535
39p
5
1
5
R
K
2 .
2
SUMY0003816
OBM-410L44-RC1882
MIC501
2
1
39pF
C531
39p
C527
0
2
5
R
0
MAIN_MIC_P
MAIN_MIC_N
TP2
TP6
TP5
C234 : TP4
C235 : TP3
C230 : TP1
R514 : TP2
C532 : TP5
C529 : TP6
4. TROUBLE SHOOTING
- 89 -
SETTING : After initialize Agilent 8960, Test EGSM900, DCS mode ( or GSM850, PCS mode )
START
Make a phone call,
then check C230(TP1) mic bias
comes from U201?
1. Check mic Bias signal line
2. Change the U201
No
Yes
Microphone will work
properly.
Check the signal
Level at each side
of MIC501.
Is it a few tens
mV AC?
Yes
Change the microphone
No
Check the soldering of
C532, C529(TP5,6)
Re-solder component
No
Check microphone sound hole
Yes
- 90 -
4. TROUBLE SHOOTING
4.11 SIM Card Interface Trouble
Figure 4.13
R213
0
2V85_VSIM
0.1u
C225
J15
K18
H17
H18
G18
J18
J17
H14
E1
G4
G5
F2
F3
F1
D2
D1
E2
M10
A13
B13
XOX
XO
VSIM
SIM_IO
SIM_CLK
SIM_RST
MMCI_CMD
MMCI_DAT_0
MMCI_CLK
MMCI_DAT_1
MMCI_DAT_2
MMCI_DAT_3
SWIF_TXRX
TDO
TDI
TMS
TCK
TRST_N
TRIG_IN
MON1
USB_DM
SIM_DATA
SIM_CLK
MSD_CLK
MSD_D[1]
MSD_D[0]
MSD_CMD
MSD_D[3]
MSD_D[2]
LCD_RST_N
JTAG_TRST_N
JTAG_TDI
JTAG_TMS
JTAG_TCK
JTAG_TDO
SIM_SEL
SIM_RST_N
VDDP_SIM
VDDP_MMC
VDDP_DIG1
RF
U201
TP1
C318
33p
C323
33p
C320
33p
33p
C317 C316
33p
33p
C315 2
0
3
D
Z
7
1
3
R
K
7
.
4
0.1u
C321
S301
5000-12P-2_95D-A1-R0
EAG63211701
C7
4
1
C1_1
5
1
C1
3
1
C3_1
C6
C2
C5
C5_1
C2_1
C3 C7_1
C6_1
6
1
6
D
N
G
VPP2
I/O2 CLK1
RST2
GND2
GND1
RST1
VPP1
CLK2
3
D
N
G
VCC1
5
D
N
G
VCC2
4
D
N
G
I/O1
VA308
VA309
VA312
VA311
VA310
8
1
3
R
K
7
.
4
2V85_VSIM 2V85_VSIM
2V85_VSIM
2V85_VSIM
0.1u
C319
SIM_CLK
SIM_CLK SIM_DATA_1
SIM_RST_N
SIM_DATA_2
SIM_RST_2
PIN #1
TP1 : C225
PIN#1
4. TROUBLE SHOOTING
- 91 -
START
Does the SIM card
support 3V or 1.8V ?
Change the SIM Card.
This phone supports 3V or 1.8V SIM card.
No
SIM card is properly working
Yes
Yes
Is Voltage at the pin#1
of S301 2.85V or 1.8V?
Yes
Resolder S301
No
Change the SIM Card
And try again.
Does it work
Properly?
Change the U102
No
Voltage output
of VSIM LDO (TP1)
Is 2.85V?
redownload SW.
Does it work
Properly?
No
SIM card is properly working.
Yes
Change the main board
No
- 92 -
4. TROUBLE SHOOTING
Figure 4.14
4.12 Micro SD (uSD) Trouble
R308 51
2
0
3
R
K
0
1
R309 51
R310 51
R311 51
R312 51
R313 51
3
0
3
R
K
0
1
4
0
3
R
K
0
1
5
0
3
R
K
0
1
6
0
3
R
K
0
1
1
0
3
D
Z
1
0
3
A
V
2
0
3
A
V
4
0
3
A
V
5
0
3
A
V
470
R307
C310
1u
0
6
2
3
R
VDD_IO_1V8
VMMC_2V85
R301
470K
6
0
3
A
V
CN301
14
13
12
11
10
8
7
6
5
4
3
2
1
9
SW1
SW2
3
1
3
A
V
DNI
C311 I
N
D
4
1
3
R
MSD_CLK
MSD_DET_N
MSD_D[1]
MSD_D[0]
MSD_CMD
MSD_D[3]
MSD_D[2]
Micro_SD
TP1
TP2
TP3
R301(TP2)
VA313(TP3)
C310(TP1)
4. TROUBLE SHOOTING
- 93 -
START
Micro SD Detect
OK?
No
Replace Micro SD Card
Yes
Yes
Re-download SW
Check out MC_CLK &
Data Timing(TP3) OK?
Re-attach or
Replace CN301
No
uSD_DET(R301(TP2))
Is High?
No
Check the
C310(TP1) = 2.8V?
Change U201
No
Yes
Yes
Micro SD Card will
work properly
Yes
- 94 -
4. TROUBLE SHOOTING
Figure 4.16.1
4.13 Bluetooth Trouble
C709
DNI C708
12n
2.7n
C714
3.3n
R703
1n C712
R702
15K
DNI
C713
R704 DNI
C711 1n
U701
BCM2070B2KUBXG
F4
D5
1
A
6
B
7
D
6
E
3
F
6
F
A2
3
A
B3
E3 C3
F2
D2 E5
C2 F5
A4 B4
C4
E4 E2
D4 C1
C6 D1
B2
E1
B5
C5 C7
D6
6
A
7
B
1
B
7
E
7
F
7
A
1
F
3
D
5
A
T
A
B
V
O
D
D
V
2
C
D
D
V
G
E
R
V
X
P
D
D
V
F
R
D
D
V
B
S
U
_
D
D
V
F
T
D
D
V
V
H
G
E
R
V
RES
RFP RST_N
REG_EN
SCL
HUSB_DN
SDA TM2
SPIM_CLK PCM_IN
SPIM_CS_N PCM_OUT
PCM_CLK
LPO_IN PCM_SYNC
XIN UART_TXD
XOUT UART_RXD
UART_RTS_N
GPIO_0 UART_CTS_N
GPIO_1
1
C
D
D
V
HUSB_DP
6
S
S
V
5
S
S
V
4
S
S
V
3
S
S
V
2
S
S
V
1
S
S
V
GPIO_6
GPIO_5
C706
10n
TP701
VDD_IO_1V8
10p
C704
C701
2.2u
VPA_2V85
C703
10p
C702
10n
VDD_IO_1V8
10n
C707
1K R705
TP707
TP711
TP708
TP706
TP709
2450MHz FL701
4 2
3 1
IN OUT
GND1 GND2
2.2u
C705
C710 100p
TP710
TP702
TP703
TP704
TP705
FB701
600
CON_ANT_FEED CON_ANT_FEED
BT_UART_TX
BT_UART_RX
BT_UART_RTS
BT_UART_CTS
BT_PCM_SYNC
BT_PCM_OUT
BT_PCM_IN
BT_PCM_CLK
BT_WAKEUP
RTC_32K
BT_CLK_26M
BT_RST_N
BT_WAKEUP_HOST
BT_CLK_REQ
BT_RF
BTCX_STATUS
BTCX_TXCONF
BTCX_RF_ACTIVE
BT_WIFI
must have 1% tolerance
When power class 1.5 is used, R307 is populated and R308 is depopulated.
(Vice versa for power class 2)
QCT
IFX
VBT_PA_2V6
QCT
IFX
VBT_IO_1V8
VREG_MSMP_2V6
VREG_MSME_1V8
VIO_1V8
VPA_2V85
Class 2 or 1.5
VDD_IO_1V8
C711: TP1
C713: TP2
C708:TP4
C709:TP3
R703 C714
ANT701
C708(TP04)
C709(TP03)
C711(TP01)
U701
VDD_IO_1V8
C713(TP02)
4. TROUBLE SHOOTING
- 95 -
START
Check of BT Ant condition
A condition is good? Replace Ant701
No
Yes
BT will work properly
A condition is good?
Yes
Give the additory solder in
TP3~4(C708,C709,R703,C714)
No
Check Bias Voltage
VDD_IO_1V8
Replace
U701
No
Check condition of matching
components TP3~4(C708,C709)
Yes
Yes
Check RTC32K
TP1 (C711)
Replace
U701
No
Yes
Check BT_CLK_26M
TP2(C713)
Replace
U701
No
- 96 -
4. TROUBLE SHOOTING
4.14 WiFi Trouble
ANT701
C708(TP1)
C703(TP2)
U801
X801
C821 : TP6
C819 : TP4
RTC_32K
R803(TP5)
VDD_IO_1V8
C818 : TP3
U802
4. TROUBLE SHOOTING
- 97 -
L803
DNI
L804
3.3n
U801
EAT61493201
XM2400LV-DL1201TMP
1 1 2101
9
5 46
3 7
2 8
1
VCTL1
RX ANT
GND1 VCTL3
2
C
N
2
X
T
1
C
N
GND2
D
D
V
1
X
T
2L
T
C
V
C807
0.1u
C819 0.1u
VBAT
1u
C825 C824
1u
R803
0
K001
R804
C805
10u
0
R802
218
C
u7.4
VBAT
VDD_TCXO
C823
2.2u
C815
5.6n
R801
15K
FB801
120
26MHz
TG-5010LH-87N
X801
4 2
3 1
NC OUT
GND VCC
10p
C820
C813
15p
VDD_TCXO
10p
C803
10p C801
VDD_3P3
O
D
L
N
L
_
T
U
O
V
U802
2
B
1
J
4
B
3
A
7
F
5
A
1
G
3
D
1
D
4
L
3
L
3
K
1
H
1
L
2
J
1
K
J5
D7
D6
F6
A7
E5
J7
J6
H5
J4
E4
K4
J3
K5
H4
H3
H2
C7
B7
G7
H7
H6
G5
G6
K7
K6
L7
L5
L6
F5
F2
G2
F1
E1
D5
B1
A1
5
C
4
C
2
L
2
K
4
G
3
G
4
F
3
F
3
E
4
A
6
E
2
E
6
C
2
D
6
A
4
D
D
N
G
_
A
N
A
_
F
R
W
D
N
G
_
O
C
V
_
F
R
W
2
D
N
G
_
A
P
_
F
R
W
D
N
G
_
L
A
T
X
_
F
R
W
D
N
G
_
V
R
D
A
P
_
F
R
W
D
N
G
_
E
F
A
_
F
R
W
D
N
G
_
A
N
L
_
F
R
W
1
D
N
G
2
D
N
G
3
D
N
G
4
D
N
G
5
D
N
G
S
S
V
A
_
U
M
P
S
S
V
P
_
R
S
T
U
O
_
O
I
P
G
_
F
R
W
2
P
1
D
D
V
_
T
U
O
_
O
D
L
_
O
C
V
_
F
R
W
WRF_RFIN
WRF_RFOUT
WRF_RES_EXT
RF_SW_CTRL0
RF_SW_CTRL1
RF_SW_CTRL2
RF_SW_CTRL3
SDIO_DATA_2
SDIO_DATA_0/SPI_MISO
SDIO_DATA_1/SPI_IRQ
SDIO_CLK/SPI_CLK
SDIO_DATA_3/SPI_CSX
SDIO_CMD/SPI_MOSI
JTAG_TMS
JTAG_TDO
JTAG_TDI
JTAG_TCK
JTAG_TRST_L
WRF_TCXO_VDD3P3
WRF_XTAL_VDD1P2
VDD1
VDD2
VDDIO
VDDIO_SD
EXT_SMPS_REQ
EXT_PWM_REQ
GPIO_0
WL_RST_N
GPIO_3/BTCX_TXCONF
GPIO_4/BTCX_STATUS
GPIO_5/BTCX_RF_ACTIVE
GPIO_1/BTCX_FREQ
WRF_TCXO_IN
XTAL_PU
OSCOUT
OSCIN
EXT_SLEEP_CLK
2
_
1
T
A
B
D
D
V
_
R
S
2
T
A
B
D
D
V
_
R
S
X
L
V
_
R
S
3
P
3
_
T
U
O
V
1
O
D
L
N
L
_
T
U
O
V
O
D
L
_
D
D
V
O
D
L
C
_
T
U
O
V
D
D
V
_
A
P
_
F
R
W
D
D
V
_
V
R
D
A
P
_
F
R
W
F
R
_
O
I
D
D
V
8
P
1
D
D
V
_
N
I
_
O
D
L
_
O
C
V
_
F
R
W
2
P
1
D
D
V
_
E
F
A
_
F
R
W
2
P
1
D
D
V
_
A
N
L
_
F
R
W
2
P
1
D
D
V
_
A
N
A
_
F
R
W
1
_
1
T
A
B
D
D
V
_
R
S
1
D
N
G
_
A
P
_
F
R
W
18p
C817
0
1
8
C
2.2u
C826
0.1u
u7.4
208
C
VDD_IO_1V8
18p
418
C
K
C
U
B
C
_
T
U
O
V
VDD_CORE
100p C821
VOUT_LNLDO
K
C
U
B
C
_
T
U
O
V
E
R
O
C
_
D
D
V
u
5.
1
1
0
8
L
VDD_IO_1V8
1u
C806
O
D
L
N
L
_
T
U
O
V
O
D
L
N
L
_
T
U
O
V
U803
5
3 2
4 1
VOUT VIN
GND STBY
D
N
G
P
TP804
TP807
TP809
TP810
TP801
TP805
TP803
TP802
TP806
TP808
C822
220n
220n
C816
FB802 600
220n
C808
0.5p
C818
208
L
n9.3
3
P
3
_
D
D
V
3
P
3
_
D
D
V
9
0
8
C
1u
1
1
8
C
2.2u
R805
39K
RTC_32K
BT_RF
BTCX_STATUS
BTCX_TXCONF
SPI_CLK
SPI_MISO
SPI_INT
SPI_CS
SPI_MOSI
WLAN_REG_ON
BTCX_RF_ACTIVE
BT_WIFI
WRF_TX
X
T
_
F
R
W
XTALP
XTALP
RF_SW_CTRL_BT
RF_SW_CTRL_BT
RF_SW_CTRL_RX
X
R
_
L
R
T
C
_
W
S
_
F
R
WLAN_CLK_REQ
WLAN_CLK_REQ
RF_SW_CTRL_TX
RF_SW_CTRL_TX
TCXO LDO WiFi TCXO
U801
X801
TP3
VDD_IO_1V8
TP06 : XTALP
TP05 : RTC_32K
- 98 -
4. TROUBLE SHOOTING
START
Check of Wif Ant condition
A condition is good? Replace Ant701
No
Yes
Wif will
work properly
Yes
Give the addition solder in
(C818:TP3,C819:TP4)
No
Check Bias Voltage
VDD IO 1V8
Replace
U802
No
Check condition of
matching components
C708,C703(TP1,TP2)
Yes
Yes
Check RTC32K
(R806:TP5)
Replace
U802
No
Yes
Check XTAL
(C821:TP6)
Replace
X801
No
4. TROUBLE SHOOTING
- 99 -
Figure 4.17
4.15 FM Radio Trouble
J501
EAG63234901
JAM3333-F36-7H
M5
M4D
M4
M1
M6
FB507
FB503
FB502
C502
27p
VA501
1n
C501
L501
100n
R505
DNI
10
FB501
FB506
HS_GND
FM_LNA_IN
C502:TP1
L501:TP2
VA501:TP3
J 501
I
N
D
1
0
2
D
Z
R217
4.7K
R214
24K
470n
C240
C239
330p
C242 470n
C241
1u
R215
270
5.1
R216
L202
22n
Q202
2
1
3
FM_LNA_OUT
FM_LNA_EN
FM_LNA_IN
FM Radio(LNA)
To Main Chipset!
L202 : TP04
ZD201 : TP06
C242 : TP05
Q202
Q202
VA501 : TP3
L202 : TP4
C502 : TP1
L501 : TP2
ZD201 : TP6
C242 : TP5
- 100 -
4. TROUBLE SHOOTING
START
Check of ear jack condition
A condition is good? Replace J501
No
Yes
FM_radio will
work properly
Yes
Give the additory
solder in (L501,C502,VA501: TP1,2,3)
No
Check condition of matching
components(L501,C502,VA501: TP1,2,3)
Yes
Yes
Replace Q202
No
Yes
Check Bias Voltage
VDD_FMR(C224)
Replace U201
No
Check Bias Voltage FM LNA
(LNA_EN_L202 : TP 04)
4. TROUBLE SHOOTING
- 101 -
4.16 Touch trouble
1n
C230
47p
C233
47p
C235
47p
C234
47p
C232 C231
1n
220n
C236
VDD_IO_1V8
TP204
T12
P13
R12
P15
P14
T15
R15
T14
R14
1
1
F
1
T
8
1
T
8
1
A
1
A
1
1
R
7
A
7
B
0
1
C
0
1
B
0
1
A
0
1
D
0
K
L
C
_
1
S
2
I
X
R
_
1
S
2
I
X
T
_
1
S
2
I
0
A
W
_
1
S
2
I
L
C
S
_
C
2
I
A
D
S
_
C
2
I
F
F
O
N
O
1
C
N
2
C
N
3
C
N
4
C
N
S
F
D
D
V
MICN1
MICP1
MICN2
MICP2
VMIC
VUMIC
ACD
AGND
VREF
2.2K
R212
R211
2.2K
HS_MIC_N
PWRON
HS_MIC_P
MAIN_MIC_P
S
T
R
_
T
R
A
U
_
T
B
S
T
C
_
T
R
A
U
_
T
B
T
U
O
_
M
C
P
_
T
B
N
I
_
M
C
P
_
T
B
I2C_SDA
I2C_SCL
HS_JACK_DET
MAIN_MIC_N
VDDP_DIG1
1
T
N
I
E
6
T
N
I
E
0
T
N
I
E
1
G
I
D
_
P
D
D
V
TP2
TP3
4
0
4
A
V
C416
0.1u
I
N
D
5
0
4
A
V
6
0
4
A
V
I
N
D
GB042-10S-H10-E3000
CN403
6 5
7 4
8 3
9 2
10 1
VTOUCH_3V0
K
7
.
4
2
1
4
R
VA407
VDD_IO_1V8
I2C_SDA
I2C_SCL
TOUCH_ID
TOUCH_INT No7=NC(VDDIO)
No9=NC(reset)
TP1
TP3 : C212
TP2 : C211
TP1 : R412
- 102 -
4. TROUBLE SHOOTING
START
Yes
Resolder CN404 or
replace touch panel
Check I2C signal of U201
R229, R230 (TP3~4)
Yes
Resolder or Replace
U201
No
Check supply voltage of U402
C417 (TP1)
Check touch signal
ZD402~405 (TP5~8)
Resolder or Replace
U402
No
Yes
Check CN404 and
touch panel
contact
Contact well CN404 and
touch panel
No
Touch will work
properly
Yes
4. TROUBLE SHOOTING
- 103 -
4.17 Memory trouble
TP301
B2
K3
K2
K1
J4
A0
A1
A2
A3
A4
NANDD_DDRA[00]
NANDD_DDRA[01]
NANDD_DDRA[02]
NANDD_DDRA[03]
NANDD_DDRA[04]
TP301
TP303
TP304
J1
G2
F2
H2
D3
F8
G8
/CK
CK
CKE
/CS
/RAS
/CAS
DDR_CAS_N
DDR_RAS_N
DDR_CLK_P
DDR_CKE
DDR_CLK_N
DDR_CS_N
TP304
TP301
TP304
- 104 -
4. TROUBLE SHOOTING
START
Check TP301 NANDD_DDRA[00]
of U301
Yes
Resolder or Replace
U301
No
Check Test Point
TP301 TP304
Check TP304 DDR_CS_N
of U301
Resolder or Replace
U301
No
Yes
Memory will work
properly
4. TROUBLE SHOOTING
- 105 -
Process Detail Guide Description
Disassemble
Main Board
1. Disassemble
the main board
from the Phone.
2. Detach gold
gasket tape from
shield-can via
pincette.
Main Board Detach gold gasket tape
Cut of shield
can
1. Cut 4-point of
shield-can that
checked red
quadrangle via
nipper.
2. Flowing iron
through applying
heat. In same
time lift a piece
of shield can with
a pincette.
3. Separated
shield-can throw
away.
Cut 4-points that checked
red quadrangle
Apply heat to
shield-can that
removing part
Shield-can cut
of Main board
Remove
Memory
1. Apply heat via
heat-gun.
2. Pick up
through pincette
when complete
melting solder.
3. Polish-up
around of
Memory IC pad
via Solder paste
for deliberate
mounting
Memory IC.
Melt solder via heat-gun. Polish up Memory IC pad area
- 106 -
4. TROUBLE SHOOTING
Soldering
Memory and
Shield can
1. Ready to
rework new
normal Memory.
2. Be locate
exactly position
via pincette.
3. Apply heat via
heat-gun.
4. Be careful
when using
heat-gun for not
blowing up other
parts.
5. Find out
shield-can and
soldering
Ready to rework
memory
Soldering Memory IC.
Soldering shield
can.
Attaching
gold gasket
and assemble
1. Attach gold
gasket and
remove vinyl
through pincette.
2. Assemble
other parts that
is disassembled
before.
3. Function test
after fnishing
assemble. Attach gold gasket Assemble phone Function test
4. TROUBLE SHOOTING
- 107 -
4.18 Proximity Sensor on/of Trouble Shooting
0
R521
9
3
5
C
u
1
.
0
C534
1u
VDD_IO_1V8
u
0
1
8
3
5
C
U501
EUSY0376201
GP2AP002S00F
5 4
6 3
7 2
8 1
LEDA SCL
LEDC SDA
VCC VIO
VOUT
GND
3
3
5
C
u
7
.
4
R522
10
VPROX_3V0
I2C_SDA
I2C_SCL
PROX_INT
TP3
TP2
TP1
TP1 : VA607 TP2 : VA608
TP3
- 108 -
4. TROUBLE SHOOTING
Proximity Sensor is worked as below :
Call connected -> Object moved at the sensor -> Control the screens on/of operation automatically
START
LCD OFF?
Change the Proximity
Sensor (U501)
No
Call Connected & Object moved at
Proximity Sensor
Check I2C_SCL/SDA & PROX_INT
Change the Main board
No
END
Yes
Work Well?
Yes
No
Yes
Measurement
VREG_MSME_1.8V
VREG_PROX_2.6V
PROX_OUT
PROX_I2C_SCL / SDA
5. DOWNLOAD
- 109 -
5. DOWNLOAD
Oownload lool (GSMULT ver 3.0)
!.Counlry or buyer BPAZL (TMG)
2. SiW ( PV ;{. )
LG-T385
LG-T385
- 110 -
5. DOWNLOAD
OLL (GU280 XXX OLL) OLL (GU280_XXX.OLL)
LG-T385
LG-T385
LG-T385
5. DOWNLOAD
- 111 -
LG-T385
LG-T385
LG-T385
- 112 -
5. DOWNLOAD
Sel Up_USB_Porl Mappnq ver (04)
LG-T385
5. DOWNLOAD
- 113 -
USB Orver (LG USB Modem Orver ver 4.9.4)
- 114 -
5. DOWNLOAD
5. DOWNLOAD
- 115 -
USB Map = ( NFNECN Aqold Seres) p ( q )
LG-T385
- 116 -
5. DOWNLOAD
5. DOWNLOAD
- 117 -
; I; l (MullGSM_V30) ( )
- 118 -
5. DOWNLOAD
LG-T385
LG-T385
LG-T385
LG-T385
LG-T385 LG-T385
LG-T385
LG-T385
LG-T385
5. DOWNLOAD
- 119 -
LG-T385 LG-T385
LG-T385 LG-T385
LG-T385
LG-T385
- 120 -
5. DOWNLOAD
LG-T385
LG-T385
5. DOWNLOAD
- 121 -
LG-T385
LG-T385
- 122 -
6.Block Diagram
32 KHz 26 MHz
ANT
Charge
Pump
Vibrator
LCD_LED_CAl:5
VCAM_lO_lV8
VCAM_DlG_lV8
VCAM_ANA_2V8
2M CAMERA
Hansung
3.2 QVGA
LCD
Capacitive
Touch PaneI
5!MY0007l04
CAM_DATA{0:7]
CAM_PCLK
CAM_H5YNC
CAM_V5YNC
CAM_PWDN
CAM_R5T_N
CAM_MCLK
LCD_D{00:07]
LCD_C5_N
LCD_R5
LCD_WR_N
LCD_R5T_N
LCD_MAKER_lD
LCD_V5YNC_OUT
LCD MAKER lD
Vl_P
RF_H_RXP
RF_L_TX
RF_H_TX
RF_ANT_5EL{0]
RF_ANT_5EL{l]
RF_TX_EN
RF_TX_RAMP
5lM_DATA
5lM_CLK
5lM_R5T_N
PAM
5KY775
50
DuaI-5lM
5ocket
KEY_lN{l]
KEY_lN{3]
KEY_OUT{2]
KEY_OUT{3]
M5D_D{0:3]
M5D_CLK
M5D_CMD
M5D_DET_N
PC5
EG5M
TOUCH_R5T
TOUCH_lNT AnaIog
5witch
NANDD DDRA{00:l5]
LCD_MAKER_lD
RF_H_RXN
RF_L_RXP
RF_L_RXN
l2C_5DA
l2C_5CL
50
5AW
FiIIter
RTC_32K
T_CLK_26M
T_WAKEUP_HO5T
T_CLK_REQ
T_UART_RX/TX
T UART CT5/RT5
DC5
G5M850
EG5M
PROX_lNT
Proximity 5ensor
EU5Y037620l
NANDD_DDRA{00:l5]
DDR_D{00:l5]
DDR_DQM{0:l]
DDR_DQ5{0:l]
DDR_CLK_N
DDR_CLK_P
DDR_RA5_N
DDR_CA5_N
DDR_C5_N
DDR_CKE
T
CM20
702K
UXG
XMM2l5x
PM88l0(AGR+, NAND)
MAlN
EU5Y042940l
T_UART_CT5/RT5
T_R5T_N
T_WAKEUP
T_PCM_OUT
T_PCM_lN
T_PCM_CLK
T_PCM_5YNC
Memory
2G NAND + lG DRAM
and
Pass
FiIIter
TCX_TXCONF
NAND_DDR_WE_N
NAND_ALE_N
NAND_C5_N
NAND_CLE_N
NAND_WP_N
NAND_5Y_N
NAND_RE_N
EAN6l92750l
ATTERY
EAC6l70020l
EU5Y04l870l
AT TEMP
WlFl
CM43
362KU
G
5eperat
-or
XM2400LV-
DLl20l
EAT6l49320l
WRF_TX
RTC_32K
RF_5W_CTRL_T
RF_5W_CTRL_RX/TX
5Pl_Ml5O
5Pl_lNT
5Pl C5
TCX_5TATU5
TCX_RF_ACTlVE
ATTERY
3.7 V / 950 mAh
MlNl A
.
AT_TEMP
UART_TX
UART_RX
U5_DP
U5_DM
MUlC_lNT_N
VU5_LDO_4V9
5PK_H5_L
5PK_H5_R FM_ANT_2
FM_ANT
H5_!ACK_DET
H5_HOOK_DET
H5_MlC_P
H5_MlC_N
MAlN_MlC_P
MAlN_MlC_N
RCV_P
RCV_N
G
EU5Y043440l
26 MHz
5Pl_C5
5Pl_MO5l
5Pl_CLK
WLAN_CLK_REQ
WRAN_REG_ON
MUlC_lO_M
MUlC lO P
RT9396
(MUlC
+ Charge lC)
5peaker
AUDlO
5U5Y5TEM
TPA2055D3
EU5Y042000l
H5_OUT_L, H5_OUT_R 5PK_P, 5PK_N
MlC
3.5 Pl Earjack
RECElVER
Micro U5
5Pin
Connector
TA/U5/UART/Factory
MUlC_lO_P
MUlC_ACC_lD
EU5Y042000l
6. BLOCK DIAGRAM
- 123 - Copyright 2012 LG Electronics. Inc. All right reserved.
LGE Internal Use Only
7. CIRCUIT DIAGRAM
n8.1
931
C
L112
5.6n
C110 3.3n
R102
12
L106
1.8n
1.8n
L110
C109 2.2n
1
R107
ANT103
HJ-BCT-04Y
1
701L
n8.6
C112
1.2p
U101
SKY77550-21
9
2
3
2
4
2
5
2
6
2
7
2
8
2
15
16
17
18
19
20
21
22
8
7
6
5
4
3
2
1
4
1
3
1
2
1
1
1
0
19
N
I
_
B
L
_
x
T
N
I
_
B
H
_
x
T
N
E
_
W
S
V
S
B
1
D
V
S
R
2
D
V
S
R
GND1
GND2
VBATT1
VBATT2
GND3
GND4
GND5
GND6
GND7
Rx2
RSVD3
Rx1
RSVD
TxEN
VRAMP
GND8
9
D
N
G
0
1
D
N
G
T
N
A
1
1
D
N
G
2
1
D
N
G
3
1
D
N
G
D
N
G
P
L105
0.5p
C113
27n
0
L101
FL101
10 5
8
3
7 2
6
4
9
1
U_P_1960/
B_P_1960/1842_5MHz_2
U_P_1842_5/
B_P_942_5/881_5MHz_1
GND1 B_P_942_5/881_5MHz_2
GND2
B_P_1960/1842_5MHz_1
GND3 GND4
942_5MHz
881_5MHz
C111
DNI
HJ-ICT-03Y
ANT102
FEED
HJ-ICT-03Y
ANT101
FEED
L111 10n
10n L114
L109
0.75p
0.5p
C114
401L
n8.1
SW101
4 3
2
1
ANT COMMON
G3 G4
DNI
L138
DNI
L139
C116
39p 39p
C115
39p
C117
C108
33u
DNI
L108
C107
15p
C102
33p
C104
DNI
C101
33p
C103
DNI
VBAT
1K R104
C106
10n
C105
39p
L103
DNI
L113
DNI
L102
DNI
RF_HB_TX
RF_LB_TX
RF_HB_RXN
RF_LB_RXP
RF_TX_EN
RF_ANT_SEL[0]
RF_ANT_SEL[1]
RF_TX_RAMP
ANT_FEED
ANT_FEED
RF_HB_RXP
RF_LB_RXN
RF
HIGH
LOW
(50V,J,NP0)
GSM850 / DCS
HIGH
BS
(10V,2012)
1-0-1-2 ANT_PAD_Ver1.0
LOW
LOW
LOW
HIGH
HIGH
MODE
STANDBY
RX1
RX2
850/900 TX
DCS/PCS TX
VSW_EN
LOW
HIGH
HIGH
HIGH
HIGH
Tx Enable
LOW
LOW
EGSM / PCS
(16V,K,X7R)
7. CIRCUIT DIAGRAM
7. CIRCUIT DIAGRAM
CN201
9
8
7
6
5
4
3
2
1
C237
22p
C238
27p
Q201
1
2
3
DNI
C245
C223
DNI
IND
102DZ
X201 TSX-3225
26MHz
2 1
3 4
GND2 HOT2
HOT1 GND1
R213
0
470n
C219
VDDTRX
342
C
p5.7
1n
C230
47p
C233
47p
C235
47p
C234
47p
C232
C229
47p 47p
C228 C227
DNI
C226
DNI
VDD_IO_1V8
C231
1n
VMIC_BIAS_P
220n
C236
442
C
p5.7
VDD_IO_1V8
100K
R209
100K
R210
812R
01
2V85_VSIM
0.1u
C225
4.7n C224
FB201
75
VBAT
VRF1 VDDRF2 VUSB VMMC_2V85
VPA_2V85 VBAT_RF2
VPMU
VDD_IO_1V8
VDD_IO_1V8
VDD_IO_1V8
SC201
1
SC202
1
VDD_IO_1V8
VBAT
10u C222
VAUD_HS_BIAS
TP206
TP205
22u
C221
TP207
R205
5.6K
3.9K
R203
VDDXO
VBAT
L201
3.3u
R204
100K VDDMS VCORE
K7.4
602R
470
R202
VDD_IO_1V8
C220
1u
VBACKUP_BAT
VBACKUP_BAT
TP204
102R
0
VDDTDC
VDD_IO_1V8
VDD_IO_1V8
VCORE
2.2u
C202
VDD_IO_1V8
VDD_IO_1V8
VUSB VBAT VCORE VDDMS VDDTRX
VDD_IO_1V8
0.1u
C216
VDD_IO_1V8
VDDRF2 VDDTDC VMMC_2V85
VDD_IO_1V8
VRF1
0.1u
C206
VPA_2V85
C203
0.1u C214
1u
VDDXO
C211
4.7n
C205
470n
VBAT_RF2
1u
C218
C213
47n
C212
47n
VPMU
C217
0.1u
VBAT
1u
C208 0.1u
C201
C207
220n C210
220n
470n
C204
C209
18p 1u
C215
R217
4.7K
U201
8K 7T 8R 9M 6T 8M 8L
21L
71C
71F
21H
51G
11M 9L
41F
01P
41E
61G
81R
41B
31E
51H
41G
51A
21J
51F
61F
71P
61P
01G
01K 7R
1 1J
11H
01F 3A
11T
21P 8H 6P 6F 9K
11G
01N
81P
31L
61L 9R 9T 8T 9P
T12
P13
R12
P15
P14
T15
R15
T14
R14
N17
N18
T16
R16
M18
M17
K17
P11
P4
J4
T2
J5
G1
L4
J3
L2
P5
P2
J8
T5
P1
T4
R6
R2
N2
B1
A2
G6
H4
H2
G2
G3
H3
H1
H6
K4
K2
J1
K3
L3
J2
M2
L1
M3
R1
P7
N6
N4
L5
M5
T3
R4
R3
P3
M1
M4
N3
N5
R5
L11
K12
L10
G12
H13
J13
F13
G13
C6
J14
J15
K18
H17
H18
G18
J18
J17
H14
E1
G4
G5
F2
F3
F1
D2
D1
E2
M10
A13
B13
K14
K13
B4
A5
B5
A4
J10
H9
J9
H10
B16
C14
B17
B18
C15
B15
C16
E18
F18
C18
D18
A16
A17
R17
T17
M13
M12
N13
R13
T13
N14
11F
1T 81T
81A
1A 11R
7A 7B 01C
01B
01A
01D
6B 51L
71L
81L
6A 01R
01T
21F
11E
11C
11B
11D
21E
21D
21C
21B
21A
11A
8E 9G 8F 9E 9F 8G 01E
9C 8C 9B 9A 7C 8B 8A 2B 2C 4E 6D 5C 5E 5F 1C 4D 3B 3C 4C 5D 4F 3 D 3E
0D_F I D
1D_FI D
2D_FID
3D_FID
4D _FID
5 D_FI D
6D_FID
7D_FID
8D _FI D
1S C_F ID
DC_FID
RW_FID
D R_FI D
D H_FI D
DV_FID
TESER_F ID
0D _FI C
1D _FI C
2D_F IC
3D_F IC
4D _FI C
5D _FI C
6D_F IC
7D_FIC
KLCP _FI C
C NYS H_F IC
CNYSV_FIC
2TUOKLC
DP_FIC
TESER_FIC
0NI_PK
1NI_PK
2NI_PK
3NI_PK
4NI_PK
5NI_PK
0TUO_PK
1TUO_PK
2TUO_PK
3TUO_PK
5TUO_PK
BIV
BIV_SSV
0TUOKLC
K23F
K 23C SO
N_TESER
NI2T
0KLC_1S2I
XR_1S2I
XT_ 1S2I
0AW_1S2I
LCS_C2I
ADS _C2 I
FFONO
1C N
2CN
3CN
4CN
SFDDV
M0
M1
M2
VDD_FMR
FMRIN
FMRINX
CP1
CP2
TX1
FE2
RX12
RX12X
RX34
RX34X
VDET
PABS
PABIAS
FE1
TX2
PAEN
VDDTRX
USIF2_TXD_MTSR
USIF2_RXD_MRST
USIF2_RTS_N
USIF2_CTS_N
USIF1_TXD_MTSR
USIF1_RXD_MRST
USIF1_RTS_N
USIF1_CTS_N
DPLUS
DMINUS
XOX
XO
VSIM
SIM_IO
SIM_CLK
SIM_RST
MMCI_CMD
MMCI_DAT_0
MMCI_CLK
MMCI_DAT_1
MMCI_DAT_2
MMCI_DAT_3
SWIF_TXRX
TDO
TDI
TMS
TCK
TRST_N
TRIG_IN
MON1
MON2
MON3
FSYS1
FSYS2
DIGUP_CLK
DIGUP1
DIGUP2
LEDFBN
LEDFBP
LEDDRV
A_D0
A_D1
A_D2
A_D3
A_D4
A_D5
A_D6
A_D7
A_D8
A_D9
A_D10
A_D11
A_D12
A_D13
A_D14
A_D15
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
FWP
FCDP_RBn
CS0_n
CS1_n
CS2_n
ADV_n
RD_n
WR_n
WAIT_n
RAS_n
CAS_n
BC0_n
BC1_n
BC2_n
BC3_n
SDCLKO
BFCLKO_0
BFCLKO_1
CKE
ANAMON
FSYS_EN
EPN
EPP
HSL
HSR
LSN
LSP
MICN1
MICP1
MICN2
MICP2
VMIC
VUMIC
ACD
AGND
VREF
1D S_D DV
BF_1DS
1DS_SSV
WS 1DS
1S MSS V
2SMSSV
PSTABV
U MP_ TABV
1OIDDV
2OIDDV
1 UBE _DD V
2UBE_DDV
LLD_DDV
UM PV
UM P_S SV
1EROCSSV
2EROCSSV
3 ERO CSSV
4 ERO CSSV
5EROCSSV
ER OCV
E ROCDDV
PC8V1DDV
RSLSSV
XRTSSV
XRSSV
18V1DDV
PMARV
GID_SSV
SMDDV
OXDDV
CDTDDV
GENDDV
TABV
OCDSSV
XUAV
OXSSV
CMMV
BSUV
2FRDDV
1FRV
OL _SSV
FRSSV
CTRV
NESNES
PESNES
GH CDD V
SCBSC
GHCV
TNHSV
R214
24K
470n
C240
C239
330p
2.2K
R212
R211
2.2K
C242 470n
C241
1u
R215
270
5.1
R216
L202
22n
Q202
2
1
3
BAT201
SMZY0023501
311HR-VG1
X202
NX3215SA
32.768KHz
2 1
]0[
A
T
A
D_
M
A
C
]1[
A
T
A
D_
M
A
C
] 2[
A
T
A
D_
M
A
C
]3[
A
T
A
D_
M
A
C
]4[
A
T
A
D_
M
A
C
]5[
A
T
A
D_
M
A
C
] 6[
A
T
A
D_
M
A
C
]7[
A
T
A
D_
M
A
C
C
N
Y
S
H_
M
A
C
KL
C
P_
M
A
C
C
N
Y
S
V_
M
A
C
K
L
C
M
_
M
A
C
S
R_
D
CL
HS_MIC_N
USB_DP
USB_DM
PWRON
UART_TX
SIM_DATA
SIM_CLK
HS_MIC_P
MSD_CLK
N_
T
E
D_
D
S
M
MSD_D[1]
MSD_D[0]
MSD_CMD
MSD_D[3]
MSD_D[2]
MAIN_MIC_P
N_
S
C_
D
CL
DDR_CAS_N
DDR_RAS_N
DDR_DQS[1]
DDR_DQS[0]
DDR_DQM[0]
DDR_DQM[1]
NAND_BSY_N
NAND_CS_N
DDR_D[15]
DDR_D[05]
DDR_D[01]
DDR_D[02]
DDR_D[00]
DDR_D[14]
DDR_D[13]
DDR_D[12]
DDR_D[11]
DDR_D[10]
DDR_D[09]
DDR_D[08]
DDR_D[07]
DDR_D[06]
DDR_D[04]
DDR_D[03]
BT_UART_TX
BT_UART_RX
UART_RX
VUSB_LDO_4V9
S
T
R_
T
R
A
U_
T
B
S
T
C_
T
R
A
U_
T
B
RF_HB_TX
RF_LB_TX
RF_HB_RXN
RF_LB_RXP
RF_TX_EN
BAT_TEMP
BT_PCM_SYNC
T
U
O_
M
C
P_
T
B
NI_
M
C
P_
T
B
BT_PCM_CLK
T
U
O_
C
N
Y
S
V _
D
CL
P
U
E
K
A
W_
T
B
K23_
C
T
R
LCD_RST_N
BT_CLK_26M
BT_RST_N
T
S
O
H_
P
U
E
K
A
W_
T
B
BT_CLK_REQ
I2C_SDA
I2C_SCL
N
D
W
P_
M
A
C
N_
T
S
R_
M
A
C
SPI_CLK
SPI_MISO
SPI_INT
S
C
_
I
P
S
SPI_MOSI
DI_
D
CL
]3[
NI_
Y
E
K
]2[
T
U
O _
Y
E
K
N_
R
W_
D
CL
N_
T
E
S
E
R
RESET_N
JTAG_TRST_N
JTAG_TRST_N
JTAG_TDI
JTAG_TDI
JTAG_TMS
JTAG_TMS
JTAG_TCK
JTAG_TCK
JTAG_TDO
JTAG_TDO
P_
BI
V
]7 0[
D_
D
CL
] 60[
D_
D
CL
]50[
D_
D
C L
]40[
D_
D
CL
]30[
D_
D
CL
]20[
D_
D
CL
]10[
D_
D
CL
]00[
D_
D
CL
N_
T
NI_
CI
U
M
TOUCH_ID
]1[
NI_
Y
E
K
HS_JACK_DET
SPK_HS_L
SPK_HS_R
WLAN_REG_ON
RF_ANT_SEL[0]
RF_ANT_SEL[1]
RF_TX_RAMP
RF_HB_RXP
RF_LB_RXN
FM_LNA_OUT
FM_LNA_OUT
T
NI_
H
C
U
O
T
T
E
D_
K
O
O
H_
S
H
L
E
S
_
T
S
R
_
M
I
S
SIM_SEL
NAND_DDR_WE_N
NANDD_DDRA[00]
NANDD_DDRA[01]
NANDD_DDRA[10]
NANDD_DDRA[11]
NANDD_DDRA[12]
NANDD_DDRA[13]
NANDD_DDRA[14]
NANDD_DDRA[15]
NANDD_DDRA[02]
NANDD_DDRA[03]
NANDD_DDRA[04]
NANDD_DDRA[05]
NANDD_DDRA[06]
NANDD_DDRA[07]
NANDD_DDRA[08]
NANDD_DDRA[09]
DDR_CLK_P
NAND_WP_N
DDR_CKE
NAND_ALE_N
NAND_RE_N
NAND_CLE_N
DDR_CLK_N
DDR_CS_N
SIM_RST_N
MAIN_MIC_N
L
R
T
C_L
B_
D
CL
RCV_HS_N
RCV_HS_P
T
NI_
X
O
R
P
FM_LNA_EN
N
E_
A
NL_
M
F
D
R_
D
CL
FM_LNA_IN
VDD_EBU
PIN N10
PIN K9
DBB SUPPLIES ABB SUPPLIES
PIN_G15 PIN_G16 PIN_E13 PIN_B14
PIN G11 PIN F6,P6
PIN P12 PIN P16
VBAT_PMU
(10V)
RF SUPPLIES (CLEAN GND)
PIN P10 PIN L9 PIN M11 PIN K10
PMU SUPPLIES
RF SUPPLIES (DIRTY GND)
PIN_B16 PIN_H15
VDD_IO1 VDD1V8CP
VBATSP
VDD_IO2 Speaker Supply
Seperate and shield
PIN_H12
(10V)
(1%)
2-5-1-2_IFX_XMM215x_NAND_V0.1
FM Radio(LNA)
Close to the 26MHz XTAL
INT PORT
BT_DBB_INT
DIF_RESET
EINT4
USIF1_CTS_N _CHG_EOC
SLIDE T2IN
SIGNAL NAME
DIGUP2
MUIC_INT CC0CC1IO
EINT7
CC1CC6IO
EINT0
PIN NAME
uSD_DET
USIF1_RTS_N
VDDP_EBU
ABB
VDDP_DIG1
1T
NIE
FOR ESD (LCD - TOP Contact)
6T
NIE
0T
NIE
0T
NIE
CT
R_
D
DV
4T
NIE
VDDP_DIG1
OI3
C
C1
C
C
6 T
NIE
VDDP_DIG1
0T
NIE
1T
NIE
OI0
C
C1
C
C
OI4
C
C0
C
C
OI4
C
C1
C
C
5T
NIE
VDDP_SIM
VDDP_MMC
VDDP_DIG1
RF
CC0CC1IO
CC0CC7IO
EINT4/EINT1
VDDP_DIG1
EINT3
EINT2
CC1CC6IO
ABB
RF
VDDP_ULPI
RF
VDDP_DIG2
7T
NIE
1
GI
D_P
D
DV
1
GI
D_P
D
DV
Shield Can Super Cap
To Main Chipset! VDDP_DIG1
AGR+MCP
PAM
VDDP_DIG1
VDDP_EBU
7. CIRCUIT DIAGRAM
R308 51
203R
K01
R309 51
R310 51
R311 51
R312 51
R313 51
303R
K01
403R
K01
503R
K01
603R
K01
C318
33p
C323
33p
C320
33p
33p
C317 C316
33p 33p
C315
103DZ
203DZ
103AV
203AV
403AV
503AV
713R
K7.4
0.1u
C321
C304
33p
33p
C305
S301
5000-12P-2_95D-A1-R0
EAG63211701
C7
41
C1_1
51
C1
31
C3_1
C6
C2
C5
C5_1
C2_1
C3 C7_1
C6_1
61
6DN
G
VPP2
I/O2 CLK1
RST2
GND2
GND1
RST1
VPP1
CLK2
3DN
G
VCC1
5DN
G
VCC2
4DN
G
I/O1
K001
223R
470
R307
C310
1u
VA308
VA309
VA312
VA311
VA310
C301
4.7u
TP301
TP302
813R
K7.4
TP303
TP304
TP305
2V85_VSIM 2V85_VSIM
FSA2259UMX
U302
EUSY0186504 6
5
7
4
8
3
9
2
10
1
CCV
2B1
1B1
2A
1A
S2
S1
0B2
1B0
DN
G
2V85_VSIM
R325
100K
0
623R
VDD_IO_1V8
VMMC_2V85
100K
R324
R301
470K
2V85_VSIM
603
A
V
2V85_VSIM
0.1u
C319
CN301
14
13
12
11
10
8
7
6
5
4
3
2
1
9
SW1
SW2
C322 1u
313
A
V
R321
10K
DNI
C311 IND
413R
10K
R323
2V85_VSIM
IND
723R
C302
0.1u
C303
0.1u
C312
0.1u
C313
0.1u 0.1u
C314
C306
4.7u
C309
0.1u
C308
0.1u 0.1u
C307
VDD_IO_1V8
VDD_IO_1V8
VDD_IO_1V8
913R
K01
VDD_IO_1V8
U301 EAN61927501
H9DA2GH1GHMMMR-46M
B6
B3
B4
A4
A7
A3
A6
M8
L7
M7
N5
N4
M4
N3
N2
L8
M6
L6
N7
L5
M3
M2
M1
H7
D5
H8
D7
J1
G2
F2
H2
D3
F8
G8
B7
B8
C7
C8
C6
D8
C5
E6
J5
J7
K8
J8
K7
K6
K5
K4
J2
H3
E1
E2
J3
C4
D2
C3
D1
C2
B2
K3
K2
K1
J4
N9
N6
M10
L9
L2
K10
J10
H9
H1
G9
F10
E9
D10
C9
B10
B5
B1
A9
M5
A5
L4
L3
J6
H6
H5
H4
G7
G6
G5
G4
G3
F7
F6
F5
F4
F3
F1
E8
E7
E5
E4
E3
D6
D4
A2
M9
L10
K9
J9
H10
F9
E10
D9
C10
B9
N8
L1
G10
G1
C1
A8
0
1
N
1
N
0
1
A
1
A
1
C
N
6
2
C
N
8
2
C
N
9
2
C
N
VDD1
VDD2
VDD3
VDD5
VDD4
VDD6
VDDQ1
VDDQ6
VDDQ5
VDDQ4
VDDQ10
VDDQ9
VDDQ2
VDDQ8
VDDQ7
VDDQ3
NC27
NC20
NC21
NC9
NC19
NC8
NC11
NC12
NC17
NC18
NC7
NC16
NC25
NC6
NC10
NC5
NC13
NC14
NC4
NC2
NC24
NC22
NC23
A13
NC3
VCC1
VCC2
VSS1
VSS4
VSS8
VSSQ5
VSSQ4
VSSQ9
VSSQ8
VSSQ3
VSS2
VSS3
VSSQ10
VSSQ1
VSSQ2
VSS5
VSSQ6
VSSQ7
VSS6
VSS7
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
BA0
BA1
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
/CK
CK
CKE
/CS
/RAS
/CAS
/WED
UDQM
LDQM
UDQS
LDQS
IO0
IO1
IO2
IO3
IO4
IO5
IO6
IO7
IO8
IO9
IO10
IO11
IO12
IO13
IO14
IO15
/CE
/RE
/WE
CLE
ALE
/WP
R/B
SIM_DATA
SIM_CLK
SIM_CLK
MSD_CLK
MSD_DET_N
MSD_D[1]
MSD_D[0]
MSD_CMD
MSD_D[3]
MSD_D[2]
DDR_CAS_N
DDR_RAS_N
DDR_DQS[1]
DDR_DQS[0]
DDR_DQM[0]
DDR_DQM[1]
NAND_BSY_N
NAND_CS_N
DDR_D[15]
DDR_D[05]
DDR_D[01]
DDR_D[02]
DDR_D[00]
DDR_D[14]
DDR_D[13]
DDR_D[12]
DDR_D[11]
DDR_D[10]
DDR_D[09]
DDR_D[08]
DDR_D[07]
DDR_D[06]
DDR_D[04]
DDR_D[03]
SIM_RST_SEL
SIM_SEL
NAND_DDR_WE_N
NAND_DDR_WE_N
NANDD_DDRA[00]
NANDD_DDRA[00]
NANDD_DDRA[01]
NANDD_DDRA[01]
NANDD_DDRA[10]
NANDD_DDRA[10]
NANDD_DDRA[11]
NANDD_DDRA[11]
NANDD_DDRA[12]
NANDD_DDRA[12]
NANDD_DDRA[13]
NANDD_DDRA[13]
NANDD_DDRA[14]
NANDD_DDRA[14]
NANDD_DDRA[15]
NANDD_DDRA[15]
NANDD_DDRA[02]
NANDD_DDRA[02]
NANDD_DDRA[03]
NANDD_DDRA[03]
NANDD_DDRA[04]
NANDD_DDRA[04]
NANDD_DDRA[05]
NANDD_DDRA[05]
NANDD_DDRA[06]
NANDD_DDRA[06]
NANDD_DDRA[07]
NANDD_DDRA[07]
NANDD_DDRA[08]
NANDD_DDRA[08]
NANDD_DDRA[09]
NANDD_DDRA[09]
DDR_CLK_P
NAND_WP_N
DDR_CKE
NAND_ALE_N
NAND_RE_N
NAND_CLE_N
DDR_CLK_N
DDR_CS_N
SIM_DATA_1
SIM_DATA_1
SIM_RST_N
SIM_DATA_2
SIM_DATA_2
SIM_RST_2
SIM_RST_2
DAT1
SIM Switch
SIM_CONNECTOR Dual
T8
DAT0
Micro_SD
8-3-1-2_Push_168T_Ver1.0
T5
T4
T3
If Dual SIM, R327=DNI and U302=Insert.
T2
T1
If single SIM, R327=0ohm and U302=DNI.
Pin Number
MCP2-1_2G_1G DDRx16_hynix
VSS
CLK
VDD
CMD
CD/DAT3
DAT2
Description
T7
MSD_DET_N
T6
High
Low Insert
No card
7. CIRCUIT DIAGRAM
U401
EAN62339701
LP8727-B
C5
D2
B5
D3
D1
E1
E2
E3
E5
E4
A1
C1
B1
A4
A5
A3
A2
D5
4
D
4
C
3
C
2
C
2
B
3
B
4
B
L
C
S
A
D
S
T
N
I
1
D
N
G
2
D
N
G
3
D
N
G
4
D
N
G
BATT2
DN
DP
U1
U2
AUD1
AUD2
MIC
VBUS1
VBUS2
D-
D+
ID
RES
DSS
EXPDET
CAP
BATT1
C401
1u
TP401
TP416
TP415
33p
C417
40 4
AV
C416
0.1u
C418
DNI
104L
n65
56n
L402
C406
47u
CN402
3
2
1
D1
D2
TP414
TP413
TP412
TP411
TP410
TP409
TP408
TP407
TP406
TP405
TP404
TP403
TP402
TP417
TP420
TP419
TP418
IN D
50 4
AV
60 4
AV
I ND
ZD401
C407
33p
04-5161-005-101-868+
EAG63149901
CN401
11
10
9
5
4
3
2
1
8
7
6
GB042-10S-H10-E3000
CN403
6 5
7 4
8 3
9 2
10 1
R410
2.2K
ZD402
10K
R402
4 14
C
u1
C410
22pF
VB401
2
1
1u
C412
CN404
3
2
1
FB401 1800
2.2u
C409
VA403
C402
22pF
ZD404
VTOUCH_3V0
K 7.4
214
R
R407 10
VDD_IO_1V8
VA401
ZD403
VBAT
VUSB_CHG_IN
R405 10
680 R421
CN405
4
3
2
1
R403
51K
R409
100K
VA407
R419 680
VDD_IO_1V8
VA409 VA408
6.8K
R413
C415
0.1u
VA402
VBACKUP_BAT
680 R420
FL401
IN OUT
GND1 GND2
C408
10n
10
R408
R401
47K
R406 10
u1
31 4
C
VDD_IO_1V8
VBAT
C411
1u
1u
C405
33p
C404
R418
100K
1K
R417
USB_DP
USB_DM
PWRON
UART_TX
MUIC_ACC_ID
MUIC_ACC_ID
UART_RX
VUSB_LDO_4V9
BAT_TEMP
I2C_SDA
I2C_SDA
I2C_SCL
I2C_SCL
KEY_IN[3]
KEY_OUT[2]
VIB_P
MUIC_IO_P
MUIC_IO_P
MUIC_IO_M
MUIC_IO_M
MUIC_INT_N
TOUCH_ID
KEY_IN[1]
TOUCH_INT
ESD GND
SIDE KEY INTERFACE
SEND
Line Width: 2mm
X
MINI ABB ( MUIC + CHARGE ID)
(1%)
MOTOR
KEY_OUT2 KEY_OUT3
CLR
4-5-1-1 Battery Connector 4-2-3-1 Micro-USB 5pin normal
END Vol_UP
Vol_down
KEY_IN3
KEY_IN1
No7=NC(VDDIO)
KEY_IN0
C-Touch Connector
DNI
DNI
No9=NC(reset)
POWER ON
7. CIRCUIT DIAGRAM
Q501
KTJ6131V 1
3
2
G
D
S
4.7
R507
R506
4.7
0
R521 10u
C526
C506
560p 560p
C509
U502
NCS2200SQ2T2G
2
3
1
4 5
VCC
VIN-
OUT VIN+ GND
525R
M1
625R
K022
47
R527
C541
120p
825R
K001
VDD_IO_1V8
C510 0.1u
0.1u C515
935C
u1.0
C540
39pF
J501
EAG63234901
JAM3333-F36-7H
M5
M4D
M4
M1
M6
ZD503
VA503 VA502
C522 22n
VDD_IO_1V8
10
R504
ZD502
K2.2
915R
C532 33n
12 R508
R509 12
1u C507
C508 1u
D501
415R
K 1
L504
0
D502
0 315R
R517
100 33n C529
39p
C537
100
R518
1800 FB507
600
FB505
ZD501
FB504 600
39p
C536
VMIC_BIAS_P
C535
39p
515R
K2 .2
FB503 1800
FB502 1800
C502
27p
VA501
47K
R501
SUMY0003816
OBM-410L44-RC1882
MIC501
2
1
C517
2.2u
39pF
C531
1n
C501
R523
DNI
C534
1u
VDD_IO_1V8
C514
39p
u0 1
8 35C
CN501
EAB62429501
2
1
M501
3D 1C 2E 2A
C2
B2
B4
A4
B3
E1
A3
D1
A1
C3
B1
E4
E3 C4
4D 2D
DDVPH
DDVPS
IN3- OUT+
OUT-
HPL
IN3+
HPR
CP
IN1+
CN
IN1-
IN2+
IN2-
SDA
SCL
SAIB
DDVPC
SSVPC
D N
G
C513
39p
2 05R
0
U501
EUSY0376201
GP2AP002S00F
5 4
6 3
7 2
8 1
LEDA SCL
LEDC SDA
VCC VIO
VOUT GND
39p
C527
C518
2.2u
025R
0
L501
100n
ZD504
C525
47p 47p
C524
335C
u7.4
R505
DNI
R522
10
VPROX_3V0
R512
2.2K
C528
39p
1.5K
R511
C523
2.2u
C521
39pF
L505
0
C520
22n
VAUD_HS_BIAS
C516
2.2u
R524
1K
C519
2.2u
C503
10u
2.2u C505
VBAT
10
FB501
1800 FB506
R503
220K
0.1u
C504
DNI
C530
VDD_IO_1V8
HS_MIC_N
HS_MIC_P
MAIN_MIC_P
HS_OUT_R
HS_OUT_R
HS_OUT_L
HS_OUT_L
HS_GND
HS_GND
HS_GND
HS_GND
I2C_SDA
I2C_SDA
I2C_SCL
I2C_SCL
HS_JACK_DET
SPK_P
SPK_P
SPK_N
SPK_N
SPK_HS_L
SPK_HS_R
HS_MIC
HS_MIC
HS_HOOK_DET
MAIN_MIC_N
RCV_HS_N
RCV_HS_P
PROX_INT
FM_LNA_IN
SPEAKER
MAIN MIC Proximity Sensor
3.5pi HEADSET
AUDIO SUBSYSTEM
7. CIRCUIT DIAGRAM
VA601
1u
IND
606AV
15pF
FL605
01 5
6 4
7 3
8 2
9 1
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1
G
2
G
FL604
15pF
01 5
6 4
7 3
8 2
9 1
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1
G
2
G
FL603
15pF
015
6 4
7 3
8 2
9 1
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1
G
2
G
FL602
15pF
01 5
6 4
7 3
8 2
9 1
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1
G
2
G
15pF
FL601
01 5
6 4
7 3
8 2
9 1
INOUT_A1 INOUT_B1
INOUT_A2 INOUT_B2
INOUT_A3 INOUT_B3
INOUT_A4 INOUT_B4
1
G
2
G
216 C
u1.0
u 1.0
3 16C
416C
u1.0
C607
18p
R612 47
47 R613
R614 47
LD602
LD603
LD601
C621
1u
1u
C622
C617
7.5p
10 6R
0
7.5p
C620
U601
24
23
22
21
20
19
18
8
7
6
5
9
4
10
3
11
2
12
1
3141516171
LCS
ADS NE
M
WP FC
DN
GP
LDO1
N2C
LDO2
N1C
LDO3
P1C
LDO4
P2C
AGND
VIN
LDOIN
LED6
LED5
LED4
LED3
LED2
LED1
VOUT
R618
100
VPROX_3V0
VTOUCH_3V0
VCAM_DIG_1V8
7.5p
C618
7.5p
C616
R617
100
5 06R
0
106
BF01
VCAM_IO_1V8
R620 0
VBAT
C603
2.2u
TP603
C619
1u
100K
R604
100K
R610
706AV
806AV
R602
DNI
606R0
0 R619
VCAM_DIG_1V8
VCAM_IO_1V8
VCAM_ANA_2V8
0 R608
50 6AV
0 R609
40 6AV
DNI
R603
2.2u
C610
VA602
TP602
R616
10
VPA_2V85
VDD_IO_1V8
CN602
13 12
14 11
15 10
16 9
17 8
18 7
19 6
20 5
21 4
22 3
23 2
24 1
C604
1u
C605
2.2u
VCAM_ANA_2V8
1u
C608
1u
C609 C611
1u
1u
C601
C602
1u
VBAT
100K
R611
CN601
21 20
22 19
23 18
24 17
25 16
26 15
27 14
28 13
29 12
30 11
31 10
32 9
33 8
34 7
35 6
36 5
37 4
38 3
39 2
40 1
1u
C606
CAM_DATA[0]
CAM_DATA[1]
CAM_DATA[2]
CAM_DATA[3]
CAM_DATA[4]
CAM_DATA[5]
CAM_DATA[6]
CAM_DATA[7]
CAM_HSYNC
CAM_PCLK
CAM_VSYNC
CAM_MCLK
LCD_RS
VBAT
LCD_LED_CA5
LCD_LED_CA5
LCD_LED_CA4
LCD_LED_CA4
LCD_LED_CA3
LCD_LED_CA3
LCD_LED_CA2
LCD_LED_CA2
LCD_LED_CA1
LCD_LED_CA1
LCD_PWM
LCD_PWM
LCD_CS_N
LCD_VSYNC_OUT
CAM_F_DATA[6]
CAM_F_DATA[6]
CAM_F_DATA[5]
CAM_F_DATA[5]
CAM_F_DATA[4]
CAM_F_DATA[4]
CAM_F_DATA[3]
CAM_F_DATA[3]
CAM_F_DATA[2]
CAM_F_DATA[2]
CAM_F_DATA[1]
CAM_F_DATA[1]
CAM_F_DATA[0]
CAM_F_DATA[0]
CAM_F_DATA[7]
CAM_F_DATA[7]
LCD_F_DATA[2]
LCD_F_DATA[2]
LCD_F_DATA[3]
LCD_F_DATA[3]
LCD_F_DATA[1]
LCD_F_DATA[1]
LCD_F_DATA[0]
LCD_F_DATA[0]
LCD_F_DATA[7]
LCD_F_DATA[7]
LCD_F_DATA[5]
LCD_F_DATA[5]
LCD_F_DATA[4]
LCD_F_DATA[4]
LCD_F_WR_N
LCD_F_WR_N
LCD_F_CS_N
LCD_F_CS_N
LCD_F_RS
LCD_F_RS
LCD_F_DATA[6]
LCD_F_DATA[6]
LCD_RST_N
I2C_SDA
I2C_SDA
I2C_SCL
I2C_SCL
CAM_PWDN
CAM_RST_N
LCD_ID
LCD_WR_N
LCD_D[07]
LCD_D[06]
LCD_D[05]
LCD_D[04]
LCD_D[03]
LCD_D[02]
LCD_D[01]
LCD_D[00]
LCD_IFMODE
LCD_IFMODE
BACKLIGHT_KEY
BACKLIGHT_KEY
LCD_BL_CTRL
F_CAM_VSYNC
F_CAM_VSYNC
F_CAM_HSYNC
F_CAM_HSYNC
LCD_RD LCD_F_RD
LCD_F_RD
2M_FF_CAMERA
KEY BACKLIGHT LED
CAM_EMI FILTER
ENBY0036001
GB042-40S-H10-E3000
LCD CONNECTOR
6ch_CHARGING PUMP _4LDO
7. CIRCUIT DIAGRAM
C709
DNI C708
12n
2.7n
C714
3.3n
R703
1n C712
R702
15K
DNI
C713
R704 DNI
C711 1n U701
BCM2070B2KUBXG
F4
D5
1
A
6
B
7
D
6
E
3
F
6
F
A2
3
A
B3
E3 C3
F2
D2 E5
C2 F5
A4 B4
C4
E4 E2
D4 C1
C6 D1
B2
E1
B5
C5 C7
D6
6
A
7
B
1
B
7
E
7
F
7
A
1
F
3
D
5
A
T
A
B
V
O
D
D
V
2
C
D
D
V
G
E
R
V
X
P
D
D
V
F
R
D
D
V
B
S
U
_
D
D
V
F
T
D
D
V
V
H
G
E
R
V RES
RFP RST_N
REG_EN
SCL
HUSB_DN
SDA TM2
SPIM_CLK PCM_IN
SPIM_CS_N PCM_OUT
PCM_CLK
LPO_IN PCM_SYNC
XIN UART_TXD
XOUT UART_RXD
UART_RTS_N
GPIO_0 UART_CTS_N
GPIO_1
1
C
D
D
V
HUSB_DP
6
S
S
V
5
S
S
V
4
S
S
V
3
S
S
V
2
S
S
V
1
S
S
V
GPIO_6
GPIO_5
C706
10n
TP701
VDD_IO_1V8
10p
C704
C701
2.2u
VPA_2V85
C703
10p
C702
10n
VDD_IO_1V8
10n
C707
1K R705
TP707
TP711
TP708
TP706
TP709
2450MHz FL701
4 2
3 1
IN OUT
GND1 GND2
2.2u
C705
C710 100p
TP710
TP702
TP703
TP704
TP705
ANT701
FB701
600
CON_ANT_FEED
CON_ANT_FEED|GND
CON_ANT_FEED
CON_ANT_FEED
BT_UART_TX
BT_UART_RX
BT_UART_RTS
BT_UART_CTS
BT_PCM_SYNC
BT_PCM_OUT
BT_PCM_IN
BT_PCM_CLK
BT_WAKEUP
RTC_32K
BT_CLK_26M
BT_RST_N
BT_WAKEUP_HOST
BT_CLK_REQ
BT_RF
BTCX_STATUS
BTCX_TXCONF
BTCX_RF_ACTIVE
BT_WIFI
BT
must have 1% tolerance
When power class 1.5 is used, R307 is populated and R308 is depopulated.
(Vice versa for power class 2)
QCT
IFX
VBT_PA_2V6
QCT
IFX
VBT_IO_1V8
VREG_MSMP_2V6
VREG_MSME_1V8
VIO_1V8
VPA_2V85
7-1-1-3_BCM2070(QCT & IFX Only)_0.4Pitch
Class 2 or 1.5
7. CIRCUIT DIAGRAM
L803
DNI
L804
3.3n
U801
EAT61493201
XM2400LV-DL1201TMP
1 1 2101
9
5 46
3 7
2 8
1
VCTL1
RX ANT
GND1 VCTL3
2
C
N
2
XT
1
C
N
GND2
D
D
V
1
XT
2LT
C
V
C807
0.1u
C819 0.1u
VBAT
1u
C825 C824
1u
R803
0
K001
R804
C805
10u
0
R802
218
C
u7.4
VBAT
VDD_TCXO
C823
2.2u
C815
5.6n
R801
15K
FB801
120
26MHz
TG-5010LH-87N
X801
4 2
3 1
NC OUT
GND VCC
10p
C820
C813
15p
VDD_TCXO
10p
C803
10p C801
VDD_3P3
O
D
L
N
L
_
T
U
O
V
U802
2
B
1
J
4
B
3
A
7
F
5
A
1
G
3
D
1
D
4
L
3
L
3
K
1
H
1
L
2
J
1
K
J5
D7
D6
F6
A7
E5
J7
J6
H5
J4
E4
K4
J3
K5
H4
H3
H2
C7
B7
G7
H7
H6
G5
G6
K7
K6
L7
L5
L6
F5
F2
G2
F1
E1
D5
B1
A1
5
C
4
C
2
L
2
K
4
G
3
G
4
F
3
F
3
E
4
A
6
E
2
E
6
C
2
D
6
A
4
D
D
N
G
_
A
N
A
_
F
R
W
D
N
G
_
O
C
V
_
F
R
W
2
D
N
G
_
A
P
_
F
R
W
D
N
G
_
L
A
T
X
_
F
R
W
D
N
G
_
V
R
D
A
P
_
F
R
W
D
N
G
_
E
F
A
_
F
R
W
D
N
G
_
A
N
L
_
F
R
W
1
D
N
G
2
D
N
G
3
D
N
G
4
D
N
G
5
D
N
G
S
S
V
A
_
U
M
P
S
S
V
P
_
R
S
T
U
O
_
O
I
P
G
_
F
R
W
2
P
1
D
D
V
_
T
U
O
_
O
D
L
_
O
C
V
_
F
R
W
WRF_RFIN
WRF_RFOUT
WRF_RES_EXT
RF_SW_CTRL0
RF_SW_CTRL1
RF_SW_CTRL2
RF_SW_CTRL3
SDIO_DATA_2
SDIO_DATA_0/SPI_MISO
SDIO_DATA_1/SPI_IRQ
SDIO_CLK/SPI_CLK
SDIO_DATA_3/SPI_CSX
SDIO_CMD/SPI_MOSI
JTAG_TMS
JTAG_TDO
JTAG_TDI
JTAG_TCK
JTAG_TRST_L
WRF_TCXO_VDD3P3
WRF_XTAL_VDD1P2
VDD1
VDD2
VDDIO
VDDIO_SD
EXT_SMPS_REQ
EXT_PWM_REQ
GPIO_0
WL_RST_N
GPIO_3/BTCX_TXCONF
GPIO_4/BTCX_STATUS
GPIO_5/BTCX_RF_ACTIVE
GPIO_1/BTCX_FREQ
WRF_TCXO_IN
XTAL_PU
OSCOUT
OSCIN
EXT_SLEEP_CLK
2
_
1
T
A
B
D
D
V
_
R
S
2
T
A
B
D
D
V
_
R
S
X
L
V
_
R
S
3
P
3
_
T
U
O
V
1
O
D
L
N
L
_
T
U
O
V
O
D
L
_
D
D
V
O
D
L
C
_
T
U
O
V
D
D
V
_
A
P
_
F
R
W
D
D
V
_
V
R
D
A
P
_
F
R
W
F
R
_
O
I
D
D
V
8
P
1
D
D
V
_
N
I
_
O
D
L
_
O
C
V
_
F
R
W
2
P
1
D
D
V
_
E
F
A
_
F
R
W
2
P
1
D
D
V
_
A
N
L
_
F
R
W
2
P
1
D
D
V
_
A
N
A
_
F
R
W
1
_
1
T
A
B
D
D
V
_
R
S
1
D
N
G
_
A
P
_
F
R
W
18p
C817
0
1
8
C
2.2u
C826
0.1u
u7.4
208
C
VDD_IO_1V8
18p
418
C
K
C
U
B
C
_
T
U
O
V
VDD_CORE
100p C821
VOUT_LNLDO
K
C
U
B
C
_
T
U
O
V
E
R
O
C
_
D
D
V
u
5.
1
1
0
8
L
VDD_IO_1V8
1u
C806
O
D
L
N
L
_
T
U
O
V
O
D
L
N
L
_
T
U
O
V
U803
5
3 2
4 1
VOUT VIN
GND STBY
D
N
G
P
TP804
TP807
TP809
TP810
TP801
TP805
TP803
TP802
TP806
TP808
C822
220n
220n
C816
FB802 600
220n
C808
0.5p
C818
208L
n9.3
3
P
3
_
D
D
V
3
P
3
_
D
D
V
9
0
8
C
1u
1
1
8
C
2.2u
R805
39K
RTC_32K
BT_RF
BTCX_STATUS
BTCX_TXCONF
SPI_CLK
SPI_MISO
SPI_INT
SPI_CS
SPI_MOSI
WLAN_REG_ON
BTCX_RF_ACTIVE
BT_WIFI
WRF_TX
X
T
_
F
R
W
XTALP
XTALP
RF_SW_CTRL_BT
RF_SW_CTRL_BT
RF_SW_CTRL_RX
X
R
_
L
R
T
C
_
W
S
_
F
R
WLAN_CLK_REQ
WLAN_CLK_REQ
RF_SW_CTRL_TX
RF_SW_CTRL_TX
TCXO LDO WiFi TCXO
WIFI
8. BGA PIN MAP
- 131 -
8. BGA PIN MAP
8.5 CA PlN MAP (Top View)
8.5.1 CA lC pih check (201)
all Diagran (Top View), PM8815(A-COLDRADlO-)
`Nol in uso
1/147
BGA IC pin check (U201)
Ball Diagram (Top View), PMB8815(A-GOLDRADIO+)
: not in use
- 132 -
8. BGA PIN MAP
8.5.2 CA lC pih check (301)
all Diagran (Top View), H9DA2CH1CHMMMR-46M
2/147
Nol in uso
: not in use
BGA IC pin check (U301)
* Ball Diagram (Top View), H9DA2GH1GHMMMR-46M
9. PCB LAYOUT
18 A
H
J
K
L
N
M
B
C
D
E
F
G
1 10
J
1
T
R
K
L
M
P
N
E
F
G
H
D
C
B
A
7
1 5 A
B
C
D
E
G
A1
B
C
D
E
F
H
J
K
L
R408
LD603
MIC501
41 3C
U301
C301
C217
U201
222
C
L201
L102
LD601
C825
8 12C
FB201
802C
4 1 2C
2 01R
1 11C
1 01 C
L105
31 4C
C412
VA602
U501
L113
C114
0 13C
1
0
4
B
V
10 4L
1 02
N
C
C405
C404 204 L
BAT201
4 1 6R
305AV
205A V
TP305
213C
TP302
TP303
R327
4 02R
202R
1 04L
F
424 R
Q201
3 02 R
5 02R
TP304 TP301
123 R
913 R
2 23 R
313C
C304
C215 9 03C
503 C
LD602 316R
104 C
C216
0 22C
C306
7 03C
803C
3 03 C
2 03C
4 02PT
CN401
C207
1 04DZ
2 04 C
01 4C
20 4D Z
122
C
3 08 R
R211
R212
4 22 C
23 2C
43 2C
105
N
C
33 2C
53 2C
632C
202
C
C213
C209
C212
X201
C211
125 R
L505
7 35C
335C
93 5C
032 C
132 C72 2C
622 C
2
0
2
X
L103
C411 103A V
C538
L504
R522
C528 035C
43 5C
D501
D502
602C
5 22C
3 12R
C205
302 C
C228
C201
C237
C229
C238
R209
9 12C
R210
10 1 L
201C
401C
701 C
60 1C
801
C
TP205
TP206
TP207
20 3R
803R
413R
R307
R301
603AV
C311
903R
4 03R
303R
0 13R
R311
203 A V
VA313
313R
60 3R
503R
2 13R
503AV
4 03AV
10 8
X
10 8BF
7 08C
6 1 1C
4 0 1R
014R
J501
2 28C
1 08 R
2 08R
C204
208 BF
808C
C821
618C
U802
5 0 8C01 2C
9 18 C
01 8
C
1 18
C
102 R
808PT2 08PT
308P T
5 08PT
TP810
108P T
708P T
408PT
9 08P T
TP806
11 1LC117
5 0 1C
511 C
30 1C
U101
901C
401L
10 4R
C414
5 04 R
R402
604 R
U401
C418
104 BF
R612
418 C
C527
81 5R
71 5R
3 01 TN A
U803
C824
R804
32 8
C
L804
C806
2 08 L
C818
C817
C802
C809
C812
L801
R805
10 8C
C803 0 28 C
628 C
41 1L
011L
601L
L109
L107
FL101
L108
L112
23 5C
92 5C
R514
625
C
635 C
C531
9 15R
51 5 R
R520
6 2 3R
5 35C
LG-T385_MAIN_EAX64678601_1.0_TOP
9. PCB LAYOUT
MIC501
.no Voice sending
-no Voice recoding
CN401 :I/O conn.
-no USB Connection.
-no Serial Connection.
U401 : MUIC + Charge ID
-no Booting.
-no USB/Serial Connection.
-no Battery Charge.
-no LCD Backlight
U101 : Tx Module
-no Service
-RF Sensitivity & TX Power
X201 : 26Mhz X-tal
-no Power On
-no Service
U201 : BB IC
-no Power On.
-no Service.
-no FM Radio
U802 : WiiFi Module
- No WiFi Connection
J501 : 3.5 ear Jack
-no Earphone, headset MIC
U301 : Memory
-no Booting
BAT201 : Backup Cap.
-RTC Reset
9. PCB LAYOUT
E
6
5
10
12
13 24
1
CB DA
1
4
F
E
D
C
B
A 7
12
04
0 2
7 1 4R
CN403
6 16R
342C
806AV
70 4C
04 5C
2 02
Q
C519
C240
305
C
C711
707C
TP711
R611
1 01
W
S
Q501
C709
C708
C815
FB601
CN404
21 4R
40 4 DZ
81 4R
3 1 4R
6 02R
5 1 4C
404AV
C223
6 1 4C
704AV
31 6C
3 04
D
Z
026 C
4 16 C
406AV
506 AV
2 1 6C
706AV
604AV
504AV
3 04AV
C406
904C
CN602
FL605 71 6C
8 16C
7 16R
606AV
61 6C
81 6R
R407
C417 90 4R
80 4C
VA401
CN402
FL604
812R
442 C
30 4R
S301
113 AV
803AV
7 01R
323C
613C
C321 C319
ANT101
21 5R
125C
C522
213AV
425R
142 C
20 2L
612R
512 R
307 PT
R601
206LF
011C C113
513 C
813C
4 0 5D Z
R511
605BF
023 C
R317
713C
C520
C524
013A V
R318
903AV
105DZ
60 5C
R506
305B F
C509
C525
705R
C523
415 C
R513 315 C
C242
C517
9 05 R
705C
805C
8 05 R
015C
515C
105
M
107BF
C706
5 07R
TP708
TP706
907P T
TP710 TP705
7 07PT
C713
107PT
TP702
R603 706R
R602
106LF
016R
10 6AV
306LF
R606 R604
R605
C606
C607
TP603
C603
C112
ANT102
1
0
3
N
C
C502
405 R
40 7C
2 1 7C
R421
916C
806C
9 06 C
116 C 5 06
C
VA501
205BF
105 C
R523
1 02DZ
30 5DZ
505R
1 05BF
70 5B F
R501
L501
2 05D Z
R217
305R
41 2R
C516
932 C
C505
C518
FB505
FB504
4 05C
2 05R
507
C
4 0 7P T
107
C
20 7R
30 7 C
207 C
U701
R420
VA408
R419
VA409
VA402
02 6R
91 6R
90 6R
80 6R
U601
106
N
C
C139
9 31 L
8 31L
417C
50 4
N
C
C604
01 6
C
ANT701
30 7R
1 07L
F
3 0 8L
31 8C
U801
R704 01 7C
C601
C602
TP602
LG-T385_MAIN_EAX64678601_1.0_BOT
S301 : SIM Conn.
-no Sim
ANT701 : BT/WiFi Intenna contact.
-no BT connection
-no WiFi connection
M501 :Audio Sub System
-no Sound
U701 : BT Module
-no BT connection
CN601 : LCD Conn.
-no Display
CN301 : Flash Socket
-no Flash Memory
CN402 : Battery Conn.
-no power on
CN403 : Touch screen connector
-no touch screen
CN602 : 2M Camera connector
-no Camera
- 135 -
10.ENGINEERING MODE
Engineering mode is designed to allow a service man/engineer to view and test the basic functions provided
by a handset. The key sequence for switching the engineering mode on is 1809#*350# Select. Pressing END
will switch back to non-engineering mode operation. Use Up and Down key to select a menu and press
select key to progress the test. Pressing back key will switch back to the original testmenu.
[1] BB TEST
[1-1] Battery Info
[1-1-1] BattInfo
[1-2] Bluetooth Test
[1-2-1] Enter Test Mode
[1-2-2] OnOf Test
[1-2-3] Headset Test
[1-2-4] BT Test1
[1-2-5] BT Test2
[2] Model Version
[1-2-6] Xhtml Compose Print
[2-1] Version
[1-2-7] Xhtml Print Test
[3] Eng Mode
[3-1] Cell environ.
[3-2] PS Layer Info
[3-2-1] Mobility
[3-2-2] RadioRes
[3-3] Layer1 Info
[3-4] Reset Information
[3-5] Memory
[3o-n6f]i gMuermarGioennConf
[3-7] MemAllUse
[3-8] MemDetUse
[3-9] MemDump
[ 3-10] Change Frequency Band
[4] Call Timer
[5] Factory Reset
[6] MF TEST
[6-1] All Auto Test
[6-2] Backlight
[6-2-1] Backlight On
[6-2-2] Backlight Of
[6-3] Audio
[6-3-1] Audio Test
[6-4] Vibrator
[6-4-1] Vibrator On
[6-4-2] Vibrator Of
[6-5] LCD
[6-5-1] Auto LCD
[6-6] Key pad
[6-7] Mic Speaker
[6-8] Camera
[6-8-1] Camera Main Preview
[6-8-2] Flash On
[6-8-3] Flash Of
[6-9] FM Radio
[6-8-4] Camera Flash Bunning
[6-9-1] FM Radio Test
[7] Network selection
[7-1] Automatic
[7-2] GSM850
[7-3] EGSM
[7-4] DCS
[7-5] PCS
- 136 -
11. STAND ALONE TEST
10.1 Introduction
This man al e plains ho to e amine the stat s of RX and TX of the model
This manual explains how to examine the status of RX and TX of the model.
A. Tx Test
TX test - this is to see if the transmitter of the phones is activating normally.
B. Rx Test
RX test - this is to see if the receiver of the phones is activating normally.
10.2 Setting Method
1. Set COM Port

2 Check PC Bau Rate
2. Check PC Bau Rate

3. Confirm EEPROM & Delta file prefix name
4. Click Update Info for communicating Phone and Test-Program
11.1
11.2 Setting Method
- 137 -
Nol Connecled
Connecled
!3!i!47
5. For the purpose of the Standalone Test, Change the Phone to ptest mode and then Click the Reset bar.
6. Select Non signaling in the Quick Bar menu. Then Standalone Test setup is finished.
- 138 -
Chanqe plesl mood

10.3 Tx Test
1. Non signaling mode bar and then confirm OK text in the command line.
!32i!47
2. Put the number of TX Channel in the ARFCN
3. Select Tx in the RF mode menu and PCL in the PA Level menu.
4. Finally, Click Write All bar and try the efficiency test of Phone.
11.3 Tx Test
- 139 -
10 4 Rx Test 10.4 Rx Test

1. Put the number of RX Channel in the ARFCN.
2. Select Rx in the RF mode menu.
3. Finally, Click Write All bar and try the efficiency test of Phone.
4. The Phone must be changed normal mode after finishing Test.
5. Change the Phone to normal mode and then Click the Reset bar.

11.4 Rx Test
- 140 -
Chanqe normal mode

!34i!47
- 141 -
12.AUTO CALIBRATION
12.AUTO CALIBRATION
11 1 O i
11. AUTO CALIBRATION
11.1 Overview
Auto-cal (Auto Calibration) is the PC side Calibration tool that perform Tx, Rx and Battery
Calibration with Agilent 8960(GSM call setting instrument) and Tektronix PS2521G(Programmable
Power supply).
Auto-cal generates calibration data by communicating with phone and measuring equipment then
write it into calibration data block of flash memory in GSM phone.
11.2 Tachyon Directory
12.1 Overview
12.2 Tachyon Directory
LGT385
LGT385
LGT385
LGT385
LGT385/
- 142 -
12.AUTO CALIBRATION
LGT385
LGT385
11.3 Test Equipment Setup
1 .Turn on the Phone.
2. /LGE/Tachyon/Tachyon.exe
11.4 Procedure
12.3 Test Equipment Setup

12.4 Procedure
- 143 -
12.AUTO CALIBRATION
3. Tachyon Login
4. Tachyon Main
LGT385
- 144 -
12.AUTO CALIBRATION
5. Tachyon Loss Setting
lgT385.gms
lgT385.gms
lgT385.gms
lgT385.gms
lgT385.gms
- 145 -
12.AUTO CALIBRATION
LGT385
6. Tachyon Setting
(1) Tachyon Main UI
l) 2) 3) 4) 5) 6) 7) 8) 9) l0)
(1) Tachyon Main UI
1) User Model Selection
2) Calibration + Auto Test
3) Stop
4) Auto Test Only
5) Loss Setting
6) System Option Setting
7) Running Option Setting
8) Voltage Current Setting
9) ShowResult Window
9) Show Result Window

10) Setting click Click after setting
- 146 -
12.AUTO CALIBRATION
(2) Click System Option Setting Menu
U5 To 5eriaI Port
5etting
CIick
5etting
(3) Report Data
- 147 -
12.AUTO CALIBRATION
7. Click User Model Selection Menu
CIick
DoubIe CIick

LGT385
LGT385
LGT385
LGT385
LGT385
LGT385
LGT385
LGT385
LGT385
LGT385
- 148 -
12.AUTO CALIBRATION
8. Tachyon RF Calibration Start
CIick,
Test 5tart
9. Tachyon RF Calibration finishes.
CaIibration + Auto PA55
lgT385.gms + NewFile.grf
LGT385
LGT385
LGT385
- 149 -
12.AUTO CALIBRATION
11.5 AGC
This procedure is for Rx calibration.
In this procedure, We can get RSSI correction value. Set band EGSM and press Start button the
result window will show correction values per every power level and gain code and the same
measure is performed per every frequency.
11 6 APC 11.6 APC
This procedure is for Tx calibration.
In this procedure you can get proper scale factor value and measured power level.
11.7 ADC
This procedure is for battery calibration This procedure is for battery calibration.
You can get main Battery Config Table and temperature Config Table will be reset.
11.8 Target Power
High Middle Low Description BAND
32 5 dBm 32 5 dBm 32 5 dBm Max power
914.8 MHz 897.4 MHz 880.2 MHz Frequency
124 37 975 Channel
EGSM 900
32.5 dBm 32.5 dBm 32.5 dBm Max power
251 191 128 Channel
GSM 850
1909.8 MHz 1880 MHz 1850.2 MHz Frequency
810 661 512 Channel
PCS 1900
885 699 512 Channel
DCS1800

12.5 AGC
12.6 APC
12.7 ADC
12.8 Target Power
13. EXPLODED VIEW & REPLACEMENT PART LIST
13.1 EXPLODED VIEW
Location Description
ACQ00 Cover Assembly,Rear
EAA00 PIFA Antenna,Multiple
EAB00 Speaker,Dual Mode
EAJ00 LCD Module
EBD00 Touch Window Assembly
ABM00 Can Assembly,Shield
MBG00 Button
MBG01 Button,Side
ACQ01 Cover Assembly,Front
MCQ00 Damper,Speaker
MCQ01 Damper,LCD
MDS01 Gasket
MDS00 Gasket
EBR00 PCB Assembly,Main
EAX01 PCB,Flexible
EAX00 PCB,Sidekey
EBR01 Camera Module
SJMY00 Motor,DC
SUMY00 Microphone,Condenser
GMEY00 Screw,Machine
MPHY00 Plate,Protector
EAC00 Rechargeable Battery,Lithium Ion
MCK00 Cover,Battery
EBD00 ACQ00
EAJ00
MDS00
MCQ00
MDS01
ABM00
MBG00
MBG01
EAB00 MCQ01
MCK00
GMEY00
MPHY00
EAC00
ACQ01
EAA00
EAX01
SUMY00
EAX00
EBR00
EBR01 SJMY00
- 151 -
Note: This Chapterisused for reference,Part order is ordered
by SBOM standard on GCSC
Level LocationNo. Description PartNumber Spec Remark
1 AGQ000000 Phone Assembly AGQ86717201 LGT385.ATURBK BK:BLACK BLACK -
2 MEZ002101 Label,Approval MLAA0062316
COMPLEX GU280 OREBK ZZ:Without Color
COMPLEX, (empty), , , , ,
2 ACQ100400
Cover
Assembly,EMS
ACQ86021101 LGT385.ATURBK BK:BLACK BLACK -
3 ACQ00
Cover
Assembly,Rear
ACQ85971301 LGT375.ATHABK ZZ:Without Color -
4 MDS000000 Gasket MDS63943701 COMPLEX LGT375.ATHABK ZZ:Without Color -
4 MKC009400 Window,Camera MKC64323201 CUTTING PC LGT375.ATHABK ZZ:Without Color -
4 MEZ000900 Label,After Service MLAB0001102
COMPLEX C2000 CGRSV WA:White C2000
USASV DIA 4.0 PRINTING,
4 MCK063300 Cover,Rear MCK67156601 MOLD PC LGT375.ATHABK ZZ:Without Color -
4 MJN020800 Tape,Decor MJN68116901 COMPLEX LGT375.ATHABK ZZ:Without Color -
4 MCQ043300 Damper,LCD MCQ66973101 COMPLEX LGT375.ATHABK ZZ:Without Color -
4 MCQ015700 Damper,Connector MCQ66973201 COMPLEX LGT375.ATHABK ZZ:Without Color -
4 MCQ009400 Damper,Camera MCQ66998101 COMPLEX LGT375.ATHABK ZZ:Without Color -
4 MCQ074201 Damper,Speaker MCQ66998301 COMPLEX LGT375.ATHABK ZZ:Without Color -
4 MCR000000 Decor MCR64793701 MOLD PC LGT375.ATHABK ZZ:Without Color -
4 MCQ000000 Damper MCQ66953901 COMPLEX LGT375.ATHABK ZZ:Without Color -
3 ACQ003400
Cover
Assembly,Bar
ACQ86111401 LGT385.ATURBK BK:BLACK BLACK -
13.2 ReplacementParts
<Mechanic component>
- 152 -
4 MJN061100 Tape,Protect MJN68155901 COMPLEX LGT385.ATURBK ZZ:Without Color -
4 ABM00
Can
Assembly,Shield
ABM73757601 LGT375.ATHABK ZZ:Without Color -
5 MBG00 Button MBG64586701 MOLD PC LGT375.ATHABK ZZ:Without Color -
5 MBG01 Button,Side MBG64586601 MOLD PC LGT375.ATHABK ZZ:Without Color -
5 ABM070300
Can
Assembly,Shield
ABM73797201 LGT375.ATHABK ZZ:Without Color -
6 MBK070300 Can,Shield MBK63273801
PRESS STS 304 0.4 LGT375.ATHABK ZZ:Without
Color -
5 MHK000000 Sheet MHK63757801 COMPLEX LGT375.ATHABK ZZ:Without Color -
5 MJN000000 Tape MJN68171001 COMPLEX LGT375.AVNMBK ZZ:Without Color -
5 MDJ000000 Filter MDJ63407501 COMPLEX LGT375.ATHABK ZZ:Without Color -
5 MJN061100 Tape,Protect MJN68081501 COMPLEX LGT375.ATHABK ZZ:Without Color -
5 MJN061101 Tape,Protect MJN68081601 COMPLEX LGT375.ATHABK ZZ:Without Color -
4 ACQ01
Cover
Assembly,Front
ACQ85989401 LGT375.ATHABK ZZ:Without Color -
5 MJB000000 Stopper MJB62950101 COMPLEX LGT375.ATHABK ZZ:Without Color -
5 MDJ000000 Filter MDJ63464901 COMPLEX LGT375.ATHABK ZZ:Without Color -
5 MCQ049800 Damper,Motor MCQ66998001 COMPLEX LGT375.ATHABK ZZ:Without Color -
5 MCK032700 Cover,Front MCK67121901 MOLD PC LGT375.ATHABK ZZ:Without Color -
- 153 -
6 MET099500 INSERT,NUT MICE0016910 MECH_COMMON ZY,ZZ,PRESS, STS, , , , ,
5 MJN000000 Tape MJN68099901 COMPLEX LGT375.ATHABK ZZ:Without Color -
5 MJN089300 Tape,Window MJN68116601 COMPLEX LGT375.ATHABK ZZ:Without Color -
4 MCQ01 Damper,LCD MCQ66997801 COMPLEX LGT375.ATHABK ZZ:Without Color -
4 MEV000000 Insulator MEV64107701 COMPLEX LGT375.ATHABK ZZ:Without Color -
4 MJN061101 Tape,Protect MJN68155801 COMPLEX LGT375.AVNMBK ZZ:Without Color -
6
ANT101
ANT102
Contact MCIZ0008201
COMPLEX LG-VN530 VRZ DW:DARK BROWN
PRESS, BeCu, , 3.0, 1.5, 1.5,
5 MEZ000000 Label MLAZ0038301
COMPLEX LG-VX6000 ZZ:Without Color PID Label
4 Array PRINTING,
6 ANT103 Contact MCIZ0008701
COMPLEX L-04C, ANTTWV ZZ:Without Color
PRESS, YCUT-FX, 4.2, 2.5, 1.5,
6 SC202 Can,Shield MBK63214601
PRESS SUS 304 0.2 LGT375.ATHABK ZZ:Without
Color -
6 SC201 Can,Shield MBK63273901
PRESS SUS 304 0.2 LGT375.ATHABK ZZ:Without
Color -
5 MCQ049800 Damper,Motor MCQ67046101 COMPLEX LGT375.ATHABK ZZ:Without Color -
5 MEV000000 Insulator MEV64231201
COMPLEX LGT375.AVNMBK ZZ:Without Color
insulator_PCB
- 154 -
3 GMEY00 Screw,Machine GMEY0013901
BH + 1.4mM 4mM MSWR FZB N - ARIMA
COMMUNICATIONS CORP.
3 MPHY00 Plate,Protector MPHY0001005 COMPLEX CU8180.BUMWPF ZZ:Without Color -
1 AGF000000 Package Assembly AGF76517805
LGT385.ATURBK ZZ:Without Color LG-T385
TUR(EU1W/SMS Text UB/TUR Peel/1,200EA)
2 MAY084000 Box,Unit MAY65497207
BOX Paper 120 90 56 4 COLOR LGT385.ATURBK
ZZ:Without Color LG-T385 TUR(SMS Text) Unit
Box(EU1W)
2 MEZ084100 Label,Unit Box MLAQ0018064
PRINTING LGC105.ATURBK ZZ:Without Color
Turkey Peel & SMS Label TUR only_Peel+SMS
text_unit box label_10540
2 AGJ000000 PALLET ASSY APLY0003901
GD510 BALBK BK,ZZ,EU1
TYPE_Body(SW)+Cap(EU)+AL_1200EA
3 MBEC00 Box,Carton MBEC0003601 COMPLEX GD510 CZESV ZZ:Without Color -
3 MCCL00 Cap,Box MCCL0002501 COMPLEX GD510 CZESV ZZ:Without Color -
3 MPCY00 Pallet MPCY0012403 COMPLEX KG800 FRABK DB:DARK BLUE -
2 MBAD00 Bag,Vinyl MBAD0005204 COMPLEX LG-LX260 SPRAG ZZ:Without Color -
2 MBEE00 Box,Master MBEE0061001
COMPLEX GD510.ACZESV ZZ:Without Color EU1
Master Box
2 MLAJ00 Label,Master Box MLAJ0004402
PRINTING CG300 CGR DG ZZ:Without Color
LABEL MASTER BOX(for CGR TDR 2VER.
mbox_label) GSM standard_master box label
2 MLAZ01 Label MLAZ0050901
COMPLEX KU990.AGBRBK ZZ:Without Color
Battery Warning Label (Lithium ion Battery Label)
1 AAD000000 Addition Assembly AAD85976201 LGT385.ATURBK BK:BLACK BLACK -
2 MCK00 Cover,Battery MCK67265401 MOLD PC LGT385.ATURBK ZZ:Without Color -
- 155 -
Note: This Chapterisused for reference, Part order is ordered
by SBOM standard on GCSC
4 EAA00
PIFA
Antenna,Multiple
EAA62788401
CN007068 QUAD -5DB 5:1 LDS Type -
SHANGHAI AMPHENOL AIRWAVE
4 EAA030101
PIFA Antenna
Bluetooth
EAA62824501
LS01-I-11123-A0 SINGLE -5DB 5:1 Metal Stamping
Type - LS Mtron Ltd.
4 EAB00
Speaker,Dual
Mode
EAB62429501
1812-8T-05PP Nd-Fe-B 700mW 8OHM 91DB
720HZ 1812*3.0T DCCA new pin type PIN KIRYN
TELECOM CO., LTD
4 EAJ00 LCD Module EAJ62130001
LM320DN1A QVGA 3.2INCH 240X320 400CD
COLOR 60% 4/3 500 60Hz Inverter N LED 2D -
TOVIS
4 EBD00
Touch Window
Assembly
EBD61386301
STWC-L0008FA CAPACITIVE TOUCH PFF
MMS128 3.2" B to B - SUNTEL CO.,LTD.
3 EBR00
PCB
Assembly,Main
EBR75393801 LGT385.ATURBK 1.0 Main
4 EBR071800
PCB Assembly
Main,SMT
5 EBR071600
PCB Assembly
Main,SMT Bottom
6 C112
Capacitor
Ceramic,Chip
ECCH0000196
MCH155A0R75C 0.75pF 0.25PF 50V NP0 -
55TO+125C 1005 R/TP - ROHM Semiconductor
KOREA CORPORATION
6 C406
Capacitor
TA,Conformal
ECTH0002002
F981A336MSA 33uF 20% 10V 3.3UA -55TO+125C
6OHM 2.0X1.25X0.8MM NONE SMD R/TP 0.9T
max. NICHICON CORPORATION, EAST JAPAN
SALES OFFICE
6 C714
Inductor
Multilayer,Chip
ELCH0001403
LL1005-FHL1N0S 1NH 0.3NH - 400mA - - 0.1OHM
20GHZ 7 SHIELD NONE 1.0X0.5X0.5MM R/TP
TOKO, INC.
6 C708
Inductor
Multilayer,Chip
ELCH0001401
LL1005-FHL15NJ 15NH 5% - 300mA 0.5OHM
2.8GHZ 9 SHIELD NONE 1.0X0.5X0.5MM R/TP
TOKO, INC.
13.2 ReplacementParts
<Main component>
- 156 -
6
R502
R513
R601
R605
R606
R608
R609
R619
R620
Resistor,Chip ERHZ0000401
MCR01MZSJ000 0OHM 5% 1/16W 1005 R/TP -
ROHM.
6
C703
C704
Capacitor
Ceramic,Chip
ECCH0000110
MCH155A100D 10pF 0.5PF 50V NP0 -55TO+125C
1005 R/TP - ROHM Semiconductor KOREA
CORPORATION
6
R218
R504
R616
MCR01MZP5J100 10OHM 5% 1/16W 1005 R/TP -
ROHM.
6
C408
C702
C706
C707
Capacitor
Ceramic,Chip
ECCH0000155
MCH153CN103KK 10nF 10% 16V X7R -
KOREA CORPORATION
6 L501
Inductor
Multilayer,Chip
ELCH0003842
LQG15HSR10J02D 100NH 5% - 150mA - -
1.25OHM 600MHZ 8 SHIELD NONE
1.0X0.5X0.5MM R/TP MURATA
MANUFACTURING CO.,LTD.
6 U601 IC,Sub PMIC EUSY0344403
RT9396GQW QFN,24,R/TP,4CH+2LDO,IC,Sub
PMICIC,Sub PMIC RICHTEK TECHNOLOGY
CORP.
6 R216 Resistor,Chip ERHZ0003801
MCR01MZP5J5R1 5.1OHM 5% 1/16W 1005 R/TP -
ROHM.
6
C604
C608
C609
C611
C619
C621
C622
VA601
Capacitor
Ceramic,Chip
ECCH0004904
GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C
1005 R/TP - MURATA MANUFACTURING
CO.,LTD.
6
FL601
FL602
FL603
FL604
FL605
Filter,EMI/Power SFEY0013201
EVRC14S03Q030100R ESD/EMI 0HZ 15pF 0H
SMD R/TP AMOTECH CO., LTD.
- 157 -
6
ZD201
ZD302
ZD404
ZD501
ZD502
ZD503
ZD504
Diode,TVS EDTY0012501
UCLAMP3311T.TCT 3.3V 3.5V min. 6.5V 5A -
SLP1006P2T R/TP 2P 1 SEMTECH
CORPORATION
6
C315
C316
C317
C318
C320
C323
C407
C417
Capacitor
Ceramic,Chip
ECZH0000830
C1005C0G1H330JT000F 33pF 5% 50V NP0 -
55TO+125C 1005 R/TP - TDK KOREA
COOPERATION
6 R503,R526 Resistor,Chip ERHZ0000445
MCR01MZP5J224 220KOHM 5% 1/16W 1005 R/TP
- ROHM.
6
C505
C516
C517
C518
C519
Capacitor
Ceramic,Chip
ECCH0000198
CL05A225MQ5NSNC 2.2uF 20% 6.3V X5R -
55TO+85C 1005 R/TP . SAMSUNG ELECTRO-
MECHANICS CO., LTD.
6 M501
IC,Audio Sub
System
EUSY0420001
TPA2055D3 1.6~5.5V 0W WLCSP R/TP 20P -
TEXAS INSTRUMENTS INCO.
6
C319
C321
C415
C416
C504
C510
C515
C612
C613
C614
Capacitor
Ceramic,Chip
ECZH0003103
GRM36X7R104K10PT 100nF 10% 10V X7R -
55TO+125C 1005 R/TP - MURATA
6 Q202 TR,Bipolar EQBN0019201
KTC3770V NPN 3V 20V 12V 100mA 999A 999
100mW VSM R/TP 3P KEC CORPORAITION
6
C524
C525
Capacitor
Ceramic,Chip
ECCH0000122
MCH155A470JK 47pF 5% 50V NP0 -55TO+125C
CORPORATION
6
C241
C507
C508
C601
C602
C606
Capacitor
Ceramic,Chip
ECZH0001215
C1005X5R1A105KT000F 1uF 10% 10V X5R -
COOPERATION
- 158 -
6
R419
R420
R421
MCR01MZP5J681 680OHM 5% 1/16W 1005 R/TP -
ROHM.
6
R417
R524
R705
MCR01MZP5J102 1KOHM 5% 1/16W 1005 R/TP -
ROHM.
6
R206
R217
R317
R318
R412
Resistor,Chip ERHY0000254
MCR01MZP5J472 4.7KOHM 5% 1/16W 1005 R/TP
- ROHM.
MCR01MZP5F1502 15KOHM 1% 1/16W 1005
R/TP - ROHM.
6
FB502
FB503
FB506
FB507
Filter,Bead SFBH0008102
BLM15HD182SN1D 1800 ohm 1.0X0.5X0.5 25%
2.2 ohm 0.2A SMD R/TP 2P 0 MURATA
6 C502
Capacitor
Ceramic,Chip
ECCH0000117
CL05C270JB5NNNC 27pF 5% 50V NP0 -
55TO+125C 1005 R/TP 0.5 SAMSUNG ELECTRO-
MECHANICS CO., LTD.
6
FB504
FB505
FB701
BLM15AG601SN1D 600 ohm 1.0X0.5X0.5 25% 0.6
ohm 0.3A SMD R/TP 2P 0 MURATA
- ROHM.
6
VA402
VA404
VA408
VA409
VA604
VA605
VA607
VA608
Varistor SEVY0004301
ICVL0518100Y500FR 18V 0% 10F 1.0*0.5*0.55
NONE SMD R/TP INNOCHIPS TECHNOLOGY
- ROHM.
6 CN301 Socket,Card EAG62830201
104031-0811 SD 8P ANGLE SMD R/TP
11.95x11.40x1.42t, Push-pull type MOLEX
6 CN602 Connector,BtoB ENBY0034201
GB042-24S-H10-E3000 24P 0.40MM STRAIGHT
SOCKET SMD R/TP 1M - LS Mtron Ltd.
6
C513
C514
C521
C540
Capacitor
Ceramic,Chip
ECCH0000120
MCH155A390J 39pF 5% 50V NP0 -55TO+125C
CORPORATION
- 159 -
6
VA401
VA403
EVLC5S02100 5.5V 0% 100F 1.0*0.5*0.6 UL SMD
R/TP AMOTECH CO., LTD.
6
R506
R507
MCR01MZP5J4R7 4.7OHM 5% 1/16W 1005 R/TP -
ROHM.
6
VA308
VA309
VA310
VA311
VA312
EVLC18S02003 18V 0% 3F 1.0*0.5*0.6 NONE
6 S301 Card Socket EAG63211701
5000-12P-2.95D-A1-R0 SIM 12P STRAIGHT SMD
T/REEL - HYUPJIN I&C CO.,LTD.
- ROHM.
6
C243
C244
C616
C617
C618
C620
Capacitor
Ceramic,Chip
ECCH0010501
GRM1555C1H7R5D 7.5pF 0.5PF 50V C0G -
6
FB501
FB601
BLM15AG100SN1D 10 ohm 1.0X0.5X0.5 5 ohm
0.05 ohm 1A SMD R/TP 2P 0 MURATA
6
C110
R703
Inductor
Multilayer,Chip
ELCH0003826
LQG15HS3N3S02D 3.3NH 0.3NH - 300mA - -
0.17OHM 6GHZ 8 SHIELD NONE 1.0X0.5X0.5MM
R/TP MURATA MANUFACTURING CO.,LTD.
6 C815
Inductor
Multilayer,Chip
ELCH0003836
LQG15HS5N6S02D 5.6NH 0.3NH - 300mA 0.2OHM
MURATA MANUFACTURING CO.,LTD.
FEMALE SMD R/TP 1M - LS Mtron Ltd.
6 R107 Resistor,Chip EBC61835701
RC0402FR-071RL 1OHM 1% 1/16W 1005 R/TP -
YAGEO CORPORATION
6
R418
R604
R610
R611
- ROHM.
6
R409
R528
MCR01MZP5F1003 100KOHM 1% 1/16W 1005
R/TP - ROHM.
- 160 -
MCR01MZP5J271 270OHM 5% 1/16W 1005 R/TP -
ROHM.
6 C607
Capacitor
Ceramic,Chip
ECCH0000113
MCH155A180J 18pF 5% 50V NP0 -55TO+125C
CORPORATION
6 Q501 FET EBK61952101
KTJ6131V P-CHANNEL MOSFET -30V +-20 -0.05A
40OHM 100mW VSM R/TP 3P KEC
CORPORAITION
6
C523
C603
C605
C610
C701
C705
Capacitor
Ceramic,Chip
ECCH0005603
GRM188R61A225K 2.2uF 10% 10V X5R -
6
C501
C506
C509
C711
C712
Capacitor
Ceramic,Chip
ECCH0000143
MCH155CN102KK 1nF 10% 50V X7R -55TO+125C
CORPORATION
6 C813
Capacitor
Ceramic,Chip
ECCH0000112
MCH155C150J 15pF 5% 50V NP0 -55TO+125C
CORPORATION
6
C520
C522
Capacitor
Ceramic,Chip
ECCH0000179
GRM155R71C223K 22nF 10% 16V X7R -
MCR01MZP5F10R0 10OHM 1% 1/16W 1005 R/TP
- ROHM.
6 C409
Capacitor
Ceramic,Chip
ECCH0007804
CL05A225MP5NSNC 2.2uF 20% 10V X5R -
55TO+85C 1005 R/TP 0.5MM SAMSUNG
ELECTRO-MECHANICS CO., LTD.
6
C240
C242
Capacitor
Ceramic,Chip
ECZH0001217
GRM155R60J474K 470nF 10% 6.3V X5R -
25TO+70C 1005 BK-DUP - MURATA
6 C503
Capacitor
Ceramic,Chip
ECCH0007803
CL10A106MP8NNNC 10uF 20% 10V X5R -
6 VA407 Varistor SEVY0004101
ICVN0505X150FR 5.6V 0% 360F 1.0*0.5*0.55
MCR01MZP5J470 47OHM 5% 1/16W 1005 R/TP -
ROHM.
- 161 -
6
R617
R618
MCR01MZP5J101 100OHM 5% 1/16W 1005 R/TP -
ROHM.
6
R508
R509
- ROHM.
SOCKET SMD R/TP 1M ENGINEERING PLASTIC
UL94V-0 AU OVER NI LS Mtron Ltd.
MCR01MZP5J105 1MOHM 5% 1/16W 1005 R/TP -
ROHM.
6 C139
Inductor
Multilayer,Chip
ELCH0003847
6 C239
Capacitor
Ceramic,Chip
ECCH0000137
C1005X7R1H331KT000F 0.33nF 10% 50V X7R -
COOPERATION
MCR01MZP5F5102 51KOHM 1% 1/16W 1005
R/TP - ROHM.
6 U502 IC,Comparator EUSY0250501
NCS2200SQ2T2G NCS2200SQ2T2G,SC70,5
PIN,R/TP,Comparator,pin compatible to
EUSY0077701 - - SC70 R/TP 5P - ON
SEMICONDUCTOR
6 U701 IC,Bluetooth EUSY0418701
BCM2070B2KUBXG 2.3VTO5.5V 158.4mW 42P -
WLBGA R/TP 42P BROADCOM ASIA
DISTRIBUTION PTE LTD
6 VA501 Diode,TVS EDTY0010501
RCLAMP1521P.TCT 15V 16.7 28V 4A 0W
SLP1006P2 R/TP 2P 1 SEMTECH
CORPORATION
6 C541
Capacitor
Ceramic,Chip
ECCH0000129
MCH155A121JK 120pF 5% 50V NP0 -55TO+125C
CORPORATION
6 L202
Inductor
Multilayer,Chip
ELCH0003839
LQG15HS22NJ02D 22NH 5% - 300mA 0.42OHM
- ROHM.
6 FL701 Filter,Dielectric SFDY0003001
DEA202450BT-1275A1 DEA202450BT-
1275A1,2450
MHz,2.0*1.25*1.05,SMD,2400M~2500M,IL
1.6,4pin,U-U,50-50,BT BPF TDK CORPORATION
- 162 -
6 SW101 Connector,RF ENWY0008701
MS-156C NONE STRAIGHT SOCKET SMD
T/REEL AU 50OHM 400mDB HIROSE KOREA
CO.,LTD
6 CN402
Connector
Terminal Block
EAG63254401
00 9245 003 032 868+ 3P 3.00MM STRAIGHT DIP
T/REEL - KYOCERA ELCO KOREA SALES
CO.,LTD.
6 C710
Capacitor
Ceramic,Chip
ECZH0000813
C1005C0G1H101JT 100pF 5% 50V C0G -
COOPERATION
- ROHM.
6 U801
Module, FEM(Front
End Module)
EAT61493201
XM2400LV-DL1201TMP 8DBM 12.5DB 10% 12mA
12mA 2.2DB 23.5DBM 4DBM 12P 1.6x1.6x0.4MM -
5 EBR071700
PCB
Assembly,Main,SM
T Top
6
VA502
VA503
ICVS0505481FR 5.6V 0% 480F 1.0*0.5*0.55 NONE
SMD R/TP INNOCHIPS TECHNOLOGY
6
D501
D502
PESD5V0F1BL 5.5V 6V min 11V 2.5A - SOD-882
R/TP 2P 1 STC CORP.
6 C714
Inductor
Multilayer,Chip
ELCH0001403
LL1005-FHL1N0S 1NH 0.3NH - 400mA - - 0.1OHM
TOKO, INC.
6 L804
Inductor
Multilayer,Chip
ELCH0003815
LQG15HS2N7S02D 2.7NH 0.3NH - 300mA
RC0603JR-074R7L 4.7OHM 5% 1/10W 1608 R/TP
- YAGEO CORPORATION
6 EAX010000 PCB,Main EAX64678601
LGT375.ABRABK 1.0 FR-4 Staggered via 8 0.8
Main
6
R502
R513
R601
R605
R606
R608
R609
R619
R620
MCR01MZSJ000 0OHM 5% 1/16W 1005 R/TP -
ROHM.
- 163 -
6
C529
C532
Capacitor
Ceramic,Chip
ECCH0000161
MCH153CN333KK 33nF 10% 16V X7R -
KOREA CORPORATION
6
C604
C608
C609
C611
C619
C621
C622
VA601
Capacitor
Ceramic,Chip
ECCH0004904
GRM155R60J105K 1uF 10% 6.3V X5R -55TO+85C
1005 R/TP - MURATA MANUFACTURING
CO.,LTD.
6
C319
C321
C415
C416
C504
C510
C515
C612
C613
C614
Capacitor
Ceramic,Chip
ECZH0003103
GRM36X7R104K10PT 100nF 10% 10V X7R -
6 X201 Crystal EXXY0025701
TSX- 3225 TSX- 3225 TSX- 3225,26 MHz,10
PPM,8 pF,40 ohm,SMD ,32X25X0.6 ,X-Tal (Infinion
chip), Pb-Free EPSON TOYOCOM CORP EPSON
TOYOCOM CORP
6
LD601
LD602
LD603
LED,Chip EDLH0015103
19-217/UTD-S887-1/TR8 Snow White 2.7~3.0
30mA 90~180mcd x, y 110mW 1608 R/TP 2P -
EVERLIGHT ELECTRONICS CO., LTD.
6 C406
Capacitor,TA,Confo
rmal
ECTH0002002
F981A336MSA 33uF 20% 10V 3.3UA -55TO+125C
SALES OFFICE
6
FB504
FB505
FB701
BLM15AG601SN1D 600 ohm 1.0X0.5X0.5 25% 0.6
6
ZD201
ZD302
ZD404
ZD501
ZD502
ZD503
ZD504
UCLAMP3311T.TCT 3.3V 3.5V min. 6.5V 5A -
SLP1006P2T R/TP 2P 1 SEMTECH
CORPORATION
- ROHM.
- 164 -
6
C513
C514
C521
C540
Capacitor
Ceramic,Chip
ECCH0000120
MCH155A390J 39pF 5% 50V NP0 -55TO+125C
CORPORATION
6
C524
C525
Capacitor
Ceramic,Chip
ECCH0000122
MCH155A470JK 47pF 5% 50V NP0 -55TO+125C
CORPORATION
6 C221
Capacitor
Ceramic,Chip
ECZH0025502
GRM219R60J226M 0.000022F 20% 6.3V X5R -
55TO+85C 2012 R/TP 0.85MM MURATA
6
C401
C412
Capacitor
Ceramic,Chip
EAE62505701
CL10A105KB8NNNC 1uF 10% 50V X5R -
55TO+85C 1608 R/TP 0.9T max. SAMSUNG
6
R418
R604
R610
R611
- ROHM.
6 FB201 Filter,Bead SFBH0007103
BLM15BB750SN1D 75 ohm 1.0X0.5X0.5 25% 0.4
6
C240
C242
Capacitor
Ceramic,Chip
ECZH0001217
GRM155R60J474K 470nF 10% 6.3V X5R -
25TO+70C 1005 BK-DUP - MURATA
6
C408
C702
C706
C707
Capacitor
Ceramic,Chip
ECCH0000155
MCH153CN103KK 10nF 10% 16V X7R -
KOREA CORPORATION
6
R308
R309
R310
R311
R312
R313
MCR01MZP5J510 51OHM 5% 1/16W 1005 R/TP -
ROHM.
6
C523
C603
C605
C610
C701
C705
Capacitor
Ceramic,Chip
ECCH0005603
GRM188R61A225K 2.2uF 10% 10V X5R -
- 165 -
6
R302
R303
R304
R305
R306
R319
R321
R323
- ROHM.
6
R202
R307
MCR01MZP5J471 470OHM 5% 1/16W 1005 R/TP -
ROHM.
6 C710
Capacitor
Ceramic,Chip
ECZH0000813
C1005C0G1H101JT 100pF 5% 50V C0G -
COOPERATION
6
C207
C210
C236
C808
C816
C822
Capacitor
Ceramic,Chip
ECZH0001216
C1005X5R1A224KT000E 220nF 10% 10V X5R -
COOPERATION
6
VA402
VA404
VA408
VA409
VA604
VA605
VA607
VA608
ICVL0518100Y500FR 18V 0% 10F 1.0*0.5*0.55
6
C501
C506
C509
C711
C712
Capacitor
Ceramic,Chip
ECCH0000143
MCH155CN102KK 1nF 10% 50V X7R -55TO+125C
CORPORATION
6
R617
R618
MCR01MZP5J101 100OHM 5% 1/16W 1005 R/TP -
ROHM.
6
L401
L402
Inductor
Multilayer,Chip
ELCH0003825
800MHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
6
FB502
FB503
FB506
FB507
BLM15HD182SN1D 1800 ohm 1.0X0.5X0.5 25%
6 X801 Oscillator,TCXO EXST0001901
TG-5010LH-87N 26MHZ 2.5PPM 2.8V
32.0x25.0x10.0MM - SMD R/TP EPSON
TOYOCOM CORP
- 166 -
6
C703
C704
Capacitor
Ceramic,Chip
ECCH0000110
MCH155A100D 10pF 0.5PF 50V NP0 -55TO+125C
CORPORATION
6 U301 IC,MCP,NAND EAN61927501
H9DA2GH1GHMMMR-46M NAND/2G SDRAM/1G
1.7VTO1.95V 8.0x9.0x0.9 TR 130P NAND+DDR
SDRAM FBGA 2Gb NAND(LB/128Mx16)+1Gb
DRAM(DDR/200MHz/16Mx4x16) HYNIX
SEMICONDUCTOR INC.
6 U501 IC,Proximity EUSY0376201
GP2AP002S00F GP2AP002S00F
GP2AP002S00F,,8 ,R/TP , SHARP
CORPORATION. SHARP CORPORATION.
6
VA308
VA309
VA310
VA311
VA312
EVLC18S02003 18V 0% 3F 1.0*0.5*0.6 NONE
6
R417
R524
R705
MCR01MZP5J102 1KOHM 5% 1/16W 1005 R/TP -
ROHM.
6 L802
Inductor
Multilayer,Chip
ELCH0001057
1005GC2T3N9SLF 3.9NH 0.3NH - 300mA
R/TP PILKOR ELECTRONICS LTD.
6 C607
Capacitor
Ceramic,Chip
ECCH0000113
MCH155A180J 18pF 5% 50V NP0 -55TO+125C
CORPORATION
6 C219
Capacitor
Ceramic,Chip
ECZH0001210
C1005Y5V1A474ZT000F 470nF -20TO+80% 10V
Y5V -30TO+85C 1005 R/TP - TDK KOREA
COOPERATION
6
C301
C306
Capacitor
Ceramic,Chip
ECCH0006201
C1608X5R0J475KT000N 4.7uF 10% 6.3V X5R -
55TO+85C 1608 R/TP - TDK CORPORATION
6
C241
C507
C508
C601
C602
C606
Capacitor
Ceramic,Chip
ECZH0001215
C1005X5R1A105KT000F 1uF 10% 10V X5R -
COOPERATION
6 U401 IC,Mini ABB EAN62339701
LP8727- B MUIC with Charger IC CSP R/TP 25P
TEXAS INSTRUMENTS KOREA LTD, HONGKONG
BRANCH.
- 167 -
6
C114
C818
L105
L109
Capacitor
Ceramic,Chip
ECZH0001002
C1005CH1H0R5BT000F 0.5pF 0.1PF 50V NP0 -
COOPERATION
6
R612
R613
R614
RC1005F470CS 47OHM 1% 1/16W 1005 R/TP -
SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 C526
Capacitor,TA,Confo
rmal
ECTH0001902
F981A106MMA 10uF 20% 10V 1UA -55TO+125C
SALES OFFICE
6
C315
C316
C317
C318
C320
C323
C407
C417
Capacitor
Ceramic,Chip
ECZH0000830
C1005C0G1H330JT000F 33pF 5% 50V NP0 -
COOPERATION
MCR01MZP5F1002 10KOHM 1% 1/16W 1005
R/TP - ROHM.
- ROHM.
6 L201
Inductor,Wire
Wound,Chip
ELCP0009410
LQM2HPN3R3MG0 3.3UH 20% - 350mA 0.35 1.2
0.1OHM - - SHIELD 2.5X2X1MM NONE R/TP
6 C502
Capacitor
Ceramic,Chip
ECCH0000117
CL05C270JB5NNNC 27pF 5% 50V NP0 -
55TO+125C 1005 R/TP 0.5 SAMSUNG ELECTRO-
MECHANICS CO., LTD.
6
C212
C213
Capacitor
Ceramic,Chip
ECCH0002002
C1005X7R1A473KT000F 47000pF 10% 10V Y5P -
6 CN401 Connector,I/O EAG63149901
04-5161-005-101-868+ 5P 0.50MM STRAIGHT
RECEPTACLE DIP R/TP Reverse type(New IO)
KYOCERA ELCO KOREA SALES CO.,LTD.
- ROHM.
6 C826
Capacitor
Ceramic,Chip
ECCH0002001
C1005JB0J104KT000F 0.1uF 10% 6.3V Y5P -
6
L111
L114
Inductor
Multilayer,Chip
ELCH0003824
- 168 -
6 C805
Capacitor
Ceramic,Chip
ECCH0007805
CL05A106MQ5NUNC 10uF 20% 6.3V X5R -
55TO+85C 1005 R/TP - SAMSUNG ELECTRO-
MECHANICS CO., LTD.
6 FL101 Filter,Saw,Dual EAM62290001
SAKEX881MAN0F00R14
881.5/942.5/1842.5/1960MHz 1.8*1.4*0.6 SMD
R/TP 10P MURATA MANUFACTURING CO.,LTD.
6 C109
Inductor
Multilayer,Chip
ELCH0003832
LQG15HS2N2S02D 2.2NH 0.3NH - 300mA - -
6 C503
Capacitor
Ceramic,Chip
ECCH0007803
CL10A106MP8NNNC 10uF 20% 10V X5R -
6 C538
Capacitor
Ceramic,Chip
ECCH0005604
GRM188R60J106M 10000000
pF,6.3V,M,X5R,TC,1608,R/TP,0.8 mm MURATA
6 C813
Capacitor
Ceramic,Chip
ECCH0000112
MCH155C150J 15pF 5% 50V NP0 -55TO+125C
CORPORATION
6 U101 Module,Tx Module EAT61713801
SKY77550-21 0DBM 0DB 0% 0A 0A 0DB 0DBM
0DBM 28P 6.0x6.0x0.9MM GPRS TxM, Quad Tx,
Dual Rx, SP4T SKYWORKS SOLUTIONS INC.
6 BAT201
Capacitor
Assembly
SMZY0023501
PAS311HR-VG1 3.8 Backup Capacitor
0.03F,Module Assembly, KOREA TAIYO
YUDEN.CO., LTD.
6
C211
C224
Capacitor,Ceramic,
Chip
ECCH0000151
CL05B472KB5NNNC 4.7nF 10% 25V X7R -
MECHANICS CO., LTD.
6 FB801 Filter,Bead SFBH0007101
BLM15AG121SN1D 120 ohm 1.0X0.5X0.5 25%
6
R409
R528
MCR01MZP5F1003 100KOHM 1% 1/16W 1005
R/TP - ROHM.
6
R218
R504
R616
MCR01MZP5J100 10OHM 5% 1/16W 1005 R/TP -
ROHM.
MCR01MZP5J120 12OHM 5% 1/16W 1005 R/TP -
ROHM.
- 169 -
6
C237
C402
C410
Capacitor
Ceramic,Chip
ECCH0000115
MCH155A220JK 22pF 5% 50V NP0 -55TO+125C
CORPORATION
6 Q201 TR,Bipolar EQBN0020501
KTC4075E NPN 5V 60V 50V 150mA 100NA 700
100mW ESM R/TP 3P KEC CORPORAITION
6 FL401 Filter,EMI/Power SFEY0015301
NFM18PC104R1C3 ESD/EMI 0HZ 0.1uF 0H SMD
6 X202 Crystal EXXY0026801
NX3215SA 32.768KHZ 20PPM 0F NONE SMD
R/TP NIHON DEMPA KOGYO CO.,LTD.
6 U802 IC Assembly EUSY0434401
BCM43362SKUBG BCM43362SKUBG
BROADCOM ASIA DISTRIBUTION PTE LTD
- ROHM.
6 U201
IC,Digital
Baseband
Processor,GSM
EUSY0429401
PMB8815 ,281,EDGE Rx,ARM11 208MHz,NAND
booting,2.0Mp,FMR,IC,Digital Baseband Processor
BGA R/TP 281P INFINEON TECHNOLOGIES
(ASIA PACIFIC) PTE LTD.
6 U803
IC,LDO Voltage
Regulator
EUSY0407101
BU28TD4WNVX SSON004,4,R/TP,2.8V 150mA
Single LDO,IC,LDO Voltage RegulatorIC,LDO
Voltage Regulator ROHM.
- ROHM.
6
C802
C812
Capacitor
Ceramic,Chip
ECCH0007802
CL10A475KP8NNNC 4.7uF 10% 10V X5R -
MECHANICS CO., LTD.
- ROHM.
6 U302 IC,Analog Switch EUSY0186504
FSA2259UMX QFN ,8 ,R/TP ,Dual SPDT ,;
,IC,Analog Switch FAIRCHILD SEMICONDUCTOR
6 C139
Inductor
Multilayer,Chip
ELCH0003847
6 L801
Inductor,Wire
Wound,Chip
ELCP0012801
MIPS2520D1R5-LG 1.5UH 30% - 1.2A 1.2 1.2
0.1OHM - - SHIELD 2.5X2X1MM NONE R/TP FDK
CORPORATION.
- 170 -
MCR01MZP5F1502 15KOHM 1% 1/16W 1005
R/TP - ROHM.
6 C533
Capacitor
Ceramic,Chip
ECCH0017601
CL05A475MQ5NRNC 4.7uF 20% 6.3V X5R -
6 L112
Inductor
Multilayer,Chip
ELCH0004718
1005GC2T5N6SLF 5.6NH 0.3NH - 300mA
0.27OHM 3.2GHZ 8 SHIELD NONE
1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS
LTD.
- ROHM.
6
VA301
VA302
VA304
VA305
EVLC18S02015 18V 0% 15F 1.0*0.5*0.6 NONE
6 J501 Jack,Phone EAG63234901
JAM3333-F36-7H 5P 2P STRAIGHT R/TP 3.5M
BLACK 5P Reverse type HON HAI PRECISION
INDUSTRY CO.,LTD.
6 L107
Inductor,Multilayer,
Chip
ELCH0001408
LL1005-FHL6N8J 6.8NH 5% - 300mA 0.23OHM
TOKO, INC.
5 SAD010000 Software,Mobile SAD33305901 Base V10b - MIDDLE EAST AND AFRICA IFX -
4 EBR071500
PCB Assembly
Main,Insert
5 EAX01 PCB,Flexible EAX64733401 LGT375.ATHABK 1.0 POLYI Multi 2 0.15 Flexible
5 EAX00 PCB,Sidekey EAX64733301 LGT375.ATHABK 1.0 POLYI Multi 2 0.15 Sidekey
5 EBR01 Camera Module EBP61562201
C2FA-H440A C2FA-H440A 2M FF Hynix 1/5", FPC
0deg. 7mm LG INNOTEK CO., LTD
5 SJMY00 Motor,DC SJMY0007104 3V 80mA 0A 12KRPM 0RPM 0SEC 0GF.CM 0OHM
5 SUMY00
Microphone,Conde
nser
SUMY0003816
OBM-410L44-RC1882 -44DB 2.2KOHM OMNI
1TO10V 4x1.0t FPCB BSE CO., LTD.
5 RAA050100 Resin,PC BRAH0001301 UF2040 or 3075BHF . . NONE
- 171 -
Note: This Chapterisused for reference,Part order is ordered
by SBOM standard onGCSC
2 EAY060000 Adapters EAY62389801
STA-U35ED2 100-240V 4.8V 400mA 50-60Hz CB,
CE WALL 2P USB - DONGDO ELECTRONICS
CO.,LTD
2 EAC00
Rechargeable
Battery,Lithium Ion
EAC61700101
LGIP-531A-WWU-LGC PRISMATIC 3.7V 950mAH
190mAH 34x50x5.5 34.15x53.55x5.7 BLACK Bar
Type 553450, 950mAh, Bar Type, WW, Up LG
Chem,LTD.
2 EAB010200 Earphone,Stereo SGEY0003219
EMB-LGE001STKE ,BLACK,4 POLE PLUG,3.5
4,Earphone,Stereo CRESYN CO.,LTD
2 AFN053800
Manual Assembly
Operation
AFN75741501
LGT385.ATURBK ZZ:Without Color Manual assy for
LGT385 TUR
3 MFL053800
Manual
Operation
MFL67525101
PRINTING LGT385.ATURBK ZZ:Without Color
Manual for LGT385 TUR
13.3 Accessory

LG T385 Service Manual

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LG T385 Service Manual

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Internal Use Only

Offset Phase Locked Loop OPLL

Wireless Application Protocol WAP

Voice Recoding Yes

5 20dBm 3dB 13 4dBm 4dB

True ring tones (MP3)

True ring tones (MP3)

3.2 Power Management

3.2.7 External Reset Handling

3.5 RF Subsystem of PMB8815 (U201)

Figure. 3.5.5 POWER SUPPLY BLOCK DIAGRAM

- 10 Year Data retention

3.9 LCD Interface

provide current limiting and over-temperature functions. The RT9396 is available in a

Figure 3.12.1 Audio Section Overview

Figure 3.12.3 Switching for R/L DACs onto Bufers

Figure 3.13.1 Block Diagram of Camera Interface

Color processing (contrast, saturation, brightness, hue)

increases the signal strength, thereby improving SNR.

Check TP1 of SW101

Graph 4.7.2. LCD Data Waveform

1. Set COM Port

2. Check PC Bau Rate

Chanqe plesl mood

10 4 Rx Test 10.4 Rx Test

Chanqe normal mode

12.3 Test Equipment Setup

9) Show Result Window

29.5 dBm 29.5 dBm 29.5 dBm Max power

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